CN1318151C - Device and method for forming coating film - Google Patents
Device and method for forming coating film Download PDFInfo
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- CN1318151C CN1318151C CNB2005100016570A CN200510001657A CN1318151C CN 1318151 C CN1318151 C CN 1318151C CN B2005100016570 A CNB2005100016570 A CN B2005100016570A CN 200510001657 A CN200510001657 A CN 200510001657A CN 1318151 C CN1318151 C CN 1318151C
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- substrate
- lcd substrate
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- holding member
- transported
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F17/00—Safety devices, e.g. for limiting or indicating lifting force
- B66F17/006—Safety devices, e.g. for limiting or indicating lifting force for working platforms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F11/00—Lifting devices specially adapted for particular uses not otherwise provided for
- B66F11/04—Lifting devices specially adapted for particular uses not otherwise provided for for movable platforms or cabins, e.g. on vehicles, permitting workmen to place themselves in any desired position for carrying out required operations
- B66F11/044—Working platforms suspended from booms
Abstract
To provide an apparatus and a method for forming a coating film which suppress the occurrence of transfer marks on the surface of a substrate and can prevent the attachment of particles to the rear face of the substrate. A resist applicator (CT) 23a comprises a stage 12 formed with a plurality of gas injection ports 16a for jetting out a gas, a substrate transfer mechanism 13 for transferring the LCD substrate G in the X direction on the stage 12, and a resist supply nozzle 14 for supplying a resist liquid onto the surface of the LCD substrate G during transportation of the LCD substrate G on the stage 12. The LCD substrate G is levitated nearly horizontally above the surface of the stage 12 by the gas jet out from the gas injection ports 16a, and is transferred in the levitated state on the stage 12 by means of the substrate transfer mechanism 13.
Description
Technical field
The present invention relates to a kind of substrates such as glass substrate, supply with coating liquid and form the coating membrane formation device and the coated film formation method of coated film at the FPD (flat-panel monitor) that is used for liquid crystal indicator (LCD) etc.
Background technology
For example, in the manufacturing process of liquid crystal indicator (LCD), use photoetching technique, thereby on glass substrate, form the circuitous pattern of regulation.In other words, on glass substrate, supply with resist and form coated film, and after it is carried out drying, heat treatment, carry out exposure-processed, development treatment in turn.
Here,, resist liquid forms the device of coated film as being supplied with glass substrate, known a kind of mounting table with vacuum suction glass substrate flatly, supply with the coating membrane formation device (for example, with reference to patent documentation 1) of the travel mechanism of the resist supply nozzle of resist liquid and relatively mobile mounting table of along continuous straight runs and resist supply nozzle to remaining on substrate on this mounting table.
But, owing to the very thin thickness of the glass substrate that LCD is used, so exist the suction hole that is arranged on the mounting table by the lip-deep problem of transcription at glass substrate.In addition, also exist in the problem that a lot of particles are adhered at the back side of substrate.And, owing in the disengaging of substrate and mounting table, need official hour, so the high production rate of saying nothing of.In addition, owing to because of being accompanied by the maximization of glass substrate in recent years, produce the maximization of mounting table and resist supply nozzle, their structure of travel mechanism of relatively moving also becomes and is on a grand scale, so more need be with as far as possible simple structure moving substrate.
[patent documentation 1] Japanese kokai publication hei 10-156255 patent gazette
Summary of the invention
The present invention proposes in view of the above problems, and its purpose is to provide a kind of the generation on being suppressed at substrate surface to prevent that particle is attached to the coating membrane formation device and the coated film formation method of substrate back in the duplicating vestige.In addition, the object of the present invention is to provide a kind of simple structure of transporting the mechanism of substrate, and can form the coating membrane formation device and the coated film formation method of coated film with high productivity ratio.
In other words, according to the present invention, can provide a kind of one side to transport the coating liquid that substrate one side will stipulate along a direction and be supplied to the coating membrane formation device that aforesaid substrate forms coated film, this device possesses: be provided with the platform that is used in a plurality of gas ejection ports of the assigned position injection regulation gas on surface; Transport the substrate conveyer of substrate in the direction in above-mentioned upper edge; The coating liquid of regulation is supplied to the coating liquid supply nozzle on the surface of the substrate that on above-mentioned platform, moves, wherein, the gas of aforesaid substrate by ejecting from the above-mentioned gas jet with flat-hand position and the state that floats from above-mentioned surface, is transported by the aforesaid substrate conveyer.
In addition, according to the present invention, simultaneously will apply liquid is supplied to the coated film formation method that aforesaid substrate forms coated film can to provide a kind of one side to transport substrate along a direction, this method has: a part that keeps the periphery of substrate, and making aforesaid substrate float over the state that operation above the platform of surface ejection regulation gas and one side maintain aforesaid substrate upwards to float and transport above-mentioned along a direction with the approximate horizontal posture, one side is supplied with the coating liquid of regulation and is formed the operation of coated film to aforesaid substrate.
According to the present invention, owing to transport substrate with the state that upwards floats from platform, thus can not cause the duplicating on platform surface, and suppress to adhere to the particle of substrate back, and can transport substrate with less power.In addition owing to become form by the gas support substrate integral body of spraying from downside, so can be easily the posture of substrate be kept level, thus, can be suppressed at produce on the coated film in uneven thickness.In addition, apply processing because substrate can be transported gradually, so can access very high productivity ratio.
Description of drawings
Fig. 1 is the general view of resist coating developing system of resist applying device that possesses an embodiment of coating membrane formation device of the present invention.
Fig. 2 is the side view of first thermal treatment unit part of expression resist coating developing system shown in Figure 1.
Fig. 3 is the side view of second thermal treatment unit part of expression resist coating developing system shown in Figure 1.
