CN1310761C - Droplet deposition apparatus - Google Patents

Droplet deposition apparatus Download PDF

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Publication number
CN1310761C
CN1310761C CNB038020602A CN03802060A CN1310761C CN 1310761 C CN1310761 C CN 1310761C CN B038020602 A CNB038020602 A CN B038020602A CN 03802060 A CN03802060 A CN 03802060A CN 1310761 C CN1310761 C CN 1310761C
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CN
China
Prior art keywords
passage
sidewall
channel
deposition apparatus
groove
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Expired - Fee Related
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CNB038020602A
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Chinese (zh)
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CN1612809A (en
Inventor
W·扎普卡
L·莱温
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Xaar Technology Ltd
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Xaar Technology Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • B41J2/14209Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1607Production of print heads with piezoelectric elements
    • B41J2/1609Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • B41J2/1634Manufacturing processes machining laser machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1635Manufacturing processes dividing the wafer into individual chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1643Manufacturing processes thin film formation thin film formation by plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering

Abstract

Droplet deposition apparatus comprises a plurality of parallel channels each defined at least in part by facing side walls of piezoelectric material, and electrode means for the application of an electric field to selected ones of the side walls. The electrode means are connected to an electrical drive circuit by connection tracks located within grooves extending along the side walls.

Description

Oroplet deposition apparatus and manufacture method thereof
The present invention relates to Oroplet deposition apparatus and make the method for this device.
Fig. 1 to Fig. 3 illustrates a kind of typical ink jet-print head 8 with perspective view and sectional view respectively, and it contains the piezoelectric wall actuators (wall actuators) with the shear mode running, for example can recognize from US-A-5016 028.It comprises a piezoelectric matrix 10, is placed on the circuit board 12, and only wherein the part of expression connection track (connection tracks) 14 is illustrated.
A plurality of parallel grooves are formed in the matrix 10, extend in piezoelectricity (PZT) material layer, for example, as described in the US-A-5016028.Each groove comprises a fore-end, and it is deep, and so that ink channel 20 to be provided, they are isolated by the opposite wall 22 of actuator, and these walls have coplanar end face; With a rear end part, it is superficial, provides position 23 for connecting track.The front-end and back-end part is connected by " flexure plane (runout) " part R of passage, and its radius is by the radius decision of the cutting disc that is used for forming passage.
After groove forms, with these walls of silicon nitride " passivation in advance ".The purpose of doing like this is for before using electrode, covers upward skim (1 μ m) low-dielectric material for the non-active portion of wall.The intention become activity (active) thus wall portions masked can be by passivation in advance.Utilize the plasma of silane, nitrogen and argon, use silicon nitride by the electron cyclotron resonace chemical vapour desposition.Cyclotron radiation is activated plasma in such a way, with generation the deposition of the silicon nitride of very low hydrogen content is arranged, and does not produce excessive heat, to be no more than the Curie temperature of PZT.
As shown in Figure 3, after the passivation, the coat of metal is deposited in the groove in advance, provides electrode 26 with the fore-end at the forward surface of ink channel 20.Electrode approximately extends to half (Fig. 3 (a) and (b)) of channel height from the top of wall.Coating also provides at rear end part and connects track 24, and it is connected to the electrode 26 (Fig. 3 (c)) of each passage 20.The top of wall does not have the coat of metal, and therefore, electrode 26 constitutes the activation electrodes of the separation of each passage.
After deposition and passivator layer covering matrix 10 with silicon nitride, thereby this passivator layer keeps apart electrode part and ink as ion and electron barrier avoids corrosion, matrix 10 is fixed on the circuit board 12 as shown in Figure 1, and make bonded wire connection 28, the connection track 24 on the body portion 10 is connected to the connection track 14 on the circuit board 12.
A lid 16 is adhered to the top of actuator walls 22, thereby forms a plurality of " sealing " passage 20.At one end, each passage obtains ink replenishing by the window in the lid 16 27.At the other end of each passage, a nozzle 30 is arranged, it can (advantageously be ablated by the UV excimer laser) and be formed in the nozzle plate 17 that adheres to printhead.
