CN1182631C - 具有可定制的电路板片的电连接器 - Google Patents

具有可定制的电路板片的电连接器 Download PDF

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CN1182631C
CN1182631C CNB01804459XA CN01804459A CN1182631C CN 1182631 C CN1182631 C CN 1182631C CN B01804459X A CNB01804459X A CN B01804459XA CN 01804459 A CN01804459 A CN 01804459A CN 1182631 C CN1182631 C CN 1182631C
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乔治·R·德菲鲍
W���ն�˹��
戴维·W·赫尔斯特
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斯科特·K·米基维茨
R
林恩·R·赛普
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473Impedance matching
    • H01R13/6477Impedance matching by variation of dielectric properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581Shield structure
    • H01R13/6585Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/514Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6471Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards

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Abstract

一种电连接器,包括外壳(12)和电路板(13),电路板由外壳支撑。电路板以隔开的关系相互平行延伸。电路板包括经连接器提供电通路的信号印制线(14)。电通路从连接器一端的配合接口(16)向连接器另一端的安装接口(17)延伸。电路板包括第一类电路板(1,3,5,7,9)和第二类电路板(2,4,6,8,10),第一类电路板有布置成第一种图案的电路,第二类电路板有布置成区别于第一种图案的第二种图案的电路。

Description

具有可定制的 电路板片的电连接器
                          技术领域
本发明涉及一种电连接器,该连接器具有与电路板连接的多行和多列导电元件。
                          背景技术
将电路板底板与一个子板相互连接的电连接器通常包括分成对半的两个配合连接器,每一半有多行和多列的导电元件或触点。公知技术提供的每一列触点是单独模块,该模块包括一个垂直阵列的触点,触点有一个超模塑的(overmolded)载体。将多个模块安装在连接器外壳内构成一个完整连接器。比如,参见US5066236。通常,这种连接器中的所有模块基本一样。但是,为了适应经过连接器的信号的不同电特性,连接器中有时需要有不同类型的模块。由此引起的一个问题是需要另行加工和处理不同类型的模块,从而增加了制造成本。
连接到子板连接器的底板有高的触点密度,而且需要在比较高的电速度下运行。由于电子工业具有持续向小型化和改良电性能的方向发展的趋势,因此经常公布更高的触点密度和更高的电子速度的要求。这些要求导致设计的冲突,尤其是在电速度达到500兆赫及以上范围时更加如此,这是因为增加触点密度就要求触点的位置相互非常靠近,从而引起两个不同信号对中的相邻触点之间的相互干扰。
欧洲专利申请EP0852414A2提供了一种电连接器,其包括支持电路板模块的壳体。该连接器中的每个模块都包括一个含有电路板的子组件、多个电气端子、一个分隔件和一个绝缘盖。这些模块的绝缘盖的特征与壳体的配合特征相配套,将电路板模块固定并对齐在壳体中。但是,由于每个模块都是由多个元件构成的,所以,希望能够通过减少元件数量来简化连接器结构,从而降低制造成本。
因此,需要解决的一个问题是如何提供一种触点密度大的电连接器,使其适用于极高速电信号并且造价低廉。
                          发明内容
为解决上述技术问题,本发明提供一种电连接器,包括外壳和由该外壳支持的多个电路板,所述电路板以隔开的关系相互平行延伸,每个电路板包括导电的印制线,这些印制线形成了经过连接器从连接器一端的配合接口向连接器另一端的安装接口延伸的电通路,其特征在于:
所述外壳包括一个前壁、从前壁向后延伸的顶壁和从前壁向前延伸的上遮板和下遮板,前壁多个孔穿过,上遮板具有与孔对齐的上遮板凹槽、下遮板具有有与孔对齐的下遮板凹槽,顶壁有与孔对齐的多个狭缝,所述的电路板穿过前壁中的孔延伸,并且具有置于上遮板凹槽和狭缝中的顶边,电路板还具有置于下遮板凹槽中的底边。
                          附图说明
现在参考附图通过示例描述本发明,其中:
图1是根据本发明的一个电连接器的右前侧等轴测示意图;
图2是该连接器的侧视图;
图3是该连接器的左前侧局部分解等轴测示意图;
图4是该连接器的右后侧局部分解等轴测示意图;
图5是该连接器和一个配合电连接器的分解等轴测示意图;
图6是该连接器和它的配合连接器在配合情况下的等轴测示意图;
图7是通过该连接器前壳的横截面等轴测示意图;
图8是该连接器的左前侧分解等轴测示意图;
图9是该连接器的右前侧分解等轴测示意图;
图10是可用于该连接器的第一类电路板的左侧视图;
图11是可用于该连接器的第二类电路板的左侧视图;
图12是第一类电路板的右侧视图;
图13是第二类电路板的右侧视图;
图14是通过连接器内三个相邻电路板的局部横截面图,其中在相邻电路板上的成对信号印制线彼此相对;
图15是可以用在连接器中的电路板的一个替换实施例的侧视图;
图16是一个有多个图15所示电路板的电连接器的等轴测示意图;和
图17是根据本发明的一种竖直型电连接器的等轴测示意图。
                          具体实施方式
如图1-5所示,本发明的电连接器11包括一个绝缘外壳12,它支撑多个电路板或片13。每块电路板片包括一个绝缘基片,该基片能由传统电路基片材料制成,比如FR4。基片上有传导信号印制线14和接地印制线15。信号印制线和接地印制线适合于为从连接器一端的配合接口16经过连接器到连接器另一端的安装接口17提供一个导电通路。接口16与一个配合电连接器18连接,如图5所示,接口17与一个子板(未示)连接。同样,配合电连接器18有一个安装接口19,接口上有许多触点51,将该接口与母板(未示)连接。连接器11和18用来将子板与母板互联。图6中的这两个连接器是配合好的情况。
