CN118202520A

CN118202520A - Module, laminate for image display device, method for manufacturing module, and wiring board

Info

Publication number: CN118202520A
Application number: CN202280074319.1A
Authority: CN
Inventors: 古庄宏树; 武诚司; 木下一树; 榊真史
Original assignee: Dai Nippon Printing Co Ltd
Current assignee: Dai Nippon Printing Co Ltd
Priority date: 2021-11-08
Filing date: 2022-11-08
Publication date: 2024-06-14

Abstract

The module is provided with: a wiring substrate having a substrate, a mesh wiring layer, a power supply unit, and a protective layer; and a power supply line electrically connected to the power supply unit via an anisotropic conductive film including conductive particles. The substrate has transparency. The protective layer covers only a part of the power supply portion. The anisotropic conductive film covers a region of the power supply portion that is not covered by the protective layer.

Description

Module, laminate for image display device, method for manufacturing module, and wiring board

Technical Field

Embodiments of the present disclosure relate to a module, a laminate for an image display device, a method of manufacturing a module, and a wiring substrate.

Background

At present, portable terminal devices such as smartphones, tablet personal computers, and smart glasses (AR, MR, etc.) are being advanced in terms of high functionality, miniaturization, thinness, and weight reduction. These portable terminal devices use a plurality of communication bands, and therefore, a plurality of antennas corresponding to the communication bands are required. For example, a plurality of antennas such as an antenna for a telephone, an antenna for WiFi (WIRELESS FIDELITY: wireless fidelity), an antenna for 3G (Generation) and an antenna for 4G (Generation), an antenna for 5G (Generation), an antenna for LTE (Long Term Evolution: long term evolution), an antenna for Bluetooth (registered trademark), and an antenna for NFC (NEAR FIELD Communication: near field Communication) are mounted in a portable terminal device. However, with miniaturization of portable terminal devices, the space for mounting an antenna is limited, and the degree of freedom in antenna design is narrowed. In addition, since the antenna is built in a limited space, the requirement of radio wave sensitivity is not necessarily satisfied.

Accordingly, a film antenna capable of being mounted in a display area of a portable terminal device or a transmission area of smart glasses has been developed. In the film antenna, an antenna pattern is formed on a transparent substrate. The antenna pattern is formed of a mesh-like conductive mesh layer composed of a conductive portion as a formation portion of the opaque conductive layer and a plurality of opening portions as non-formation portions.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open publication No. 2011-66610

Patent document 2: japanese patent No. 5636735 specification

Patent document 3: japanese patent No. 5695947 specification

However, in the film antenna, a power supply line is connected to a power supply portion for electrically connecting the conductive mesh layer to an external device. In this case, it is required to protect the power supply portion from corrosion or the like while suppressing a decrease in electrical connectivity between the power supply portion and the power supply line.

In the film antenna, it is preferable that the conductive mesh layer and the power supply portion are covered with a protective layer in order to protect the conductive mesh layer or the power supply portion for electrically connecting the conductive mesh layer to an external device. However, when the conductive mesh layer is covered with the protective layer, light is reflected by the protective layer, and thus the wiring board may be easily seen.

The present embodiment aims to provide a module, a laminate for an image display device, and an image display device, which can protect a power supply unit while suppressing a decrease in electrical connectivity between a power supply line and the power supply unit.

The present embodiment provides a wiring substrate, a laminate for an image display device, and an image display device, which can protect a metal layer existing in a region that does not overlap with a display region of the image display device, and can make it difficult to see the wiring substrate existing in the region that overlaps with the display region.

The present embodiment provides a wiring board, a laminate for an image display device, and an image display device as follows: the metal layer can be protected and the wiring substrate is not easily seen.

Disclosure of Invention

A 1 st aspect of the present disclosure is a module, wherein the module includes: a wiring substrate including a 1 st surface and a 2 nd surface located on the opposite side of the 1 st surface, a grid wiring layer disposed on the 1 st surface of the substrate, a power supply portion electrically connected to the grid wiring layer, and a protective layer disposed on the 1 st surface of the substrate and covering the grid wiring layer and the power supply portion; and a power supply line electrically connected to the power supply portion via an anisotropic conductive film including conductive particles, the substrate having transparency, the protective layer covering only a part of the power supply portion, the anisotropic conductive film covering a region of the power supply portion not covered by the protective layer.

In the module according to the above aspect 1, the anisotropic conductive film may be partially disposed on the protective layer.

In the module according to the 1 st aspect or the 2 nd aspect of the present disclosure, the region of the power supply portion not covered with any one of the protective layer and the anisotropic conductive film may be covered with a coating layer containing a material having corrosion resistance.

In a4 th aspect of the present disclosure, in the module according to the 1 st aspect to the 3 rd aspect, the power supply line is electrically connected to the power supply unit by the conductive particles entering the protective layer.

In a 5 th aspect of the present disclosure, in addition to the module according to the 1 st aspect to the 4 th aspect, the protective layer may have a thickness of 4.0 μm or more and 8.0 μm or less.

In a6 th aspect of the present disclosure, in the module according to the 1 st aspect to the 5 th aspect, a dummy wiring layer electrically independent of the mesh wiring layer may be provided around the mesh wiring layer.

In a 7 th aspect of the present disclosure, in the module according to the 1 st aspect to the 6 th aspect, the wiring board may have a radio wave transmitting/receiving function.

In an 8 th aspect of the present disclosure, in the module according to the 1 st aspect to the 7 th aspect, the mesh wiring layer may include a transmission unit connected to the power supply unit and a transmission/reception unit connected to the transmission unit.

A 9 th aspect of the present disclosure is a laminate for an image display device, comprising: the module according to any one of the above aspects 1 to 8; a1 st adhesive layer located on the 1 st surface side of the substrate; and a 2 nd adhesive layer located on the 2 nd surface side of the substrate, wherein a partial region of the substrate is disposed in a partial region between the 1 st adhesive layer and the 2 nd adhesive layer.

A 10 th aspect of the present disclosure is an image display device including the laminate for an image display device of the 9 th aspect and a display device laminated on the laminate for an image display device.

An 11 th aspect of the present disclosure is a method for manufacturing a module, including: a step of preparing a substrate including a 1 st surface and a 2 nd surface located on the opposite side of the 1 st surface; forming a mesh wiring layer and a power supply unit electrically connected to the mesh wiring layer on the 1 st surface of the substrate; forming a protective layer on the 1 st surface of the substrate so as to cover the mesh wiring layer and the power supply portion; and a step of electrically connecting a power supply line to the power supply portion via an anisotropic conductive film containing conductive particles, wherein the substrate has transparency, the protective layer covers only a part of the power supply portion, and the anisotropic conductive film covers a region of the power supply portion not covered by the protective layer.

A 12 th aspect of the present disclosure is a wiring substrate for an image display device, the wiring substrate including: a substrate; a metal layer disposed on the substrate; and a protective layer covering a part of the metal layer, wherein the substrate has transparency, the metal layer includes a mesh wiring layer, and the protective layer is present in a1 st region which does not overlap with a display region of the image display device and is not present in a2 nd region which overlaps with the display region of the image display device. In the present specification, transparency means that the transmittance of light having a wavelength of 400nm or more and 700nm or less is 85% or more.

In a 13 th aspect of the present disclosure, in the wiring board according to the 12 th aspect, a difference between a heat shrinkage rate of the protective layer at 120 ℃ after 1 hour and a heat shrinkage rate of the board is 1% or less.

In a 14 th aspect of the present disclosure, in the wiring board according to the 12 th or 13 th aspect, the protective layer may have a dielectric loss tangent of 0.002 or less.

In a 15 th aspect of the present disclosure, in the wiring board according to the 12 th aspect to the 14 th aspect, a ratio (T ₁₂/T₁) of the thickness T ₁₂ of the protective layer to the thickness T ₁ of the board may be 0.02 to 5.0.

In a 16 th aspect of the present disclosure, in the wiring board according to the 12 th aspect to the 15 th aspect, the thickness of the board may be 10 μm or more and 50 μm or less.

In a 17 th aspect of the present disclosure, in the wiring substrate according to the 12 th aspect to the 16 th aspect, a dummy wiring layer electrically independent of the mesh wiring layer may be provided around the mesh wiring layer.

In an 18 th aspect of the present disclosure, in the wiring board according to the 12 th aspect to the 17 th aspect, the mesh wiring layer may function as an antenna.

In a 19 th aspect of the present disclosure, the wiring board according to the 12 th aspect to the 18 th aspect may further include a power feeding portion electrically connected to the mesh wiring layer, and the mesh wiring layer may include a transmission portion connected to the power feeding portion and a transmission/reception portion connected to the transmission portion.

In a 20 th aspect of the present disclosure, in the wiring board according to the 12 th aspect to the 19 th aspect, the board, the metal layer, and the protective layer may be curved in the 1 st area.

A 21 st aspect of the present disclosure is a module including: a wiring board according to any one of the 12 th to 19 th aspects; and a power supply line electrically connected to the wiring board.

A 22 nd aspect of the present disclosure is a laminate for an image display device, comprising: a wiring board according to any one of the 12 th to 19 th aspects; a 3 rd adhesive layer having a larger area than the substrate; and a 4 th adhesive layer having a larger area than the substrate, the 3 rd adhesive layer having transparency, the 4 th adhesive layer having transparency, a part of the area of the substrate being arranged in a part of the area between the 3 rd adhesive layer and the 4 th adhesive layer.

In a 23 rd aspect of the present disclosure, in the laminate for an image display device according to the 22 nd aspect, at least one of the thickness of the 3 rd adhesive layer and the thickness of the 4 th adhesive layer may be 1.5 times or more the thickness of the substrate.

In a 24 th aspect of the present disclosure, in the laminate for an image display device according to the 22 nd or 23 th aspect, the material of the 3 rd adhesive layer is an acrylic resin, and the material of the 4 th adhesive layer is an acrylic resin.

A 25 th aspect of the present disclosure is an image display device including: the laminated body for an image display device according to any one of the above 22 to 24; and a display unit having a display region, which is laminated on the laminate for an image display device.

A 26 th aspect of the present disclosure is a wiring board for an image display device, including: a substrate; a metal layer disposed on the substrate; and a protective layer covering the metal layer, wherein the substrate has transparency, the metal layer includes a mesh wiring layer, and a difference between a refractive index of the substrate and a refractive index of the protective layer is 0.1 or less. In the present specification, transparency means that the transmittance of light having a wavelength of 400nm or more and 700nm or less is 85% or more.

In a 27 th aspect of the present disclosure, in the wiring board according to the 26 th aspect, a difference between a heat shrinkage rate of the protective layer at 120 ℃ after 1 hour and a heat shrinkage rate of the board may be 1% or less.

In a 28 th aspect of the present disclosure, in the wiring board according to the 26 th or 27 th aspect, the protective layer may have a dielectric loss tangent of 0.002 or less.

In a 29 th aspect of the present disclosure, in the wiring board according to the 26 th aspect to the 28 th aspect, a ratio (T ₁₂/T₁) of the thickness T ₁₂ of the protective layer to the thickness T ₁ of the board may be 0.02 to 5.0.

In a 30 th aspect of the present disclosure, in the wiring board according to the 26 th aspect to the 29 th aspect, the thickness of the board may be 10 μm or more and 50 μm or less.

In a 31 st aspect of the present disclosure, in the wiring substrate according to the 26 th aspect to the 30 th aspect, a dummy wiring layer electrically independent of the mesh wiring layer may be provided around the mesh wiring layer.

In a 32 nd aspect of the present disclosure, in the wiring board according to the 26 th aspect to the 31 st aspect, the mesh wiring layer functions as an antenna.

A 33 of the present disclosure may further include a power feeding unit electrically connected to the mesh wiring layer, the mesh wiring layer including a transmission unit connected to the power feeding unit and a transmission/reception unit connected to the transmission unit, in the wiring substrate of each of the 26 th to 32 th of the present disclosure.

In a 34 th aspect of the present disclosure, in the wiring board according to the 26 th aspect to the 33 th aspect, a part of the board, the metal layer, and the protective layer may be curved.

A 35 th aspect of the present disclosure is a module including: a wiring board according to any one of the 26 th to 34 th aspects; and a power supply line electrically connected to the wiring board.

A 36 th aspect of the present disclosure is a laminate for an image display device, comprising: a 3 rd adhesive layer; a 4 th adhesive layer; and a wiring substrate disposed between the 3 rd adhesive layer and the 4 th adhesive layer, wherein the wiring substrate has a substrate, a metal layer disposed on the substrate, and a protective layer covering the metal layer, the substrate has transparency, the 3 rd adhesive layer has transparency, the 4 th adhesive layer has transparency, the metal layer includes a mesh wiring layer, and a difference between a maximum value and a minimum value among a refractive index of the substrate, a refractive index of the protective layer, a refractive index of the 3 rd adhesive layer, and a refractive index of the 4 th adhesive layer is 0.1 or less.

In a 37 th aspect of the present disclosure, in the laminate for an image display device according to the 36 th aspect, at least one of the thickness of the 3 rd adhesive layer and the thickness of the 4 th adhesive layer may be 1.5 times or more the thickness of the substrate.

In a 38 th aspect of the present disclosure, in the laminate for an image display device according to the 36 th aspect or the 37 th aspect, the material of the 3 rd adhesive layer is an acrylic resin, and the material of the 4 th adhesive layer is an acrylic resin.

An 39 th aspect of the present disclosure is an image display apparatus, comprising: the laminated body for an image display device according to any one of the 36 th to 38 th modes; and a display unit laminated on the laminate for an image display device.