In this example, from an ink feed source, discharge ink by window 27, ink is inhaled into ink channel 20 from window, arrives nozzle 30 again, operates printhead thus.For example, as what understood from EP-A-0 277 703, applied voltage waveform rightly on the electrode of the either side of conduit wall, cause between wall, setting up an electrical potential difference, this polarized piezoelectric material that causes conduit wall again is out of shape with shear mode, and causes that wall is with respect to separately passage lateral drift.Therefore, define one or two wall possibility deflection of ink channel.Along top and bottom respectively by matrix and closed with covers and both sides by the length of that passage of separately conduit wall sealing, an acoustic pressure wave is set up in the motion of wall in ink.This length is called passage " activity " length (active length), and is noted as " L " in Fig. 1 and 2.Acoustic pressure wave is propagated along the length of passage, and ejects ink droplet therefrom.
The basic principle of passivation in advance is as follows: because PZT has a high dielectric constant, so the voltage difference great majority between wall appear on the silicon nitride layer, seldom appear on the PZT.As a result, the stray capacitance of the non-active portion of wall is minimized, and this has reduced electric current and has made driving chip more easily obtain a fast rise time.In addition, open-topped wall is not very hard, when they do not have passivation in advance, will cause useless sound wave in manifold (manifold) zone of printhead.
And, the actuating of the unnecessary part by stoping PZT, passivation in advance prevents the excessive buildup of the heat of printhead, thereby reduces the total amount of heat that is produced in the printing operation process.As disclosed in our international patent application no PCT/GB01/00652 common in a review, a fin can be bonded to the top of assembly of lid 16, is used for dispersing the heat that is produced in passage in the ink droplet jet process.Yet, in the configuration shown in Fig. 1, provide the requirement of ink feed by assembly of lid 16, limit fin and covered the degree of passage, thereby limited the heat that can shift to fin from ink channel.
The present invention attempts to solve this and other problems.
On the one hand, the invention provides Oroplet deposition apparatus, it comprises many parallel injection channels, and each is defined by the subtend sidewall of piezoelectric at least in part; And electrode assembly, be used for electric field is applied to those selected sidewalls, wherein electrode assembly is connected to a drive circuit by the connection track that is positioned at groove, and this groove extends along the edge of the sidewall that defines injection channel.
In order to get rid of the too much heat that is produced in the deposition process ink inside passage, the present invention has recognized this expectation, a fin that is covered in the whole surface of assembly of lid is provided, thereby rearranges ink feed according to assembly of lid.Yet, in the layout of meaning shown in Fig. 1 to 3, circuit board 12 is provided and provides bonded wire to be connected 28 necessity to mean that the ink feed source can not be replayed to the rear end of ink channel easily, and does not hinder these connections in the ink channel rear end.
Be positioned at the groove that extends along the sidewall edge of ink channel when connection track of the present invention, in other words, not when extending along the bottom of the passage back shown in Fig. 3 (c), these tracks can be realized by a kind of alternative method with being connected of drive circuit, for example, utilize the adhesive tape of the rear surface that is adhered to the ink channel sidewall.Thisly bonding connection track 24 on the body portion 10 is connected to connection track 14 on the circuit board 12, connects 28 than bonded wire mentioned above and carry out easily, and can not hinder the arrangement of the ink feed of passage rear end.Therefore, now the entire upper surface of assembly of lid can contact heat spreader, is used for effective cooling of device.
Preferably, each groove comprises a cardinal principle L shaped (that is, having a bottom surface and an one-sided wall) groove or breach, along the extension of edge separately of sidewall.In one embodiment, connecting track only extends along the bottom surface of L shaped groove.No longer extend when connecting track, but when being positioned in the bottom surface of the groove that extends along the sidewall edge of ink channel along the sidewall of passage, just no longer need be before the electrode deposition passivation conduit wall in advance.Therefore, a manifold can be fixed in the assembly of lid, so that ink can feed path; In the time of on connecting the subtend sidewall that track is not positioned at passage top end opening part, with regard to the problem that does not exist the sound wave that produced in the ink with these parts of passage to be associated.
