CN1186314A - Slurry for silver leads of surface installed multi-layer disc ceramic capacitor - Google Patents
Slurry for silver leads of surface installed multi-layer disc ceramic capacitor Download PDFInfo
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- CN1186314A CN1186314A CN96121453A CN96121453A CN1186314A CN 1186314 A CN1186314 A CN 1186314A CN 96121453 A CN96121453 A CN 96121453A CN 96121453 A CN96121453 A CN 96121453A CN 1186314 A CN1186314 A CN 1186314A
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- silver powder
- silver
- slurry
- ceramic capacitor
- frit
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Abstract
A platable full-siver paste for the end of laminated ceramic capacitor chip for SMT is prepared from silver powder, ZnO-Al2O3-B2O3-SiO2 glass powder as inorganic filler and organic carrier including rosin resin, ethylcellulose, terpineol and butyl carbitol. It features good uniformity, bright appearance, high electric conductivity, no bridging after acidic plating, and high adhesion.
Description
The present invention relates to the full silver of chip multilayer ceramic capacitor and can plate the termination slurry.
At present in the chip multilayer ceramic capacitor structure, general wire type and the flatiron manual welding type of adopting, but such capacitor outer electrode adopts full silver bonding tip slurry, its anti-sweating heat 260 degree, dip time is lower than 5 seconds, development along with surface mounting technology, the automatic chip mounting capacitor must withstand wave-soldering technology or infrared reflow welder preface efficiently, in this course, chip component wants the long period directly to immerse in the rodent high-temperature solder, and traditional full silver or palladium-silver capacitor termination are difficult to bear this abominable operation.The three layers of electroplating technology in the nickel barrier layer of employing are arranged, i.e. electroless nickel layer and tin layer (or leypewter layer) on silver-colored termination, this technology improves the anti-sweating heat performance of chip capacitor greatly, can be in 260 degree scolders, dip time surpasses 1 minute, as seen, and the use of three layers of electroplating technology, make chip capacitor termination electrode must stand this severe rugged environment of acidic bath, this opposite end tip electrode slurry has proposed new requirement.
The objective of the invention is at above-mentioned deficiency, propose a kind of mounted on surface and can plate the termination slurry with the full silver of chip multilayer ceramic capacitor, its slurry is even, fine and smooth, outward appearance light after the burning infiltration, electric conductivity are good, behind acid electroplating, do not produce and extend the bridge joint phenomenon, have higher adhesive force, be full of the production-line technique requirement.
The present invention is made up of following (weight ratio), silver powder 65～85 (Wt) %, wherein spherical silver powder and flake silver powder ratio 1: 0.3～1.5; Frit 2～25 (Wt) %, frit consist of PbO 40～60 (Wt) %, B
2O
35～15 (Wt) %, SiO
225～40 (Wt) %, additive 10～25 (Wt) % is Al
2O
3, CaO, CdO, CuO, L
12O, Na
2O, NiO, WO
3, one or more mixtures of TiO, ZnO, organic carrier 15～35 (Wt) %, rosin phenolic resin 20～35 (Wt) % wherein, ethyl cellulose 1～3 (Wt) %, terpinol 50～65 (Wt) %, turpentine oil 7～12 (Wt) %, castor oil 5～12 (Wt) %, thixotropic agent 1～2 (Wt) %, defoamer 0.05～2 (Wt) %.
Optimum formula (weight ratio) consists of silver powder 75～80 (Wt) %; Frit 3～6 (Wt) %; Organic carrier 20～25 (Wt) %.
We can be from termination electrodes specification of a model the present invention, accompanying drawing 1, accompanying drawing 2, before accompanying drawing 3 is termination electrodes model burning infiltration respectively, after, electroplate back three kinds of states, Fig. 1 is that complete silver-colored platable end paste is coated on formed conductive pattern after the drying of ceramic matrix surface, the 1st, ceramic matrix, the 2nd, the termination slurry, silver powder and the inorganic filler state that is evenly distributed in the conductive layer, the conductive layer interface is attached on the coarse ceramic matrix, Fig. 2 is the monolithic capacitor termination section after the burning infiltration, the 3rd, the continuous metal conductor, the 4th, the low-melting-point glass bonded areas is enriched in the glass melt on conductive layer and ceramic matrix surface, forms a discrete firm bonded areas after cooling, has the favorable mechanical bonding force, Fig. 3 is the termination section of the monolithic capacitor after electroplating, the 5th, and tin layer, the 6th, nickel dam, the 7th, silver layer, after the plating, be coated with last layer thermal barrier properties nickel dam on the fine and close silver layer, and the tin layer of plating one deck good weldability becomes tin lead layer on nickel dam.
