CN1213292C - Heat measuring apparatus and method thereof - Google Patents
Heat measuring apparatus and method thereof Download PDFInfo
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- CN1213292C CN1213292C CN 02126791 CN02126791A CN1213292C CN 1213292 C CN1213292 C CN 1213292C CN 02126791 CN02126791 CN 02126791 CN 02126791 A CN02126791 A CN 02126791A CN 1213292 C CN1213292 C CN 1213292C
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Abstract
The present invention relates to a heat testing device which comprises a controllable heat-sensitive element, a heat type sensor, a differential pressure sensor, a multiple-channel A/D and D/A conversion and control device and a fan module, wherein a layout on a typical circuit plate of a simulating communication appliance of the controllable heat-sensitive element is arranged on a simulating single plate. The heat type sensor and the differential pressure sensor are arranged on the analog single plate in an inserted mode and are also arranged on a position adjacent to the controllable heat-sensitive element, and the detecting signals of the heat type sensor and the differential pressure sensor and a controlling signal of the controllable heat-sensitive element are connected with the multiple-channel A/D and D/A conversion and control device by a connector on the simulating single plate. Because the present invention adopts the non-uniformity of the wind speed of the surface of a multiple testing point PCB plate, the measuring errors of a hand-held appliance can be reduced. The present invention can realistically simulate the condition of the heat radiation of the practical electronic appliance and can also directly detect and verify the effect of the heat radiation of a strengthening heat radiation technique.
Description
Technical field
The present invention relates to a kind of heat test device and method of testing thereof, particularly a kind of simulation heat test device and method of testing thereof of air-cooled electronics inner stream flow.
Background technology
Along with the increase of electronics power consumption and reducing of structural volume, heat radiation more and more becomes a major issue in the product design, the heat test has become an important content in the product design checking, also be product specification design phase important indicator simultaneously, but the model machine stage sometimes because the imperfection of product function, make the power consumption of equipment can not reach maximum horizontal, the heat radiation index can not in time be carried out testing authentication, carrying out testing authentication after product development is finished often needs to change fan or restructure, can cause problems such as noise increase, delay product development cycle.
In many heat radiation indexs, the wind speed index is wherein important a kind of, the used wind speed tester of test wind speed has wind ball formula, weathercock formula, three kinds of forms of hot type at present, its version all is the single probe of hand-held, in the wind speed tester of these three kinds of versions, the vane type wind gage is to utilize wheel speed to detect to measure wind speed; The hot type wind gage can be divided into hot diaphragm type and hot-bulb formula again, but its principle of work all is to adopt the convection heat transfer principle of air-flow, changes the air-flow velocity that obtains to flow through the surface by the detecting sensor surface temperature; Swing weathervane formula wind gage is to utilize the amplitude of fluctuation of weathercock to test wind speed, is mainly used in the wind speed test in meteorology, the agricultural.But these several wind gages all can not well satisfy the interior flow field simulation and the distribution tests of electronics.Reason is the pre-installed plug panel-form of the many employings of electronic communication equipment, as shown in Figure 1, the panel of the board of each printed circuit board (PCB) vertically is plugged in the trough frontward, like this as adopting existing tester to remove panel of the board, but remove the loss that panel of the board can cause air quantity in the air channel, and processing test technology hole not only needs independent processing on panel, and test point is more single, can not test the distribution situation of the wind speed field in this groove position exactly, if when simultaneously being covered with connector on the panel of the board, the product this testing authentication that is in operation not can be carried out.The wind speed tester of existing hand hold transducer can not be tested the indexs such as wind speed, blast of the test point that needs exactly especially; Can not be accurately, comprehensively whether pressure, the wind speed profile in the verification system adheres to specification; Whether the working point that can not accurately judge fan is suitable.
Summary of the invention
The objective of the invention is problem at above-mentioned existence, but provide a kind of multi-point sampler printed circuit board (PCB) (pcb board) surface the wind speed unevenness, can realize safe emulation testing, and the simulation heat test device and the method for testing thereof of the air-cooled electronics interior flow field of measuring accuracy height, good stability.