In one embodiment, each wall has a groove that extends along the one side, a connection track that is positioned at groove, and it is connected to drive circuit the electrode assembly on that side that is fixed on sidewall.In another embodiment, each wall has the groove that extends along its opposite sides, connects track and is positioned at groove, and it is connected to drive circuit each electrode assembly on the sidewall in opposite directions that is fixed on that wall.
Preferably, each passage is defined by subtend sidewall and a bottom surface of extending between sidewall, and wherein the open side of passage is sealed along the length of active channel by a lid that is fixed to sidewall.Preferably, the bottom surface is defined by a matrix, and matrix and sidewall are an integral body.
This device preferably includes liquid supplying apparatus, and it is used to passage supply liquid, to replenish the ink droplet that passage is sprayed.In one embodiment, the nozzle plate that has defined the injection nozzle of each passage is positioned at an end of passage, and liquid supplying apparatus is positioned at the other end of passage.
The connection track is fit to lead slurry by electricity and forms.
On the other hand, the invention provides a kind of method of making Oroplet deposition apparatus, this method may further comprise the steps:
In a piezoelectric plate, form many first parallel channels with first degree of depth;
Conducting material is deposited in the first passage;
In that piece piezoelectric, form many second parallel channels, parallel with first passage extension, and has second degree of depth greater than first degree of depth, at least one sidewall in the subtend sidewall of each second channel is positioned at first passage separately, and is offset a sidewall of that first passage; With
Selectively electrode material is deposited at least a portion in the subtend sidewall of each second channel, so that the conducting material in the remainder of contact first passage, thereby makes the signal of telecommunication can be sent to the electrode of second channel wall, to reach the actuating purpose.
Preferably, the step of deposition conducting material comprises material is deposited on the whole surface of that piece piezoelectric, removes the material of the end face that is deposited on the first passage wall subsequently.In preferred embodiments, remove this material by machining.
Preferably, a lid is adhered on the plank, can be bonded on the lid with sealing channel part and fin along active length.
In one embodiment, be deposited on conducting material in the first passage before, many 3rd parallel channels that are vertically intersected on first passage are formed in that piece piezoelectric plate, subsequently conducting material be deposited on first and the 3 two passage in.
This method can may further comprise the steps, divide that piece plank along being parallel to third channel with first section line that intersects at electrode, and along being parallel to third channel and second section line division plank that intersects at third channel separately, like this, the material segment that is deposited on third channel provides the position for electrode is electrically connected to external drive circuit.Preferably, a nozzle plate is applied in the position of first section line, sprays the nozzle of ink droplet with definition.Preferably, the liquid supplementary device is in the position of second section line.
In preferred embodiments, passage forms by remove material from plank, for example by saw.
Above the described characteristics in relevant method of the present invention aspect can be applicable to the device aspect, and vice versa.
In the mode of embodiment, further explain the present invention with reference to the accompanying drawings.
Fig. 1 is a kind of perspective view of traditional ink jet-print head of form;
Fig. 2 is the sectional view of the printhead of Fig. 1 of being done of the line A-A along Fig. 1;
Fig. 3 (a) (b) and (c) is respectively along the line B-B of Fig. 1, the partial cross section figure of the printhead of Fig. 1 that C-C and D-D did;
Fig. 4 to 9 is perspective views of formation step of the printhead of signal first embodiment of the present invention;
Figure 10 is the sectional view of the printhead of Fig. 9 of being done of the line E-E along Fig. 9;
Figure 11 (a) and (b) be the partial cross section figure of the printhead of Figure 10 of being done along line F-F and G-G respectively;
Figure 11 (c) and (d) be to fill along the formed groove of conduit wall except conductive material is similar to Figure 11 (a) and those sectional view (b) respectively;
Figure 12 to 16 is perspective views of formation step of the printhead of signal second embodiment of the present invention;
Figure 17 is the sectional view of the printhead of Figure 16 of being done of the line H-H along the Figure 16 with additional cap sub-component;
Figure 18 is the perspective view (lid is removed) of the printhead of the Figure 17 after dividing; With
Figure 19 is the sectional view of formation step of the printhead of signal the 3rd embodiment of the present invention.