According to the embodiments of the present disclosure, it is possible to suppress a decrease in electrical connectivity between the power supply line and the power supply portion, and to protect the power supply portion.

According to the embodiments of the present disclosure, the metal layer existing in the region that does not overlap with the display region of the image display device can be protected, and it is difficult to see the wiring substrate existing in the region that overlaps with the display region.

According to the embodiments of the present disclosure, the metal layer can be protected, and it is difficult to see the wiring substrate.

Drawings

Fig. 1 is a plan view showing an image display device according to embodiment 1.

Fig. 2 is a cross-sectional view (cross-sectional view taken along line II-II in fig. 1) showing the image display device of embodiment 1.

Fig. 3 is a plan view showing the wiring board according to embodiment 1.

Fig. 4 is an enlarged plan view showing the mesh wiring layer and the power supply portion of the wiring board according to embodiment 1.

Fig. 5 is a cross-sectional view (V-V line cross-sectional view in fig. 4) showing the wiring substrate of embodiment 1.

Fig. 6 is a cross-sectional view (a VI-VI cross-sectional view in fig. 4) showing the wiring substrate of embodiment 1.

Fig. 7 is a plan view showing the module of embodiment 1.

Fig. 8 (a) is an enlarged plan view showing a power supply unit of the module according to embodiment 1, and fig. 8 (b) is an enlarged plan view showing a power supply line of the module according to embodiment 1.

Fig. 9 is a cross-sectional view (cross-sectional view taken along line IX-IX of fig. 7) showing a module of embodiment 1.

Fig. 10 (a) - (f) are cross-sectional views showing a method for manufacturing a wiring substrate according to embodiment 1.

Fig. 11 (a) - (c) are cross-sectional views showing a method of manufacturing the module of embodiment 1.

Fig. 12 (a) - (c) are cross-sectional views showing a method for manufacturing a laminate for an image display device according to embodiment 1.

Fig. 13 is a cross-sectional view showing a module according to modification 1.

Fig. 14 is a cross-sectional view showing a module according to modification 2.

Fig. 15 (a) - (d) are cross-sectional views showing a method of manufacturing a module according to modification 2.

Fig. 16 is a cross-sectional view showing a module according to modification 3.

Fig. 17 (a) - (c) are cross-sectional views showing a method of manufacturing a module according to modification 3.

Fig. 18 is a plan view of a wiring board according to modification 1.

Fig. 19 is an enlarged plan view of a wiring board according to modification 1.

Fig. 20 is a plan view showing a wiring board according to modification 2.

Fig. 21 is an enlarged plan view of a wiring board according to modification 2.

Fig. 22 is an enlarged plan view showing a mesh wiring layer of the wiring substrate according to modification 3.

Fig. 23 is a plan view showing an image display device according to embodiment 2.

Fig. 24 is a cross-sectional view (sectional view taken along line XXIV-XXIV in fig. 23) showing an image display device of embodiment 2.

Fig. 25 is a plan view showing a wiring substrate.

Fig. 26 is an enlarged plan view showing a mesh wiring layer of the wiring substrate.

Fig. 27 is a cross-sectional view showing a wiring substrate (cross-sectional view taken along line XXVII-XXVII of fig. 26).

Fig. 28 is a cross-sectional view (cross-sectional view taken along line XXVIII-XXVIII of fig. 26) showing a wiring substrate.

Fig. 29 (a) - (g) are cross-sectional views showing a method for manufacturing a wiring board according to embodiment 2.

Fig. 30 is a cross-sectional view showing a state after bending the wiring substrate.

Fig. 31 is a plan view of a wiring board according to modification 1.

Fig. 32 is a plan view of a wiring board according to modification 2.

Fig. 33 is a cross-sectional view showing a wiring board according to modification 3.

Fig. 34 is a cross-sectional view showing a wiring board according to modification 4.

Fig. 35 is a cross-sectional view (corresponding to the cross-sectional view of fig. 24) showing the image display device of embodiment 3.

Fig. 36 is a plan view showing a wiring substrate.

Fig. 37 (a) - (g) are cross-sectional views showing a method for manufacturing a wiring board according to embodiment 3.

Fig. 38 is a plan view of a wiring board according to modification 1.

Fig. 39 is a plan view of a wiring board according to modification 2.

Detailed Description

(Embodiment 1)

First, embodiment 1 will be described with reference to fig. 1 to 12. Fig. 1 to 12 are diagrams showing the present embodiment.

Each of the drawings shown below is a schematic diagram. Therefore, the size and shape of each portion are appropriately exaggerated for easy understanding. The present invention can be implemented by appropriately changing the configuration without departing from the scope of the technical idea. In the drawings shown below, the same reference numerals are given to the same parts, and a part of detailed description may be omitted. The numerical values and material names of the dimensions and the like of the respective members described in the present specification are examples of the embodiments, and are not limited thereto, and can be appropriately selected and used. In the present specification, terms for determining conditions of shape and geometry, such as parallel, orthogonal, and vertical terms, are to be interpreted as including substantially the same state, except for strict meaning.

In the following embodiments, the "X direction" refers to a direction parallel to one side of the image display device. The "Y direction" refers to a direction perpendicular to the X direction and parallel to the other side of the image display device. The "Z direction" is a direction perpendicular to both the X direction and the Y direction and parallel to the thickness direction of the image display device. The "front face" refers to the face on the positive side in the Z direction, the light emitting face side of the image display device, and the face facing the viewer side. The "back surface" refers to the surface on the negative side in the Z direction, and refers to the surface on the opposite side to the light emitting surface and the surface facing the viewer side of the image display apparatus. In the present embodiment, the case where the mesh wiring layer 20 is the mesh wiring layer 20 having the radio wave transmitting/receiving function (function as an antenna) is described as an example, but the mesh wiring layer 20 may not have the radio wave transmitting/receiving function (function as an antenna).

[ Structure of image display device ]

The configuration of the image display device according to the present embodiment will be described with reference to fig. 1 and 2.

As shown in fig. 1 and 2, the image display device 60 of the present embodiment includes a laminate 70 for an image display device, and a display device (display) 61 laminated on the laminate 70 for an image display device. The image display device laminate 70 includes a1 st transparent adhesive layer (1 st adhesive layer) 95, a2 nd transparent adhesive layer (2 nd adhesive layer) 96, and a module 80A. The module 80A of the image display device laminate 70 includes the wiring board 10 and the power supply line 85 electrically connected to the wiring board 10.

The wiring substrate 10 of the module 80A includes a substrate 11, a mesh wiring layer 20, a power supply unit 40, and a protective layer 17 covering the mesh wiring layer 20 and the power supply unit 40. The substrate 11 includes a 1 st surface 11a and a 2 nd surface 11b located on the opposite side of the 1 st surface 11 a. The mesh wiring layer 20 is disposed on the 1 st surface 11a of the substrate 11. Further, a power supply unit 40 is electrically connected to the mesh wiring layer 20. The communication module 63 is disposed on the negative side in the Z direction with respect to the display device 61. The image display device laminate 70, the display device 61, and the communication module 63 are housed in the case 62.

In the image display device 60 shown in fig. 1 and 2, radio waves of a predetermined frequency can be transmitted and received via the communication module 63, and communication can be performed. The communication module 63 may include any of a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth (registered trademark) antenna, an NFC antenna, and the like. Examples of such an image display device 60 include a mobile terminal device such as a smart phone or a tablet computer, and smart glasses.

As shown in fig. 2, the image display device 60 has a light emitting surface 64. The image display device 60 includes the wiring board 10 positioned on the light emitting surface 64 side (Z direction positive side) with respect to the display device 61, and the communication module 63 positioned on the opposite side (Z direction negative side) of the light emitting surface 64 with respect to the display device 61.

The display device 61 is constituted by an organic EL (Electro Luminescence: electroluminescence) display device, for example. The display device 61 may include, for example, a metal layer, a supporting substrate, a resin substrate, a Thin Film Transistor (TFT), and an organic EL layer, which are not shown. A touch sensor, not shown, may be disposed on the display device 61. Further, the wiring board 10 is disposed on the display device 61 with the 2 nd transparent adhesive layer 96 interposed therebetween. The display device 61 is not limited to the organic EL display device. For example, the display device 61 may be another display device having a function of emitting light itself, or may be a micro LED display device including a micro LED element (light emitter). The display device 61 may be a liquid crystal display device including liquid crystal. A cover glass (front protective plate) 75 is disposed on the wiring board 10 through a1 st transparent adhesive layer 95. A decorative film and a polarizing plate, not shown, may be disposed between the 1 st transparent adhesive layer 95 and the cover glass 75.

The 1 st transparent adhesive layer 95 is an adhesive layer that directly or indirectly adheres the wiring board 10 to the cover glass 75. The 1 st transparent adhesive layer 95 is located on the 1 st surface 11a side of the substrate 11. The 1 st transparent adhesive layer 95 has Optical transparency, and may be an OCA (Optical CLEAR ADHESIVE: optically clear adhesive) layer. The OCA layer is, for example, a layer produced as follows. First, a composition for a liquid curable adhesive layer containing a polymerizable compound is applied to a release film such as polyethylene terephthalate (PET), and cured using, for example, ultraviolet (UV) light or the like to obtain an OCA sheet. The OCA layer is obtained by bonding the OCA sheet to an object and then peeling off and removing the release film. The material of the 1 st transparent adhesive layer 95 may be an acrylic resin, a silicone resin, a urethane resin, or the like. In particular, the 1 st transparent adhesive layer 95 may contain an acrylic resin. In this case, the 2 nd transparent adhesive layer 96 preferably contains an acrylic resin. This substantially eliminates the difference in refractive index between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96, and can more reliably suppress reflection of visible light at the interface B5 between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96.

The transmittance of visible light (light having a wavelength of 400nm or more and 700nm or less) of the 1 st transparent adhesive layer 95 may be 85% or more, preferably 90% or more. The upper limit of the transmittance of visible light of the 1 st transparent adhesive layer 95 is not particularly limited, and may be, for example, 100% or less. By setting the transmittance of visible light of the 1 st transparent adhesive layer 95 to the above range, the transparency of the laminate 70 for an image display device can be improved, and the display device 61 of the image display device 60 can be easily seen.

As described above, the wiring board 10 is disposed on the light emitting surface 64 side with respect to the display device 61. In this case, the wiring board 10 is located between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96. More specifically, a part of the area of the substrate 11 of the wiring substrate 10 is disposed in a part of the area between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96. In this case, the 1 st transparent adhesive layer 95, the 2 nd transparent adhesive layer 96, the display device 61, and the cover glass 75 each have a larger area than the substrate 11 of the wiring substrate 10. In this way, by disposing the substrate 11 of the wiring substrate 10 in a partial region of the image display device 60, not the entire surface of the image display device 60, the thickness of the entire image display device 60 can be reduced.

The wiring board 10 includes: a substrate 11 having transparency; a mesh wiring layer 20 disposed on the 1 st surface 11a of the substrate 11; a power supply unit 40 electrically connected to the mesh wiring layer 20; and a protective layer 17 disposed on the 1 st surface 11a of the substrate 11 and covering the mesh wiring layer 20 and the power supply unit 40. A power supply unit 40 is electrically connected to the mesh wiring layer 20. The power supply unit 40 is electrically connected to the communication module 63 via a power supply line 85. In addition, a part of the wiring board 10 is not disposed between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96, but protrudes outward (negative side in the Y direction) from between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96. Specifically, the region of the wiring substrate 10 where the power supply portion 40 is provided protrudes outward. This makes it possible to easily electrically connect the power supply unit 40 and the communication module 63. On the other hand, the region of the wiring substrate 10 where the mesh wiring layer 20 is provided is located between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96. The details of the wiring board 10 and the feeder line 85 will be described later.

The 2 nd transparent adhesive layer 96 is an adhesive layer that directly or indirectly adheres the display device 61 to the wiring substrate 10. The 2 nd transparent adhesive layer 96 is located on the 2 nd surface 11b side of the substrate 11. The 2 nd transparent adhesive layer 96 has Optical transparency similar to the 1 st transparent adhesive layer 95, and may be an OCA (Optical CLEAR ADHESIVE: optically clear adhesive) layer. The material of the 2 nd transparent adhesive layer 96 may be an acrylic resin, a silicone resin, a urethane resin, or the like. In particular, the 2 nd transparent adhesive layer 96 may contain an acrylic resin. This substantially eliminates the difference in refractive index between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96, and can more reliably suppress reflection of visible light at the interface B5 between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96.

The transmittance of visible light (light having a wavelength of 400nm or more and 700nm or less) of the 2 nd transparent adhesive layer 96 may be 85% or more, preferably 90% or more. The upper limit of the transmittance of visible light of the 2 nd transparent adhesive layer 96 is not particularly limited, and may be, for example, 100% or less. By setting the transmittance of visible light of the 2 nd transparent adhesive layer 96 to the above range, the transparency of the laminate 70 for an image display device can be improved, and the display device 61 of the image display device 60 can be easily seen.

In such a laminate 70 for an image display device, the difference between the refractive index of the 1 st transparent adhesive layer 95 and the refractive index of the protective layer 17 of the wiring substrate 10 is 0.1 or less, preferably 0.05 or less. The difference between the refractive index of the protective layer 17 and the refractive index of the substrate 11 is 0.1 or less, preferably 0.05 or less. The refractive index herein means an absolute refractive index, and can be obtained by the A method according to JIS K-7142. For example, when the material of the 1 st transparent adhesive layer 95 is an acrylic resin (refractive index is 1.49), the refractive index of the protective layer 17 is set to 1.39 or more and 1.59 or less.

