CN1301896C - Minisize circulating flow passage device made by lead frame - Google Patents

Minisize circulating flow passage device made by lead frame Download PDF

Info

Publication number
CN1301896C
CN1301896C CNB2004100300267A CN200410030026A CN1301896C CN 1301896 C CN1301896 C CN 1301896C CN B2004100300267 A CNB2004100300267 A CN B2004100300267A CN 200410030026 A CN200410030026 A CN 200410030026A CN 1301896 C CN1301896 C CN 1301896C
Authority
CN
China
Prior art keywords
circulatory flow
runner
miniature
section
flow device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100300267A
Other languages
Chinese (zh)
Other versions
CN1669905A (en
Inventor
陈佩佩
林招庆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
SHENGDA SCIENCE AND TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENGDA SCIENCE AND TECHNOLOGY Co Ltd filed Critical SHENGDA SCIENCE AND TECHNOLOGY Co Ltd
Priority to CNB2004100300267A priority Critical patent/CN1301896C/en
Publication of CN1669905A publication Critical patent/CN1669905A/en
Application granted granted Critical
Publication of CN1301896C publication Critical patent/CN1301896C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention relates to a minisize circulating flow passage device made of a guide wire frame, which is used for transferring heat in a high-temperature zone to a low-temperature zone. The present invention comprises at least one guide wire frame, a cover body and a liquid, wherein the guide wire frame forms a path of a circulating flow passage, and the path of the circulating flow passage comprises at least one heat collecting flow passage near the high-temperature zone, at least one heat dispersing flow passage near the low-temperature zone, a low-temperature conveying flow passage which is communicated to the heat collecting flow passage by the heat dispersing flow passage and a high-temperature conveying flow passage which is communicated to the heat dispersing flow passage by the heat collecting flow passage. The cover body is fixedly arranged on the guide wire frame and covers the path of the circulating flow passage, the liquid is contained in the path of the circulating flow passage so as to transfer heat in the high-temperature zone to the low-temperature zone.