The formation step of the printhead of first embodiment of the present invention is described referring now to Fig. 4 to 11.
At first, provide a piezoelectric plate 100 such as lead zirconate titanate (PZT) with reference to figure 4.PZT plate 100 comprises two-layer PZT, and one deck is along the Z direction polarization, and another layer polarizes in the opposite direction.The substantially parallel shallow first passage 102 in many sides is formed in the PZT plate 100, for example by cut or otherwise form the groove (only for simplicity, eight first passages only being shown in Fig. 4) of rectangular cross section on PZT plate 100.Can utilize the parallel diamond dust impregnated disks that is contained on the common axis, or carry out cutting by laser cutting.In this embodiment, the width of first passage 102 is 65 μ m, and the degree of depth is 30 μ m, and the interval that first passage is 102 is substantially equal to be formed at subsequently the interval (being approximately 140 μ m) of the ink channel in the PZT plate 100.
With reference to figure 5, after first passage 102 formed, the substantially parallel cross aisle 104 in many sides was formed in the PZT plate 100 equally, with first passage 102 basic quadratures.In this embodiment, the width of cross aisle 104 also is 65 μ m, but the degree of depth expands to 100 μ m, is spaced apart 3mm between the adjacent cross aisle 104.
The surface-coated conducting material 106 that covers of the entire top of PZT plate 100 subsequently is with the complete filling passage.For not depolarising PZT plate 100, use the preferably slurry of cold curing of low temperature, for example, as from Dutch Scheemda, Acheson Coloiden BV's, be entitled as described in the handbook of " ProductData Sheet On Screen-Printable Ag, Ag/AgCl and C pastes ".After solidifying, remove this slurry from being positioned at interchannel plank 100 end faces 108, for example by little processing.In one embodiment, the structure that obtains is illustrated in Fig. 6, and this slurry covers the wall of first passage 102 and cross aisle 104 effectively.In another embodiment, this slurry is filled first passage 102 effectively.
Other the suitable method that is used for depositing conducting material 106 comprises that the nickel of chemical deposit is electroplated, spraying plating or the like.
With reference to figure 7, the substantially parallel second channel 110 in the uniform side of many degree of depth is formed in the PZT plate 100.These second channels 110 provide ink ejection channels.Ink channel 110 is substantially parallel with first passage 102, width (being approximately 65 μ m) is identical with first passage 102, ink channel 110 departs from the distance of about 20 μ m slightly with respect to first passage 102, therefore a wall 112 of each ink channel 110 is formed in the first passage 102, and another wall 118 of each ink channel 110 is formed between the first passage 102.This causes each ink channel 110 that a degree of depth is arranged is the 85 μ m width of 20 μ m, and the width of its remainder is 65 μ m, have and comprise a wall 112 along the groove 114 of its whole length extension, be positioned at the track 116 of a conducting material of groove 114, and be another channel wall 118 on plane.
As shown in Figure 8, metal electrode 120 is deposited on the active region of front of each wall 112,118 of ink channel 110 subsequently.Before metallization, mask is formed at not need be such as the place of the electrode material of aluminium; Subsequently, one is played mask and the aluminium that removes the place that does not need electrode from (liftoff).What can select is can use aiming metal vapor deposition (sight metalvapour deposition) line and come deposit metal electrodes.When PZT plate 100 comprises the piezoelectric material layer of two reverse polarizations, the wall 112,118 of ink channel 110 is as the wall actuators that is known as " V-arrangement (chevron) " type, this for example is the theme of european patent number 0277703 and 0278590, and it openly is incorporated herein by reference.These actuators are considered to have superiority, because they need lower driving voltage in operating process, just can set up identical pressure in ink channel.For the electrode material that will be deposited on the sidewall 112,118 is connected to track 116, electrode material extends to the entire depth of sidewall 112,118, and expands on the bottom surface of the active part of ink channel 110.