By suppressing the difference between the refractive index of the 1 st transparent adhesive layer 95 and the refractive index of the protective layer 17 to 0.1 or less in this way, reflection of visible light at the interface B1 between the 1 st transparent adhesive layer 95 and the protective layer 17 can be suppressed, and the substrate 11 provided with the protective layer 17 can be made difficult to be seen by the naked eye of an observer. In addition, by suppressing the difference between the refractive index of the protective layer 17 and the refractive index of the substrate 11 to 0.1 or less, reflection of visible light at the interface B2 between the protective layer 17 and the substrate 11 can be suppressed, and the substrate 11 can be made difficult to be seen by the naked eye of an observer.

In the laminate 70 for an image display device, the difference between the refractive index of the substrate 11 and the refractive index of the 1 st transparent adhesive layer 95 is 0.1 or less, preferably 0.05 or less. The difference between the refractive index of the 2 nd transparent adhesive layer 96 and the refractive index of the substrate 11 is 0.1 or less, preferably 0.05 or less. Further, the difference between the refractive index of the 1 st transparent adhesive layer 95 and the refractive index of the 2 nd transparent adhesive layer 96 is preferably 0.1 or less, more preferably 0.05 or less. For example, when the material of the 1 st transparent adhesive layer 95 and the material of the 2 nd transparent adhesive layer 96 are acrylic resins (refractive index is 1.49), the refractive index of the substrate 11 is set to be 1.39 or more and 1.59 or less. Examples of such a material include a fluororesin, a silicone resin, a polyolefin resin, a polyester resin, an acrylic resin, a polycarbonate resin, a polyimide resin, and a cellulose resin.

By thus suppressing the difference between the refractive index of the substrate 11 and the refractive index of the 1 st transparent adhesive layer 95 to 0.1 or less, reflection of visible light at the interface B3 between the substrate 11 and the 1 st transparent adhesive layer 95 can be suppressed, and the substrate 11 can be made difficult to be seen by the naked eye of an observer. Further, by suppressing the difference between the refractive index of the 2 nd transparent adhesive layer 96 and the refractive index of the substrate 11 to 0.1 or less, reflection of visible light at the interface B4 between the 2 nd transparent adhesive layer 96 and the substrate 11 can be suppressed, and the substrate 11 can be made difficult to be seen by the naked eye of an observer. Further, by suppressing the difference between the refractive index of the 1 st transparent adhesive layer 95 and the refractive index of the 2 nd transparent adhesive layer 96 to 0.1 or less, reflection of visible light at the interface B5 between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96 can be suppressed, and the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96 can be made difficult to be seen by the naked eye of an observer.

It is particularly preferable that the material of the 1 st transparent adhesive layer 95 and the material of the 2 nd transparent adhesive layer 96 are the same as each other. This can further reduce the difference in refractive index between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96, and can suppress reflection of visible light at the interface B5 between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96.

In fig. 2, at least one of the thickness T ₃ of the 1 st transparent adhesive layer 95 and the thickness T ₄ of the 2 nd transparent adhesive layer 96 may be 1.5 times or more, preferably 2 times or more, and more preferably 2.5 times or more the thickness T ₁ of the substrate 11. In this way, by making the thickness T ₃ of the 1 st transparent adhesive layer 95 or the thickness T ₄ of the 2 nd transparent adhesive layer 96 sufficiently thick with respect to the thickness T ₁ of the substrate 11, the 1 st transparent adhesive layer 95 or the 2 nd transparent adhesive layer 96 deforms in the thickness direction in the region overlapping the substrate 11, thereby absorbing the thickness of the substrate 11. This can suppress the occurrence of a step in the 1 st transparent adhesive layer 95 or the 2 nd transparent adhesive layer 96 at the peripheral edge of the substrate 11, and can make it difficult for the observer to see the presence of the substrate 11.

The thickness T ₃ of the 1 st transparent adhesive layer 95 and the thickness T ₄ of the 2 nd transparent adhesive layer 96 are preferably 10 times or less, more preferably 5 times or less the thickness T ₁ of the substrate 11. Accordingly, the thickness T ₃ of the 1 st transparent adhesive layer 95 or the thickness T ₄ of the 2 nd transparent adhesive layer 96 does not become excessively thick, and the thickness of the entire image display device 60 can be reduced.

In fig. 2, the thickness T ₃ of the 1 st transparent adhesive layer 95 and the thickness T ₄ of the 2 nd transparent adhesive layer 96 may be the same as each other. In this case, the thickness T ₃ of the 1 st transparent adhesive layer 95 and the thickness T ₄ of the 2 nd transparent adhesive layer 96 may be 1.5 times or more, preferably 2.0 times or more, the thickness T ₁ of the substrate 11, respectively. That is, the total (T ₃+T₄) of the thickness T ₃ of the 1 st transparent adhesive layer 95 and the thickness T ₄ of the 2 nd transparent adhesive layer 96 is 3 times or more the thickness T ₁ of the substrate 11. By making the total of the thicknesses T ₃、T₄ and T ₃、T₄ of the 1 st and 2 nd transparent adhesive layers 95 and 96 sufficiently thick with respect to the thickness T ₁ of the substrate 11 in this way, the 1 st and 2 nd transparent adhesive layers 95 and 96 deform (shrink) in the thickness direction in the region overlapping the substrate 11, thereby absorbing the thickness of the substrate 11. This can suppress the occurrence of a step in the 1 st transparent adhesive layer 95 or the 2 nd transparent adhesive layer 96 at the peripheral edge of the substrate 11, and can make it difficult for the observer to see the presence of the substrate 11.

In the case where the thickness T ₃ of the 1 st transparent adhesive layer 95 and the thickness T ₄ of the 2 nd transparent adhesive layer 96 are the same as each other, the thickness T ₃ of the 1 st transparent adhesive layer 95 and the thickness T ₄ of the 2 nd transparent adhesive layer 96 may be 5 times or less, preferably 3 times or less, the thickness T ₁ of the substrate 11, respectively. Thus, the thickness T ₃、T₄ of both the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96 does not become excessively thick, and the thickness of the entire image display device 60 can be made thin.

Specifically, the thickness T ₁ of the substrate 11 may be, for example, 2 μm or more and 200 μm or less, may be 2 μm or more and 50 μm or less, may be 10 μm or more and 50 μm or less, and is preferably 15 μm or more and 25 μm or less. By setting the thickness T ₁ of the substrate 11 to 2 μm or more, the strength of the wiring substrate 10 can be maintained, and the 1 st-direction wiring 21 and the 2 nd-direction wiring 22, which will be described later, of the mesh wiring layer 20 are hardly deformed. Further, by setting the thickness T ₁ of the substrate 11 to 200 μm or less, it is possible to suppress the occurrence of a step in the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96 at the peripheral edge of the substrate 11, and it is possible to make it difficult for the observer to see the presence of the substrate 11. Further, by setting the thickness T ₁ of the substrate 11 to 50 μm or less, it is possible to further suppress the occurrence of a step in the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96 at the peripheral edge of the substrate 11, and it is more difficult for the observer to see the presence of the substrate 11.

The thickness T ₃ of the 1 st transparent adhesive layer 95 may be, for example, 15 μm or more and 500 μm or less, preferably 15 μm or more and 300 μm or less, and more preferably 20 μm or more and 250 μm or less. The thickness T ₄ of the 2 nd transparent adhesive layer 96 may be, for example, 15 μm or more and 500 μm or less, preferably 15 μm or more and 300 μm or less, and more preferably 20 μm or more and 250 μm or less.

As described above, the module 80A including the wiring substrate 10, the 1 st transparent adhesive layer 95 having a larger area than the substrate 11 of the wiring substrate 10, and the 2 nd transparent adhesive layer 96 having a larger area than the substrate 11 constitute the laminated body 70 for the image display device. In the present embodiment, there is also provided such a laminate 70 for an image display device. As described above, the image display device laminate 70 forms the image display device 60 together with the display device 61. The image display device laminate 70 may be mounted on a frame (not shown) and assembled on a head mounted display (smart glasses).

Referring again to fig. 2, cover glass (front protection plate) 75 is disposed directly or indirectly on 1 st transparent adhesive layer 95. The cover glass 75 is a glass member that transmits light. Cover glass 75 may be plate-shaped and rectangular in plan view. The thickness of cover glass 75 may be, for example, 200 μm or more and 1000 μm or less, and preferably 300 μm or more and 700 μm or less. The length of cover glass 75 in the longitudinal direction (Y direction) may be, for example, 20mm or more and 500mm or less, preferably 100mm or more and 200mm or less, and the length of cover glass 75 in the short direction (X direction) may be 20mm or more and 500mm or less, preferably 50mm or more and 100mm or less.

As shown in fig. 1, the image display device 60 has a substantially rectangular shape as a whole in plan view, and has a long side direction parallel to the Y direction and a short side direction parallel to the X direction. The length L ₄ of the image display device 60 in the long side direction (Y direction) may be selected in a range of, for example, 20mm to 500mm, preferably 100mm to 200mm, and the length L ₅ of the image display device 60 in the short side direction (X direction) may be selected in a range of, for example, 20mm to 500mm, preferably 50mm to 100 mm. The corners of the image display device 60 may be rounded.

[ Structure of wiring substrate ]

Next, a structure of the wiring board will be described with reference to fig. 3 to 6. Fig. 3 to 6 are diagrams showing the wiring board according to the present embodiment.

As shown in fig. 3, the wiring board 10 according to the present embodiment is used in the image display device 60 (see fig. 1 and 2) described above, and is disposed between the 1 st transparent adhesive layer 95 and the 2 nd transparent adhesive layer 96 on the light emitting surface 64 side of the display device 61. The wiring board 10 includes: a substrate 11 having transparency; a mesh wiring layer 20 arranged on the substrate 11; a power supply unit 40 electrically connected to the mesh wiring layer 20; and a protective layer 17 disposed on the substrate 11 and covering the mesh wiring layer 20 and the power supply portion 40. Further, a power supply unit 40 is electrically connected to the mesh wiring layer 20.

The substrate 11 has a substantially rectangular shape in plan view, and has a long side direction parallel to the Y direction and a short side direction parallel to the X direction. The substrate 11 has transparency and is substantially flat plate-like, and the thickness thereof is substantially uniform as a whole. The length L ₁ of the substrate 11 in the longitudinal direction (Y direction) may be selected, for example, from 2mm to 300mm, from 10mm to 200mm, or from 100mm to 200 mm. The length L ₂ of the substrate 11 in the short side direction (X direction) may be selected, for example, from 2mm to 300mm, from 3mm to 100mm, or from 50mm to 100 mm. The corners of the substrate 11 may be rounded.

The material of the substrate 11 may be any material having transparency in the visible light range and electrical insulation. In the present embodiment, the material of the substrate 11 is polyethylene terephthalate, but is not limited thereto. As a material of the substrate 11, for example, an organic insulating material such as a polyester resin such as polyethylene terephthalate, an acrylic resin such as polymethyl methacrylate, a polycarbonate resin, a polyimide resin, a polyolefin resin such as a cycloolefin polymer, a cellulose resin such as triacetyl cellulose, a fluororesin material such as PTFE or PFA is preferably used. Alternatively, as a material of the substrate 11, an organic insulating material such as a cycloolefin polymer (for example, ZF-16 manufactured by ZEON corporation, japan) or a polynorbornene polymer (manufactured by Sumitomo electric wood Co., ltd.) may be used. The material of the substrate 11 may be appropriately selected from glass, ceramic, and the like according to the application. Although the substrate 11 is shown as a single layer, the present invention is not limited to this, and a plurality of substrates or layers may be stacked. The substrate 11 may be film-shaped or plate-shaped.

The dielectric loss tangent of the substrate 11 is preferably 0.002 or less. By setting the dielectric loss tangent of the substrate 11 to the above range, it is possible to reduce the loss of gain (sensitivity) associated with transmission and reception of electromagnetic waves, particularly when electromagnetic waves (for example, millimeter waves) transmitted and received by the mesh wiring layer 20 are high frequency.

The relative dielectric constant of the substrate 11 is preferably 2 or more and 10 or less. By setting the relative dielectric constant of the substrate 11 to 2 or more, the choice of materials for the substrate 11 can be increased. Further, by setting the relative dielectric constant of the substrate 11 to 10 or less, loss of gain (sensitivity) associated with transmission and reception of electromagnetic waves can be reduced. That is, when the relative dielectric constant of the substrate 11 increases, the influence of the thickness of the substrate 11 on the propagation of electromagnetic waves increases. In addition, when the propagation of electromagnetic waves is adversely affected, the dielectric loss tangent of the substrate 11 may be increased, and the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves may be increased. In contrast, by setting the relative dielectric constant of the substrate 11 to 10 or less, the influence of the thickness of the substrate 11 on the propagation of electromagnetic waves can be reduced. Therefore, the loss of gain (sensitivity) associated with transmission and reception of electromagnetic waves can be reduced. In particular, when the electromagnetic wave (for example, millimeter wave) transmitted and received by the mesh wiring layer 20 is high frequency, the loss of gain (sensitivity) associated with the transmission and reception of the electromagnetic wave can be reduced.

The dielectric loss tangent and the relative permittivity of the substrate 11 can be measured according to IEC 62562. Specifically, first, the substrate 11 on which the mesh wiring layer 20 is not formed is cut out to prepare a test piece. Regarding the dimensions of the test pieces, the width was 10mm to 20mm and the length was 50mm to 100mm. Next, the dielectric loss tangent or relative permittivity is measured according to IEC 62562.