Fig. 4 is the side view of the 3rd thermal treatment unit part of expression resist coating developing system shown in Figure 1.
Fig. 5 is the general view of resist processing unit.
Fig. 6 is the sectional view that the summary of expression substrate conveyer constitutes.
Fig. 7 be pattern be illustrated in the key diagram that transports form that imports platform portion, coating platform portion, outbound dock portion LCD substrate separately.
Fig. 8 is the approximate three-dimensional map of resist supply nozzle.
Fig. 9 is plane and the sectional view that expression is arranged on the schematic configuration of other substrate conveyers in the resist applying device.
Figure 10 is the key diagram that transports form of the LCD substrate of the substrate conveyer shown in the pattern ground presentation graphs 9.
Figure 11 is the sectional view that expression is arranged on the general structure of another the substrate conveyer in the resist applying device.
Figure 12 is the key diagram that transports form of the LCD substrate of the substrate conveyer shown in the pattern ground presentation graphs 11.
Label declaration
1. box platform
2. treatment bench
3. connection platform
12. platform
12a. import platform portion
12b. coating platform portion
12c. outbound dock portion
13. substrate conveyer
14. resist supply nozzle
15a～15d holding member
16a. gas ejection ports
16b. air entry
23. resist processing unit
23a. resist applying device
23b. decompression dry device
100. resist coating developing system
The G.LCD substrate
The specific embodiment
Below, the embodiment that present invention will be described in detail with reference to the accompanying.Here, the present invention is applicable to that the situation that forms the apparatus and method of resist film on the surface of the glass substrate (hereinafter referred to as " LCD substrate ") that LCD uses describes.
Fig. 1 is illustrated in the general view of the resist coating developing system of the resist film development treatment after forming resist film on the LCD substrate and carrying out exposure-processed.This resist coating developing system 100 has box platform (being transported into the portion of transporting) 1 that mounting contains the box C of polylith LCD substrate G, have the treatment bench (handling part) 2 of a plurality of processing units that are used to implement to be included in a succession of processing of carrying out the resist coating on the LCD substrate G and developing and be used for exposure device 4 between carry out LCD substrate G handing-over be connected platform (connecting portion) 3, and make box platform 1 and be connected the two ends that platform 3 is configured in treatment bench 2 respectively.In addition, in Fig. 1, the length direction that resist is applied developing system 100 is as directions X, and vertical with directions X in the plane direction is as the Y direction.
In addition, along transporting circuit B, arrange the second thermal treatment unit part 27, development treatment unit (DEV) 24, i line UV illumination unit (i-UV) 25 and the 3rd thermal treatment unit part 28 to box platform 1 one sides from connecting platform 3.On the part on clean cleaning treatment unit (SCR) 21 excimer laser (エ キ シ マ) UV illumination unit (e-UV) 22 is set.In addition, excimer laser UV illumination unit (e-UV) 22 is set, i line UV illumination unit (i-UV) 25 is set for the decolouring of developing handles in order before cleaning cleaning, to remove the organic matter of LCD substrate G.
In cleaning cleaning treatment unit (SCR) 21, one side is transported LCD substrate G with the approximate horizontal posture within it, and one side is carried out cleaning treatment and dry the processing.In development treatment unit (DEV) 24, one side is transported LCD substrate G with the approximate horizontal posture, and one side is carried out developer solution coating, flushing and dry the processing one by one.Clean among cleaning treatment unit (SCR) 21 and development treatment unit (DEV) 24 at these, transport or belt transports and carries out transporting of LCD substrate G, being transported into mouthful and transporting mouth and be arranged on the relative minor face LCD substrate G by for example roller bearing.In addition, by with the same mechanism of conveyer of development treatment unit (DEV) 24, that carries out LCD substrate G continuously is transported to transporting of i line UV illumination unit (i-UV) 25.
Resist processing unit 23 as the back describes in detail, has one side and transports LCD substrate G with the approximate horizontal posture, and one side is supplied with resist liquid, forms resist applying device (CT) 23a of coated film; With by LCD substrate G is exposed to the open air in reduced atmosphere, make the volatile ingredient evaporation that is comprised in the coated film that on LCD substrate G, forms, and then the decompression dry device of drying coated film (VD) 23b.
The first thermal treatment unit part 26 has that lamination is implemented heat treated thermal treatment unit to LCD substrate G and two thermal treatment unit pieces (TB) 31,32 of constituting, thermal treatment unit piece (TB) 31 is arranged on cleans cleaning treatment unit (SCR) 21 1 sides, and thermal treatment unit piece (TB) 32 is arranged on resist processing unit 23 1 sides.Between these two thermal treatment unit pieces (TB) 31,32, be provided with first conveyer 33.
Shown in the side view of the first thermal treatment unit part 26 of Fig. 2, thermal treatment unit piece (TB) 31 has the following four-layer structure of lamination in turn from bottom to top, carry out the transfer unit (PASS) 61 of the handing-over of LCD substrate G, two LCD substrate G is implemented dehydration and cure the dehydration of processing and cure unit (DHP) 62,63, LCD substrate G is implemented the adhesion process unit (AD) 64 of draining processing.In addition, the four-layer structure of lamination in turn from bottom to top that thermal treatment unit piece (TB) 32 is following, carry out the transfer unit (PASS) 65 of the handing-over of LCD substrate G, two cooling units (COL) 66,67 of cooling LCD substrate G are to the adhesion process unit (AD) 68 of LCD substrate G enforcement draining processing.
