CN1382983A - Nondestructive quantitative measuring method and device for photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system - Google Patents
Nondestructive quantitative measuring method and device for photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system Download PDFInfo
- Publication number
- CN1382983A CN1382983A CN 02112786 CN02112786A CN1382983A CN 1382983 A CN1382983 A CN 1382983A CN 02112786 CN02112786 CN 02112786 CN 02112786 A CN02112786 A CN 02112786A CN 1382983 A CN1382983 A CN 1382983A
- Authority
- CN
- China
- Prior art keywords
- interface
- mechanical
- photoacaustic
- performance
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to the measure area of laser technique and nanometer technique, especially to the method and device for undamaged quantificationally measuring the optical acoustic performance of the coupled structure of the film base in the mini optical-mechanical-electrical system. The ultra fast short pulse laser transfers to the interface of the sample of the coupled structure of the film base to excite the micro scale interface wave. Analyzing dissipation character of the said interface wave and measuring the interface adhesion mass of the dissipation characteristic quantity explores the scale effect how to affect the dissipation character of the interface wave quantificationally. Also analyzing and measuring investigates the regular rule of the action between the scale effect and elastic parameter as well as the interface adhesion mass so as to realize the said undamaged quantificationally measurement.
Description
One, technical field
The present invention relates to laser technology and nanometer technology fields of measurement, refer in particular to a kind of photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system nondestructive quantitative measuring method and device.It is applicable to all kinds of micro/nano films, device and macroscopic view with interface combination, be situated between and see or the microcosmic material system that is coupled, as the performance undamaged quantitative test of optoacoustic of the molecular self-assembled monolayer that adheres on macroscopical matrix, double-deck molecular self-assembled monolayer etc.
Two, background technology
There are 2 key scientific problems in micro-nano scientific research, the one, the structure of low-dimensional materials and behavior under the surface of material, interface and the non-equilibrium condition, develop and sign as the formation of the non-equilibrium material structures of low-dimensional such as nanometer, and basic problems such as structure, physical property, chemical property, mechanical property are furtherd investigate, help to reach to the optimal design of micro Nano material, device and machinery and effectively control; Two, the Study on Integration of macroscopic view, be situated between sight and microcosmic, thereby disclose two new problem in science: the one, " scale problem ", promptly how to carry out the different scale level---transition and corresponding inner link thereof under macroscopic view, be situated between sight and the microcosmic, as two-phase Fourier Series expansion technique mechanical property, physical property transformation of energy in the dimensional variation process; The 2nd, how " colony's evolution problem " promptly describes reciprocation and evolution problem that macroscopic view, Jie's sight, micromechanism and defective are embodied as colony's coupling.
Nano measurement plays a part very important in nanosecond science and technology, and its intension relates to the measurement of the nanoscale of the evaluation of nanoscale, composition, microstructure and rerum natura.At first succeed in developing scanning tunnel microscope (STM) from Nobel Prize in physics winner Binnig in 1984 and Rohrer, over more than 10 year, comprise that its scan-probe technology STM that derives, AFM, MFM etc. have developed into commodity, in recent years, the novel nano measuring technique that combines with the SPM technology of Near-field Optical Microscope, photon scanning tunneling microscope and various spectroscopy analysis means occurs in succession.Transformation to the traditional analysis technology is another important channel that the development nano measurement is learned, but traditional analytical technology (comprising ion beam, photon beam, electron beam) has certain limitation in nano measurement is learned, and lateral resolution and longitudinal frame all need further to improve.The analysis-by-synthesis current measuring methods, they only relate to the imaging and the measurement of micro Nano material surface and interface pattern, microstructure, flatness and the fluctuating of (comprising film, powder, fiber etc.), size-grade distribution, thickness, composition, chemical analysis, electronic structure or the like.And propose not solve the research method of above-mentioned two 2 problem in science.