In addition, the substrate 11 has transparency. In the present specification, "transparent" means that the transmittance of visible light (light having a wavelength of 400nm or more and 700nm or less) is 85% or more. The transmittance of the visible light (light having a wavelength of 400nm or more and 700nm or less) of the substrate 11 may be 85% or more, preferably 90% or more. The upper limit of the transmittance of the visible light of the substrate 11 is not particularly limited, and may be, for example, 100% or less. By setting the transmittance of the visible light of the substrate 11 to the above range, the transparency of the wiring substrate 10 can be improved, and the display device 61 of the image display device 60 can be easily seen. The visible light is light having a wavelength of 400nm to 700 nm. The transmittance of visible light being 85% or more means that: when absorbance of the substrate 11 is measured using a known spectrophotometer (for example, a spectrometer manufactured by Nippon Specification Co., ltd.: V-670), the transmittance is 85% or more in a full wavelength region of 400nm to 700 nm.

In the present embodiment, the mesh wiring layer 20 is constituted by an antenna pattern having a function as an antenna. In fig. 3, the mesh wiring layer 20 is formed one on the substrate 11. As shown in fig. 3, the mesh wiring layer 20 may be present only in a partial region on the substrate 11, not in the entire surface of the substrate 11. The mesh wiring layer 20 corresponds to a predetermined frequency band. That is, the length (length in the Y direction) L _a of the mesh wiring layer 20 is a length corresponding to a specific frequency band. The lower the corresponding frequency band is, the longer the length L _a of the mesh wiring layer 20 is. The mesh wiring layer 20 may correspond to any of an antenna for telephone, an antenna for WiFi, an antenna for 3G, an antenna for 4G, an antenna for 5G, an antenna for LTE, an antenna for Bluetooth (registered trademark), an antenna for NFC, an antenna for millimeter wave, and the like. Further, a plurality of mesh wiring layers 20 may be formed on the substrate 11. In this case, the lengths of the plurality of mesh wiring layers 20 may be different from each other, and may correspond to different frequency bands. Alternatively, when the wiring board 10 does not have a radio wave transmitting/receiving function, each mesh wiring layer 20 may have a function such as hovering (a function that a user can operate without directly touching the display), fingerprint authentication, a heater, or noise cut-off (shielding), for example.

The mesh wiring layer 20 has a base end side portion (transmission portion) 20a on the power feeding portion 40 side, and a distal end side portion (transmission/reception portion) 20b connected to the base end side portion 20 a. The base end side portion 20a and the tip end side portion 20b each have a substantially rectangular shape in plan view. In this case, the length (Y-direction distance) of the distal portion 20b is longer than the length (Y-direction distance) of the proximal portion 20a, and the width (X-direction distance) of the distal portion 20b is wider than the width (X-direction distance) of the proximal portion 20 a.

The grid wiring layer 20 has a long side direction parallel to the Y direction and a short side direction parallel to the X direction. The length L _a of the mesh wiring layer 20 in the longitudinal direction (Y direction) can be selected, for example, in a range of 2mm or more and 100mm or less, or in a range of 3mm or more and 100mm or less, and the width W _a of the mesh wiring layer 20 (end side portion 20 b) in the short side direction (X direction) can be selected, for example, in a range of 1mm or more and 10mm or less. In particular, when the mesh wiring layer 20 is an antenna for millimeter waves, the length L _a of the mesh wiring layer 20 can be selected in a range of 1mm to 10mm, more preferably in a range of 1.5mm to 5 mm. In fig. 5, the mesh wiring layer 20 is shown in a shape functioning as a monopole antenna, but the shape is not limited to this, and may be a dipole antenna, a loop antenna, a slot antenna, a microstrip antenna, a patch antenna, or the like.

The metal lines of the mesh wiring layer 20 are formed in a lattice shape or a mesh shape, respectively, and have a repeating pattern in the X direction and the Y direction. That is, the mesh wiring layer 20 has a pattern shape composed of a portion (2 nd direction wiring 22) extending in the X direction and a portion (1 st direction wiring 21) extending in the Y direction.

As shown in fig. 4, the mesh wiring layer 20 includes a plurality of 1 st-direction wirings (antenna wirings) 21 having a function as antennas, and a plurality of 2 nd-direction wirings (antenna connection wirings) 22 connecting the plurality of 1 st-direction wirings 21. Specifically, the plurality of 1 st-direction wirings 21 and the plurality of 2 nd-direction wirings 22 are integrally formed to have a lattice shape or a mesh shape. Each 1 st-direction wiring 21 extends in a direction (longitudinal direction, Y-direction) corresponding to the frequency band of the antenna, and each 2 nd-direction wiring 22 extends in a direction (width direction, X-direction) orthogonal to the 1 st-direction wiring 21. The 1 st-direction wiring 21 mainly functions as an antenna by having a length L _a (the length of the mesh wiring layer 20 described above, see fig. 3) corresponding to a predetermined frequency band. On the other hand, the 2 nd-direction wiring 22 serves to suppress disconnection of the 1 st-direction wiring 21 or occurrence of a defect that the 1 st-direction wiring 21 is not electrically connected to the power supply unit 40 by connecting the 1 st-direction wirings 21 to each other.

In the mesh wiring layer 20, a plurality of openings 23 are formed by being surrounded by the 1 st-direction wirings 21 adjacent to each other and the 2 nd-direction wirings 22 adjacent to each other. The 1 st-direction wiring 21 and the 2 nd-direction wiring 22 are arranged at equal intervals. That is, the plurality of 1 st-direction wirings 21 are arranged at equal intervals, and the pitch P ₁ thereof may be, for example, in a range of 0.01mm to 1 mm. The plurality of 2 nd-direction wirings 22 are arranged at equal intervals, and the pitch P ₂ may be, for example, in the range of 0.01mm to 1 mm. By disposing the 1 st-direction wirings 21 and the 2 nd-direction wirings 22 at equal intervals in this way, the size of the opening 23 in the mesh wiring layer 20 is not changed, and the mesh wiring layer 20 can be made difficult to be seen by the naked eye. The pitch P ₁ of the 1 st-direction wiring 21 is equal to the pitch P ₂ of the 2 nd-direction wiring 22. Accordingly, each opening 23 has a substantially square shape in plan view, and the transparent substrate 11 is exposed from each opening 23. Therefore, by enlarging the area of each opening 23, the transparency of the entire wiring board 10 can be improved. The length L ₃ of one side of each opening 23 may be, for example, in the range of 0.01mm to 1 mm. The 1 st-direction wirings 21 and the 2 nd-direction wirings 22 are orthogonal to each other, but the present invention is not limited to this, and may intersect each other at an acute angle or an obtuse angle. The shape of the opening 23 is preferably the same shape and the same size over the entire surface, but may be varied depending on the location or the like, and thus may be uneven over the entire surface.

As shown in fig. 5, each 1 st-direction wiring 21 has a substantially rectangular or substantially square cross section (X-direction cross section) perpendicular to the longitudinal direction thereof. In this case, the cross-sectional shape of the 1 st-direction wiring 21 is substantially uniform along the longitudinal direction (Y-direction) of the 1 st-direction wiring 21. As shown in fig. 6, each of the 2 nd-direction wirings 22 has a cross section perpendicular to the longitudinal direction (Y-direction cross section) that is substantially rectangular or substantially square, and is substantially identical to the cross section of the 1 st-direction wiring 21 (X-direction cross section). In this case, the cross-sectional shape of the 2 nd-direction wiring 22 is substantially uniform along the longitudinal direction (X-direction) of the 2 nd-direction wiring 22. The cross-sectional shapes of the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 need not be substantially rectangular or substantially square, and may be, for example, a substantially trapezoidal shape in which the front side (Z-direction positive side) is narrower than the rear side (Z-direction negative side), or a shape in which the side surfaces on both sides in the longitudinal direction are curved.

In the present embodiment, the line width W ₁ (length in the X direction, see fig. 5) of the 1 st-direction wiring 21 and the line width W ₂ (length in the Y direction, see fig. 6) of the 2 nd-direction wiring 22 are not particularly limited, and may be appropriately selected according to the application. For example, the line width W ₁ of the 1 st direction wiring 21 can be selected in the range of 0.1 μm or more and 5.0 μm or less, and is preferably 0.2 μm or more and 2.0 μm or less. The line width W ₂ of the 2 nd-direction wiring 22 can be selected in the range of 0.1 μm or more and 5.0 μm or less, and is preferably 0.2 μm or more and 2.0 μm or less. The height H ₁ (length in the Z direction, see fig. 5) of the 1 st-direction wiring 21 and the height H ₂ (length in the Z direction, see fig. 6) of the 2 nd-direction wiring 22 are not particularly limited, and can be appropriately selected according to the application. The height H ₁ of the 1 st-direction wiring 21 and the height H ₂ of the 2 nd-direction wiring 22 can be selected in a range of, for example, 0.1 μm or more and 5.0 μm or less, and preferably 0.2 μm or more and 2.0 μm or less.

The material of the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 may be any metal material having conductivity. In the present embodiment, the material of the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 is copper, but is not limited thereto. As a material of the 1 st-direction wiring 21 and the 2 nd-direction wiring 22, for example, a metal material (including an alloy thereof) such as gold, silver, copper, platinum, tin, aluminum, iron, nickel, or the like can be used. The 1 st-direction wiring 21 and the 2 nd-direction wiring 22 may be plated layers formed by a plating method.

The aperture ratio At of the entire mesh wiring layer 20 may be, for example, in a range of 87% or more and less than 100%. By setting the aperture ratio At of the entire mesh wiring layer 20 to this range, the conductivity and transparency of the wiring substrate 10 can be ensured. The aperture ratio is a ratio (%) of the area of the aperture region (the region where the substrate 11 is exposed without the metal portion such as the 1 st-direction wiring 21 or the 2 nd-direction wiring 22) to the unit area of a predetermined region (for example, the entire region of the mesh wiring layer 20).

Referring again to fig. 3 and 4, the power supply portion 40 is electrically connected to the mesh wiring layer 20. The power supply portion 40 is formed of a substantially rectangular conductive thin plate-like member. The long side direction of the power supply portion 40 is parallel to the X direction, and the short side direction of the power supply portion 40 is parallel to the Y direction. The power supply portion 40 is disposed at the longitudinal end (Y-direction negative end) of the substrate 11. For example, a metal material (including an alloy thereof) such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel is used as the material of the power supply portion 40. The power supply unit 40 may be a plate-like member having no opening, unlike the mesh wiring layer 20. When the module 80A including the wiring board 10 is assembled in the image display device 60 (see fig. 1 and 2), the power supply unit 40 is electrically connected to the communication module 63 of the image display device 60 via the power supply line 85. The power supply unit 40 is provided on the 1 st surface 11a of the substrate 11, but the present invention is not limited thereto, and a part or all of the power supply unit 40 may be located outside the peripheral edge of the substrate 11. Further, the power supply unit 40 may be formed flexibly, whereby the power supply unit 40 may be wound around the side surface or the rear surface of the image display device 60 and may be electrically connected to the side surface or the rear surface.

As shown in fig. 4, on the Y-direction positive side, the plurality of 1 st-direction wirings 21 are electrically connected to the power supply portion 40. In this case, the power supply portion 40 is integrally formed with the mesh wiring layer 20. The thickness T ₅ (length in the Z direction, see fig. 6) of the power feeding portion 40 can be selected to be equal to the height H ₁ (see fig. 5) of the 1 st-direction wiring 21 and the height H ₂ (see fig. 6) of the 2 nd-direction wiring 22, for example, in the range of 0.1 μm to 5.0 μm.

As shown in fig. 5 and 6, a protective layer 17 is formed on the 1 st surface 11a of the substrate 11 so as to cover the mesh wiring layer 20 and the power supply portion 40. The protective layer 17 is a layer for protecting the mesh wiring layer 20 and the power supply unit 40. As shown in fig. 3, 4, and 6, the protective layer 17 covers only a part of the power supply portion 40. That is, a region not covered by the protective layer 17 is formed in the power supply portion 40. Specifically, the protective layer 17 covers the entire region of the mesh wiring layer 20 and a partial region on the Y-direction positive side in the power supply section 40. Further, a part of the region on the negative side in the Y direction in the power feeding section 40 is not covered with the protective layer 17. In other words, the wiring substrate 10 is formed with the protected region 10a where the 1 st surface 11a is covered with the protective layer 17 and the unprotected region 10b where the 1 st surface 11a is not covered with the protective layer 17.

The thickness T ₆ (length in the Z direction, see fig. 6) of the protective layer 17 may be 4.0 μm or more and 8.0 μm or less. By setting the thickness T ₆ of the protective layer 17 to 4.0 μm or more, the scratch resistance and weather resistance of the protective layer 17 can be improved. Further, by setting the thickness T ₆ of the protective layer 17 to 8.0 μm or less, the thickness T ₆ of the protective layer 17 does not become excessively thick, and the thickness of the entire image display device 60 can be reduced. In the present embodiment, the thickness T ₆ of the protective layer 17 is a Z-direction distance from the front surface of the power supply unit 40 to the front surface of the protective layer 17.

The dielectric loss tangent of the protective layer 17 is preferably 0.005 or less. This effectively suppresses the influence of the protective layer 17 on the transmission and reception of radio waves in the mesh wiring layer 20. Therefore, the antenna performance degradation can be suppressed. In addition, the dielectric loss tangent of the protective layer 17 can be measured by the same method as the method of measuring the relative dielectric constant of the substrate 11 and according to IEC 62562. At this time, the dielectric loss tangent of the protective layer 17 was measured in a state where the protective layer 17 was peeled off from the substrate 11.