Description

Miniature circulatory flow device with the metallic plate making
[technical field]
The present invention relates to a kind of miniature circulatory flow device, particularly relate to a kind of miniature circulatory flow device.
[background technology]
Electronic technology is maked rapid progress now, such as mobile phone (cell phone), personal digital assistant (PDA), and the electronic equipment of notebook computer (Notebook) etc., all towards light, thin, short, little, beautiful, and multi-functional trend development, and make above-mentioned electronic equipment comprise as the electronic component of little processing wafer etc. also along with miniaturization, more on arithmetic speed and processing energy, significantly rise to simultaneously, therefore relatively in the process of running, just quite be easy to generate accumulation of heat, cause component temperature to raise.Add along with the collective electron component density that trend caused of miniaturization improves, and because of the high frequency electric that high speed circuit caused, make each element and system be subject to operating temperature and what is heard is arranged can't represent the thing of actual usefulness the time.Therefore, for each electronic component can effectively be provided, particularly as the heat radiation of key element such as little processing wafer, just industry has the suggestion of utilization microsystems technology development micro cooling device.
Microsystems technology is meant the technology that volume is small, have the structure of function and self-organizing system of making, general as MEMS (Micro-Electro-Mechanical System, MEMS), microcomputer photosystem (Micro-Optic-Mechanical System, MOMS), and MOEMS (Micro-Electro-Mecha-Optical System, MEMOS) etc., the field that all belongs to microsystems technology.Because micro-system can be widely used in fields such as information electronics, photoelectricity communication, precision optical machinery, monitoring of environment, medical biochemistry, and can significantly promote the technical level of every field, think the key technology area of development in science and technology now, and wherein play the part of very important role with centimetre (mm) level to the manufacturing technology of the microstructure of micron (μ m) level, therefore, the existing microsystems technology that is applied to make micro cooling device is based on the microstructure of centimetre (mm) level to micron (μ m) level.
The manufacture method of existing microstructure can be divided into criticizing to be made (batch process) and makes (non-batch process) with non-batch, wherein can criticize the technology of making and include the trickle processing of matrix (bulk micromachining), surperficial trickle processing (surface micro machining), and micro-lithography electroforming model (LIGA, a German acronym for lithographie, galvanoformung, abformung) etc., it mainly is to continue to use existing semi-conductive microelectric technique development, and is therefore quite ripe.Yet the shortcoming of wherein preceding two technology is to carry out high-aspect-ratio (high aspect ratio), and complicated three-dimensional space stereochemical structure processing, just is subjected to suitable restriction when therefore being applied to make three-dimensional microstructure.Though micro-lithography electroforming model then is to be the technology that purpose is researched and developed batch to make, but because its equipment needed thereby and production cost are higher, and, therefore in fact still can't criticize in a large number and make the making of carrying out microstructure with low cost at technical bottlenecks that still exists such as die casting or injection moldings.
The non-batch of technology of making then includes little Precision Machining (precision micro machining), micro discharge processing (electro-discharge micro machining), and little Laser Processing (lasermicro machining) etc., though it can carry out than high-aspect-ratio, and complicated three-dimensional space stereochemical structure processing, but make owing to can't criticize, therefore can't be by the advantage of a large amount of productions with the performance micro-system that reduces cost.
[summary of the invention]
Main purpose of the present invention is that a kind of miniature circulatory flow device made from metallic plate is being provided.
Another object of the present invention is but that a kind of miniature circulatory flow device of batch making is being provided.
Another purpose of the present invention is that a kind of miniature circulatory flow device that is used for the heat transfer is being provided.
A further object of the present invention is but a kind of batch making to be provided and to present the miniature circulatory flow device of stereoscopic-state.
In order to achieve the above object, the invention provides a kind of miniature circulatory flow device made from metallic plate, it is contiguous high-temperature region and low-temperature space setting, and it comprises at least one metallic plate, and a lid, and fluid is characterized in that:
This metallic plate forms a circulatory flow path, this circulatory flow path comprises the low temperature that the heat radiation runner, of the thermal-arrest runner of at least one contiguous high-temperature region, at least one contiguous low-temperature space is communicated to this thermal-arrest runner by this heat radiation runner and carries runner, and one is communicated to the high temperature conveying runner of this heat radiation runner by this thermal-arrest runner; This lid is fixedly arranged on this metallic plate and contains this circulatory flow path; This fluid is installed in this circulatory flow path, is passed to this low-temperature space with the heat with this high-temperature region, and this high temperature carry runner can have at least one be connected with this thermal-arrest runner and sectional area greater than the variable cross-section section of the sectional area of this thermal-arrest runner.
The miniature circulatory flow device made from metallic plate of the present invention can also have following additional technical characterictic:
This miniature circulatory flow device can comprise that several are formed with the metallic plate in this circulatory flow path.
This lid can be a metallic plate.
This miniature circulatory flow device can comprise that more one carries runner to be connected with this low temperature and drive the drive unit that this fluid flows in this circulatory flow path.
This circulatory flow path can comprise several thermal-arrest runners.
This high temperature carries runner can have several variable cross-section sections, and this thermal-arrest runner carries the variable cross-section section of runner to be connected with this high temperature respectively.
This circulatory flow path can comprise several heat radiation runners.
This metallic plate more can be formed with several flow-disturbing lugs in this thermal-arrest runner.
This low temperature carries runner can have the apotheca section of contiguous this heat radiation runner, and the transportation section of this apotheca section of connection and this thermal-arrest runner, and the sectional area of this apotheca section is greater than the sectional area of this transportation section.
This high temperature carries runner more can have a mixing chamber region; This circulatory flow path more comprises one and is communicated with this low temperature conveying runner and this mixing chamber region, makes this fluid of part directly carry runner to be delivered to the low temperature secondary fluid course of this mixing chamber region without this high-temperature region by this low temperature.
This high temperature conveying runner more can have a mixing chamber region and and be communicated with this variable cross-section section and this mixing chamber region and sectional area throat's section less than the sectional area of this variable cross-section section; This circulatory flow path more comprises this low temperature of connection and carries runner and this throat's section so that this fluid of part directly carries runner to be delivered to the low temperature secondary fluid course of this mixing chamber region without this high-temperature region by this low temperature.
