[summary of the invention]
Main purpose of the present invention is that a kind of miniature circulatory flow device made from metallic plate is being provided.
Another object of the present invention is but that a kind of miniature circulatory flow device of batch making is being provided.
Another purpose of the present invention is that a kind of miniature circulatory flow device that is used for the heat transfer is being provided.
A further object of the present invention is but a kind of batch making to be provided and to present the miniature circulatory flow device of stereoscopic-state.
In order to achieve the above object, the invention provides a kind of miniature circulatory flow device made from metallic plate, it is contiguous high-temperature region and low-temperature space setting, and it comprises at least one metallic plate, and a lid, and fluid is characterized in that:
This metallic plate forms a circulatory flow path, this circulatory flow path comprises the low temperature that the heat radiation runner, of the thermal-arrest runner of at least one contiguous high-temperature region, at least one contiguous low-temperature space is communicated to this thermal-arrest runner by this heat radiation runner and carries runner, and one is communicated to the high temperature conveying runner of this heat radiation runner by this thermal-arrest runner; This lid is fixedly arranged on this metallic plate and contains this circulatory flow path; This fluid is installed in this circulatory flow path, is passed to this low-temperature space with the heat with this high-temperature region, and this high temperature carry runner can have at least one be connected with this thermal-arrest runner and sectional area greater than the variable cross-section section of the sectional area of this thermal-arrest runner.
The miniature circulatory flow device made from metallic plate of the present invention can also have following additional technical characterictic:
This miniature circulatory flow device can comprise that several are formed with the metallic plate in this circulatory flow path.
This lid can be a metallic plate.
This miniature circulatory flow device can comprise that more one carries runner to be connected with this low temperature and drive the drive unit that this fluid flows in this circulatory flow path.
This circulatory flow path can comprise several thermal-arrest runners.
This high temperature carries runner can have several variable cross-section sections, and this thermal-arrest runner carries the variable cross-section section of runner to be connected with this high temperature respectively.
This circulatory flow path can comprise several heat radiation runners.
This metallic plate more can be formed with several flow-disturbing lugs in this thermal-arrest runner.
This low temperature carries runner can have the apotheca section of contiguous this heat radiation runner, and the transportation section of this apotheca section of connection and this thermal-arrest runner, and the sectional area of this apotheca section is greater than the sectional area of this transportation section.
This high temperature carries runner more can have a mixing chamber region; This circulatory flow path more comprises one and is communicated with this low temperature conveying runner and this mixing chamber region, makes this fluid of part directly carry runner to be delivered to the low temperature secondary fluid course of this mixing chamber region without this high-temperature region by this low temperature.
This high temperature conveying runner more can have a mixing chamber region and and be communicated with this variable cross-section section and this mixing chamber region and sectional area throat's section less than the sectional area of this variable cross-section section; This circulatory flow path more comprises this low temperature of connection and carries runner and this throat's section so that this fluid of part directly carries runner to be delivered to the low temperature secondary fluid course of this mixing chamber region without this high-temperature region by this low temperature.
This high temperature carries runner can have one relatively away from the heavy in section section of this heat radiation runner, and at least one relative proximity runner and sectional area small bore section less than the sectional area of this heavy in section section of should dispelling the heat.
This high temperature carries runner can have several small bore sections.
This high temperature carries runner can have several relatively away from the heavy in section section of this heat radiation runner, and several relative proximities runner and sectional area small bore section less than the sectional area of this heavy in section section of should dispelling the heat.
This fluid can be air or methyl alcohol or acetone or water.
This miniature circulatory flow device can comprise that more several are arranged at the radiating fin on this metallic plate.
This miniature circulatory flow device can comprise that more several are arranged at the radiating fin on this lid.
This miniature circulatory flow device can comprise that more one is fixedly arranged on this metallic plate and contains the base plate in this circulatory flow path.
This miniature circulatory flow device can comprise that more several are arranged at the radiating fin on this base plate.
This base plate can be a metallic plate.