As a material of the protective layer 17, an acrylic resin such as polymethyl (meth) acrylate or polyethyl (meth) acrylate, a modified resin thereof, a copolymer thereof, a polyethylene resin such as polyester resin, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal or polyvinyl butyral, a copolymer thereof, a polyurethane resin, an epoxy resin, a polyamide resin, a colorless transparent insulating resin such as chlorinated polyolefin, or the like can be used.

The protective layer 17 particularly preferably contains an acrylic resin or a polyester resin. This can further improve adhesion between the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 and adhesion between the substrate 11. Therefore, the scratch resistance and weather resistance of the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 can be improved. Further, the invisibility can be maintained and the antenna performance can be maintained.

Furthermore, the protective layer 17 preferably comprises silicon dioxide. Silica may also be added to the resin as a powder. Alternatively, the film may be formed substantially free of resin by vapor deposition, sputtering, CVD, or the like. Thereby, the smoothness of the surface of the protective layer 17 and the antireflection property of the protective layer 17 can be improved.

[ Structure of Module ]

Next, the structure of the module will be described with reference to fig. 7 to 9. Fig. 7 to 9 are diagrams showing the modules of the present embodiment.

As shown in fig. 7, the module 80A includes the wiring board 10 and the power supply line 85 electrically connected to the power supply unit 40 via the anisotropic conductive film 85 c. As described above, when the module 80A is assembled in the image display device 60 having the display device 61, the power supply portion 40 of the wiring substrate 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply line 85.

The power feeding line 85 has a substantially rectangular shape in plan view. In this case, the width (X-direction distance) of the feeder line 85 may be substantially the same as the width (X-direction distance) of the feeder unit 40. The area of the power feeding line 85 may be substantially the same as the area of the power feeding unit 40. This makes it possible to bring the resistance of the power feeding line 85 and the resistance of the power feeding unit 40 close to each other. Therefore, impedance matching can be easily achieved between the power feeding line 85 and the power feeding portion 40, and a decrease in electrical connectivity between the power feeding line 85 and the power feeding portion 40 can be suppressed.

Here, as shown in fig. 8 (a), a through hole 41 may be formed in the power supply portion 40. In the illustrated example, a plurality (6) of through holes 41 are formed in the power supply portion 40. That is, in fig. 8 (a), 3 through holes 41 are provided along the X direction, and two rows of 3 through holes 41 are provided along the Y direction. The number of the through holes 41 is not limited to this. Thus, by forming the through-hole 41 in the power feeding portion 40, the area of the power feeding portion 40 (the area of the region where the metal portion exists) can be easily adjusted.

As shown in fig. 8 (b), the end of the power supply line 85 on the power supply portion 40 side may be formed in a comb-tooth shape. That is, the power supply line 85 may include: a main body 88 having a substantially rectangular shape in plan view; a plurality of (4) protruding portions 89 protruding from the main body portion 88 toward the power feeding portion 40 side (Y-direction positive side). This makes it possible to easily adjust the area of the feeder line 85. Therefore, the area of the power feeding line 85 can be made substantially the same as the area of the power feeding portion 40. The number of the protruding portions 89 may be 1 or more and 3 or less, or may be 5 or more.

Referring again to fig. 7, the power supply line 85 is pressure-bonded to the wiring substrate 10 via an Anisotropic Conductive Film (ACF) 85 c. The anisotropic conductive film 85c includes a resin material such as an acrylic resin or an epoxy resin, and conductive particles 85d (see fig. 9). The anisotropic conductive film 85c covers the region of the power supply portion 40 not covered by the protective layer 17. This can suppress corrosion of the power supply unit 40. In the present embodiment, the anisotropic conductive film 85c covers the entire area of the power supply portion 40, which is not covered with the protective layer 17.

As shown in fig. 9, a part of the anisotropic conductive film 85c is disposed on the protective layer 17. Thus, the anisotropic conductive film 85c can reliably cover the region of the power supply portion 40 that is not covered by the protective layer 17, and corrosion and the like of the power supply portion 40 can be more effectively suppressed.

The anisotropic conductive film 85c is disposed so as to face the power supply unit 40. Further, a part of the conductive particles 85d is in contact with the power supply portion 40. Thereby, the power supply line 85 is electrically connected to the power supply unit 40. In addition, when the feeder line 85 is pressed against the wiring substrate 10, a part of the anisotropic conductive film 85c may be melted around the feeder line 85. The particle diameter of the conductive particles 85d may be, for example, about 7 μm.

The power supply line 85 may be, for example, a flexible printed board. As shown in fig. 9, the power supply line 85 includes a base material 85a and a metal wiring portion 85b laminated on the base material 85 a. The base material 85a may include a resin material such as polyimide or a liquid crystal polymer. The metal wiring portion 85b may include copper, for example. The metal wiring portion 85b is electrically connected to the power supply portion 40 via the conductive particles 85 d.

[ Method for producing wiring substrate, method for producing module, and method for producing laminate for image display device ]

Next, a method for manufacturing the wiring board 10, a method for manufacturing the module 80A, and a method for manufacturing the laminate 70 for an image display device according to the present embodiment will be described with reference to fig. 10 (a) to (f), 11 (a) to (c), and 12 (a) to (c). Fig. 10 (a) - (f) are cross-sectional views showing a method of manufacturing the wiring substrate 10 of the present embodiment. Fig. 11 (a) - (c) are cross-sectional views showing a method of manufacturing the module 80A of the present embodiment. Fig. 12 (a) - (c) are cross-sectional views illustrating a method of manufacturing the laminated body 70 for an image display device according to the present embodiment.

First, a method for manufacturing a wiring board according to the present embodiment will be described with reference to fig. 10 (a) to (f).

First, a substrate 11 including a 1 st surface 11a and a2 nd surface 11b located on the opposite side of the 1 st surface 11a is prepared. The substrate 11 has transparency.

Next, a mesh wiring layer 20 and a power supply portion 40 electrically connected to the mesh wiring layer 20 are formed on the 1 st surface 11a of the substrate 11.

At this time, first, as shown in fig. 10 (a), a metal foil 51 is laminated on substantially the entire area of the 1 st surface 11a of the substrate 11. In the present embodiment, the thickness of the metal foil 51 may be 0.1 μm or more and 5.0 μm or less. In the present embodiment, the metal foil 51 may contain copper.

Next, as shown in fig. 10 (b), a photocurable insulating resist 52 is supplied to substantially the entire area of the front surface of the metal foil 51. Examples of the photocurable insulating resist 52 include organic resins such as acrylic resins and epoxy resins.

Next, as shown in fig. 10 (c), an insulating layer 54 is formed by photolithography. In this case, the photo-curable insulating resist 52 is patterned by photolithography to form an insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed so that the metal foil 51 corresponding to the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 is exposed.

Next, as shown in fig. 10 (d), the metal foil 51 on the 1 st surface 11a of the substrate 11 at the portion not covered with the insulating layer 54 is removed. At this time, the metal foil 51 is etched so that the 1 st surface 11a of the substrate 11 is exposed by performing wet treatment using a strong acid such as ferric chloride, cupric chloride, sulfuric acid, or hydrochloric acid, a persulfate, hydrogen peroxide, an aqueous solution of these, or a combination of these.

Next, as shown in fig. 10 (e), the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by performing wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkali solution, or dry treatment using oxygen plasma.

Thus, the substrate 11 and the mesh wiring layer 20 provided on the 1 st surface 11a of the substrate 11 are obtained. In this case, the mesh wiring layer 20 includes a 1 st direction wiring 21 and a2 nd direction wiring 22. In this case, the power supply portion 40 may be formed of a part of the metal foil. Alternatively, a flat-plate-shaped power supply unit 40 may be separately prepared, and the power supply unit 40 may be electrically connected to the grid wiring layer 20.

Then, as shown in fig. 10 (f), the protective layer 17 is formed on the 1 st surface 11a of the substrate 11 so as to cover the mesh wiring layer 20 and the power supply portion 40. The protective layer 17 is formed so as to cover only a part of the power supply portion 40 (see fig. 9). As a method for forming the protective layer 17, roll coating, gravure reverse coating, micro gravure coating, slot die coating, doctor blade coating, inkjet coating, dispenser coating, kiss coating, spray coating, screen printing, offset printing, flexography printing can be used.

Thus, the wiring board 10 having the substrate 11, the mesh wiring layer 20 disposed on the 1 st surface 11a of the substrate 11, the power feeding portion 40 electrically connected to the mesh wiring layer 20, and the protective layer 17 disposed on the 1 st surface 11a of the substrate 11 and covering the mesh wiring layer 20 and the power feeding portion 40 can be obtained.

Next, a method for manufacturing the module according to the present embodiment will be described with reference to fig. 11 (a) to (c).

First, as shown in fig. 11 (a), a wiring substrate 10 is prepared. At this time, the wiring board 10 is manufactured by, for example, the methods shown in (a) to (f) of fig. 10.

Next, the power feeding line 85 and the power feeding portion 40 are electrically connected via an anisotropic conductive film 85c including conductive particles 85 d. At this time, first, as shown in fig. 11 (b), an anisotropic conductive film 85c is disposed on the wiring substrate 10. At this time, the anisotropic conductive film 85c is disposed so as to face the power supply unit 40.

Next, as shown in fig. 11 (c), the power feeding line 85 is pressure-bonded to the wiring board 10. At this time, the feeder line 85 is pressure-bonded to the wiring substrate 10 by applying pressure and heat to the feeder line 85. Further, a part of the conductive particles 85d is in contact with the power supply portion 40. In this way, the power supply line 85 is electrically connected to the power supply unit 40. When the feeder wire 85 is pressed against the wiring substrate 10, the feeder wire 85 is pressed against the wiring substrate 10 so that the anisotropic conductive film 85c covers the region of the power supply portion 40 that is not covered by the protective layer 17. Further, a part of the anisotropic conductive film 85c is melted around the power feeding line 85, whereby a part of the anisotropic conductive film 85c is disposed on the protective layer 17.

Thus, a module 80A including the wiring board 10 and the power supply line 85 electrically connected to the power supply portion 40 via the anisotropic conductive film 85c including the conductive particles 85d is obtained.

Next, a method for manufacturing the laminated body 70 for an image display device according to the present embodiment will be described with reference to fig. 12 (a) to (c).

Next, the 1 st transparent adhesive layer 95, the wiring board 10 of the module 80A, and the 2 nd transparent adhesive layer 96 are laminated on each other. At this time, first, as shown in fig. 12a, for example, an OCA sheet 90a is prepared, and the OCA sheet 90a includes a release film 91 of polyethylene terephthalate (PET) and an OCA layer 92 (1 st transparent adhesive layer 95 or 2 nd transparent adhesive layer 96) laminated on the release film 91. In this case, the OCA layer 92 may be a layer obtained by applying a liquid curable adhesive layer composition containing a polymerizable compound to the release film 91 and curing the composition using, for example, ultraviolet (UV) light or the like. The curable adhesive layer composition contains a polar group-containing monomer.

Next, as shown in fig. 12 (b), the OCA layer 92 of the OCA sheet 90a is bonded to the wiring substrate 10. Thus, the wiring board 10 is sandwiched by the OCA layer 92.

Then, as shown in fig. 12c, the release film 91 is peeled off from the OCA layer 92 of the OCA sheet 90a attached to the wiring substrate 10, whereby the 1 st transparent adhesive layer 95 (OCA layer 92), the wiring substrate 10, and the 2 nd transparent adhesive layer 96 (OCA layer 92) are laminated to each other.

Thus, the laminate 70 for an image display device is obtained, which includes: a1 st transparent adhesive layer 95; a2 nd transparent adhesive layer 96; and a module 80A including the wiring board 10.

Then, the display device 61 is laminated on the image display device laminate 70, whereby the image display device 60 including the image display device laminate 70 and the display device 61 laminated on the image display device laminate 70 is obtained.

[ Action of the present embodiment ]

Next, the operation of the present embodiment configured in such a manner will be described.

As shown in fig. 1 and 2, the wiring board 10 is assembled to an image display device 60 having a display device 61. At this time, the wiring board 10 is disposed on the display device 61. The mesh wiring layer 20 of the wiring substrate 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40 and the power supply line 85. In this way, radio waves of a predetermined frequency can be transmitted and received through the mesh wiring layer 20, and communication can be performed using the image display device 60.

According to the present embodiment, the protective layer 17 covers only a part of the power supply portion 40, and the anisotropic conductive film 85c covers the region of the power supply portion 40 that is not covered by the protective layer 17. This can suppress the decrease in electrical connectivity between the power feeding line 85 and the power feeding portion 40, and suppress corrosion of the power feeding portion 40, and the like.

Further, according to the present embodiment, the wiring substrate 10 includes the substrate 11 and the mesh wiring layer 20 disposed on the substrate 11. In addition, the substrate 11 has transparency. Further, the mesh wiring layer 20 has a mesh-like pattern formed of a conductor portion, which is a formation portion of the opaque conductor layer, and a plurality of openings. Therefore, the transparency of the wiring substrate 10 is ensured. Thus, when the wiring board 10 is disposed on the display device 61, the display device 61 can be seen from the opening 23 of the mesh wiring layer 20, and visibility of the display device 61 is not impaired.

Further, according to the present embodiment, a part of the anisotropic conductive film 85c is disposed on the protective layer 17. Thus, the anisotropic conductive film 85c can reliably cover the region of the power supply portion 40 that is not covered by the protective layer 17, and corrosion and the like of the power supply portion 40 can be more effectively suppressed.

Modification example

Next, a modification of the module will be described.