Technical scheme of the present invention is achieved in that
On the one hand, a kind of heat test device comprises:
Be used to simulate the controlled thermal photosensitive elements that heater element produces thermal source;
The thermal sensor that is used for detected temperatures and wind velocity signal;
Be used to gather the differential pressure pick-up of pressure signal;
Be used for hyperchannel A/D, D/A conversion and control device that many groups temperature signal, pressure signal are changed and controlled thermal photosensitive elements and fan piece are controlled;
The blower module of wind regime is provided for analog veneer;
Wherein the layout on the controlled thermal photosensitive elements analog communication equipment typical circuit board is installed on the analog veneer, thermal sensor and differential pressure pick-up adopt inserting mode to be arranged on the analog veneer, and thermal sensor and differential pressure sensor arrangement are in the position near the controlled thermal photosensitive elements, the control signal of the detection signal of thermal sensor and differential pressure pick-up and controlled thermal photosensitive elements is connected with hyperchannel A/D, D/A conversion and control device by the connector on the analog veneer, the blower module device is in trough, and its air outlet is towards each analog veneer.
On the other hand, the method for testing of being undertaken by above-mentioned proving installation may further comprise the steps:
1), the layout on the controlled thermal photosensitive elements analog communication equipment typical circuit board is installed on the analog veneer;
2), adopt inserting mode to be arranged in thermal sensor and differential pressure pick-up to be positioned on the analog veneer near the controlled thermal photosensitive elements position;
3), the detection signal of thermal sensor and differential pressure pick-up and the control signal of controlled thermal photosensitive elements are connected to hyperchannel A/D, D/A conversion and control device;
4), the wind speed of regulating blower module by A/D, D/A conversion and control device controls the flow of the wind on the analog veneer, and the relevant temperature of record, the data of pressure;
5), according to the flow on the data creating analog veneer of the temperature of the flow of wind and record, pressure and the family curve of pressure;
6) be that analog veneer selects suitable fan as radiating element, according to the family curve of making.
Because the present invention has adopted above-mentioned technical scheme, so have following advantage:
1, owing to adopt the unevenness of the wind speed on multi-measuring point test pcb board surface, can effectively reduce the measuring error of portable equipment;
2, because a plurality of wind speed, blast, temperature point and adjustable power simulation heater members are that controlled thermal sensing element directly is distributed on the pcb board simultaneously, so both can simulate the heat dissipating state of actual electrical subset realistically, again the direct radiating effect of detection validation enhance heat technology;
3, owing to wind speed, blast, temperature sensor adopt the plug-in mounting means, can make the present invention be applicable to the simulation requirement of the board design of different size.
In a word, compare with existing wind speed testing apparatus, test item of the present invention is more comprehensive, measuring accuracy is higher, can reliablely and stablely be suitable for the simulation and the test in the heat radiation flow field of electronics inside.
Description of drawings
Fig. 1 is the structural representation that existing electronics adopts pre-installed plug panel;
Fig. 2 is that structure of the present invention is formed block scheme;
Fig. 3 is the structural representations of apparatus of the present invention on analog veneer;
Fig. 4 is the process flow diagram of method of testing of the present invention.