The second thermal treatment unit part 27 has that lamination is implemented heat treated thermal treatment unit to LCD substrate G and two thermal treatment unit pieces (TB) 34,35 of constituting, thermal treatment unit piece (TB) 34 is set at erosion agent processing unit 23 1 sides, and thermal treatment unit piece (TB) 35 is set at development treatment unit (DEV) 24 1 sides.In addition, between these two thermal treatment unit pieces (TB) 34,35, be provided with second conveyer 36.
Shown in the side view of the second thermal treatment unit part 27 of Fig. 3, thermal treatment unit piece (TB) 34 has the following four-layer structure of lamination in turn from bottom to top, carry out LCD substrate G handing-over transfer unit (PASS) 69 and LCD substrate G is implemented three prebake unit (PREBAKE) 70,71,72 of pre-bake treatment.In addition, thermal treatment unit piece (TB) 35 has the following four-layer structure of lamination in turn from bottom to top, carry out the handing-over of LCD substrate G transfer unit (PASS) 73, cooling LCD substrate G cooling unit (COL) 74 and LCD substrate G is implemented two prebake unit (PREBAKE) 75,76 of pre-bake treatment.
The LCD substrate G that second conveyer 36 is accepted through transfer unit (PASS) 69 from resist processing unit 23, and carry out LCD substrate G being transported between above-mentioned thermal treatment unit and transport, through transfer unit (PASS) 73 and to the handing-over of the LCD substrate G of development treatment unit (DEV) 24, and carry out and handing-over and acceptance as extension cooling bench (EXTCOL) the 44 opposing L CD substrate G of the substrate delivery/reception portion that is connected platform 3 described later.In addition, second conveyer 36 has the structure identical with first conveyer 33, and can be close to any one unit in the thermal treatment unit piece (TB) 34,35.
The 3rd thermal treatment unit part 28 has that lamination is implemented heat treated thermal treatment unit to LCD substrate G and two thermal treatment unit pieces (TB) 37,38 of constituting, thermal treatment unit piece (TB) 37 is set at development treatment unit (DEV) 24 1 sides, and thermal treatment unit piece (TB) 38 is set at box platform one side.In addition, between these two thermal treatment unit pieces (TB) 37,38, be provided with the 3rd conveyer 39.
Shown in the side view of the 3rd thermal treatment unit part 28 of Fig. 4, thermal treatment unit piece (TB) 37 has the following four-layer structure of lamination in turn from bottom to top, carry out LCD substrate G handing-over transfer unit (PASS) 77 and LCD substrate G implemented after cure the formation of curing unit (POBAKE) 78,79,80 behind three of processing.In addition, thermal treatment unit piece (TB) 38 has the following four-layer structure of lamination in turn from bottom to top, after cure unit (POBAKE) 81, carry out the transmission cooling unit (PASSCOL) 82 of the handing-over of LCD substrate G and cooling and LCD substrate G implemented after cure unit (POBAKE) 83,84 after curing two of processing.
The 3rd conveyer 39 passes through transfer unit (PASS) 77 and from the acceptance of the LCD substrate G of i line UV illumination unit (i-UV) 25, LCD substrate G being transported between above-mentioned thermal treatment unit transports, and the handing-over of LCD substrate G to box platform 1 that arrive through transmitting cooling unit (PASSCOL) 82.In addition, the 3rd conveyer 39 has the structure identical with first conveyer 33, still can be near any one unit in the thermal treatment unit piece (TB) 37,38.
In treatment bench 2, constitute two row as described above and transport circuit A, B, and dispose each processing unit and conveyer with the order of handling basically, these transport circuit A, B and are provided with space 40.And also being provided with can be at the round parts (mounting substrate element) 41 of these space 40 back and forth movements.Can keep LCD substrate G ground to constitute and to come and go parts 41, and, transport the handing-over of carrying out LCD substrate G between circuit A, the B through coming and going parts 41.By above-mentioned first to the 3rd conveyer 33,36,39, carry out the handing-over that LCD substrate G comes and goes parts 41 relatively.
In the resist coating developing system 100 that constitutes like this, at first, by conveyer 11, the LCD substrate G in the box C that is configured on the mounting table 9 of box platform 1 directly is transported in the excimer laser UV illumination unit (e-UV) 22 of treatment bench 2, clean pre-treatment.Secondly,, LCD substrate G is transported into scouring cleaning treatment unit (SCR) 21, cleans cleaning by conveyer 11.After cleaning cleaning, transport by for example roller bearing, LCD substrate G is transported the transfer unit (PASS) 61 of the thermal treatment unit piece (TB) 31 that belongs to the first thermal treatment unit part 26.
At first, the LCD substrate G that will be configured in transfer unit (PASS) 61 is transported to the dehydration of thermal treatment unit piece (TB) 31 and cures unit (DHP) 62, in 63 any one carried out heat treated, secondly, be transported to the cooling unit (COL) 66 of thermal treatment unit piece (TB) 32, in 67 any one and after cooling off, in order to improve the cohesive of resist, it is transported in the adhesion process unit (AD) 68 of the adhesion process unit (AD) 64 of thermal treatment unit piece (TB) 31 and thermal treatment unit piece (TB) 32 any one, carries out adhesion process (draining processing) by HMDS there.After this, any one cools off with LCD substrate G is transported in the cooling unit (COL) 66,67, is transported to the transfer unit (PASS) 65 of thermal treatment unit piece (TB) 32 then.By first conveyer 33, carry out the processing of transporting of whole LCD substrate G when carrying out as above a succession of handle.
By being arranged on substrate conveyer in the transfer unit (PASS) 65, for example roller bearing conveyer etc., the LCD substrate G that will be configured in transfer unit (PASS) 65 is transported in the resist processing unit 23.Describe in detail as the back, in resist applying device (CT) 23a, one side is transported LCD substrate G with flat-hand position, and one side is supplied with resist liquid and formed coated film, after this, with decompression dry device (VD) 23b coated film is implemented drying under reduced pressure and handles.After this, transport arm, LCD substrate G is handover to the transfer unit (PASS) 69 of the thermal treatment unit piece (TB) 34 that belongs to the second thermal treatment unit part 27 from resist processing unit 23 by the substrate that is arranged among decompression dry device (VD) 23b.
