CN1264118C - 组合ic卡的安装方法和组合ic卡 - Google Patents
组合ic卡的安装方法和组合ic卡 Download PDFInfo
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Abstract
一种组合IC卡的安装方法,包括:在第一基板上形成安装IC模块的孔穴的开穴工序;通过将连接调整用调谐电容器和天线的信号线有选择地切断,将共振频率设定成各种共振频率中的一种的调整工序;以及在调整工序之后,将IC模块安装到形成在第一基板上的孔穴中的安装工序。在形成安装IC模块的孔穴的开穴工序的同时,通过切断连接调整用调谐电容器和天线的信号线,来设定各种共振频率。
Description
技术领域
本发明涉及以接触或非接触中的任何一种方式与外部进行数据通信的组合IC卡(或称双接口IC卡)的安装方法和组合IC卡。
背景技术
组合IC卡是以接触或非接触中的任何一种方式与外部进行数据通信的IC卡。
由于在以非接触方式使卡工作时,必须将无线收发机(R/W)发出的发送频率和卡内的共振电路调谐以接受供电,所以利用由导体夹持电路基板的表里而形成的图案电容器(Pattern condenser)和图案天线(Pattern antenna)以及LSI(大规模集成电路)形成共振电路。也有将电容器装入LSI内部的。
现在,由于在组合卡的制造工序中没有使共振电路调谐到特定频率的调整工序,所以LSI及天线每一批次的特性偏差就成为共振频率的偏差,通信特性不能发挥预定的能力。
另外,过去一直存在没有可以调整的电容器图案这一缺点。
发明内容
本发明的目的在于提供一种在以接触或非接触中的任何一种方式与外部进行数据通信的组合IC卡中可进行调谐电路调整的组合IC卡的安装方法。
为了实现上述目的,本发明提供一种组合IC卡的安装方法,该组合IC卡具有:在第一基板上由天线和调整用调谐电容器构成的调谐电路;与该调谐电路电连接并安装在上述第一基板上的IC模块,其中该IC模块包括LSI和与外部装置相连接的接触部;以及由上述调谐电路和上述LSI构成的共振电路,
该安装方法包括:
在上述第一基板上形成安装上述IC模块的孔穴的开穴工序;
通过将连接上述调整用调谐电容器和天线的信号线有选择地切断,将共振频率设定成各种共振频率中的一种的调整工序;以及
在上述调整工序之后,将上述IC模块安装到形成在上述第一基板上的孔穴中的安装工序。
更好是,通过上述开穴工序,在上述第一基板上形成安装上述IC模块的矩形形状的孔穴时,露出上述调整的信号线。
更好是,通过上述开穴工序,在上述第一基板上形成安装上述IC模块的矩形形状的孔穴时,在与上述天线的两端的端子露出的边不同的边上露出上述切断的信号线。
更好是,上述切断的信号线设置在利用上述开穴工序开穴后露出的位置上。
更好是,上述调整工序是将利用上述开穴工序开穴后露出的图案的一部分切断来进行调整的工序。
另外,本发明提供一种组合IC卡,包括:
具有由天线和至少一个调谐电容器构成的调谐电路的天线卡,上述天线具有天线端子并且被安装在第一基板上,上述至少一个调谐电容器通过信号线连接到上述天线和上述天线端子上;以及
IC模块,该IC模块电连接到上述调谐电路上,该IC模块安装在第一基板上,该IC模块包括LSI、与外部装置相连接的接触部、以及天线连接端子,上述LSI、上述接触部以及上述天线连接端子安装在第二基板上,
其中,上述IC模块的天线连接端子与上述天线卡的天线电连接,从而形成一个包括上述调谐电路和上述LSI的共振电路,
而且,通过有选择地切断上述信号线,上述共振电路的共振频率被调整成各种共振频率中的一种。
更好是,有选择地切断上述信号线信号线是在形成用于将上述IC模块安装到第一基板上的孔穴时进行的。
本发明的其他目的和优点可从下面的描述而得到了解,或通过本发明的实施而了解。本发明的目的和优点可通过下面具体指出的装置和组合而实现和取得。
附图说明
包含在本说明书中并构成其一部分的附图示出本发明现在的优选实施方式,并且与上述的概述及下面的优选实施方式的详细描述一起对本发明的原理予以说明。
图1为示出用来说明本发明的实施方式的组合IC卡的概略构成的示图。
图2为示出IC模块的概略构成的示图。
图3示出组合IC卡的等价电路图。
图4为示出LSI的内部结构的示图。
图5为示出天线基板的示图。
图6为示出天线基板的剖面图。
图7为开穴工序完成时的卡的剖面图。
图8为安装工序完成时的卡的剖面图。
图9为示出天线基板的示图。
图10为开穴工序完成的卡的外观图。
图11为示出切断电容器图案(信号线)的切断部的状态的示图。
图12为安装工序完成的卡的外观图。
图13为示出电容器图案的切断部的设置例的示图。
具体实施方式
下面,参照附图对本发明的实施方式的IC卡予以详细说明。
此IC卡是以接触或非接触(无线)中的任何一种方式与作为外部装置的读卡器和写卡器进行数据通信的组合IC卡1。
此组合IC卡1,如图1、图2所示,具有在天线卡2中由天线3和调整用调谐电容器(图案电容器)4、5、6、7构成的调谐电路8,并具有与此调谐电路8电连接并安装在上述天线卡2上的IC模块9。
此IC模块9包括:基板10、通过引线键合安装于基板10上的LSI 11、安装于此LSI 11的相反侧的基板10上的接触部12、以及连接用的焊盘13、14。
