CN1315967C - Catalyst for artificial plate with low release content of free formaldehyde - Google Patents
Catalyst for artificial plate with low release content of free formaldehyde Download PDFInfo
- Publication number
- CN1315967C CN1315967C CNB200410096091XA CN200410096091A CN1315967C CN 1315967 C CN1315967 C CN 1315967C CN B200410096091X A CNB200410096091X A CN B200410096091XA CN 200410096091 A CN200410096091 A CN 200410096091A CN 1315967 C CN1315967 C CN 1315967C
- Authority
- CN
- China
- Prior art keywords
- parts
- catalyst
- acid
- formaldehyde
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Catalysts (AREA)
Abstract
The present invention relates to a catalyst for artificial plates with low release content of free formaldehyde, which is used for clearing free formaldehyde in artificial plates and enables the release amount of the free formaldehyde in the artificial plates to reach the requirements of an FC0 grade or an E0 grade on the premise that the resin of the class of formaldehyde and the production technology of the artificial plates are not changed. The catalyst is composed of 100 portions of oxide, 0 to 200 portions of compound containing NH4 groups or NH2 groups, 0 to 120 portions of strong acid weak alkali salt and 0 to 100 portions of oxidizing agent. Even if the resin of the class of formaldehyde with the free formaldehyde release amount of an E2 grade or an FC2 grade and a higher grade, the release amount of the free formaldehyde in the artificial plates can be reduced to the E0 grade or the FC0 grade by the catalyst prepared by the present invention. The present invention has the advantages of no change of the technological process of the artificial plates, simple operation and low cost.
Description
Technical field
The present invention relates to a kind ofly under the prerequisite that does not change formaldehyde resin and Wood-based Panel Production technology, make free formaldehyde release in the wood-based plate reach the catalyst for artificial plate with low release content of free formaldehyde of free formaldehyde in the removing wood-based plate that FC0 or E0 level require.
Background technology
With formaldehyde be that the resin adhesive of main raw material(s) has that cost is low, bonding strength is high, advantage such as easy manufacturing, storage and convenient transportation, be widely used in the wood-based plate industry.Formaldehyde is a kind of colourless easily molten irritant gas, can absorb through respiratory tract, is defined as suspicious carcinogenic and teratogenesis shape material by the World Health Organization.Lot of documents shows that formaldehyde mainly shows aspects such as allotriosmia, stimulation, allergy, abnormal pulmonary function, dysfunction of liver, immunologic dysfunction to health effects.Developed country discharges problem in the sixties in 20th century with regard to the formaldehyde that begins to solve in the wood-based plate.Developed countries such as Europe, Japan, the U.S. have formulated strict artificial board formaldehyde release standard, and Europe and Japan had also put into effect artificial board formaldehyde release E0 level, FC0 grade standard respectively in recent years.
The principal element of decision wood-based plate and goods burst size of methanal thereof is a tackiness agent.Because the addition and the polycondensation of formaldehyde and urea, trimeric cyanamide, phenol are balanced reaction, its characteristic has determined formaldehyde resin and has been can discharge free formaldehyde in the wood-based plate made of tackiness agent with it.Reduce the mol ratio of formaldehyde and urea, trimeric cyanamide, phenol, can reduce the formaldehyde content in the resin effectively, but the viscosity of resin, water-soluble, activity and stability in storage reduction, have a strong impact on the production technique and the intensity of wood-based plate.
In order to produce E0 level or FC0 level wood-based plate, adopted following measure both at home and abroad: (1) uses trimeric cyanamide or phenol to substitute the urea production resin, remove free formaldehyde in the resin by spraying drying, add entry again and modulate the production that liquid resin is used for wood-based plate; (2) use isocyanic ester or polyurethane adhesive; (3) use the polyvinyl acetate emulsion adhesive; (4) use amylan; (5) use native protein glue.Shortcoming is a complex process, and the method resin cost of (1)～(3) improves 200～900%, the wood-based plate poor water resistance of using (3)～(5) tackiness agent to produce.