(Modification 1)

Fig. 13 shows a modification 1 of the module. The modified example shown in fig. 13 is different in that the wiring board 10 further has a dark layer 18 provided on the mesh wiring layer 20, and other structures are substantially the same as those shown in fig. 1 to 12 described above. In fig. 13, the same reference numerals are given to the same portions as those in fig. 1 to 12, and detailed description thereof is omitted.

In a module 80A shown in fig. 13, a dark layer (blackened layer) 18 is formed on a mesh wiring layer 20 of a wiring substrate 10. The dark color layer 18 is a layer for making the mesh wiring layer 20 hard to be seen by the naked eye by suppressing reflection of visible light caused by the mesh wiring layer 20. As shown in fig. 13, the dark layer 18 covers the entire area of the mesh wiring layer 20 and the entire area of the power supply section 40. In addition, the dark layer 18 is covered with the protective layer 17.

The dark layer 18 may be, for example, a layer having a lower reflectance of visible light than the protective layer 17, or may be, for example, a dark layer such as black. The dark layer 18 may be a layer whose surface is roughened.

For example, the darkening layer 18 may be formed by darkening (blackening) a part of the metal material constituting the mesh wiring layer 20 or the power feeding portion 40, thereby forming the darkening layer 18 from a part of the metal material constituting the mesh wiring layer 20 or the power feeding portion 40. In this case, the dark layer 18 may be formed as a layer composed of a metal oxide or a metal sulfide. The dark layer 18 may be formed on the front surface of the mesh wiring layer 20 or the power feeding portion 40 as a coating film of a dark material or a plating layer of nickel, chromium, or the like. The dark color layer 18 may be formed by roughening the surface of the mesh wiring layer 20 or the power supply portion 40.

According to the present modification, the wiring substrate 10 further has a dark layer 18 provided on the mesh wiring layer 20. This suppresses reflection of visible light by the mesh wiring layer 20, and makes the mesh wiring layer 20 more difficult to be seen by the naked eye.

In the present modification, the protective layer 17 covers only a part of the power supply portion 40, and the anisotropic conductive film 85c (see fig. 9) covers the area of the power supply portion 40 that is not covered by the protective layer 17. This can suppress the decrease in electrical connectivity between the power feeding line 85 and the power feeding portion 40, and suppress corrosion of the power feeding portion 40, and the like. Here, when the dark layer 18 is formed on the power supply portion 40 in order to suppress reflection of visible light by the mesh wiring layer 20, the corrosion resistance of the power supply portion 40 is lowered. In contrast, in the present modification, as described above, corrosion or the like of the power supply portion 40 can be suppressed. Therefore, according to the present modification, the reflection of visible light by the mesh wiring layer 20 can be suppressed while suppressing corrosion or the like of the power supply portion 40.

(Modification 2)

Fig. 14 and 15 show modification 2 of the module. The modification shown in fig. 14 and 15 is different in that the anisotropic conductive film 85c covers only a part of the region of the power supply portion 40 that is not covered by the protective layer 17, and other structures are substantially the same as those shown in fig. 1 to 13 described above. In fig. 14 and 15, the same reference numerals are given to the same parts as those in the embodiment shown in fig. 1 to 13, and detailed description thereof is omitted.

In the module 80A shown in fig. 14, the anisotropic conductive film 85c covers only a part of the region of the power supply portion 40 that is not covered by the protective layer 17. Further, the region of the power supply portion 40 not covered with any one of the protective layer 17 and the anisotropic conductive film 85c is covered with the coating layer 86 containing a material having corrosion resistance. In this case, as a material of the coating layer 86, a metal such as gold, or a resin such as an epoxy resin, an imide resin, or an acrylic resin can be used.

Next, a method for manufacturing the module according to this modification will be described with reference to fig. 15 (a) to (d).

First, as shown in fig. 15 (a), the wiring substrate 10 is prepared. At this time, the wiring board 10 is manufactured by, for example, the methods shown in (a) to (f) of fig. 10.

Next, the feeder wire 85 is pressed against the wiring substrate 10 via the anisotropic conductive film 85c including the conductive particles 85 d. At this time, first, as shown in fig. 15 (b), an anisotropic conductive film 85c is disposed on the wiring substrate 10. At this time, the anisotropic conductive film 85c is disposed so as to face the power supply unit 40.

Next, as shown in fig. 15 (c), the power feeding line 85 is pressure-bonded to the wiring board 10. At this time, the power feeding line 85 is pressure-bonded to the wiring substrate 10 so that the anisotropic conductive film 85c covers only a part of the region of the power feeding portion 40 that is not covered with the protective layer 17.

Next, as shown in fig. 15 (d), a coating layer 86 is formed so as to cover the power supply portion 40 in a region of the power supply portion 40 that is not covered with any one of the protective layer 17 and the anisotropic conductive film 85 c. In this case, the coating layer 86 may be formed by plating, and gold may be used as the metal constituting the coating layer 86.

Thus, a module 80A including the wiring board 10 and the power supply line 85 electrically connected to the power supply unit 40 via the anisotropic conductive film 85c including the conductive particles 85d is obtained.

According to the present modification, the region of the power supply portion 40 not covered with any one of the protective layer 17 and the anisotropic conductive film 85c is covered with the coating layer 86 containing a material having corrosion resistance. In this case, too, the reduction in electrical connectivity between the power supply line 85 and the power supply unit 40 can be suppressed, and corrosion or the like of the power supply unit 40 can be suppressed.

(Modification 3)

Fig. 16 and 17 show modification 3 of the module. The modification shown in fig. 16 and 17 is different in that the conductive particles 85d enter the protective layer 17, and the other configuration is substantially the same as that shown in fig. 1 to 15 described above. In fig. 16 and 17, the same reference numerals are given to the same parts as those in the embodiments shown in fig. 1 to 15, and detailed description thereof is omitted.

In the module 80A shown in fig. 16, the conductive particles 85d enter the protective layer 17. The power supply line 85 is electrically connected to the power supply unit 40 by the conductive particles 85d entering the protective layer 17. That is, when the feeder wire 85 is pressed against the wiring substrate 10, the conductive particles 85d of the anisotropic conductive film 85c break through the front surface of the protective layer 17 and enter the protective layer 17. Further, a part of the conductive particles 85d is in contact with the power supply portion 40. By causing the conductive particles 85d to enter the protective layer 17 in this way, the power supply line 85 is electrically connected to the power supply unit 40.

In this modification, the pencil hardness of the front surface of the protective layer 17 is preferably B or more and 2H or less. By setting the pencil hardness of the front surface of the protective layer 17 to B or more, scratch resistance and weather resistance of the protective layer 17 can be improved. In addition, by setting the pencil hardness of the front surface of the protective layer 17 to 2H or less, the conductive particles 85d of the Anisotropic Conductive Film (ACF) 85c can easily enter the protective layer 17, and the electrical connectivity between the power supply portion 40 and the power supply line 85 can be improved. The pencil hardness may be according to JISK 5600-5-4:1999, measured by a pencil hardness test.

As described above, the thickness T ₆ (see fig. 6) of the protective layer 17 may be 4.0 μm or more and 8.0 μm or less. By setting the thickness T ₆ of the protective layer 17 to 8.0 μm or less, when the conductive particles 85d of the Anisotropic Conductive Film (ACF) 85c enter the protective layer 17, the conductive particles 85d can easily contact the power supply portion 40. Therefore, the electrical connection between the power supply unit 40 and the power supply line 85 can be ensured.

Next, a method for manufacturing the module according to this modification will be described with reference to fig. 17 (a) to (c).

First, as shown in fig. 17 (a), a wiring substrate 10 is prepared. At this time, the wiring board 10 is manufactured by, for example, the methods shown in (a) to (f) of fig. 10. Here, in the present modification, the protective layer 17 may be formed so as to cover the entire area of the power supply portion 40 (see fig. 17 (a)).

Next, the feeder wire 85 is pressed against the wiring substrate 10 via the anisotropic conductive film 85c including the conductive particles 85 d. At this time, first, as shown in fig. 17 (b), an anisotropic conductive film 85c is disposed on the wiring substrate 10. At this time, the anisotropic conductive film 85c is disposed so as to face the power supply unit 40.

Next, as shown in fig. 17 (c), the power feeding line 85 is pressure-bonded to the wiring board 10. At this time, the conductive particles 85d of the anisotropic conductive film 85c break through the front surface of the protective layer 17 and enter the protective layer 17. Further, a part of the conductive particles 85d is in contact with the power supply portion 40. By causing the conductive particles 85d to enter the protective layer 17 in this way, the power supply line 85 is electrically connected to the power supply unit 40.

According to the present modification, the power supply line 85 is electrically connected to the power supply portion 40 by the conductive particles 85d entering the protective layer 17. In this case, too, the reduction in electrical connectivity between the power supply line 85 and the power supply unit 40 can be suppressed, and corrosion or the like of the power supply unit 40 can be suppressed.

Next, a modified example of the wiring board will be described.

(Modification 1)

Fig. 18 and 19 show modification 1 of the wiring board. The modification shown in fig. 18 and 19 is different in that the dummy wiring layer 30 is provided around the mesh wiring layer 20, and other structures are substantially the same as those shown in fig. 1 to 17. In fig. 18 and 19, the same reference numerals are given to the same portions as those in fig. 1 to 17, and detailed description thereof is omitted.

In the wiring substrate 10 shown in fig. 18, a dummy wiring layer 30 is provided along the periphery of the mesh wiring layer 20. The dummy wiring layer 30 does not substantially function as an antenna unlike the mesh wiring layer 20.

As shown in fig. 19, the dummy wiring layer 30 is formed by repetition of the dummy wiring 30a having a predetermined unit pattern shape. That is, the dummy wiring layer 30 includes a plurality of dummy wirings 30a of the same shape, and each of the dummy wirings 30a is electrically independent from the mesh wiring layer 20 (the 1 st-direction wiring 21 and the 2 nd-direction wiring 22). In other words, each dummy wiring 30a is separated from the mesh wiring layer 20 in the horizontal direction. Further, the plurality of dummy wirings 30a are regularly arranged throughout the entire region within the dummy wiring layer 30. The plurality of dummy wirings 30a are separated from each other in the planar direction and are arranged so as to protrude from the substrate 11. That is, each dummy wiring 30a is electrically independent of the mesh wiring layer 20, the power supply portion 40, and other dummy wirings 30 a. Each of the dummy wirings 30a has a substantially L-shape in a plan view.

In this case, the dummy wiring 30a has a shape in which a part of the unit pattern shape of the mesh wiring layer 20 is missing. As a result, it is possible to make it difficult to visually recognize the difference between the mesh wiring layer 20 and the dummy wiring layer 30, and it is possible to make it difficult to see the mesh wiring layer 20 disposed on the substrate 11. The aperture ratio of the dummy wiring layer 30 may be the same as or different from the aperture ratio of the mesh wiring layer 20, but is preferably close to the aperture ratio of the mesh wiring layer 20.

In this way, by disposing the dummy wiring layer 30 electrically independent of the mesh wiring layer 20 around the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be made unclear. As a result, it is difficult to see the mesh wiring layer 20 on the front surface of the image display device 60, and it is difficult for the user of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

(Modification 2)

Fig. 20 and 21 show modification 2 of the wiring board. The modification shown in fig. 20 and 21 is different in that a plurality of dummy wiring layers 30A and 30B having different aperture ratios are provided around the mesh wiring layer 20, and other configurations are substantially the same as those shown in fig. 1 to 19. In fig. 20 and 21, the same reference numerals are given to the same portions as those in fig. 1 to 19, and detailed description thereof is omitted.

In the wiring substrate 10 shown in fig. 20, a plurality of (in this case, 2) dummy wiring layers 30A, 30B (1 st dummy wiring layer 30A and 2 nd dummy wiring layer 30B) having different aperture ratios are provided along the periphery of the mesh wiring layer 20. Specifically, the 1 st dummy wiring layer 30A is arranged along the periphery of the mesh wiring layer 20, and the 2 nd dummy wiring layer 30B is arranged along the periphery of the 1 st dummy wiring layer 30A. The dummy wiring layers 30A and 30B do not substantially function as antennas unlike the mesh wiring layer 20.

As shown in fig. 21, the 1 st dummy wiring layer 30A is formed by repetition of the dummy wirings 30A having a predetermined unit pattern shape. The 2 nd dummy wiring layer 30B is constituted by repetition of the dummy wiring 30a2 having a predetermined unit pattern shape. That is, the dummy wiring layers 30A and 30B include a plurality of dummy wirings 30A1 and 30A2 having the same shape, and the dummy wirings 30A1 and 30A2 are electrically independent of the mesh wiring layer 20. The dummy wirings 30A1 and 30A2 are regularly arranged over the entire regions in the dummy wiring layers 30A and 30B, respectively. The dummy wirings 30a1 and 30a2 are separated from each other in the planar direction and are arranged so as to protrude from the substrate 11. Each of the dummy wirings 30a1 and 30a2 is electrically independent of the mesh wiring layer 20, the power supply portion 40, and the other dummy wirings 30a1 and 30a2, respectively. The dummy wirings 30a1 and 30a2 are each substantially L-shaped in a plan view.

In this case, the dummy wirings 30a1 and 30a2 have a shape in which a part of the unit pattern shape of the mesh wiring layer 20 is missing. Thus, it is possible to make it difficult to visually recognize the difference between the mesh wiring layer 20 and the 1 st dummy wiring layer 30A and the difference between the 1 st dummy wiring layer 30A and the 2 nd dummy wiring layer 30B, and it is possible to make it difficult to see the mesh wiring layer 20 arranged on the substrate 11. The 1 st dummy wiring layer 30A has a larger aperture ratio than the mesh wiring layer 20, and the 1 st dummy wiring layer 30A has a larger aperture ratio than the 2 nd dummy wiring layer 30B.