另外,由上述调谐电路8和LSI 11构成共振电路。
上述接触部12,比如,由多个端子12a-12h构成,包括工作用的电源电压(+5V)用的VCC端子12a,复位信号用的RST端子12b,时钟信号用的CLK端子12c,接地用的GND端子12d,存储器的写入电源电压用的VPP端子12e,数据输入输出用的I/O端子12f,以及预备端子12g、12h。
图3示出组合IC卡的等价电路图。
天线3、调谐电容器4、5、6、7及LSI 11形成共振电路,从外部供给的电波变换为电力使LSI 11动作,利用其余的电力返回响应以非接触方式进行数据通信。
以接触方式经接触部12进行数据通信。
本实施例,为了使组合IC卡1的共振频率调谐到特定的频率,通过将连接调谐电容器4、5、6、7和天线3的图案(信号线)的一部分(切断部Pa-Pd)有选择地切断,使共振电路的电容器的容量改变而进行调整。
上述LSI 11,如图4所示,包括电源生成部21、解调电路22、控制逻辑电路23、调制电路24、存储器25、时钟脉冲生成电路26以及接口27。
来自读卡器和写卡器的无线信号由调谐电路8接收。接收信号,由解调电路22解调,送到控制逻辑电路23,在该处进行命令分析。其结果,控制逻辑电路23根据命令内容对存储器25进行数据写入或数据读出。控制逻辑电路23从存储器25读出数据送到调制电路24。在调制电路24中,对数据进行调制,由调谐电路8通过无线方式发送到读卡器和写卡器。
电源生成部21是利用上述调谐电路8中的接收信号生成无线卡1内消耗的电源。
另外,时钟脉冲生成电路26利用上述调谐电路8中的接收信号生成使各个电路动作所必需的时钟脉冲,该时钟脉冲输出到解调电路22,调制电路24以及控制逻辑电路23。
所以,组合IC卡1,是将从卡外部(读卡器和写卡器)供给的电波变换为电力使LSI 11动作,利用其余的电力返回响应以非接触方式进行数据通信。
另外,接口27与上述接触部12相连接,对与接触部12相连接(接触)的外部装置(读卡器和写卡器)和控制逻辑电路23的数据进行收发。
图5示出本发明所使用的天线基板图。
天线基板31,基材采用厚度为0.025mm的聚对苯二甲酸乙二酯(以下称其为PET,图中未示出),在其一面上设置有连接通过刻蚀铝箔形成的天线3和IC模块9的天线端子32、33、及调谐电容器4、5、6、7的电极4a、5a、6a、7a,而在天线基板31的另一面同样由铝箔形成调谐电容器4、5、6、7的另一面上的电极4b、5b、6b、7b。
这样,调谐电容器4、5、6、7通过中间夹着介电质PET的导体电极而具有静电容量,在本实施例中的电容器的电极面积为1cm×1cm,具有约80PF的容量。
在本实施例中,表里的导体采用同一种类(铝),但也可以采用铜箔和铝箔与银浆料的组合。
在上述天线3的一端和调谐电容器4、5、6、7的电极4a、5a、6a、7a之间进行布线,并且在上述天线3的另一端和调谐电容器4、5、6、7的电极4b、5b、6ab、7b之间进行布线。
另外,组合IC卡1,为了调整到某一特定的共振频率,在开穴工序时通过切断调谐电容器4、5、6、7的图案而使其改变。
此处,调整用的电容器的容量值,通过预先利用与IC模块9的焊盘13、14接触的探针进行的测定而确定修正值。
在本实施例中,LSI 11的安装方法是引线键合方式,但也可以采用倒装片方式等。
图6-图8为本发明的实施例(组合IC卡1的工序流程)。
如图5、图6、图9所示,天线卡36是在天线基板31的表和里上把PET片及PVC(聚氯乙烯)片34、35叠层一体化而成的结构。
在此天线卡36的规定位置上通过开穴工序掘出埋入IC模块9的孔穴41、42,在安装工序中埋入LSI 11而变成组合IC卡1。
此时的共振频率取调谐电容器4、5、6、7和LSI 11的电容器容量的相加值。
不过,由于LSI 11内部的电容器容量因LSI 11的制造批次等而有一定的偏差,所以由于其影响共振频率会偏离共振频率的目的值。
在本发明中提出以对LSI 11内部的电容器容量的偏差进行修正,使其与规定的频率共振为目的而有选择地切断调谐电容器4、5、6、7的手段。
下面对本实施例予以说明。
开穴工序完成了的卡的外观和剖面示于图1、图7和图10。用来粘接IC模块9的浅的粘接穴41和用来容纳LSI封装部的深穴42的状态是从卡的表面下凹。另外,连接天线3和调谐电容器4、5、6、7的图案的一部分(切断部Pa-Pe),从IC模块9的粘接穴41的下边露出。此时,由于调谐电容器4、5、6、7全部连接,如以C1、C2、C3、C4表示调谐电容器4、5、6、7的电容,则天线卡36的共振频率为:
f=1/2π(L(C1+C2+C3+C4))1/2
不过,在通过事前检查了解到IC模块9的内部容量比预想值大(C1+C2)时,如图11所示,在调整工序中将与调谐电容器4、5连接的电容器图案(信号线)的切断部Pa、Pb切断而进行容量调整。
在本实施例中,由于电容器图案的切断部Pa、Pb,是利用开穴时的切断器(cutter)在开穴时实施,所以不另外需要调整用的切断器。
另外,也可以利用调整用的切断器切断图案。
此外,通过将切断部Pe切断,可以将调谐电容器4、5、6、7的容量全部切断。