But, the develop rapidly of nanosecond science and technology research has proposed urgent requirements at the higher level to nano measurement, as in micro-nano device, structure or system, the different units device under coupling, the physical property of quantitative measurment Fourier Series expansion technique, mechanical property, interfacial structure and quality; Measure the further evolution rule of research performances such as physical property, mechanical property, interfacial structure and quality in yardstick gradual change process by unit separating and measuring and Fourier Series expansion technique on this basis; Equally for studying reciprocation and the evolution problem that colony's coupling is embodied in different macroscopic views, be situated between sight and the microscopic units combination Fourier Series expansion technique.For the research work of this science proposition, currently do not see relevant report.
Surface acoustic wave and Lamb wave are very useful waveform in Ultrasonic Detection, ps pulsed laser and ns pulsed laser ultrasonic technique particularly, because LASER Light Source can be focused into the point source (or line source) of very little (or very thin), makes these two kinds of waveforms effectively to detect little or thin sample.But along with thickness of sample is more and more thinner, until entering be situated between sight, micro-scale, it is not enough that the hyperacoustic spatial resolution of monopulse just more shows, therefore necessary motivated frequency bands is the higher pulse ultrasonic wave of broadband more, common ultrasonic means comprises that the ultrasonic upper frequency limit of nanosecond laser ultrasonic excitation generally is 250MHz at present.
Ultra-short pulse laser ultrasonic technique progress realized to tens films to hundreds of nm rapidly, detects with the microstructure and the parameter measurement of the spatial resolution of 1-10nm.Now inspired the big bandwidth sound basis of high frequency that the upper limit reaches 440GHz.It should be noted that light penetration depth one in this psec or femtosecond pulse and the material mechanism is all about micron order, that have even reach centimetre-sized, therefore be that light penetrates for micro/nano film, its great majority of determining of device, so in actual measurement, there is certain difficulty.
Three, summary of the invention
The purpose of this invention is to provide a kind of in the Micro-Opto-Electro-Mechanical Systems crucial film base coupling interface structure, utilize the ultrafast short-pulse impulse optical excitation microsize interface wave technology that proposes to two-phase elastic properties of materials parameter, interface quality, coupling effect, scale effect can't harm, quantitatively, the photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system nondestructive quantitative measuring method and the device of non-contact measurement.
The present invention realizes by following technical scheme:
It arrives sample interface with ultrafast short-pulse impulse light transmission, excite and obtain microsize interface wave, by the microsize interface wave dissipation characteristic that receives is analyzed, realize quantitative test, it is characterized in that described ultrafast short-pulse impulse light is transferred to film base coupling sample interface in the Micro-Opto-Electro-Mechanical Systems by outside optical system, realizes photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system harmless quantitative non-contact testing.
By designing the different interface adhesive bonding strengths of same Fourier Series expansion technique, different adhesion strengths are to film base boundary wave dissipation behavioral implications in the research Micro-Opto-Electro-Mechanical Systems, adopt different technology to prepare film base coupling sample, as physical vapour deposition (PVD), chemical vapor deposition, magnetron sputtering and pulsed laser deposition etc. for this reason; Perhaps adopt same process preparation, but change the method for technological parameter, regulate the film base coupling sample of the different adhesion strength combinations that obtain same components and geometric properties.With the film basic pattern product that obtain under different technologies of preparing or the identical preparation parameter condition.
Measure microsize interface wave dissipation characteristic under this condition by designing film base sample that different interfaces adhere to the contact area ratios, the adhesion contact area compares the numerical relation with the dissipation characteristic quantity, thereby oppositely realizes the quantitative measurement of film base coupled interface adhesion contact gear ratio in the Micro-Opto-Electro-Mechanical Systems.
Interface by the design different curvature adheres to the gap, investigate level and smooth non-adhesion contact, non-adhesion contact influence to microsize interface wave dissipation behavior and characteristic quantity thereof with oval spacing in the non-adhesion of rectangle spacing contact, in the realization Micro-Opto-Electro-Mechanical Systems film base coupled interface adhesion roughness quantitative estimation.
Realize device of the present invention, it is accepted system, control system and sample system by ultrafast short-pulse impulse optical generator, outside optical system, frock clamp system, the interface glistening light of waves and forms, and it is characterized in that sample body is the film base coupling sample system that is coupled to form through the interface by film and matrix in the Micro-Opto-Electro-Mechanical Systems.