By second conveyer 36, any one that will be configured in that LCD substrate G in the transfer unit (PASS) 69 is transported in the prebake unit (PREBAKE) 75,76 of the prebake unit (PREBAKE) 70,71,72 of thermal treatment unit piece (TB) 34 and thermal treatment unit piece (TB) 35 carried out pre-bake treatment, after this, it is transported to the cooling unit (COL) 74 of thermal treatment unit piece (TB) 35 and is cooled to set point of temperature.In addition, by second conveyer 36, further it is transported to the transfer unit (PASS) 73 of thermal treatment unit piece (TB) 35.
After this, by second conveyer 36, LCD substrate G is transported to the extension cooling bench (EXTCOL) 44 that connects platform 3, and as required, by connecting the conveyer 42 of platform 3, it is transported to the peripheral exposure device (EE) of external device (ED) parts 45, there, is used to remove the exposure of the outer peripheral portion (not part) of etchant resist.Next, by conveyer 42, G is transported to exposure device 4 with the LCD substrate, there the resist film on the LCD substrate G is implemented exposure-processed with compulsory figure.In addition, in case also exist LCD substrate G to be housed in the buffer pocket on the buffer table (BUF) 43, just be transported to the situation of exposure device 4 afterwards.
Behind end exposure, by connecting the conveyer 42 of platform 3, LCD substrate G is transported to the record word cell (TITLER) of the epimere of external device (ED) parts 45, and provisioning information is recorded on the LCD substrate G, it is positioned in extends on the cooling bench (EXTCOL) 44 afterwards.By second conveyer 36, LCD substrate G is transported to the transfer unit (PASS) 73 of the thermal treatment unit piece (TB) 35 that belongs to the second thermal treatment unit part 27 from extension cooling bench (EXTCOL) 44.
By making for example roller bearing conveyer work that extends to development treatment unit (DEV) 24 from transfer unit (PASS) 73, LCD substrate G is transported into development treatment unit (DEV) 24 from transfer unit (PASS) 73.In development treatment unit (DEV) 24, for example, the one side transport substrate with flat-hand position, the one side with developer solution on LCD substrate G, after this, in case stop to transport of LCD substrate G, the angle that just makes the LCD substrate tilt to stipulate, thus, the developer solution on the LCD substrate G that flows falls it, also under this state, flushing liquor supplied with LCD substrate G, thereby make wash-out developer that it is flowed away.After this,, thereby begin once more to transport, and, make the LCD drying substrates by blowing LCD substrate G with nitrogen or air with dry with LCD substrate G Reversion Level posture.
After development treatment finishes, transport by continuous conveyer, for example roller bearing, LCD substrate G is transported to i line UV illumination unit (i-UV) 25 from development treatment unit (DEV) 24, and LCD substrate G is implemented decolouring handle.After this, by the roller bearing conveyer in the i line UV illumination unit (i-UV) 25, LCD substrate G is transported to the transfer unit (PASS) 77 of the thermal treatment unit piece (TB) 37 that belongs to the 3rd thermal treatment unit part 28.
By the 3rd conveyer 39, to be configured in LCD substrate G in the transfer unit (PASS) 77 be transported to thermal treatment unit piece (TB) 37 after cure unit (POBAKE) 78,79,80 and thermal treatment unit piece (TB) 38 after cure and cure processing after in the unit (POBAKE) 81,83,84 any one carried out, after this, at the transmission cooling unit (PASSCOL) 82 that it is transported to this thermal treatment unit piece (TB) 38 and after making it be cooled to set point of temperature, by the conveyer 11 of box platform 1, LCD substrate G is housed among the regulation box C that is configured in the box platform 1.
Next, resist processing unit 23 is elaborated.Fig. 5 is the general view of resist processing unit 23.
Resist applying device (CT) 23a has, and is provided with the platform 12 that is used at a plurality of gas ejection ports 16a that spray regulation gas on the assigned position on surface, transports the substrate conveyer 13 of LCD substrate G and supply with the resist supply nozzle 14 of resist liquid to the surface of the LCD substrate G that moves on platform 12 at platform 12 upper edge directions Xs.In addition, decompression dry device (VD) the 23b chamber 18 that has the mounting table 17 that is used for mounting LCD substrate G and accommodate the LCD substrate G that is positioned on the mounting table 17.In addition, in resist processing unit 23, both be provided with from resist applying device (CT) 23a to decompression dry device (VD) 23b, transport arm 19 from decompression dry device (VD) 23b to being arranged on the substrate that transfer unit (PASS) 69 the thermal treatment unit piece (TB) 34 transports LCD substrate G again.
Fig. 6 is the sectional view of the schematic configuration of expression substrate conveyer 13.Substrate conveyer 13 has, holding member 15a, the 15b of the part of the Y direction end of maintenance LCD substrate G; The line slideway 51a, the 51b that dispose in the mode of extending in the Y of platform 12 direction side at directions X; Keep holding member 15a, 15b and with the chimeric binding parts 50 of line slideway 51a, 51b and make and link the X-axis driving mechanism 53 that parts 50 move back and forth at directions X.
