CN1423307A - 化学溶液输送装置和制备悬浮液的方法 - Google Patents
化学溶液输送装置和制备悬浮液的方法 Download PDFInfo
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- CN1423307A CN1423307A CN02147986A CN02147986A CN1423307A CN 1423307 A CN1423307 A CN 1423307A CN 02147986 A CN02147986 A CN 02147986A CN 02147986 A CN02147986 A CN 02147986A CN 1423307 A CN1423307 A CN 1423307A
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- 239000000126 substance Substances 0.000 title claims abstract description 30
- 239000000725 suspension Substances 0.000 title claims description 180
- 239000007788 liquid Substances 0.000 title claims description 59
- 238000000034 method Methods 0.000 title claims description 13
- 238000002360 preparation method Methods 0.000 claims abstract description 27
- 238000001514 detection method Methods 0.000 claims abstract description 15
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 141
- 238000003860 storage Methods 0.000 claims description 56
- 239000007800 oxidant agent Substances 0.000 claims description 46
- 230000001590 oxidative effect Effects 0.000 claims description 46
- 239000012530 fluid Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 230000000295 complement effect Effects 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 230000014759 maintenance of location Effects 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 239000002002 slurry Substances 0.000 abstract 5
- 238000004448 titration Methods 0.000 description 14
- 238000005498 polishing Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000012546 transfer Methods 0.000 description 7
- 239000006061 abrasive grain Substances 0.000 description 5
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000009183 running Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000002479 acid--base titration Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
- Y10T137/0335—Controlled by consistency of mixture
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Accessories For Mixers (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001371944A JP4456308B2 (ja) | 2001-12-05 | 2001-12-05 | 薬液供給装置 |
JP371944/2001 | 2001-12-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1423307A true CN1423307A (zh) | 2003-06-11 |
CN1210767C CN1210767C (zh) | 2005-07-13 |
Family
ID=19180920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021479860A Expired - Fee Related CN1210767C (zh) | 2001-12-05 | 2002-10-31 | 化学溶液输送装置和制备悬浮液的方法 |
Country Status (5)
Country | Link |
---|---|
US (3) | US6659634B2 (zh) |
JP (1) | JP4456308B2 (zh) |
KR (1) | KR100837673B1 (zh) |
CN (1) | CN1210767C (zh) |
TW (1) | TW588418B (zh) |
Cited By (17)
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CN100374245C (zh) * | 2003-12-29 | 2008-03-12 | 中芯国际集成电路制造(上海)有限公司 | 研磨液再利用装置及其*** |
CN102369054A (zh) * | 2010-01-08 | 2012-03-07 | 奥林巴斯医疗株式会社 | 液体混合装置、药液试验装置及内窥镜处理装置 |
CN102476355A (zh) * | 2010-11-19 | 2012-05-30 | 亚泰半导体设备股份有限公司 | 循环***及方法 |
CN102895892A (zh) * | 2012-09-29 | 2013-01-30 | 北京七星华创电子股份有限公司 | 化学液存储装置 |
CN102951629A (zh) * | 2012-10-29 | 2013-03-06 | 南昌大学 | 一种碳纳米管合成炉恒压给料装置 |
CN103639889A (zh) * | 2013-12-05 | 2014-03-19 | 天津中环领先材料技术有限公司 | 一种用于无蜡抛光设备的配液供液装置及其使用方法 |
CN104141164A (zh) * | 2013-05-08 | 2014-11-12 | 盛美半导体设备(上海)有限公司 | 化学液供液及回收再利用***与方法 |
CN105251383A (zh) * | 2015-11-04 | 2016-01-20 | 厦门米特自动化设备有限公司 | 液体密度配比仪 |
CN101816907B (zh) * | 2009-02-26 | 2016-04-27 | 希森美康株式会社 | 试剂调制装置、检体处理***以及试剂调制方法 |
CN105538128A (zh) * | 2016-01-21 | 2016-05-04 | 苏州新美光纳米科技有限公司 | 抛光液加热装置及抛光温度控制方法 |
CN106442408A (zh) * | 2016-10-12 | 2017-02-22 | 上海胤飞自动化科技有限公司 | 化学机械研磨液自动配制控制*** |