More than the micron order of sample system by macroscopic view, the nano level film of submicron order that be situated between to see and microcosmic and matrix be coupled in twos and constitute the Fourier Series expansion technique of different scale combination.
For film base two phase materials incident ultrafast short-pulse impulse light when all transparent, is proposed interface excitaton source dyeing local techniques, guarantee that ultrafast short-pulse is punched in the absorption on the interface, and then excite boundary wave.
Measurement mechanism is connected by the photoelectricity trigger switch with the boundary wave excitation apparatus, realizes triggering simultaneously receiving, and perhaps according to the size of excitaton source and measurement point distance, postpones the reception interface ripple.
The present invention proposes the ultrafast short-pulse impulse and sends out microsize interface wave non-destructive testing technology, it directly utilizes ultrafast short-pulse impulse light beam (pulse width psec or femtosecond magnitude) normal incidence film base sample interface, activates displacement by electronics and excites the boundary wave of propagating along film base interface.Use interference of light displacement vibration receiving system in the place of distance excitaton source different distance and receive the boundary wave of propagating arrival in real time.Set up boundary wave dissipation equation through theoretical analysis, obtaining the quantitative relationship of velocity of wave and wave number in film base material material elastic parameter and matter density and the dissipation equation.Adhere to quality by measuring boundary wave dissipation characteristic quantity quantitatively characterizing interface, truly adhere to contact area, adhesion strength etc. as the film base; Realization is at the influence of different its scale effects of micro-nano Fourier Series expansion technique quantitative examination to the boundary wave dissipation characteristic, investigating the film matrix is that the thickness direction scale effect adheres to the action rule of quality to elastic parameter and interface, thereby realizes towards the film base elastic parameter of Micro-Opto-Electro-Mechanical Systems and the interface coupling mass is harmless, noncontact, quantitative test.
The present invention has following technical advantage:
Make full use of the room and time resolution that microsize interface wave has superelevation, realize quantitative measurement Micro-Opto-Electro-Mechanical Systems median surface coupling effect, scale effect.
Quantitative measurment microsize interface wave dissipation characteristic quantity quantitative response two-phase elastic properties of materials parameter and interface adhesion property.Micro-scale boundary wave dissipation characteristic quantity (phase velocity v, wave number k, attenuation coefficient ξ) and sign two phase materials are the elastic constant c of stress displacement relation separately
i(as for isotropic material c
1=c
3=λ+2 μ, c
2=λ, c
4=μ, λ, μ are medium Raman constant) and the matter density p
iBetween numerical value contact, promptly set up microsize interface wave dissipation equation.Thereby solve " scale problem " and " colony's evolution problem " in the micro-nano scientific research.
Nondestructive measurement, good reproducibility: traditional micro/nano-scale thin film mechanical performance measuring technology generally all is destructive test, and well-known its stressed behavior of destructive test more complicated all, and different force way can obtain identical result, so the pilot system error is big and poor repeatability.And exciting microsize interface wave and receiving course all adopt phot-luminescence to receive, the error of having avoided this insoluble system and device of conventional test methodologies to cause, and good reproducibility.
Noncontact mode in real time: there be non-linear, the hysteresis and the creep problem of friction, the not coaxial error of bringing, dynamometer spring rigidity difference and Piezoelectric Driving between moving chuck and the support member in traditional micro/nano-scale thin film mechanical performance measuring technology, and there is very big discreteness in the mechanical performance data that finally causes measuring.Because the dirigibility of laser technology, controlled as hot spot, light path, light triggers, and it is real-time, online and contactless to determine whole measuring process to realize.