Holding member 15a, 15b have respectively, be provided with the more than one structure that is used for LCD substrate G absorption is remained on the absorption ring flange 48 on the pedestal unit 49, and carry out work by the mechanism of decompressor 52 that makes vavuum pump etc., can make blue dish 48 absorption of absorption method and keep LCD substrate G.Absorption ring flange 48 in the rear side that does not apply the part of resist liquid on the LCD substrate G, be on the back side peripheral part of LCD substrate G, keeps LCD substrate G.As X-axis driving mechanism 53, for example, can list leather belt driving mechanism, roller bearing, air slider, electronic slider etc.
From the upstream of the carriage direction of LCD substrate G downstream, platform 12 is divided into imports the platform 12a of portion, the 12b of coating platform portion and the 12c of outbound dock portion.Import the platform 12a of portion and be and be used for from the transfer unit (PASS) 65 of thermal treatment unit piece (TB) 32 to zone that the 12b of coating platform portion transports LCD substrate G.On the 12b of coating platform portion, dispose resist supply nozzle 14, here supply with coating liquid and form coated film to LCD substrate G.The 12c of outbound dock portion is the zone that the LCD substrate G that is used for being formed with coated film transports decompression dry device (VD) 23b.
Fig. 7 (a)～(c) be pattern be illustrated in the key diagram that transports form that each imports the LCD substrate G among platform 12a of portion, the 12b of coating platform portion, the 12c of outbound dock portion.
Shown in Fig. 5 and Fig. 7 (a), importing on the platform 12a of portion, be provided with on the assigned position from it the surface to above spray the gas ejection ports 16a of gases such as nitrogen and air, make and LCD substrate G is remained on from importing the state that the platform 12a of portion upwards floats the gas that sprays by from gas ejection ports 16a with the approximate horizontal posture.In order to improve the flatness of LCD substrate G, preferably dwindle the diameter of gas ejection ports 16a, or increase the configuration quantity of gas ejection ports 16a.
Shown in Fig. 5 and Fig. 7 (b), on the 12b of coating platform portion, on gas ejection ports 16a basis, also the assigned position on its surface is provided with air entry 16b.In the 12b of coating platform portion,, can regulate the height that upwards floats of LCD substrate G with than importing platform 12a of portion and the high precision of the 12c of outbound dock portion by adjusting from the gas emitted dose of gas ejection ports 16a with from the gas soakage of air entry 16b.
Shown in Fig. 5 and Fig. 7 (c), on the 12c of outbound dock portion, on the gas ejection ports 16a basis that is used to make LCD substrate G upwards to float, for being handover to substrate, the LCD substrate G that will be transported to the 12c of outbound dock portion transports arm 19, and also be provided with and keep superincumbent going up to lift pole 47 LCD substrate G.
Like this, in resist applying device (CT) 23a, can keep LCD substrate G with the state that upwards floats predetermined distance from platform 12.Therefore, in order to keep LCD substrate G and to move binding parts 50, do not need big strength at holding member 15a, 15b.In other words, in X driving mechanism 53, do not need big torque, thus, can seek 13 miniaturizations of substrate conveyer.
Fig. 8 represents the approximate three-dimensional map of resist supply nozzle 14.The structure that resist supply nozzle 14 is had is that the strip casing 14a of Yan Shening is provided with the banded resist ejiction opening 14b that sprays resist liquid roughly bandedly in one direction.Under the length direction that the makes casing 14a state consistent with the Y direction, can pass through nozzle elevating mechanism 30, free lifting ground is installed in this resist supply nozzle 14 on the nozzle holding member 20 of the substantial middle part that is configured in the 12b of coating platform portion.
The sensor 29 of measuring the interval between resist ejiction opening 14b and the LCD substrate G is being installed on the resist supply nozzle 14, and nozzle elevating mechanism 30 is controlled the position of resist supply nozzle 14 according to the measured value of this sensor 29.The length of resist supply nozzle 14 is less than the width (Y direction length) of LCD substrate G, makes can not form coated film in certain zone of the periphery of LCD substrate G.
On the surface that is arranged at the mounting table 17 on decompression dry device (VD) 23b, will support the pole (not shown) of pressing close to of LCD substrate G to be arranged on assigned position.Chamber 18 has two structures of cutting apart up and down that are made of fixing bottom container and upper cover that can free lifting is arranged.Substrate transports arm 19 and can move along directions X, Y direction, Z direction (vertical direction).
Inferior, the treatment process of we the LCD substrate G of explanation in the resist processing unit 23 that as above constitutes.In addition, be arranged on the roller bearing conveyer of the rotation of the roller bearing 46 on the transfer unit (PASS) 65, carry out transfer unit (PASS) 65 the transporting to resist processing unit 23 of LCD substrate G from thermal treatment unit piece (TB) 32 by use.
At first, at thermal treatment unit piece (TB) 32 1 side standby holding member 15a, 15b, formation can make LCD substrate G upwards float the state of specified altitude in each unit on the platform 12.Secondly, by the roller bearing conveyer, LCD substrate G is entered from the transfer unit (PASS) 65 of thermal treatment unit piece (TB) 32 import the platform 12a of portion, under the state that the part of LCD substrate G is also supported by roller bearing 46, Y direction one end of LCD substrate G is remained on holding member 15a, the 15b.Then, make the travelling speed that produces by roller bearing 46 consistent, thereby LCD substrate G is transported into the importing platform 12a of portion of platform 12 with the translational speed of holding member 15a, 15b.Importing on the platform 12a of portion, for example, transport LCD substrate G with the state that upwards floats 150 μ m from its surface.
Along with the driving by base plate driving mechanism 13 causes that LCD substrate G is transported into the 12b of coating platform portion to the moving of the directions X of holding member 15a, 15b.On the 12b of coating platform portion, by carry out air-breathing from air entry 16b when carrying out spraying from the gas of gas ejection ports 16a, for example, the height that LCD substrate G is upwards floated from this surface is about 40 μ m.
When LCD substrate G is below resist supply nozzle 14, to LCD substrate G ejection resist liquid, form coated film from resist supply nozzle 14.For example, the substrate travelling speed on the 12b of coating platform portion can be 150mm/ second.Like this, owing to can further improve the flatness of LCD substrate G by the height that upwards floats that reduces the LCD substrate, so can form the uniform coated film of thickness.
In addition, though can also be according to the measured signal of sensor 29, every LCD substrate G is adjusted the height of resist supply nozzle 14, but usually because the shipping situation of polylith LCD substrate G is identical, if, then after this need to adjust the height of resist supply nozzle 14 hardly so regulate the height of the resist supply nozzle 14 on initially treated LCD substrate G or the pseudo-substrate G.In addition, the selection of time that both can utilize the measured signal decision of sensor 29 to begin/spray end from the ejection of the resist liquid of resist supply nozzle 14, the sensor of the position of detecting LCD substrate G also can be set with another kind of method, and according to this selection of time of signal deciding from this sensor.
Along with moving of holding member 15a, 15b, because of the LCD substrate G that has formed coated film by the 12b of coating platform portion is transported to the 12c of outbound dock portion.In the 12c of outbound dock portion, for example, make LCD substrate G be in the state that upwards floats 150 μ m from its surface.Arrive on the outbound dock 12c of portion if LCD substrate G is whole, then remove the absorption that produces by holding member 15a, 15b and keep, act pole 47 is risen, thereby LCD substrate G is remained on the height of regulation.
Then, substrate transports arm 19 near keeping superincumbent LCD substrate G by last act pole 47.If substrate transports arm 19 and controls LCD substrate G at Y direction one end of LCD substrate G, then make and lift pole 47 declines.In addition, substrate transports the LCD substrate G that arm 19 will control and is positioned on the mounting table 17 of decompression dry device (VD) 23b.After this, with its inner pressure relief, coated film is carried out drying under reduced pressure by airtight chamber 18.
If the processing in decompression dry device (VD) 23b of LCD substrate G finishes, then open chamber 18, make substrate transport arm 19 near the LCD substrate G that is positioned on the mounting table 17, thereby control LCD substrate G, and LCD substrate G is transported to the transfer unit (PASS) 69 of thermal treatment unit piece (TB) 34.On the other hand, LCD substrate G is joined to holding member 15a, 15b after the last act pole 47,, return thermal treatment unit piece (TB) 32 1 sides, after this, repeat above-mentioned treatment process in order to transport the LCD substrate G that handles next time.
In this coated film formation method, owing to transport LCD substrate G with the state that upwards floats from platform 12, thus the transcription on platform 12 surfaces can not take place, and can suppress the back side that particle is attached to LCD substrate G.In addition, owing to can shorten the intermittence that resist liquid is coated to LCD substrate G, so can access higher productivity ratio.
Thus, LCD substrate G in this resist applying device (CT) 23a transports in the method, on joining LCD substrate G to the 12c of outbound dock portion, holding member 15a, 15b lift pole 47, turn back to before thermal treatment unit piece (TB) 32 1 sides, LCD substrate G to be processed next time can be transported into and import the platform 12a of portion.Therefore, our explanation is equipped in the further preferred substrate conveyer among resist applying device (CT) 23a below.
Fig. 9 represents to be arranged on the plane (Fig. 9 (a)) and the sectional view (Fig. 9 (b)) of the schematic configuration of other substrate conveyers on resist applying device (CT) 23a.This substrate conveyer 55 has holding member 85a, the 85b of Y direction one end that keeps LCD substrate G; Chimeric with line slideway 51a, 51b (with the substrate conveyer 13 that illustrates previously identical) respectively, can respectively holding member 85a, 85b be remained on sliding freely moving body 86a, the 86b of Y direction simultaneously; And X-axis driving mechanism 53a, the 53b that can respectively moving body 85a, 85b be moved to the another one directions X.
Holding member 85a, 85b have the elongate in shape along directions X respectively, and have a plurality of absorption ring flanges 48, feasible Y direction one end that can keep LCD substrate G in the vast scope of directions X.Thus,, and move holding member 85a, 85b, also can prevent the deviation of LCD substrate G on the Y direction, thereby can stablize the posture of transporting LCD substrate G along directions X even individually LCD substrate G is remained on holding member 85a, the 85b respectively.In addition, holding member 85a, 85b slide freely on the Y direction respectively by not shown Y direction slide mechanism.
Figure 10 is the key diagram that transport form of pattern ground expression by the LCD substrate G of these substrate conveyer 55 generations.At first, with holding member 85b with not be transported into mode that the LCD substrate G that imports the platform 12a of portion joins and be configured on the position away from the Y direction, on the other hand, holding member 85a is configured on the position that imports Y direction one end that can keep LCD substrate G on the platform 12a of portion, remains on the holding member 85a thereby will be transported into the LCD substrate G that imports the platform 12a of portion.(Figure 10 (a)).
Secondly, move holding member 85a along directions X, and then LCD substrate G is transported into the 12b of coating platform portion, and there, carry out the formation of coated film.In addition, if LCD substrate G integral body is transported into the 12b of coating platform portion, then be in the state that can be transported into the LCD substrate G that next time handles, so holding member 85b is moved on the position that imports Y direction one end that can keep LCD substrate G on the platform 12a of portion (Figure 10 (b)) because import the platform 12a of portion.
