CN118311306A

CN118311306A - Protection module, testing device, testing equipment and testing method

Info

Publication number: CN118311306A
Application number: CN202410738418.6A
Authority: CN
Inventors: 张东; 刘芳; 陈燕宁; 赵东艳; 贾晨; 范维; 杨璐羽; 段方维
Original assignee: State Grid Corp of China SGCC; Electric Power Research Institute of State Grid Liaoning Electric Power Co Ltd; Beijing Smartchip Microelectronics Technology Co Ltd
Current assignee: State Grid Corp of China SGCC; Electric Power Research Institute of State Grid Liaoning Electric Power Co Ltd; Beijing Smartchip Microelectronics Technology Co Ltd
Priority date: 2024-06-07
Filing date: 2024-06-07
Publication date: 2024-07-09

Abstract

The disclosure relates to the technical field of wafer and chip finished product testing, in particular to a protection module, a testing device, testing equipment and a testing method. The present disclosure provides a general high reliability testing device, by adding a protection module in the testing device, a current limiting unit and a connection unit are further added in the protection module, the current limiting unit includes a current limiting device for preventing the testing device and/or the tested device from being damaged due to current sudden increase; the connecting unit at least comprises a resistor with a preset resistance value, the sensing line of the testing machine is connected with the tested device through the resistor, so that the testing machine senses the voltage value applied to the tested device through the sensing line, the accuracy of the obtained voltage of the tested device is ensured by improving the input impedance of the sensing line through the resistor, and the accuracy of a testing result is improved.

Description

Protection module, testing device, testing equipment and testing method

Technical Field

The disclosure relates to the technical field of wafer and chip finished product testing, in particular to a protection module, a testing device, testing equipment and a testing method.

Background

In the actual integrated circuit production process, after the wafer product is finished, electrical parameters of specific test structure points on the wafer are generally measured to detect the process conditions of the wafer product, evaluate the quality and process stability in the integrated circuit manufacturing process, and determine whether the wafer meets the electrical specification requirements of a process technology platform. In addition, reliability tests are performed on devices on portions of the wafer.

To achieve the above test, the test structure shown in fig. 1 is generally used in the prior art. As shown in fig. 1, the hub or probe card is used to secure the external test port (drive and sense ends, i.e., drive and sense ends) and the needle arm while allowing for micro-movement of the needle arm and probe. To eliminate cable drop losses on the external test port, the drive and sense terminals are typically shorted between the external test port and the probe. In addition, for test items with low requirements for test accuracy, as shown in fig. 2, the driving end is usually directly connected to the probe, and the sensing end floats.

The two test structures shown in fig. 1 and fig. 2 are not problematic for the test under the condition that small current or abrupt change of current does not occur, but in the time-dependent dielectric Breakdown (TIME DEPENDENT DIELECTRIC Breakdown, TDDB) test and IV curve scan test, due to the existence of the current-limiting delay of the source measurement unit (Source Measure Unit, SMU), the current rises instantaneously, and at this time, the same current flows through the contact resistance (about 300mΩ) between the probe tip and the test pad of the device under test, so that the tip generates instantaneous high temperature and the phenomenon of burning occurs.

Disclosure of Invention

In order to solve the problems in the related art, embodiments of the present disclosure provide a protection module, a test device, a test apparatus, and a test method.

In a first aspect, in an embodiment of the present disclosure, there is provided a protection module for a test apparatus, the protection module including: the first electric connection end, the second electric connection end, the current limiting unit and the connection unit, wherein,

The first electric connection end is connected with a driving wire of a testing machine, and the testing machine is used for testing electric parameters of a tested device; the second electric connection end is connected with a sensing line of the testing machine;

The input end of the current limiting unit is connected with the first electric connection end, the output end of the current limiting unit is connected with the first terminal of the connecting unit, the second terminal of the connecting unit is connected with the second electric connection end, the third terminal of the connecting unit is connected with the first terminal and a contact part of a testing device, and when the contact part is connected with the tested device, the driving wire applies a testing voltage to the tested device through the current limiting unit and the connecting unit;

The current limiting unit comprises a current limiting device and is used for preventing the damage to the testing device and/or the tested device caused by current sudden increase;

The connecting unit at least comprises a resistor with a preset resistance value, one end of the resistor is connected with the second terminal of the connecting unit, and the other end of the resistor is connected with the contact part, so that a sensing line of the testing machine is connected with the tested device, and the testing machine senses the voltage value applied to the tested device through the sensing line;

The current limiting device includes: any one or any combination of a first current limiting device, a second current limiting device, and a third current limiting device, wherein:

When the current limiting unit comprises any one of the first current limiting device, the second current limiting device and the third current limiting device, one end of the current limiting device is connected with the input end of the current limiting unit, and the other end of the current limiting device is connected with the output end of the current limiting unit;

When the current limiting unit comprises any two current limiting devices of the first current limiting device, the second current limiting device and the third current limiting device, the two current limiting devices are sequentially connected in series between the input end and the output end of the current limiting unit;

when the current limiting unit comprises the first current limiting device, the second current limiting device and the third current limiting device, the first current limiting device, the second current limiting device and the third current limiting device are sequentially connected in series between an input end and an output end of the current limiting unit.

According to an embodiment of the disclosure, the first current limiting device is a resistor, the second current limiting device is a fuse, and the third current limiting device is a dynamic impedance matching circuit.

According to an embodiment of the present disclosure, when the current limiting device includes a resistor, a difference of a resistance value of the resistor minus a contact resistance value of the contact portion and the device under test is greater than a first preset value, and a difference of a resistance value of the device under test minus a resistance value of the resistor is greater than a second preset value, so that heat is concentrated on the resistor when a current flowing through the device under test increases suddenly, thereby preventing the test device and/or the device under test from being damaged.

According to an embodiment of the disclosure, the resistance of the resistor is at least 10 times the contact resistance of the contact portion and the device under test, and the resistance of the device under test is at least 10 times the resistance of the resistor.

According to an embodiment of the present disclosure, when the current limiting device includes a fuse, a normal non-fusing current parameter of the fuse is a third preset value, the third preset value is smaller than a current value that damages the test apparatus and/or the device under test, and when a current flowing through the fuse suddenly increases to be greater than the normal non-fusing current parameter of the fuse, the fuse fuses to cause the current flowing through the fuse to be 0, thereby preventing the test apparatus and/or the device under test from being damaged.

According to the embodiment of the disclosure, when the current limiting device includes a dynamic impedance matching circuit, the dynamic impedance matching circuit adjusts its own impedance value according to the resistance value of the device under test through a dynamic impedance transformation relationship, and satisfies that a difference of the adjusted impedance value minus the contact resistance value of the contact portion and the device under test is greater than a fourth preset value, and that a difference of the resistance value of the device under test minus the adjusted impedance value is greater than a fifth preset value, so that heat is concentrated on the dynamic impedance matching circuit when a current flowing through the device under test suddenly increases, thereby preventing the test device and/or the device under test from being damaged.

