CN1189071C - 安装机器及其零件安装方法 - Google Patents

安装机器及其零件安装方法 Download PDF

Info

Publication number
CN1189071C
CN1189071C CNB021075336A CN02107533A CN1189071C CN 1189071 C CN1189071 C CN 1189071C CN B021075336 A CNB021075336 A CN B021075336A CN 02107533 A CN02107533 A CN 02107533A CN 1189071 C CN1189071 C CN 1189071C
Authority
CN
China
Prior art keywords
bull
parts
feasible value
offset
spacing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB021075336A
Other languages
English (en)
Chinese (zh)
Other versions
CN1376026A (zh
Inventor
宝田益义
久乡大作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN1376026A publication Critical patent/CN1376026A/zh
Application granted granted Critical
Publication of CN1189071C publication Critical patent/CN1189071C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Operations Research (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Automatic Assembly (AREA)
CNB021075336A 2001-03-14 2002-03-14 安装机器及其零件安装方法 Expired - Lifetime CN1189071C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001072689A JP3709800B2 (ja) 2001-03-14 2001-03-14 実装機およびその部品装着方法
JP2001-072689 2001-03-14
JP072689/2001 2001-03-14

Publications (2)

Publication Number Publication Date
CN1376026A CN1376026A (zh) 2002-10-23
CN1189071C true CN1189071C (zh) 2005-02-09

Family

ID=18930236

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021075336A Expired - Lifetime CN1189071C (zh) 2001-03-14 2002-03-14 安装机器及其零件安装方法

Country Status (3)

Country Link
JP (1) JP3709800B2 (ko)
KR (1) KR100447310B1 (ko)
CN (1) CN1189071C (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4106301B2 (ja) * 2003-04-23 2008-06-25 Ｊｕｋｉ株式会社 部品認識方法及び装置
JP2005101263A (ja) * 2003-09-25 2005-04-14 Juki Corp 電子部品実装装置
JP4664752B2 (ja) * 2005-06-30 2011-04-06 Ｊｕｋｉ株式会社 部品吸着方法及び装置
JP5064758B2 (ja) * 2006-10-23 2012-10-31 ヤマハ発動機株式会社 データ作成装置および表面実装機
JP5527179B2 (ja) * 2010-11-29 2014-06-18 株式会社デンソー 直交型組付装置
US9693166B2 (en) * 2014-06-24 2017-06-27 The Boeing Company Automated production of acoustic structures
JP6454730B2 (ja) * 2014-12-26 2019-01-16 シャープ株式会社 半導体素子パッケージのためのキャップ装着方法及びキャップ装着装置
CN104858858A (zh) * 2015-04-13 2015-08-26 上海金东唐科技股份有限公司 一种自动抓取机构及自动抓取方法
JP6913849B2 (ja) * 2017-01-12 2021-08-04 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置
CN108860717B (zh) * 2017-05-16 2021-08-31 太阳诱电株式会社 电子部件***装置和方法、电子部件收纳带制造装置和方法
CN108007865A (zh) * 2018-01-09 2018-05-08 科为升视觉技术（苏州）有限公司 基于图像识别的pcb自动上料检测***及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2620646B2 (ja) * 1989-06-07 1997-06-18 三洋電機株式会社 電子部品自動装着装置
JPH07235800A (ja) * 1994-02-24 1995-09-05 Citizen Watch Co Ltd 部品搬送装置および部品搬送方法
JP2863731B2 (ja) * 1996-05-14 1999-03-03 株式会社テンリュウテクニックス 電子部品装着装置およびその方法
JPH10224092A (ja) * 1997-02-12 1998-08-21 Matsushita Electric Ind Co Ltd 電子部品装着方法及びその装置
KR100515446B1 (ko) * 1998-08-07 2005-11-28 삼성전자주식회사 전자부품 실장장치 및 실장제어방법
KR20000021713A (ko) * 1998-09-30 2000-04-25 윤종용 전자 부품 실장기 및 실장 방법

Also Published As

Publication number Publication date
CN1376026A (zh) 2002-10-23
JP3709800B2 (ja) 2005-10-26
KR20020073274A (ko) 2002-09-23
KR100447310B1 (ko) 2004-09-07
JP2002271098A (ja) 2002-09-20

Similar Documents

Publication Publication Date Title
CN1189071C (zh) 安装机器及其零件安装方法
US9844170B2 (en) Component mounting machine
US6971158B2 (en) Electric-component mounting system including movable substrate-holding device
CN1269121A (zh) 部件安装方法以及部件安装装置
KR101051106B1 (ko) 전자부품 실장장치 및 전자부품 실장방법
JP4730139B2 (ja) 電子部品実装装置および電子部品実装方法
CN1617295A (zh) 电路基板的搬运装置及搬运方法、焊球搭载方法
CN1312674A (zh) 元器件安装方法
CN1262162C (zh) 电子部件安装装置
JP6153594B2 (ja) 部品実装システムおよびそれに用いるバルク部品決定方法
KR101893213B1 (ko) 전자부품 실장장치 및 전자부품 실장방법
JP4546935B2 (ja) 部品実装方法、部品実装機およびプログラム
JP4331565B2 (ja) 電子部品実装装置
JP2006310647A (ja) 表面実装機および部品実装方法
JP4387963B2 (ja) 部品実装方法
KR100565783B1 (ko) 반도체 패키지용 다중 정렬장치 및 방법
JP4943352B2 (ja) 電子部品実装方法
CN106888568B (zh) 电子部件安装装置
CN1849058A (zh) 基板识别方法及元件安装***
KR20150002532A (ko) 전자 부품 실장 방법 및 전자 부품 실장 장치
KR20120108219A (ko) 부품 실장 장치 및 방법
JP6949777B2 (ja) 部品搭載装置
CN113303040B (zh) 容许值设定装置及容许值设定方法
JP2007128957A (ja) 電子部品移載装置
JP2007042834A (ja) 電子部品の実装装置および実装方法

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20050209