Then, holding member 85b keeps newly being transported into the LCD substrate G ' that imports the platform 12a of portion, and begins transporting to the 12b of coating platform portion.On the other hand, the LCD substrate G that holding member 85a will form coated film is transported to platform unit 12c, and last act pole 47 (Figure 10 (c)) is given in handing-over there.After this, for the LCD substrate G ' that does not transport with holding member 85b clashes,, holding member 85a is got back to import the platform 12a of portion one side (Figure 10 (d)) with state away from platform 12.Then, if the LCD substrate G ' that remains among the holding member 85b is transported into the 12b of coating platform portion by integral body, then prepare new LCD substrate G is transported into the importing platform 12a of portion, thereby holding member 85a is moved on the position of Y direction one end that can keep LCD substrate G.After, holding member 85a, 85b repeat and the identical work of above-mentioned holding member 85a.
Then, we illustrate another substrate conveyer.Figure 11 is the sectional view that expression is arranged on the general structure of another the substrate conveyer among resist applying device (CT) 23a.This substrate conveyer 56 has the line slideway 51a～51d of the two one group ground configuration in the Y of platform 12 direction side; Chimeric with line slideway 51a～51d respectively moving body 88a～88d; Be separately positioned on elevating mechanism 89a, 89b on moving body 88a, the 88b; Remain on holding member 15a, 15b on elevating mechanism 89a, the 89b respectively; Be separately positioned on holding member 15c, 15d on moving body 88c, the 88d; Y- axis driving mechanism 89c, 89d that holding member 15c, 15d are slided along the Y direction; And X-axis driving mechanism 53a～53d that moving body 88a～88d is slided along directions X.
Figure 11 (a) expression is one group with holding member 15a, 15b and is keeping LCD substrate G state that Figure 11 (b) expression is one group with holding member 15c, 15d and is keeping LCD substrate G state.When holding member 15a, 15b transport LCD substrate G, be in vertical plane S, to carry out (with reference to Figure 11 (a)) in order to make holding member 15a, 15b motion separately, similarly control the driving of X-axis driving mechanism 53a, 53b and elevating mechanism 89a, 89b.Transport at holding member 15c, 15d under the situation of LCD substrate G, control X-axis driving mechanism 53c, 53d and Y- axis driving mechanism 89c, 89d similarly.
Figure 12 is the key diagram of the action of expression holding member 15a～15d.At first, controlling with holding member 15a, 15b under the situation that is transported to the LCD substrate G that imports the platform 12a of portion from the transfer unit (PASS) 65 of thermal treatment unit piece (TB) 32, make holding member 15c, 15d be in the state (Figure 12 (a)) of Y direction away from platform 12.
If holding member 15a, 15b are keeping LCD substrate G, then make holding member 15a, 15b to the 12b of coating platform portion one side shifting, thereby on LCD substrate G, apply resist liquid.On the other hand, then in order to make holding member 15c, 15d can accept the LCD substrate G that transports from transfer unit (PASS) 65, will hold parts 15c, 15d near platform 12 (Figure 12 (b)).
Maintenance has formed holding member 15a, the 15b of the LCD substrate G of coated film, after moving to the 12c of outbound dock portion, there the LCD substrate G that keeps is joined to last act pole 47 (not shown in Figure 12).On the other hand, holding member 15c, 15d control from the transfer unit (PASS) 65 of thermal treatment unit piece (TB) 32 and are transported to the LCD substrate G ' that imports the platform 12a of portion, thereby beginning is to move (Figure 12 (c)) of the 12b of coating platform portion side.
Then, after holding member 15a, 15b are reduced to the position that is lower than holding member 15c, 15d, it are returned with this state import the platform 12a of portion one side (please refer to Figure 11 (b)), after this, adjust the height and position of holding member 15a, 15b, make to keep new LCD substrate.On the other hand, holding member 15c, 15d are transported to the 12b of coating platform portion one side with LCD substrate G ', and form coated film (Figure 12 (d)) on LCD substrate G '.
Arrive holding member 15c, the 15d of the outbound dock 12c of portion, in the 12c of outbound dock portion, the LCD substrate G ' handing-over that keeps given and lift pole 47 (in Figure 12 for illustrating).In addition, holding member 15a, 15b control from the transfer unit (PASS) 65 of thermal treatment unit piece (TB) 32 and are transported to the LCD substrate G that imports the platform 12a of portion ", thus beginning is to move (Figure 12 (e)) of the 12b of coating platform portion side.
Then, holding member 15c, 15d away from platform 12, and then are returned under this state and import the platform 12a of portion one side (Figure 12 (f).After this, holding member 15a～15d transports LCD substrate G one by one by repeating above-mentioned order respectively.Under situation, because can transport the formation processing that the LCD substrate carries out coated film continuously, so can access very high productivity ratio with this substrate conveyer 55,56.
More than, though embodiments of the present invention are had illustrated, the present invention is not limited to this mode.For example, LCD substrate G from the transfer unit (PASS) 65 of thermal treatment unit piece (TB) 32 to resist applying device (CT) 23a transports, can also be on transfer unit (PASS) 65, substrate to be set to transport arm, and lift pole importing to be provided with on the platform 12a of portion, thereby give last act pole by the LCD substrate delivery/reception that this substrate is transported the arm maintenance, and lift pole in the reduction,, LCD substrate G is held on holding member 15a, the 15b etc. at the near surface that imports the platform 12a of portion.
In addition, though expression has holding member 15a, 15b to draw the mode of LCD substrate G to transport form with LCD substrate G to remain on its carriage direction front part, holding member 15a, 15b can push away the mode of LCD substrate G to remain on its carriage direction rear part and transport LCD substrate G.In addition, in substrate conveyer 56, though holding member 15c, 15d can slide freely in the Y direction, holding member 15c, 15d also can be at the height that transports LCD substrate G and be higher than lifting structure freely between the position of the height that transports LCD substrate G.Thus, holding member 15a, 15b and holding member 15c, 15d are not clashed, and can on them, transport LCD substrate G alternately.In the above description, though take out resist film as coated film, coated film is not limited to this, can also be antireflection film or does not have photosensitive dielectric film etc.