另外,如本实施例的图1所示,由于电容器图案的切断部Pa-Pe是配置于与天线连接端子32、33所在的位置不同的一边,所以即使是为了连接天线连接端子32、33和IC模块9而使用导电粘合剂时,粘合剂溢出使切断的图案短路的危险也很小。
由此,可以防止在天线连接端子32、33和电容器图案的切断部Pa-Pd设置于同一边内时,由于导电粘合剂溢出到切断部Pa-Pd使切断的电容器再连接的危险性。
在本实施例中,利用图8所示的安装工序,将临时粘接各向异性导电粘接膜(图中未示出)的IC模块9放入安装用的粘接穴41、42,加热加压进行电气和物理连接而形成图12所示的组合IC卡1。
IC模块9的焊盘13、14分别连接到天线端子32、33,调谐电路8和LSI 11连接。
如上所述,比如,由于LSI 11内部的电容器容量因LSI 11的制造批次等而有一定的偏差,所以由于其影响共振频率会偏离共振频率的目的值f。
为了对LSI 11内部的电容器容量的偏差进行修正,使其与规定的频率共振为目的而有选择地与调谐电容器4、5、6、7相连接。其结果,即使是组合IC卡,也可以得到通信距离。
在上述示例中,说明的是通过以批次单位测定最初的数个LSI的共振频率的偏差,确定调整图案,但也可以测定一个一个LSI的共振频率的偏差确定调整图案。
另外,在上述示例中,电容器图案的切断部Pa-Pd是配置于与天线连接端子32、33所在的位置不同的一边,但也不限于此,如图13所示,也可以配置于同一边。
本发明的其他优点和改型对于本领域的技术人员是显而易见的。因此,广义的本发明不限于上述的具体细节和代表性的具体实施例。在不脱离由后附的权利要求及其等效物确定的发明总构思的精神和范围的情况下,可以实现多种改型。
Claims (7)
1.一种组合IC卡的安装方法,该组合IC卡具有:在第一基板上由天线和调整用调谐电容器构成的调谐电路;与该调谐电路电连接并安装在上述第一基板上的IC模块,其中该IC模块包括LSI和与外部装置相连接的接触部;以及由上述调谐电路和上述LSI构成的共振电路,
其特征在于,包括:
在上述第一基板上形成安装上述IC模块的孔穴的开穴工序;
通过将连接上述调整用调谐电容器和天线的信号线有选择地切断,将共振频率设定成各种共振频率中的一种的调整工序;以及
在上述调整工序之后,将上述IC模块安装到形成在上述第一基板上的孔穴中的安装工序。
2.如权利要求1所述的组合IC卡的安装方法,其特征在于,通过上述开穴工序,在上述第一基板上形成安装上述IC模块的矩形形状的孔穴时,露出上述调整的信号线。
3.如权利要求1所述的组合IC卡的安装方法,其特征在于,通过上述开穴工序,在上述第一基板上形成安装上述IC模块的矩形形状的孔穴时,在与上述天线的两端的端子露出的边不同的边上露出上述切断的信号线。
4.如权利要求1所述的组合IC卡的安装方法,其特征在于,上述切断的信号线设置在利用上述开穴工序开穴后露出的位置上。
5.如权利要求1所述的组合IC卡的安装方法,其特征在于,上述调整工序是将利用上述开穴工序开穴后露出的图案的一部分切断来进行调整的工序。
6.一种组合IC卡,包括:
具有由天线和至少一个调谐电容器构成的调谐电路的天线卡,上述天线具有天线端子并且被安装在第一基板上,上述至少一个调谐电容器通过信号线连接到上述天线和上述天线端子上;以及
IC模块,该IC模块电连接到上述调谐电路上,该IC模块安装在第一基板上,该IC模块包括LSI、与外部装置相连接的接触部、以及天线连接端子,上述LSI、上述接触部以及上述天线连接端子安装在第二基板上,
其特征在于,
上述IC模块的天线连接端子与上述天线卡的天线电连接,从而形成一个包括上述调谐电路和上述LSI的共振电路,
并且,通过有选择地切断上述信号线,上述共振电路的共振频率被调整成各种共振频率中的一种。
7.如权利要求6所述的组合IC卡,其特征在于,有选择地切断上述信号线信号线,是在形成用于将上述IC模块安装到第一基板上的孔穴时进行的。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102024176A (zh) * | 2010-12-09 | 2011-04-20 | 武汉天喻信息产业股份有限公司 | 一种双界面智能卡的制作方法 |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100602621B1 (ko) * | 2004-06-16 | 2006-07-19 | 한국조폐공사 | 조립식 콤비카드 및 이의 제조방법 |
US20060000914A1 (en) * | 2004-06-30 | 2006-01-05 | Chen Chien-Yuan | Memory card capable of wireless transmission |
WO2006034143A2 (en) * | 2004-09-16 | 2006-03-30 | Cirque Corporation | A contactless card reader integrated into a touchpad |
BRPI0607570A2 (pt) * | 2005-03-09 | 2009-09-15 | Diebold Inc | método; aparelho; aparelho para máquina de auto-atendimento bancário; máquina de auto-atendimento bancário |
