CN1298523C - Method and device for scribing fragile material substrate - Google Patents
Method and device for scribing fragile material substrate Download PDFInfo
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- CN1298523C CN1298523C CNB038049163A CN03804916A CN1298523C CN 1298523 C CN1298523 C CN 1298523C CN B038049163 A CNB038049163 A CN B038049163A CN 03804916 A CN03804916 A CN 03804916A CN 1298523 C CN1298523 C CN 1298523C
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- 239000000758 substrate Substances 0.000 title claims abstract description 185
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 title abstract 2
- 238000001816 cooling Methods 0.000 claims abstract description 175
- 208000037656 Respiratory Sounds Diseases 0.000 claims description 52
- 239000003507 refrigerant Substances 0.000 claims description 27
- 239000002826 coolant Substances 0.000 claims description 22
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 239000011521 glass Substances 0.000 abstract description 154
- 238000009751 slip forming Methods 0.000 abstract 1
- 230000035882 stress Effects 0.000 description 29
- 238000010438 heat treatment Methods 0.000 description 15
- 239000013256 coordination polymer Substances 0.000 description 10
- 230000006835 compression Effects 0.000 description 9
- 238000007906 compression Methods 0.000 description 9
- 239000007921 spray Substances 0.000 description 9
- 239000000498 cooling water Substances 0.000 description 7
- 230000010355 oscillation Effects 0.000 description 7
- 230000035939 shock Effects 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000003570 air Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/003—Cooling means
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
A method for scribing a fragile material substrate, comprising the steps of cooling a mother glass substrate (50) in an area in proximity to laser spots (LS) along a predicted scribe line (SL) while continuously radiating laser beam onto the surface of the mother glass substrate (50) so that the laser spots (LS) with a temperature lower than the softening point of the mother glass substrate can be formed along the predicted scribe line (SL) to form a main cooling spot (MCP), whereby cracks can be continuously formed along the predicted scribe line (SL), and an assist cooling spot (ACP) for pre-cooling an area positioned on the laser spot (LS) side of the main cooling spot (MCP) can be formed along the predicted scribe line (SL) in proximity to the main cooling spot (MCP).
Description
Technical field
The present invention relates to scribble method and chalker, it is in order to block the brittle substrate of the glass substrate that is used in the flat-panel monitor (below, be called FPD), semiconductor wafer etc., and forms score line on the surface of brittle substrate.
Background technology
Below, the prior art of following situation is described: the brittle substrate that is used for various flat-panel monitors a kind of is to form score line on female brittle substrate of forming of glass substrate or bonding this brittle substrate.
A pair of glass substrate is the mutually bonding and FPD of the display panels that constitutes etc., make a pair of female glass substrate bonding each other after, each female glass substrate is blocked, make it become the glass substrate of the prescribed level that constitutes FPD.Each female glass substrate forms after the score line by adamantine cutter in advance, blocks along this score line.Sometimes owing to the kind of flat-panel monitor or the difference of manufacture method, and form score line on the female glass substrate before bonding, thereby block this mother's glass substrate again.
If be mechanically formed score line by cutter, then the periphery of the score line of Xing Chenging is in the state of having accumulated residual stress.If block female glass substrate along score line, then accumulating on the edge part of the lip-deep lateral margin of the glass substrate that is blocked and form and periphery thereof has residual stress.Such residual stress is the latent stress that unnecessary crackle is extended at the near surface of glass substrate, if this residual stress release, then may produce unnecessary crackle and the edge part of the truncation surface of glass substrate is broken.Owing to the edge part of the truncation surface of the glass substrate fragment that produces that breaks may bring bad influence to the FPD that will make.
In recent years, in actual applications, use laser beam mostly in order on the surface of female glass substrate, to form score line.On female glass substrate, form in the method for score line using laser beam, as shown in Figure 8, with respect to female glass substrate 50, from laser oscillation apparatus 61 illuminating laser beam LB.Form the laser point LS of the elliptical shape of the line preset lines SL on female glass substrate 50 on the surface of female glass substrate 50 from the laser beam LB of laser oscillation apparatus 61 irradiation.Make female glass substrate 50 with relatively mobile along the length direction of laser point LS by the laser beam LB of laser oscillation apparatus 61 irradiations.
Again, from cooling jet 62 cooling medium of cooling water etc. is ejected into female glass substrate 50 the surface laser beam LB irradiation area near so that form score line.On the surface of the female glass substrate 50 that is shone by laser beam LB, the heating of being carried out owing to laser beam LB produces compression stress, and produces tensile stress owing to spraying cooling medium.Like this, because on the zone of the regional institute adjacency that has produced compression stress, produce tensile stress, so between two zones, produce based on the stress gradient of stress separately, on female glass substrate 50, from being pre-formed in the otch TR of female glass substrate 50 ends, along line preset lines SL, go up the formation vertical crack at the thickness direction (vertical direction) of female glass substrate 50.That is, the line of this vertical crack is a score line.