According to an embodiment of the disclosure, the adjusted impedance value is at least 10 times the contact resistance value of the contact portion and the device under test, and the resistance value of the device under test is at least 10 times the adjusted impedance value.

According to an embodiment of the disclosure, the contact is a probe, and the other end of the resistor is directly connected to the probe or a needle arm connected to the probe.

According to an embodiment of the disclosure, the contact is a probe, and the other end of the resistor is connected to the probe or a needle arm connected to the probe via the third terminal.

According to an embodiment of the disclosure, the contact is a socket pin, and the other end of the resistor is connected to the socket pin via the third terminal.

According to the embodiment of the disclosure, the first electrical connection end is a source measurement unit SMU driving end, and the second electrical connection end is a source measurement unit SMU sensing end.

In a second aspect, in an embodiment of the present disclosure, there is provided a test apparatus, including: a contact and a protection module according to the first aspect.

According to an embodiment of the present disclosure, wherein:

the contact part comprises a probe, and the testing device comprises a fixing device for fixing the probe;

When the protection module is connected with the probe through the fixing device, the fixing device is used for fixing a driving wire and a sensing wire of the testing machine, wherein the driving wire of the testing machine is connected with a first electric connection end of the protection module through a first port of the fixing device; the sensing line of the testing machine is connected with the second electric connection end of the protection module through the second port of the fixing device;

When the protection module is not connected with the probe through the fixing device, a driving wire of the testing machine is directly connected with a first electric connection end of the protection module; the sensing line of the testing machine is directly connected with the second electric connection end of the protection module;

the third port of the fixture is also used to secure the probe.

According to an embodiment of the present disclosure, the test apparatus further includes: and the needle arm is fixed at the third port of the fixing device and is connected with the probe.

According to an embodiment of the present disclosure, wherein the other end of the resistor in the connection unit of the protection module is connected to a conductive sleeve fixed on the probe.

According to an embodiment of the present disclosure, the test device includes: a probe card or a probe mount.

According to an embodiment of the present disclosure, wherein:

the contact portion includes a socket pin;

the test device comprises a chip test seat, wherein the chip test seat comprises a socket, and the socket comprises one or more socket pins;

the third terminal of the connection unit of the protection module is connected with the first terminal thereof and the socket pins of the socket.

In a third aspect, embodiments of the present disclosure provide a test apparatus, including: the testing machine and the testing device according to the second aspect,

The driving line and the sensing line of the testing machine are respectively connected with a first electric connection end and a second electric connection end in the protection module of the testing device through a first port and a second port of the fixing device;

or alternatively

The driving line and the sensing line of the testing machine are respectively and directly connected with the first electric connecting end and the second electric connecting end in the protection module.

In a fourth aspect, in an embodiment of the present disclosure, there is provided a test apparatus including: the test machine and the test device according to the second aspect, wherein the driving line and the sensing line of the test machine are respectively connected with the first electric connection end and the second electric connection end in the protection module of the test device.

In a fifth aspect, in an embodiment of the present disclosure, there is provided a testing method for testing a device under test using the testing apparatus described in the third aspect, where the testing method includes:

Connecting a driving wire of a testing machine with a first electric connection end of a protection module of a testing device through a first port of the testing device in the testing equipment, or directly connecting the driving wire of the testing machine with the first electric connection end of the protection module of the testing device;

when a driving wire of a testing machine is connected with a first electric connection end of a protection module of a testing device through a first port of the testing device in the testing equipment, a sensing wire of the testing machine is connected with a second electric connection end of the protection module through a second port of the testing device; when a driving wire of a testing machine is directly connected with a first electric connection end of a protection module of the testing device, a sensing wire of the testing machine is directly connected with a second electric connection end of the protection module;

connecting a probe of the testing device with the tested device to apply a testing voltage to the tested device and test the tested device;

the tester senses a voltage value applied to the device under test through the sensing line.

According to an embodiment of the disclosure, the device under test is a wafer, and the testing of the device under test specifically includes one or more of the following tests:

performing time-dependent dielectric breakdown TDDB test on the tested device;

performing IV curve scanning test on the tested device;

Performing reliability test on the tested device;

Performing an electrical characteristic test on the device to be tested;

And performing acceptable test WAT on the tested device.

According to an embodiment of the present disclosure, the test method further includes:

After the testing machine obtains the voltage value of the tested device sensed by the sensing line, the testing voltage applied to the tested device through the driving line is adjusted according to the sensed voltage value applied to the tested device until the sensed voltage value applied to the tested device reaches a set value.

In a sixth aspect, in an embodiment of the present disclosure, there is provided a testing method for testing a device under test by using the testing apparatus in the fourth aspect, where the testing method includes:

connecting a drive wire of a testing machine with a first electric connection end of a protection module of a testing device in the testing equipment;

connecting a sensing line of the testing machine with a second electric connection end of the protection module;

connecting socket pins of a socket of a chip test seat of the test device with a device to be tested, and applying test voltage to the device to be tested to test the device to be tested;

The tester senses a voltage value applied to the device under test through the sensing line;

wherein the tested device is a packaged chip.

According to the embodiment of the disclosure, when the device under test is tested, each port of the device under test is connected with the protection module through the socket pin, or the first port of the device under test is connected with the protection module through the socket pin, and the second port of the device under test is grounded.

According to the technical scheme provided by the embodiment of the disclosure, the protection module is added in the test device, the current limiting unit and the connecting unit comprising a resistor with a preset resistance are further added in the protection module, and the problem of damage to the test device and/or the tested device caused by current sudden increase is solved by utilizing the current limiting and voltage dividing functions of the current limiting unit; meanwhile, the accuracy of the sensed voltage value of the tested device is guaranteed by improving the input impedance of the sensing line by utilizing the resistor in the connecting unit, so that the tester can use the sensed voltage value of the tested device to adjust the voltage applied through the driving line until the sensed voltage value applied to the tested device reaches a set value, and the accuracy of a test result is improved; in addition, when the current limiting unit comprises a dynamic impedance matching circuit, the dynamic impedance matching circuit can be utilized to dynamically adjust the dynamic impedance transformation characteristic of the self impedance according to the resistance of the tested device in the test, so that the current limiting unit can adapt to the tested device with various resistance values, and the problems of poor flexibility, low test efficiency and high cost are solved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

Other features, objects and advantages of the present disclosure will become more apparent from the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings. In the drawings:

FIG. 1 shows a schematic diagram of the connection of a prior art test mechanism;

FIG. 2 shows a schematic diagram of the connection of another prior art test mechanism;

FIG. 3 shows a schematic diagram of the connection of yet another prior art test mechanism;

FIG. 4 illustrates a structural connection schematic of a protection module for a test device according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram showing structural connections of a current limiting unit according to an embodiment of the present disclosure when the current limiting unit includes a current limiting device;

FIG. 6 is a schematic diagram showing the structural connection of a current limiting unit according to an embodiment of the present disclosure when the current limiting unit includes two current limiting devices;

FIG. 7 is a schematic diagram showing structural connections of a current limiting unit according to an embodiment of the present disclosure including three current limiting devices;

