CN106338375A - Equipment cabinet board card heat testing method and device - Google Patents
Equipment cabinet board card heat testing method and device Download PDFInfo
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- CN106338375A CN106338375A CN201510397525.8A CN201510397525A CN106338375A CN 106338375 A CN106338375 A CN 106338375A CN 201510397525 A CN201510397525 A CN 201510397525A CN 106338375 A CN106338375 A CN 106338375A
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- air
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- temperature
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Abstract
The invention provides an equipment cabinet board card heat test method and device. The testing method comprises the steps of 1) acquiring the temperature and the air speed of a board card front air inlet area, a board card rear air outlet area and a mainboard region air outlet area of an equipment cabinet; and 2) collecting and calculating temperature and air speed data of each position of an equipment cabinet board card so as to monitor variation in the temperature and the air speed of the equipment cabinet board card in real time, and thus acquiring air flow passing conditions of the equipment cabinet and the board card. According to the equipment cabinet board card heat testing method and device, temperature sensors and air speed sensors are arranged in the board card front air inlet area, the board card rear air outlet area and the mainboard air outlet area of the equipment cabinet to be monitored, so that air speed and temperature conditions of the equipment cabinet board card in different operating environments can be tested, and an acquired result is conducive to subsequent structural design improvement of the equipment cabinet and the board card.
Description
Technical field
The present invention relates to a kind of method of testing and device, particularly to a kind of rack board heat testing method and device.
Background technology
High density equipment cabinet server, by feat of prominent performance and density advantages, replaces traditional server rapidly, becomes data center
Main force's equipment.In same space, the calculating density of high density equipment cabinet server is higher, and the heat giving out is also more,
The refrigeration that it is faced, heat dissipation problem are also just more prominent.Thereby it is ensured that the high efficiency and heat radiation of high density equipment cabinet server seems outstanding
It is important.In addition how the half of power consumption convergence total electricity consumption in terms of radiating for the data center according to statistics, so reduce highly dense
The required energy consumption of degree equipment cabinet server radiating is also extremely urgent.The energy-conservation of cooling system to be realized, on the one hand can select new
Air-conditioning, for example, can make refrigeration unit closer to server cabinet, allow air directly between rack and air-conditioning with the shortest
Path is circulated, and compared with room-level refrigeration, it can process higher heat load density；On the other hand can set from air current composition
Meter is set about, and refrigerating capacity is loaded reasonable distribution according to it, reduces blower fan power consumption.
The physical characteristics of its inner air of the structures shape of machine frame or rack flowing are extremely complex, need to combine and survey and computer mould
Intend it is studied.Computational fluid dynamicses (cfd) are the effective ways of analysis air flow rule, and it passes through computer number
Value calculates and image shows, the analysis that the system including the relevant physical phenomenas such as flow of fluid and conduction of heat is done, and is in stream
Numerical simulation to flowing under dynamic fundamental equation (mass-conservation equation, momentum conservation equation, energy conservation equation) control.Logical
Cross cfd numerical simulation, can obtain fundamental physical quantity on each position in the flow field of extremely complex problem (as speed, pressure,
Temperature, concentration etc.) distribution, and these physical quantitys situation over time, and can combine with cad and carry out structure optimization
Design, is widely used in data central gas stream organizational aspects.But cfd numerical method is also required to be aided with measured data,
Genuine and believable by the boundary condition obtained by experiment measurement, it is the basis of cfd numerical method, can improve the accurate of cfd result
Degree, its importance can not be underestimated.
Content of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of rack board heat testing method and device,
Improved with the design of board structure with contributing to rack.
For achieving the above object and other related purposes, the present invention provides a kind of rack board heat testing method, including step: 1)
Obtain the temperature in air intake region, board rear air-out region and mainboard area air-out region and wind speed in front of rack board；2) collect simultaneously
Count temperature and the air speed data of described rack board various loci, with the temperature of monitor in real time rack board and wind speed change, enter
And know described rack and board distinguished and admirable by situation.