This high temperature carries runner can have one relatively away from the heavy in section section of this heat radiation runner, and at least one relative proximity runner and sectional area small bore section less than the sectional area of this heavy in section section of should dispelling the heat.
This high temperature carries runner can have several small bore sections.
This high temperature carries runner can have several relatively away from the heavy in section section of this heat radiation runner, and several relative proximities runner and sectional area small bore section less than the sectional area of this heavy in section section of should dispelling the heat.
This fluid can be air or methyl alcohol or acetone or water.
This miniature circulatory flow device can comprise that more several are arranged at the radiating fin on this metallic plate.
This miniature circulatory flow device can comprise that more several are arranged at the radiating fin on this lid.
This miniature circulatory flow device can comprise that more one is fixedly arranged on this metallic plate and contains the base plate in this circulatory flow path.
This miniature circulatory flow device can comprise that more several are arranged at the radiating fin on this base plate.
This base plate can be a metallic plate.
[description of drawings]
The present invention is described in detail below in conjunction with drawings and Examples:
Fig. 1 is the side view of the present invention with first preferred embodiment of the miniature circulatory flow device of metallic plate making;
Fig. 2 is the profile along the line II-II among Fig. 1;
Fig. 3 is a plane of this first preferred embodiment, illustrates that a metallic plate has several blocks;
Fig. 4 is a part of side view of this first preferred embodiment, illustrates that a circulatory flow path is formed with several flow-disturbing lugs;
Fig. 5 is the profile along the line V-V among Fig. 4;
Fig. 6 is a flow chart of this first preferred embodiment;
Fig. 7 is a profile of this first preferred embodiment, and light shield with a predetermined pattern and a metallic plate that is coated with a photoresist layer are described;
Fig. 8 is a profile of this first preferred embodiment, illustrates that this predetermined pattern of definition is on this metallic plate;
Fig. 9 is a profile of this first preferred embodiment, illustrates that the part that removes this metallic plate is to form this circulatory flow path;
Figure 10 is a profile of this first preferred embodiment, illustrates to plate to establish a wlding on this metallic plate;
Figure 11 is a profile of this first preferred embodiment, illustrates to cover to establish a lid on this wlding;
Figure 12 is this first preferred embodiment profile of an embodiment again, illustrates to be formed with a channel on this lid;
Figure 13 is the profile of another embodiment of this first preferred embodiment, and several radiating fins that are arranged on this lid are described;
Figure 14 is the schematic diagram of the another embodiment of this first preferred embodiment, and a drive unit that is arranged on this circulatory flow path is described;
Figure 15 is the side view of the present invention with second preferred embodiment of the miniature circulatory flow device of metallic plate making;
Figure 16 is the generalized section along the line XVI-XVI among Figure 15;
Figure 17 is a flow chart of this second preferred embodiment;
Figure 18 is a side view of this second preferred embodiment, and a metallic plate that is formed with a major cycle flow passage route is described;
Figure 19 is a side view of this second preferred embodiment, illustrates to set firmly a base plate on this metallic plate;
Figure 20 is a side view of this second preferred embodiment, illustrate set firmly be formed with a circulatory flow path another metallic plate on this metallic plate;
Figure 21 is a side view of this second preferred embodiment, illustrates to cover to establish a lid on this another metallic plate; And
Figure 22 is the side view of another embodiment of this second preferred embodiment, and several radiating fins that are arranged on this base plate are described.
[specific embodiment]
About aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to two graphic preferred embodiments, can clearly understand.Before proposing detailed description, be noted that in the following description similar elements is to represent with identical numbering.
As shown in Figures 1 and 2, first preferred embodiment of the miniature circulatory flow device 1 of the present invention, be on the heater element 9 that is arranged at just like wafer, be passed to a low-temperature space 92 with heat by a high-temperature region 91 with its generation, this miniature circulatory flow device 1 comprises that a metallic plate 2, that is formed with a circulatory flow path 20 is fixedly arranged on this metallic plate 2 and contains the lid 3 in this circulatory flow path 20, and one is installed in the fluid that is used to transfer heat in this circulatory flow path 20.
In the present embodiment, this metallic plate 2 is that one to comprise 97% copper metal and thickness be the sheet metal of 1.25mm before making.As shown in Figure 3, generally be used to make the metallic plate 2 that electrically connects usefulness, mostly be the large-scale scale copper of getting earlier as 22cm * 26cm, after being divided into several blocks 23 earlier, again simultaneously in respectively forming the hollow out zone with identical pattern on this block 23, cutting and separating in addition subsequently, and be that unit finishes final product with this block 23 respectively.So in the following description, though be to make single micro flow channel device 1 with single metal plate 2, have the knack of this skill person when guessing easily, the present invention also can make a plurality of micro flow channel devices 1 with single metal plate 2 certainly simultaneously.
As shown in Figure 1, this metallic plate 2 has one first basal plane 21 and second basal plane 22 in contrast to this first basal plane 21, in the present embodiment, this circulatory flow path 20 is to adopt etched mode, forming the groove that is extended toward these second basal plane, 22 directions by this first basal plane 21 on this metallic plate 2 is constituted, and remove the some of this metallic plate 2, but not as limit, it also can change to adopt as modes such as laser form this circulatory flow path 20 on this metallic plate 2.
As shown in Figure 2, this circulatory flow path 20 comprises the high temperature that low temperature that the heat radiation runner 202, of thermal-arrest runner 201, several contiguous these low-temperature spaces 92 of several contiguous these high-temperature regions 91 is communicated to these thermal-arrest runners 201 by these heat radiation runners 202 carries runner 203, to be communicated to these heat radiation runners 202 by these thermal-arrest runners 201 and carries runner 204, and one is communicated with this low temperature and carries runner 203 and this high temperature to carry the low temperature secondary fluid course 205 of runner 204.
This low temperature conveying runner 203 has the apotheca section 2031 of contiguous these heat radiation runners 202, so as to the required fluid of stocking system running, and the transportation section 2032 of this apotheca section 2031 of a connection and these thermal-arrest runners 201.