Summary of the invention
The object of the present invention is to provide a kind of catalyst, this catalyst added in the resin or with catalyst when the impregnation wood-based plate is carried out post-processed to wooden starting material or with catalyst, under the prerequisite that does not change formaldehyde resin and Wood-based Panel Production technology, make the free formaldehyde release in the wood-based plate reach FC0 or the requirement of E0 level.
The object of the present invention is achieved like this: catalyst by oxide compound, contain NH
4Base or NH
2The compound of base, strong acid weak base salt, oxygenant are formed.
Oxide compound specifically refers to the compound of structure shown in the formula (1).
XnOm (1) formula
{ n and m are integer in the formula, and X is basic metal, alkaline-earth metal, main group metal, the nonmetal and transition element in the periodic table of elements.}
(1) oxide compound of formula specifically refers to sodium oxide, potassium oxide, magnesium oxide, calcium oxide, titanium dioxide, ferric oxide, nickel oxide, cupric oxide, Red copper oxide, manganese oxide, Tungsten oxide 99.999, Cadmium oxide, Indium sesquioxide, silver suboxide, tindioxide, zinc oxide, aluminium sesquioxide, silicon-dioxide etc.Oxide compound can be a kind of in the above-claimed cpd, also can be two kinds and above mixture, and comprise the natural crystal of mentioned component such as kaolin, sepiolite, talcum powder, quartz sand, perlite, potassium felspar sand, medical stone, corundum, fireclay, wilkinite, zeolite, bauxitic clay, kyanite etc.
The compound that contains the NH4 base specifically refers to the compound of structure shown in the formula (2).
(NH
4) nYm (2) formula
{ n and m are integer in the formula, and Y is an acid group.Acid group refers to the acid group of hydrochloric acid, bromic acid, nitric acid, nitrous acid, sulfuric acid, sulfurous acid, persulfuric acid, phosphoric acid, sulfonic acid, carbonic acid, boric acid, carboxylic acid etc.
(2) compound of formula specifically refers to ammonium chloride, brometo de amonio, ammonium nitrate, ammonium nitrite, ammonium sulfate, ammonium sulphite, ammonium persulphate, Secondary ammonium phosphate, primary ammonium phosphate, triammonium phosphate, ammonium polyphosphate, ammonium pyrophosphate, Ammonium sulfamate, volatile salt, bicarbonate of ammonia, ammonium borate, zinc borate ammonium, ammonium oxalate etc.
Contain NH
2The compound of base refers to the hydrazide kind compound that acid amides and derivative, Dyhard RU 100, trimeric cyanamide, hydrazine hydrate, hydrazine hydrate and carboxylic acid or dicarboxylic acid reaction form.
Acid amides and derivative thereof specifically refer to urea, thiocarbamide, thiourea peroxide, ethylene thiocarbamide, Antiradon, sulfanilic amide, ethanamide, trimethylammonium butyramide etc.
Hydrazide kind compound comprises the polyhydrazide compound that contains 3 and above hydrazide group in two hydrazide-based compound that contain 2 hydrazide groups in the monobasic hydrazide-based compound that contains 1 hydrazide group in the molecule, the molecule and the molecule.
The monobasic hydrazide-based compound specifically refers to the compound of structure shown in the formula (3).
R-CO-NHNH
2(3) formula
{ R is hydrogen atom, alkyl or has substituent aryl in the formula.Carbonatoms such as alkyl nail base, ethyl, n-propyl, normal-butyl, n-pentyl, n-hexyl is 1～12 straight chain shape alkyl.Aryl refers to phenyl, connects phenylbenzene, naphthyl etc.The substituting group of aryl can be atoms such as hydrogen, fluorine, chlorine, bromine, and carbonatomss such as methyl, ethyl, n-propyl, second propyl group, normal-butyl, isobutyl-are 1～4 straight chain shape or branched-chain alkyl.