US8527510B2 (en) | 2005-05-23 | 2013-09-03 | Monster Worldwide, Inc. | Intelligent job matching system and method |
FR2890212B1 (fr) * | 2005-08-30 | 2009-08-21 | Smart Packaging Solutions Sps | Module electronique a double interface de communication, notamment pour carte a puce |
JP2007172592A (ja) * | 2005-11-25 | 2007-07-05 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
US8195657B1 (en) | 2006-01-09 | 2012-06-05 | Monster Worldwide, Inc. | Apparatuses, systems and methods for data entry correlation |
US8600931B1 (en) | 2006-03-31 | 2013-12-03 | Monster Worldwide, Inc. | Apparatuses, methods and systems for automated online data submission |
US7965520B2 (en) * | 2007-01-22 | 2011-06-21 | Sony Ericsson Mobile Communications Ab | Electronic device with flip module having low height |
US9830575B1 (en) | 2008-04-21 | 2017-11-28 | Monster Worldwide, Inc. | Apparatuses, methods and systems for advancement path taxonomy |
JP5172762B2 (ja) * | 2009-03-27 | 2013-03-27 | リンテック株式会社 | アンテナ回路、icインレット、icタグ、およびアンテナ回路の容量調整方法 |
JP5423974B2 (ja) * | 2010-03-25 | 2014-02-19 | 大日本印刷株式会社 | 表示機能付き非接触式データキャリア |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
JP5724313B2 (ja) * | 2010-11-16 | 2015-05-27 | セイコーエプソン株式会社 | 無線通信装置 |
CN102328120B (zh) * | 2011-09-08 | 2013-04-17 | 张开兰 | 一种生产ic智能卡的铣槽方法 |
US9740342B2 (en) | 2011-12-23 | 2017-08-22 | Cirque Corporation | Method for preventing interference of contactless card reader and touch functions when they are physically and logically bound together for improved authentication security |
KR102134490B1 (ko) | 2012-01-12 | 2020-07-16 | 시냅틱스 인코포레이티드 | 단일층 용량성 이미징 센서들 |
US9262651B2 (en) | 2013-01-08 | 2016-02-16 | Cirque Corporation | Method for preventing unintended contactless interaction when performing contact interaction |
DE102013107003A1 (de) * | 2013-07-03 | 2015-01-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zum Anpassen eines Schwingkreises für ein Spielgerät |
US9542023B2 (en) | 2013-08-07 | 2017-01-10 | Synaptics Incorporated | Capacitive sensing using matrix electrodes driven by routing traces disposed in a source line layer |
US9298325B2 (en) | 2013-09-30 | 2016-03-29 | Synaptics Incorporated | Processing system for a capacitive sensing device |