This high temperature carry runner 204 have several respectively with these thermal-arrest runners 201 wherein the variable cross-section section 2041 that is connected of segment set hot flow path 201, several throat's sections 2042,2042 ' that are connected with this variable cross-section section 2041 respectively respectively, an and mixing chamber region 2043 that is connected with all throat's sections 2042,2042 '.The sectional area of this variable cross-section section 2041 is greater than respectively this thermal-arrest runner 201 and the respectively sectional area of this transportation section 2032, and past respectively this throat's section 2042,2042 ' direction convergent.Respectively this throat's section 2042,2042 ' sectional area are then all less than the sectional area of this variable cross-section section 2041 respectively, and this low temperature secondary fluid course 205 is communicated on one of them throat's section 2042 ', and, directly be delivered to this mixing chamber region 2043 by this throat's section 2042 ' so as to making the part cryogen directly carry runner 203 under the situation of this high-temperature region 91 by this low temperature.
This high temperature carries runner 204 to have more the heavy in section section 2044 that several are connected with this mixing chamber region 2043, and several small bore sections 2045 that are connected with this heavy in section section 2044 respectively respectively, respectively the sectional area of this small bore section 2045 is less than the sectional area of this heavy in section section 2044 respectively, and contiguous these heat radiation runners 202; With respect to these small bore sections 2045,2044 of these heavy in section sections are away from these heat radiation runners 202.
As shown in Figures 1 and 2, this lid 3 is arranged on this first basal plane 21, and seals this circulatory flow path 20; In the present embodiment, this lid 3 is another metallic plate, but is not as limit, and the shape of this lid 3 and material etc. as long as have the material on a composition surface 31 that can engage with this metallic plate 2, all can be applicable among the present invention.Change speech, above-mentioned lid 3 also can be other any suitable shapes beyond the metallic plate, the object of material.
Above-mentioned fluid then is to be installed in this circulatory flow path 20, is passed to this low-temperature space 92 so as to the heat with this high-temperature region 91.In the present embodiment, this fluid is distilled water or deionized water, but not as limit, as the organic solvent of methyl alcohol and acetone etc., or other cooling agents (or refrigerant), even air also can be as the fluid that is used to transfer heat in this miniature circulatory flow device 1.Because this non-principal character of the present invention, and be to be familiar with this easy full of beard of operator institute to reach, so here no longer be described in detail.
From the above, when the fluid that for example is distilled water or deionized water etc. riddles in this circulatory flow path 20, because the sectional area of this apotheca section 2031 is greater than the sectional area of this transportation section 2032, this fluid major part will be stored in this apotheca section 2031, fluid temperature (F.T.) at this place is lower and be in a liquid state in the present embodiment, its temperature and environment temperature are approaching, and can flow to these thermal-arrest runners 201 via this transportation section 2032.Because this thermal-arrest runner 201 is area distribution, therefore make this fluid absorb the heat that these heater elements that are positioned at this high-temperature region 91 9 are produced easily.When so the accumulation of heat that produces when this heater element 9 causes temperature to raise the boiling point that surpasses working fluid (is about 100 ℃ of example with water), via heat exchange action, make heat by this absorption of fluids after, this fluid temperature (F.T.) will be raise, and and then make it be vapor state.And because the design of runner process, make the sectional area of these variable cross-section sections 2041 with respect to the sectional area of these thermal-arrest runners 201 and this transportation section 2032 for big, so relative pressure is lower, therefore the fluid that is vapor state that is positioned at these thermal-arrest runners 201 just flows toward these variable cross-section sections 2041 naturally, and simultaneously the cryogen in this transportation section 2032 is produced the strength of drawing, and then make that being positioned at this low temperature carries the fluid of runner 203 to flow toward these thermal-arrest runner 201 directions.
And this absorption heat and the fluid that is vapor state flow to these throat's sections 2042 by these variable cross-section sections 2041, in the time of 2042 ', reason owing to the sectional area convergent, to make this fluid quicken gradually to flow, and in respectively this throat's section 2042 of flowing through, produce in the time of 2042 ' at a high speed, to produce relatively low pressure because of high-velocity fluid this moment, therefore will make the low pressure that results from this throat's section 2042 ' that the fluid in this low temperature secondary fluid course 205 is produced one and draw strength, and the fluid liquid that will be positioned at this low temperature secondary fluid course 205 sucks this throat's section 2042 ', and with by this throat's section 2042 respectively, 2042 ' the vapor state fluid that flows out together flows into this mixing chamber region 2043.
Therefore, though being positioned at the fluid temperature (F.T.) of this mixing chamber region 2043 descends, but it is the effect that cryogen and high temperature fluid thermal balance are caused, not really with heat by shifting out in the fluid, therefore still must carry runner 204 be directed in these heat radiation runners 202 by this high temperature the fluids in this mixing chamber region 2043 and dispel the heat.Because respectively the sectional area of this small bore section 2045 is less than the sectional area of this heavy in section section 2044 respectively, therefore the capillary force of fluid in this small bore section 2045 respectively is greater than the capillary force of this heavy in section section 2044 respectively, therefore be positioned at the fluid of this mixing chamber region 2043 can be naturally by the attraction of capillary force via this small bore section 2045 respectively of these heavy in section section 2044 flow directions respectively, flow into these heat radiation runners 202 at last, the heat that fluid absorbed is sent to this low-temperature space 92 by heat exchange action, and finishes the transfer of heat.
Above-mentioned thermal-arrest runner 201 sectional areas are less, and its purpose is to draw cryogen in this transportation section 2032 by capillarity, and most these thermal-arrest runners 201 are set simultaneously increases gross areas that its distributed areas included, to reach better thermal-arrest effect.In addition, the total sectional area of above-mentioned thermal-arrest runner 201 is also relatively greater than the sectional area of this transportation section 2032, with ccontaining cryogen of coming, and reach flow velocity when reducing it and being positioned at this thermal-arrest runner 201 respectively simultaneously, make it can carry out heat exchange fully by this transportation section 2032 streams.
Certainly, the present invention is not exceeded with the foregoing description, and as Fig. 4 and shown in Figure 5, this metallic plate 2 also can be formed with several flow-disturbing lugs 24 in single thermal-arrest runner 201, increases so as to the contact area that makes this fluid and this metallic plate 2, makes adsorption phenomena more remarkable.Certainly, these flow-disturbing lugs 24 also can be formed at this lid 3 simultaneously and correspond to locating of this thermal-arrest runner 201, to strengthen the adsorption phenomena of this fluid in this thermal-arrest runner 201.
In addition, this low temperature secondary fluid course 205 shown in Figure 1, this throat's section 2042,2042 ' respectively, and this mixing chamber region 2043 is supporting settings, its purpose is positioned at the cryogen of this apotheca section 2031 and mixes with the high temperature fluid that is flowed out by these thermal-arrest runners 201 in guiding, and reach the purpose of fast cooling, make this high-temperature stream physical efficiency flow out this 91 backs, high-temperature region cooling rapidly.This low temperature secondary fluid course 205 of thought, respectively this throat's section 2042,2042 ', and this mixing chamber region 2043 be inessential element also, still can not implement the present invention if said elements is set.
Manufacture method as for the above-mentioned miniature circulatory flow device made from metallic plate 1 then as shown in Figure 6, comprises the following step:
Step 100, as shown in Figure 7, preparation one has the light shield 6 of a predetermined pattern 60; The image that this predetermined pattern 60 is had is the projected image of above-mentioned circulatory flow path 20 (see figure 2)s.
Step 102 is coated with a photoresist layer 62 on first basal plane 21 of this metallic plate 2;
Step 104 as shown in Figure 8, is transferred on this photoresist layer 62 with the mode of exposure imaging this predetermined pattern 60 with this light shield 61.Just finish via above-mentioned steps 100 to step 104 this predetermined pattern 60 is defined in step on this metallic plate 2.
Step 106, as shown in Figure 9, with this photoresist layer 62 is shade, and remove the some of this metallic plate 2 corresponding to this predetermined pattern 60 in etched mode, it is wide to form this 100 μ m, by this first basal plane 21 to these second basal plane, 22 directions extend 100 μ m dark partly lose circulatory flow path 20, remove this photoresist layer 62 subsequently again.Certainly, the wide dark size of above-mentioned runner is not as limit, and it can change according to system requirements.
Step 108 is carried out surface treatment to this metallic plate 2.Be after cleaning this metallic plate 2 with 5% dilute nitric acid solution, to dry with the clear water flushing again, in the present embodiment to remove the impurity that these metallic plate 2 surfaces attach.
Step 110, as shown in figure 10, plating is established a wlding 7 on this metallic plate 2.In the present embodiment, be to deposit the thick gun-metal of 6 μ m on this metallic plate 2 with plating mode.Certainly, plate the mode of establishing this wlding 7 and do not exceed, also can adopt other modes such as evaporation and sputter with plating; Simultaneously, the material of this wlding 7 also can be to substitute as other low-melting-point metals such as tin metal and tin-indium alloy etc. and gun-metals.
And the thickness of this wlding 7 also non-limiting be 6 μ m because this wlding 7 is in subsequent step, form Jie's metal in this metallic plate 2 and this lid 3 (see figure 1) places of being adjacent to each other, thus its thickness in the scope of 2 μ m to 10 μ m than reaching desirable strength.What need be illustrated is, when adopting electric plating method to deposit this wlding 7, though be difficult to avoid make this wlding 7 of part to enter in this circulatory flow path 20, but, therefore will be unlikely to influence the desired effect of these circulatory flow path 20 designs because its thickness is minimum with respect to the size in this circulatory flow path 20.
Step 112 as shown in figure 11, is posted by this lid 3 of containing this circulatory flow path 20 on this wlding 7.
Step 114, heating makes this wlding 7 be molten condition, applies one simultaneously and makes this lid 3 and the approaching mutually strength of this metallic plate 2, so that this lid 3 is fixed on this metallic plate 2.Because of this wlding 7 in the present embodiment is a gun-metal, thus this step be with hot press in 60 minutes time, apply and keep 40kg/cm 2Pressure, and be heated to 200 ℃ to 250 ℃ temperature range, make this wlding 7 and the contact site of this metallic plate 2 and this lid 3 form Jie's metal, thereby this metallic plate 2 and this lid 3 be engaged with each other.
To step 114, the lid 3 that just this can be contained this circulatory flow path 20 is fixedly arranged on this metallic plate 2 as illustrated in fig. 1, forms this micro flow channel device 1 through above-mentioned steps 110.
Usually in above-mentioned manufacturing process, can reserve a perforation that is in communication with the outside (figure does not show),, fluid be injected in this circulatory flow path 20 so that after finishing above-mentioned steps.Though if design flows in fluid in this micro flow channel with air for this, as long as in above-mentioned manufacturing process is not the use high vacuum furnace, then air occupies space in this circulatory flow path 20 naturally in manufacturing process, and after this circulatory flow path 20 forms, just be present in simultaneously in this circulatory flow path 20.But if set firmly this lid 3 on this metallic plate 2 time near the low-pressure state of vacuum the time, then still must reserve one and bore a hole and enter in this circulatory flow path 20 for air.
From the above, this lid 3 can directly adopt another metallic plate, therefore, as shown in figure 12, another embodiment of present embodiment is before step 112, is formed with a channel 33 corresponding to this circulatory flow path 20 earlier in this lid 3 contiguous these metallic plate 2 sides, so that this lid 3 is posted by this wlding 7 (seeing Figure 11) in step 112 when going up, it is logical that this circulatory flow path 20 and this channel 33 are connected with each other, to increase the sectional area in this circulatory flow path 20.And this lid 3 forms the mode of above-mentioned channel 33, then similarly can adopt above-mentioned steps 100 to the mode of step 106 to form.
It should be noted that, the mode of above-mentioned affixed this lid 3 and this metallic plate 2, though belong to the technical field of low-temperature welding, its affixed mode is as limit, the eutectic welding connection that other comprise diffusion soft soldering etc. can be applicable among the present invention too.In fact, as long as other can make this lid 3 be fixedly arranged on mode on this metallic plate 2, as gluing, welding, or, all can be applicable among the present invention with methods such as anchor clamps are fixing.
But it is noted that,, then certainly adopt methods such as above-mentioned gluing and general welding if the operating temperature of these circulatory flow path 20 designs is lower than the melting temperature of the joint material of selecting for use; Wherein, if adopt the material of the employed tin cream of general electronic industry as this wlding 7 (seeing Figure 11), then at 110 energy of above-mentioned steps with wire mark or revolve modes such as plating this wlding 7 is coated on this metallic plate 2.If the operating temperature of this circulatory flow path 20 designs is higher, then except above-mentioned method, also can adopt method of brazing to carry out engaging of this lid 3 and this metallic plate 2 in addition with low-temperature welding.
As shown in figure 13, another embodiment of present embodiment, this miniature circulatory flow device 1 comprise that more several are arranged at the radiating fin 4 of contiguous these heat radiation runners 202 on this lid 3, so as to promoting radiating efficiency.In the present embodiment, this miniature circulatory flow device 1 is directly to be posted by on this heater element 9 with this metallic plate 2, so these radiating fins 4 just are arranged on this metallic plate 2 this lid 3 away from these heater element 9 sides.Certainly, the position that these radiating fins 4 are set is as limit, and can be in response to being equipped with in any suitable position; For example when this miniature circulatory flow device 1 be when directly being posted by on this heater element 9 with this lid 3, then these radiating fins 4 can certainly change and are located on this metallic plate 2 this second basal plane 22 away from this lid 3, equally also can reach the effect that promotes this miniature circulatory flow device 1 radiating efficiency.
As shown in figure 14, the another embodiment of present embodiment, this miniature circulatory flow device 1 comprise that more one carries runner 203 to be connected with this low temperature and so as to driving this fluid mobile drive unit 5 in this circulatory flow path 20 in.Similarly, the also inessential element of this drive unit 5, this miniature circulatory flow device 1 does not need the driving force that adds from the above, just heat can be passed to this low-temperature space 92 by this high-temperature region 91.But, because this high-temperature region 91 must reach the effect that can make this miniature circulatory flow device 1 reach the transfer of above-mentioned heat naturally more than the certain high temperature (typically referring to boiling point near this fluid at this so-called high temperature), therefore, can not cool off by this miniature circulatory flow device 1 when these high-temperature region 91 temperature reach above-mentioned high temperature if wish, perhaps desire is carried out other control to this miniature circulatory flow device 1, then can be reached by this drive unit 5 is set.
As Figure 15 and shown in Figure 16, the main element of second preferred embodiment of the miniature circulatory flow device 1 of the present invention and above-mentioned first preferred embodiment are roughly the same, and are to be used for heat is passed to a low-temperature space 92 by a high-temperature region 91 equally.Its difference is, in the present embodiment, this miniature circulatory flow device 1 comprises several metallic plates 2,2 ', one adjacent one another are and that be formed with this circulatory flow path 20 and is fixedly arranged on base plate 8 on these metallic plates 2,2 ' one of them metallic plate 2, and one is covered on the wherein lid 3 on another metallic plate 2 ' of these metallic plates 2,2 '; This base plate 8 is all contained this circulatory flow path 20 with this lid 3.This circulatory flow path 20 can be divided into a major cycle flow passage route 2001 and an inferior circulatory flow path 2002 that is connected with this major cycle flow passage route 2001, wherein, this major cycle flow passage route 2001 is formed at these metallic plates 2,2 ' and wherein is close on the metallic plate 2 of this base plate 8, and this time circulatory flow path 2002 then is to be formed at these metallic plates 2,2 ' wherein to be close on another metallic plate 2 ' of this lid 3.So this circulatory flow path 20 that these metallic plates 2,2 ' are defined is not limited on the same plane, but is stereoscopic-state; And in the present embodiment, this base plate 8 and this lid 3 are similarly another metallic plate identical with above-mentioned metallic plate 2, but are not as limit; This high-temperature region 91 and this low-temperature space 92 then lay respectively at the two opposite sides of this miniature circulatory flow device 1.
This major cycle flow passage route 2001 comprises heat radiation runner 202, a low temperature that is communicated with these heat radiation runners 202 of several contiguous low-temperature spaces 92 and carries runner 203, and a low temperature secondary fluid course 205 that is connected with this low temperature conveying runner 203; This time circulatory flow path 2002 then comprises contiguous this high-temperature region 91 and carries thermal-arrest runner that runner 203 is connected 201, to be communicated to these heat radiation runners 202 and to be carried runner 204 with the high temperature that this low temperature carries runner 203 to be connected by these thermal-arrest runners 201 with this low temperature.Therefore, the circulatory flow path 20 that is made of this major cycle flow passage route 2001 and this time circulatory flow path 2002 in the present embodiment just has the effect that the circulatory flow path 20 with above-mentioned first preferred embodiment is had.
The preparation method manufacturing that this miniature circulatory flow device 1 with the circulatory flow path 20 that is stereoscopic-state is introduced in can above-mentioned first preferred embodiment, as shown in figure 17, introduce the preparation method that another also can be applied to the various miniature circulatory flow device 1 of the present invention with next, it comprises the following step:
Step 300 as shown in figure 18, removes the some of this metallic plate 2 in the mechanical stamping mode, forms this major cycle flow passage route 2001 that this runs through this metallic plate 2.
Step 302 is carried out surface treatment to this metallic plate 2.
Step 304 as shown in figure 19, is posted by this base plate 8 of containing this major cycle flow passage route 2001 on this metallic plate 2.
Step 306 heats this metallic plate 2 and this base plate 8 near molten condition, applies one simultaneously and makes this base plate 8 and the approaching mutually strength of this metallic plate 2, and this base plate 8 is fixedly arranged on this metallic plate 2.This step is 5 * 10 with high vacuum furnace in the present embodiment -5Under the environment of Torr, apply the strength of 4000Pa, and be heated to, keep engaging in 10 hours to 950 ℃.Certainly, the method that this base plate 8 is fixedly arranged on this metallic plate 2 is not as limit, and it also can adopt the described arbitrary joint method of first embodiment; But be noted that it engages temperature and pressure that temperature that the back is suitable for and intensity need meet in the subsequent step to be taken place.
Step 308, as shown in figure 20, set firmly this another metallic plate 2 ' that is formed with this time circulatory flow path 2002 and be formed with on the metallic plate 2 of this major cycle flow passage route 2001, and this time circulatory flow path 2002 is connected with this major cycle flow passage route 2001 in this; And these metallic plates 2,2 ' affixed mode can adopt aforesaid arbitrary joint method to finish.
Step 310 as shown in figure 21, sets firmly this lid 3 and is formed with on the metallic plate 2 ' in this time circulatory flow path 2002 in this, and its affixed mode can adopt aforesaid arbitrary joint method to finish.
Step 312 is injected this fluid and is entered in this circulatory flow path 20, to finish this cooling device 1.This step is to reserve in these metallic plates 2,2 ', this base plate 8 by original, or the perforation on this lid 3 (figure does not show), and this fluid is injected in this circulatory flow path 20.
Because so above-mentioned major cycle flow passage route 2001 contiguous these base plates 8 that comprise these heat radiation runners 202 as shown in figure 22, comprise among another embodiment of several radiating fins 4 at present embodiment, these radiating fins are to be arranged on this base plate 8.Certainly, above-mentioned major cycle flow passage route 2001 also can adopt the mode of half erosion of introducing as first preferred embodiment directly to form on this metallic plate 2, and non-limiting mode of sealing these major cycle flow passage route 2001 with this base plate 8 forms; This moment, these radiating fins 4 then can directly be arranged on this metallic plate 2.
From the above, the miniature circulatory flow device 1 of the present invention can only not engage with another metallic plate as this lid 3 with a metallic plate 2 and form this circulatory flow path 20, can be with a metallic plate 2 and two engage as the metallic plate of this base plate 8 and this lid 3 respectively and form this circulatory flow path 20 in addition yet; More can be by repeating above-mentioned steps 308, a plurality of metallic plates are engaged with each other and form the circulatory flow path 20 that presents the stereo staggered pattern, make the design and the utilization of this miniature circulatory flow device 1 have more elasticity, and applied to various electronic equipments widely.
In addition, miniature circulatory flow device 1 decapacitation of the present invention is integrated outside the processing procedure of the ripe metallic plate of utilization prior art quickly and effectively, more can make full use of metallic plate and can criticize the advantage of making production in a large number, make production cost significantly reduce, successfully reach with lower production cost and make micron-sized circulatory flow path 20, even can be by superimposed stacked conducting plate 2, the purpose that has a miniature circulatory flow device 1 in three-dimensional circulatory flow path 20 with a large amount of batch makings of low cost is achieved.

Claims (20)

1. miniature circulatory flow device, it is contiguous high-temperature region and low-temperature space setting, and it comprises at least one metallic plate, and a lid, and fluid is characterized in that:
This metallic plate forms a circulatory flow path, this circulatory flow path comprises the low temperature that the heat radiation runner, of the thermal-arrest runner of at least one contiguous high-temperature region, at least one contiguous low-temperature space is communicated to this thermal-arrest runner by this heat radiation runner and carries runner, and one is communicated to the high temperature conveying runner of this heat radiation runner by this thermal-arrest runner; This lid is fixedly arranged on this metallic plate and contains this circulatory flow path; This fluid is installed in this circulatory flow path, and this high temperature carry runner have at least one be connected with this thermal-arrest runner and sectional area greater than the variable cross-section section of the sectional area of this thermal-arrest runner.
2. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This miniature circulatory flow device comprises that several are formed with the metallic plate in this circulatory flow path.
3. the miniature circulatory flow device of metallic plate as claimed in claim 1 is characterized in that:
This lid is a metallic plate.
4. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This miniature circulatory flow device comprises that more one carries runner to be connected with this low temperature and drive the drive unit that this fluid flows in this circulatory flow path.
5. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This circulatory flow path comprises several thermal-arrest runners.
6. miniature circulatory flow device as claimed in claim 5 is characterized in that:
This high temperature carries runner to have several variable cross-section sections, and this thermal-arrest runner carries the variable cross-section section of runner to be connected with this high temperature respectively.
7. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This circulatory flow path comprises several heat radiation runners.
8. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This metallic plate more is formed with several flow-disturbing lugs in this thermal-arrest runner.
9. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This low temperature carries runner to have the apotheca section of contiguous this heat radiation runner, and the transportation section of this apotheca section of connection and this thermal-arrest runner, and the sectional area of this apotheca section is greater than the sectional area of this transportation section.
10. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This high temperature carries runner to have more a mixing chamber region; This circulatory flow path more comprises one and is communicated with this low temperature conveying runner and this mixing chamber region, makes this fluid of part directly carry runner to be delivered to the low temperature secondary fluid course of this mixing chamber region without this high-temperature region by this low temperature.
11. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This high temperature conveying runner has more a mixing chamber region and and is communicated with this variable cross-section section and this mixing chamber region and sectional area throat's section less than the sectional area of this variable cross-section section; This circulatory flow path more comprises this low temperature of connection and carries runner and this throat's section so that this fluid of part directly carries runner to be delivered to the low temperature secondary fluid course of this mixing chamber region without this high-temperature region by this low temperature.
12. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This high temperature carries runner to have one relatively away from the heavy in section section of this heat radiation runner, and at least one relative proximity runner and sectional area small bore section less than the sectional area of this heavy in section section of should dispelling the heat.
13. miniature circulatory flow device as claimed in claim 12 is characterized in that:
This high temperature carries runner to have several small bore sections.
14. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This high temperature carries runner to have several relatively away from the heavy in section section of this heat radiation runner, and several relative proximities runner and sectional area small bore section less than the sectional area of this heavy in section section of should dispelling the heat.
15. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This fluid be air, methyl alcohol, acetone and water one of them.
16. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This miniature circulatory flow device comprises that more several are arranged at the radiating fin on this metallic plate.
17. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This miniature circulatory flow device comprises that more several are arranged at the radiating fin on this lid.
18. miniature circulatory flow device as claimed in claim 1 is characterized in that:
This miniature circulatory flow device comprises that more one is fixedly arranged on this lead frame and contains the base plate in this circulatory flow path.
19. miniature circulatory flow device as claimed in claim 18 is characterized in that:
This miniature circulatory flow device comprises that more several are arranged at the radiating fin on this base plate.
20. miniature circulatory flow device as claimed in claim 18 is characterized in that:
This base plate is a metallic plate.
CNB2004100300267A 2004-03-17 2004-03-17 Minisize circulating flow passage device made by lead frame Expired - Fee Related CN1301896C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2004100300267A CN1301896C (en) 2004-03-17 2004-03-17 Minisize circulating flow passage device made by lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2004100300267A CN1301896C (en) 2004-03-17 2004-03-17 Minisize circulating flow passage device made by lead frame

