CN1313798C - 有形装药的衬 - Google Patents
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- F42—AMMUNITION; BLASTING
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- F42B1/00—Explosive charges characterised by form or shape but not dependent on shape of container
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Abstract
一种有形装药的衬,由重量比超过90%的钨粉和重量比最高10%的粉末状粘合剂混合组成。这种混合物被制成为一个基本上为圆锥形状的主体和颗粒粒径在25纳米~1微米之间的均一颗粒的晶体结构。
Description
技术领域
本发明涉及***装药领域,特别是涉及一种有形装药的衬及其成分。
背景技术
有形装药包括一个外壳、大量的烈性***如RDX:三次甲基三硝基胺和一个***烈性***中的衬。在石油和天然气开采业中,有形装药的衬常常通过将金属粉末挤压成圆锥形,不过采用其它等效的形状也可以。在大多数情况下,是以锻造金属和合金为原料,通过各种工艺加工成各种形状和粒径的衬。当烈性***被引爆后,冲击力将***包的衬冲破并将***从装药的一端以一股很长的物质流的形式高速喷出,形成一个喷流。这种喷流被用来穿透目标。
有形装药被用于军事和工商业的很多方面。例如,在石油开采业中,有形装药被称作穿孔器,用于穿透油井的外层及周围的储油岩石层。
目前已经有很多关于有形装药弹头的研究,设计者尽力试图获得能达到穿孔要求和满足限制条件的弹头或穿孔器的最高效率。
在许多应用中,希望喷流能尽可能深地穿透目标材料。在本领域一种已知的方法是通过在有形的装药外壳内增加***量来提高穿透深度。而这种方法的缺点是在***引爆时有些能量就会消耗在非喷流方向的其他方向。在油井开发中,这会对井口和相关设备造成不应有的损坏。
另一种使穿透深度最大化的方法是优化整个弹头/穿孔器的设计包括引爆方法和衬的形状。即便如此,传递衬上的能量还是受到***的几何形状和***量的限制。
使穿透深度最大化的一种又进一步的方法是改变有形装药的衬的材料。在过去,最初的有形装药的衬典型地由锻造铜来制成,而在本领域中已经知道,在某些应用中其他材料展示出了更好的优点。例如,在油井穿透器中,使用了包括相对高含量的钨金属粉和软金属、非金属粘合剂压坯的衬。美国专利5656791和5567906揭示的有形装药的衬含有高达90%的钨。这种衬的穿透深度被证明超过传统材料制作的防护面,但其缺点是易碎。
发明内容
因此本发明的目的是提供一种用于制作有形装药衬,使其能够增加穿透深度,并且能解决上述的钨增强衬垫的问题。
据此本发明提供一种有形装药的衬,其由重量超过90%的钨粉和重量最多10%的粉末状粘合剂组成。这种混合物被制成圆锥的形状和均一的颗粒,其颗粒的粒径在25纳米~~1微米之间。
众所周知,穿透深度与(喷流长度)×(有形装药衬的材料密度比率)1/2成比例的。所以,增加衬材料的密度将会提高喷流的穿透深度。钨具有较高的密度,因而用重量超过90%的钨制作衬,其穿透深度超过其他现有的衬,尤其是在石油和天然气工业中。
但是,喷流长度也影响穿透深度。为获得较长的喷流,衬必须被设计成能使喷流具有长的喷流衰减时间,基于Zerilli-Armsrong的材料运算法则(参见Ramachandran V,Zerilli F J,Armstrong R W,在关于钨和钨合金的最新进展的美国温度测量学会第120次年会,美国新奥尔良1991年2月17~~21日)和Goldthorpe的张力不稳定测试方法(第19届国际弹道学讨论会2001年5月3~~7日瑞士)的有形装药的衬的动力学分析已被发明人员接受,该分析表明:喷流的衰减时间与塑性颗粒的速率成反比关系,该塑性颗粒的速率只是由衬材料的组成颗粒的粒径的单调函数决定的。因此,小的颗粒物粒径将会增加喷流的衰减时间,进而增加穿透深度。
使用小于1微米或更小粒径的组成颗粒物,钨衬垫的穿透能力证明将会大大的提高。这里的术语“颗粒物粒径”是指采用美国材料实验协会指定的:E112截取程序(Heyn)测量的颗粒物平均直径。
进一步,如果高钨含量衬垫的颗粒粒径小于1微米,获得的喷流的特性至少可以与贫铀材料(DU)获得的特性相比。所以,钨也是一种不太容易得到的用于代替贫铀材料的材料。
上述的颗粒物粒径和喷流的衰减时间之间的关系要求组成颗粒物的粒径在25纳米。若低于这一下限,则材料的微观结构特性将改变。低于25纳米,成型变形机理就受组成物质的小角度和颗粒物的高角颗粒物边界控制。大于25纳米,材料的变形过程将由错位控制,同时在微观结构中存储能量的效率也比小粒径颗粒物结构低。微观结构变形机理的不同将导致不同的微观结构,最终使材料的物理特性也不同。这种微观结构机械性能不受生产纳米材料的工艺过程控制。
颗粒物的粒径小于100纳米的钨材料能提高材料的动态塑性,因此其作为有形装药的衬的材料是非常有前景的。在这里颗粒粒径优选地小于100纳米的材料被定义为“纳米晶体材料”。
衬通过压缩混合物形成压坯或者通过烧结混合物来制作。在压缩形成压坯的情况下,粘合剂可由任何的金属粉末或非金属材料,但优选地地由软性高密度材料如铅、钽、钼、石墨来构成。更方便的作法是,钨涂上一层粘合剂材料的涂层,粘合剂由如铅等金属或非金属材料如聚合材料来构成。
方便地,但是,衬通常通过烧结以得到更加坚固的结构。这种情况下,适合的粘合剂由铜、镍、铁、钴的单一物质或它们的组合物来构成。
纳米晶体钨能够经由许多生产工艺如化学气相沉积法(CVD)如通过用氢还原六氟化物气体来得到超细的钨粉末来得到。
超细的钨通过气体冷凝浓缩技术从气相中得到,有许多不同的物理气相沉积法(PVD)可供选用。
包含纳米晶体颗粒的超细粉末也可以用PCT/GB01/00553和WO93/02787中叙述的等离子弧反应器来生产。