As a kind of preferred version of the rack board heat testing method of the present invention, step 1) in, by front of rack board
Temperature sensor and air velocity transducer are laid respectively to obtain in air intake region, board rear air-out region and mainboard area air-out region
The temperature of position and wind speed.
As a kind of preferred version of the rack board heat testing method of the present invention, by usb data wire by the temperature in rack board
Degree sensor and air velocity transducer data transfer are collected to controller and count.
As a kind of preferred version of the rack board heat testing method of the present invention, step 2) in, collected by described controller
And count temperature and the air speed data of described rack board various loci, changed with the temperature of monitor in real time rack board and wind speed,
And then know described rack and board distinguished and admirable by situation.
The present invention also provides a kind of rack board heat test device, comprising: temperature sensor and air velocity transducer, is separately positioned on
In front of rack board, air intake region, board rear air-out region and mainboard area air-out region, flow through machine for obtaining under varying environment
The wind speed of cabinet board and temperature；And controller, it is connected with each temperature sensor and air velocity transducer, for collecting and counting institute
State temperature and the air speed data of rack board various loci, with the temperature of monitor in real time rack board and wind speed change, and then know
Described rack and board distinguished and admirable by situation.
As a kind of preferred version of the rack board heat test device of the present invention, each temperature sensor and air velocity transducer pass through
Usb data wire is connected with described controller.
As a kind of preferred version of the rack board heat test device of the present invention, described rack board is arranged at blade server.
As described above, the rack board heat testing method of the present invention and device, by air intake region in front of rack board to be monitored,
Board rear air-out region and the setting temperature sensor of mainboard area air-out region and air velocity transducer, can record rack board not
With the wind speed under working environment and temperature conditionss, obtained result contributes to the rack in later stage and board structure design improves.
Brief description
Fig. 1 is shown as the steps flow chart schematic diagram of the rack board heat testing method of the present invention.
Fig. 2 is shown as the structural representation of the rack board heat test device of the present invention.
Component label instructions
10 temperature sensors and air velocity transducer
20 controllers
30 usb data wires
Air intake region in front of 40 boards
50 board rears air-out region
60 mainboard areas air-out region
S11～s12 step
Specific embodiment
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art can be disclosed by this specification
Content understand other advantages and effect of the present invention easily.The present invention can also be added by addition different specific embodiments
To implement or to apply, the every details in this specification can also be based on different viewpoints and application, in the essence without departing from the present invention
Carry out various modifications and changes under god.
Refer to Fig. 1～Fig. 2.It should be noted that the diagram provided in the present embodiment only illustrates the present invention's in a schematic way
Basic conception, then in schema only display and relevant assembly in the present invention rather than according to component count during actual enforcement, shape and
Size is drawn, and during its actual enforcement, the kenel of each assembly, quantity and ratio can be a kind of random change, and its assembly layout type
State is likely to increasingly complex.
As shown in figure 1, the present embodiment provides a kind of rack board heat testing method, including step:
As shown in figure 1, carrying out step 1 first) s11, obtain rack board in front of air intake region, board rear air-out region and
The temperature in mainboard area air-out region and wind speed.
In the present embodiment, divided by air intake region in front of rack board, board rear air-out region and mainboard area air-out region
Not Bu She temperature sensor and air velocity transducer to obtain temperature and the wind speed of position.
As shown in figure 1, and then carrying out step 2) s12, collects and counts temperature and the wind speed number of described rack board various loci
According to, with the temperature of monitor in real time rack board and wind speed change, and then know described rack and board distinguished and admirable by situation.
In the present embodiment, by usb data wire, the temperature sensor in rack board and air velocity transducer data transfer are extremely controlled
Device processed is collected and counts.Specifically, collected by described controller and count described rack board various loci temperature and
Air speed data, with the temperature of monitor in real time rack board and wind speed change, and then know described rack and board distinguished and admirable by feelings
Condition.
As shown in Fig. 2 in a specific implementation process, the enforcement of the rack board heat testing method of the present invention includes following
Part: control computer, three air velocity transducers, three temperature sensors, and usb data wire.
