CN1362540A - Composite electroforming process of nickel-base composite material - Google Patents
Composite electroforming process of nickel-base composite material Download PDFInfo
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- CN1362540A CN1362540A CN 01139137 CN01139137A CN1362540A CN 1362540 A CN1362540 A CN 1362540A CN 01139137 CN01139137 CN 01139137 CN 01139137 A CN01139137 A CN 01139137A CN 1362540 A CN1362540 A CN 1362540A
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- nickel
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Abstract
The metal nickel is used as anode material, metal nickel plate is used as cathode deposition mother body, and in the electroforming plating liquor the reinforcing body and codepositino promotor made up by using cationic fluorocarbon surfactant, triethanolamine, hexamethyne tetramine and sulfourea are added, then powered on to make metal nickel ions and reinforcing body codeposit on the cathode mother body, then the composite electroformed plating layer can be stripped from cathode to obtain the integrally-reinforced nickel base compostion material with low cost and excellent performance.
Description
Technical field:
The present invention designs a kind of composite electroforming process of nickel-base composite material, belongs to the composite plating technology field.
Background technology:
The method that is used to prepare discontinuous enhancing metal-base composites at present is a lot, as (" metal-base composites " Zhang Guoding, Zhao Changzheng such as diffusion bonding method (solid state process), molten metal infiltration method (liquid infiltration method), casting, high energy forming methods, press of Shanghai Communications University, 1996).These preparation methods all need at high temperature carry out, and make metallic matrix easily and strengthen serious surface reaction, the oxidizing reaction of generation between the body and service temperature is higher, cause metallic matrix and the structure and the degradation that strengthen body interface.Simultaneously, in preparation process, strengthen that body is perishable under comparatively high temps, embrittlement, lose intensity, thus the forfeiture strengthening effect.And for prepare metal-base composites with composite plating method, one of them shortcoming is exactly that prepared composite deposite is thinner, in most cases only be at component surface plating one deck matrix material, it is compared with bulk material, its range of application narrower (" composite deposite " Guo Hetong, Zhang San unit, press of University Of Tianjin, 1991).
Summary of the invention:
The objective of the invention is to some shortcomings at conventional metals based composites preparation method and composite plating process, a kind of new nickel-base composite material electroforming preparing process is provided, in conjunction with complex electrodeposit axiom and galvanoplastics, relatively low at the technology cost, under the not high situation of service temperature, the preparation enhanced granule is evenly distributed, the relative common electrical coated coating of integral thickness is big, the nickel-base composite material of excellent performance.
Technical scheme of the present invention is: based on complex electrodeposit axiom, make anode material with metallic nickel, thickness be the metal nickel plate of 1mm as the cathodic deposition parent, in the composite plating groove, select the preparation electroform bath.(concentration range in electroform bath is 5～100g/L) to add in the electroform bath will to strengthen body, and adding codeposition promotor, energising makes metallic nickel ions and strengthens the body common deposited on the negative electrode parent then, at last complex electroform coating is peeled off and is obtained the overall enhanced nickel-base composite material from negative electrode.
Electroform bath of the present invention can be selected vitriol electroforming solution, sulfamate, vitriol-muriate and high speed electroformed nickel electroforming solution respectively for use.Strengthen body and can select different kinds for use, as particle (as particles such as SiC, BN, graphite, PFTE), whisker (as the SiC whisker) and staple fibre (as graphite fibre, carbon fiber etc.), to prepare multiple enhancing nickel-base composite material.The codeposition promotor of being adopted is the mixed preparation of cation fluorine carbon surface active agent (FC), trolamine, hexamethylenetetramine and four kinds of additives of thiocarbamide gained, its composition proportion in electroform bath is: cation fluorine carbon surface active agent 1～5g/L, trolamine 30～80ml/L, hexamethylenetetramine 10～50g/L, thiocarbamide 0～30mg/L.
The present invention carries out in the aqueous solution, and temperature is no more than 90 ℃, and only needs to transform slightly on general electroplating device basis and just can be used as this composite electroformed equipment, and cost is lower.Can effectively control the enhancing content of body in nickel-base composite material and the degree of uniformity of distribution by the adjusting process parameter in addition, thereby make material in a big way, keep better physical and mechanical property.The nickel-base composite material enhanced granule of the present invention's preparation is evenly distributed, the relative common electrical coated coating of integral thickness is big, excellent performance.
Embodiment:
Below by specific embodiment technical scheme of the present invention is further described.
Embodiment 1:
Preparation vitriol electroform bath in the composite plating groove, its composition is:
NiSO
4·7H
2O：250g/L；NiCl
2·6H
2O：45g/L；H
3BO
3：35g/L
Anode material is the nickel plate.Strengthen body and function SiC
p(particle diameter is 7 μ m) 40g/L, codeposition promotor composition is (ratio of each additive is its composition proportion in electroplating bath solution):
Cation fluorine carbon surface active agent: 2.5g/L;
Trolamine: 50ml/L;
Hexamethylenetetramine: 25g/L;
Thiocarbamide: 10mg/L.
At SiC
pBefore adding in the electroform bath, the mixed dissolving of codeposition promotor for preparing with pure water and part earlier is again with SiC
pPut into and wherein carry out stir process to smash the SiC of reunion
p, and slough SiC
pThe impurity on surface.Afterwards, with SiC
pPut into electroform bath together with codeposition promotor, and constantly stir electroform bath.Adopt the board-like lifting agitator of development voluntarily in the plating tank, in the bottom of the compound groove of electroforming the flat board that a slice is drilled with many apertures is installed, pumping in the groove by acting on of motor makes particle even suspended dispersed in plating bath.Energising makes SiC
pWith the nickel ion common deposited on the negative electrode parent.The adjusting process parameter: cathode current density is 6A/dm
2Plating temperature is 25 ℃; Stirring frequency is 60r/min.To constantly stir electroform bath in the whole energising preparation process.
Gained Ni/SiC
pSiC in the matrix material
pContent is 29% (volume percent), and SiC
pIn material, be evenly distributed.And material surface planarization, smooth finish are better.
Embodiment 2:
Preparation vitriol electroform bath in the composite plating groove, its composition is:
NiSO
4·7H
2O：250g/L；NiCl
2·6H
2O：45g/L；H
3BO
3：35g/L
Anode material is the nickel plate.Strengthen body and function SiC whisker 45g/L, codeposition promotor composition is (ratio of each additive is its composition proportion in electroplating bath solution):
Cation fluorine carbon surface active agent: 2.5g/L;
Trolamine: 50ml/L;
Hexamethylenetetramine: 25g/L;
Thiocarbamide: 10mg/L.
Before the SiC whisker added in the electroform bath, the mixed dissolving of codeposition promotor for preparing with pure water and part earlier put into the SiC whisker and wherein carried out stir process smashing the SiC whisker of reunion, and slough the impurity on SiC whisker surface.Afterwards, SiC whisker and codeposition promotor are put into electroform bath together, and constantly stir electroform bath.Adopt the board-like lifting agitator of development voluntarily in the plating tank, in the bottom of the compound groove of electroforming the flat board that a slice is drilled with many apertures is installed, pumping in the groove by acting on of motor makes particle even suspended dispersed in plating bath.Energising makes SiC whisker and nickel ion common deposited on cathode base.The adjusting process parameter: cathode current density is 6A/dm
2Plating temperature is 25 ℃; Stirring frequency is 60r/min.To constantly stir electroform bath in the whole energising preparation process.
SiC whisker content is 26% (volume percent) in the gained SiC crystal whisker enhancement nickel-base matrix material, and the SiC whisker is evenly distributed in material.Material surface is a little bit poorer a little than planarization, the smooth finish of 1 prepared material of example, and this is because the result that the SiC whisker of large-size adds.
Embodiment 3:
Preparation sulfamate electroform bath in the composite plating groove, its composition is:
Ni(NH
2SO
3)
2·4H
2O：400g/L；NiCl
2·6H
2O：15g/L；H
3BO
3：35g/L
Anode material is the nickel plate.Strengthen body and function SiC
p(particle diameter is 7 μ m) 35g/L, codeposition promotor composition is (ratio of each additive is its composition proportion in electroplating bath solution):
Cation fluorine carbon surface active agent: 2.5g/L;
Trolamine: 50ml/L;
Hexamethylenetetramine: 25g/L;
Thiocarbamide: 10mg/L.
At SiC
pBefore adding in the electroform bath, the mixed dissolving of codeposition promotor for preparing with pure water and part earlier is again with SiC
pPut into and wherein carry out stir process to smash the SiC of reunion
p, and slough SiC
pThe impurity on surface.Afterwards, with SiC
pPut into electroform bath together with codeposition promotor, and constantly stir electroform bath.Adopt the board-like lifting agitator of development voluntarily in the plating tank, in the bottom of the compound groove of electroforming the flat board that a slice is drilled with many apertures is installed, pumping in the groove by acting on of motor makes particle even suspended dispersed in plating bath.Energising makes SiC
pWith the nickel ion common deposited on cathode base.The adjusting process parameter: cathode current density is 6A/dm
2Plating temperature is 25 ℃; Stirring frequency is 60r/min.To constantly stir electroform bath in the whole energising preparation process.
Gained Ni/SiC
pSiC in the matrix material
pContent is 26% (volume percent), and SiC
pIn material, be evenly distributed.