Publications (2)

Publication Number Publication Date
CN1669905A CN1669905A (en) 2005-09-21
CN1301896C true CN1301896C (en) 2007-02-28

Family

ID=35041383

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100300267A Expired - Fee Related CN1301896C (en) 2004-03-17 2004-03-17 Minisize circulating flow passage device made by lead frame

Country Status (1)

Country Link
CN (1) CN1301896C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102469748A (en) * 2010-11-12 2012-05-23 奇鋐科技股份有限公司 Improved runner structure of water cooling device
US20140198453A1 (en) * 2011-08-15 2014-07-17 Fan Zhang Mixing manifold and method
CN106017174B (en) * 2016-06-17 2018-05-04 浙江工业大学 A kind of dropwise condensation and the microcooler and its manufacture method to catchment certainly
CN109288523B (en) * 2018-10-12 2022-06-28 上海联影医疗科技股份有限公司 Radiating structure of transmitting coil and transmitting coil

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1158549A (en) * 1996-02-29 1997-09-03 中国科学院上海光学精密机械研究所 Microchannel cooling heat sink
US6437981B1 (en) * 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
CN1430099A (en) * 2001-12-31 2003-07-16 中国科学技术大学 Manufacturing method of micro-pipeline
US6610605B2 (en) * 2001-06-28 2003-08-26 Intel Corporation Method and apparatus for fabricating encapsulated micro-channels in a substrate
CN1464303A (en) * 2002-06-20 2003-12-31 中国科学院理化技术研究所 Process for preparing high polymer micro-flow control chips

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1158549A (en) * 1996-02-29 1997-09-03 中国科学院上海光学精密机械研究所 Microchannel cooling heat sink
US6437981B1 (en) * 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
US6610605B2 (en) * 2001-06-28 2003-08-26 Intel Corporation Method and apparatus for fabricating encapsulated micro-channels in a substrate
CN1430099A (en) * 2001-12-31 2003-07-16 中国科学技术大学 Manufacturing method of micro-pipeline
CN1464303A (en) * 2002-06-20 2003-12-31 中国科学院理化技术研究所 Process for preparing high polymer micro-flow control chips

Also Published As

Publication number Publication date
CN1669905A (en) 2005-09-21

Similar Documents

Publication Publication Date Title
US9803938B2 (en) Cooling assemblies having porous three dimensional surfaces
US20080190586A1 (en) Carbon-based waterblock with attached heat exchanger for cooling of electronic devices
CN1163978C (en) Method of manufacturing thermionic element
CN105865243A (en) Novel flat plate thiele tube and preparation method thereof
WO2011087028A1 (en) Substrate with integrated fins and method of manufacturing substrate with integrated fins
CN1768425A (en) Electronic assemblies with fluid cooling and associated methods
KR20090004836A (en) Heat transfer member, protruding structural member, electronic device, and electric product
JP2007294554A (en) Convex structural member
CN1506649A (en) Heat-transfer apparatus and electronic apparatus
CN1805133A (en) Plate-type heat-pipe radiator
CN1946958A (en) Method for producing lamellae for a lamellar seal
JP2008543112A5 (en)
CN1689180A (en) Honeycomb structure and method for production of said structure
CN1479855A (en) Cooling device, electronic device and method of manufacturing cooling device
CN1551340A (en) Semiconductor device and its manufacturing method
CN1301896C (en) Minisize circulating flow passage device made by lead frame
CN110769647B (en) Manufacturing method of vapor chamber
CN109411431A (en) A kind of heat exchange structure and preparation method thereof
CN1301043C (en) Circuit device and its mfg. method
JP2017143094A (en) Heat sink, thermoelectric conversion module, method of manufacturing heat sink
CN1301897C (en) Method for making minisize flow passage by lead frame technology
CN2791701Y (en) Peltier moudle
CN2765440Y (en) Plate type air heat pipe radiator
CN1571624A (en) Miniature circulating flow passage system and manufacturing method thereof
JP2002314013A (en) Heat dissipating material and method for manufacturing the same

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: QI SCIENCE & TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: SHENG DA TECHNOLOGY, INC.

Effective date: 20070928

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20070928

Address after: Kaohsiung city of Taiwan Province

Patentee after: Qihong Sci-Tech Co., Ltd.

Address before: Taipei County of Taiwan Province

Patentee before: Shengda Science and Technology Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070228

Termination date: 20170317

CF01 Termination of patent right due to non-payment of annual fee