The present invention is applicable to resist membrane formation device and the resist film formation method that forms resist film on the large substrate of LCD substrate etc.
Claims (13)
1. coating membrane formation device, the direction in described coating membrane formation device one edge is transported substrate, on one side the coating liquid that will stipulate be supplied to described substrate, thereby the formation coated film it is characterized in that,
Described device has:
Be provided with the platform that is used for spraying a plurality of gas ejection ports of regulation gas at the assigned position on surface;
Transport the substrate conveyer of substrate in the direction in described upper edge;
The coating liquid of regulation is supplied on described platform the lip-deep coating liquid supply nozzle of the substrate that moves,
Described substrate, by from described gas ejection ports gas jet, the state so that approximate horizontal posture ground upwards floats from described surface transports by described substrate conveyer.
2. coating membrane formation device as claimed in claim 1 is characterized in that,
Described has:
Supply with the coating platform portion of coating liquid from described coating liquid supply nozzle;
Be used for substrate is transported into the importing platform portion of described coating platform portion;
Be used for transporting the outbound dock portion of substrate from described coating platform portion,
Described coating platform portion also has air entry at its surperficial assigned position,
In described coating platform portion,, regulate the height that upwards floats of the substrate that is transported by adjusting from the gas emitted dose of described gas ejection ports with from the gas inspiratory capacity of described air entry.
3. coating membrane formation device as claimed in claim 1 or 2 is characterized in that,
Described substrate conveyer has:
The holding member that keeps substrate; With
Move the slide mechanism of described holding member along prescribed direction,
Described holding member remains on substrate absorption near the two ends with the direction of substrate carriage direction quadrature.
4. coating membrane formation device as claimed in claim 3 is characterized in that,
Described device possesses 2 groups of described holding members,
Described slide mechanism alternatively is transported to substrate described 2 groups of holding members.
5. as claim 1 or the described coating membrane formation device of claim 2, it is characterized in that,
Described substrate conveyer has:
The holding member that keeps substrate;
Move the slide mechanism of described holding member along prescribed direction,
Described holding member remains on a end with the direction of substrate carriage direction quadrature with substrate absorption.
6. coating membrane formation device as claimed in claim 5 is characterized in that,
Dispose described holding member can distinguish independently in mode with two side drives of the direction of substrate carriage direction quadrature,
Described slide mechanism alternatively is transported to substrate each holding member.
7. coating membrane formation device as claimed in claim 1 or 2 is characterized in that,
Described device also has:
Be arranged on described substrate carriage direction downstream, the coated film that forms on described substrate is reduced pressure dry decompression dry device;
Accept to be transported to the substrate of described outbound dock portion from described holding member, and it is transported to other substrate conveyers of described decompression dry device.
8. coating membrane formation device as claimed in claim 1 or 2 is characterized in that,
Described coating liquid supply nozzle has the edge and extends with the direction of substrate carriage direction quadrature, and applies the slot-shaped coating liquid ejiction opening of liquid with the band shape ejection.
9. coating membrane formation device as claimed in claim 8 is characterized in that,
Described device also has:
Be determined at described coating liquid supply nozzle under the sensor of distance between the coating liquid ejiction opening of the substrate surface that moves and described coating liquid supply nozzle;
According to the described coating liquid of the measured value lifting supply nozzle of described sensor, make described coating liquid supply nozzle be configured in the nozzle elevating mechanism of the height and position of regulation.
10. coated film formation method, the direction in an edge is transported substrate, on one side will apply liquid and be supplied to described substrate, thereby the formation coated film it is characterized in that,
Described method comprises:
A part that keeps the periphery of substrate floats over operation above the platform of surface ejection regulation gas with described substrate with the approximate horizontal posture; With
Described substrate is maintained the state ground that upwards floats on one side and transport in the direction in described upper edge, to described substrate supply with operation that the coating liquid stipulated form coated film on one side.
11. coated film formation method as claimed in claim 10 is characterized in that,
Supply with coating liquid to substrate during, when from described the described gas of jet surface, carry out air-breathing from described surface simultaneously, thus, adjust described substrate from described height that upwards floats.
12. as claim 10 or 11 described coated film formation methods, it is characterized in that,
By a plurality of substrate conveyers that can drive, carry out transporting of described substrate continuously.
13. as claim 10 or 11 described coated film formation methods, it is characterized in that,
Roughly bandedly supply with described coating liquid with what extend to described substrate along the direction vertical with described substrate carriage direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004029031A JP4049751B2 (en) | 2004-02-05 | 2004-02-05 | Coating film forming device |
| JP2004029031 | 2004-02-05 |
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| Publication Number | Publication Date |
|---|---|
| CN1651155A CN1651155A (en) | 2005-08-10 |
| CN1318151C true CN1318151C (en) | 2007-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100016570A Active CN1318151C (en) | 2004-02-05 | 2005-02-03 | Device and method for forming coating film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4049751B2 (en) |
| KR (1) | KR101061707B1 (en) |
| CN (1) | CN1318151C (en) |
| TW (1) | TWI268533B (en) |
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| US10067123B2 (en) | 2006-10-13 | 2018-09-04 | Theranos Ip Company Llc | Reducing optical interference in a fluidic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101061707B1 (en) | 2011-09-01 |
| JP4049751B2 (en) | 2008-02-20 |
| CN1651155A (en) | 2005-08-10 |
| TWI268533B (en) | 2006-12-11 |
| TW200527493A (en) | 2005-08-16 |
| JP2005223119A (en) | 2005-08-18 |
| KR20050079637A (en) | 2005-08-10 |
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