Described air velocity transducer and temperature sensor are arranged at air intake in front of rack board, rack board rear wind outlet and master
Plate area wind outlet, for capturing wind speed and the temperature of described board to be monitored, the sensor passes through usb data wire 30 and control
Computer processed is connected, and is collected by control computer, calculating, real-time monitoring rack board wind speed and temperature change.
The concrete operation step of above-mentioned method of testing is as described below:
The first step: sensor and rear end are controlled computer to be connected, whether test sensor probe is in running order, each part
Annexation is as shown in Figure 2；
Second step: three sensors are separately fixed at air intake in front of rack board, rear wind outlet and mainboard area wind outlet three
Individual position, the set location of each sensor is as shown in Figure 2；
3rd: controlling computer end, sensor control software is opened；
4th: rack test environment is set in test program；
5th step: open rack board；
6th step: hit testing starts, and end record data to be tested just can move to second piece of rack board sensor, with this
Analogize, until having surveyed all boards of rack.
As shown in Fig. 2 the present embodiment also provides a kind of rack board heat test device, comprising: temperature sensor and wind speed sensing
Device 10, is separately positioned on air intake region 40 in front of rack board, board rear air-out region 50 and mainboard area air-out region 60,
For obtaining the wind speed flowing through rack board under varying environment and temperature；And controller 20, pass with each temperature sensor and wind speed
Sensor 10 is connected, for collecting and counting temperature and the air speed data of described rack board various loci, with monitor in real time rack plate
The temperature of card and wind speed change, so know described rack and board distinguished and admirable by situation.
As an example, each temperature sensor and air velocity transducer 10 are connected with described controller 20 by usb data wire 30.
As an example, described rack board is arranged at blade server.As described above, the rack board Thermal test of the present invention
Method and device, by air intake region 40 in front of rack board to be monitored, board rear air-out region 50 and the air-out of mainboard area
Region 60 setting temperature sensor and air velocity transducer, can record wind speed under different operating environment for the rack board and temperature feelings
Condition, obtained result contributes to the rack in later stage and board structure design improves.So, the present invention effectively overcomes existing skill
Various shortcoming in art and have high industrial utilization.
Above-described embodiment only principle of the illustrative present invention and its effect, not for the restriction present invention.Any it is familiar with this skill
The personage of art all can carry out modifications and changes without prejudice under the spirit and the scope of the present invention to above-described embodiment.Therefore, such as
Those of ordinary skill in the art completed under without departing from disclosed spirit and technological thought all etc.
Effect modifications and changes, must be covered by the claim of the present invention.
Claims (7)
1. a kind of rack board heat testing method is it is characterised in that include step:
1) obtain the temperature in air intake region, board rear air-out region and mainboard area air-out region and wind speed in front of rack board；
2) collect and count temperature and the air speed data of described rack board various loci, with the temperature of monitor in real time rack board
Degree and wind speed change, so know described rack and board distinguished and admirable by situation.
2. rack board heat testing method as claimed in claim 1 it is characterised in that: step 1) in, by before rack board
Fang Jinfeng region, board rear air-out region and mainboard area air-out region lay respectively temperature sensor and air velocity transducer with
Obtain temperature and the wind speed of position.
3. rack board heat testing method as claimed in claim 2 it is characterised in that: by usb data wire by rack board
Temperature sensor and air velocity transducer data transfer are collected to controller and count.
4. rack board heat testing method as claimed in claim 3 it is characterised in that: step 2) in, received by described controller
Collect and count temperature and the air speed data of described rack board various loci, become with the temperature of monitor in real time rack board and wind speed
Change, so know described rack and board distinguished and admirable by situation.
5. a kind of rack board heat test device is it is characterised in that include:
Temperature sensor and air velocity transducer, are separately positioned on air intake region in front of rack board, board rear air-out region
With mainboard area air-out region, for obtaining the wind speed flowing through rack board under varying environment and temperature；
Controller, is connected with each temperature sensor and air velocity transducer, for collecting and counting described rack board position everywhere
The temperature put and air speed data, with the temperature of monitor in real time rack board and wind speed change, and then know described rack and board
Distinguished and admirable by situation.