Claims (3)
1, a kind of composite electroforming process of nickel-base composite material, it is characterized in that making anode material with metallic nickel, metal nickel plate is as the cathodic deposition parent, in the electroform bath in the composite plating groove, add the enhancing body of 5～100g/L and by cation fluorine carbon surface active agent 1～5g/L, trolamine 30～80ml/L, hexamethylenetetramine 10～50g/L, the codeposition promotor of thiocarbamide 0～30mg/L mixed configuration gained, energising makes metallic nickel ions and strengthens the body common deposited on the negative electrode parent, again complex electroform coating is peeled off and is obtained the overall enhanced nickel-base composite material from negative electrode.
2,, it is characterized in that electroform bath selects vitriol electroforming solution, sulfamate, vitriol-muriate or high speed electroformed nickel electroforming solution for use as the said composite electroforming process of nickel-base composite material of claim 1.
3,, it is characterized in that strengthening body and select particle or SiC whisker or graphite fibre, carbon fibers etc. such as SiC, BN, graphite, PFTE for use as the said composite electroforming process of nickel-base composite material of claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01139137 CN1132968C (en) | 2001-12-20 | 2001-12-20 | Composite electroforming process of nickel-base composite material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01139137 CN1132968C (en) | 2001-12-20 | 2001-12-20 | Composite electroforming process of nickel-base composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1362540A true CN1362540A (en) | 2002-08-07 |
| CN1132968C CN1132968C (en) | 2003-12-31 |
Family
ID=4675063
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01139137 Expired - Fee Related CN1132968C (en) | 2001-12-20 | 2001-12-20 | Composite electroforming process of nickel-base composite material |
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| CN (1) | CN1132968C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100523310C (en) * | 2002-11-01 | 2009-08-05 | 信州大学 | Metal plating structure and method for production thereof |
| CN102146573A (en) * | 2011-03-14 | 2011-08-10 | 江苏技术师范学院 | Method for preparing nano composite material by supercritical fluid electroforming |
| CN108725060A (en) * | 2017-04-14 | 2018-11-02 | 深圳市传代金文化有限公司 | A kind of roll unit and its method for the pattern-making of precious metal sheets surface |
| CN110257895A (en) * | 2019-06-24 | 2019-09-20 | 江苏守航实业有限公司 | A kind of electrolytic polishing method and device of semiconductor material |
| CN111088507A (en) * | 2018-10-24 | 2020-05-01 | 通用电气公司 | Method of forming high temperature electroformed component and related component |
| CN113695731A (en) * | 2021-09-02 | 2021-11-26 | 哈尔滨工业大学 | Method for performing metal/alloy low-temperature diffusion connection by utilizing electrodeposited nanocrystalline nickel intermediate layer |
| US11788198B2 (en) | 2018-10-24 | 2023-10-17 | General Electric Company | Methods of forming high-temperature electroformed components and related components |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100336940C (en) * | 2005-02-24 | 2007-09-12 | 上海交通大学 | Composite electroforming preparing process for nano silicon carbide particle reinforced nickel base composite material |
-
2001
- 2001-12-20 CN CN 01139137 patent/CN1132968C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100523310C (en) * | 2002-11-01 | 2009-08-05 | 信州大学 | Metal plating structure and method for production thereof |
| CN102146573A (en) * | 2011-03-14 | 2011-08-10 | 江苏技术师范学院 | Method for preparing nano composite material by supercritical fluid electroforming |
| CN102146573B (en) * | 2011-03-14 | 2013-05-08 | 江苏理工学院 | Method for preparing nano composite material by supercritical fluid electroforming |
| CN108725060A (en) * | 2017-04-14 | 2018-11-02 | 深圳市传代金文化有限公司 | A kind of roll unit and its method for the pattern-making of precious metal sheets surface |
| CN108725060B (en) * | 2017-04-14 | 2020-01-21 | 深圳市传代金文化有限公司 | Rolling equipment and method for manufacturing pattern on surface of noble metal chip |
| CN111088507A (en) * | 2018-10-24 | 2020-05-01 | 通用电气公司 | Method of forming high temperature electroformed component and related component |
| CN111088507B (en) * | 2018-10-24 | 2023-02-21 | 通用电气公司 | Method of forming high temperature electroformed component and related components |
| US11788198B2 (en) | 2018-10-24 | 2023-10-17 | General Electric Company | Methods of forming high-temperature electroformed components and related components |
| CN110257895A (en) * | 2019-06-24 | 2019-09-20 | 江苏守航实业有限公司 | A kind of electrolytic polishing method and device of semiconductor material |
| CN113695731A (en) * | 2021-09-02 | 2021-11-26 | 哈尔滨工业大学 | Method for performing metal/alloy low-temperature diffusion connection by utilizing electrodeposited nanocrystalline nickel intermediate layer |
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| Publication number | Publication date |
|---|---|
| CN1132968C (en) | 2003-12-31 |
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