现在参考图3-5和7。外壳12是一个包括前壳20和一个组织器(organizer)30的两件式组件。前壳包括一个前壁21,有多个平行孔22经过前壁延伸。前壳还包括从前壁向后延伸的顶壁23和从前壁向前延伸的上下遮板24,25。上下遮板24,25有与孔22对齐的凹槽26,27,顶壁23有与孔22对齐的狭缝28。
每一个电路板片13有一个配合边42、安装边43、顶边44、背边45、底边46和后边47。比如通过焊接将多个端子50固定在安装边上。通过将电路板片的配合边42从前壁的后部插进孔22中就可将电路板片13安装到前壳20上。如图7所示,每个板片13的顶边44有一个用来接受对应的突起49的槽口48,该突起在前壳的相应的一个狭缝28内。
组织器30包括底壁31和后壁32,后壁上有一系列水平狭缝33和竖直狭缝34,它们在接合处35互相对齐后连接。这些水平狭缝和竖直狭缝与前壁21中的多个孔22相一致地相互隔开。水平狭缝33经过孔36通向底壁的底侧41,如图4所示,但是竖直狭缝34不通向后壁的后面37。水平狭缝33有交替顺序布置的两种类型的孔组成。一种狭缝33延伸到底壁31的前边38,从而在狭缝33和底侧41之间确定表面39。另一种狭缝33有端部,在前边的各端部与前边38用一个腹板40隔开,其目的在下面进行解释。
在板13安装到前壳中以后,将组织器30固定到前壳20上。板的安装边43和背边45分别装在水平和竖直狭缝33,34内。将每块板的端子50插进相应的孔36中并且伸出底壁31的底侧41,暴露在这里的触点用来插进子板相应的通孔内(未示)。通过轻微的过盈配合使端子50保持在孔36内,从而将形成连接器的安装接口17的端子固定住。组织器30的后壁32的整个顶边均有接线柱54,这些接线柱过盈配合在前壳部的顶壁23的孔56内,从而保证组织器固定在那里,因此,也将电路板片13安装在外壳11内。
根据本发明的一个方面,如图8和9所示,板片13有两种不同类型,按照交替顺序布置在连接器内。板片13有一个键固定结构件以保证正确装到外壳上。键固定结构由板片后边47的水平凹槽60或者安装边43的垂直凹槽62形成。水平凹槽60与组织器30的一个面39进行键固定,而垂直凹槽62与组织器30的一个腹板40键固定。
在所示的具体实施例中,有10个标号为1-10的板片,序号为奇数的板片是第一类板片,偶数板片为第二类板片。每块板片的面上交替形成有信号印制线14和接地印制线15。不同类型的板片由信号印制线和接地印制线的不同布局区分。在本示例中,每一块板片的面上有两个信号印制线14,它们沿整个长度位于接地印制线15的一侧,接地印制线占导电材料的宽阔区域。接地印制线与信号印制线由间隙隔离以防短路。
现在参考图10-13,示出的两类板片是示例性的实施例。图10和11是在连接器内相邻的两块板片面的平面图,图12和13是从相反方向看到的两块相邻板片的平面图。图10和11分别对应于图8中的板片1和2的可视面,图12和13分别对应于图9中的板片9和10的可视面。显然,图10和12示出第一类板片的两相反面,图11和13示出第二类板片的两相反面。
每块板片的安装边43上有9个端子50,靠近配合边42处有9个接触焊盘,它们作为信号焊盘64和接地焊盘65。信号焊盘64与信号印制线14电连通,这些焊盘64在每块板片13的一侧或一面。接地焊盘65与接地印制线15电连通,这些焊盘65在每块板片的另一侧或另一面。通过相关的信号焊盘64和接地焊盘65,导电通路66为板片的另一侧上的信号印制线14和接地印制线15之间提供电连接。
根据本发明,相邻板片的相对面上的信号印制线相互基本为镜像图象。参考图10和13,第一类板片上的第一和第二信号印制线71,72基本是第二类板片上的第三和第四信号印制线73,74的镜像图象。类似地,参考图11和12,第二类板片上的第五和第六信号印制线75,76基本是第一类板片上的第七和第八信号印制线77,78的镜像图象。因此,连接器相邻板片上的信号印制线与相邻板片的相对面上的信号印制线彼此相对。这为成对使用电信号提供有利的布置。根据本发明,相邻板片上彼此相对的成对印制线用来输送各自的信号对。这一方面示于图14中,其中板片13有信号印制线14和交错的接地印制线15。相邻板片有成对的相对信号印制线14,为了说明起见,每一对印制线被封闭在假想的椭圆80内,每一对这样的印制线用来传输经过连接器的各自的电信号对。
这里公开的信号印制线的布置促进每一对信号的信号印制线之间电耦合,这是因为它们彼此靠得很近。该布置的一个优点在于,由于每一对信号印制线基本互为镜像图象,因此每一对信号印制线长度基本相等,从而使各对电信号的反射最小。
应当注意到,沿每块板片的连续信号印制线与板片的顺序交替侧上的其他信号印制线耦合。这样,信号印制线对交替地交错排列在每块板片的相对侧。这使每一对信号与相邻信号对之间最大可能地隔离。
在一个可替换的布置中,让信号印制线对相互靠得很近,可以使一个信号板片同一侧上的多个信号印制线相互成对,由此促进每一对信号印制线之间边对边地电耦合。
图15示出用于本发明的电路板片的一个替换实施例。在该实施例中,电路板片83有一个信号印制线84和接地印制线85、信号焊盘86、在板片的信号焊盘相反侧的接地焊盘(看不到)、一个配合边88和一个安装边89。安装边89上形成有半圆切口90,信号印制线和和接地印制线延伸到这些切口。每个切口内有一个焊球92固定在板片上,焊球与信号印制线85或接地印制线86中的一个电连接,从而沿安装边形成端子。图15只示出两个焊球92。但是可以理解焊球端子的数量与电路板片上信号印制线和接地印制线的数量相符。
图16示出一个有多个板片83的电连接器100,焊球92构成连接器的一个安装接口。
图17示出根据本发明的一个竖直型电连接器。该竖直型连接器基本类似于前述的直角型连接器。但是,竖直型用来使相互平行的母板片和子板片交互连接,而直角型基本用来使相互垂直的母板片和子板片相互连接。竖直型连接器包括一个外壳110,它有多个电路板片113。该电路板片带有信号和接地印制线,这些印制线在配合接口116和安装接口(沿外壳110的底部118)之间延伸。
本发明有许多优点。电路板片为设计提供很大的灵活性,这样就能够根据用户要求和***特性,可以选择板片上导电印制线的布局来优化性能。可以定制板片来为特定用途提供需要的电特性,而且容易修改电特性。通过改变板片上的布线图可以简单容易地设计和制造出可定制的板片。这些可定制的板片可以使用与其他板片相同的触点、外壳和组件,因此容易用现有板片更换可定制的板片。这样,可以提供造价低廉的可定制电连接器。