US10042489B2 (en) | 2013-09-30 | 2018-08-07 | Synaptics Incorporated | Matrix sensor for image touch sensing |
US20150091842A1 (en) | 2013-09-30 | 2015-04-02 | Synaptics Incorporated | Matrix sensor for image touch sensing |
US9459367B2 (en) | 2013-10-02 | 2016-10-04 | Synaptics Incorporated | Capacitive sensor driving technique that enables hybrid sensing or equalization |
US9274662B2 (en) | 2013-10-18 | 2016-03-01 | Synaptics Incorporated | Sensor matrix pad for performing multiple capacitive sensing techniques |
US9081457B2 (en) | 2013-10-30 | 2015-07-14 | Synaptics Incorporated | Single-layer muti-touch capacitive imaging sensor |
US9798429B2 (en) | 2014-02-28 | 2017-10-24 | Synaptics Incorporated | Guard electrodes in a sensing stack |
KR101762778B1 (ko) | 2014-03-04 | 2017-07-28 | 엘지이노텍 주식회사 | 무선 충전 및 통신 기판 그리고 무선 충전 및 통신 장치 |
US10133421B2 (en) | 2014-04-02 | 2018-11-20 | Synaptics Incorporated | Display stackups for matrix sensor |
US9836682B2 (en) | 2014-04-07 | 2017-12-05 | American Banknote Corporation | System and method for detecting the depth of an antenna in the card body of a smart card |
US9927832B2 (en) | 2014-04-25 | 2018-03-27 | Synaptics Incorporated | Input device having a reduced border region |
US20170330153A1 (en) | 2014-05-13 | 2017-11-16 | Monster Worldwide, Inc. | Search Extraction Matching, Draw Attention-Fit Modality, Application Morphing, and Informed Apply Apparatuses, Methods and Systems |
US9690397B2 (en) | 2014-05-20 | 2017-06-27 | Synaptics Incorporated | System and method for detecting an active pen with a matrix sensor |
FR3024000B1 (fr) * | 2014-07-15 | 2018-04-06 | Oberthur Technologies | Entite electronique rfid a condensateur rapporte |
US10175827B2 (en) | 2014-12-23 | 2019-01-08 | Synaptics Incorporated | Detecting an active pen using a capacitive sensing device |
US10795471B2 (en) | 2015-01-05 | 2020-10-06 | Synaptics Incorporated | Modulating a reference voltage to perform capacitive sensing |
CN106157019A (zh) * | 2015-03-26 | 2016-11-23 | 咏嘉科技股份有限公司 | Nfc支付模块及其控制方法 |
US9939972B2 (en) | 2015-04-06 | 2018-04-10 | Synaptics Incorporated | Matrix sensor with via routing |
USD776664S1 (en) * | 2015-05-20 | 2017-01-17 | Chaya Coleena Hendrick | Smart card |