FIG. 8 is a schematic diagram of the circuit connections of a dynamic impedance matching circuit in one embodiment;

FIG. 9 is a schematic diagram showing structural connection of a test device of embodiment 1;

FIG. 10 is a schematic diagram showing structural connection of a test device of embodiment 2;

FIG. 11 is a schematic diagram showing structural connection of a test device of embodiment 3;

FIG. 12 is a schematic diagram showing structural connection of a test device of embodiment 4;

fig. 13 shows a schematic view of the other end of the resistor in the connection unit directly connected to the probe through the conductive sleeve;

FIG. 14 is a schematic view showing structural connection of a test device of embodiment 5;

FIG. 15 shows a schematic diagram of the structural connection of a test device according to the present disclosure corresponding to embodiment 1;

FIG. 16 is a schematic diagram showing the structural connection of a test device according to the present disclosure corresponding to embodiment 2;

FIG. 17 is a schematic diagram showing structural connection of a test apparatus according to the present disclosure, which corresponds to embodiment 3;

FIG. 18 is a schematic diagram showing structural connection of a test apparatus according to the present disclosure, which corresponds to embodiment 4;

FIG. 19 is a schematic view showing structural connection of a test apparatus according to the present disclosure corresponding to embodiment 5;

FIG. 20 illustrates a flow chart of a test method for testing a device under test using the test apparatus described in particular embodiments 1-3, in accordance with an embodiment of the present disclosure;

FIG. 21 illustrates a flow chart of a test method for testing a device under test using the test apparatus described in particular embodiment 4, in accordance with an embodiment of the present disclosure;

FIG. 22 illustrates a flow chart of a test method for testing a device under test using the test apparatus described in particular embodiment 5, in accordance with an embodiment of the present disclosure;

FIG. 23 illustrates a schematic diagram of structural connections for testing a device under test using dual ports in accordance with one embodiment of the present disclosure;

Fig. 24 illustrates a schematic diagram of a structural connection for testing a device under test using a single port in a specific embodiment in accordance with the present disclosure.

Detailed Description

Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement them. In addition, for the sake of clarity, portions irrelevant to description of the exemplary embodiments are omitted in the drawings.

In this disclosure, it should be understood that terms such as "comprises" or "comprising," etc., are intended to indicate the presence of features, numbers, steps, acts, components, portions, or combinations thereof disclosed in this specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, acts, components, portions, or combinations thereof are present or added.

In addition, it should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Wafer and chip finished product testing is an important ring of integrated circuit design and manufacturing in the integrated circuit manufacturing process, and is used for ensuring that the products manufactured by the integrated circuit design meet the specification requirements. The wafer is composed of one die (die), and a plurality of bonding pads (Pad) are arranged on one die, wherein the bonding pads comprise a power Pad, a ground GND Pad and an input/output I/O Pad. The tester contacts the Pad on the die with the probe and runs the test software to test the die. Also, for the finished chip, the tester connects the package pins of the chip through the chip test socket and runs the test software to test the chip. In the wafer and chip finished product test, the accuracy requirement on the power supply voltage provided by the tester to the tested wafer Pad or the tested chip pin is higher and higher, the voltage drop generated by the resistance of the wire itself is large enough and cannot be ignored in the process of transmitting the power supply voltage provided by the tester to the tested wafer power Pad or the tested chip pin, the voltage drop can affect the result of a test item, especially a low-voltage high-current test item, so most of tester power DPSs are connected by kelvin, namely DPS is divided into a driving end for providing the test voltage and a sensing end for sensing the voltage applied to the tested device, as shown in fig. 1 and 2.

Specifically, as shown in FIG. 1, the hub or probe card is used to secure the external test port (drive and Sense ends, i.e., force and Sense ends) and the needle arm, while allowing for micro-movement of the needle arm and probe. To eliminate cable drop losses on the external test port, the drive and sense terminals are typically shorted between the external test port and the probe. In addition, for test items with low requirements for test accuracy, as shown in fig. 2, the driving end is usually directly connected to the probe, and the sensing end floats.

For the TDDB test item, since the resistance of the device under test is relatively high, a protection resistor far lower than the resistance of the device under test is typically connected in series with the driving terminal. As shown in FIG. 3, assuming that the equivalent resistance of the device under test is R, the resistance of the protection resistor is R, and the voltage at the driving end is V, the voltage actually applied to the device under testThe method comprises the following steps:

When R is much larger than R, vt is approximately V. When the tested device breaks down, R is reduced rapidly, the current in the whole loop is mainly determined by R, the current in the loop is set as I,

Wherein the method comprises the steps ofIs the contact resistance between the tip and the test Pad of the device under test. The current in the loop is not excessive due to r, so that the needle tip is not burnt.

However, although the introduction of the protection resistor can solve the problem of needle point burning, a new problem is brought about at the same time, namely: the voltage actually applied to the tested device end is not consistent with the set value of the test due to the voltage division effect of the protection resistor, so that the deviation of the test result is caused. In addition, the tested devices with different resistance values need to be independently designed with protection resistors, the flexibility is poor, and a plurality of protection resistors need to be manufactured and replaced for testing various tested devices, so that the efficiency is low and the cost is high.

Therefore, in the test apparatus shown in fig. 1 and fig. 2, when a large current or a breakdown voltage is related to the test, the contact point is easily burned when a large current flows between the probe and the device to be tested, and the device to be tested or the probe is damaged. The testing device shown in fig. 3 can avoid the burning of the tested device or the probe to a certain extent, but the voltage applied to the tested device and the set voltage have deviation in the testing process, so that the testing result is inaccurate, and the tested devices with different resistance values need to be independently manufactured with corresponding protection resistors, so that the flexibility is poor, the efficiency is low, and the cost is huge.

The inventors of the present disclosure noted and summarized in the project test process: the test structures shown in fig. 1 and 2 are only suitable for testing under the condition that small current or current does not suddenly change, and for TDDB testing and IV curve scanning testing, the phenomenon of burning of a probe and a device to be tested occurs under the influence of large current, so that fig. 1 and 2 are not suitable for testing under the condition that large current or current suddenly changes; if the test structure is improved to the test structure shown in fig. 3, when the test is performed under the condition of high current or abrupt change of current, although the problem of damage to a probe or a tested device is avoided by adding a protection resistor, the problem of inaccurate test result caused by deviation between the voltage of the tested device and the set voltage exists, and particularly when the resistance of the tested device is smaller, the influence of the introduction of the protection resistor on the test result is more obvious; in addition, for the tested devices with different resistance values, if the probe is to be prevented from burning and the influence of the protection resistance on the test result is reduced, the protection resistance matched with the resistance value of the tested device needs to be introduced, so that the flexibility and the test efficiency are reduced and the test cost is increased. Therefore, both the test structures shown in fig. 1 and 2 and the test structure shown in fig. 3 have respective test limitations, and cannot meet various test requirements of the device under test.