The area of each dummy wiring 30A1 of the 1 st dummy wiring layer 30A is larger than the area of each dummy wiring 30A2 of the 2 nd dummy wiring layer 30B. In this case, the line width of each dummy wiring 30a1 is the same as the line width of each dummy wiring 30a2, but the present invention is not limited thereto, and the line width of each dummy wiring 30a1 may be thicker than the line width of each dummy wiring 30a 2. In addition, 3 or more dummy wiring layers having different aperture ratios may be provided. In this case, the aperture ratio of each dummy wiring layer preferably increases gradually from a portion close to the mesh wiring layer 20 toward a portion distant from the mesh wiring layer 20.

By disposing the dummy wiring layers 30A and 30B electrically independent of the mesh wiring layer 20 in this way, the outer edge of the mesh wiring layer 20 can be made clearer. As a result, it is difficult to see the mesh wiring layer 20 on the front surface of the image display device 60, and it is difficult for the user of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

(Modification 3)

Fig. 22 shows a 3 rd modification of the wiring board. The planar shape of the mesh wiring layer 20 of the modification shown in fig. 22 is different, and the other structures are substantially the same as those shown in fig. 1 to 21 described above. In fig. 22, the same reference numerals are given to the same parts as those in fig. 1 to 21, and detailed description thereof is omitted.

Fig. 22 is an enlarged plan view of the mesh wiring layer 20 according to a modification. In fig. 22, the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 intersect obliquely (not at right angles), and each opening 23 is formed in a diamond shape in a plan view. Although the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 are not parallel to the X-direction and the Y-direction, either the 1 st-direction wiring 21 or the 2 nd-direction wiring 22 may be parallel to the X-direction or the Y-direction.

(Embodiment 2)

Next, embodiment 2 will be described with reference to fig. 23 to 30. Fig. 23 to 30 are diagrams showing the present embodiment. In fig. 23 to 30, the same reference numerals are given to the same parts as those in embodiment 1 shown in fig. 1 to 22, and detailed description thereof may be omitted.

[ Structure of image display device ]

The configuration of the image display device according to the present embodiment will be described with reference to fig. 23 and 24.

As shown in fig. 23 and 24, the image display device 60 of the present embodiment includes a laminate 70 for an image display device, and a display unit (display) 610 having a display region 61a, which is laminated on the laminate 70 for an image display device. The image display device laminate 70 includes a 3 rd adhesive layer 950, a 4 th adhesive layer 960, and a wiring board 10 located between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. The communication module 63 is disposed on the negative side in the Z direction with respect to the display unit 610. The image display device laminate 70, the display unit 610, and the communication module 63 are housed in the case 62.

The wiring board 10 includes a transparent substrate 11, a metal layer 90, and a protective layer 17. The metal layer 90 is disposed on the substrate 11. The metal layer 90 includes the mesh wiring layer 20 and the power supply portion 40 electrically connected to the mesh wiring layer 20. The protective layer 17 covers a portion of the metal layer 90. That is, a part of the metal layer 90 is not covered by the protective layer 17. In other words, the metal layer 90 includes a portion not covered by the protective layer 17. The protective layer 17 is present in at least a portion of the 1 st region A1, but is not present in the 2 nd region A2. The 1 st area A1 is an area that does not overlap with the display area 61a of the image display device 60. The 2 nd area A2 is an area overlapping with the display area 61a of the image display device 60.

As shown in fig. 24, the image display device 60 has a light emitting surface 64. The wiring board 10 is located on the light emitting surface 64 side (Z direction positive side) with respect to the display portion 610. The communication module 63 is located on the opposite side (negative Z-direction side) of the light emitting surface 64 with respect to the display portion 610.

The display unit 610 is constituted by an organic EL (Electro Luminescence: electroluminescence) display device, for example. The display portion 610 has a display region 61a on the wiring substrate 10 side. The display area 61a is an area corresponding to a screen on which an image or the like is displayed on the front surface of the display unit 610. The display portion 610 may include, for example, a metal layer, a support substrate, a resin substrate, a Thin Film Transistor (TFT), and an organic EL layer, which are not shown. A touch sensor, not shown, may be disposed on the display unit 610. Further, the wiring board 10 is disposed on the display unit 610 with the 3 rd adhesive layer 950 interposed therebetween. The display portion 610 is not limited to the organic EL display device. For example, the display unit 610 may be another display device having a function of emitting light itself, or may be a micro LED display device including a micro LED element (light emitter). The display unit 610 may be a liquid crystal display device including liquid crystal. A cover glass (front protection plate) 75 is disposed on the wiring board 10 through a 4 th adhesive layer 960. A decorative film 74 is disposed between the 4 th adhesive layer 960 and the cover glass 75. The decorative film 74 may define the boundary between the 2 nd region A2 and the 1 st region A1. That is, the inner periphery of the decorative film 74 may be located on the boundary described above. A polarizing plate, not shown, may be disposed between the 4 th adhesive layer 960 and the cover glass 75.

The 3 rd adhesive layer 950 is an adhesive layer that directly or indirectly adheres the display portion 610 to the wiring substrate 10. The 3 rd adhesive layer 950 has optical transparency. The 3 rd adhesive layer 950 has a larger area than the substrate 11 of the wiring substrate 10. The transmittance of visible light of the 3 rd adhesive layer 950 may be 85% or more, preferably 90% or more. The upper limit of the transmittance of visible light of the 3 rd adhesive layer 950 is not particularly limited, and may be, for example, 100% or less. The visible light is light having a wavelength of 400nm to 700 nm. The transmittance of visible light being 85% or more means that: when absorbance of the 3 rd adhesive layer 950 is measured by a known spectrophotometer (for example, a spectrometer made by Nippon Spectrophotometer, V-670), the transmittance is 85% or more in the entire wavelength region of 400nm to 700 nm.

The 3 rd adhesive layer 950 may be an OCA (Optical CLEAR ADHESIVE: optically clear adhesive) layer. The OCA layer is, for example, a layer produced as follows. First, a liquid curable adhesive layer composition containing a polymerizable compound is applied to a release film such as polyethylene terephthalate (PET). Next, the curable adhesive layer composition is cured using, for example, ultraviolet (UV) light or the like, to obtain an OCA sheet. The OCA sheet is bonded to an object, and then the release film is peeled off and removed, whereby the OCA layer is obtained. The material of the 3 rd adhesive layer 950 may be an acrylic resin, a silicone resin, a urethane resin, or the like.

As described above, the wiring board 10 is arranged on the light emitting surface 64 side with respect to the display portion 610. In this case, the wiring substrate 10 is located between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. More specifically, a partial region of the substrate 11 of the wiring substrate 10 is disposed in a partial region between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. In this case, the 3 rd adhesive layer 950, the 4 th adhesive layer 960, the display portion 610, and the cover glass 75 each have a larger area than the substrate 11 of the wiring substrate 10. In this way, by disposing the substrate 11 of the wiring substrate 10 in a partial region of the image display device 60, not the entire surface of the image display device 60, in a plan view, the thickness of the entire image display device 60 can be reduced.

The wiring board 10 includes: a substrate 11 having transparency; a metal layer 90 disposed on the substrate 11; and a protective layer 17 covering a portion of the metal layer 90. The metal layer 90 includes the mesh wiring layer 20 and the power supply portion 40 electrically connected to the mesh wiring layer 20. The power supply unit 40 is electrically connected to the communication module 63. In the 1 st region A1, a part of the wiring board 10 is not disposed between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960, but protrudes outward (negative Y-direction side) from between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. Specifically, the region of the wiring substrate 10 where the power supply portion 40 is provided protrudes outward. This makes it possible to easily electrically connect the power supply unit 40 and the communication module 63. On the other hand, the region of the wiring substrate 10 where the mesh wiring layer 20 is provided is located between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. In addition, a part of the mesh wiring layer 20 may protrude outward. In the 1 st region A1, a part of the wiring board 10 is bent. The details of the wiring board 10 will be described later.

The 4 th adhesive layer 960 is an adhesive layer that directly or indirectly adheres the wiring substrate 10 to the cover glass 75. The 4 th adhesive layer 960 has a larger area than the substrate 11 of the wiring substrate 10. The 4 th adhesive layer 960 has optical transparency similar to the 3 rd adhesive layer 950. The transmittance of visible rays of the 4 th adhesive layer 960 may be 85% or more, preferably 90% or more. The upper limit of the transmittance of visible light of the 4 th adhesive layer 960 is not particularly limited, and may be, for example, 100% or less. The 4 th adhesive layer 960 may be an OCA (Optical CLEAR ADHESIVE: optically clear adhesive) layer. The material of the 4 th adhesive layer 960 may be an acrylic resin, a silicone resin, a urethane resin, or the like. The 4 th adhesive layer 960 may be made of the same material as the 3 rd adhesive layer 950.

In fig. 24, at least one of the thickness T ₁₃ of the 3 rd adhesive layer 950 and the thickness T ₁₄ of the 4 th adhesive layer 960 may be 1.5 times or more, preferably 2.0 times or more, and more preferably 2.5 times or more the thickness T ₁ of the substrate 11. In this way, by making the thickness T ₁₃ of the 3 rd adhesive layer 950 or the thickness T ₁₄ of the 4 th adhesive layer 960 sufficiently thick with respect to the thickness T ₁ of the substrate 11, the 3 rd adhesive layer 950 or the 4 th adhesive layer 960 deforms in the thickness direction in the region overlapping the substrate 11, thereby absorbing the thickness of the substrate 11. This can suppress the occurrence of a step in the 3 rd adhesive layer 950 or the 4 th adhesive layer 960 at the peripheral edge of the substrate 11, and can make it difficult for the observer to see the presence of the substrate 11.

At least one of the thickness T ₁₃ of the 3 rd adhesive layer 950 and the thickness T ₁₄ of the 4 th adhesive layer 960 may be 10 times or less, preferably 5 times or less, the thickness T ₁ of the substrate 11. Accordingly, the thickness T ₁₃ of the 3 rd adhesive layer 950 or the thickness T ₁₄ of the 4 th adhesive layer 960 does not become excessively thick, and the thickness of the entire image display device 60 can be reduced.

The thickness T ₁₃ of the 3 rd adhesive layer 950 and the thickness T ₁₄ of the 4 th adhesive layer 960 may also be the same as each other. In this case, the thickness T ₁₃ of the 3 rd adhesive layer 950 and the thickness T ₁₄ of the 4 th adhesive layer 960 may be 1.2 times or more, preferably 1.5 times or more, and more preferably 2.0 times or more, the thickness T ₁ of the substrate 11, respectively. That is, the total (T ₁₃+T₁₄) of the thickness T ₁₃ of the 3 rd adhesive layer 950 and the thickness T ₁₄ of the 4 th adhesive layer 960 is 3 times or more the thickness T ₁ of the substrate 11. By making the total of the thicknesses T ₁₃、T₁₄ of the 3 rd adhesive layer 950 and the 4 th adhesive layer 960 sufficiently thick with respect to the thickness T ₁ of the substrate 11 in this way, the 3 rd adhesive layer 950 and the 4 th adhesive layer 960 deform in the thickness direction in the region overlapping the substrate 11, thereby absorbing the thickness of the substrate 11. This can suppress the occurrence of a step in the 3 rd adhesive layer 950 or the 4 th adhesive layer 960 at the peripheral edge of the substrate 11, and can make it difficult for the observer to see the presence of the substrate 11.

In the case where the thickness T ₁₃ of the 3 rd adhesive layer 950 and the thickness T ₁₄ of the 4 th adhesive layer 960 are the same as each other, the thickness T ₁₃ of the 3 rd adhesive layer 950 and the thickness T ₁₄ of the 4 th adhesive layer 960 may be 5 times or less, preferably 3 times or less, the thickness T ₁ of the substrate 11, respectively. Thus, the thickness T ₁₃、T₁₄ of both the 3 rd adhesive layer 950 and the 4 th adhesive layer 960 is not excessively thick, and the thickness of the entire image display device 60 can be reduced.

Specifically, the thickness T ₁ of the substrate 11 may be, for example, 10 μm or more and 50 μm or less, and preferably 15 μm or more and 25 μm or less. By setting the thickness T ₁ of the substrate 11 to 10 μm or more, the strength of the wiring substrate 10 can be maintained, and the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 of the grid wiring layer 20, which will be described later, can be made difficult to deform. Further, by setting the thickness T ₁ of the substrate 11 to 50 μm or less, it is possible to suppress the occurrence of a step in the 3 rd adhesive layer 950 and the 4 th adhesive layer 960 at the peripheral edge of the substrate 11, and it is possible to make it difficult for the observer to see the presence of the substrate 11.

The thickness T ₁₃ of the 3 rd adhesive layer 950 may be, for example, 15 μm or more and 500 μm or less, and preferably 20 μm or more and 250 μm or less. The thickness T ₁₄ of the 4 th adhesive layer 960 may be, for example, 15 μm or more and 500 μm or less, and preferably 20 μm or more and 250 μm or less.

As described above, the wiring board 10, the 3 rd adhesive layer 950, and the 4 th adhesive layer 960 constitute the image display device laminate 70. In the present embodiment, there is also provided such a laminate 70 for an image display device.