附图说明
图1示出了根据本发明具有固态衬的有形装药。
图2示出了在显微镜下的钨---铜材料组成的衬样本的微观结构
具体实施方式
如图1所示,传统的有形装药包括由圆锥形或金属材料的圆柱体外壳1和根据本发明的圆锥形金属衬2,一般以衬直径的1~5%作为壁厚,极端情况下会超过10%。衬2紧密地连结在圆柱体外壳1的一端。烈性***3储藏在圆柱体和衬围成的空间内。
适合的衬的引发材料可以由重量占90%的粉末状纳米晶体钨粉和余下重量占10%的粉末状纳米晶体粘合剂组成。粘合剂由软金属如铅、钽、钼或石墨组成。这些粉末状纳米晶体混合物材料可以由上述的任何一种生产工艺得到。
一种生产衬的方法是通过挤压在模具中紧密混合各种粉末的固定量来生产出衬作为压坯的衬。根据本专利在其他情况下,可使用与上述几乎相同的生产工艺紧密混合粉末材料,但生产出来的压坯产品应当为允许某些烧结或渗透而接近网状的形状。
图2示出由钨-铜材料组成的衬的微观结构。这种衬由重量占90%的纳米晶体钨粉和余下重量占10%的粉末状纳米晶体粉末粘合剂材料的混合物组成,这里用铜作为粘合剂。通过烧结混合物来制作衬。
图2显示的是放大100倍的表面显微照片。衬的微观结构是由粒径约在5~~10微米钨颗粒物10(暗灰色)和铜颗粒物20(亮灰色)组成的。如果衬作为压坯的话,则颗粒物粒径实际上会更小,如1微米或更小。
对本发明的具体实施例的变换对于本领域的技术人员来说是显而易见的。因而也将被认为落入本发明的保护范围。例如,可以采用生产细颗粒衬的其他方法。
Claims (11)
1、一种有形装药的衬,由重量比超过90%的钨粉和重量比最高至10%的粉末状粘合剂混合组成,这种混合物被制成为一个圆锥形状的主体和具有颗粒粒径在25纳米~~1微米之间的均一颗粒的晶体结构。
2、根据权利要求1的衬,其特征在于,该混合物中的颗粒粒径在25纳米~~100纳米之间。
3、根据权利要求1或2的衬,其特征在于,该衬混合物被压缩形成压坯。
4、根据权利要求3的衬,其特征在于,该粘合剂含有纳米晶体金属粉末。
5、根据权利要求4的衬,其特征在于,该粘合剂从铅、铜、钽、钼或它们的组合物中选择。
6、根据权利要求3要求的衬,其特征在于,该粘合剂含有纳米晶体非金属粉末。
7、根据权利要求6要求的衬,其特征在于,该粘合剂是非金属材料聚合体。
8、根据权利要求1或2的衬,其特征在于,该粘合剂材料涂在钨上。
9、根据权利要求1或2的衬,其特征在于,该粘合剂混合物是烧结的。
10、根据权利要求9的衬,其特征在于,该粘合剂包含有纳米晶体粉末铜、镍、铁、钴或它们的混合物。
11、一种有形装药,由一外壳、填入到外壳中的一些烈性***、和根据前述任一权利要求所述的一个***到外壳中的衬组成,该烈性***填入到该外壳和该衬之间的空间。
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GB0127296A GB2382122A (en) | 2001-11-14 | 2001-11-14 | Shaped charge liner |
GB0127296.2 | 2001-11-14 |
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CN1585888A CN1585888A (zh) | 2005-02-23 |
CN1313798C true CN1313798C (zh) | 2007-05-02 |
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US (1) | US7261036B2 (zh) |
EP (1) | EP1444477B1 (zh) |
CN (1) | CN1313798C (zh) |
AT (1) | ATE334375T1 (zh) |
AU (1) | AU2002363806B2 (zh) |
CA (1) | CA2467103C (zh) |
DE (1) | DE60213446T2 (zh) |
GB (1) | GB2382122A (zh) |
NO (1) | NO328843B1 (zh) |
RU (1) | RU2258195C1 (zh) |
WO (1) | WO2003042625A1 (zh) |
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GB0323675D0 (en) | 2003-10-10 | 2003-11-12 | Qinetiq Ltd | Improvements in and relating to perforators |
GB0323717D0 (en) * | 2003-10-10 | 2003-11-12 | Qinetiq Ltd | Improvements in and relating to oil well perforators |
US7360488B2 (en) * | 2004-04-30 | 2008-04-22 | Aerojet - General Corporation | Single phase tungsten alloy |
US8584772B2 (en) * | 2005-05-25 | 2013-11-19 | Schlumberger Technology Corporation | Shaped charges for creating enhanced perforation tunnel in a well formation |
US7762193B2 (en) * | 2005-11-14 | 2010-07-27 | Schlumberger Technology Corporation | Perforating charge for use in a well |
US7849919B2 (en) * | 2007-06-22 | 2010-12-14 | Lockheed Martin Corporation | Methods and systems for generating and using plasma conduits |