6. rack board heat test device as claimed in claim 5 it is characterised in that: each temperature sensor and air velocity transducer pass through
Usb data wire is connected with described controller.
7. rack board heat test device as claimed in claim 5 it is characterised in that: described rack board is arranged at blade type service
Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510397525.8A CN106338375A (en) | 2015-07-08 | 2015-07-08 | Equipment cabinet board card heat testing method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510397525.8A CN106338375A (en) | 2015-07-08 | 2015-07-08 | Equipment cabinet board card heat testing method and device |
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| CN106338375A true CN106338375A (en) | 2017-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510397525.8A Pending CN106338375A (en) | 2015-07-08 | 2015-07-08 | Equipment cabinet board card heat testing method and device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109341895A (en) * | 2018-10-26 | 2019-02-15 | 杭州阿姆科技有限公司 | A kind of automatization test system and method for veneer dissipating-heat environment |
| CN109765401A (en) * | 2019-01-22 | 2019-05-17 | 上海宽带技术及应用工程研究中心 | Cabinet board wind speed test method and device |
| CN109781283A (en) * | 2019-01-22 | 2019-05-21 | 上海宽带技术及应用工程研究中心 | Cabinet board temperature testing method and device |
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| JPS62194434A (en) * | 1986-02-20 | 1987-08-26 | Fujitsu Ltd | Method for measuring air passing resistance |
| DE3741972A1 (en) * | 1987-12-11 | 1989-06-22 | Kieninger & Obergfell | Electrical flow or heat quantity meter |
| CN1470866A (en) * | 2002-07-23 | 2004-01-28 | 华为技术有限公司 | Heat measuring apparatus and method thereof |
| CN201697983U (en) * | 2010-06-07 | 2011-01-05 | 大唐移动通信设备有限公司 | Heat-dissipation test single board |
| CN203658555U (en) * | 2013-12-09 | 2014-06-18 | 天津工大瑞工光电技术研究院有限公司 | LED radiating module total thermal resistance measurement system |
| CN104236845A (en) * | 2013-06-08 | 2014-12-24 | 上海宽带技术及应用工程研究中心 | ATCA board wind resistance test method and system based on PICMG 3.0 standard |
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2015
- 2015-07-08 CN CN201510397525.8A patent/CN106338375A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62194434A (en) * | 1986-02-20 | 1987-08-26 | Fujitsu Ltd | Method for measuring air passing resistance |
| DE3741972A1 (en) * | 1987-12-11 | 1989-06-22 | Kieninger & Obergfell | Electrical flow or heat quantity meter |
| CN1470866A (en) * | 2002-07-23 | 2004-01-28 | 华为技术有限公司 | Heat measuring apparatus and method thereof |
| CN201697983U (en) * | 2010-06-07 | 2011-01-05 | 大唐移动通信设备有限公司 | Heat-dissipation test single board |
| CN104236845A (en) * | 2013-06-08 | 2014-12-24 | 上海宽带技术及应用工程研究中心 | ATCA board wind resistance test method and system based on PICMG 3.0 standard |
| CN203658555U (en) * | 2013-12-09 | 2014-06-18 | 天津工大瑞工光电技术研究院有限公司 | LED radiating module total thermal resistance measurement system |
Non-Patent Citations (1)
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| 谈骞: "ATCA板卡热测试分析", 《电子质量》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109341895A (en) * | 2018-10-26 | 2019-02-15 | 杭州阿姆科技有限公司 | A kind of automatization test system and method for veneer dissipating-heat environment |
| CN109765401A (en) * | 2019-01-22 | 2019-05-17 | 上海宽带技术及应用工程研究中心 | Cabinet board wind speed test method and device |
| CN109781283A (en) * | 2019-01-22 | 2019-05-21 | 上海宽带技术及应用工程研究中心 | Cabinet board temperature testing method and device |
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Application publication date: 20170118 |