How to develop a test product suitable for multiple tests, thereby overcoming the test limitations of the test structures of the prior art? The inventor optimizes and improves the existing test structure through repeated experimental demonstration, and provides a high-reliability test device which is simple in structure, easy to implement and general, and the purpose of solving the technical problems is achieved through the protection module arranged in the test device.

Specifically, on one hand, the embodiment of the disclosure adds the current limiting unit in the protection module, connects the driving line of the testing machine with the tested device through the current limiting unit by the probe, and solves the problem of damage to the testing device and/or the tested device caused by current sudden increase by utilizing the current limiting and voltage dividing functions of the current limiting unit; on the other hand, a connecting unit comprising a resistor with a preset resistance value is added in the protection module, a sensing line of the testing machine is connected with the resistor and then is in short circuit with a driving line connected with the current limiting unit, so that the input impedance of the sensing line is improved by utilizing the resistor, the accuracy of the sensed voltage of the tested device is further ensured, the testing machine can adjust the voltage applied through the driving line by using the sensed voltage of the tested device until the sensed voltage value applied to the tested device reaches a set value, and the accuracy of a testing result is improved; in addition, when the current limiting unit comprises a dynamic impedance matching circuit, the dynamic impedance matching circuit can be utilized to dynamically adjust the dynamic impedance transformation characteristic of the self impedance according to the resistance of the tested device in the test, so that the current limiting unit can adapt to the tested device with various resistance values, and the problems of poor flexibility, low test efficiency and high cost are solved.

Fig. 4 shows a schematic diagram of structural connection of a protection module for a test device according to an embodiment of the present disclosure. As shown in fig. 4, a protection module 400 for a test apparatus includes: the device comprises a first electric connection end 410, a second electric connection end 420, a current limiting unit 430 and a connection unit 440, wherein the first electric connection end 410 is connected with a driving wire of a testing machine (not shown in the figure) which is used for testing electric parameters of a tested device; the second electrical connection end 420 is connected with a sensing line of the testing machine; the input end 431 of the current limiting unit 430 is connected to the first electrical connection end 410, the output end 432 of the current limiting unit 430 is connected to the first terminal 441 of the connection unit 440, the second terminal 442 of the connection unit 440 is connected to the second electrical connection end 420, the third terminal 443 of the connection unit 440 is connected to the first terminal 441 and a contact portion (the contact portion includes a probe or socket pin, not shown) of a testing device, and when the contact portion is connected to the device under test, the driving wire applies a test voltage to the device under test via the current limiting unit 430 and the connection unit 440; the current limiting unit 430 includes a current limiting device, and the current limiting unit 430 is used for preventing the test device and/or the device under test from being damaged due to current sudden increase; the connection unit 440 includes at least a resistor 444 with a preset resistance, one end of the resistor 444 is connected to the second terminal 442 of the connection unit, and the other end of the resistor 444 is connected to the contact portion, so as to connect a sensing line of the tester with the device under test, so that the tester senses a voltage value applied to the device under test through the sensing line.

According to an embodiment of the present disclosure, the current limiting device includes: any one or any combination of the first current limiting device, the second current limiting device and the third current limiting device. By way of example: the current limiting device may comprise only one current limiting device, such as: only the first current limiting device, or only the second current limiting device, or only the third current limiting device; the current limiting device may also include two current limiting devices, such as: comprises a first current limiting device and a second current limiting device, or a first current limiting device and a third current limiting device, or a second current limiting device and a third current limiting device; in addition, the current limiting device may further include three current limiting devices, a first current limiting device, a second current limiting device, and a third current limiting device.

According to an embodiment of the present disclosure, when the current limiting unit includes any one of the first current limiting device, the second current limiting device, and the third current limiting device, namely: when the first current limiting device or the second current limiting device or the third current limiting device is used, one end of the first current limiting device or the second current limiting device or the third current limiting device is connected with the input end 431 of the current limiting unit 430, the other end is connected with the output end 432 of the current limiting unit 430, and the current limiting unit comprises the first current limiting device as an example, and a specific structural connection schematic diagram is shown in fig. 5.

When the current limiting unit includes any two of the first current limiting device, the second current limiting device, and the third current limiting device, for example: when the first current limiting device and the second current limiting device are used, the first current limiting device and the second current limiting device are sequentially connected in series between the input end 431 and the output end 432 of the current limiting unit 430, and the specific structure connection schematic diagram is shown in fig. 6, taking the example that the current limiting unit includes the first current limiting device and the second current limiting device.

When the current limiting unit comprises three current limiting devices, namely: when the first current limiting device, the second current limiting device and the third current limiting device are connected in series in sequence between the input end 431 and the output end 432 of the current limiting unit 430, the specific structural connection schematic diagram is shown in fig. 7.

According to an embodiment of the present disclosure, the first current limiting device may be a resistor, the second current limiting device may be a fuse, and the third current limiting device may be a dynamic impedance matching circuit, but is not limited thereto. For example: the first current limiting device may also be a fuse or a dynamic impedance matching circuit, the second current limiting device may also be a resistor or a dynamic impedance matching circuit, and the third current limiting device may also be a resistor or a fuse.

According to the embodiment of the disclosure, when the current limiting device in the current limiting unit comprises a resistor (namely, when the first current limiting device or the second current limiting device or the third current limiting device contained in the current limiting unit is a resistor), the resistance value of the resistor needs to meet the following two conditions:

condition 1: the difference between the resistance value of the resistor minus the contact resistance value of the contact part and the measured device is larger than a first preset value.

Condition 2: the difference of the resistance value of the tested device minus the resistance value of the resistor is larger than a second preset value.

In this way, when the current flowing through the current-limiting unit increases suddenly, heat is concentrated on the resistor in the current-limiting unit, thereby preventing the test device and/or the device under test from being damaged.

In specific implementation, the resistance value of the resistor in the current limiting unit can be set according to specific test types, tested device conditions and test requirements. For example: for large current or TDDB test items, the resistance of the device under test is typically large, so the resistance of the resistor in the current limiting unit should be much lower than the resistance of the device under test. Meanwhile, considering that the resistance of the device to be tested is rapidly reduced when the device to be tested is broken down, the current in the whole loop is mainly determined by the resistance value of the resistance in the current limiting unit, and in order to avoid heat concentration mainly on the contact point of the probe and the device to be tested, the resistance value of the resistance in the current limiting unit needs to be far greater than the contact resistance value of the contact part and the device to be tested, so that heat concentration is more on the resistance in the current limiting unit. In addition, the resistor in the current limiting unit limits the increase of the loop current to a certain extent, so that the testing device and/or the tested device cannot be damaged. Generally, the contact resistance value of the device under test is about 300mΩ. In a specific embodiment, the resistance of the resistor in the current limiting unit may be set to be a multiple of at least one order of magnitude of the contact resistance of the contact portion and the device under test, and the resistance of the device under test is a multiple of at least one order of magnitude of the resistance of the resistor in the current limiting unit, for example: 10 times.

For another example: for other test items in which small current or current cannot be suddenly changed, the specific phase difference values between the resistance value of the resistor in the current limiting unit, the contact resistance value of the contact part and the tested device and the resistance value of the tested device, namely the first preset value and the second preset value, can be adjusted according to actual needs.