US20100132946A1 (en) | 2008-12-01 | 2010-06-03 | Matthew Robert George Bell | Method for the Enhancement of Injection Activities and Stimulation of Oil and Gas Production |
US8171851B2 (en) | 2009-04-01 | 2012-05-08 | Kennametal Inc. | Kinetic energy penetrator |
GB201012716D0 (en) * | 2010-07-29 | 2010-09-15 | Qinetiq Ltd | Improvements in and relating to oil well perforators |
DE102012007203B4 (de) * | 2012-04-12 | 2015-03-05 | TDW Gesellschaft für verteidigungstechnische Wirksysteme mbH | Verfahren und Einrichtung zur Erhöhung der Leistung einer Hohlladung mit kunststoffgebundenem Sprengstoff bei tiefen Temperaturen |
US8985024B2 (en) * | 2012-06-22 | 2015-03-24 | Schlumberger Technology Corporation | Shaped charge liner |
GB201222474D0 (en) * | 2012-12-13 | 2013-01-30 | Qinetiq Ltd | Shaped charge and method of modifying a shaped charge |
US9175940B1 (en) | 2013-02-15 | 2015-11-03 | Innovation Defense, LLC | Revolved arc profile axisymmetric explosively formed projectile shaped charge |
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- 2002-11-12 CA CA002467103A patent/CA2467103C/en not_active Expired - Fee Related
- 2002-11-12 CN CNB028224833A patent/CN1313798C/zh not_active Expired - Fee Related
- 2002-11-12 AT AT02803062T patent/ATE334375T1/de not_active IP Right Cessation
- 2002-11-12 WO PCT/GB2002/005092 patent/WO2003042625A1/en active IP Right Grant
- 2002-11-12 EP EP02803062A patent/EP1444477B1/en not_active Expired - Lifetime
- 2002-11-12 DE DE60213446T patent/DE60213446T2/de not_active Expired - Lifetime
- 2002-11-12 US US10/494,805 patent/US7261036B2/en not_active Expired - Lifetime
- 2002-11-12 AU AU2002363806A patent/AU2002363806B2/en not_active Ceased
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2004
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Also Published As
Publication number | Publication date |
---|---|
CN1585888A (zh) | 2005-02-23 |
DE60213446D1 (de) | 2006-09-07 |
DE60213446T2 (de) | 2007-02-22 |
RU2258195C1 (ru) | 2005-08-10 |
US7261036B2 (en) | 2007-08-28 |
NO328843B1 (no) | 2010-05-25 |
AU2002363806B2 (en) | 2006-08-10 |
RU2004117863A (ru) | 2005-06-10 |
US20040255812A1 (en) | 2004-12-23 |
WO2003042625A1 (en) | 2003-05-22 |
NO20041980L (no) | 2004-06-14 |
GB0127296D0 (en) | 2002-01-02 |
ATE334375T1 (de) | 2006-08-15 |
CA2467103C (en) | 2009-10-27 |
CA2467103A1 (en) | 2003-05-22 |
EP1444477A1 (en) | 2004-08-11 |
EP1444477B1 (en) | 2006-07-26 |
GB2382122A (en) | 2003-05-21 |
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