Four, description of drawings
Fig. 1 photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system harmless quantitative proving installation
Fig. 2 Micro-Opto-Electro-Mechanical Systems film base coupled structure interface microsize interface wave dissipation synoptic diagram
The different film base interface coupling sample synoptic diagram that adhere to contact gear ratio and different adhesive bond gap curvature of Fig. 3
The scale effect of Fig. 4 film base Fourier Series expansion technique and the Coupling Design synoptic diagram of study of coupling effect
1 prism, 2 attenuators, 3 spectroscopes, 4 ultrafast pulse laser generators, 5 photodiodes, 6 oscillographs, 7 computing machines, 8 wave filters, 9 laser interferometer, 10 films, 11 matrixes, 12 condenser lenses, 13 catoptrons, 14 catoptrons, 15 level and smooth non-adhesion contacts, the non-adhesion contact of 16 rectangle spacings, the non-adhesion contact of 17 oval spacings
Five, embodiment
The details and the working condition of the concrete device that the present invention proposes are described below in conjunction with Fig. 1.
Photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system harmless quantitative proving installation is by ultrafast short-pulse impulse optical generator 4, and the boundary wave signal laser is interfered the receiving and analyzing system, and outside optical system and specimen system are formed.Outside optical system is mainly by prism 1, attenuator 2, and spectroscope 3, condenser lens 12, catoptron 13, catoptron 14 is formed.The boundary wave signal laser interferes the receiving and analyzing system mainly by laser interferometer 9, wave filter 8, and oscillograph 6 and computing machine 7 are formed.The specimen system is made up of the film 10 and the matrix 11 of different scale coupling.
Ultrafast short-pulse impulse optical generator 4 sends pulse laser and triggers 5 photodiodes, with the delay start laser interferometer 9 of synchronously real-time or certain hour, and logical oscillograph 6 record boundary wave waveforms.At last, the computing machine 7 of the boundary wave waveform of record input computational analysis system carries out boundary wave dissipation performance evaluation, realizes quantitative test.
Fig. 2 Micro-Opto-Electro-Mechanical Systems film base coupled structure interface microsize interface wave dissipation synoptic diagram.Boundary wave is constantly decay with the increasing of propagation distance, the dissipation characteristic quantity phase velocity v of quantitative measurement Fourier Series expansion technique boundary wave, and wave number k, attenuation coefficient ξ etc. can carry out quantitative measurment to the elastic performance parameter and the interface quality of film matrix system.
The different film base interface coupling sample synoptic diagram that adhere to contact gear ratio and different adhesive bond gap curvature of Fig. 3.Level and smooth non-adhesion contact 15, non-adhesion contact 17 curvature that reflected different adhesive bond interface contact gear ratio and adhered to the gap and influences with oval spacing for the non-adhesion of rectangle spacing contact 16, by design different between gap density change contact gear ratio, take this to investigate dissipation behavior and characteristic quantity thereof under this condition.
The scale effect of Fig. 4 film base Fourier Series expansion technique and the Coupling Design synoptic diagram of study of coupling effect.The film of macroscopic view, microcosmic, meso-scale and matrix constitute different film base Fourier Series expansion technique in twos, and the film basic pattern product of same Fourier Series expansion technique, its dimensional variation of single constituent element such as nano thin-film, to cause the scale effect of mechanical property, elastic parameter etc., by same components film matrix system is passed through to change coupling yardstick, the scale effect of quantitative expedition system and coupling effect.
Embodiment proposed by the invention only describes technical scheme, and does not limit.
Claims (7)
1, photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system nondestructive quantitative measuring method, it arrives sample interface with ultrafast short-pulse impulse light transmission, excite and obtain microsize interface wave, by the microsize interface wave dissipation characteristic that receives is analyzed, realize quantitative test, it is characterized in that described ultrafast short-pulse impulse light is transferred to film base coupling sample interface in the Micro-Opto-Electro-Mechanical Systems by outside optical system, realizes photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system harmless quantitative non-contact testing.
2, photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system nondestructive quantitative measuring method according to claim 1, it is characterized in that adopting different process such as physical vapour deposition (PVD), chemical vapor deposition, magnetron sputtering and pulsed laser deposition to prepare film base coupling sample, regulate obtaining same components with geometric properties but the film base of different adhesion strength combinations coupling sample.
3, photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system nondestructive quantitative measuring method according to claim 1, it is characterized in that adopting same process, but the change technological parameter is regulated the preparation same components with geometric properties but the film base of different adhesion strength combinations coupling sample.
4, photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system nondestructive quantitative measuring method according to claim 1, it is characterized in that designing the film base coupling sample that different interfaces adhere to the contact area ratio, measure the microsize interface wave dissipation characteristic under this condition, determine to adhere to contact area than with the numerical relation of dissipation characteristic quantity, realize that film base coupled interface adheres to the quantitative measurement of contact gear ratio.
5, photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system nondestructive quantitative measuring method according to claim 1, it is characterized in that designing different curvature the interface adhere to the gap, investigate level and smooth non-adhesion contact, non-adhesion contact influence to microsize interface wave dissipation behavior and characteristic quantity thereof with oval spacing in the non-adhesion of rectangle spacing contact, in the realization Micro-Opto-Electro-Mechanical Systems film base coupled interface adhesion roughness quantitative estimation.
6, realize the device of the described photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system nondestructive quantitative measuring method of claim 1, it is accepted system, control system and sample system by ultrafast short-pulse impulse optical generator (4), outside optical system, frock clamp system, the interface glistening light of waves and forms, and it is characterized in that sample body is the film base coupling sample system that is coupled to form through the interface by film (10) and matrix (11) in the Micro-Opto-Electro-Mechanical Systems.
7, the device of photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system nondestructive quantitative measuring method according to claim 6, the film base Fourier Series expansion technique that it is characterized in that more than the micron order of film base coupling sample system by macroscopic view, the nano level film of the be situated between submicron order seen and microcosmic and matrix is coupled the different scale combination that constitutes in twos.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021127867A CN1189746C (en) | 2002-03-21 | 2002-03-21 | Nondestructive quantitative measuring method and device for photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021127867A CN1189746C (en) | 2002-03-21 | 2002-03-21 | Nondestructive quantitative measuring method and device for photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1382983A true CN1382983A (en) | 2002-12-04 |
| CN1189746C CN1189746C (en) | 2005-02-16 |
Family
ID=4742254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021127867A Expired - Fee Related CN1189746C (en) | 2002-03-21 | 2002-03-21 | Nondestructive quantitative measuring method and device for photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1189746C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100427921C (en) * | 2005-09-12 | 2008-10-22 | 电子科技大学 | Thin-membrane section positioning method of scanning probe microscope |
| CN102667442A (en) * | 2009-10-13 | 2012-09-12 | 派克米瑞斯有限责任公司 | System and method for detection and measurement of interfacial properties in single and multilayer objects |
| CN105572049A (en) * | 2015-12-16 | 2016-05-11 | 华南师范大学 | Opto-acoustic quantitative elasticity imaging method and device |
| CN105572048A (en) * | 2015-12-16 | 2016-05-11 | 华南师范大学 | Opto-acoustic quantitative elasticity and viscosity double-parameter imaging method and device |
| CN109799191A (en) * | 2017-11-17 | 2019-05-24 | 南京理工大学 | The optical touchless detection device and method of solid material rough surface acoustic disturbance |
| CN110567877A (en) * | 2019-09-26 | 2019-12-13 | 苏州热工研究院有限公司 | Laser film internal consumption instrument and material internal consumption detection method |
| CN113124792A (en) * | 2019-12-31 | 2021-07-16 | 哈尔滨工业大学 | Method for measuring bonding area of large-scale high-speed rotating equipment based on non-contact ultrasound |
-
2002
- 2002-03-21 CN CNB021127867A patent/CN1189746C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100427921C (en) * | 2005-09-12 | 2008-10-22 | 电子科技大学 | Thin-membrane section positioning method of scanning probe microscope |