According to an embodiment of the present disclosure, when the current limiting device includes a fuse, assuming that a conventional non-fusing current parameter of the fuse is a third preset value, the third preset value needs to satisfy a condition: the third preset value is smaller than a current value which damages the testing device and/or the tested device. Thus, when the current flowing in the loop suddenly increases to be greater than the conventional non-fusing current parameter of the fuse, the fuse fuses timely fuses so that the current flowing is rapidly reduced to 0 before the testing device and/or the tested device are damaged, thereby preventing the testing device and/or the tested device from being damaged.

Wherein the parameters describing the fuse include a rated current and a fusing coefficient, and in general, the rated current refers to a maximum current at which the fuse can maintain normal operation for a long period of time under normal conditions, which is determined by a manufacturing department under laboratory conditions; the fusing coefficient is generally between 1.1 and 1.5, and is different according to the authentication standard. Whereas the conventional unblown current parameter refers to a value obtained by multiplying the rated current and the fusing coefficient. In the implementation, the matched fuses can be selected according to specific characteristic parameters of the tested device, the probes and the socket pins, so that the tested device and the tested device are protected. Typically, the probe will not burn when the loop current is below 100 mA.

According to an embodiment of the present disclosure, when the current limiting device includes a dynamic impedance matching circuit, the dynamic impedance matching circuit adjusts its own impedance value according to the resistance value of the device under test through a dynamic impedance transformation relationship, and the adjusted impedance value needs to satisfy the following two conditions:

Condition 1: the difference between the adjusted impedance value minus the contact resistance value of the contact part and the measured device is larger than a fourth preset value.

Condition 2: the difference of the resistance value of the measured device minus the adjusted impedance value is greater than a fifth preset value.

In this way, when the current flowing through the circuit increases suddenly, heat is concentrated on the dynamic impedance matching circuit, thereby preventing the test device and/or the device under test from being damaged.

Fig. 8 shows a schematic circuit connection diagram of the dynamic impedance matching circuit in an embodiment. It should be noted that, in the implementation, the dynamic impedance matching circuit matched with the test type, the device under test condition and the test requirement can be selected according to the specific implementation, and the method is not limited to the use of the dynamic impedance matching circuit shown in fig. 8.

As shown in fig. 8, the dynamic impedance matching circuit is composed of two parts: a sampling resistor 810 and a resistance adjustment circuit 820. The resistance value adjusting circuit 820 is composed of an NMOS transistor 821, a PMOS transistor 822, and a first resistor 823 and a second resistor 824. The sampling resistor 810 measures the current from the loop and converts the current into a voltage signal, and then the voltage signal is used as an input of the resistance value adjusting circuit 820, and the resistance value adjusting circuit 820 dynamically adjusts the resistance value of the current limiting unit according to the voltage signal collected by the sampling resistor 810. The specific process is as follows: the voltages of the P node of the NMOS transistor 821 and the N node of the PMOS transistor 822 are obtained from the sampling resistor, and when the current in the loop increases, the sampling resistor voltage also increases according to ohm's law, so that the voltages of the P and N nodes increase, resulting in a decrease in the on-resistances of the NMOS transistor 821 and the PMOS transistor 822, and further, in a decrease in the resistance value adjusting circuit 820, resulting in a decrease in the resistance value of the current limiting unit. Similarly, when the current in the loop decreases, the on-resistance of the NMOS transistor 821 and the PMOS transistor 822 increases, and the resistance value adjusting circuit 820 increases, so that the resistance value of the current limiting unit increases. Thus, when the resistance values of the tested devices are different, the current in the loop is reduced, and the dynamic impedance matching circuit increases the impedance value according to the current in the loop, so that the resistance value of the current limiting unit is also increased; when the resistance value of the currently tested device to be tested is reduced, the current in the loop is increased, and the dynamic impedance matching circuit reduces the impedance value of the dynamic impedance matching circuit according to the current in the loop, so that the resistance value of the current limiting unit is reduced. However, the adjusted impedance value needs to satisfy the following two conditions: the adjusted impedance value should be much larger than the contact resistance value of the contact portion and the device under test, and the resistance value of the device under test is much larger than the adjusted impedance value. For example: the adjusted impedance value is a multiple of at least one order of magnitude of the contact resistance value of the contact portion and the measured device, and the resistance value of the measured device is a multiple of at least one order of magnitude of the impedance value adjusted by the dynamic impedance matching circuit, for example: 10 times.

By connecting the dynamic impedance matching circuit in the current limiting unit in series, the test device (such as a probe card, a probe seat or a chip test seat) applying the protection module can adapt to tested devices with various resistance values, and the problems of poor flexibility, low efficiency and huge cost caused by the fact that the tested devices with different resistance values need to be independently manufactured. At the same time, the output voltage range of the drive end of the tester is increased.

According to an embodiment of the present disclosure, for the connection unit in the protection module, one end of the resistor included therein is connected with the second terminal of the connection unit, and the other end is connected with the contact portion of the testing device, since the second terminal of the connection unit is connected with the second electrical connection end of the protection module, and the second electrical connection end of the protection module is connected with the sensing line of the testing machine, when the device under test is tested by the contact portion being connected with the device under test, the resistor in the connection unit in the protection module connects the sensing line of the testing machine with the device under test, thereby causing the testing machine to sense the voltage value applied to the device under test through the sensing line. Because of the addition of the resistor, the input impedance of the sensing line is improved, and the accuracy of the sensed voltage of the tested device is further ensured, so that the tester can adjust the voltage applied by the tester through the driving line by using the sensed voltage of the tested device, and the accuracy of the test result is improved.

According to an embodiment of the present disclosure, the resistor included in the connection unit has a preset resistance value, which may be set according to a specific implementation. According to an embodiment of the disclosure, the preset resistance is much larger than the resistance of the measured object. In one embodiment, the predetermined resistance value of the resistor is greater than or equal to 1Mohm.

According to an embodiment of the present disclosure, when the contact portion is a probe, the other end of the resistor in the connection unit is connected to the contact portion of the test device in two ways:

Mode one: the other end of the resistor is connected to the probe or a needle arm connected to the probe via the third terminal.

Mode two: the other end of the resistor is directly connected to the probe or a needle arm connected to the probe.

In the first mode, the output end of the current limiting unit is connected to the other end of the resistor through the third terminal of the connection unit, that is, the other end of the resistor is connected to the output end of the current limiting unit inside the connection unit and then connected to the probe of the testing device, or the other end of the resistor is connected to the output end of the current limiting unit inside the connection unit and then connected to the needle arm of the testing device, and the needle arm is connected to the probe.

In the second embodiment, the other end of the resistor is connected not to the probe through the third terminal of the connection unit as in the first embodiment, but to the probe directly or to the needle arm directly. Compared with the first mode, the direct connection mode enables the sensing line of the testing machine to be closer to the tested device, and therefore the voltage value of the tested device sensed by the sensing line is more accurate.

