CN1292091C - Sputtering machine table and its sputtering carrying table - Google Patents
Sputtering machine table and its sputtering carrying table Download PDFInfo
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- CN1292091C CN1292091C CN 200410062331 CN200410062331A CN1292091C CN 1292091 C CN1292091 C CN 1292091C CN 200410062331 CN200410062331 CN 200410062331 CN 200410062331 A CN200410062331 A CN 200410062331A CN 1292091 C CN1292091 C CN 1292091C
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- sputtering
- linings
- carrying platform
- machine table
- slotted eyes
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Abstract
The present invention relates to a sputtering carrying table which is suitable for carrying a basal plate for sputtering processes and comprises a pedestal, a plurality of linings and a bearing plate, wherein the pedestal is provided with a plurality of slotted holes and a plurality of position pins which can be correspondingly arranged in the slotted holes, and the linings are sheathed in the slotted holes and are respectively exposed out of the position pins. In addition, the bearing plate is arranged on the pedestal and the linings and is used for bearing the basal plate, the bearing plate is provided with a plurality of holes corresponding to the slotted holes so as to expose the position pin, and therefore, the position pins can be buckled on the edge of the basal plate so as to fix the basal plate. In the process of sputtering, the sputtering carrying table can prevent sputtering substances from directly attaching on the pedestal exposed out of the holes, and therefore, the production quality is improved.
Description
Technical field
The present invention is relevant for a kind of sputtering machine table and sputtering carrying platform thereof, and is particularly to a kind of residual sputtering machine table and the sputtering carrying platform thereof that can effectively avoid sputter material in the sputter process.
Background technology
Along with the manufacture of semiconductor continuous advancement in technology, drive the flourish of whole electronic industry, and the electronic product of all kinds of novelties is come out one after another also.Wherein, on the market of indicating meter, liquid-crystal display because have that volume is little, in light weight, low voltage drive, low power consumption, portable advantage such as do not take up space, and its product application scope very extensively, ever-changing from daily life field to industrial high-level application etc., comprise clock and watch, counter, TV, communication product, medical device, air transportation, industrial equipments, military special purpose etc., make high-quality liquid-crystal display that the trend that replaces traditional color-picture tube gradually be arranged.
Liquid-crystal display (LCD; Liquid Crystal Display) manufacturing process is as follows haply: clean glass substrate (preceding cleaning engineering), form one deck indium tin oxide (ITO on glass substrate; Indium Tin Oxide) conductive layer (pattern engineering), on the indium tin oxide conductive layer, form one deck alignment film (orientation transfer printing engineering), a kind of clearance material (spacer) is scattered in the crack between two sheet glass substrates, megohmite (glue frame coating engineering) at two sheet glass substrate peripherals printing Resins, epoxy, with two plate bases applyings (combination sealing engineering), cutting and sliver, liquid crystal injects and pressure seal, the glass substrate corner chamfering engineering of liquid crystal panel, the liquid crystal panel check, polaroid attaches engineering, and last check.Wherein, the sputter technology in the physical vapor deposition is made mostly for above-mentioned conductive layer.
Please also refer to Figure 1A and Figure 1B, it illustrates the illustrative view of the sputtering machine table of known display panels respectively.Sputtering machine table 100 mainly comprises a sputter chamber (chamber) 110, a sputtering carrying platform (being illustrated in Fig. 1 C), shielding (mask) 130 and a negative electrode (cathode) 120, wherein sputtering carrying platform is positioned at sputter chamber 110, desire to carry out the glass substrate (not illustrating) of sputter with carrying, and 130 the effect of shielding is in definition sputter zone, and can avoid forming metal deposit in other zone of glass substrate (not illustrating) sputtering carrying platform in addition.In addition, negative electrode 120 is located at the opening part of sputter chamber 110, and disposes target in the negative electrode 120, for the usefulness of sputter.When carrying out the sputter process of glass substrate 102, at first grasp glass substrate 102 to sputter chamber 110 by mechanical arm.Then, rotating cathode 120, so that sputter chamber 110 and negative electrode 120 driving fits, to carry out follow-up sputter action.