CN106670976A (zh) * | 2016-12-09 | 2017-05-17 | 昆山纳诺新材料科技有限公司 | 一种高压磨料水射流工件抛光的方法 |
CN108664046A (zh) * | 2018-04-23 | 2018-10-16 | 南通福沃得智能制造有限公司 | 双氧水浓度在线智能测控*** |
CN109313128A (zh) * | 2016-06-21 | 2019-02-05 | 势弥径有限公司 | 浆料溶液的浓度测定及调节装置 |
CN109352531A (zh) * | 2018-10-24 | 2019-02-19 | 上海华力微电子有限公司 | 一种研磨液供给***及化学机械研磨液的供给方法 |
TWI699237B (zh) * | 2019-02-22 | 2020-07-21 | 亞泰半導體設備股份有限公司 | 研磨液混料供應系統 |
CN113118964A (zh) * | 2021-04-23 | 2021-07-16 | 长鑫存储技术有限公司 | 化学机械研磨装置 |
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US7871249B2 (en) * | 1998-04-16 | 2011-01-18 | Air Liquide Electronics U.S. Lp | Systems and methods for managing fluids using a liquid ring pump |
US7344297B2 (en) * | 1998-04-16 | 2008-03-18 | Air Liquide Electronics U.S. Lp | Method and apparatus for asynchronous blending and supply of chemical solutions |
US20070119816A1 (en) * | 1998-04-16 | 2007-05-31 | Urquhart Karl J | Systems and methods for reclaiming process fluids in a processing environment |
US7980753B2 (en) | 1998-04-16 | 2011-07-19 | Air Liquide Electronics U.S. Lp | Systems and methods for managing fluids in a processing environment using a liquid ring pump and reclamation system |
JP3747174B2 (ja) * | 2001-11-19 | 2006-02-22 | 株式会社カイジョー | 半導体処理装置の薬液濃度制御装置 |
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JP2002016029A (ja) * | 2000-06-27 | 2002-01-18 | Mitsubishi Chemical Engineering Corp | 研磨液の調製方法および調製装置 |
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JP3789296B2 (ja) * | 2000-11-17 | 2006-06-21 | リオン株式会社 | 研磨液の製造装置 |
JP2002178261A (ja) * | 2000-12-13 | 2002-06-25 | Ebara Corp | 砥液供給装置及び砥液供給装置への添加剤補充方法及び研磨装置 |
US6554467B2 (en) * | 2000-12-28 | 2003-04-29 | L'air Liquide - Societe' Anonyme A'directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude | Process and apparatus for blending and distributing a slurry solution |
KR100454120B1 (ko) * | 2001-11-12 | 2004-10-26 | 삼성전자주식회사 | 화학적 기계적 연마 장비의 슬러리 공급 장치 및 방법 |
JP4456308B2 (ja) * | 2001-12-05 | 2010-04-28 | 富士通マイクロエレクトロニクス株式会社 | 薬液供給装置 |
-
2001
- 2001-12-05 JP JP2001371944A patent/JP4456308B2/ja not_active Expired - Fee Related
-
2002
- 2002-10-07 TW TW091123113A patent/TW588418B/zh not_active IP Right Cessation
- 2002-10-24 KR KR1020020065100A patent/KR100837673B1/ko active IP Right Grant
- 2002-10-29 US US10/282,116 patent/US6659634B2/en not_active Expired - Lifetime
- 2002-10-31 CN CNB021479860A patent/CN1210767C/zh not_active Expired - Fee Related
-
2003
- 2003-09-16 US US10/662,450 patent/US7419946B2/en not_active Expired - Fee Related
-
2008
- 2008-03-14 US US12/076,168 patent/US7863195B2/en not_active Expired - Fee Related
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CN109352531A (zh) * | 2018-10-24 | 2019-02-19 | 上海华力微电子有限公司 | 一种研磨液供给***及化学机械研磨液的供给方法 |
TWI699237B (zh) * | 2019-02-22 | 2020-07-21 | 亞泰半導體設備股份有限公司 | 研磨液混料供應系統 |
US11617993B2 (en) | 2019-02-22 | 2023-04-04 | Asia Ic Mic-Process, Inc. | Material mixing and supplying system |
CN113118964A (zh) * | 2021-04-23 | 2021-07-16 | 长鑫存储技术有限公司 | 化学机械研磨装置 |
Also Published As
Publication number | Publication date |
---|---|
US7419946B2 (en) | 2008-09-02 |
US7863195B2 (en) | 2011-01-04 |
KR20030046301A (ko) | 2003-06-12 |
US20040052154A1 (en) | 2004-03-18 |
US20030104959A1 (en) | 2003-06-05 |
JP2003170034A (ja) | 2003-06-17 |
US6659634B2 (en) | 2003-12-09 |
US20080214005A1 (en) | 2008-09-04 |
CN1210767C (zh) | 2005-07-13 |
TW588418B (en) | 2004-05-21 |
KR100837673B1 (ko) | 2008-06-13 |
JP4456308B2 (ja) | 2010-04-28 |
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