[specific embodiment]
About aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to two graphic preferred embodiments, can clearly understand.Before proposing detailed description, be noted that in the following description similar elements is to represent with identical numbering.
As shown in Figures 1 and 2, first preferred embodiment of the miniature circulatory flow device 1 of the present invention, be on the heater element 9 that is arranged at just like wafer, be passed to a low-temperature space 92 with heat by a high-temperature region 91 with its generation, this miniature circulatory flow device 1 comprises that a metallic plate 2, that is formed with a circulatory flow path 20 is fixedly arranged on this metallic plate 2 and contains the lid 3 in this circulatory flow path 20, and one is installed in the fluid that is used to transfer heat in this circulatory flow path 20.
In the present embodiment, this metallic plate 2 is that one to comprise 97% copper metal and thickness be the sheet metal of 1.25mm before making.As shown in Figure 3, generally be used to make the metallic plate 2 that electrically connects usefulness, mostly be the large-scale scale copper of getting earlier as 22cm * 26cm, after being divided into several blocks 23 earlier, again simultaneously in respectively forming the hollow out zone with identical pattern on this block 23, cutting and separating in addition subsequently, and be that unit finishes final product with this block 23 respectively.So in the following description, though be to make single micro flow channel device 1 with single metal plate 2, have the knack of this skill person when guessing easily, the present invention also can make a plurality of micro flow channel devices 1 with single metal plate 2 certainly simultaneously.
As shown in Figure 1, this metallic plate 2 has one first basal plane 21 and second basal plane 22 in contrast to this first basal plane 21, in the present embodiment, this circulatory flow path 20 is to adopt etched mode, forming the groove that is extended toward these second basal plane, 22 directions by this first basal plane 21 on this metallic plate 2 is constituted, and remove the some of this metallic plate 2, but not as limit, it also can change to adopt as modes such as laser form this circulatory flow path 20 on this metallic plate 2.
As shown in Figure 2, this circulatory flow path 20 comprises the high temperature that low temperature that the heat radiation runner 202, of thermal-arrest runner 201, several contiguous these low-temperature spaces 92 of several contiguous these high-temperature regions 91 is communicated to these thermal-arrest runners 201 by these heat radiation runners 202 carries runner 203, to be communicated to these heat radiation runners 202 by these thermal-arrest runners 201 and carries runner 204, and one is communicated with this low temperature and carries runner 203 and this high temperature to carry the low temperature secondary fluid course 205 of runner 204.
This low temperature conveying runner 203 has the apotheca section 2031 of contiguous these heat radiation runners 202, so as to the required fluid of stocking system running, and the transportation section 2032 of this apotheca section 2031 of a connection and these thermal-arrest runners 201.
This high temperature carry runner 204 have several respectively with these thermal-arrest runners 201 wherein the variable cross-section section 2041 that is connected of segment set hot flow path 201, several throat's sections 2042,2042 ' that are connected with this variable cross-section section 2041 respectively respectively, an and mixing chamber region 2043 that is connected with all throat's sections 2042,2042 '.The sectional area of this variable cross-section section 2041 is greater than respectively this thermal-arrest runner 201 and the respectively sectional area of this transportation section 2032, and past respectively this throat's section 2042,2042 ' direction convergent.Respectively this throat's section 2042,2042 ' sectional area are then all less than the sectional area of this variable cross-section section 2041 respectively, and this low temperature secondary fluid course 205 is communicated on one of them throat's section 2042 ', and, directly be delivered to this mixing chamber region 2043 by this throat's section 2042 ' so as to making the part cryogen directly carry runner 203 under the situation of this high-temperature region 91 by this low temperature.
This high temperature carries runner 204 to have more the heavy in section section 2044 that several are connected with this mixing chamber region 2043, and several small bore sections 2045 that are connected with this heavy in section section 2044 respectively respectively, respectively the sectional area of this small bore section 2045 is less than the sectional area of this heavy in section section 2044 respectively, and contiguous these heat radiation runners 202; With respect to these small bore sections 2045,2044 of these heavy in section sections are away from these heat radiation runners 202.
As shown in Figures 1 and 2, this lid 3 is arranged on this first basal plane 21, and seals this circulatory flow path 20; In the present embodiment, this lid 3 is another metallic plate, but is not as limit, and the shape of this lid 3 and material etc. as long as have the material on a composition surface 31 that can engage with this metallic plate 2, all can be applicable among the present invention.Change speech, above-mentioned lid 3 also can be other any suitable shapes beyond the metallic plate, the object of material.
Above-mentioned fluid then is to be installed in this circulatory flow path 20, is passed to this low-temperature space 92 so as to the heat with this high-temperature region 91.In the present embodiment, this fluid is distilled water or deionized water, but not as limit, as the organic solvent of methyl alcohol and acetone etc., or other cooling agents (or refrigerant), even air also can be as the fluid that is used to transfer heat in this miniature circulatory flow device 1.Because this non-principal character of the present invention, and be to be familiar with this easy full of beard of operator institute to reach, so here no longer be described in detail.
From the above, when the fluid that for example is distilled water or deionized water etc. riddles in this circulatory flow path 20, because the sectional area of this apotheca section 2031 is greater than the sectional area of this transportation section 2032, this fluid major part will be stored in this apotheca section 2031, fluid temperature (F.T.) at this place is lower and be in a liquid state in the present embodiment, its temperature and environment temperature are approaching, and can flow to these thermal-arrest runners 201 via this transportation section 2032.Because this thermal-arrest runner 201 is area distribution, therefore make this fluid absorb the heat that these heater elements that are positioned at this high-temperature region 91 9 are produced easily.When so the accumulation of heat that produces when this heater element 9 causes temperature to raise the boiling point that surpasses working fluid (is about 100 ℃ of example with water), via heat exchange action, make heat by this absorption of fluids after, this fluid temperature (F.T.) will be raise, and and then make it be vapor state.And because the design of runner process, make the sectional area of these variable cross-section sections 2041 with respect to the sectional area of these thermal-arrest runners 201 and this transportation section 2032 for big, so relative pressure is lower, therefore the fluid that is vapor state that is positioned at these thermal-arrest runners 201 just flows toward these variable cross-section sections 2041 naturally, and simultaneously the cryogen in this transportation section 2032 is produced the strength of drawing, and then make that being positioned at this low temperature carries the fluid of runner 203 to flow toward these thermal-arrest runner 201 directions.
And this absorption heat and the fluid that is vapor state flow to these throat's sections 2042 by these variable cross-section sections 2041, in the time of 2042 ', reason owing to the sectional area convergent, to make this fluid quicken gradually to flow, and in respectively this throat's section 2042 of flowing through, produce in the time of 2042 ' at a high speed, to produce relatively low pressure because of high-velocity fluid this moment, therefore will make the low pressure that results from this throat's section 2042 ' that the fluid in this low temperature secondary fluid course 205 is produced one and draw strength, and the fluid liquid that will be positioned at this low temperature secondary fluid course 205 sucks this throat's section 2042 ', and with by this throat's section 2042 respectively, 2042 ' the vapor state fluid that flows out together flows into this mixing chamber region 2043.
Therefore, though being positioned at the fluid temperature (F.T.) of this mixing chamber region 2043 descends, but it is the effect that cryogen and high temperature fluid thermal balance are caused, not really with heat by shifting out in the fluid, therefore still must carry runner 204 be directed in these heat radiation runners 202 by this high temperature the fluids in this mixing chamber region 2043 and dispel the heat.Because respectively the sectional area of this small bore section 2045 is less than the sectional area of this heavy in section section 2044 respectively, therefore the capillary force of fluid in this small bore section 2045 respectively is greater than the capillary force of this heavy in section section 2044 respectively, therefore be positioned at the fluid of this mixing chamber region 2043 can be naturally by the attraction of capillary force via this small bore section 2045 respectively of these heavy in section section 2044 flow directions respectively, flow into these heat radiation runners 202 at last, the heat that fluid absorbed is sent to this low-temperature space 92 by heat exchange action, and finishes the transfer of heat.
Above-mentioned thermal-arrest runner 201 sectional areas are less, and its purpose is to draw cryogen in this transportation section 2032 by capillarity, and most these thermal-arrest runners 201 are set simultaneously increases gross areas that its distributed areas included, to reach better thermal-arrest effect.In addition, the total sectional area of above-mentioned thermal-arrest runner 201 is also relatively greater than the sectional area of this transportation section 2032, with ccontaining cryogen of coming, and reach flow velocity when reducing it and being positioned at this thermal-arrest runner 201 respectively simultaneously, make it can carry out heat exchange fully by this transportation section 2032 streams.
Certainly, the present invention is not exceeded with the foregoing description, and as Fig. 4 and shown in Figure 5, this metallic plate 2 also can be formed with several flow-disturbing lugs 24 in single thermal-arrest runner 201, increases so as to the contact area that makes this fluid and this metallic plate 2, makes adsorption phenomena more remarkable.Certainly, these flow-disturbing lugs 24 also can be formed at this lid 3 simultaneously and correspond to locating of this thermal-arrest runner 201, to strengthen the adsorption phenomena of this fluid in this thermal-arrest runner 201.
In addition, this low temperature secondary fluid course 205 shown in Figure 1, this throat's section 2042,2042 ' respectively, and this mixing chamber region 2043 is supporting settings, its purpose is positioned at the cryogen of this apotheca section 2031 and mixes with the high temperature fluid that is flowed out by these thermal-arrest runners 201 in guiding, and reach the purpose of fast cooling, make this high-temperature stream physical efficiency flow out this 91 backs, high-temperature region cooling rapidly.This low temperature secondary fluid course 205 of thought, respectively this throat's section 2042,2042 ', and this mixing chamber region 2043 be inessential element also, still can not implement the present invention if said elements is set.
Manufacture method as for the above-mentioned miniature circulatory flow device made from metallic plate 1 then as shown in Figure 6, comprises the following step:
Step 100, as shown in Figure 7, preparation one has the light shield 6 of a predetermined pattern 60; The image that this predetermined pattern 60 is had is the projected image of above-mentioned circulatory flow path 20 (see figure 2)s.
Step 102 is coated with a photoresist layer 62 on first basal plane 21 of this metallic plate 2;
Step 104 as shown in Figure 8, is transferred on this photoresist layer 62 with the mode of exposure imaging this predetermined pattern 60 with this light shield 61.Just finish via above-mentioned steps 100 to step 104 this predetermined pattern 60 is defined in step on this metallic plate 2.
Step 106, as shown in Figure 9, with this photoresist layer 62 is shade, and remove the some of this metallic plate 2 corresponding to this predetermined pattern 60 in etched mode, it is wide to form this 100 μ m, by this first basal plane 21 to these second basal plane, 22 directions extend 100 μ m dark partly lose circulatory flow path 20, remove this photoresist layer 62 subsequently again.Certainly, the wide dark size of above-mentioned runner is not as limit, and it can change according to system requirements.
Step 108 is carried out surface treatment to this metallic plate 2.Be after cleaning this metallic plate 2 with 5% dilute nitric acid solution, to dry with the clear water flushing again, in the present embodiment to remove the impurity that these metallic plate 2 surfaces attach.
Step 110, as shown in figure 10, plating is established a wlding 7 on this metallic plate 2.In the present embodiment, be to deposit the thick gun-metal of 6 μ m on this metallic plate 2 with plating mode.Certainly, plate the mode of establishing this wlding 7 and do not exceed, also can adopt other modes such as evaporation and sputter with plating; Simultaneously, the material of this wlding 7 also can be to substitute as other low-melting-point metals such as tin metal and tin-indium alloy etc. and gun-metals.
And the thickness of this wlding 7 also non-limiting be 6 μ m because this wlding 7 is in subsequent step, form Jie's metal in this metallic plate 2 and this lid 3 (see figure 1) places of being adjacent to each other, thus its thickness in the scope of 2 μ m to 10 μ m than reaching desirable strength.What need be illustrated is, when adopting electric plating method to deposit this wlding 7, though be difficult to avoid make this wlding 7 of part to enter in this circulatory flow path 20, but, therefore will be unlikely to influence the desired effect of these circulatory flow path 20 designs because its thickness is minimum with respect to the size in this circulatory flow path 20.
Step 112 as shown in figure 11, is posted by this lid 3 of containing this circulatory flow path 20 on this wlding 7.
Step 114, heating makes this wlding 7 be molten condition, applies one simultaneously and makes this lid 3 and the approaching mutually strength of this metallic plate 2, so that this lid 3 is fixed on this metallic plate 2.Because of this wlding 7 in the present embodiment is a gun-metal, thus this step be with hot press in 60 minutes time, apply and keep 40kg/cm
2Pressure, and be heated to 200 ℃ to 250 ℃ temperature range, make this wlding 7 and the contact site of this metallic plate 2 and this lid 3 form Jie's metal, thereby this metallic plate 2 and this lid 3 be engaged with each other.
To step 114, the lid 3 that just this can be contained this circulatory flow path 20 is fixedly arranged on this metallic plate 2 as illustrated in fig. 1, forms this micro flow channel device 1 through above-mentioned steps 110.
Usually in above-mentioned manufacturing process, can reserve a perforation that is in communication with the outside (figure does not show),, fluid be injected in this circulatory flow path 20 so that after finishing above-mentioned steps.Though if design flows in fluid in this micro flow channel with air for this, as long as in above-mentioned manufacturing process is not the use high vacuum furnace, then air occupies space in this circulatory flow path 20 naturally in manufacturing process, and after this circulatory flow path 20 forms, just be present in simultaneously in this circulatory flow path 20.But if set firmly this lid 3 on this metallic plate 2 time near the low-pressure state of vacuum the time, then still must reserve one and bore a hole and enter in this circulatory flow path 20 for air.
From the above, this lid 3 can directly adopt another metallic plate, therefore, as shown in figure 12, another embodiment of present embodiment is before step 112, is formed with a channel 33 corresponding to this circulatory flow path 20 earlier in this lid 3 contiguous these metallic plate 2 sides, so that this lid 3 is posted by this wlding 7 (seeing Figure 11) in step 112 when going up, it is logical that this circulatory flow path 20 and this channel 33 are connected with each other, to increase the sectional area in this circulatory flow path 20.And this lid 3 forms the mode of above-mentioned channel 33, then similarly can adopt above-mentioned steps 100 to the mode of step 106 to form.
It should be noted that, the mode of above-mentioned affixed this lid 3 and this metallic plate 2, though belong to the technical field of low-temperature welding, its affixed mode is as limit, the eutectic welding connection that other comprise diffusion soft soldering etc. can be applicable among the present invention too.In fact, as long as other can make this lid 3 be fixedly arranged on mode on this metallic plate 2, as gluing, welding, or, all can be applicable among the present invention with methods such as anchor clamps are fixing.
But it is noted that,, then certainly adopt methods such as above-mentioned gluing and general welding if the operating temperature of these circulatory flow path 20 designs is lower than the melting temperature of the joint material of selecting for use; Wherein, if adopt the material of the employed tin cream of general electronic industry as this wlding 7 (seeing Figure 11), then at 110 energy of above-mentioned steps with wire mark or revolve modes such as plating this wlding 7 is coated on this metallic plate 2.If the operating temperature of this circulatory flow path 20 designs is higher, then except above-mentioned method, also can adopt method of brazing to carry out engaging of this lid 3 and this metallic plate 2 in addition with low-temperature welding.
As shown in figure 13, another embodiment of present embodiment, this miniature circulatory flow device 1 comprise that more several are arranged at the radiating fin 4 of contiguous these heat radiation runners 202 on this lid 3, so as to promoting radiating efficiency.In the present embodiment, this miniature circulatory flow device 1 is directly to be posted by on this heater element 9 with this metallic plate 2, so these radiating fins 4 just are arranged on this metallic plate 2 this lid 3 away from these heater element 9 sides.Certainly, the position that these radiating fins 4 are set is as limit, and can be in response to being equipped with in any suitable position; For example when this miniature circulatory flow device 1 be when directly being posted by on this heater element 9 with this lid 3, then these radiating fins 4 can certainly change and are located on this metallic plate 2 this second basal plane 22 away from this lid 3, equally also can reach the effect that promotes this miniature circulatory flow device 1 radiating efficiency.
As shown in figure 14, the another embodiment of present embodiment, this miniature circulatory flow device 1 comprise that more one carries runner 203 to be connected with this low temperature and so as to driving this fluid mobile drive unit 5 in this circulatory flow path 20 in.Similarly, the also inessential element of this drive unit 5, this miniature circulatory flow device 1 does not need the driving force that adds from the above, just heat can be passed to this low-temperature space 92 by this high-temperature region 91.But, because this high-temperature region 91 must reach the effect that can make this miniature circulatory flow device 1 reach the transfer of above-mentioned heat naturally more than the certain high temperature (typically referring to boiling point near this fluid at this so-called high temperature), therefore, can not cool off by this miniature circulatory flow device 1 when these high-temperature region 91 temperature reach above-mentioned high temperature if wish, perhaps desire is carried out other control to this miniature circulatory flow device 1, then can be reached by this drive unit 5 is set.
As Figure 15 and shown in Figure 16, the main element of second preferred embodiment of the miniature circulatory flow device 1 of the present invention and above-mentioned first preferred embodiment are roughly the same, and are to be used for heat is passed to a low-temperature space 92 by a high-temperature region 91 equally.Its difference is, in the present embodiment, this miniature circulatory flow device 1 comprises several metallic plates 2,2 ', one adjacent one another are and that be formed with this circulatory flow path 20 and is fixedly arranged on base plate 8 on these metallic plates 2,2 ' one of them metallic plate 2, and one is covered on the wherein lid 3 on another metallic plate 2 ' of these metallic plates 2,2 '; This base plate 8 is all contained this circulatory flow path 20 with this lid 3.This circulatory flow path 20 can be divided into a major cycle flow passage route 2001 and an inferior circulatory flow path 2002 that is connected with this major cycle flow passage route 2001, wherein, this major cycle flow passage route 2001 is formed at these metallic plates 2,2 ' and wherein is close on the metallic plate 2 of this base plate 8, and this time circulatory flow path 2002 then is to be formed at these metallic plates 2,2 ' wherein to be close on another metallic plate 2 ' of this lid 3.So this circulatory flow path 20 that these metallic plates 2,2 ' are defined is not limited on the same plane, but is stereoscopic-state; And in the present embodiment, this base plate 8 and this lid 3 are similarly another metallic plate identical with above-mentioned metallic plate 2, but are not as limit; This high-temperature region 91 and this low-temperature space 92 then lay respectively at the two opposite sides of this miniature circulatory flow device 1.
This major cycle flow passage route 2001 comprises heat radiation runner 202, a low temperature that is communicated with these heat radiation runners 202 of several contiguous low-temperature spaces 92 and carries runner 203, and a low temperature secondary fluid course 205 that is connected with this low temperature conveying runner 203; This time circulatory flow path 2002 then comprises contiguous this high-temperature region 91 and carries thermal-arrest runner that runner 203 is connected 201, to be communicated to these heat radiation runners 202 and to be carried runner 204 with the high temperature that this low temperature carries runner 203 to be connected by these thermal-arrest runners 201 with this low temperature.Therefore, the circulatory flow path 20 that is made of this major cycle flow passage route 2001 and this time circulatory flow path 2002 in the present embodiment just has the effect that the circulatory flow path 20 with above-mentioned first preferred embodiment is had.
The preparation method manufacturing that this miniature circulatory flow device 1 with the circulatory flow path 20 that is stereoscopic-state is introduced in can above-mentioned first preferred embodiment, as shown in figure 17, introduce the preparation method that another also can be applied to the various miniature circulatory flow device 1 of the present invention with next, it comprises the following step:
Step 300 as shown in figure 18, removes the some of this metallic plate 2 in the mechanical stamping mode, forms this major cycle flow passage route 2001 that this runs through this metallic plate 2.
Step 302 is carried out surface treatment to this metallic plate 2.
Step 304 as shown in figure 19, is posted by this base plate 8 of containing this major cycle flow passage route 2001 on this metallic plate 2.
Step 306 heats this metallic plate 2 and this base plate 8 near molten condition, applies one simultaneously and makes this base plate 8 and the approaching mutually strength of this metallic plate 2, and this base plate 8 is fixedly arranged on this metallic plate 2.This step is 5 * 10 with high vacuum furnace in the present embodiment
-5Under the environment of Torr, apply the strength of 4000Pa, and be heated to, keep engaging in 10 hours to 950 ℃.Certainly, the method that this base plate 8 is fixedly arranged on this metallic plate 2 is not as limit, and it also can adopt the described arbitrary joint method of first embodiment; But be noted that it engages temperature and pressure that temperature that the back is suitable for and intensity need meet in the subsequent step to be taken place.
Step 308, as shown in figure 20, set firmly this another metallic plate 2 ' that is formed with this time circulatory flow path 2002 and be formed with on the metallic plate 2 of this major cycle flow passage route 2001, and this time circulatory flow path 2002 is connected with this major cycle flow passage route 2001 in this; And these metallic plates 2,2 ' affixed mode can adopt aforesaid arbitrary joint method to finish.
Step 310 as shown in figure 21, sets firmly this lid 3 and is formed with on the metallic plate 2 ' in this time circulatory flow path 2002 in this, and its affixed mode can adopt aforesaid arbitrary joint method to finish.
Step 312 is injected this fluid and is entered in this circulatory flow path 20, to finish this cooling device 1.This step is to reserve in these metallic plates 2,2 ', this base plate 8 by original, or the perforation on this lid 3 (figure does not show), and this fluid is injected in this circulatory flow path 20.
Because so above-mentioned major cycle flow passage route 2001 contiguous these base plates 8 that comprise these heat radiation runners 202 as shown in figure 22, comprise among another embodiment of several radiating fins 4 at present embodiment, these radiating fins are to be arranged on this base plate 8.Certainly, above-mentioned major cycle flow passage route 2001 also can adopt the mode of half erosion of introducing as first preferred embodiment directly to form on this metallic plate 2, and non-limiting mode of sealing these major cycle flow passage route 2001 with this base plate 8 forms; This moment, these radiating fins 4 then can directly be arranged on this metallic plate 2.
From the above, the miniature circulatory flow device 1 of the present invention can only not engage with another metallic plate as this lid 3 with a metallic plate 2 and form this circulatory flow path 20, can be with a metallic plate 2 and two engage as the metallic plate of this base plate 8 and this lid 3 respectively and form this circulatory flow path 20 in addition yet; More can be by repeating above-mentioned steps 308, a plurality of metallic plates are engaged with each other and form the circulatory flow path 20 that presents the stereo staggered pattern, make the design and the utilization of this miniature circulatory flow device 1 have more elasticity, and applied to various electronic equipments widely.
In addition, miniature circulatory flow device 1 decapacitation of the present invention is integrated outside the processing procedure of the ripe metallic plate of utilization prior art quickly and effectively, more can make full use of metallic plate and can criticize the advantage of making production in a large number, make production cost significantly reduce, successfully reach with lower production cost and make micron-sized circulatory flow path 20, even can be by superimposed stacked conducting plate 2, the purpose that has a miniature circulatory flow device 1 in three-dimensional circulatory flow path 20 with a large amount of batch makings of low cost is achieved.