Please refer to Fig. 1 C, it illustrates the decomposing schematic representation of above-mentioned sputtering carrying platform, wherein for every assembly of clear expression sputtering carrying platform, does not illustrate above-mentioned glass substrate among the figure.Sputtering carrying platform for example comprises 140 and bases of a carrier (susceptor) (platen) 150, and wherein the periphery of base 150 has several slotted eyes 152a and 152b.In addition, have several perforate 142a and 142b on the carrier 140, dispose steady brace (stop ﹠amp in the slotted eye 152a of base 150 respectively movably corresponding to slotted eye 152a and 152b; Clamp pin) 154a, it is outside can being exposed to through perforate 142a, the slotted eye 152b that perforate 142b is corresponding with it then can be for supporting pin (the supporting pin does not illustrate) turnover that is positioned at base (platen) 150 belows.Supporting pin (not illustrating) in order to the support glass substrate, and falls within on the carrier 140 glass substrate above glass substrate enters base 150 time reposefully, and then steady brace 154a just can be fastened on the edge of glass substrate, with the position of fixing glass substrate.
Though it should be noted that in the sputter process of known display panels, shielding can effectively be avoided the overwhelming majority zone of sputter electrodeposition substance on base with carrier.Yet, because slotted eye is when carrying out sputter process, can sees through perforate and directly be exposed to the sputter chamber, so after sputter finished, the inner subregion peripheral with it of slotted eye will deposit sputter material partly.Thus, after the sputter action of carrying out repeatedly, the sputter material that is attached to aforementioned region will peel off because of the start repeatedly of thickness increase and steady brace and supporting pin, make that the cleanliness factor in the sputtering machine table descends, and then influence the yield of the sputter process of display panels.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of sputtering carrying platform exactly, and the sputter material directly is attached on the base in the sputter process in order to avoid, and keeping the cleanliness factor in the sputtering machine table, and then improves the yield of sputter process.
Another object of the present invention is more providing a kind of sputtering machine table, and it can effectively avoid the residual of sputter material in the sputter process, thereby has preferable cleanliness factor, and preferable process rate can be provided.
Based on above-mentioned purpose, the present invention proposes a kind of sputtering carrying platform, and it is suitable for carrying a substrate to carry out sputter process, and this sputtering carrying platform for example comprises a base (platen), several linings and a carrier (susceptor).Wherein, base for example has several slotted eyes and corresponding movably several steady braces (stop that is disposed in the slotted eye; Clamp Pin), be sheathed in the slotted eye and lining is a correspondence, and expose steady brace.In addition, carrier is disposed on base and the lining, and in order to bearing substrate, and carrier has several perforates corresponding to slotted eye, and in order to exposing steady brace, and steady brace is suitable for being fastened on the edge of substrate, with the position of fixing base.
Described according to preferred embodiment of the present invention, above-mentioned lining for example comprises a sleeve pipe and an annular plate, its middle sleeve has a perforation, and be sheathed in the slotted eye, and annular plate is bearing on the loading end of base, and the surface away from base of telescopic inwall or annular plate for example can be uneven surface, in order to increase the ability of lining absorption sputter material.In addition, annular plate is connected in the end that telescopic is adjacent to loading end, and annular plate has an endoporus, and it overlaps with the telescopic perforation, to expose the steady brace of correspondence.In addition, the telescopic shape is corresponding with the profile phase of slotted eye, and the material of lining for example can be porous material or metallic substance (as stainless steel etc.).
Based on above-mentioned sputtering carrying platform, the present invention more proposes a kind of sputtering machine table, and it for example comprises a sputter chamber, a negative electrode, a shielding and an above-mentioned sputtering carrying platform.Wherein, sputtering carrying platform is disposed in the sputter chamber, and it for example carries a substrate, to carry out sputter process.In addition, the sputter chamber has an opening, and cathode arrangement is in the opening part of sputter chamber, and shield configuration is between sputter chamber and negative electrode, in order to the sputter zone of definition substrate, and avoid sputter electrodeposition substance other zone in glass substrate sputtering carrying platform in addition.