So, because be formed at the vertical crack on surface of female glass substrate 50 minimum, with the naked eye can not see usually, so be called hidden crackle BC.
The stereogram of the formation state of the hidden crackle BC on Fig. 9 female glass substrate 50 that to be pattern ground expression rule by laser scribe apparatus, Figure 10 is the vertical view of the physical change state on this mother's glass substrate 50 of pattern ground expression.
Form the laser point LS of elliptical shape on the surface of female glass substrate 50 from the laser beam of laser oscillation apparatus 61 vibration generations.Shine and make that the major axis of laser point LS is consistent with line preset lines SL.
In this case, be formed at the laser point LS on female glass substrate 50, it is big that the thermal energy intensity of the thermal energy strength ratio central portion of its outer peripheral edges portion is wanted.Such laser point LS forms the laser beam that thermal energy intensity is Gaussian distribution, that is, thermal energy is distributed as the thermal energy intensity maximum of each end of long axis direction.Therefore, on each end that is positioned at the long axis direction on the line preset lines SL, thermal energy intensity be maximum, and the thermal energy intensity of each end of thermal energy strength ratio of middle body that is sandwiched in the laser point LS between each end is little.
Thus, produce thermograde between laser point LS and cooling point CP, CP produces big tensile stress in the zone of an opposite side with laser point LS with respect to the cooling point.Utilize this tensile stress, from being pre-formed,, on the direction of the thickness t of female glass substrate 50, form vertical crack along the line preset lines in the otch TR of female glass substrate 50 ends.
Like this, the surface of female glass substrate 50 is by after the heating of big thermal energy intensity, and by little thermal energy intensity between the period of heating, its heat is conducted to inside really.At this moment, prevent that the surface of female glass substrate 50 from continuing by big thermal energy intensity heating, thereby can prevent the softening of female glass substrate 50 surfaces again., if once more by big thermal energy intensity heat female glass substrate 50, then positively be heated to the inside of female glass substrate 50, in the surface and the inner compression stress that produces of female glass substrate 50 thereafter.By near the cooling point CP the zone of the such compression stress of generation, spraying cooling medium, produce tensile stress.
If on by the formed heating region of laser point LS, produce compression stress, producing tensile stress by cooling medium on the formed cooling point CP, then by resulting from the compression stress on the thermal diffusion zone between laser point LS and the cooling point CP, CP produces big tensile stress in the zone of an opposite side with laser point LS with respect to the cooling point.Utilize this tensile stress,, produce hidden crackle along the line preset lines from being pre-formed in the otch TR of female glass substrate 50 ends.
If the hidden crackle BC as score line is formed on female glass substrate 50, then female glass substrate 50 is fed into the next one and blocks operation, in the both sides of hidden crackle BC to female glass substrate 50 application of forces, so that produce the bending moment that hidden crackle BC is stretched along the thickness direction of female glass substrate 50.Thus, female glass substrate 50 is blocked along hidden crackle BC, and described hidden crackle BC forms along cut preset lines SL.
In such chalker, the thermal energy intensity distributions that is formed at the lip-deep laser point LS of female glass substrate 50 is: thermal energy intensity maximum on long axis direction.Like this, thermal energy intensity is in each end maximum of long axis direction, and 2 grades of ground heat the surface of female glass substrates 50, and thus, female glass substrate 50 is in the state that heat has been passed to substrate inside.Therefore, only by forming the cooling that refrigerant carried out of cooling point CP, can not and cooling point CP between obtain sufficient thermal stress gradient, thereby can not form dark hidden crackle (vertical crack).Thereby, may block in the operation that to produce blocking of female glass substrate 50 bad aforementioned.
Under these circumstances, the relative moving speed of must slow down female glass substrate 50 and laser point LS prolongs the time of heating by the end of laser point LS, and its result may not can form hidden crackle BC efficiently.
The present invention proposes in order to address the above problem, its purpose be to provide a kind of can be efficiently and on the brittle substrate of female glass substrate etc., form the scribble method and the chalker of the brittle substrate of score line reliably.
Summary of the invention
The scribble method of brittle substrate of the present invention, lip-deep line preset lines along brittle substrate, illuminating laser beam and moving it continuously, with the formation temperature laser point lower than the softening point of this brittle substrate, by near cooling medium the zone of line preset lines, cooling off to the rear of this laser point, thereby form main cooling point, form hidden crackle continuously along the line preset lines, it is characterized in that, in a side than the more close laser point of described main cooling point, be formed on one side in advance at least one that cool off along the zone of line preset lines being assisted cooling point, Yi Bian rule by refrigerant.
Aforementioned auxiliary cooling point utilizes chilling temperature and forms than the high refrigerant of chilling temperature that forms aforementioned main cooling point.
Again, the chalker of brittle substrate of the present invention possesses: the laser beam irradiation means, and meanwhile continuously illuminating laser beam move it, with the laser point lower of formation temperature on the surface of this brittle substrate than the softening point of brittle substrate; Main cooling body, by refrigerant to by this laser point area heated rear along the line preset lines the zone near cooling off continuously; Lip-deep line preset lines along brittle substrate forms hidden crackle, it is characterized in that, has at least one auxiliary cooling body, it utilizes the temperature refrigerant higher than the temperature of the refrigerant of main cooling body, and cooling raio is by this main cooling body institute more close zone by formed laser point one side of aforementioned laser bundle irradiation means of cooled zones.
Description of drawings
Fig. 1 is the vertical view of the enforcement state of pattern ground expression scribble method of the present invention.
Fig. 2 is the front view of an example of the embodiment of expression chalker of the present invention.
Fig. 3 is illustrated in the figure that has formed the result of hidden crackle among the embodiment 1.
Fig. 4 is illustrated in the figure that has formed the result of hidden crackle among the embodiment 2.
Fig. 5 is illustrated in the figure that has formed the result of hidden crackle among the embodiment 3.
Fig. 6 is illustrated in the figure that has formed the result of hidden crackle among the embodiment 4.
Fig. 7 is the vertical view of pattern ground expression other embodiment of the present invention.
Fig. 8 is the schematic diagram that is used to illustrate the action of the existing laser scribe apparatus that has used laser beam.
The stereogram of the formation state of the hidden crackle on Fig. 9 female glass substrate that to be pattern ground expression rule by this laser scribe apparatus.
The vertical view of the physical change state on Figure 10 female glass substrate that to be pattern ground expression rule by this laser scribe apparatus.
The specific embodiment
Fig. 1 is the approximate vertical view of female glass baseplate surface of enforcement state of the scribble method of pattern ground expression brittle substrate of the present invention.Implement this scribble method and be used for following purpose: for example, blocking female glass substrate, and forming when the glass substrate of FPD of a plurality of formation display panels etc., before blocking female glass substrate, on female glass substrate, forming hidden crackle as score line.
As shown in Figure 1, on the surface of female glass substrate 50, along line preset lines SL, the irradiation by laser beam forms laser point LS1.In addition, near the side edge part of the female glass substrate 50 the line starting position of the lip-deep line preset lines SL of female glass substrate 50, be pre-formed otch (breaking joint) TR along this line preset lines.
Laser point LS1 becomes elliptical shape,, relatively moves along direction shown in the arrow A with respect to the surface of female glass substrate 50 under the state of line preset lines SL at major diameter.
In this case, be formed at the laser point LS1 on female glass substrate 50, it is big that the thermal energy intensity of the thermal energy strength ratio central portion of its outer peripheral edges portion is wanted.Such laser point LS1 forms the laser beam that thermal energy intensity is Gaussian distribution, that is, thermal energy is distributed as the thermal energy intensity maximum of each end of long axis direction.Therefore, on each end that is positioned at the long axis direction on the line preset lines SL, it is maximum that thermal energy intensity is respectively, and the thermal energy intensity of each end of thermal energy strength ratio of middle body that is sandwiched in the laser point LS1 between each end is little.
The laser point LS1 of elliptical shape moves along the line preset lines SL on the surface of female glass substrate 50, and SL heats successively to the line preset lines.
The softening point temperature low temperature of laser point LS1 to soften than female glass substrate 50, and mobile at high speed with respect to female glass substrate 50, simultaneously female glass substrate 50 is heated.Thus, the surface that has formed female glass substrate 50 of laser point LS1 can not be heated to fusion.
On the surface of female glass substrate 50, form a main cooling point MCP at the rear of the direct of travel of laser point LS1.Main cooling point MCP forms in the following manner: from the cooling medium of cooling jet to jet surface cooling water, water and the compressed-air actuated fluid-mixing of female glass substrate 50, compressed air, helium, nitrogen, carbon dioxide etc., thereby to cooling off on the surface of female glass substrate 50; With respect to female glass substrate 50 on the direction identical with laser point LS1 and, the speed that equates with translational speed with laser point LS1, move along the line preset lines SL on the surface of female glass substrate 50.
On the surface of female glass substrate 50,, be formed with and the main approaching auxiliary cooling point ACP of some MCP that cools off along line preset lines SL in main the place ahead of cooling off the direct of travel of some MCP again.Auxiliary cooling point ACP forms in the following manner: from the cooling medium of cooling jet to jet surface cooling water, water and the compressed-air actuated fluid-mixing of female glass substrate 50, compressed air, helium, nitrogen, carbon dioxide etc., the temperature that is ejected into the refrigerant on the auxiliary cooling point ACP is cooled off the surface of female glass substrate 50 under such state than the temperature height that is ejected into the refrigerant on the main cooling point MCP.Auxiliary cooling point ACP also cools off some MCP similarly with main, with respect to female glass substrate 50 on the direction identical with laser point LS1 and, the speed that equates with translational speed with laser point LS1, move along the line preset lines SL on the surface of female glass substrate 50.
After heat successively along line preset lines SL and by laser point LS1 on the surface of female glass substrate 50, its heating part is before being about to be formed the refrigerant cooling of main cooling point MCP, cool off under by the refrigerant that forms auxiliary cooling point ACP than the high chilling temperature of main cooling point MCP, by the refrigerant that form main cooling point MCP be cooled to than auxiliary cooling point ACP low temperature thereafter.
After the surface of heating female glass substrate 50 by laser point LS1 makes to produce compression stress, to once cooling off on the surface of female glass substrate 50, thus, produce tensile stress by the refrigerant that forms auxiliary cooling point ACP.Under the state that has produced such tensile stress, if further cool off by the refrigerant that forms main cooling point MCP, then because on the surface of female glass substrate 50, be in the state that produces tensile stress, so the tensile stress that is produced by the cooling that refrigerant carried out that forms main cooling point MCP is easy to act on the surface of female glass substrate 50, forms darker hidden crackle BC along vertical direction on female glass substrate 50.
Again, prior art shown in Figure 10 by the scribble method that laser carried out in, because after the surface of female glass substrate 50 being heated by laser point LS, spray the surface that cooling medium cools off female glass substrate 50, so except forming hidden crackle, also produced useless thermal shock.
In scribble method of the present invention, by auxiliary cooling point ACP is set, can relax above-mentioned useless thermal shock between main cooling point MCP and laser point LS1, the energy that will be lost by thermal shock is used to make the power of hidden crackle elongation.
If the hidden flaw shape as score line is formed on female glass substrate 50, then female glass substrate 50 is fed into the next one and blocks operation, in the both sides of hidden crackle to female glass substrate 50 application of forces, so that produce the bending moment that hidden crackle is stretched along the thickness direction of female glass substrate 50.Thus, female glass substrate 50 is blocked along hidden crackle, and described hidden crackle forms along cut preset lines SL.
Fig. 2 is the summary pie graph of embodiment of the chalker of expression brittle substrate of the present invention.Chalker of the present invention for example is to be formed for blocking device into the score line of the employed a plurality of glass substrates of FPD from female glass substrate 50.As shown in Figure 2, this chalker has the slide unit 12 that the horizontal direction (Y direction) in horizontal pallet 11 upper edges regulations moves back and forth.
Pedestal 19 is disposed on the slide unit 12 with horizontal state.Pedestal 19 is supported on the pair of guide rails 21 slidably, and described guide rail 21 is disposed on the slide unit 12 abreast.Each guide rail 21 is the vertical directions X configuration of Y direction along the glide direction with slide unit 12.Again, dispose leading screw 22 abreast with each guide rail 21 on the central portion of 21 on each guide rail, leading screw 22 can pass through motor 23 and forward or reverse.
On pedestal 19, be provided with rotating mechanism 25, be located on this rotating mechanism 25 with level as the turntable 26 of 50 mountings of female glass substrate of cutting off object.Rotating mechanism 25 makes turntable 26 around being rotated along the central shaft of vertical direction, turntable 26 is rotated to become anglec of rotation θ arbitrarily with the reference position.Female glass substrate 50 is fixed on the turntable 26 by for example attracting chuck.
Supporting station 31 and turntable 26 are disposed at the top of turntable 26 with leaving appropriate intervals.This supporting station 31 is supported in the bottom with the optics support 33 of plumbness configuration under level.The upper end of optics support 33 is installed on the lower surface of the erecting bed of being located on the pallet 11 32.Be provided with the laser oscillator 34 that makes laser beam on erecting bed 32, the laser beam that produces from laser oscillator 34 vibrations shines the optical system that remains in the optics support 33.
Laser beam from laser oscillator 34 vibration generations, its thermal energy intensity distributions is normal distribution, by being located at the optical system in the optics support 33, form the laser point LS1 of elliptical shape as shown in Figure 1, and, be that the parallel mode of directions X shines mounting on the female glass substrate 50 on the turntable 26 with its long axis direction and the moving direction of turntable 26.
On supporting station 31, dispose main cooling jet 37 at a distance of the compartment of terrain more than the 4mm with this auxiliary cooling jet 41 again.This main cooling jet 37 is ejected into the position at the rear of the female glass substrate that is cooled off by auxiliary cooling jet 41 with the cooling medium of cooling water, water and compressed-air actuated fluid-mixing, compressed air, helium etc.The chilling temperature that is ejected into the cooling medium on female glass substrate 50 from main cooling jet 37 is lower than the chilling temperature that blows to the cooling medium on female glass substrate 50 from auxiliary cooling jet 41.
Again, on supporting station 31, with respect to the laser point LS1 from optics support 33 irradiation, the side opposite with main cooling jet 37 is provided with break bar 35 opposed to each other with female glass substrate 50 of mounting on turntable 26.Break bar 35 is along the long axis direction configuration from the laser point LS1 of optics support 33 irradiation, on the side edge part of the female glass substrate 50 on the turntable 26, forms otch (breaking joint) along the direction of line preset lines in mounting.
In addition, control the location, rotating mechanism 25, laser oscillator 34 etc. of slide unit 12 and pedestal 19 by control part (not shown).
By such chalker under the situation that forms hidden crackle on the surface of female glass substrate 50, at first, the information of the size of female glass substrate 50, the position of line preset lines etc. is input in the control part.
Then, female glass substrate 50 is fixed on turntable 26 and by attraction mechanism by mounting.If reach such state, then, the alignment mark that is located on female glass substrate 50 is made a video recording by ccd video camera 38 and 39.The alignment mark of being made a video recording shows by monitor 28 and 29, in image processing apparatus the positional information of the alignment mark on female glass substrate 50 is handled.
If turntable 26 is positioned with respect to supporting station 31, then turntable 26 slides along directions X, and line preset lines and break bar 35 in the side edge part of female glass substrate 50 are opposed.Then, break bar 35 descends, and forms otch (breaking joint) TR on the side edge part of the line preset lines of female glass substrate 50.
Thereafter, turntable 26 slides on directions X along the line preset lines, produce laser beams from laser oscillation apparatus 34 vibration simultaneously, and spray the cooling medium of cooling waters etc., and cooling water etc. is ejected with compressed air from main cooling jet 37 from auxiliary cooling jet 41.
By the laser beam that produces from laser oscillation apparatus 34 vibration, on female glass substrate 50, form along the laser point LS1 of the elongated elliptical shape of X-direction along the scanning direction of female glass substrate 50.Then,, spray cooling medium along the line preset lines, thereby form auxiliary cooling point ACP from auxiliary cooling jet 41 at the rear of this laser point LS1.And then, at the rear of this auxiliary cooling point ACP, spray cooling medium along the line preset lines, thereby form main cooling point MCP from main cooling jet 37.
Thus, as previously mentioned, if heat, then utilize the auxiliary stress gradient of cooling off the cooling of some ACP and main cooling point MCP and forming by laser point LS1, compare with the situation up to now that does not adopt auxiliary cooling point ACP, on female glass substrate 50, deeper be formed with vertical hidden crackle.
If be formed with hidden crackle on female glass substrate 50, then female glass substrate 50 is fed into the next one and blocks operation, to female glass substrate application of force, makes bending moment act on the width of hidden crackle.Thus, female glass substrate 50 is blocked along hidden crackle from being located at the otch TR of its side edge part.
In addition, in the explanation of above embodiment, though form a main cooling point MCP and an auxiliary cooling point ACP by directly cooling medium being ejected into line preset lines SL respectively from main cooling jet 37 and auxiliary cooling jet 45, but be preferably following formation: for example, have and make main cooling jet 37 and auxiliary cooling jet 45 individually along mechanism that directions X and Y direction move, can regulate laser point LS1 and the auxiliary interval of some ACP and the interval of auxiliary cooling point ACP and main cooling point MCP of cooling off on the line preset lines freely, perhaps will assist a cooling ACP and the set positions of main cooling point MCP is the position of staggering on the line preset lines.
Again, in embodiments of the present invention, though an example of using female glass substrate of display panels to be used as brittle substrate describes, the present invention also is applicable to the line processing of bonding glass substrate, veneer glass, semiconductor wafer, pottery etc.
Again, in the explanation till above-mentioned, though the big situation of thermal energy intensity to the thermal energy strength ratio central portion of the outer peripheral edges portion that is formed at the laser point LS1 on female glass substrate 50 is illustrated, it is also passable that the thermal energy of laser point LS1 is distributed as Gaussian distribution.
(embodiment)
Then, use this chalker, the embodiment that forms hidden crackle under various conditions on glass substrate is described.
(embodiment 1)
The laser beam that produces from laser oscillator 34 vibration is made as 200W, is radiated on the soda-lime glass substrate of thickness 3.0mm and has formed hidden crackle.Be formed at laser point LS1 on the glass substrate and be for example elliptical shape of major axis 40mm, minor axis 1.5mm, the main cooling point MCP that forms by the refrigerant that sprays from main cooling jet 37 is formed at the position apart from the center 85mm of laser point LS1, again, the auxiliary cooling point ACP that forms by the refrigerant that sprays from auxiliary cooling jet 41 is formed on the master and cools off some MCP on the position of the side of the laser point LS1 of 10mm.
Use front inner diameter as the nozzle of 0.6mm as main cooling jet 37, use front inner diameter as the nozzle of 0.8mm as auxiliary cooling jet 41.
With the surface of glass substrate height at a distance of 5mm, from main cooling jet 37 with 0.5Mpa (flow: pressure injection water 10L/min) and compressed-air actuated fluid-mixing.Again, with the surface of glass substrate height at a distance of 1mm, from auxiliary cooling jet 41 also with 0.2Mpa (flow: pressure injection compressed air 14L/min).And then the translational speed of glass substrate is unit and ladder ground changes with 10mm/s from 100mm/s to 180mm/s, forms hidden crackle on glass substrate, measures its degree of depth δ.Its result as shown in Figure 3.In addition, for the ease of relatively, in Fig. 3, also mark not the degree of depth δ of the hidden crackle when forming auxiliary cooling ACP in the lump by auxiliary cooling jet 41.
In this case, by formed auxiliary cooling point ACP by auxiliary cooling jet 41, compare with the situation that does not form auxiliary cooling point ACP, the degree of depth δ of hidden crackle deepens about 10%.
(embodiment 2)
Glass substrate is made as the soda-lime glass substrate of thickness 1.1mm, from main cooling jet 37 with 0.5Mpa (flow: pressure injection water 10L/min) and compressed-air actuated fluid-mixing.Again, from auxiliary cooling jet 41 also with 0.2Mpa (flow: pressure injection compressed air 14L/min), and then, leave the auxiliary cooling jet 41 of compartment of terrain configuration of 7mm with main cooling jet 37.The translational speed of glass substrate is unit and ladder ground changes with 20mm/s from 100mm/s to 400mm/s, forms hidden crackle on glass substrate, measures its degree of depth δ.Its result as shown in Figure 4.In addition, for the ease of relatively, in Fig. 4, also mark not the degree of depth δ of the hidden crackle when forming auxiliary cooling ACP in the lump by auxiliary cooling jet 41.
Again, other implementation condition is identical with embodiment 1.
In this case, by formed auxiliary cooling point ACP by auxiliary cooling jet 41, compare with the situation that does not form auxiliary cooling point ACP, the degree of depth δ of hidden crackle also deepens about 10%.
(embodiment 3)
The position of the auxiliary cooling point ACP that is formed by auxiliary cooling jet 41 is changed between 0mm～15mm with respect to the main position of cooling off some MCP that is formed by main cooling jet 37, make pressure when spraying cooling mediums at 0.1Mpa (flow: 7L/min), 0.2Mpa (flow: 14L/min) and 0.3Mpa (flow: 21L/min) change between the three by auxiliary cooling jet 41, in addition condition is identical with embodiment 1, form hidden crackle thus, measure its degree of depth δ.Its result as shown in Figure 5.
In this case, make that the distance between auxiliary cooling jet 41 and the main cooling jet 37 is about 10mm, and on glass substrate, form auxiliary cooling point ACP, thus, compare with the situation that does not form auxiliary cooling point ACP, the degree of depth δ of hidden crackle deepens about 10%.
(embodiment 4)
The position of the auxiliary cooling point ACP that is formed by auxiliary cooling jet 41 is changed between 5mm～9mm at a distance of the distance of the main cooling point MCP that is formed by main cooling jet 37, make pressure when spraying cooling mediums at 0.1Mpa (flow: 7L/min), 0.2Mpa (flow: 14L/min) and 0.3Mpa (flow: 21L/min) change between the three by auxiliary cooling jet 41, in addition condition is identical with embodiment 2, form hidden crackle thus, measure its degree of depth δ.Its result as shown in Figure 6.
In this case, make that the distance between auxiliary cooling jet 41 and the main cooling jet 37 is about 7mm, and on glass substrate, also form auxiliary cooling point ACP, thus, compare with the situation that does not form auxiliary cooling point ACP, the degree of depth δ of hidden crackle deepens about 10%.
Fig. 7 is the vertical view of pattern ground expression other embodiment of the present invention.By the laser beam that produces from laser oscillation apparatus 34 vibration, on female glass substrate 50, form along the laser point LS1 of the elongated elliptical shape of X-direction along the scanning direction of female glass substrate 50.Then, at the rear of this laser point LS1, spray cooling medium from a plurality of auxiliary cooling jets 41 along the line preset lines, thereby form a plurality of auxiliary cooling point ACP.And then, at the rear of these a plurality of auxiliary cooling point ACP, spray cooling medium along line preset lines SL, thereby form main cooling point MCP from main cooling jet 37.
After heat successively along line preset lines SL and by laser point LS1 on the surface of female glass substrate 50, its heating part is before soon being cooled by a main cooling point MCP, be cooled under by a plurality of auxiliary cooling point ACP successively than the high temperature of the temperature of the refrigerant that forms main cooling point MCP, by the refrigerant that form main cooling point MCP than the temperature of the refrigerant that form auxiliary cooling point ACP low temperature under be cooled thereafter.
Again, prior art shown in Figure 8 by the scribble method that laser carried out in, because after the surface of female glass substrate 50 being heated by laser point LS, spray the surface that cooling medium cools off female glass substrate 50, so except forming hidden crackle, also produced useless thermal shock.
By a plurality of auxiliary cooling point ACP being set in a side than the close laser point LS1 of main cooling point MCP, can relax above-mentioned useless thermal shock, the energy that will be lost by thermal shock is used to make the power of hidden crackle elongation, by establishing a plurality of auxiliary cooling points, can cool off female glass substrate successively, can not produce useless thermal shock, be that 1 situation is compared and can be formed darker hidden crackle (vertical crack) with auxiliary cooling point.
Because main cooling point is identical with the situation that forms an aforementioned auxiliary cooling point on female glass substrate with the cooling medium of auxiliary cooling point forming on the glass substrate, so do not describe in detail at this.
Again, formation as chalker, be preferably: for example, have and make main cooling jet 37 and a plurality of auxiliary cooling jet 41 individually along mechanism that directions X and Y direction move, can on the line preset lines, regulate laser point LS1 and the interval that is positioned at the auxiliary cooling point ACP of the most close laser point one side freely, be positioned at the interval of auxiliary cooling point ACP with the main cooling point MCP of the most close main cooling point MCP one side, and the mutual interval of a plurality of auxiliary cooling points, and then with set positions the position on line preset lines stagger of a plurality of auxiliary cooling point ACP with main cooling point MCP.
Like this, by being set, at least one auxiliary cooling point realizes the present invention between laser point on female glass substrate and main cooling point.
Industrial applicibility
Like this, the scribble method of brittle substrate of the present invention and chalker are being formed at mother Between the lip-deep laser spots of the brittle substrate of glass substrate etc. and the main cooling point, connecing Form auxiliary cooling point on the position of nearly main cooling point, so can form deeper hidden splitting Therefore line, can form hidden crackle efficiently.
Claims (3)
1. the scribble method of a brittle substrate, lip-deep line preset lines along brittle substrate, illuminating laser beam and moving it continuously, with the formation temperature laser point lower than the softening point of this brittle substrate, by near cooling medium the zone of line preset lines, cooling off to the rear of this laser point, thereby form main cooling point, form hidden crackle continuously along the line preset lines
It is characterized in that, in a side than the more close laser point of described main cooling point, Yi Bian be formed in advance at least one that cool off along the zone of line preset lines being assisted cooling point by refrigerant, Yi Bian rule.
2. the scribble method of brittle substrate as claimed in claim 1, aforementioned auxiliary cooling point utilize chilling temperature, and the refrigerant higher than the chilling temperature of the refrigerant that forms aforementioned main cooling point forms.
3. the chalker of a brittle substrate possesses: the laser beam irradiation means, and meanwhile continuously illuminating laser beam move it, with the laser point lower of formation temperature on the surface of this brittle substrate than the softening point of brittle substrate;
Main cooling body utilizes refrigerant near cooling off continuously the zone of line preset lines by this laser point area heated rear; Lip-deep line preset lines along brittle substrate forms hidden crackle, it is characterized in that,
Have at least one auxiliary cooling body, it utilizes the temperature refrigerant higher than the temperature of the refrigerant of above-mentioned main cooling body, and cooling raio is by the above-mentioned main cooling body institute more close zone by formed laser point one side of aforementioned laser bundle irradiation means of cooled zones.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP234049/2002 | 2002-08-09 | ||
| JP2002234049 | 2002-08-09 |
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| CN1638931A CN1638931A (en) | 2005-07-13 |
| CN1298523C true CN1298523C (en) | 2007-02-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB038049163A Expired - Fee Related CN1298523C (en) | 2002-08-09 | 2003-08-04 | Method and device for scribing fragile material substrate |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP4080484B2 (en) |
| KR (1) | KR100649894B1 (en) |
| CN (1) | CN1298523C (en) |
| AU (1) | AU2003252389A1 (en) |
| TW (1) | TWI277612B (en) |
| WO (1) | WO2004014625A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106573819A (en) * | 2014-08-20 | 2017-04-19 | 康宁股份有限公司 | Method and apparatus for yielding high edge strength in cutting of flexible thin glass |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4619024B2 (en) * | 2004-03-19 | 2011-01-26 | 芝浦メカトロニクス株式会社 | Brittle material cleaving system and method |
| US20070284785A1 (en) * | 2004-06-21 | 2007-12-13 | Applied Photonicss, Inc. | Device, System and Method for Cutting, Cleaving or Separating a Substrate Material |
| EP1806202B1 (en) | 2004-10-25 | 2011-08-17 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and device for forming crack |
| KR100740456B1 (en) * | 2006-08-31 | 2007-07-18 | 로체 시스템즈(주) | Nonmetal-plate cutting method and device using precooling |
| WO2008133800A1 (en) * | 2007-04-30 | 2008-11-06 | Corning Incorporated | Apparatus, system, and method for scoring a moving glass ribbon |
| JP5011048B2 (en) * | 2007-09-27 | 2012-08-29 | 三星ダイヤモンド工業株式会社 | Processing method of brittle material substrate |
| KR20120046752A (en) * | 2009-07-22 | 2012-05-10 | 코닝 인코포레이티드 | Heat-and-quench scoring process quench zone |
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| WO2011162392A1 (en) * | 2010-06-25 | 2011-12-29 | 旭硝子株式会社 | Cutting method and cutting apparatus |
| US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
| TWI400137B (en) * | 2010-12-17 | 2013-07-01 | Ind Tech Res Inst | Device for removing defects on edges of glass sheets and method therefor |
| CN102643017B (en) * | 2011-03-14 | 2014-09-10 | 京东方科技集团股份有限公司 | Non-contact type breaking method and equipment and method and equipment for cutting and breaking |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| CN110480192B (en) * | 2019-08-28 | 2021-06-11 | 业成科技（成都）有限公司 | Method for cutting brittle material |
| JP7459536B2 (en) * | 2020-02-04 | 2024-04-02 | 日本電気硝子株式会社 | Glass plate and method for producing the same |
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- 2003-08-01 TW TW092121110A patent/TWI277612B/en not_active IP Right Cessation
- 2003-08-04 WO PCT/JP2003/009899 patent/WO2004014625A1/en active Application Filing
- 2003-08-04 AU AU2003252389A patent/AU2003252389A1/en not_active Abandoned
- 2003-08-04 JP JP2004527333A patent/JP4080484B2/en not_active Expired - Fee Related
- 2003-08-04 KR KR1020047011519A patent/KR100649894B1/en not_active IP Right Cessation
- 2003-08-04 CN CNB038049163A patent/CN1298523C/en not_active Expired - Fee Related
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| CN1018621B (en) * | 1986-09-26 | 1992-10-14 | 株式会社半导体能源研究所 | Laser scribing system and method |
| JP2000233936A (en) * | 1999-02-10 | 2000-08-29 | Mitsuboshi Diamond Kogyo Kk | Glass cutting device |
| JP2001064029A (en) * | 1999-08-27 | 2001-03-13 | Toyo Commun Equip Co Ltd | Multilayered glass substrate and its cutting method |
| JP2002144067A (en) * | 2000-10-21 | 2002-05-21 | Samsung Electronics Co Ltd | Method and device for cutting non-metallic substrate with laser beam |
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| CN106573819A (en) * | 2014-08-20 | 2017-04-19 | 康宁股份有限公司 | Method and apparatus for yielding high edge strength in cutting of flexible thin glass |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI277612B (en) | 2007-04-01 |
| WO2004014625A1 (en) | 2004-02-19 |
| KR100649894B1 (en) | 2006-11-27 |
| CN1638931A (en) | 2005-07-13 |
| JPWO2004014625A1 (en) | 2005-12-02 |
| AU2003252389A1 (en) | 2004-02-25 |
| TW200403193A (en) | 2004-03-01 |
| KR20050018636A (en) | 2005-02-23 |
| JP4080484B2 (en) | 2008-04-23 |
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