According to an embodiment of the present disclosure, when the contact is a socket pin, the other end of the resistor in the connection unit is connected to the socket pin via the third terminal.

According to an embodiment of the disclosure, the first electrical connection end of the protection module may be a source measurement unit SMU driving end, and the second electrical connection end of the protection module may be a source measurement unit SMU sensing end.

When the voltage value of the tested device is sensed by the sensing line, one test mode in the wafer test in the prior art is as follows: and the sensing line of the tester is directly connected with a bonding Pad (Pad) on the surface of the tested device through a sensing pin, and then the voltage of the bonding Pad is fed back to the tester as the voltage of the tested device. Although this approach can sense the voltage value applied to the device under test, there is a problem in that: the sensing pin is good in levelness at the initial stage of manufacturing, all needle points are good in contact, and when testing is conducted, the sensing line can sense actual voltage of the bonding pad and feed the actual voltage back to the testing machine, so that the testing machine outputs proper voltage to a tested device. However, when the sensing pin is tested for a certain number of contacts during mass production, the needle tip is gradually worn or polluted, so that the sensing pin cannot contact with the bonding pad or the contact resistance is overlarge, and the sensing line cannot normally sense the actual bonding pad voltage.

In contrast, in the protection module for the testing device, the sensing line and the tested device are not directly connected, but are connected with the tested device through the resistor in the connection unit and the probe connected with the driving line, on one hand, the input impedance of the sensing line is improved by utilizing the resistor so as to ensure the accuracy of the sensed voltage of the tested device, on the other hand, the sensing line of the testing machine is closer to the tested device by preferably connecting the other end of the resistor with the probe or the needle arm, so that the accuracy of the sensed voltage of the tested device is further ensured, and further, the accuracy of the sensed voltage of the tested device is ensured under the condition that the sensing line is not directly connected with the tested device, and meanwhile, the problems caused by the mode are avoided.

According to the technical scheme provided by the embodiment of the disclosure, the protection module is added in the test device, the current limiting unit and the connecting unit comprising a resistor with a preset resistance are further added in the protection module, and the problem of damage to the test device and/or the tested device caused by current sudden increase is solved by utilizing the current limiting and voltage dividing functions of the current limiting unit; meanwhile, the accuracy of the sensed voltage of the tested device is guaranteed by improving the input impedance of the sensing line by utilizing the resistor in the connecting unit, so that the testing machine can adjust the voltage applied through the driving line by using the sensed voltage of the tested device, and the accuracy of a testing result is improved; in addition, when the current limiting unit comprises a dynamic impedance matching circuit, the dynamic impedance matching circuit can be utilized to dynamically adjust the dynamic impedance transformation characteristic of the self impedance according to the resistance of the tested device in the test, so that the current limiting unit can adapt to the tested device with various resistance values, and the problems of poor flexibility, low test efficiency and high cost are solved.

According to an embodiment of the present disclosure, there is provided a test device including a contact portion and the protection module of the above embodiment. Wherein the contact portion includes: probes or socket pins. When the contact portion is a probe, the test device includes a fixing device for fixing the probe; when the contact portion is a socket pin, the test device includes a chip test socket including a socket including one or more of the socket pins.

The specific structural constitution of the test device to which the protection module described in the above-described embodiments is applied will be described by five specific embodiments in conjunction with the specific manner in which the other end of the resistor in the above-described connection unit is connected to the test device, and the specific type of the test device.

Fig. 9 is a schematic structural connection diagram of a testing device in embodiment 1.

As shown in fig. 9, the test apparatus includes: fixing means 910, probes 920 and the protection module 400 described in the above embodiments; wherein, when the protection module 400 is connected to the probe 920 through the fixing device 910, namely: the protection module 400 is disposed inside the fixing device 910, then: the fixing device 910 is used for fixing a driving line and a sensing line of a testing machine, wherein the driving line of the testing machine is connected with the first electrical connection end 410 of the protection module 400 through the first port 930 of the fixing device 910; the sensing line of the tester is connected to the second electrical connection terminal 420 of the protection module 400 through the second port 940 of the fixing device 910; the third port 950 of the fixture 910 is used to secure the probe 920.

In embodiment 1, the other end of the resistor 444 in the connection unit 440 of the protection module 400 provided in the test apparatus is connected to the probe 920 via the third terminal 443 of the connection unit 440. Test devices in this context include, but are not limited to: a probe card.

Fig. 10 is a schematic structural connection diagram of a test device in embodiment 2.

Compared to the test apparatus of embodiment 1 shown in fig. 9, as shown in fig. 10, the test apparatus of embodiment 2 further includes: a needle arm 960, the third port 950 of the fixing device 910 fixes the needle arm 960, and the needle arm 960 is connected to the probe 920.

In embodiment 2, the other end of the resistor 444 in the connection unit 440 of the protection module 400 provided in the test apparatus is connected to the needle arm 960 connected to the probe 920 via the third terminal 443 of the connection unit 440. Test devices in this context include, but are not limited to: a probe seat.

Fig. 11 shows a schematic structural connection diagram of a test device of embodiment 3. As shown in fig. 11, the other end of the resistor 444 in the connection unit 440 of the protection module 400 provided in the test device may also be directly connected to the needle arm 960 connected to the probe 920, and since the needle arm is generally hollow, connection can be achieved inside the needle arm. Test devices in this context include, but are not limited to: a probe seat.

Fig. 12 is a schematic diagram showing structural connection of a test device of embodiment 4. As shown in fig. 12, when the protection module 400 is not connected to the probe 920 through the fixing device 910, for example: the protection module 400 may be separately disposed outside the fixing device 910, then: the drive line of the tester is directly connected to the first electrical connection 410 of the protection module 400; the sensing line of the tester is directly connected to the second electrical connection 420 of the protection module 400, and the other end of the resistor 444 in the connection unit 440 is directly connected to the probe 920. Since the probe is generally solid, it is necessary to connect the other end of the resistor 444 to the probe 920 by means of a connection like a conductive sleeve, namely: the other end of the resistor 444 is connected to a conductive sleeve fixed to the probe 920. Fig. 13 shows a schematic view in which the other end of the resistor 444 in the connection unit 440 is directly connected to the probe 920 through a conductive sleeve, and as shown in fig. 13, a conductive sleeve 970 may be fitted over the probe 920, and the other end of the resistor 444 in the connection unit 440 may be welded to the conductive sleeve 970, thereby being connected to the probe 920 through the conductive sleeve 970. The conductive sleeve may be made of metal with excellent conductivity, such as: copper, and the like. Test devices in this context include, but are not limited to: a probe seat.

It should be noted that: in the test device shown in fig. 12, since the protection module is disposed outside the fixing device, the fixing device and the probe structure of the test device do not need to be modified, and the test device has the advantages of simple structure and easy implementation.

Fig. 14 is a schematic structural connection diagram of a testing device in embodiment 5. As shown in fig. 14, the test apparatus includes: a chip test socket 1410 and one or more protection modules 400 according to the above embodiments, wherein the chip test socket 1410 comprises a socket, the socket comprising a plurality of socket pins; the third terminal 443 of the connection unit 440 of the protection module 400 is connected to the first terminal 441 thereof and the socket pins of the socket.

Fig. 15 shows a schematic structural connection diagram of a test apparatus according to the present disclosure, which corresponds to embodiment 1.

As shown in fig. 15, the test apparatus includes: test machine 1510 and the test apparatus described in embodiment 1 above, the driving line and the sensing line of the test machine 1510 are connected to the first electrical connection terminal 410 and the second electrical connection terminal 420 of the protection module 400 through the first port 930 and the second port 940 of the fixing device 910 in the test apparatus, respectively. Wherein the tester 1510 is used for performing electrical parameter testing on the device under test by running test software. When the probe 920 is connected to a device under test, a driving line of the tester 1510 applies a test voltage to the device under test through the probe 920 via the current limiting unit 430 and the connection unit 440, and a sensing line of the tester 1510 is connected to the device under test through the probe 920 by a resistor 444 in the connection unit 440, so that the tester 1510 senses a voltage value applied to the device under test through the sensing line. Fig. 15 shows a case where the other end of the resistor 444 in the connection unit 440 is connected to the probe 920 via the third terminal 443 of the connection unit 440.

Fig. 16 shows a schematic structural connection diagram of a test apparatus according to the present disclosure, which corresponds to embodiment 2.

As shown in fig. 16, the test apparatus includes: the test apparatus 1510 and the test device described in the above embodiment 2 are different from the test apparatus shown in fig. 15 in that the test apparatus shown in fig. 16 is a configuration in which the other end of the resistor 444 in the connection unit 440 is connected to the needle arm 960 connected to the probe 920 via the third terminal 443 of the connection unit 440.

Fig. 17 shows a schematic structural connection diagram of a test apparatus according to the present disclosure, which corresponds to embodiment 3.

As shown in fig. 17, the test apparatus includes: the test apparatus 1510 and the test device described in the above embodiment 3 are different from the test apparatus shown in fig. 15 in that the test apparatus shown in fig. 17 is a case in which the other end of the resistor 444 in the connection unit 440 is directly connected to the needle arm 960 connected to the probe 920.

Fig. 18 shows a schematic structural connection diagram of a test apparatus according to the present disclosure, which corresponds to embodiment 4.

As shown in fig. 18, the test apparatus includes: the test apparatus 1510 and the test device described in the above embodiment 4 are different from the test apparatus shown in fig. 15 in that the test apparatus shown in fig. 18 is a case where the other end of the resistor 444 in the connection unit 440 is directly connected to the probe 920, wherein the driving line and the sensing line of the test apparatus are directly connected to the first electrical connection terminal 410 and the second electrical connection terminal 420 in the protection module 400, respectively.

Fig. 19 shows a schematic structural connection diagram of a test apparatus according to the present disclosure, which corresponds to embodiment 5.

As shown in fig. 19, the test apparatus includes: test machine 1510 and the test apparatus described in embodiment 5 above, the drive line and the sense line of the test machine are connected to the first electrical connection terminal 410 and the second electrical connection terminal 420 in the protection module 400, respectively.

Thus, the wafer can be tested by the test apparatus shown in fig. 15-18; the packaged chips can be tested by the test apparatus shown in fig. 19.

Fig. 20 shows a flow chart of a test method for testing a device under test using the test apparatus described in the above specific embodiments 1-3, according to an embodiment of the present disclosure. The device under test to which the following test method is applied is a wafer. As shown in fig. 20, the testing method includes the following steps S2010 to S2040:

In step S2010, a drive line of a testing machine is connected to a first electrical connection of a protection module of a testing device through a first port of the testing device in the testing apparatus.

In step S2020, the sensing line of the testing machine is connected to the second electrical connection terminal of the protection module through the second port of the testing device.

In step S2030, a probe of the testing apparatus is connected to the device under test, so as to apply a test voltage to the device under test, and test the device under test.

In step S2040, the tester senses a voltage value applied to the device under test through the sense line.

Fig. 21 shows a flow chart of a test method for testing a device under test using the test apparatus described in embodiment 4 above, according to an embodiment of the present disclosure. The device under test to which the following test method is applied is a wafer. As shown in fig. 21, the testing method includes the following steps S2110 to S2140:

in step S2110, the driving wire of the testing machine is directly connected to the first electrical connection terminal of the protection module of the testing device.

In step S2120, the sensing line of the testing machine is directly connected to the second electrical connection terminal of the protection module.

In step S2130, a probe of the testing apparatus is connected to the device under test to apply a test voltage to the device under test to test the device under test.

In step S2140, the tester senses a voltage value applied to the device under test through the sense line.

Fig. 22 shows a flow chart of a test method for testing a device under test using the test apparatus described in embodiment 5 above, according to an embodiment of the present disclosure. The device under test to which the following test method is applied is a packaged chip. As shown in fig. 22, the testing method includes the following steps S2210 to S2240:

In step S2210, a driving wire of a testing machine is connected to a first electrical connection terminal of a protection module of a testing device in the testing apparatus.

In step S2220, the sensing line of the testing machine is connected to the second electrical connection terminal of the protection module.

In step S2230, socket pins of a socket of a chip test socket of the test apparatus are connected to the device under test to apply a test voltage to the device under test to test the device under test.

In step S2240, the tester senses a voltage value applied to the device under test through the sensing line.

According to an embodiment of the present disclosure, when performing the steps S2030, S2130, S2230 as described above, the testing the device under test specifically includes one or several of the following tests:

performing time-dependent dielectric breakdown TDDB test on the tested device;

performing IV curve scanning test on the tested device;

Performing reliability test on the tested device;

Performing an electrical characteristic test on the device to be tested;

And performing acceptable test WAT on the tested device.

According to an embodiment of the present disclosure, during the test, the tester acquires the voltage value applied to the device under test through steps S2040, S2140, S2240 as above. In a specific embodiment, after the tester obtains the voltage value of the device under test sensed by the sensing line, the tester adjusts the test voltage applied to the device under test through the driving line according to the sensed voltage value applied to the device under test until the sensed voltage value applied to the device under test reaches the set value.

In addition, for the above step S2230, according to an embodiment of the present disclosure, when the device under test is tested, each port of the device under test is connected to the protection module through the socket pin, or the first port of the device under test is connected to the protection module through the socket pin, and the second port of the device under test is grounded. For example: assuming that the device under test is a capacitor, the capacitor has two ports, and the capacitor is inserted on the chip test socket, then each port of the capacitor is connected with a socket pin, and in one embodiment, each port of the capacitor is connected with a protection module, as shown in fig. 23; in another embodiment, one port of the capacitor is connected to a protection module, and the other port is grounded, as shown in fig. 24. In addition, for chips with more than two ports, such as: the triode with three ports can be respectively connected with one protection module, and two ports can be respectively connected with one protection module, and the other port is grounded. The method can be specifically set according to the test requirement.