After the metallization, implement silicon nitride passivation so that ion and electron barrier to be provided, corroded by ink to prevent track 116 and electrode 120.Then, adhered to the end face 108 of conduit wall with reference to figure 9 and 10, one assembly of lid 122.Lid 122 is formed with a series of parallel undercutting (undercuts) 124, and they are used to define the active length L (approximately 1mm) of each ink channel 110.
Up to the present all these processing are all carried out in the wafer scope, and so a large amount of printheads can be made into simultaneously.In this stage, printhead is cut open along first section line F-F that intersects at electrode 120 and the second section line G-G that intersects at cross aisle 104.With reference to Figure 11 (a), provide a flat front surface 126 along the cut-out of line F-F, skim adhesive of no use adheres to the coat of metal or slurry above it being similar to the nozzle plate shown in Fig. 1.With reference to Figure 11 (b), exposed the rear surface 128 of the sidewall of ink channel 110 along the cut-out of line G-G, each surface 128 be formed with in the above an adhesive pad 130 (electricity lead slurry be deposited in the process in the cross aisle 104 form), it is electrically connected to track 116 separately.Adhesive pad 130 for example is electrically connected by adhesive tape for being electrically connected the position that facilitates, and track 116 electricity (anisotropy) are adhered to drive circuit, driving voltage is provided for electrode 120 by for example connection shown in Fig. 1 28.An ink feed (not shown) is connected to the rear end of passage 110 then, and with to passage supply ink, and fin (not shown) is installed in the top of lid 122.
As what mention previously, for the slurry embodiment of filling groove 114 effectively, Figure 11 (c) and 11 (d) are equal to Figure 11 (a) and 11 (b).
By the track 116 that is located by connecting along shallow grooves 114, this shallow grooves 114 is to form along the top of the complete closed of the wall 112 of ink channel 110, just there is no need the wall 112,118 of passivation ink channel in advance.In addition, when ink feed was positioned at the rear end of passage, the whole top of lid 122 just can be adhered to fin, thereby improved the cooling of printhead.Compare with the printhead of the prior art shown in Fig. 1 and 2, do not need to provide any piezoelectric " crooked (run out) " backward from the rear surface of lid, with the position that provides to be used for track 116, thereby reduced the needed piezoelectric amount of formation printhead to the electrical connection of drive circuit.
The formation step of the printhead of second embodiment of the present invention is described referring now to Figure 12 to 17.
The degree of depth is approximately 20 μ m, and width is that the shallow first passage 102 of 85 μ m is formed in the PZT plate 100.Different with first embodiment, form subsequently and have angled side walls and the degree of depth is the recessed cross aisle 104 of 40 μ m, itself and first passage 102 basic quadratures, as shown in figure 12.Then, angle (90 °) with vertical incidence arrives plank end face 106 with metal vacuum deposition, in this metallization processes, be deposited on the inclined plane and the bottom surface of recessed cross aisle 104 and the end face 106 of the bottom surface of first passage 102 and plank 100 such as the metal of aluminium.As in the first embodiment, remove metal by little processing from the end face 106 of plank 100 then, metal is only left in path 10 2 and 104, as shown in figure 13 like this.As selection, in metallization processes, end face 106 can be covered.Also as in first embodiment, in metallization processes, first passage 102 can be full of metal.
With reference to Figure 14, many substantially parallel second channels 110 in side with varying depth are formed in the PZT plank 100.The width of each passage 110 is 65 μ m, and with each first passage 102 center-aligned, so just forming width at the either side of passage 110 is 10 μ m and the groove 114 that comprises metal track 116.By sawing or cut with diamond/Metal Cutting cutter, each passage is formed in the path, blade depth is changing in the path of passage, like this, each passage 110 has a deep core, so that a pair of back-to-back ink channel to be provided, each has shallow relatively end, is similar to above with reference to the described groove 20 of Fig. 1 and 2.
