CN1321408A - 敷铜层压板及使用了该敷铜层压板的激光加工方法 - Google Patents
敷铜层压板及使用了该敷铜层压板的激光加工方法 Download PDFInfo
- Publication number
- CN1321408A CN1321408A CN00801769A CN00801769A CN1321408A CN 1321408 A CN1321408 A CN 1321408A CN 00801769 A CN00801769 A CN 00801769A CN 00801769 A CN00801769 A CN 00801769A CN 1321408 A CN1321408 A CN 1321408A
- Authority
- CN
- China
- Prior art keywords
- copper
- copper foil
- coated laminate
- laser
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 160
- 239000011889 copper foil Substances 0.000 claims abstract description 93
- 239000010949 copper Substances 0.000 claims abstract description 79
- 229910052802 copper Inorganic materials 0.000 claims abstract description 70
- 238000002310 reflectometry Methods 0.000 claims abstract description 23
- 238000012545 processing Methods 0.000 claims description 47
- 239000011888 foil Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 239000011229 interlayer Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 abstract description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 1
- 239000005751 Copper oxide Substances 0.000 abstract 1
- 229910000431 copper oxide Inorganic materials 0.000 abstract 1
- 238000005553 drilling Methods 0.000 description 15
- 230000003746 surface roughness Effects 0.000 description 11
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 10
- 208000003351 Melanosis Diseases 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 description 5
- 239000001569 carbon dioxide Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 150000001879 copper Chemical class 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011151 fibre-reinforced plastic Substances 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 description 1
- 241000555268 Dendroides Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- 239000012312 sodium hydride Substances 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
试样No. | 反射率(%) | 亮度 | 表面粗糙度/Ra(μm) | 激光开孔评估结果 |
A | 71 | 7.99 | 0.368 | 良好 |
B | 86 | 22.00 | 0.331 | 良 |
C | 93 | 30.01 | 0.443 | 不佳 |
D | 95 | 47.18 | 0.222 |
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23733599A JP2001068816A (ja) | 1999-08-24 | 1999-08-24 | 銅張積層板及びその銅張積層板を用いたレーザー加工方法 |
JP237335/1999 | 1999-08-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1321408A true CN1321408A (zh) | 2001-11-07 |
Family
ID=17013865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN00801769A Pending CN1321408A (zh) | 1999-08-24 | 2000-04-06 | 敷铜层压板及使用了该敷铜层压板的激光加工方法 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1139704A1 (zh) |
JP (1) | JP2001068816A (zh) |
KR (1) | KR20010075646A (zh) |
CN (1) | CN1321408A (zh) |
HK (1) | HK1040878A1 (zh) |
WO (1) | WO2001015500A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101306490B (zh) * | 2002-11-12 | 2011-08-17 | Jx日矿日石金属株式会社 | 金属箔的激光穿孔方法 |
CN103692092A (zh) * | 2013-12-12 | 2014-04-02 | 深圳市大族激光科技股份有限公司 | 激光加工装置及激光加工方法 |
CN105934307A (zh) * | 2014-01-27 | 2016-09-07 | 三井金属矿业株式会社 | 粗化处理铜箔、覆铜层压板以及印刷线路板 |
CN107428129A (zh) * | 2015-03-24 | 2017-12-01 | 三井金属矿业株式会社 | 带载体的极薄铜箔、其制造方法、覆铜层叠板和印刷电路板 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3261119B2 (ja) * | 2000-05-16 | 2002-02-25 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
JP2002299794A (ja) * | 2001-04-03 | 2002-10-11 | Ibiden Co Ltd | ビアホールの形成方法およびビアホールを有する積層配線板 |
JP2002301584A (ja) * | 2001-04-03 | 2002-10-15 | Ibiden Co Ltd | ビアホールの形成方法 |
KR100530818B1 (ko) * | 2001-05-11 | 2005-11-25 | 미쓰비시덴키 가부시키가이샤 | 적층 재료의 레이저 가공 방법 및 장치 |