After the driving line and the sensing line of the tester are connected with the testing device and the tested device through the steps S2010-S2040, S2110-S2140 or S2210-S2240, a testing voltage is applied to the tested device through the driving line of the tester, at this time, the current flow direction of the circuit where the driving line of the tester is located is from the tester to the tested device, specifically from the driving line of the tester to the current limiting unit through the first electric connection end of the protection module, then from the current limiting unit to the contact part through the connection unit, and finally to the tested device through the contact part; the current flow direction of the circuit where the sensing line of the testing machine is located is from the tested device to the testing machine, specifically from the other end of the resistor in the connection unit to the second electric connection end connected with the sensing line of the testing machine.

According to the technical scheme provided by the embodiment of the disclosure, on one hand, the current limiting unit is added in the protection module, the driving wire of the testing machine is connected with the tested device through the probe by the current limiting unit, and the problem of damage to the testing device and/or the tested device caused by current sudden increase is solved by utilizing the current limiting and voltage dividing functions of the current limiting unit; on the other hand, a connecting unit comprising a resistor with a preset resistance value is added in the protection module, a sensing line of the testing machine is connected with the resistor and then is in short circuit with a driving line connected with the current limiting unit, so that the input impedance of the sensing line is improved by utilizing the resistor, the accuracy of the sensed voltage of the tested device is further ensured, the testing machine can adjust the voltage applied through the driving line by using the sensed voltage of the tested device until the sensed voltage value applied to the tested device reaches a set value, and the accuracy of a testing result is improved; in addition, when the current limiting unit comprises a dynamic impedance matching circuit, the dynamic impedance matching circuit can be utilized to dynamically adjust the dynamic impedance transformation characteristic of the self impedance according to the resistance of the tested device in the test, so that the current limiting unit can adapt to the tested device with various resistance values, and the problems of poor flexibility, low test efficiency and high cost are solved.

The foregoing description is only of the preferred embodiments of the present disclosure and description of the principles of the technology being employed. It will be appreciated by those skilled in the art that the scope of the invention referred to in this disclosure is not limited to the specific combination of features described above, but encompasses other embodiments in which any combination of features described above or their equivalents is contemplated without departing from the inventive concepts described. Such as those described above, are mutually substituted with the technical features having similar functions disclosed in the present disclosure (but not limited thereto).

Claims

1. A protection module for a test device, the protection module comprising: the first electric connection end, the second electric connection end, the current limiting unit and the connection unit, wherein,

2. The protection module of claim 1, wherein the first current limiting device is a resistor, the second current limiting device is a fuse, and the third current limiting device is a dynamic impedance matching circuit.

3. The protection module according to claim 2, wherein when the current limiting device comprises a resistor, a difference of a resistance value of the resistor minus a contact resistance value of the contact portion and the device under test is larger than a first preset value, and a difference of a resistance value of the device under test minus a resistance value of the resistor is larger than a second preset value, so that heat is concentrated on the resistor when a current flowing through the resistor is suddenly increased, thereby preventing the test device and/or the device under test from being damaged.

4. A protection module according to claim 3, wherein the resistance of the resistor is at least 10 times the contact resistance of the contact portion and the device under test, and the resistance of the device under test is at least 10 times the resistance of the resistor.

5. The protection module of claim 2, wherein when the current limiting device comprises a fuse, the normal non-blowing current parameter of the fuse is a third preset value that is less than a current value that damages the test device and/or the device under test, and when the current flowing through the fuse suddenly increases to be greater than the normal non-blowing current parameter of the fuse, the fuse blows causing the current flowing through the fuse to be 0, thereby preventing the test device and/or the device under test from being damaged.

6. The protection module according to claim 2, wherein when the current limiting device includes a dynamic impedance matching circuit, the dynamic impedance matching circuit adjusts its own impedance value according to the resistance value of the device under test through a dynamic impedance transformation relationship, and satisfies that a difference of the adjusted impedance value minus the contact resistance value of the contact portion and the device under test is greater than a fourth preset value, and that a difference of the resistance value of the device under test minus the adjusted impedance value is greater than a fifth preset value, so that heat is concentrated on the dynamic impedance matching circuit when a current flowing through the current suddenly increases, thereby preventing the test device and/or the device under test from being damaged.

7. The protection module of claim 6, wherein the adjusted impedance value is at least 10 times a contact resistance value of the contact portion and the device under test, and wherein the resistance value of the device under test is at least 10 times the adjusted impedance value.

8. The protection module according to claim 1, wherein the contact portion is a probe, and the other end of the resistor is directly connected to the probe or a needle arm connected to the probe.

9. The protection module according to claim 1, wherein the contact portion is a probe, and the other end of the resistor is connected to the probe or a needle arm connected to the probe via the third terminal.

10. The protection module according to claim 1, wherein the contact portion is a socket pin, and the other end of the resistor is connected to the socket pin via the third terminal.

11. The protection module of claim 1, wherein the first electrical connection terminal is a source measurement unit SMU drive terminal and the second electrical connection terminal is a source measurement unit SMU sense terminal.

12. A test device, the test device comprising: a contact portion and a protection module according to any one of claims 1 to 11.

13. The test device of claim 12, wherein:

the third port of the fixture is also used to secure the probe.

14. The test device of claim 13, wherein the test device further comprises: and the needle arm is fixed at the third port of the fixing device and is connected with the probe.

15. The test device of claim 13, wherein the other end of the resistor in the connection unit of the protection module is connected to a conductive sleeve fixed on the probe.

16. The test device of claim 13, wherein the test device comprises: a probe card or a probe mount.

17. The test device of claim 12, wherein:

the contact portion includes a socket pin;

18. A test apparatus, the test apparatus comprising: the testing machine and the testing device according to claim 13,

or alternatively

19. A test apparatus, the test apparatus comprising: a testing machine and a testing device according to claim 17, wherein the drive and sense lines of the testing machine are connected to a first and a second electrical connection, respectively, in a protection module of the testing device.

20. A test method for testing a device under test using the test apparatus according to claim 18, the test method comprising:

When a driving wire of the testing machine is connected with a first electric connection end of a protection module of a testing device through a first port of the testing device in the testing equipment, a sensing wire of the testing machine is connected with a second electric connection end of the protection module through a second port of the testing device; when the driving wire of the testing machine is directly connected with the first electric connecting end of the protection module of the testing device, the sensing wire of the testing machine is directly connected with the second electric connecting end of the protection module;

21. The testing method according to claim 20, wherein the device under test is a wafer, and the testing of the device under test specifically includes one or more of the following tests:

performing time-dependent dielectric breakdown TDDB test on the tested device;

performing IV curve scanning test on the tested device;

Performing reliability test on the tested device;

Performing an electrical characteristic test on the device to be tested;

And performing acceptable test WAT on the tested device.

22. The method of testing of claim 20, further comprising:

23. A test method for testing a device under test using the test apparatus according to claim 19, the test method comprising:

wherein the tested device is a packaged chip.

24. The method of claim 23, wherein each port of the device under test is connected to the protection module through the socket pin or a first port of the device under test is connected to the protection module through the socket pin and a second port of the device under test is grounded when the device under test is tested.