Claims (7)

1.一种电连接器(11),包括外壳(12)和由该外壳支持的多个电路板(13),所述电路板以隔开的关系相互平行延伸,每个电路板包括导电的印制线(14,15),这些印制线形成了经过连接器从连接器一端的配合接口向连接器另一端的安装接口延伸的电通路,其特征在于:
所述外壳(12)包括一个前壁(21)、从前壁向后延伸的顶壁(23)和从前壁向前延伸的上遮板(24)和下遮板(25),前壁有多个孔(22)穿过,上遮板具有与孔对齐的上遮板凹槽(26)、下遮板具有与孔对齐的下遮板凹槽(27),顶壁有与孔(22)对齐的多个狭缝(28),所述的电路板穿过前壁中的孔延伸,并且具有置于上遮板凹槽(26)和狭缝(28)中的顶边(44),电路板还具有置于下遮板凹槽(27)中的底边(46)。
2.根据权利要求1所述的电连接器,其中电路板(13)包括第一类电路板(1,3,5,7,9)和第二类电路板(2,4,6,8,10),第一类电路板有布置成第一种图案的电路,第二类电路板有布置成不同于第一种图案的第二种图案的电路。
3.根据权利要求2所述的电连接器,其中一个第一类电路板邻接一个第二类电路板,该第一和第二类电路板的相对的两面包括互为镜像图象的电路图案。
4.根据权利要求3所述的电连接器,其中所述的印制线包括信号印制线(14),第一、第二类电路板上成对的相对信号印制线用于经过连接器的相应的电信号对。
5.根据权利要求2所述的电连接器,其中多个第一类电路板和第二类电路板按交替顺序排列在连接器中。
6.根据权利要求5所述的电连接器,其中所述的印制线包括信号印制线(14),第一、第二类电路板上成对的相对信号印制线用于经过连接器的相应的电信号对。
7.根据权利要求6所述的连接器,其中多对相对信号印制线交错排列在所述每个电路板的两相对面。
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