Embodiment
As shown in Figure 1-Figure 3, heat test device of the present invention comprises:
Be used to simulate the controlled thermal photosensitive elements 1 that heater element produces thermal source;
The thermal sensor 2 that is used for detected temperatures and wind velocity signal;
Be used to gather the differential pressure pick-up 3 of pressure signal;
Be used for hyperchannel A/D, D/A conversion and control device 5 that many groups temperature signal, pressure signal are changed and controlled thermal photosensitive elements 1 and blower module 6 are controlled;
The blower module of wind regime is provided for analog veneer;
Wherein the layout on the controlled thermal photosensitive elements 1 analog communication equipment typical circuit board is installed on the analog veneer 7, thermal sensor 2 and differential pressure pick-up 3 adopt inserting mode to be arranged on the analog veneer 7, and thermal sensor 2 and differential pressure pick-up 3 devices are in the position near controlled thermal photosensitive elements 1, the detection signal of thermal sensor 2 and differential pressure pick-up 3 and the control signal of controlled thermal photosensitive elements 1 are connected with hyperchannel A/D, D/A conversion and control device 5 by the connector on the analog veneer 74, blower module 6 devices are in trough, and its air outlet is towards each analog veneer 7.Wherein above-mentioned A/D, D/A conversion and control device 5 be provided with the knob button 52, the selection key 53 that is used to realize channel selecting that are used to realize temperature-sensitive control, be used to show the display screen 51 of wind speed, blast, temperature, rotation speed of the fan and be used for to circuit supply and be the power transfer module of dissimilar blower module 6 speed governing.And described power transfer module is provided with the DC voltage output interface of at least more than one gear.In the present embodiment, power supply adopts the 220V Alternating Current Power Supply, the power transfer module that is provided with in conversion and control section converts thereof into DC48V, 24V, 12V and 5V, be used for speed governing to circuit supply and the dissimilar fans of adaptation, but the controls of 6 fans only are provided at most, avoid power requirement too high and make the instrument volume excessive.
The method of testing of heat test device of the present invention may further comprise the steps:
1), the layout on the controlled thermal photosensitive elements 1 analog communication equipment typical circuit board is installed on the analog veneer 7;
2), adopt inserting mode to be arranged in thermal sensor 2 and differential pressure pick-up 3 to be positioned on the analog veneer 7 near the controlled thermal photosensitive elements 1 position;
3), the detection signal of thermal sensor 2 and differential pressure pick-up 3 and the control signal of controlled thermal photosensitive elements 1 are connected to hyperchannel A/D, D/A conversion and control device 5;
4), the wind speed of regulating blower modules 6 by A/D, D/A conversion and control device 5 controls the flow of the wind on the analog veneer 7, and the relevant temperature of record, the data of pressure;
5), according to the flow on the data creating analog veneer 7 of the temperature of the flow of wind and record, pressure and the family curve of pressure;
6) be that analog veneer 7 selects suitable fan as radiating element, according to the family curve of making.
Claims (4)
1, a kind of heat test device is characterized in that comprising:
Be used to simulate the controlled thermal photosensitive elements that heater element produces thermal source;
The thermal sensor that is used for detected temperatures and wind velocity signal;
Be used to gather the differential pressure pick-up of pressure signal;
Be used for hyperchannel A/D, D/A conversion and control device that many groups temperature signal, pressure signal are changed and controlled thermal photosensitive elements and blower module are controlled;
The blower module of wind regime is provided for analog veneer;
Wherein the layout on the controlled thermal photosensitive elements analog communication equipment typical circuit board is installed on the analog veneer, thermal sensor and differential pressure pick-up adopt inserting mode to be arranged on the analog veneer, and thermal sensor and differential pressure sensor arrangement are in the position near the controlled thermal photosensitive elements, the control signal of the detection signal of thermal sensor and differential pressure pick-up and controlled thermal photosensitive elements is connected with hyperchannel A/D, D/A conversion and control device by the connector on the analog veneer, the blower module device is in trough, and its air outlet is towards each analog veneer.
2, heat test device according to claim 1 is characterized in that above-mentioned A/D, D/A conversion and control device are provided with the knob button, the selection key that is used to realize channel selecting that are used to realize temperature-sensitive control, are used to show the display screen of wind speed, blast, temperature, rotation speed of the fan and are used for to circuit supply and are the power transfer module of dissimilar blower module speed governing.
3, heat test device according to claim 2 is characterized in that above-mentioned power transfer module is provided with the DC voltage output interface of at least one gear.