With reference to Figure 15, utilize mask mentioned above and metallization, electrode 120 is formed on the subtend sidewall of ink channel.In this embodiment, the electrode 120 on the subtend sidewall of each ink channel 110 does not have to couple together with the bottom surface of passage, and electrode 120 extends to the only about half of of the ink channel degree of depth.As shown in figure 16, the groove 140 of Xing Chenging is parallel with first passage 102 subsequently, and passes cross aisle 104 in 106 extensions of end face, defines a succession of adhesive pad 130 in the cross aisle 104 thus.
As shown in figure 17, assembly of lid 122 is subsequently attached to the top 106 of passage.Be different from first embodiment, and be similar to the printhead with reference to the described prior art of Fig. 1 and 2, assembly of lid 122 has and is formed at its inner window 142, makes ink can be fed to ink channel 110.Then, cut along the first section line I-I and the second section line J-J, every section line I-I passes through the center of its cross aisle 104 separately, and every section line J-J passes through the center of electrode 120.As shown in figure 18, each segmentation adhesive pad 130 provides an electric connection point, respectively with ink channel 112 be associated be connected track 116 and electrode 120 is connected to the drive circuit (not shown).
In this second embodiment, different with first embodiment, ink feed remains by assembly of lid, as the printhead of the prior art of early describing.Yet the characteristics that this second embodiment and first embodiment are shared are need not implement the passivation in advance of passage before connecting track 116 formation, because the connection track is not positioned on the subtend sidewall of ink channel 110.
Will be understood that, above only be to have described the present invention, and can doing the change on the details within the scope of the invention in the mode of embodiment.
For example, with reference to Figure 19, the electrode 120 of first embodiment can be formed at the central authorities of the sidewall in opposite directions of ink channel 110, as in second embodiment.Utilization is formed at groove in the lid 122 to 124, with line F-F that ink channel 110 is divided into two along the center by depositing electrode 120 and the cutting carried out along line G-G by groove 104, device is divided into printhead in opposite directions, as in second embodiment, the active length of the ink channel of each printhead is to be controlled by the location of lid 122 further groove 124 as in the first embodiment.
Each characteristic of illustrating in the disclosed and/or accompanying drawing in this specification (its project comprises claim) can join among the present invention, and are independent of other disclosed and/or illustrate characteristics.

Claims (22)

1. Oroplet deposition apparatus, comprise a plurality of parallel injection channels, each defines to the sidewall in opposite directions of small part by piezoelectric, and electrode assembly, be used for electric field is applied to selected sidewall, wherein this electrode assembly is connected to drive circuit by the connection track that is positioned at groove, and this groove extends along the edge of the sidewall that defines this injection channel.
2. the described Oroplet deposition apparatus of claim 1, wherein each groove comprises a groove that cardinal principle is L shaped, it extends along the edge of a sidewall respectively.
3. the described Oroplet deposition apparatus of claim 1, wherein each wall has a groove that extends along its side, and a connection track that is positioned at described groove is connected to described drive circuit the electrode assembly on that side of described wall.
4. the described Oroplet deposition apparatus of arbitrary claim among the claim 1-3, wherein each wall has the groove that extends along its opposite sides, be positioned at the connection track of described groove, described drive circuit be connected to each electrode assembly on the described opposite sides of that wall.
5. the described Oroplet deposition apparatus of arbitrary claim among the claim 1-3, wherein each connects track and stops in the electric end of the end surface that is positioned at sidewall.
6. the described Oroplet deposition apparatus of arbitrary claim among the claim 1-3, wherein each passage define by the described sidewall in opposite directions and the bottom surface of between described sidewall, extending and the open side of wherein said passage by an active channel length of closed with covers that is fixed on described sidewall.
7. the described Oroplet deposition apparatus of claim 6, wherein said bottom surface is defined by a matrix, and described matrix and described sidewall are an integral body.
