CN1309529C - Ic封装用焊锡球“熔融机电整合”一次成型工艺及装置 - Google Patents
Ic封装用焊锡球“熔融机电整合”一次成型工艺及装置 Download PDFInfo
- Publication number
- CN1309529C CN1309529C CNB200410100844XA CN200410100844A CN1309529C CN 1309529 C CN1309529 C CN 1309529C CN B200410100844X A CNB200410100844X A CN B200410100844XA CN 200410100844 A CN200410100844 A CN 200410100844A CN 1309529 C CN1309529 C CN 1309529C
- Authority
- CN
- China
- Prior art keywords
- ball
- orifice plate
- former
- moulding
- smt laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005516 engineering process Methods 0.000 title claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 238000000465 moulding Methods 0.000 title claims description 20
- 238000005476 soldering Methods 0.000 title abstract 5
- 239000007788 liquid Substances 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 15
- 230000010355 oscillation Effects 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 19
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 239000003963 antioxidant agent Substances 0.000 claims description 14
- 230000003078 antioxidant effect Effects 0.000 claims description 14
- 235000006708 antioxidants Nutrition 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 8
- 230000010354 integration Effects 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 6
- 230000004927 fusion Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims description 5
- 238000012216 screening Methods 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 238000010079 rubber tapping Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 206010021143 Hypoxia Diseases 0.000 claims 1
- 230000001427 coherent effect Effects 0.000 claims 1
- 230000001146 hypoxic effect Effects 0.000 claims 1
- 239000008187 granular material Substances 0.000 abstract description 8
- 238000007493 shaping process Methods 0.000 abstract description 6
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 230000003064 anti-oxidating effect Effects 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 230000002195 synergetic effect Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000003723 Smelting Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 101100298225 Caenorhabditis elegans pot-2 gene Proteins 0.000 description 2
- 238000005282 brightening Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 206010033307 Overweight Diseases 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 235000020825 overweight Nutrition 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Laser Beam Processing (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200410100844XA CN1309529C (zh) | 2004-12-08 | 2004-12-08 | Ic封装用焊锡球“熔融机电整合”一次成型工艺及装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200410100844XA CN1309529C (zh) | 2004-12-08 | 2004-12-08 | Ic封装用焊锡球“熔融机电整合”一次成型工艺及装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1657226A CN1657226A (zh) | 2005-08-24 |
CN1309529C true CN1309529C (zh) | 2007-04-11 |
Family
ID=35007035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200410100844XA Expired - Fee Related CN1309529C (zh) | 2004-12-08 | 2004-12-08 | Ic封装用焊锡球“熔融机电整合”一次成型工艺及装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1309529C (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100431747C (zh) * | 2005-10-27 | 2008-11-12 | 徐振武 | 一种无铅焊锡球的制备方法 |
CN103252500B (zh) * | 2013-01-09 | 2017-08-22 | 深圳市创智成功科技有限公司 | 一种用于半导体封装的锡球制造方法及设备 |
CN103157962B (zh) * | 2013-03-27 | 2015-04-08 | 云南锡业锡材有限公司 | 一种斜轧锡球的制备方法 |
CN107081431B (zh) * | 2017-04-26 | 2023-08-22 | 江苏兴贤高新材料股份有限公司 | 一种全自动bga焊球制备装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001340992A (ja) * | 2000-06-01 | 2001-12-11 | Dowa Mining Co Ltd | 球状体の製造方法及び製造装置 |
CN2476100Y (zh) * | 2001-05-11 | 2002-02-06 | 黄清池 | 一次性锡球球体成形机 |
JP2002192383A (ja) * | 2000-12-28 | 2002-07-10 | Mitsubishi Materials Corp | 表面硬度の高いハンダボールの製造方法および装置 |
US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
CN1127386C (zh) * | 2000-11-27 | 2003-11-12 | 张道光 | 封装材料用的焊球制造方法 |
CN1476954A (zh) * | 2003-06-30 | 2004-02-25 | 广州市特铜电子材料有限公司 | 一种bga用焊锡球生产方法及其设备 |
-
2004
- 2004-12-08 CN CNB200410100844XA patent/CN1309529C/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
JP2001340992A (ja) * | 2000-06-01 | 2001-12-11 | Dowa Mining Co Ltd | 球状体の製造方法及び製造装置 |
CN1127386C (zh) * | 2000-11-27 | 2003-11-12 | 张道光 | 封装材料用的焊球制造方法 |
JP2002192383A (ja) * | 2000-12-28 | 2002-07-10 | Mitsubishi Materials Corp | 表面硬度の高いハンダボールの製造方法および装置 |
CN2476100Y (zh) * | 2001-05-11 | 2002-02-06 | 黄清池 | 一次性锡球球体成形机 |
CN1476954A (zh) * | 2003-06-30 | 2004-02-25 | 广州市特铜电子材料有限公司 | 一种bga用焊锡球生产方法及其设备 |
Also Published As
Publication number | Publication date |
---|---|
CN1657226A (zh) | 2005-08-24 |
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PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Yunnan Xiye Microelectronics Material Co.,Ltd. Assignor: Research & Design Institute of Yunnan Tin Industry Group Inc. Contract fulfillment period: 2009.9.27 to 2024.10.21 Contract record no.: 2009530000027 Denomination of invention: One-step molding technology and device for spherical soldering tin Granted publication date: 20070411 License type: Exclusive license Record date: 20091009 |
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LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.9.27 TO 2024.10.21; CHANGE OF CONTRACT Name of requester: YUNNAN TIN MICROELECTRONICS MATERIALS CO., LTD. Effective date: 20091009 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070411 |