US10095948B2 (en) | 2015-06-30 | 2018-10-09 | Synaptics Incorporated | Modulation scheme for fingerprint sensing |
US9720541B2 (en) | 2015-06-30 | 2017-08-01 | Synaptics Incorporated | Arrangement of sensor pads and display driver pads for input device |
US9715304B2 (en) | 2015-06-30 | 2017-07-25 | Synaptics Incorporated | Regular via pattern for sensor-based input device |
CN205028263U (zh) | 2015-09-07 | 2016-02-10 | 辛纳普蒂克斯公司 | 一种电容传感器 |
US10037112B2 (en) | 2015-09-30 | 2018-07-31 | Synaptics Incorporated | Sensing an active device'S transmission using timing interleaved with display updates |
US10067587B2 (en) | 2015-12-29 | 2018-09-04 | Synaptics Incorporated | Routing conductors in an integrated display device and sensing device |
CN106933400B (zh) | 2015-12-31 | 2021-10-29 | 辛纳普蒂克斯公司 | 单层传感器图案和感测方法 |
EP3496005A1 (fr) * | 2017-12-08 | 2019-06-12 | Gemalto Sa | Procédé de fabrication d'un support à puce radiofréquence |
US10909436B2 (en) * | 2019-05-13 | 2021-02-02 | American Express Travel Related Services Company, Inc. | Angled slot in a transaction card |
US10977539B1 (en) * | 2019-12-20 | 2021-04-13 | Capital One Services, Llc | Systems and methods for use of capacitive member to prevent chip fraud |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE450057B (sv) * | 1984-11-20 | 1987-06-01 | Saab Automation Ab | Identitetsbrickor for identifiering av foremal |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
JP3064840B2 (ja) | 1994-12-22 | 2000-07-12 | ソニー株式会社 | Icカード |
CN1160666C (zh) * | 1996-07-15 | 2004-08-04 | 奥地利塑料卡及证件***股份有限公司 | 具有一模块和一全息图象的数据载体 |
JPH1092690A (ja) * | 1996-09-18 | 1998-04-10 | Kokusai Electric Co Ltd | 容量調整装置 |
IL122250A (en) * | 1997-11-19 | 2003-07-31 | On Track Innovations Ltd | Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof |
JP4242512B2 (ja) * | 1999-05-20 | 2009-03-25 | 凸版印刷株式会社 | 非接触icカードの同調調整方法 |
FR2808648B1 (fr) * | 2000-05-03 | 2004-07-30 | Schlumberger Systems & Service | Antenne pour carte a circuit integre et procede d'ajustement de l'inductance d'une telle antenne |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102024176A (zh) * | 2010-12-09 | 2011-04-20 | 武汉天喻信息产业股份有限公司 | 一种双界面智能卡的制作方法 |
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