DE50108246D1 (de) * | 2001-09-01 | 2006-01-05 | Trumpf Lasertechnik Gmbh | Verfahren zum Herstellen von Löchern in einer Mehrlagenleiterplatte |
JP2003136268A (ja) * | 2001-11-06 | 2003-05-14 | Hitachi Via Mechanics Ltd | プリント基板の穴あけ加工方法 |
JP2005150211A (ja) * | 2003-11-12 | 2005-06-09 | Hitachi Chem Co Ltd | 多層配線板およびその製造方法 |
TW200535259A (en) * | 2004-02-06 | 2005-11-01 | Furukawa Circuit Foil | Treated copper foil and circuit board |
JP4528204B2 (ja) * | 2005-05-31 | 2010-08-18 | 日立ビアメカニクス株式会社 | プリント配線板の製造方法 |
JP2007129193A (ja) * | 2005-10-06 | 2007-05-24 | Mec Kk | プリント配線板の製造方法 |
KR100986639B1 (ko) * | 2009-12-29 | 2010-10-08 | 주식회사 젤리오아시스 | 속견훈련용 교재를 이용한 학습방법 |
KR101108930B1 (ko) * | 2010-07-26 | 2012-01-31 | 주식회사 젤리오아시스 | 속견훈련용 교재를 이용한 학습방법 |
WO2012148332A1 (en) * | 2011-04-29 | 2012-11-01 | Telefonaktiebolaget L M Ericsson (Publ) | Manufacturing method for printed circuit boards |
JP5875350B2 (ja) | 2011-11-30 | 2016-03-02 | 三井金属鉱業株式会社 | 電解銅合金箔及びキャリア箔付電解銅合金箔 |
US9663868B2 (en) | 2011-12-28 | 2017-05-30 | Mitsui Mining & Smelting Co., Ltd. | Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foil |
WO2013129508A1 (ja) | 2012-03-01 | 2013-09-06 | 三井金属鉱業株式会社 | キャリア箔付銅箔、キャリア箔付銅箔の製造方法及びそのキャリア箔付銅箔を用いて得られるレーザー孔明け加工用の銅張積層板 |
JP2014053342A (ja) * | 2012-09-05 | 2014-03-20 | Mitsui Mining & Smelting Co Ltd | プリント配線板の製造方法及びプリント配線板 |
CN103857205A (zh) * | 2012-12-04 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | 电路板激光成孔方法 |
JP5870148B2 (ja) * | 2013-11-27 | 2016-02-24 | Jx金属株式会社 | キャリア付銅箔、プリント回路板の製造方法、銅張積層板、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
WO2015151935A1 (ja) * | 2014-03-31 | 2015-10-08 | 三井金属鉱業株式会社 | キャリア箔付銅箔、銅張積層板及びプリント配線板 |
JP6614696B2 (ja) * | 2015-08-26 | 2019-12-04 | 株式会社ディスコ | 保護膜形成用樹脂剤及びレーザ加工方法 |
JP6775083B2 (ja) * | 2017-05-19 | 2020-10-28 | ベジ 佐々木 | 電子部品搭載用基板及びその製造方法 |
JP6818950B1 (ja) * | 2020-02-21 | 2021-01-27 | 三菱電機株式会社 | 加工エネルギーの制御方法およびレーザ加工装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0734508B2 (ja) * | 1989-04-10 | 1995-04-12 | 三菱電機株式会社 | 多層配線板 |
JPH0936550A (ja) * | 1995-07-19 | 1997-02-07 | Hitachi Chem Co Ltd | 多層プリント配線板の製造方法 |
JPH10224040A (ja) * | 1997-01-31 | 1998-08-21 | Nippon Carbide Ind Co Inc | 多層配線板の製造方法 |
-
1999
- 1999-08-24 JP JP23733599A patent/JP2001068816A/ja active Pending
-
2000
- 2000-04-06 CN CN00801769A patent/CN1321408A/zh active Pending
- 2000-04-06 KR KR1020017004921A patent/KR20010075646A/ko not_active Application Discontinuation
- 2000-04-06 WO PCT/JP2000/002224 patent/WO2001015500A1/ja not_active Application Discontinuation
- 2000-04-06 EP EP00915370A patent/EP1139704A1/en not_active Withdrawn
-
2002
- 2002-03-22 HK HK02102208.2A patent/HK1040878A1/zh unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101306490B (zh) * | 2002-11-12 | 2011-08-17 | Jx日矿日石金属株式会社 | 金属箔的激光穿孔方法 |
CN103692092A (zh) * | 2013-12-12 | 2014-04-02 | 深圳市大族激光科技股份有限公司 | 激光加工装置及激光加工方法 |
CN105934307A (zh) * | 2014-01-27 | 2016-09-07 | 三井金属矿业株式会社 | 粗化处理铜箔、覆铜层压板以及印刷线路板 |
CN107428129A (zh) * | 2015-03-24 | 2017-12-01 | 三井金属矿业株式会社 | 带载体的极薄铜箔、其制造方法、覆铜层叠板和印刷电路板 |
CN107428129B (zh) * | 2015-03-24 | 2019-06-18 | 三井金属矿业株式会社 | 带载体的极薄铜箔、其制造方法、覆铜层叠板和印刷电路板 |
Also Published As
Publication number | Publication date |
---|---|
HK1040878A1 (zh) | 2002-06-21 |
EP1139704A1 (en) | 2001-10-04 |
WO2001015500A1 (fr) | 2001-03-01 |
JP2001068816A (ja) | 2001-03-16 |
KR20010075646A (ko) | 2001-08-09 |
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