8. the described Oroplet deposition apparatus of claim 6, one of them fin is bonded on the described lid, to disperse the heat that is produced in the ink droplet jet process.
9. the described Oroplet deposition apparatus of arbitrary claim among the claim 1-3 comprises liquid supplying apparatus, and it is used for to described passage supply liquid, to replenish the drop from described channel injection.
10. the described Oroplet deposition apparatus of claim 9, one of them nozzle plate that has defined the nozzle of each passage is positioned at an end of described passage, and described liquid supplying apparatus is positioned at the other end of described passage.
11. the described Oroplet deposition apparatus of arbitrary claim among the claim 1-3, wherein said connection track is led slurry by electricity and is formed.
12. make a kind of method of Oroplet deposition apparatus, this method comprises the following steps:
On a piezoelectric plank, form a plurality of first parallel channels with first degree of depth;
Conducting material is deposited in the described first passage;
In described plank, form a plurality of second parallel channels, parallel with described first passage extension, and has second degree of depth greater than described first degree of depth, in the sidewall in opposite directions of each described second channel at least one is positioned at first passage separately, and is offset a sidewall of that first passage; With
Selectively electrode material is deposited at least a portion of described sidewall in opposite directions of each described second channel, so that contact the interior conducting material of remainder of described first passage, thereby make the signal of telecommunication can be sent to the described electrode of second channel wall, activate it thus.
Be deposited on described material on the whole surface of described plank and remove material on the end face of the wall that is deposited on first passage subsequently 13. the described method of claim 12, the step that wherein deposits described conducting material comprise.
14. the described method of claim 13, wherein said material removes by machining.
15. the described method of any one in the claim 12 to 14, one of them lid is adhered to described plank, to seal the described channel part of an active length.
16. the described method of claim 15, one of them fin is adhered on the described lid.
17. claim 12,13,14 or 16 described methods, before wherein in conducting material deposits to first passage, a plurality of vertical and intersect at the 3rd parallel channels that first passage extends and be formed in the described plank, described conducting material be deposited on subsequently described first and the 3 two passage in.
18. the described method of claim 17, may further comprise the steps, along parallel with described third channel and cut described plank with first section line that described electrode intersects, with along parallel with described third channel and cut described plank with second section line that separately third channel intersects, like this, the material segment that is deposited in the described third channel provides the position for described electrode with being electrically connected of external drive circuit.
19. the described method of claim 18, wherein nozzle plate is applied in the position of first section line, to define the nozzle that is used for droplet ejection.
20. claim 18 or 19 described methods, wherein the liquid supplementary device is placed in the second section line position.
21. claim 12,13,14,16,18 or 19 described methods, wherein said passage forms by removing material from described plank.
22. the described method of claim 21, wherein said passage forms by sawing.
CNB038020602A 2002-01-15 2003-01-15 Droplet deposition apparatus Expired - Fee Related CN1310761C (en)

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JP5689652B2 (en) 2010-11-10 2015-03-25 エスアイアイ・プリンテック株式会社 Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head
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CN104001862B (en) * 2014-06-16 2015-10-21 安徽工业大学 A kind of rapid forming system of water-soluble core and manufacturing process

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US5016028A (en) * 1988-10-13 1991-05-14 Am International, Inc. High density multi-channel array, electrically pulsed droplet deposition apparatus
US6070310A (en) * 1997-04-09 2000-06-06 Brother Kogyo Kabushiki Kaisha Method for producing an ink jet head
JP2001334665A (en) * 2000-05-26 2001-12-04 Sharp Corp Ink jet head and method of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016028A (en) * 1988-10-13 1991-05-14 Am International, Inc. High density multi-channel array, electrically pulsed droplet deposition apparatus
US6070310A (en) * 1997-04-09 2000-06-06 Brother Kogyo Kabushiki Kaisha Method for producing an ink jet head
JP2001334665A (en) * 2000-05-26 2001-12-04 Sharp Corp Ink jet head and method of making the same

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GB0200852D0 (en) 2002-03-06
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