4, the method for testing of heat test device is characterized in that may further comprise the steps:
1), the layout on the controlled thermal photosensitive elements analog communication equipment typical circuit board is installed on the analog veneer;
2), adopt inserting mode to be arranged in thermal sensor and differential pressure pick-up to be positioned on the analog veneer near the controlled thermal photosensitive elements position;
3), the detection signal of thermal sensor and differential pressure pick-up and the control signal of controlled thermal photosensitive elements are connected to hyperchannel A/D, D/A conversion and control device;
4), the wind speed of regulating blower module by A/D, D/A conversion and control device controls the flow of the wind on the analog veneer, and the relevant temperature of record, the data of pressure;
5), according to the flow on the data creating analog veneer of the temperature of the flow of wind and record, pressure and the family curve of pressure;
6) be that analog veneer selects suitable fan as radiating element, according to the family curve of making.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02126791 CN1213292C (en) | 2002-07-23 | 2002-07-23 | Heat measuring apparatus and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02126791 CN1213292C (en) | 2002-07-23 | 2002-07-23 | Heat measuring apparatus and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1470866A CN1470866A (en) | 2004-01-28 |
| CN1213292C true CN1213292C (en) | 2005-08-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02126791 Expired - Fee Related CN1213292C (en) | 2002-07-23 | 2002-07-23 | Heat measuring apparatus and method thereof |
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| Country | Link |
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| CN (1) | CN1213292C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881742A (en) * | 2010-07-21 | 2010-11-10 | 中国地质大学（武汉） | Device for measuring multi-passage heat conductivity |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211301B (en) * | 2006-12-27 | 2011-03-23 | 鸿富锦精密工业（深圳）有限公司 | System heat test device |
| CN101221588B (en) * | 2007-01-09 | 2011-01-26 | 昆山杰得微电子有限公司 | Radiation design method in PCB design |
| CN101592527B (en) * | 2009-04-09 | 2012-02-01 | 上海微电子装备有限公司 | Multichannel temperature acquisition system |
| DE102009054714A1 (en) * | 2009-12-16 | 2011-06-22 | Robert Bosch GmbH, 70469 | Device and method for measuring an air flow of a vehicle |
| CN102297760B (en) * | 2010-06-25 | 2015-06-17 | 康佳集团股份有限公司 | Test method and design method of cooling fin of power device, and analog resistor |
| CN102736709B (en) * | 2011-04-02 | 2015-03-11 | 鸿富锦精密工业（深圳）有限公司 | Modularized computing platform system and method for controlling fan thereof |
| CN103185671A (en) * | 2011-12-29 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Fan testing device and testing method |
| CN102735416A (en) * | 2012-06-28 | 2012-10-17 | 浪潮电子信息产业股份有限公司 | Method for testing pressure-flow (P-Q) performance and flow resistance performance of high-flow large-size system |
| CN104238678B (en) * | 2013-06-08 | 2018-04-17 | 上海宽带技术及应用工程研究中心 | ATCA cabinet wind speed test methods and system based on 3.0 standards of PICMG |
| CN104236845B (en) * | 2013-06-08 | 2016-11-23 | 上海宽带技术及应用工程研究中心 | ATCA board windage method of testing based on PICMG 3.0 standard and system |
| CN106338375A (en) * | 2015-07-08 | 2017-01-18 | 上海宽带技术及应用工程研究中心 | Equipment cabinet board card heat testing method and device |
| EP3537859B1 (en) * | 2016-12-13 | 2024-02-14 | Huawei Technologies Co., Ltd. | Device, apparatus and method for monitoring heat dissipation states of devices |
| CN108572087B (en) * | 2017-03-08 | 2022-05-20 | 研祥智能科技股份有限公司 | Parameter testing method and system of temperature test box |
| CN113110962A (en) * | 2021-05-08 | 2021-07-13 | 中科可控信息产业有限公司 | Fan heat dissipation performance test method and test equipment |
-
2002
- 2002-07-23 CN CN 02126791 patent/CN1213292C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881742A (en) * | 2010-07-21 | 2010-11-10 | 中国地质大学（武汉） | Device for measuring multi-passage heat conductivity |
| CN101881742B (en) * | 2010-07-21 | 2011-09-14 | 中国地质大学（武汉） | Device for measuring multi-passage heat conductivity |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1470866A (en) | 2004-01-28 |
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