(3) the concrete nail hydrazides of the compound of formula, acethydrazide, propionyl hydrazine, daminozide, valeryl hydrazine, hexanoyl hydrazine, dodecyl acid (lauric acid) hydrazides, salicylic acid (Whitfield's ointment) hydrazides, right-hydroxybenzene (first) acid amides hydrazides, the sour hydrazides of naphthalene (first), 3-hydroxyl-sour hydrazides of 2-naphthalene (first) etc.
Dihydrazide compound specifically refers to the compound of structure shown in the formula (4).
H
2NHN-X-NHNH
2(4) formula
In the formula X represent CO-base or-the CO-Y-CO-base, Y represents alkylene or proyl.The carbonatomss such as the concrete nail support of alkylene, ethylene, trimethylene, fourth support, pentamethylene, hexamethylene, support in heptan, octamethylene, support in the ninth of the ten Heavenly Stems, decamethylene, undecane support of Y representative are 1～12 straight chain shape alkylene, can replace alkylene with the hydrogen base.The proyl of Y representative specifically refers to penylene, biphenylene, naphthylene, anthracene support, luxuriant and rich with fragrance support etc.The substituting group of proyl can be atoms such as hydrogen, fluorine, chlorine, bromine, and carbonatomss such as methyl, ethyl, n-propyl, second propyl group, normal-butyl, isobutyl-are 1～4 straight chain shape or branched-chain alkyl.
(4) compound of formula specifically refers to carbohydrazide, oxalic acid two hydrazides, propanedioic acid two hydrazides, succinic acid hydrazide ii, adipic dihydrazide, nonane diacid two hydrazides, sebacic dihydrazide, Malaysia acid dihydrazide, fumaric acid two hydrazides, glycol ether acid dihydrazide, winestone acid dihydrazide, apple acid dihydrazide, isophthalic acid two hydrazides, terephthaldehyde's acid dihydrazide, big horse acid dihydrazide, 2,6-naphthoic acid two hydrazides etc.
Contain NH
4Base or NH
2The compound of base is a kind of in the above-claimed cpd, also can be two kinds and above mixture.It can be at room temperature, have or do not have under the condition of catalyzer and formaldehyde generation chemical reaction, generates irreversible compound hexamethylenetetramine or contain-N=CH
2The compound of base.Wherein the effect of compounds such as ammonium sulfate, ammonium nitrate, ammonium persulphate, Ammonium sulfamate, thiocarbamide, urea, trimeric cyanamide, oxalic acid two hydrazides, propanedioic acid two hydrazides, succinic acid hydrazide ii, adipic dihydrazide, hydrazine hydrate is better.
Strong acid weak base salt specifically refers to the compound of structure shown in the formula (5).
AnYm (5) formula
{ n and m are integer in the formula, and A is alkaline-earth metal, transition element and the main group metal element in the periodic table of elements, and Y is an acid group.Alkaline-earth metal, transition element and main group metal element refer to magnesium, calcium, titanium, zirconium, Ha, Thorium, germanium, tin, lead, copper, strontium, barium, zinc, cadmium, chromium, molybdenum, manganese, iron, ruthenium, cobalt, rhodium, nickel, palladium, aluminium, gallium, silver, indium, germanium, tin, lead, antimony, bismuth etc.Acid group refers to the acid group of hydrochloric acid, bromic acid, nitric acid, nitrous acid, sulfuric acid, sulfurous acid, persulfuric acid etc.
(5) compound of formula specifically refers to calcium chloride, magnesium chloride, magnesium chloride potassium, bariumchloride, strontium chloride, zinc chloride, antimony chloride, aluminum chloride, Cerium II Chloride, titanium chloride, Manganous chloride tetrahydrate, lithium chloride, tungsten chloride, Calcium Bromide, magnesium bromide, strontium bromide, barium bromide, zinc bromide, aluminum bromide, nickelous bromide, tungsten bromide, aluminum nitrate, nitrocalcite, magnesium nitrate, Silver Nitrate, cupric nitrate, nickelous nitrate, zinc nitrate, sal epsom, antimony trisulfate, vitriolate of tartar, manganous sulfate, calcium sulfate, titanium sulfate, titanyl sulfate, copper sulfate, ferric sulfate, single nickel salt, zinc sulfate, magnesium sulfite, zinc sulfite, calcium sulfate, sal epsom etc.