| CN102667442A (en) * | 2009-10-13 | 2012-09-12 | 派克米瑞斯有限责任公司 | System and method for detection and measurement of interfacial properties in single and multilayer objects |
| CN102667442B (en) * | 2009-10-13 | 2015-07-29 | 派克米瑞斯有限责任公司 | For detecting and measure the system and method for the interfacial property in individual layer and multi-layer body |
| CN105572049A (en) * | 2015-12-16 | 2016-05-11 | 华南师范大学 | Opto-acoustic quantitative elasticity imaging method and device |
| CN105572048A (en) * | 2015-12-16 | 2016-05-11 | 华南师范大学 | Opto-acoustic quantitative elasticity and viscosity double-parameter imaging method and device |
| CN105572049B (en) * | 2015-12-16 | 2018-09-11 | 华南师范大学 | Optoacoustic quantifies elastograph imaging method and device |
| CN105572048B (en) * | 2015-12-16 | 2018-10-23 | 华南师范大学 | The quantitative elasticity of optoacoustic, the two-parameter imaging method of viscosity and device |
| CN109799191A (en) * | 2017-11-17 | 2019-05-24 | 南京理工大学 | The optical touchless detection device and method of solid material rough surface acoustic disturbance |
| CN109799191B (en) * | 2017-11-17 | 2021-07-06 | 南京理工大学 | Optical non-contact detection device and method for sound disturbance of rough surface of solid material |
| CN110567877A (en) * | 2019-09-26 | 2019-12-13 | 苏州热工研究院有限公司 | Laser film internal consumption instrument and material internal consumption detection method |
| CN113124792A (en) * | 2019-12-31 | 2021-07-16 | 哈尔滨工业大学 | Method for measuring bonding area of large-scale high-speed rotating equipment based on non-contact ultrasound |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1189746C (en) | 2005-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Briggs | Advances in acoustic microscopy | |
| Bergaud et al. | Viscosity measurements based on experimental investigations of composite cantilever beam eigenfrequencies in viscous media | |
| US7798000B1 (en) | Non-destructive imaging, characterization or measurement of thin items using laser-generated lamb waves | |
| Lu et al. | A multi-step method for in situ mechanical characterization of 1-D nanostructures using a novel micromechanical device | |
| Passeri et al. | Acoustics and atomic force microscopy for the mechanical characterization of thin films | |
| EP1985991A1 (en) | Measuring probe, sample surface measuring apparatus and sample surface measuring method | |
| KR20190107051A (en) | Heterodyne atomic force microscopy apparatus, methods and lithography systems | |
| Jajam et al. | An experimental investigation of dynamic crack growth past a stiff inclusion | |
| CN107192857A (en) | A kind of nano film thickness detection means and its method based on ultrasonic AFM | |
| Liu et al. | Dimension effect on mechanical behavior of silicon micro-cantilever beams | |
| CN1189746C (en) | Nondestructive quantitative measuring method and device for photoacaustic performance of membrane-base coupling structure in micro optical-mechanical-electric system | |
| Chen et al. | Laser-Generated Surface Acoustic Wave Technique for Crack Monitoring-A Review. | |
| Lafontan et al. | The advent of MEMS in space | |
| Hurley et al. | Mapping mechanical properties on the nanoscale using atomic-force acoustic microscopy | |
| US7966881B2 (en) | Arrangement for detecting resonance frequency shifts | |
| Weaver et al. | A quantitative acoustic microscope with multiple detection modes | |
| Turner et al. | Design and analysis of a dynamic MEM chemical sensor | |
| Lu et al. | FEM-based analysis on sensing out-of-plane displacements of low-order Lamb wave modes by CMUTs | |
| JP2005338063A (en) | Apparatus for measuring physical characteristics of sample | |
| Ellwood et al. | Imaging textural variation in the acoustoelastic coefficient of aluminum using surface acoustic waves | |
| US7395697B2 (en) | Force method for determining the spring constant of scanning probe microscope cantilevers using MEMS actuators | |
| Ngwa et al. | Characterization of polymer thin films by phase‐sensitive acoustic microscopy and atomic force microscopy: a comparative review | |
| Resch | Non-destructive evaluation of small surface cracks using surface acoustic waves | |
| CN1208882C (en) | Method and equipment for exciting microsize interface wave | |
| Zhang et al. | Evaluating local elasticity of the metal nano-films quantitatively based on referencing approach of atomic force acoustic microscopy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |