CN1325981C - Working platform structure of binding machine and its control method - Google Patents
Working platform structure of binding machine and its control method Download PDFInfo
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- CN1325981C CN1325981C CNB031054102A CN03105410A CN1325981C CN 1325981 C CN1325981 C CN 1325981C CN B031054102 A CNB031054102 A CN B031054102A CN 03105410 A CN03105410 A CN 03105410A CN 1325981 C CN1325981 C CN 1325981C
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Abstract
Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force to hold a substrate, a plurality of vacuum holes in the plate around the electro-static chucks for receiving a vacuum force, and adsorbing and holding the substrate, and a plurality of alignment mark confirming holes in a periphery of the plate for confirming the marks for aligning the adsorbed substrate, thereby separating substrate from the stage more easily by applying a DC power with polarities opposite to a regular DC power.
Description
The application requires to enjoy the P2002-0014998 of proposition on March 20th, 2002 and the rights and interests of P2002-0015077 Korean application, and it all is being hereby incorporated by reference.
The application comprises with reference to two common pending applications, these two applications are respectively: proposed on June 28th, 2002 be numbered 10/184,096, title be the application (procurator number be 8733.666.00) of " SYSTEM AND METHOD FORMANUFACTURING LIQUID CRYSTAL DISPLAY DEVICES "; What on June 28th, 2002 proposed is numbered 10/184,088, title is " SYSTEM FOR FABRICATING LIQUID CRYSTAL DISPLAY ANDMETHOD OF FABRICATING LIQUID CRYSTAL DISPLAY USING THESAME " application (8733.684.00), and they are all quoted at this.
Technical field
The present invention relates to-kind make the bonder of LCD, relate in particular to the Working table structure in the bonder of a kind of employing liquid crystal drip-injection manufactured LCD (LCD), also relate to the method for controlling a bonder.
Background technology
Development along with information society, demand to display increases gradually with various forms, recently, for satisfying these demands, developed different flat display boards, for example liquid crystal indicator (LCD), plasma display panel (PDP), electroluminescence show display device (ELD), vacuum fluorescent display device (VFD) etc., and some of them are as the display device in the various device.
LCD has been widely used as mobile display device very much, and LCD has replaced cathode ray tube (CRT) with its image quality characteristic and advantage good, in light weight, thin and low in energy consumption.Except the monitor of mobile model LCD such as notebook, for receiving and the TV (TV) of display of broadcast signal and the monitor exploitation LCD of computing machine.
Although the LCD as display in the different field is had various technological development means, but in many aspects, be used for strengthening as the effort of the LCD image quality of display and characteristic and the advantage of LCD and have contradiction.Therefore, for the LCD that is used for various fields as a universal display device, the key of exploitation LCD is LCD is accomplished that what degree could realize high grade picture such as high definition and high brightness and large-screen, makes LCD keep having in light weight, thin and characteristic low in energy consumption simultaneously.
Can make LCD with a kind of general known LCD injection method, sealant on a substrate wherein, form a filling orifice, under the vacuum state with this base plate bonding to another substrate, by the filling orifice in the sealant or inject liquid crystal wherein with a kind of liquid crystal drip-injection method that this liquid crystal drip-injection method is disclosed in 2000-284295 and 2001-005405 Jap.P. open file, wherein provide to drip on it one of liquid crystal substrate and another substrate are arranged, order is close mutually along these two substrates that a vertical direction is oppositely arranged, bonding these two substrates.
In these two kinds of methods, the advantage of liquid crystal drip-injection method is, can omit many steps (for example forming the step of liquid crystal filling orifice, the step of injecting liquid crystal and the step of encapsulated liquid crystals filling orifice), and the equipment that needs still less.Therefore, the various device that is used for the liquid crystal drip-injection method has been carried out development research.
Fig. 1 and 2 illustrates a prior art bonder, and it has adopted the liquid crystal drip-injection method.
This prior art bonder is furnished with frame 10, worktable part 21 and 22, a sealant exit portion (not shown), a liquid crystal drip-injection part 30, chamber part 31 and 32, chamber mobile device and the movable workbench device of a formation profile.
Worktable partly has upper table 21 and lower table 22, and an electrostatic chuck 28 is arranged in the bottom of upper table 21.This electrostatic chuck 28 is a kind of dielectric panels with two square grooves, and each square groove that wherein is provided with a plate electrode scribbles a dielectric substance, and its first type surface is on the surface identical with electrostatic chuck 28 ground.Each plate electrode (not shown) of burying underground is being connected to one just/negative DC power supply by a suitable switch.When being added to a positive voltage or negative voltage on the plate electrode, with same plane, electrostatic chuck 28 ground on the dielectric substance first type surface on induce a negative charge or positive charge, thereby this substrate is adsorbed in the Coulomb force that produces between the ELD by substrate 51 and charge generation.
Position one side of sealant exit portion and liquid crystal drip-injection part 30 and bonding frame is consistent, and the chamber part has dismountable each other go up chamber unit 31 and following chamber unit 32.
The chamber mobile device has a drive motor 40, this motor 40 is used for carrying out bonding position with descending chamber unit 32 to move to selectively, perhaps move to the position that discharges sealant and dispenser method, and the movable workbench device has drive motor 50, and this drive motor 50 is used for driving up and down selectively upper table 21.
Below describe each step of method of making LCD with the prior art bonder of front in detail.
At first, second substrate 52 is installed to down on the lower table 22 in the chamber unit,, move this time chamber unit 32 to upper table 21 residing positions by the drive motor 40 of drive chamber's mobile device.
In this case, upper table 21 produces pull of vacuum, by vacuum suction second substrate 52, by driving drive motor 40, following chamber unit 32 is moved to the position of sealant and dispenser method.
Then, first substrate 51 is put in the lower table 22, afterwards, lower table 22 produces pull of vacuum, vacuum suction first substrate 51.This state is shown among Fig. 1.
In this case, by chamber mobile device 40, the following chamber unit 32 that will have lower table 22 moves to the position of sealant and dispenser method.
Then, when finishing sealant coating and liquid crystal drip-injection work with sealant exit portion and liquid crystal drip-injection part 30, as shown in Figure 2,, following chamber unit 32 is moved to the position of adhesive base plate once more by chamber mobile device 40.
Afterwards, with chamber mobile device 40 bonding chamber units 31 and 32, seal each worktable 21 and 22 residing space respectively, and with these spaces of separate vacuum device emptying.In this case, fallen on the catch pawl (not shown) at second substrate 52 on the upper table by vacuum suction, in abundant this chamber of emptying, second substrate 52 on it on alive electrostatic chuck 28 absorption catch pawls.
Subsequently, move down worktable 21, make second substrate, 52 contacts that are adsorbed on the upper table 21 be adsorbed on first substrate 51 on the lower table 22 and press down it,, finish the manufacturing of LCD thus with bonding these two substrates.
But the prior art assembly machine (bonder) of front has following problem.
At first, because this prior art bonder has a system, in this system, be formed with the substrate of thin film transistor (TFT) thereon and be formed with on it on substrate of color-filter layer and carry out sealant coating and liquid crystal drip-injection operation, so this prior art bonder becomes bulky because of carrying out the each several part that sealant applies and liquid crystal drip-injection is operated.
Particularly, the required bonder of large LCD becomes more huge recently, and this is unfavorable for making large LCD.
Secondly, if chamber unit is bad with the combination seal between the last chamber unit down, so may be in adhesion process damaged substrate, bonding also may the leakage partly through one because of air be appeared and defectiveness.Therefore, under vacuum state, also need to be used for to prevent the part of leaking gas in addition, this is difficult to the precision that reaches required.
The 3rd, may be by applying the electrostatic chuck that different electrode voltages adsorbs two plate electrodes of substrate because of the electrostatic attraction substrate that drops inadequately.In addition, can't adsorb large-size glass substrate.
The 4th, be very difficult in the process of adhesive base plate, come align substrates by chamber under moving along a horizontal direction, this has just prolonged the required time cycle of whole manufacturing.That is to say, need many move operations owing to make, for example will descend chamber unit to move to dispenser method or sealant will be coated to the position that is supported on a substrate on the lower table, the chamber is returned the position of adhesive base plate once more under making when finishing above process, and this just is difficult to guarantee the accuracy of base plate alignment.
The 5th, as previously mentioned, even finish bonding after, cut off the power supply that on the electrostatic chuck 28 substrate and last/lower table is separated, being retained in upper table also is easy to stop separating of institute's adhesive base plate with electromotive force between the institute adhesive base plate, this make bonding substrate misalignment, weakened the bounding force of sealant.
Summary of the invention
The present invention relates to the Working table structure in a kind of bonder of making LCD, also relate to a kind of control method of bonder, they have avoided one or more problems of bringing because of the limitation of prior art and shortcoming basically.
An advantage of the present invention is to provide the Working table structure in the bonder of a kind of manufacturing LCD (LCD), it can provide a kind of bonder, movable workbench direction and scope that this bonder has the only size of a pair of integral layout, moving range and simplifies for steady align substrates.For the stationary process design relevant with other processes, shortened and made a time cycle that LCD is required, in the releasing Electrostatic Absorption process after Electrostatic Absorption, more reposefully substrate and worktable are separated, a kind of method of making bonder also is provided.
Other features and advantages of the present invention are listed in the following description, and according to this description, wherein a part becomes clearly, perhaps can be by practice of the present invention is learned.Pass through the structure that particularly points out in the instructions write and claims and the accompanying drawing, can realize and reach other purposes of the present invention and advantage.
In order to realize these and other advantages, according to purpose of the present invention, as institute the concrete and general description, the Working table structure of the bonder of this first and second substrates that are used for the slurry LCD comprises: one is contained in the plate in the bonding chamber movably; Be installed to the many groups electrostatic chuck on this plate, be used to provide the electrostatic force of supporting substrate; A plurality of vacuum holes, they are positioned at around the electrostatic chuck in this plate, are used for receiving a vacuum power, absorption and supporting substrate; A plurality of alignment marks are determined the hole, and they are used for determining to aim at the mark of adsorbed substrate in the periphery of this plate.
One group of electrostatic chuck comprises that a plurality of plate electrodes are right, is added with the voltage of opposite polarity on these electrode pairs.
Plate electrode have with the adjacent panels electrode on the opposite polarity voltage of institute's making alive.
Electrostatic chuck in each group is of different sizes.
A plurality of alignment marks determine that the hole comprises at least two thick index aperture and at least four thin index aperture.
Working table structure in this bonder also comprises the elevating lever hole in the plate, and these holes are used in the process of mounting substrate supporting substrate or lift substrate from worktable in uninstall process.
Electrostatic chuck comprises six groups.
One group of electrostatic chuck comprises four plate electrodes.
Plate electrode have with the adjacent panels electrode on the opposite polarity voltage of institute's making alive.
Working table structure in this bonder also comprises at least one or the standby hole more than in this plate middle body.
A plurality of alignment marks determine that the hole comprises at least one hole in the part of cutting away at an angle of electrostatic chuck in each angle of upper table.
Working table structure in this bonder also comprises a plurality of fixed orifices in the plate periphery, these fixed orifices be used for fixing bonding substrate.
Another aspect of the present invention provides the Working table structure in a kind of bonder, and this structure has a upper table and a lower table, and this structure comprises: be loaded into many groups first electrostatic chucks on the upper table, be used to provide the electrostatic force that supports a substrate; A plurality of first vacuum holes, they are positioned at around the electrostatic chuck in upper table, are used for receiving a vacuum power, adsorb and support this substrate; A plurality of first alignment marks are determined the hole, and they are used for determining to aim at the mark of adsorbed substrate in the neighboring of upper table; Be loaded into many groups second electrostatic chucks on the lower table, be used to provide the electrostatic force that supports this substrate; A plurality of second vacuum holes, they are positioned at around the electrostatic chuck in lower table, are used for receiving a vacuum power, adsorb and support this substrate.
Working table structure in this bonder also comprises: a plurality of first fixed orifices, they in the neighboring of upper table, be used for fixing bonding substrate; A plurality of second fixed orifices, they in the neighboring of lower table, be used for fixing bonding substrate.
A plurality of first fixed orifices are formed on the different mutually positions with a plurality of second fixed orifices.
Working table structure in this bonder also comprises: the elevating lever hole in the lower table, these holes are used in the process of mounting substrate supporting substrate or lift substrate from worktable in uninstall process.
Working table structure in this bonder also comprises: a plurality of second alignment marks are determined the hole, and they are used for determining to aim at the mark of adsorbed substrate in the periphery of lower table.
A plurality of first alignment marks determine that hole or a plurality of second alignment mark determine that the hole comprises at least two thick index aperture and at least four thin index aperture.
Second alignment mark determines to have in the hole light to pass.
Electrostatic chuck comprises six groups, and each group comprises four plate electrodes.
Another aspect of the present invention, a kind of control method with bonder of last lower table is provided, each worktable all has electrostatic chuck, each sucker all has a plurality of plate electrodes, this method comprises: a reverse voltage or positive polarity voltage are added on the plate electrode in the electrostatic chuck, and last lower table adsorbs each substrate by electrostatic chuck; Move and go up lower table with adhesive base plate; And cutting off the voltage that is applied on the electrostatic chuck, the voltage with opposite polarity is applied on the plate electrode respectively, mobile upper table or lower table.
Another aspect of the present invention, a kind of control method with bonder of last lower table is provided, each worktable all has electrostatic chuck, and each sucker all has a plurality of plate electrodes, and this method comprises: first substrate and second substrate are installed in the bonding chamber; The bonding chamber of emptying; A reverse voltage or positive polarity voltage are added on the plate electrode in the electrostatic chuck, and last lower table adsorbs each substrate by electrostatic chuck; Move and go up lower table with adhesive base plate; And cutting off the voltage that is applied on the electrostatic chuck, the voltage with opposite polarity is applied on the plate electrode respectively, mobile upper table or lower table.
The control method of this bonder also comprises: after being applied to reverse voltage or positive polarity voltage on the plate electrode, aim at the substrate that is adsorbed on the lower table.
The control method of this bonder also comprises: make bonding chamber ventilated, to two bonding substrates exert pressure; And being applied to voltage on the electrostatic chuck in cut-out, the voltage with opposite polarity is applied on the plate electrode respectively, after mobile upper table or the lower table, unloads first substrate and second substrate of being pressed.
It should be understood that description and the following detailed description that the front is total are exemplary and indicative, they are used to provide further specifying as the present invention for required protection.
Description of drawings
Included being used to provide further understood and the accompanying drawing that constitutes an instructions part that included shows embodiments of the invention the present invention, and is used for explaining principle of the present invention together with word segment:
In these accompanying drawings:
Fig. 1 shows a kind of substrate bonding machine of the employing prior art liquid crystal drip-injection method in the brilliant process of dropping liquid;
Fig. 2 shows a kind of substrate bonding machine of the employing prior art liquid crystal drip-injection method in the adhesive base plate process;
Fig. 3 schematically shows the bonder that adopts a kind of liquid crystal drip-injection manufactured LCD according to one embodiment of the invention;
Fig. 4 schematically shows the planimetric map according to one embodiment of the invention electrostatic chuck in bonder;
Fig. 5 shows along the section of Fig. 4 center line I-I ';
Fig. 6 shows the detailed plan view of a upper table in the bonder according to an embodiment of the invention;
Fig. 7 shows the detailed plan view according to one embodiment of the invention one lower table.
Embodiment
Describe various embodiments of the present invention now in detail, its example is shown in the drawings.
Fig. 3 schematically shows the bonder that adopts a liquid crystal drip-injection manufactured one LCD (LCD) according to one embodiment of the invention.
Bonder of the present invention comprises a bonding chamber 110, worktable part, a movable workbench device (not marking), an emptier (not marking), a ventilation unit (not marking) and a loading station 300.
Therewith together, the opening 111 in bonding chamber 110 provides a (not shown), and this door is used for closing selectively this opening.
Door 111a can be the general slip or the door of rotary type, or other can close the device of opening, and the seal member of the Men Youyi sealing off gap of this slip or rotary type does not illustrate its details among the figure.
Worktable partly comprises and is installed in the bonding chamber 110 in the upper spaces respectively and upper table 121 and lower table 122 in the space, a bottom, they are faced mutually, are used for supporting by loading station 300 putting into the locational substrate 510 of processing and 520 that bonding chamber 110 needs.
Suggestion upper table 121 has at least one electrostatic chuck (ESC) 121a and at least one vacuum hole 121b, electrostatic chuck 121a is installed on the groove in upper table 121 bottoms, be used for by the electrostatic force supporting substrate, vacuum hole 121b is used for through hole vacuum suction and supporting substrate.
Though the present embodiment suggestion has at least two ESC 121a to form a pair of, be added with opposite polarity dc voltage on each ESC in order to use the static supporting substrate, but the present invention is not limited to this, but can be designed so that to be added with opposite polarity dc voltage so that electrostatic force to be provided on the ESC.
Upper table 121 has a plurality of vacuum hole 121b that are formed at around each ESC 121a, and ESC121 is fixed to upper table 121 bottoms, and vacuum hole is connected to single pipeline or the multi-line 121c that is communicated with the vacuum pump 123 that is connected to upper table 121.
Herewith together, suggestion lower table 122 has at least one electrostatic chuck (ESC) 122a and at least one vacuum hole (not shown), electrostatic chuck 122a is used to provide the electrostatic force of supporting substrate on lower table 122 end faces, vacuum hole is used for through hole vacuum suction and supporting substrate.
ESC and vacuum hole can be with upper table 121 identical or different, but to consider that the whole manufacturing process of substrate or each liquid crystal coating region dispose electrostatic force generator and vacuum hole.
The movable workbench device comprises: shifting axle 131, and it is used for moving up and down selectively upper table 121; Turning axle 131, it is used for left rotation and right rotation lower table 122 selectively; Drive motor 133 and 134, they are installed in the inside or the outside of chamber 110, link to each other with 122 with worktable 121 by axle respectively.
Bonder of the present invention is equipped with an aspiration pump, and it transmits a suction so that the inner space of bonding chamber 110 reaches a vacuum state selectively, and is activated, and produces a total air suction.The space that aspiration pump 200 is had forms this space and is communicated with the exhaust tube 112 of bonding chamber 110.
Loading station is the device that separates with bonding chamber 110 and bonding chamber 110 interior various parts, it is installed in 110 outsides, bonding chamber, be used for admitting and carry it on selectively and drip second substrate 520 that first substrate 510 of liquid crystal is arranged or be coated with sealant on it, pack into bonding chamber 110 of these substrates is interior or from wherein taking out them.
Loading station comprises the first arm 310 and second arm 320, the first arm 310 is used for carrying and drips first substrate 510 that liquid crystal is arranged on it, second arm 320 is used for carrying second substrate 520 that is coated with sealant on it, wherein this loading station is designed under first substrate 510 on will installing to associated arm 310 and 320 and second substrate 520 stand-by state before packing in 110 inner spaces, bonding chamber, the first arm 310 is positioned on second arm 320.
In addition, advise that also bonder of the present invention also comprises an alignment device 600, it is used for determining installing in the bonding chamber 110 and installing to alignment between the substrate 510 and 520 on worktable 121 and 122 respectively by loading station, at this moment, though alignment device 600 can be installed to the outside or inner of bonding chamber 110 at least, but the present invention's suggestion, as an embodiment, alignment device 600 is installed to the outside of bonding chamber 110.
Like this, with carry out the prior art bonder that substrate form to handle and compare by in other processes, separating, make the front according to an embodiment of the invention the bonder size significantly reduce, and can shorten the manufacturing time cycle greatly by making bonder only carry out a simple adhesion process.
In addition, only move in very limited scope by making lower table, aforementioned system of the present invention can be faster and align substrates more accurately.Different with prior art, since the bonding chamber of aforementioned system of the present invention be not can be selectively in conjunction with/two bonding chambers up and down of taking apart, but whole bonding chamber, so the leakage problem that two bonding chambers produce when combining can be eliminated by aforementioned system of the present invention, and can save and prevent to leak required many parts.
Below describe upper table and lower table in detail.Fig. 4 schematically show a kind of according to the present invention the planimetric map of an electrostatic chuck in the bonder.
Referring to Fig. 4, upper table 121 or lower table 122 are provided with many group (6 groups) electrostatic chuck 121a, they are used to provide an electrostatic force, the absorption substrate, wherein each group electrostatic chuck 121a comprises at least one pair of plate electrode 1, is added with opposite polarity (negative/just) DC electric current on the pair of plates electrode 1 respectively.A plurality of vacuum hole 121b are arranged in upper table 121, and they are used for receiving vacuum power around electrostatic chuck 121a, absorption and supporting substrate.
Therefore, when being added to a positive voltage or negative voltage on the plate electrode 1, on upper table 121 and lower table 122, induce a negative charge or positive charge, substrate is subjected to by the Coulomb force absorption of charge generation between a conductive layer and upper table, this conductive layer for example is indium tin oxide (ITO), is used to form transparency electrode on glass substrate 520 as a public electrode or each pixel capacitors.
Below describe upper table and the lower table that is formed with electrostatic chuck and miscellaneous part on it in detail.Fig. 6 illustrates the detailed plan view of upper table in the bonder according to an embodiment of the invention.Fig. 7 illustrates the detailed plan view of lower table in the bonder according to an embodiment of the invention.
Referring to Fig. 6, many group (6 groups) electrostatic chuck 121a are arranged, they each all be installed in the groove in upper table 121 1 planes, be used to provide the electrostatic force of absorption substrate, wherein each group electrostatic chuck 121a comprises manyly to plate electrode 1 (four plate electrodes), is added with the DC electric current of opposite polarity on the plate electrode of each centering respectively.The form of these group electrostatic chucks 121a has nothing in common with each other, and with fastener they is fastened on the upper table, for example uses fastening bolt 2.
A plurality of vacuum hole 121b are arranged in upper table 121, and they are used for receiving vacuum power with absorption and supporting substrate around electrostatic chuck 121a.
In upper table, in 121, the hole 3b that is used for determining the coarse alignment mark is arranged, 3d, 3f, 3g, 3i and 3k and the hole 3a that is used for determining thin alignment mark, 3c, 3e, 3h, 3j and 3l, they are relative with alignment device 600 around electrostatic chuck 121a, also have the bight of plate electrode 1, they are cut into ' L ' shape in the bight of upper table, wherein be formed with the hole 3m and the 3n that are used for determining thick or thin alignment mark.That is to say, in the sidepiece up and down of bight of upper table (four parts) and upper table, form porose 3a-3l in pairs, they are used for determining coarse alignment mark and thin alignment mark, and in the bight of plate electrode 1, forming porose 3a-3l in pairs, they are used for confirming coarse alignment mark and thin alignment mark.Though the bight of general substrate is formed with thick and thin alignment mark, but the alignment mark of determining the different size substrate with the as many hole of different size substrate is also arranged.
Therefore,, utilize the four couples of hole 3a in the upper table bight and 3b and 3k and 3l to determine the alignment mark that forms it on, and, then utilize remaining hole to determine alignment mark when the substrate of substrate ratio maximum hour when substrate when being maximum.That is to say, when substrate is maximum, minimum two coarse alignment index aperture are just enough in the bight, in case of necessity, the coarse alignment index aperture of needs more than four is to adapt to different models or size, and minimum four thin alignment mark holes are just enough, and in case of necessity, the thin alignment mark hole of needs more than six is to adapt to different models or size.
In addition, be symmetrically formed a plurality of alignment marks with respect to a middle body and determine the hole.
Though utilize in the process of bonder adhesive base plate in explanation and not discuss, but have very big possibility do not aim at bonding substrate, this situation that does not have to aim at is upper table 121 to be moved down and to after being adsorbed on the substrate pressurization on upper table and the lower table, introduces dry air or gas because of pressure change with in to the process of bonding chamber venting by institute's adhesive base plate and causes pressure is uniformly applied to be out of shape on the two substrates.Therefore, before ventilation, carry out the fixation procedure of two institute's adhesive base plates.In fixation procedure, use up the partial fixing sealant, perhaps with heat or pressure fix bonding two substrates.Like this, for fixing two bonding substrates, need in addition with rayed sealant or heated sealant agent.
Therefore, in the electrostatic chuck 121a neighboring of upper table 121, porose 4a, 4b, 4c, 4d, 4e and 4f, they are used for a ultraviolet light is directed on the sealant, perhaps sealant are carried out the part heating.That is to say, with two substrates between on the corresponding position, sealant (fixing seal agent) position that forms, form these holes.Though there is shown six holes, but it is just enough to equal four or more fixed orifice number.
Though not shown in the figures, can also on the position beyond the upper table neighboring, standby hole be arranged, in the neighboring of upper table 121, also having groove 7, they have has a clamp to be used to enter on several parts.
Referring to Fig. 7, similarly, also have many group (6 groups) electrostatic chuck 122a, each group electrostatic chuck is installed in the interior groove of lower table 122 (plate), be used to provide the electrostatic force of absorption substrate, wherein each group electrostatic chuck 122a comprises manyly to plate electrode 1 (four plate electrodes), is added with opposite polarity DC electric current on the plate electrode 1 of each centering respectively.The form of these group electrostatic chucks 122a has nothing in common with each other, and they for example are fixed on the lower table 122 by fastening bolt 2 by fastener.
In lower table 122, electrostatic chuck 122a can also comprise at least one group of electrostatic chuck with four or more plate electrode 1, and this organizes the relative formation in box zone (active area) with substrate.
But, be applied to DC current polarity on the plate electrode 1 of electrostatic chuck in upper table and the lower table have nothing in common with each other (comparison diagram 6 and 7).
A plurality of vacuum hole 122b are arranged in lower table 121, and they are used for receiving vacuum power with absorption and supporting substrate around electrostatic chuck 122a.
Similar with upper table, in upper table, in 121, the hole 3b that is used for determining the coarse alignment mark is arranged, 3d, 3f, 3g, 3i and 3k and the hole 3a that is used for determining thin alignment mark, 3c, 3e, 3h, 3j and 3l, they are around electrostatic chuck 121a, relative with alignment device 600, also have the bight of plate electrode 1, they are cut into ' L ' shape in the bight of upper table, wherein are formed with the hole 3m and the 3n that are used for determining thick or thin alignment mark.That is to say, in the sidepiece up and down of bight of upper table (four parts) and upper table, form porose 3a-3l in pairs, they are used for determining coarse alignment mark and thin alignment mark, and in the bight of plate electrode 1, forming porose 3a-3l in pairs, they are used for confirming coarse alignment mark and thin alignment mark.Though the bight of general substrate is formed with thick and thin alignment mark, but the alignment mark of determining the different size substrate with the as many hole of different size substrate is also arranged.
Therefore,, utilize the four couples of hole 3a in the upper table bight and 3b and 3k and 3l to determine the alignment mark that forms it on, and, then utilize remaining hole to determine alignment mark when the substrate of substrate ratio maximum hour when substrate when being maximum.That is to say, when substrate is maximum, minimum two coarse alignment index aperture are just enough in the bight, in case of necessity, the coarse alignment index aperture of needs more than four is to adapt to different models or size, and minimum four thin alignment mark holes are just enough, and in case of necessity, the thin alignment mark hole of needs more than six is to adapt to different models or size.
In addition, in the electrostatic chuck 122a neighboring of lower table 122, porose 4a, 4b, 4c, 4d, 4e, 4f, 4g and 4h, they are used for a ultraviolet (UV) light is directed on the sealant, perhaps sealant are carried out the part heating, with fixing base.Fixed orifice 4a-4h in the lower table is formed on the position different and identical with other part positions with fixed orifice 4a-4f position in the upper substrate.Therefore, sealant is arranged in the upper table among the fixed orifice 4a-4f and lower table on the position of fixed orifice 4a-4h.Though seven fixed orifices are arranged shown in Fig. 1, but, but it is just enough to equal four or more fixed orifice number.
Also porose 5 on lower table, they are used for supporting substrate when substrate installs on the lower table, perhaps substrate are being lifted substrate when lower table unloads from the surface of lower table, and standby hole 6a can also be arranged, 6b, 6c on it, 6d, 6e and 6f.
If a video camera is fixed in upper table one side to determine coarse alignment mark and thin alignment mark, determine the hole by the markers align in the lower table so, provide a branch of light from lower table one side, and in contrast, if video camera is fixed in lower table one side, determine that by the markers align in the upper table hole provides light so, this light is as the back of the body irradiation of video camera.
Thick mark in each worktable is determined the hole, carefully mark determines that hole and fixed orifice can form with the need according to the virtual area that is supported on the worktable upper substrate.
The process that explained later utilizes the LCD bonder of front of the present invention to come adhesive base plate, and the driving method of worktable electrostatic chuck.
At first, provide on it and to drip first substrate that liquid crystal is arranged and second substrate that is coated with sealant on it.Certainly, both can drip on first substrate has liquid crystal, can also be coated with sealant.
As shown in phantom in Figure 3, loading station 300 utilizes the first arm 310 to have first substrate 510 of liquid crystal to be put on the upside with dripping on standby its, and utilizes second arm 320 to receive second substrate 520 that it goes up coating and sealant, and its side is arrived under the first arm 310.
In this case, when the opening 111 in the bonding chamber 110 was opened, loading station was controlled second arm 320, so that second arm 320 installs to second substrate 520 that is coated with sealant on it in bonding chamber 110 by this opening of opening.Upper table 121 is moved down on the upside of second substrate 520, makes vacuum pump 123 work that is connected to upper table 121, by the vacuum suction that is sent to vacuum hole 121b in the upper table 121 by the second arm 320 bonding second indoor substrate 520 of packing into.Then, the upper table 121 that moves up loads second substrate.
Afterwards, loading station control the first arm 310, pack in the bonding chamber 110 dripping first substrate 510 that liquid crystal is arranged on it, and put it on the lower table 122, make lower table 122 along with the vacuum pump (not shown) that is connected to lower table 122 is devoted oneself to work, first substrate 510 by packing into by the first arm 310 from the vacuum suction of vacuum hole (not shown) in the lower table 122 is supported on the lower table 122 first substrate 510.
If from previous adhesion process on lower table adhesive base plate, so in order to shorten the manufacturing time cycle, by after second arm 320 is packed second substrate into, make second arm 320 unload on the lower table bonding substrate, can carry out loading and unloading simultaneously.
In case finish loading to substrate 510 and 520 by the step of front, arm 310 and 320 in the loading station 300 just moves to outside the bonding chamber 110, make the door of base openings 111 in the bonding chamber 110 devote oneself to work, close base openings 111, make bonding chamber 110 be in closed condition.
Subsequently, though not shown in the figures, the substrate receiving trap to be placed a position under the upper table, second substrate that is adsorbed onto on the upper table is transferred on this substrate receiving trap the bonding chamber of beginning emptying.
That is to say, start working to produce an air suction by making the aspiration pump (emptier) 200 in the emptier, make the valve 112a on the exhaust tube 112 that is connected to bonding chamber 110 make exhaust tube be in an opening state, the air suction that is produced by aspiration pump 200 is sent to 110 inside, bonding chamber, 110 inside, bonding chamber can be placed vacuum state.
Like this, when drive aspiration pump 200 reach the certain hour section and in bonding chamber 110, obtain one need vacuum the time, aspiration pump 200 quits work, and closes exhaust tube 112 by operating valve 112a.
When being emptied completely bonding chamber 110, to ESC121a and 122a power supply, so that upper table 121 and lower table 122 are by each substrate 510 and 520 of Electrostatic Absorption.Then, the substrate receiving trap is turned back to the original position.
In this case, when the substrate surface that is formed with a conductive layer on it is positioned at a worktable one side, apply the voltage of about 0.1-1KV, and when the substrate surface that is formed with a conductive layer on it is positioned at the relative side of worktable, apply the voltage of about 3-4KV.
In this case, the movable workbench device drives drive motor 133, move down upper table 121, make it near lower table 122, herewith together, alignment device 600 determines to be supported on the alignment of each worktable 121 and 122 upper substrates 510 and 520, to shifting axle 131 and 132 and provide control signal, align substrates with turning axle that each worktable 121 links to each other with 122.
Then, the movable workbench device keeps receiving a drive signal, and be subjected to continuous drive, be pressed downwardly onto on first substrate 510 that is adsorbed onto on the lower table 122, finish adhesion process main between the two substrates thus with second substrate, 520 ESC that will be adsorbed onto on the upper table 121.Here, main adhesion process has not been finished adhesion process by moving and oppress substrate 121 and 122, its bonding just having reached to a certain degree, and this degree is when pressure is changed into atmospheric pressure, not have air to enter between two substrates.
Therefore, when finishing main adhesion process, cut off the power supply of ESC121a, release substrate from the upper table, upper table 121 moves up.Then, open valve 113a, by air or the N of snorkel 113 with drying
2Gas is incorporated into bonding indoor so that when reaching atmospheric condition gradually in bonding chamber 110, at the bonding chamber 110 inner pressure reduction that form, compressing bonding substrate.Because first substrate of sealant sealing and the space between second substrate are in vacuum state, and bonding chamber is in atmospheric pressure state, so the first and second substrate uniform-compressions.
At last, can carry out a base plate bonding that improves and handle,, just drive the door 114 of bonding chamber 110, open the base openings 111 of closing by door in case finish bondingly.
Afterwards, by unload by loading station 300 bonding substrate, and repeat the series of steps of front, carry out base plate bonding.
Simultaneously, as previously mentioned, a kind of like this possibility is arranged, that is, though finish bonding after, for substrate and last lower table are separated, cut off the power supply of electrostatic chuck 28, remain in electromotive force between upper table and the institute's adhesive base plate also may be easy to stop bonding substrate separate with worktable, this can cause bonding substrate misalignment, weakened the bounding force of sealant
Therefore, in the present invention, when cutting off the ESC121a power supply, the voltage with opposite polarity is applied on the plate electrode 1 of ESC at once, be easy to bonding substrate separate with upper table.
The voltage of positive polarity or negative polarity is applied on each plate electrode 1, adsorb substrate by the Coulomb force that produces between ITO conductive layer and the upper table on the glass substrate 520, and along with cut-out is applied to power supply on the plate electrode 1, simultaneously the voltage with the polarity of voltage opposite polarity of absorption substrate is applied on each plate electrode 1, be easy to bonding substrate separate with worktable.Then, offset remaining electric charge between worktable and the substrate, this be convenient to easily with bonding substrate separate with worktable.
As previously mentioned, the Working table structure in the bonder of this manufacturing of the present invention LCD and the control method of bonder have the following advantages.
At first, because bonder of the present invention equipment brilliant with dropping liquid and sealant separates, to receive the substrate of making by other processes, in installing to the prior art bonder, form a liquid crystal layer on the substrate on the lower table and seal required system so can save, and can reduce the overall dimensions of bonder greatly, allow thus to carry out effective topological design, saved installing space.
Carry out the bonding of the coating of instillation, sealant of liquid crystal and substrate independently, shortened the whole manufacturing time cycle.
The 3rd, what lower table was very limited in the vacuum chamber of bonder of the present invention moves, and makes it possible to the transverse movement by the following chamber unit that is similar to prior art, carries out the position alignment of substrate rapidly and exactly.Especially, different with prior art is, a whole vacuum chamber of the present invention is different with two vacuum chambers up and down of combination/dismounting selectively, eliminated up and down two vacuum chambers in conjunction with the time leakage problem that produces, and saved and prevented to leak required many parts.
The 4th, because loading station is designed to be convenient in the process of substrate of packing into, the arm of vacuum chamber pack into by placing the institute's adhesive base plate on the lower table to get outside the vacuum chamber under the bonding tacky state of prior process, so can shorten the working time of packing substrate into and taking out institute's adhesive base plate with not dripping the substrate that liquid crystal is arranged on it.
The 5th, not only the vacuum suction hole always is set at upper table and lower table, also be provided for the electrostatic chuck of Electrostatic Absorption, this set makes and can stably adsorb substrate in the process of the bonding chamber of emptying, makes the emptying adhesion process to carry out more reposefully.
The 6th, the markers align hole in the worktable makes it possible to aim at more accurately two substrates, because in the process of bonding two substrates, can determine mark in the substrate by video camera.
The 7th, after bonding two substrates, utilize fixed orifice in the worktable fixing bonding substrate, prevented to occur in the substrate misaligned situations in the venting process, improved output.
The 8th, after utilizing electrostatic chuck absorption and bonding two substrates, move up before the upper table, be applied to plate electrode in the electrostatic chuck by voltage with opposite polarity, be easy to bonding substrate separate with upper table, the situation that substrate misalignment and sealant bounding force weakened when this had prevented to move up upper table 121 takes place, and these situations are to be caused by remaining electromotive force between upper table 121 and the institute's adhesive base plate.
In this area, it is apparent that those technician, under the situation that does not break away from essence of the present invention or scope, can in the present invention makes the control method of Working table structure in the bonder of LCD and bonder, do various modifications and conversion.Therefore, suppose that of the present invention these are revised and conversion drops in the scope of appended claims and equivalent thereof, be intended to make the present invention to cover them.
Claims (24)
1. the Working table structure of the bonder of first and second substrates that are used for the slurry LCD is characterized in that, comprising:
One is contained in the plate in the bonding chamber movably;
Be installed to the many groups electrostatic chuck on this plate, be used to provide the electrostatic force of supporting substrate;
A plurality of vacuum holes, they are positioned at around the electrostatic chuck in this plate, are used for receiving a vacuum power, absorption and supporting substrate; With
A plurality of alignment marks are determined the hole, and they are used for determining to aim at the mark of adsorbed substrate in the periphery of this plate.
2. Working table structure as claimed in claim 1 is characterized in that, one group of electrostatic chuck comprises that a plurality of plate electrodes are right, is added with the voltage of opposite polarity on these electrode pairs.
3. Working table structure as claimed in claim 2 is characterized in that, plate electrode have with the adjacent panels electrode on the opposite polarity voltage of institute's making alive.
4. Working table structure as claimed in claim 1 is characterized in that, the electrostatic chuck in each group is of different sizes.
5. Working table structure as claimed in claim 1 is characterized in that, a plurality of alignment marks determine that the hole comprises at least two thick index aperture and at least four thin index aperture.
6. Working table structure as claimed in claim 1 is characterized in that, also comprises the elevating lever hole in this plate, and these holes are used in the process of mounting substrate supporting substrate or lift substrate from worktable in uninstall process.
7. Working table structure as claimed in claim 1 is characterized in that electrostatic chuck comprises at least six groups.
8. Working table structure as claimed in claim 7 is characterized in that, one group of electrostatic chuck comprises at least four plate electrodes.
9. Working table structure as claimed in claim 8 is characterized in that, plate electrode have with the adjacent panels electrode on the opposite polarity voltage of institute's making alive.
10. Working table structure as claimed in claim 1 is characterized in that, also comprises at least one the standby hole in this plate middle body.
11. Working table structure as claimed in claim 1 is characterized in that, a plurality of alignment marks determine that the hole comprises at least one hole in the part of cutting away at an angle of electrostatic chuck in each angle of upper table.
12. Working table structure as claimed in claim 1 is characterized in that, also comprises a plurality of fixed orifices in this plate periphery, these fixed orifices be used for fixing bonding substrate.
13. the Working table structure of a bonder is characterized in that, this structure has a upper table and a lower table, comprising:
Be installed to many groups first electrostatic chucks on the upper table, be used to provide the electrostatic force that supports a substrate;
A plurality of first vacuum holes, they are positioned at around the electrostatic chuck in upper table, are used for receiving a vacuum power, adsorb and support this substrate;
A plurality of first alignment marks are determined the hole, and they are used for determining to aim at the mark of adsorbed substrate in the neighboring of upper table;
Be installed to many groups second electrostatic chucks on the lower table, be used to provide the electrostatic force that supports this substrate;
A plurality of second vacuum holes, they are positioned at around the electrostatic chuck in lower table, are used for receiving a vacuum power, adsorb and support this substrate.
14. Working table structure as claimed in claim 13 is characterized in that, also comprises:
A plurality of first fixed orifices, they in the neighboring of upper table, be used for fixing bonding substrate; With
A plurality of second fixed orifices, they in the neighboring of lower table, be used for fixing bonding substrate.
15. Working table structure as claimed in claim 14 is characterized in that, a plurality of first fixed orifices are formed on the different mutually positions with a plurality of second fixed orifices.
16. Working table structure as claimed in claim 13 is characterized in that, also comprises the elevating lever hole in the lower table, these holes are used in the process of mounting substrate supporting substrate or lift substrate from worktable in uninstall process.
17. Working table structure as claimed in claim 13 is characterized in that, comprises that also a plurality of second alignment marks determine the hole, they are used for determining to aim at the mark of adsorbed substrate in the periphery of lower table.
18. Working table structure as claimed in claim 17 is characterized in that, a plurality of first alignment marks determine that hole or a plurality of second alignment mark determine that the hole comprises at least two thick index aperture and at least four thin index aperture.
19. Working table structure as claimed in claim 17 is characterized in that, second alignment mark determines to have in the hole light to pass.
20. Working table structure as claimed in claim 13 is characterized in that, electrostatic chuck comprises at least six groups, and each group comprises at least four plate electrodes.
21. the control method with bonder of last lower table, each worktable all has electrostatic chuck, and each sucker all has a plurality of plate electrodes, it is characterized in that, this method comprises:
A reverse voltage or positive polarity voltage are added on the plate electrode in the electrostatic chuck, and last lower table adsorbs each substrate by electrostatic chuck;
Move and go up lower table with adhesive base plate; And
Cut-out is applied to the voltage on the electrostatic chuck, and the voltage with opposite polarity is applied on the plate electrode respectively, mobile upper table or lower table.
22. the control method with bonder of last lower table, each worktable all has electrostatic chuck, and each sucker all has a plurality of plate electrodes, it is characterized in that, this method comprises:
First substrate and second substrate are installed in the bonding chamber;
The bonding chamber of emptying;
A reverse voltage or positive polarity voltage are added on the plate electrode in the electrostatic chuck, and last lower table adsorbs each substrate by electrostatic chuck;
Move and go up lower table with adhesive base plate; And
Cut-out is applied to the voltage on the electrostatic chuck, and the voltage with opposite polarity is applied on the plate electrode respectively, mobile upper table or lower table.
23. method as claimed in claim 22 is characterized in that, also comprises: after being applied to reverse voltage or positive polarity voltage on the plate electrode, aim at the substrate that is adsorbed on the lower table.
24. method as claimed in claim 22 is characterized in that, also comprises:
Make bonding chamber ventilated, to two bonding substrates exert pressure; And
Be applied to voltage on the electrostatic chuck in cut-out, the voltage with opposite polarity is applied on the plate electrode respectively, after mobile upper table or the lower table, unloads first substrate and second substrate of being pressed.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KRP20020015077 | 2002-03-20 | ||
| KR1020020014998A KR100769188B1 (en) | 2002-03-20 | 2002-03-20 | Stage of bonding device |
| KR10-2002-0015072A KR100460527B1 (en) | 2002-03-20 | 2002-03-20 | Electronic indexing location information system and method |
| KRP20020014998 | 2002-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1445588A CN1445588A (en) | 2003-10-01 |
| CN1325981C true CN1325981C (en) | 2007-07-11 |
Family
ID=28043904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031054102A Expired - Lifetime CN1325981C (en) | 2002-03-20 | 2003-02-20 | Working platform structure of binding machine and its control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1325981C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105826228A (en) * | 2015-01-07 | 2016-08-03 | 中芯国际集成电路制造(上海)有限公司 | Formation method of three-dimensional packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4482395B2 (en) * | 2004-08-03 | 2010-06-16 | 芝浦メカトロニクス株式会社 | Substrate bonding method and bonding apparatus |
| KR101127855B1 (en) * | 2005-06-02 | 2012-03-21 | 엘지디스플레이 주식회사 | Liquid Crystal Display Device |
| KR20070056316A (en) | 2005-11-29 | 2007-06-04 | 엘지.필립스 엘시디 주식회사 | Electric static chuck for adsorption substrate, apparatus and method for substrates bonding of liquid crystal display using the same |
| KR101192751B1 (en) | 2005-12-29 | 2012-10-18 | 엘지디스플레이 주식회사 | manufacturing device for flat panel display and method thereof |
| TW201131689A (en) * | 2009-07-21 | 2011-09-16 | Nikon Corp | Substrate holder system, substrate joining apparatus and method for manufacturing a device |
| KR101254749B1 (en) * | 2010-10-12 | 2013-04-15 | (주)와이티에스 | Apparatus for Manufacturing Stereoscopic Image Display Device |
| CN103327720B (en) * | 2012-03-21 | 2016-01-20 | 长毅技研股份有限公司 | Electrostatic suction disc can be had an X-rayed |
| JP7182703B2 (en) * | 2019-05-08 | 2022-12-02 | 東京エレクトロン株式会社 | Joining device, joining system and joining method |
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|---|---|
| CN1445588A (en) | 2003-10-01 |
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Address after: Seoul, South Kerean Patentee after: LG DISPLAY Co.,Ltd. Address before: Seoul, South Kerean Patentee before: LG.Philips LCD Co.,Ltd. |
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