Strong acid weak base salt is a kind of in the above-claimed cpd, also can be two kinds and above mixture.Wherein the effect of zinc chloride, aluminum chloride, titanium chloride, zinc bromide, aluminum bromide, nickelous bromide, Silver Nitrate, cupric nitrate, nickelous nitrate, Titanium Nitrate, Tai-Ace S 150, copper sulfate, titanium sulfate, titanyl sulfate etc. is better.
Oxygenant refers to can discharge the compound of oxygen after the aqueous solution or heating.Specifically refer to: hydrogen peroxide, SPC-D, antihypo, Sodium peroxoborate, potassium per(oxy)borate, lithium peroxide, sodium peroxide, calcium peroxide, zinc peroxide, carbamide peroxide etc.
Oxygenant is a kind of in the above-claimed cpd, also can be two kinds and above mixture.Oxygen that oxygenant discharges and formaldehyde reaction, generation formic acid.
Oxide compound, contain NH
4Base or NH
2The consumption of the compound of base, strong acid weak base salt, oxygenant: the consumption with oxide compound is 100 parts; NH
4Base or NH
2The consumption of based compound is 0～200 part, is preferably 0～50 part; The consumption of strong acid weak base salt is 0～120 part, is preferably 5～30 parts; The consumption of oxygenant is 0～100 part, is preferably 0～30 part.
In wood-based plate, the mass percent of catalyst/timber is 0.01～100%, is preferably 0.1～20%.
The mass percent of oxide compound/timber is 0.01～100% in wood-based plate, is preferably 0.05～15%.
The enforcement of the object of the invention: (1) is mixed with suspension with catalyst, and wood chip, wood shavings and veneer are handled spraying or dip treating; When (2) modulating tackiness agent, in resin, add catalyst or its suspension; (3) in to fiber or wood shavings applying glue, add catalyst or its suspension; (4) spray the suspension that is mixed with by catalyst in fibre mat that paves or wood shavings steel slab surface; (5) spray the suspension that is mixed with by catalyst on the wood-based plate surface, or wood-based plate is carried out dip treating with changing suspension.Wherein better in resin, to add catalyst or its suspension, do not change the production technique of wood-based plate.
Even use the formaldehyde resin of E2 or FC2 and above free formaldehyde release thereof, the catalyst of the application of the invention development can make the free formaldehyde release in the wood-based plate be reduced to E0 or FC0 level.With use powdered resin, isocyanic ester or polyurethanes resin, or wood-based plate is carried out post-processed compares, do not change wood-based plate technical process, simple to operate, cost is low.
Specific embodiments
Embodiment 1:
In 100 parts of deionized waters, add 200 parts of 300 order sepiolites; 330 parts of the titanyl sulfate solutions of slowly adding 20% when stirring, 25 parts of SPC-D, boiling stop the back and continue to stir 15～30 minutes; Slowly the hydrazine hydrate of adding 50% is 6.4 parts; Continue to stir 30～60 minutes; Suspension is poured in the drying basin, under 100 ± 3 ℃, be dried to constant weight; Use supper micron mill that it is crushed to below the particle diameter 100 μ m, hereinafter to be referred as catalyst HC-1.
In 100 parts of urea-formaldehyde resins (TA-100), add 7 parts of HC-1 catalyst, 10 parts in flour, obtain glued board after fully stirring and stick with glue agent.Use board using poplar board, the thickness of dash board and central layer is 1.2mm; Amount of spread is 320g/m
2110 ℃ of hot pressing temperatures, unit pressure 1.0MPa, time 60s makes three layers of glued board.
Embodiment 2:
In 100 parts of deionized waters, add 200 parts of 300 order calcined kaolins; 330 parts of the alum liquors of slowly adding 20% when stirring, boiling stop the back and continue to stir 15～30 minutes; Slowly add 10 parts in 50% urea, 60 parts in 30% hydrogen peroxide; Continue to stir 30～60 minutes; Suspension is poured in the drying basin, under 100 ± 3 ℃, be dried to constant weight; Use supper micron mill that it is crushed to below the particle diameter 100 μ m, hereinafter to be referred as catalyst HC-2.
In 100 parts of urea-formaldehyde resins (TA-100), add 7 parts of HC-2 catalyst, 10 parts in flour, obtain glued board after fully stirring and stick with glue agent.Use board using poplar board, the thickness of dash board and central layer is 1.2mm; Amount of spread is 320g/m
2110 ℃ of hot pressing temperatures, unit pressure 1.0MPa, time 60s makes three layers of glued board.
Embodiment 3:
In 100 parts of deionized waters, add 200 parts in 300 order corundum; Add 50 parts of carbohydrazides when stirring, continue to stir 15～30 minutes; Slowly the nickel sulfate solution of adding 20% is 150 parts; Continue to stir 30～60 minutes; Suspension is poured in the drying basin, under 100 ± 3 ℃, be dried to constant weight; Add 50 parts of calcium peroxides, use supper micron mill that it is crushed to below the particle diameter 100 μ m, hereinafter to be referred as catalyst HC-3.
In 100 parts of urea-formaldehyde resins (TA-100), add 7 parts of HC-3 catalyst, 10 parts in flour, obtain glued board after fully stirring and stick with glue agent.Use board using poplar board, the thickness of dash board and central layer is 1.2mm; Amount of spread is 320g/m
2110 ℃ of hot pressing temperatures, unit pressure 1.0MPa, time 60s makes three layers of glued board.
Embodiment 4:
In 100 parts of deionized waters, add 200 parts of 300 order bauxitic clays; Add 100 parts of adipic dihydrazides when stirring, continue to stir 15～30 minutes; 100 parts of copper-baths, 15 parts of the Sodium peroxoborate of slow adding 20%; Continue to stir 30～60 minutes; Suspension is poured in the drying basin, under 100 ± 3 ℃, be dried to constant weight; Use supper micron mill that it is crushed to below the particle diameter 100 μ m, hereinafter to be referred as catalyst HC-4.
In 100 parts of urea-formaldehyde resins (TA-100), add 7 parts of HC-4 catalyst, 10 parts in flour, obtain glued board after fully stirring and stick with glue agent.Use board using poplar board, the thickness of dash board and central layer is 1.2mm; Amount of spread is 320g/m
2110 ℃ of hot pressing temperatures, unit pressure 1.0MPa, time 60s makes three layers of glued board.
Embodiment 5:
In 100 parts of deionized waters, add 200 parts of 300 order coal clay; Add 100 parts of adipic dihydrazides when stirring, continue to stir 15～30 minutes; Slowly the silver nitrate solution of adding 20% is 50 parts; Continue to stir 30～60 minutes; Suspension is poured in the drying basin, under 100 ± 3 ℃, be dried to constant weight; Use supper micron mill that it is crushed to below the particle diameter 100 μ m, hereinafter to be referred as catalyst HC-5.
In 100 parts of urea-formaldehyde resins (TA-100), add 7 parts of HC-5 catalyst, 10 parts in flour, obtain glued board after fully stirring and stick with glue agent.Use board using poplar board, the thickness of dash board and central layer is 1.2mm; Amount of spread is 320g/m
2110 ℃ of hot pressing temperatures, unit pressure 1.0MPa, time 60s makes three layers of glued board.
Comparative example 1
3 parts of ammonium chloride solutions, 10 parts in the flour of adding 20% in 100 parts of urea-formaldehyde resins (TA-100) obtain glued board after fully stirring and stick with glue agent.Use board using poplar board, the thickness of dash board and central layer is 1.2mm; Amount of spread is 320g/m
2110 ℃ of hot pressing temperatures, unit pressure 1.0MPa, time 60s makes three layers of glued board.
Comparative example 2
7 parts in 3 parts of ammonium chloride solutions, urea, 10 parts in the flour of adding 20% in 100 parts of urea-formaldehyde resins (TA-100) obtain glued board after fully stirring and stick with glue agent.Use board using poplar board, the thickness of dash board and central layer is 1.2mm; Amount of spread is 320g/m
2110 ℃ of hot pressing temperatures, unit pressure 1.0MPa, time 60s makes three layers of glued board.
Comparative example 3
4 parts of 3 parts of ammonium chloride solutions, trimeric cyanamides, 10 parts in the flour of adding 20% in 100 parts of urea-formaldehyde resins (TA-100) obtain glued board after fully stirring and stick with glue agent.Use board using poplar board, the thickness of dash board and central layer is 1.2mm; Amount of spread is 320g/m
2110 ℃ of hot pressing temperatures, unit pressure 1.0MPa, time 60s makes three layers of glued board.
According to the technical requirements of two class glued boards in " GB/T 9846 glued boards ", bonding strength and burst size of methanal by " GB/T 17657 Test methods of evaluating the properties of woodbased panels and surface decorated woodbased panels " detection glued board the results are shown in Table 1.
Table 1 glued board test-results
| Test specimen | Bonding strength (MPa) | Wood-breaking rate (%) | Burst size of methanal (mg/L) | Conclusion |
| Experimental example 1 | 0.9 | 100 | 0.2 | FC0 is qualified |
| Experimental example 2 | 1.1 | 100 | 0.1 | FC0 is qualified |
| Experimental example 3 | 1.2 | 100 | 0 | FC0 is qualified |
| Experimental example 4 | 1.1 | 100 | 0 | FC0 is qualified |
| Experimental example 5 | 0.9 | 90 | 0.1 | FC0 is qualified |
| Comparative example 1 | 1.0 | 100 | 6.5 | Defective |
| Comparative example 2 | 0.5 | 30 | 2.3 | Defective |
| Comparative example 3 | 0.9 | 100 | 1.4 | FC1 is qualified |
Embodiment 6
In 100 parts of urea-formaldehyde resins (TA-200), add 8 parts of HC-1 catalyst, 10 parts in water, obtain adhesive for shaving board after fully stirring.The resin added of sandwich layer wood shavings is 9%, and the resin added of top layer wood shavings is 12%; Mat formation by normal technology; 170 ℃ of hot pressing temperatures, unit pressure 3.2MPa, time 300s makes the thick shaving board of 16mm.
Embodiment 7
In 100 parts of urea-formaldehyde resins (TA-200), add 8 parts of HC-2 catalyst, 10 parts in water, obtain adhesive for shaving board after fully stirring.The resin added of sandwich layer wood shavings is 9%, and the resin added of top layer wood shavings is 12%; Mat formation by normal technology; 170 ℃ of hot pressing temperatures, unit pressure 3.2MPa, time 300s makes the thick shaving board of 16mm.
Embodiment 8
In 100 parts of urea-formaldehyde resins (TA-200), add 8 parts of HC-3 catalyst, 10 parts in water, obtain adhesive for shaving board after fully stirring.The resin added of sandwich layer wood shavings is 9%, and the resin added of top layer wood shavings is 12%; Mat formation by normal technology; 170 ℃ of hot pressing temperatures, unit pressure 3.2MPa, time 300s makes the thick shaving board of 16mm.
Embodiment 9
In 100 parts of urea-formaldehyde resins (TA-200), add 8 parts of HC-4 catalyst, 10 parts in water, obtain adhesive for shaving board after fully stirring.The resin added of sandwich layer wood shavings is 9%, and the resin added of top layer wood shavings is 12%; Mat formation by normal technology; 170 ℃ of hot pressing temperatures, unit pressure 3.2MPa, time 300s makes the thick shaving board of 16mm.
Embodiment 10
In 100 parts of urea-formaldehyde resins (TA-200), add 8 parts of HC-5 catalyst, 10 parts in water, obtain adhesive for shaving board after fully stirring.The resin added of sandwich layer wood shavings is 9%, and the resin added of top layer wood shavings is 12%; Mat formation by normal technology; 170 ℃ of hot pressing temperatures, unit pressure 3.2MPa, time 300s makes the thick shaving board of 16mm.
Comparative example 4
In 100 parts of urea-formaldehyde resins (TA-200), add 1 part in ammonium sulfate, 10 parts in water, obtain adhesive for shaving board after fully stirring.The resin added of sandwich layer wood shavings is 9%, and the resin added of top layer wood shavings is 12%; Mat formation by normal technology; 170 ℃ of hot pressing temperatures, unit pressure 3.2MPa, time 300s makes the thick shaving board of 16mm.
Comparative example 5
In 100 parts of urea-formaldehyde resins (TA-200), add 0.6 part in ammonium sulfate, 8 parts in urea, 10 parts in water, obtain adhesive for shaving board after fully stirring.The resin added of sandwich layer wood shavings is 9%, and the resin added of top layer wood shavings is 12%; Mat formation by normal technology; 170 ℃ of hot pressing temperatures, unit pressure 3.2MPa, time 300s makes the thick shaving board of 16mm.
Comparative example 6
In 100 parts of urea-formaldehyde resins (TA-200), add 0.6 part in ammonium sulfate, 5 parts of trimeric cyanamides, 10 parts in water, obtain adhesive for shaving board after fully stirring.The resin added of sandwich layer wood shavings is 9%, and the resin added of top layer wood shavings is 12%; Mat formation by normal technology; 170 ℃ of hot pressing temperatures, unit pressure 3.2MPa, time 300s makes the thick shaving board of 16mm.
According to the technical requirements of 1 shaving board such as grade in " GB/T 4897 shaving boards ", intensity and burst size of methanal by " GB/T 17657 Test methods of evaluating the properties of woodbased panels and surface decorated woodbased panels " detection shaving board the results are shown in Table 2.
Table 2 shaving board test-results
| Test specimen | MOR (MPa) | Internal bond strength (MPa) | Burst size of methanal (mg/100g) | Remarks |
| Experimental example 6 | 21.0 | 0.75 | 2.2 | E0 is qualified |
| Experimental example 7 | 21.2 | 0.77 | 2.1 | E0 is qualified |
| Experimental example 8 | 21.0 | 0.73 | 0 | E0 is qualified |
| Experimental example 9 | 22.3 | 0.82 | 0 | E0 is qualified |
| Experimental example 10 | 19.8 | 0.69 | 2.1 | E0 is qualified |
| Comparative example 4 | 22.5 | 0.71 | 65.5 | Defective |
| Comparative example 5 | 12.5 | 0.35 | 28.3 | Defective |
| Comparative example 6 | 19.2 | 0.66 | 17.8 | E2 is qualified |
Claims (1)
1. catalyst for artificial plate with low release content of free formaldehyde is characterized in that: this catalyst is made up of for 6.4 parts 25 parts of 200 parts of sepiolites, 20% 330 parts of titanyl sulfate solutions, SPC-D, 50% hydrazine hydrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410096091XA CN1315967C (en) | 2004-11-29 | 2004-11-29 | Catalyst for artificial plate with low release content of free formaldehyde |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410096091XA CN1315967C (en) | 2004-11-29 | 2004-11-29 | Catalyst for artificial plate with low release content of free formaldehyde |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1632025A CN1632025A (en) | 2005-06-29 |
| CN1315967C true CN1315967C (en) | 2007-05-16 |
Family
ID=34847842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200410096091XA Active CN1315967C (en) | 2004-11-29 | 2004-11-29 | Catalyst for artificial plate with low release content of free formaldehyde |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1315967C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101419181B (en) * | 2008-11-21 | 2011-10-05 | 重庆大学 | Air-sensitive material for detecting oxymethylene and air-sensitive device made from the material |
| CN103101100A (en) * | 2012-12-28 | 2013-05-15 | 廊坊华日家具股份有限公司 | Environment friendly recombination bamboo artificial board and manufacturing method thereof |
| CA2967486C (en) * | 2014-11-13 | 2018-10-02 | Fpinnovations | Method for scavenging free formaldehyde using multifunctional scavenger for wooden composite products with urea-formaldehyde resin |