The present invention compares with the U.S., Japanese similar slurry measured data, sees Table 1.
Now from above-mentioned prescription, before enumerating five embodiment plating being described, plating back electrical property with and adhesive force.
Table 1
Embodiment 1:
Embodiment 2:
Embodiment 3:
Embodiment 4:
Embodiment 5:
The foregoing description 1～5 result such as following table:
| Item item claim | Complete silver-colored platable end paste | U.S. MIS company's T-2038 | The clear flourish H-2955 of company of Japan |
| Viscosity (Pa.s/25 ℃ of 10rpm) | ????45～55 | ????40～45 | ????50～55 |
| Tenor (%) | ??????75 | ??????72 | ??????75 |
| Drying condition (℃) | 230～260 12 minutes | 250～260 10 minutes | 250～260 10 minutes |
| The burning infiltration temperature (℃) | ???760～800 | ???760～780 | ???760～780 |
| Side's resistance (Ω/) | ????0.0035 | ????0.003 | ????0.0027 |
| Pulling force (Kg/mm2) | ?????2.5 | ?????1.8 | ?????1.8 |
| Fineness 50% | ??????8 | ?????10 | ??????8 |
| Smell | Denseer cloves type | Than giving off a strong fragrance any of several broadleaf plants type | Lighter |
| Electric capacity is electroplated the back outward appearance | There is not the no bridge joint of extension | There is not the no bridge joint of extension | There is not the no bridge joint of extension |
| Material | Prescription | Addition (Wt%) |
| Frit | 45％PbO/10％B 2O 3/35％SiO?2％ZnO/ 2％Al 2O 3/5％CaO/1％CuO | ????4.25 |
| Silver powder | Spherical silver powder: flake silver powder=1: 0.5 | ?????74 |
| Organic carrier | Rosin phenolic resin 25%, turpentine oil 10%, thixotropic agent 1.7%, ethyl cellulose 2.5%, castor oil 5%, terpinol 55%, defoamer 0.1% | ????21.75 |
| Material | Prescription | Addition (Wt%) |
| Frit | 43％PbO/10％B 2O 3/30％SiO?2％ZnO/ 2％WO 33％Al 2O 3/5％CaO/3％CuO 3％Na 2O/3％CdO | ?????4.25 |
| Silver powder | Spherical silver powder: flake silver powder=1: 0.5 | ??????74 |
| Organic carrier | Rosin phenolic resin 25%, turpentine oil 10%, thixotropic agent 1.7%, ethyl cellulose 2.5%, castor oil 5%, terpinol 55%, defoamer 0.1% | ????21.75 |
| Material | Prescription | Addition (Wt%) |
| Frit | 45％PbO/10％B 2O 3/35％SiO?2％ZnO/ 2％Al 2O 3/5％CaO/1％CuO | ?????4.25 |
| Silver powder | Spherical silver powder: flake silver powder=1: 1.1 | ??????74 |
| Organic carrier | Rosin phenolic resin 25%, turpentine oil 10%, thixotropic agent 1.7%, ethyl cellulose 2.5%, castor oil 5%, terpinol 55%, defoamer 0.1% | ????21.75 |
| Material | Prescription | Addition (Wt%) |
| Frit | 45％PbO/10％B 2O 3/35％SiO?2％ZnO/ 3％Al 2O 3/5％CaO/1％CuO | ?????4.25 |
| Silver powder | Spherical silver powder: flake silver powder=1: 0.3 | ??????74 |
| Organic carrier | Rosin phenolic resin 25%, turpentine oil 10%, thixotropic agent 1.7%, ethyl cellulose 2.5%, castor oil 5%, terpinol 55%, defoamer 0.1% | ????21.75 |
| Material | Prescription | Addition (Wt%) |
| Frit | 43％PbO/10％B 2O 3/35％SiO?2％ZnO/ 2％Al 2O 3/5％CaO/1％CuO | ????4.25 |
| Silver powder | Spherical silver powder: flake silver powder=1: 0.5 | ?????74 |
| Organic carrier | Rosin phenolic resin 28%, turpentine oil 10%, thixotropic agent 1.9%, castor oil 5%, terpinol 55%, defoamer 0.1% | ????21.75 |
| The slurry code | Outward appearance | Electrical property before the plating | Plating back electrical property | Adhesive force (N) | ||||
| ????C ???(nF) | ??????DF (×10 -4) | ???Ri ?(0Ω) | ????C ???(nF) | ???????DF (×10 -4) | ???Ri ??(0Ω) | |||
| ???1 | Generally | 117.2 | ?????120 | ???10 | ??116.8 | ?????122 | ???10 | ???25 |
| ???2 | Well | 115.9 | ?????122 | ???10 | ??115.4 | ?????125 | ???10 | ???28 |
| ???3 | Generally | 118.2 | ?????117 | ???10 | ??118.1 | ?????120 | ???10 | ???20 |
| ???4 | Generally | 116.5 | ?????121 | ???10 | ??116.8 | ?????121 | ???10 | ???21 |
| ???5 | Well | 116.7 | ?????124 | ???10 | ??115.9 | ?????126 | ???10 | ???24 |
| The contrast sample | Well | 116.4 | ?????125 | ???10 | ??116.8 | ?????128 | ???10 | ???22 |
Claims (2)
1, a kind of mounted on surface can be plated the termination slurry with the full silver of chip multilayer ceramic capacitor, it is characterized in that it is made of silver powder 65～85 (Wt) %, wherein spherical silver powder and flake silver powder ratio 1: 0.3～1.5 following (weight ratio); Frit 2～25 (Wt) %, frit consist of PbO 40～60 (Wt) %, B
2O
35～15 (Wt) %, SiO
225～40 (Wt) %, additive 10～25 (Wt) % is Al
2O
3, CaO, CdO, CuO, L
12O, Na
2O, NiO, WO
3, one or more mixtures of TiO, ZnO, organic carrier 15～35 (Wt) %, rosin phenolic resin 20～35 (Wt) % wherein, ethyl cellulose 1～3 (Wt) %, terpinol 50～65 (Wt) %, turpentine oil 7～12 (Wt) %, castor oil 5～12 (Wt) %, thixotropic agent 1～2 (Wt) %, defoamer 0.05～2 (Wt) %.
2, mounted on surface according to claim 1 can be plated the termination slurry with the full silver of chip multilayer ceramic capacitor, it is characterized in that it is made of silver powder 75～80 (Wt) % following (weight ratio); Frit 3～6 (Wt) %; Organic carrier 20～25 (Wt) %.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN96121453A CN1053516C (en) | 1996-12-24 | 1996-12-24 | Slurry for silver leads of surface installed multi-layer disc ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN96121453A CN1053516C (en) | 1996-12-24 | 1996-12-24 | Slurry for silver leads of surface installed multi-layer disc ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1186314A true CN1186314A (en) | 1998-07-01 |
| CN1053516C CN1053516C (en) | 2000-06-14 |
Family
ID=5126905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96121453A Expired - Fee Related CN1053516C (en) | 1996-12-24 | 1996-12-24 | Slurry for silver leads of surface installed multi-layer disc ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1053516C (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100385573C (en) * | 2003-04-21 | 2008-04-30 | 上海宝银电子材料有限公司 | Dedicated silve paste of stannum indium oxide and manufacturing method |
| CN100409370C (en) * | 2005-07-12 | 2008-08-06 | 中国印钞造币总公司 | High-temperature sintered silver paste and producing process thereof |
| CN101728002A (en) * | 2010-01-15 | 2010-06-09 | 贵阳晶华电子材料有限公司 | End-blocking slurry for flaky component |
| CN101859609A (en) * | 2010-04-21 | 2010-10-13 | 北京科技大学 | Lead-free silver electrode slurry and preparation and using method thereof |
| CN101658929B (en) * | 2009-09-06 | 2011-03-23 | 宁波广博纳米材料有限公司 | Cupro-nickel alloy powder used for preparing terminal electrode of chip-type multilayer ceramic capacitor (MLCC) |
| CN101329942B (en) * | 2007-06-18 | 2011-04-13 | 华新科技股份有限公司 | Metal cream composing substance for capacitor |
| CN102603196A (en) * | 2012-02-13 | 2012-07-25 | 江苏瑞德新能源科技有限公司 | Glass mixing powder, preparation method thereof and conductive silver paste containing glass mixing powder |
| CN102842353A (en) * | 2012-08-14 | 2012-12-26 | 廖晓峰 | Electrocondution slurry for chip component termination electrode |
| CN105531774A (en) * | 2013-09-24 | 2016-04-27 | 株式会社村田制作所 | Laminated ceramic electronic component |
| CN106030727A (en) * | 2014-02-28 | 2016-10-12 | 西门子公司 | Conducting corona shielding paper, in particular for outer corona shielding |
| CN108109978A (en) * | 2017-11-22 | 2018-06-01 | 贵州振华风光半导体有限公司 | For encapsulating the nano silver-group composite solder of adhesive integrated circuit die bonding |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR910021457A (en) * | 1990-02-21 | 1991-12-20 | 원본미기재 | Die attach compositions filled with silver and uses thereof |
-
1996
- 1996-12-24 CN CN96121453A patent/CN1053516C/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100385573C (en) * | 2003-04-21 | 2008-04-30 | 上海宝银电子材料有限公司 | Dedicated silve paste of stannum indium oxide and manufacturing method |
| CN100409370C (en) * | 2005-07-12 | 2008-08-06 | 中国印钞造币总公司 | High-temperature sintered silver paste and producing process thereof |
| CN101329942B (en) * | 2007-06-18 | 2011-04-13 | 华新科技股份有限公司 | Metal cream composing substance for capacitor |
| CN101658929B (en) * | 2009-09-06 | 2011-03-23 | 宁波广博纳米材料有限公司 | Cupro-nickel alloy powder used for preparing terminal electrode of chip-type multilayer ceramic capacitor (MLCC) |
| CN101728002A (en) * | 2010-01-15 | 2010-06-09 | 贵阳晶华电子材料有限公司 | End-blocking slurry for flaky component |
| CN101859609A (en) * | 2010-04-21 | 2010-10-13 | 北京科技大学 | Lead-free silver electrode slurry and preparation and using method thereof |
| CN102603196A (en) * | 2012-02-13 | 2012-07-25 | 江苏瑞德新能源科技有限公司 | Glass mixing powder, preparation method thereof and conductive silver paste containing glass mixing powder |
| CN102603196B (en) * | 2012-02-13 | 2015-04-01 | 江苏瑞德新能源科技有限公司 | Glass mixing powder, preparation method thereof and conductive silver paste containing glass mixing powder |
| CN102842353A (en) * | 2012-08-14 | 2012-12-26 | 廖晓峰 | Electrocondution slurry for chip component termination electrode |
| CN102842353B (en) * | 2012-08-14 | 2015-05-13 | 廖晓峰 | Electrocondution slurry for chip component termination electrode |
| CN105531774A (en) * | 2013-09-24 | 2016-04-27 | 株式会社村田制作所 | Laminated ceramic electronic component |
| CN105531774B (en) * | 2013-09-24 | 2018-10-26 | 株式会社村田制作所 | Monolithic ceramic electronic component |
| CN106030727A (en) * | 2014-02-28 | 2016-10-12 | 西门子公司 | Conducting corona shielding paper, in particular for outer corona shielding |
| CN108109978A (en) * | 2017-11-22 | 2018-06-01 | 贵州振华风光半导体有限公司 | For encapsulating the nano silver-group composite solder of adhesive integrated circuit die bonding |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1053516C (en) | 2000-06-14 |
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