Based on above-mentioned, sputtering machine table of the present invention under the principle of the original design of not destroying board, a sheathed lining respectively in the slotted eye of base, the sputter material is attached to the susceptor surface of slotted eye inwall and periphery thereof when avoiding sputter.In addition, the sleeve surface of sputtering machine table of the present invention can be carried out the action of roughening such as for example sandblasting, or lining itself can be made by porous material, makes its surface present roughness, to increase the sticking power between sputter material and the sleeve surface.Thus, can effectively avoid the sputter material to come off, keeping the cleanliness factor in the sputtering machine table, and then improve the production yield of sputter process.What deserves to be mentioned is, be sheathed in the slotted eye that therefore not only the dismounting action simply more can be taken off in the lump and be cleaned, and reach recycling, cost-effective purpose when cleaning light shield because lining of the present invention is movable ground.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A and Figure 1B illustrate the illustrative view into the sputtering machine table of known display panels respectively.
Fig. 1 C illustrates the decomposing schematic representation into the sputtering carrying platform among Figure 1A and Figure 1B.
Fig. 2 illustrates the synoptic diagram into a kind of sputtering machine table of preferred embodiment of the present invention.
Fig. 3 illustrates the synoptic diagram into the sputtering carrying platform of Fig. 2.
Fig. 4 illustrates the diagrammatic cross-section into the A-A ' line of Fig. 3.
Fig. 5 illustrates the plan view into the lining of Fig. 3.
Nomenclature
100: sputtering machine table;
102: glass substrate;
110: the sputter chamber;
120: negative electrode
130: shielding;
140: carrier;
142a, 142b: perforate;
150: base;
152a, 152b: slotted eye;
154a: steady brace;
200: sputtering machine table;
202: glass substrate;
210: the sputter chamber;
220: negative electrode;
230: shielding;
240: carrier;
242a, 242b: perforate;
250: base;
252a, 252b: slotted eye;
254a: steady brace;
260a: lining;
262: annular plate;
262a. endoporus;
264: sleeve pipe;
264a: perforation
Embodiment
Please refer to Fig. 2, it illustrates the synoptic diagram of a kind of sputtering machine table of preferred embodiment of the present invention.Sputtering machine table 200 for example comprises that a sputter chamber 210, a sputtering carrying platform are positioned at sputter chamber 210 (being illustrated in Fig. 3), one shielding, 230 and one negative electrode 220, wherein for example dispose sputtered target material (not illustrating) in the negative electrode 220, required atom when it can provide sputter-deposited via the impact of plasma ion, and sputtering carrying platform is suitable for carrying a substrate 202, and it for example can be the glass substrate that is used to make display panels.In addition, shielding 230 is disposed at the opening part of sputter chamber 210, and its effect is the sputter zone on definition substrate 202, and avoids the position of sputter electrodeposition substance outside the sputter zone.After substrate 202 was fixed in sputtering carrying platform, negative electrode 220 can be with respect to sputter chamber 210 rotation, and so that sputter chamber 210 is closed, and glass substrate 202 carries out sputter in axial mode.
For more clearly explanation is provided, please refer to Fig. 3, it illustrates the decomposing schematic representation of the sputtering carrying platform of Fig. 2.Sputtering carrying platform for example comprises a base 250 and a carrier 240, wherein the periphery on the surface of base 250 for example has several slotted eyes 252a and 252b, and has several perforates 242a and 242b respectively on the position corresponding to slotted eye 252a and slotted eye 252b of carrier 240.In addition, for example dispose steady brace 254a (only illustrating among the figure) in the slotted eye 252a respectively, it is outside perforate 242a is exposed to, and the slotted eye 252b perforate 242b corresponding with it can pass for several supporting pins (not illustrating) that are positioned at base 250 belows, moves up and down with respect to base 250 with support glass substrate (not illustrating).
For example, when mechanical arm was delivered to base 250 tops with glass substrate, supporting pin (not illustrating) passed slotted eye 252b and perforate 242b and protrudes in carrier 240 tops, with the support glass substrate.Then, mechanical arm leaves glass substrate, and supporting pin (not illustrating) withdrawal downwards falls within on the carrier 240 glass substrate.Then, steady brace 254a is fastened on the outer rim of glass substrate, with the position of fixing glass substrate, and carries out follow-up sputter action.
Sputtering machine table 200 of the present invention is attached to the zone of the slotted eye 252a and the periphery thereof of base 250 for avoiding known sputter material, several linings of configuration 260a is in order to isolated base 250 and sputter material in slotted eye 252a, wherein be simplified, Fig. 3 only illustrates a lining.
Please also refer to Fig. 3 and Fig. 4, wherein Fig. 4 illustrates the diagrammatic cross-section of the A-A ' line of Fig. 3.Carrier 240 is covered on base 250 and the lining 260a, and bearing glass substrate 202 on the carrier 240, and lining 260a correspondence is sheathed in the slotted eye 252a, and exposes steady brace 254a respectively, so that steady brace 254a keeps normal start.In addition, steady brace 254a is fastened on the both sides lateral margin of glass substrate 202 respectively, with the position of fixing glass substrate 202.
Please also refer to Fig. 5, it illustrates the plan view of the lining of Fig. 3.Lining 260a for example is made of an annular plate 262 and a sleeve pipe 264, and the shape of rectangle sleeve pipe 264 is corresponding with slotted eye 252a.Annular plate 262 has an endoporus 262a, and it overlaps with the perforation 264a of sleeve pipe 264, to expose steady brace 254a.In a preferred embodiment, annular plate 262 for example can interconnect by the mode and the sleeve pipe 264 of spot welding, makes lining 260a to be bearing on the base 250 by annular plate 262.In addition, sleeve pipe 264 also can be integrated structure with annular plate 262, and it for example can form by modes such as casting or mechanical cuttings.
Accept above-mentioned, lining of the present invention for example can have uneven surface, wherein the upper surface of annular plate and telescopic inwall for example can carry out the action of roughenings such as embossment processing or sandblasting, so that its surface presents roughness, in the hope of utilizing membrane stress dispersive principle, effectively increase the sticking power on the surface of sputter material and lining, and the sputter material is incited somebody to action and difficult drop-off with combining of sleeve surface more firm.Moreover the material of lining is except that can be stainless steel and other metal materials, and it more can be for example made by porous material, to provide the sputter material preferable sticking power.
It should be noted that, the present invention also can dispose lining in the slotted eye for the supporting pin turnover, to avoid deposition sputter material in this slotted eye, wherein in this slotted eye the shape of sheathed lining corresponding with the profile phase of slotted eye, right its detailed structure and distributing style no longer repeat to give unnecessary details at this because of similar to the above embodiments.In addition, the lining that is illustrated in the above embodiment of the present invention only is usefulness for example, in not breaking away from the spiritual scope of invention, the external form of lining and size are when can be different with the change of the kenel of the different or steady brace of the shape of slotted eye, with the demand of realistic running.
In sum, sputtering machine table of the present invention sputtering carrying platform dispose steady brace and for the slotted eye of supporting pin turnover in sheathed lining, in order to prevent the zone of sputter electrodeposition substance in inwall and its periphery of slotted eye.Thus, can effectively promote the cleanliness factor of sputtering machine table, and avoid the sputter material to pollute substrate, and then improve the yield of procedure for producing.In addition, be sheathed in the slotted eye lining movable of the present invention, thereby can look the deposition situation of sleeve surface at any time or regularly cooperate board to safeguard (process maintain, PM) time-histories, lining taken off on base clean, with the simplification cleaning action, and can reuse lining, reduce the cost of required cost.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of this skill person; without departing from the spirit and scope of the present invention; when the change that can do some a little and retouching, so protection scope of the present invention is as the criterion when looking above-mentioned the scope that claim defined.
Claims (14)
1. a sputtering carrying platform is suitable for carrying a substrate to carry out sputter process, it is characterized in that this sputtering carrying platform comprises at least:
A base has several slotted eyes and corresponding movably several steady braces that are disposed in these slotted eyes;
Several linings, correspondence are sheathed in these slotted eyes, and these linings expose these steady braces; And
One carrier is disposed on this base and these linings, in order to carry this substrate, wherein this carrier has several perforates corresponding to these slotted eyes, in order to exposing these steady braces, and these steady braces are suitable for being fastened on the edge of this substrate, to fix the position of this substrate.
2. sputtering carrying platform as claimed in claim 1 is characterized in that, wherein said lining comprises:
A sleeve pipe has a perforation, and this casing pipe sleeve is located at these slotted eyes in one of them; And
An annular plate, be bearing on the loading end of this base, wherein this annular plate is connected in the end that this telescopic is adjacent to this loading end, and annular plate has an endoporus, and this endoporus overlaps with this perforation of this telescopic, with expose these corresponding steady braces one of them.
3. sputtering carrying platform as claimed in claim 2 is characterized in that, wherein said telescopic inwall and described annular plate one of them is a uneven surface at least away from the surface of this base.
4. sputtering carrying platform as claimed in claim 2 is characterized in that, wherein these telescopic shapes are corresponding with the profile phase of these slotted eyes.
5. sputtering carrying platform as claimed in claim 1 is characterized in that wherein the material of these linings comprises metal.
6. sputtering carrying platform as claimed in claim 5 is characterized in that wherein the material of these linings comprises stainless steel.
7. sputtering carrying platform as claimed in claim 1 is characterized in that wherein the material of these linings comprises porous material.
8. a sputtering machine table is suitable for a substrate is carried out sputter process, it is characterized in that this sputtering machine table comprises:
A sputter chamber has an opening;
One negative electrode is disposed at this opening part of this sputter chamber;
One sputtering carrying platform be disposed in this sputter chamber, and this sputtering carrying platform comprises:
(1) base has several slotted eyes and corresponding movably several steady braces that are disposed in these slotted eyes;
(2) several linings, correspondence is sheathed in these slotted eyes, and these linings expose these steady braces;
(3) one carriers are disposed on this base and these linings, in order to carry this substrate, wherein this carrier has several perforates corresponding to these slotted eyes, in order to exposing these steady braces, and these steady braces are suitable for being fastened on the edge of this substrate, to fix the position of this substrate; And
One shielding is disposed between this sputter chamber and this negative electrode.
9. sputtering machine table as claimed in claim 8 is characterized in that, wherein said lining comprises:
A sleeve pipe has a perforation, and this casing pipe sleeve is located at these slotted eyes in one of them; And
An annular plate, be bearing on the loading end of this base, wherein this annular plate is connected in the end that this telescopic is adjacent to this loading end, and annular plate has an endoporus, and this endoporus overlaps with the perforation of this telescopic, with these steady braces of exposing correspondence one of them.
10. sputtering machine table as claimed in claim 9 is characterized in that, wherein said telescopic inwall and described annular plate one of them is a uneven surface at least away from the surface of this base.
11. sputtering machine table as claimed in claim 9 is characterized in that, wherein these telescopic shapes are corresponding with the profile phase of these slotted eyes.
12. sputtering machine table as claimed in claim 8 is characterized in that, wherein the material of these linings comprises metal.
13. sputtering machine table as claimed in claim 12 is characterized in that, wherein the material of these linings comprises stainless steel.
14. sputtering machine table as claimed in claim 8 is characterized in that, wherein the material of these linings comprises porous material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410062331 CN1292091C (en) | 2004-07-01 | 2004-07-01 | Sputtering machine table and its sputtering carrying table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410062331 CN1292091C (en) | 2004-07-01 | 2004-07-01 | Sputtering machine table and its sputtering carrying table |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1587437A CN1587437A (en) | 2005-03-02 |
| CN1292091C true CN1292091C (en) | 2006-12-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410062331 Expired - Fee Related CN1292091C (en) | 2004-07-01 | 2004-07-01 | Sputtering machine table and its sputtering carrying table |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1292091C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101358333B (en) * | 2007-08-02 | 2011-05-04 | 鸿富锦精密工业（深圳）有限公司 | Clamping device of sputtering substrate |
| TWI473899B (en) * | 2012-04-06 | 2015-02-21 | Au Optronics Corp | Sputtering device |
-
2004
- 2004-07-01 CN CN 200410062331 patent/CN1292091C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1587437A (en) | 2005-03-02 |
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Granted publication date: 20061227 Termination date: 20200701 |