| CN109663498A (en) * | 2018-12-11 | 2019-04-23 | 武汉中质先锋科技股份有限公司 | A kind of natural oxygen catalytic control agent for administering indoor decorating pollution |
| CN113398752B (en) * | 2021-06-22 | 2022-01-11 | 深圳特沃德环保科技有限公司 | Air purification material with formaldehyde removal effect and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4472165A (en) * | 1982-09-24 | 1984-09-18 | United Merchants And Manufacturers, Inc. | Method for reduction of formaldehyde in resin-treated fabrics |
| US4620892A (en) * | 1984-08-31 | 1986-11-04 | Interox America | Process for the assembly of wooden components and assembly of wooden components |
| US4670184A (en) * | 1983-11-15 | 1987-06-02 | Swedspan Ab | Suspension of ammonium carbonate and/or ammonium hydrogen carbonate of improved stability and its use |
| CN1281884A (en) * | 1999-07-23 | 2001-01-31 | 黄树军 | Powdered adhesive for wood material |
-
2004
- 2004-11-29 CN CNB200410096091XA patent/CN1315967C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4472165A (en) * | 1982-09-24 | 1984-09-18 | United Merchants And Manufacturers, Inc. | Method for reduction of formaldehyde in resin-treated fabrics |
| US4670184A (en) * | 1983-11-15 | 1987-06-02 | Swedspan Ab | Suspension of ammonium carbonate and/or ammonium hydrogen carbonate of improved stability and its use |
| US4620892A (en) * | 1984-08-31 | 1986-11-04 | Interox America | Process for the assembly of wooden components and assembly of wooden components |
| CN1281884A (en) * | 1999-07-23 | 2001-01-31 | 黄树军 | Powdered adhesive for wood material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1632025A (en) | 2005-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FI71515C (en) | Process for the preparation of an incombustible substance using mineral substances. | |
| CN1315967C (en) | Catalyst for artificial plate with low release content of free formaldehyde | |
| CN102757754A (en) | Flame-retardant adhesive and preparation method thereof | |
| FI87227B (en) | FOERFARANDE FOER SAMMANFOGNING AV TRAEKOMPONENTER SAMT KOMBINATION AV TRAEKOMPONENTER. | |
| US3677884A (en) | Veneer crossbinder and laminates prepared therefrom | |
| EP3050618A1 (en) | Aldehyde removal material | |
| JPS6110567A (en) | Manufacture of (2-hydroxyethyl)melamine and use | |
| JPS5964683A (en) | Resinous adhesive for particle board | |
| CN101570605B (en) | Compounded additive of pollopas and preparation method thereof | |
| RU2213753C2 (en) | Glue composition for wood-fiber tile | |
| US3100754A (en) | Potentially reactive urea-formaldehyde adhesive system | |
| SK146594A3 (en) | Method of gluing of wood-base products by gluings on amino bitumen base | |
| GB2245578A (en) | Formaldehyde resin curing agents. | |
| US3979492A (en) | Process for producing fiberboard | |
| EP2532498B1 (en) | Method of reducing the emission of formaldehyde from formaldehyde laden wood panels | |
| JPS5817547B2 (en) | Catalyst for amino resin polycondensation | |
| SU1687588A1 (en) | Composition for treating hydrophobized wood particles or surfaces of wooden panels | |
| JP2007138311A (en) | Method for producing base board for construction | |
| US4011363A (en) | Curable amino resins | |
| PL186572B1 (en) | Method of reducing formaldehyde content in and formaldehyde emission from boards made og lignocellulosic particles bonded together with amino resins | |
| KR830001734B1 (en) | Method for producing urea formaldehyde resin adhesive | |
| SU1613332A1 (en) | Method of producing wood particle boards | |
| SU1121280A1 (en) | Adhesive | |
| SU1754754A1 (en) | Liquid hardener on the basis of diatomic phenols for glue resins | |
| SU1735312A1 (en) | Method of modified urea-formaldehyde resin synthesis |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |