CN102469748A - Improved runner structure of water cooling device - Google Patents
Improved runner structure of water cooling device Download PDFInfo
- Publication number
- CN102469748A CN102469748A CN2010105460056A CN201010546005A CN102469748A CN 102469748 A CN102469748 A CN 102469748A CN 2010105460056 A CN2010105460056 A CN 2010105460056A CN 201010546005 A CN201010546005 A CN 201010546005A CN 102469748 A CN102469748 A CN 102469748A
- Authority
- CN
- China
- Prior art keywords
- runner
- water cooling
- flow passage
- improvement
- passage structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to an improved runner structure of a water cooling device, which comprises a heat conducting main body, wherein the heat conducting main body is provided with at least one runner, an inlet and an outlet; the runner is arranged in the heat conducting main body and is provided with fluid; the fluid is sealed by a slot part and a top part which are connected mutually, so that the runner is formed; at least one of the slot part and the top part is provided with at least one turbulent flow part; and under an action of the turbulent flow part, a separating eddy current can be generated by the fluid, so as to greatly increase the turbulence intensity of a flow field and increase the heat conducting efficiency.
Description
Technical field
A kind of flow passage structure improvement of water cooling plant refers to that especially a kind of turbulence structure that in runner, is provided with is to increase the flow passage structure improvement that the sink flows body heat passes the water cooling plant of effect.
Background technology
Along with being showing improvement or progress day by day of electronic information science and technology, make electronic equipment (like computer, mobile computer, communication cabinet ... etc.) use popularization and application is more extensive day by day; Yet; Electronic equipment is when working at high speed; Electronic building brick in it can produce used heat, if can't in real time said used heat be discharged outside the electronic equipment, as easy as rolling off a log these used heat that make are hoarded in electronic equipment; The temperature that makes electronic equipment internal and interior electronic building brick thereof is constantly soaring, so cause electronic building brick because of overheatedly break down, situation such as damage or operational paradigm reduction.
In order to improve said heat dissipation problem, generally more common all is that radiator fan of installing comes forced heat radiation in electronic equipment, but because of the throughput of its radiator fan limited; Make its radiating effect be difficult to promote; And the situation that cooling extent is also limited so the dealer just seeks another kind of settling mode, promptly uses a water-cooled power converter directly to be attached on the heat generating component; Like (central processing unit (CPU), MPU, south, north bridge chips or other are because of carrying out the electronic building brick etc. that the operation meeting produces high heat); And cooling liquid is imported in the water-cooled power converter in aqua storage tank by a pumping, after the heat that cooling liquid and this water-cooled power converter are absorbed from heat generating component was done heat exchange, cooling liquid flowed out to a radiating module by a delivery port of water-cooled power converter again; Via sending said aqua storage tank again back to after the cooling; Help heat radiation by the cooling liquid circulation, reduce the heat generating component temperature, its heat generating component can be operated smoothly.
Yet,, extend another problem though said water-cooled power converter can improve the problem of utilizing the air-flow heat radiation; Be that water-cooled power converter is close to the end face (being heat-absorbent surface) by this heat generating component; Inject runner in the said water-cooled power converter generation heat exchange action that circulates by cooling liquid again, however since said cooling liquid to be trapped in the time of water-cooled power converter too short so that cooling liquid cmpletely enough heats (being heat exchange) of absorption not as yet; Just derive by said delivery port fast immediately; Institute causes its heat to pass poor effect, and then makes radiating effect extremely not obvious so that the water-cooled function is had a greatly reduced quality.
The inner flow passage of oil-to-water heat exchanger structure is unidirectional level and smooth runner; So cooling liquid is shorter the dead time in these runners; Cause the thermal source of taking away promptly less, it is obviously not good therefore to cause whole heat exchanger effectiveness and heat to pass effect, and its relative radiating effect is more undesirable; Present technique has disadvantage:
1. heat exchanger effectiveness is not good;
2. radiating effect is not good.
Because above-mentioned drawbacks, the present inventor innovates improvement to be engaged in the sector experience for many years, to concentrate on studies, and successfully the present invention is accomplished in research and development finally, is the invention that a tool effect is promoted in fact.
Summary of the invention
For solving the shortcoming of above-mentioned technology, the application's main purpose provides a kind of fluid that makes and produces separation eddy lifting flow field turbulence intensity, and then increases the flow passage structure improvement that heat passes the water cooling plant of usefulness.
For reaching above-mentioned purpose, the application provides a kind of flow passage structure improvement of water cooling plant, comprises: a heat conduction body; Have at least one runner and an inlet and an outlet; Said runner is arranged at this heat conduction body interior, and said runner has a slot part and a top, and this slot part and this top interconnect closed configuration and become said runner; And one of them is provided with at least one spoiler this slot part and this top, and this inlet and this outlet are communicated with the two ends of this runner respectively.
By said runner the design of spoiler is set, increases the heat exchanger effectiveness of heat radiator body, make the fluid that passes through produce separation eddy and promote the flow field turbulence intensity and promote heat and pass usefulness.
Description of drawings
The 1st figure is a first embodiment of the present invention three-dimensional exploded view;
The 2nd figure is a first embodiment of the present invention three-dimensional combination figure;
The 3rd figure is a first embodiment of the present invention cutaway view;
4a figure is a first embodiment of the present invention vertical view;
4b figure is a first embodiment of the present invention vertical view;
5a figure is a first embodiment of the present invention vertical view;
5b figure is a first embodiment of the present invention vertical view;
5c figure is a first embodiment of the present invention vertical view;
5d figure is a first embodiment of the present invention vertical view;
5e figure is a first embodiment of the present invention vertical view;
6a figure is the pedestal cutaway view of second embodiment of the invention;
6b figure is the pedestal cutaway view of second embodiment of the invention;
The 7th figure is the pedestal vertical view of third embodiment of the invention;
The 8th figure is the schematic perspective view of fourth embodiment of the invention;
The 9th figure is the schematic perspective view of fifth embodiment of the invention;
The 10th figure is an illustrative view of the present invention.
[primary clustering symbol description]
Heat conduction body 1
Pedestal 1a
Runner 11
The 3rd wall 1113
Top 112
Radiating fin 161
Pumping 6
Embodiment
The present invention provides a kind of heat converter structure; Icon is preferred embodiment of the present invention, sees also the 1st, 2,3,4a, 4b, 5a, 5b, 5c, 5d, 5e figure, is the three-dimensional decomposition of the first embodiment of the present invention and constitutional diagram and assembled sectional view and vertical view; As shown in the figure; The flow passage structure improvement of said water cooling plant comprises: a heat conduction body 1, said heat conduction body 1 have at least one runner 11 and 12 and outlets 13 of an inlet;
Said runner 11 is arranged at this heat conduction body 1 inside; And has fluid 2 in this runner 11; Said runner 11 has a slot part 111 and a top 112; This slot part 111 and this top 112 interconnect closed configuration and become said runner 11, and this slot part 111 and this top 112 one of them be provided with at least one spoiler 14, this inlet 12 and this outlet 13 are communicated with the two ends of this runner 11 respectively.
Said slot part 111 has more one first wall 1111 and one second wall 1112 and one the 3rd wall 1113; Said first wall, 1,111 one ends connect an end of this second wall 1112 and the 3rd wall 1113; It is wherein arbitrary that said spoiler 14 selects to be located at said first wall 1111 (like the 1st figure) and second wall 1112 (like 4a figure) and the 3rd wall 1113 (like 4b figure); Said spoiler 14 is a convex body and along the axial discontinuous arrangement of this runner 11, and the spoiler 14 of present embodiment is located at this first wall 1111 (like the 1st figure).
Said heat conduction body 1 has a pedestal 1a and a lid 1b, and said lid 1b correspondence covers said pedestal 1a.
Said convex body be square (like 5a figure) and triangle (like 5b figure) and rectangle (like 5c figure) and circular (like 5d figure) and rhombus (like 5e figure) and geometry wherein any.
The width of said convex body is no more than 1/3rd width of this runner 11, and the height of this convex body can be resisted against the top 112 of this runner 11 or be lower than this top 112.
See also 6a, 6b figure; Pedestal cutaway view for second embodiment of the invention; As shown in the figure, the part technical characterictic of present embodiment is identical with said first embodiment, so will repeat no more at this; Present embodiment and said first embodiment place inequality be the spoiler 14 of present embodiment be a groove and along axially being of this runner 11 discontinuous (like 6a figure) and continuously (like 6b figure) wherein arbitrary mode arrange, said groove is arranged with in this first wall 1111.
It is wherein arbitrary that said groove is square and triangle and rectangle and circle and rhombus and geometry.
See also the 7th figure; Pedestal vertical view for third embodiment of the invention; As shown in the figure; The part technical characterictic of present embodiment is identical with said first embodiment, so will repeat no more at this, present embodiment and said first embodiment place inequality are that the spoiler 14 of present embodiment is a convex body and axially arranging continuously along this runner 11.
See also the 8th figure; For the schematic perspective view of fourth embodiment of the invention, as shown in the figure, the part technical characterictic of present embodiment is identical with said first embodiment; So will repeat no more at this; Only present embodiment and said first embodiment place inequality are that the heat conduction body 1 of present embodiment has more one first side 15 and one second side 16, said first side 15 at least one thermal source 3 of contact, and this second side 16 is provided with plurality of radiating fins 161.
See also the 9th, 10 figure; Schematic perspective view and illustrative view for fifth embodiment of the invention; As shown in the figure; The part technical characterictic of present embodiment is identical with said first embodiment; So will repeat no more at this, only present embodiment and said first embodiment place inequality are that inlet 12 and this outlet 13 of the heat conduction body 1 of present embodiment is connected at least one first body 4 and one second body 5 respectively, and other holds this first body 4 and this second body 5 and more connect a pumping 6; Order about this fluid 2 when these pumping 6 pressurizations and get in the runner 11 of this heat radiator body 1, and spoiler 14 mainly makes the fluid 2 generation separation eddies that pass through promote the flow field turbulence intensity to promote heat biography usefulness via this first body 4.
Claims (11)
1. the flow passage structure of water cooling plant improvement comprises:
A heat conduction body; Have at least one runner and an inlet and an outlet; Said runner is arranged at this heat conduction body interior, and said runner has a slot part and a top, and this slot part and this top interconnect closed configuration and become the said runner of stating; And one of them is provided with at least one spoiler this slot part and this top, and this inlet and this outlet are communicated with the two ends of this runner respectively.
2. the flow passage structure of water cooling plant as claimed in claim 1 improvement, said spoiler are a convex body and axially arranging continuously along this runner.
3. the flow passage structure of water cooling plant as claimed in claim 1 improvement, said spoiler are a convex body and along the axial discontinuous arrangement of this runner.
4. the flow passage structure of water cooling plant as claimed in claim 1 improvement, said spoiler are a groove and axially arranging continuously along this runner.
5. the flow passage structure of water cooling plant as claimed in claim 1 improvement, said spoiler are a groove and along the axial discontinuous arrangement of this runner.
6. the flow passage structure of water cooling plant as claimed in claim 1 improvement; Said slot part has one first wall and one second wall and one the 3rd wall; Said first wall connects this second wall and the 3rd wall, and it is wherein arbitrary that said spoiler selects to be located at said first wall and second wall and the 3rd wall.
7. the flow passage structure of water cooling plant as claimed in claim 1 improvement, said heat conduction body has more one first side and one second side, said at least one thermal source of first contacts side surfaces, this second side is provided with plurality of radiating fins.
8. the flow passage structure of water cooling plant as claimed in claim 1 improvement, the inlet of said heat conduction body and this outlet connect at least one first body and one second body respectively, and this first body and this second body end in addition more connect a pumping.
9. like the improvement of the flow passage structure of claim 2 or 3 described water cooling plants, it is wherein arbitrary that said convex body is square and triangle and rectangle and circle and rhombus geometry.
10. like the improvement of the flow passage structure of claim 4 or 5 described water cooling plants, it is wherein arbitrary that said groove is square and triangle and rectangle and circle and rhombus and geometry.
11. the improvement of the flow passage structure of water cooling plant as claimed in claim 1, said heat conduction body has a pedestal and a lid, and said lid correspondence covers said pedestal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105460056A CN102469748A (en) | 2010-11-12 | 2010-11-12 | Improved runner structure of water cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105460056A CN102469748A (en) | 2010-11-12 | 2010-11-12 | Improved runner structure of water cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102469748A true CN102469748A (en) | 2012-05-23 |
Family
ID=46072696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105460056A Pending CN102469748A (en) | 2010-11-12 | 2010-11-12 | Improved runner structure of water cooling device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102469748A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104541226A (en) * | 2012-06-29 | 2015-04-22 | 阿塞泰克丹麦公司 | Server memory cooling apparatus |
CN106288574A (en) * | 2016-09-23 | 2017-01-04 | 广州冰泉制冷设备有限责任公司 | A kind of high effective flake ice maker |
CN112437594A (en) * | 2020-11-26 | 2021-03-02 | 北京石油化工学院 | Vortex-shaped micro-channel heat exchanger |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1669905A (en) * | 2004-03-17 | 2005-09-21 | 升达科技股份有限公司 | Minisize circulating flow passage device made by lead frame |
CN1980560A (en) * | 2005-11-29 | 2007-06-13 | 讯凯国际股份有限公司 | Water-cooling type radiating structure and mfg. method |
CN201894034U (en) * | 2010-11-12 | 2011-07-06 | 奇鋐科技股份有限公司 | Improved runner structure of water-cooling device |
-
2010
- 2010-11-12 CN CN2010105460056A patent/CN102469748A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1669905A (en) * | 2004-03-17 | 2005-09-21 | 升达科技股份有限公司 | Minisize circulating flow passage device made by lead frame |
CN1980560A (en) * | 2005-11-29 | 2007-06-13 | 讯凯国际股份有限公司 | Water-cooling type radiating structure and mfg. method |
CN201894034U (en) * | 2010-11-12 | 2011-07-06 | 奇鋐科技股份有限公司 | Improved runner structure of water-cooling device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104541226A (en) * | 2012-06-29 | 2015-04-22 | 阿塞泰克丹麦公司 | Server memory cooling apparatus |
US9867315B2 (en) | 2012-06-29 | 2018-01-09 | Asetek Danmark A/S | Server memory cooling apparatus |
CN104541226B (en) * | 2012-06-29 | 2020-08-07 | 阿塞泰克丹麦公司 | Server memory cooling device |
CN106288574A (en) * | 2016-09-23 | 2017-01-04 | 广州冰泉制冷设备有限责任公司 | A kind of high effective flake ice maker |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
CN112437594A (en) * | 2020-11-26 | 2021-03-02 | 北京石油化工学院 | Vortex-shaped micro-channel heat exchanger |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN202816913U (en) | Microchannel liquid-cooled heat sink device | |
CN201894034U (en) | Improved runner structure of water-cooling device | |
CN204335279U (en) | Liquid-cooling type radiator structure | |
CN102956586B (en) | High-performance liquid for IGBT module cools down radiator | |
US20120152500A1 (en) | Flow passage structure for water-cooling device | |
CN202617585U (en) | Water-cooled heat dissipation device | |
CN204442899U (en) | Electronic installation and liquid-cooling type radiator structure thereof | |
CN102469748A (en) | Improved runner structure of water cooling device | |
TWI400421B (en) | Heat exchanger structure | |
CN102404973A (en) | Heat exchanger structure | |
CN103336564A (en) | Tablet personal computer heat dissipation docking station | |
CN106852092B (en) | A kind of novel mechanical pump liquid cooling heat radiation system | |
CN201766806U (en) | Heat exchanger structure | |
CN205213244U (en) | Liquid cooling plate | |
CN1980560A (en) | Water-cooling type radiating structure and mfg. method | |
CN220123320U (en) | Liquid cooling radiator | |
CN105700652A (en) | Cooler | |
CN103796489B (en) | Use hot collecting terminal and the heat abstractor of porous microchannel module | |
CN202433827U (en) | Integral water-cooled radiator | |
CN2837916Y (en) | Water-cooled heat radiation mechanism | |
CN204905381U (en) | Water -cooling board subassembly based on porous flat pipe | |
CN201557360U (en) | Cooling fan device and electronic computing system thereof | |
CN102131367A (en) | Heat exchanger structure | |
CN203689297U (en) | Cooling dock station of PPC (Panel Personal Computer) | |
CN203708742U (en) | Heat dissipation apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120523 |