The decorative film 74 is disposed on the 4 th adhesive layer 960. The portion of the decorative film 74 corresponding to the 2 nd region A2 (the display region 61 a) may be opened when viewed from the observer side. The decorative film 74 shields the 1 st region A1 except the 2 nd region A2 (the display region 61 a). That is, the decorative film 74 may also be configured to: when viewed from the observer side, it covers the end of the display unit 610 over the entire circumference.

As shown in fig. 23, the image display device 60 has a substantially rectangular shape as a whole in plan view, and has a long side direction parallel to the Y direction and a short side direction parallel to the X direction. The length L ₄ of the image display device 60 in the longitudinal direction (Y direction) can be selected, for example, in the range of 20mm to 500mm, preferably in the range of 100mm to 200 mm. The length L ₅ of the substrate 11 in the short side direction (X direction) may be selected, for example, in a range of 20mm to 500mm, preferably in a range of 50mm to 100 mm. The corners of the image display device 60 may be rounded.

[ Structure of wiring substrate ]

Next, a structure of the wiring board will be described with reference to fig. 25 to 28. Fig. 25 to 28 are diagrams showing the wiring board according to the present embodiment.

As shown in fig. 25, the wiring board 10 of the present embodiment is used in the image display device 60 described above (see fig. 23 and 24). The wiring board 10 is disposed on the light emitting surface 64 side of the display portion 610, and is disposed between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. The wiring board 10 includes a transparent substrate 11, a metal layer 90, and a protective layer 17. The metal layer 90 is disposed on the substrate 11. The protective layer 17 covers a portion of the metal layer 90. The metal layer 90 includes the mesh wiring layer 20 and the power supply portion 40 electrically connected to the mesh wiring layer 20.

As shown in fig. 26, in the present embodiment, a plurality of openings 23 are also formed by being surrounded by the 1 st-direction wirings 21 adjacent to each other and the 2 nd-direction wirings 22 adjacent to each other. In the present embodiment, the pitch P ₁ of the plurality of 1 st-direction wirings 21 may be, for example, in a range of 0.01mm to 1 mm. The pitch P ₂ of the plurality of 2 nd-direction wirings 22 may be, for example, in a range of 0.01mm to 1 mm. The length L ₃ of one side of each opening 23 may be, for example, in the range of 0.01mm to 1 mm.

As shown in fig. 27, in the present embodiment, the cross section (X-direction cross section) of each 1 st-direction wiring 21 perpendicular to the longitudinal direction thereof is also substantially rectangular or substantially square. As shown in fig. 28, in the present embodiment, the cross section (Y-direction cross section) of each 2 nd-direction wiring 22 perpendicular to the longitudinal direction is also substantially rectangular or substantially square, and is substantially the same as the cross section (X-direction cross section) of the 1 st-direction wiring 21.

The protective layer 17 is formed on the front surface of the substrate 11 so as to cover the metal layer 90. That is, in the wiring board 10, the protective layer 17 is formed so as to overlap the metal layer 90 in a plan view. The protective layer 17 protects the metal layer 90. Specifically, the protective layer 17 covers the entire region of the power supply portion 40 except for the portion where electrical connection is made. The protective layer 17 also covers a part of the area (the area on the power feeding unit 40 side) of the mesh wiring layer 20. The protective layer 17 may cover only a partial region of the power supply unit 40. The protective layer 17 may not cover the mesh wiring layer 20. In the region where the metal layer 90 is not present, the protective layer 17 covers the substrate 11. The protective layer 17 is formed over substantially the entire area in the width direction (X direction) of the substrate 11, but may be formed only in a partial area in the width direction of the substrate 11.

As described above, the protective layer 17 exists in the 1 st area A1 which does not overlap with the display area 61 a. The protective layer 17 exists only in the 1 st region A1 in the wiring substrate 10. On the other hand, the protective layer 17 is not present in the 2 nd area A2 overlapping with the display area 61 a. That is, the protective layer 17 is not present over the entire area of the 2 nd area A2. Here, the 1 st region A1 is a region (non-display region) which does not overlap with the display region 61a when viewed from the light emitting surface 64 side (Z direction positive side). The 2 nd region A2 is a region (display region) overlapping the display region 61a when viewed from the light emitting surface 64 side (Z direction positive side). An edge 17a (see fig. 24) of the protective layer 17 on the 2 nd region A2 side (Y direction positive side) may be overlapped with the decorative film 74. The end edge 17a of the protective layer 17 is located between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. However, the end edge 17a of the protective layer 17 may be exposed outward from the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. By not providing the protective layer 17 in the 2 nd region A2 in this way, the protective layer 17 is not substantially seen by the naked eye of the observer, and it is difficult for the observer to recognize the presence of the wiring substrate 10.

As shown in fig. 24, a part of the wiring board 10 is bent outside the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. Specifically, the substrate 11, the metal layer 90, and the protective layer 17 of the wiring substrate 10 are bent in a substantially C-shape toward the display portion 610 side. The substrate 11, the metal layer 90, and the protective layer 17 are bent toward the display portion 610 side (Z-direction negative side). However, the substrate 11, the metal layer 90, and the protective layer 17 may be curved toward the opposite side (positive Z-direction side) of the display portion 610. In the present specification, "bending" is not limited to the case of bending into a curve. Also included are cases where the plane is curved in such a way as to form an acute, right or obtuse angle. For example, the substrate 11, the metal layer 90, and the protective layer 17 may be bent in an L shape.

In the thus bent portion, the outermost protective layer 17 covers the substrate 11 and the metal layer 90. Thus, for example, when the metal layer 90 is bent in order to attach the wiring board 10, the metal layer 90 is protected by the protective layer 17. This can suppress cracking or peeling of the metal layer 90 due to the tensile force applied to the metal layer 90.

As a material of the protective layer 17, an acrylic resin such as polymethyl (meth) acrylate or polyethyl (meth) acrylate, a modified resin thereof, a polyethylene resin such as a copolymer, a polyester, a polyvinyl alcohol, a polyvinyl acetate, a polyvinyl acetal or a polyvinyl butyral, a colorless transparent insulating resin such as a copolymer thereof, polyurethane, an epoxy resin, polyamide or chlorinated polyolefin can be used.

The difference between the heat shrinkage of the protective layer 17 and the heat shrinkage of the substrate 11 after 1 hour at 120 ℃ may be 0% or more and 1% or less, and preferably 0% or more and 0.5% or less. By setting the difference between the thermal shrinkage rate of the protective layer 17 and the thermal shrinkage rate of the substrate 11 within the above range, cracking or peeling of the metal layer 90 can be suppressed when the wiring substrate 10 is left in a high-temperature environment for a long period of time. Specifically, the heat shrinkage of the protective layer 17 after 1 hour at 120 ℃ may be 0.01% or more and 2.0% or less, preferably 0.01% or more and 1.0% or less, and more preferably 0.05% or more and 0.3% or less. The heat shrinkage of the substrate 11 after 1 hour at 120 ℃ may be 0.01% or more and 2.0% or less, preferably 0.01% or more and 1.0% or less, and more preferably 0.05% or more and 0.3% or less.

Here, the heat shrinkage of the protective layer 17 or the substrate 11 after 1 hour at 120 ℃ is a value indicating how much dimensional change occurs in the protective layer 17 or the substrate 11 when heat is applied, which can be measured by the following method. First, the protective layer 17 or the substrate 11 was cut into a size of 50mm in length (MD) ×4mm in width (TD) to be used as a test piece. Next, the length M (mm) of the test piece was measured by a precision automatic two-dimensional coordinate measuring machine (AMIC 700, manufactured by Xindong S precision Co., ltd.). The length and width may be appropriately adjusted according to the size of the protective layer 17 or the substrate 11, or may be smaller than 50mm and 4mm, respectively. Next, the end (about 1 mm) of the test piece in the longitudinal direction was fixed to the metal mesh with an adhesive tape, and the test piece was suspended from the metal mesh. In this state, the test piece was left in an oven heated to 120℃for 1 hour, and then, the test piece was taken out together with the metal mesh and naturally cooled in an environment of room temperature (25 ℃). Next, the length N (mm) of the test piece after being naturally cooled to room temperature was measured by a precision automatic two-dimensional coordinate measuring machine (AMIC 700, manufactured by Xindong S precision Co., ltd.). At this time, the heat shrinkage was calculated by the following formula.

Heat shrinkage (%) = (1- (length N/length M)) ×100

The dielectric loss tangent of the protective layer 17 may be 0.002 or less, preferably 0.001 or less. The lower limit of the dielectric loss tangent of the protective layer 17 is not particularly limited, and may exceed 0. By setting the dielectric loss tangent of the protective layer 17 to the above range, it is possible to reduce the loss of gain (sensitivity) associated with transmission and reception of electromagnetic waves, particularly when electromagnetic waves (for example, millimeter waves) transmitted and received by the mesh wiring layer 20 are high frequency. The dielectric constant of the protective layer 17 is not particularly limited, and may be 2.0 or more and 10.0 or less.

The dielectric loss tangent of the protective layer 17 can be measured according to IEC 62562. Specifically, first, the substrate 11 and the protective layer 17 are cut out, and the protective layer 17 is peeled off from the substrate 11, thereby preparing a test piece. The dimensions of the test piece were: the width is 10mm to 20mm, and the length is 50mm to 100mm. Next, the dielectric loss tangent was measured according to IEC 62562.

The thickness T ₁₂ of the protective layer 17 may be 1 μm or more and 100 μm or less, may be 1 μm or more and 50 μm or less, may be 5 μm or more and 50 μm or less, and is preferably 5 μm or more and 25 μm or less. By setting the thickness T ₁₂ of the protective layer 17 to 1 μm or more, the scratch resistance and weather resistance of the protective layer 17 can be improved. Further, by setting the thickness T ₁₂ of the protective layer 17 to 100 μm or less, the thickness of the wiring board 10 can be reduced, and the bending property of the bending portion of the wiring board 10 can be ensured. Further, by setting the thickness T ₁₂ of the protective layer 17 to 50 μm or less, the thickness of the wiring board 10 can be made thinner, and the flexibility of the bending portion of the wiring board 10 can be further ensured. In the present embodiment, the thickness T ₁₂ of the protective layer 17 is a distance measured from the front surface of the metal layer 90 to the front surface of the protective layer 17 without bending the wiring board 10.

The ratio (T ₁₂/T₁) of the thickness T ₁₂ of the protective layer 17 to the thickness T ₁ of the substrate 11 may be 0.02 or more and 5.0 or less, preferably 0.2 or more and 1.5 or less. By setting the ratio (T ₁₂/T₁) to 0.02 or more, the scratch resistance and weather resistance of the protective layer 17 can be improved. Further, by setting the ratio (T ₁₂/T₁) to 5.0 or less, the thickness of the wiring board 10 can be reduced, and flexibility of the bent portion of the wiring board 10 can be ensured.

In the present embodiment, the power supply line 85 may be electrically connected to the power supply portion 40 of the wiring board 10 via the anisotropic conductive film 85 c. The module 80A may be constituted by the wiring board 10 and the power supply line 85 electrically connected to the power supply unit 40 via the anisotropic conductive film 85c (see fig. 1,2, 7, and the like).

[ Method for producing Wiring Board ]

Next, a method for manufacturing a wiring board according to the present embodiment will be described with reference to fig. 29 (a) to (g). Fig. 29 (a) - (g) are cross-sectional views showing a method for manufacturing a wiring board according to the present embodiment.

As shown in fig. 29 (a), a substrate 11 having transparency is prepared.

Next, a metal layer 90 is formed on the substrate 11. The metal layer 90 includes the mesh wiring layer 20 and the power supply portion 40 electrically connected to the mesh wiring layer 20.

At this time, first, as shown in fig. 29 (b), a metal foil 51 is laminated on substantially the entire front surface of the substrate 11. In the present embodiment, the thickness of the metal foil 51 may be 0.1 μm or more and 5.0 μm or less. In the present embodiment, the metal foil 51 may contain copper.

Next, as shown in fig. 29 (c), the photocurable insulating resist 52 is supplied to substantially the entire area of the front surface of the metal foil 51. Examples of the photocurable insulating resist 52 include organic resins such as acrylic resins and epoxy resins.

Next, as shown in fig. 29 (d), the insulating layer 54 is formed by photolithography. In this case, the photocurable insulating resist 52 is patterned by photolithography to form an insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed so that the metal foil 51 corresponding to the metal layer 90 is exposed.

Next, as shown in (e) of fig. 29, the metal foil 51 on the front surface of the substrate 11 at the portion not covered with the insulating layer 54 is removed. At this time, the metal foil 51 is etched so that the front surface of the substrate 11 is exposed by performing wet treatment using a strong acid such as ferric chloride, cupric chloride, sulfuric acid or hydrochloric acid, persulfate, hydrogen peroxide, an aqueous solution of these, a combination of these, or the like.

Next, as shown in fig. 29 (f), the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by performing wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkali solution, or dry treatment using oxygen plasma.

Thus, the wiring substrate 10 having the substrate 11 and the metal layer 90 provided on the substrate 11 is obtained. The metal layer 90 includes the mesh wiring layer 20 and the power supply portion 40 electrically connected to the mesh wiring layer 20.

Thereafter, as shown in fig. 29 (g), the protective layer 17 is formed so as to cover the metal layer 90 located in the 1 st region A1 on the substrate 11. At this time, the protective layer 17 is not formed in the 2 nd region A2. As a method for forming the protective layer 17, roll coating, gravure reverse coating, micro gravure coating, slot die coating, doctor blade coating, inkjet coating, dispenser coating, kiss coating, spray coating, screen printing, offset printing, flexography printing can be used.

[ Action of the present embodiment ]

As shown in fig. 23 and 24, the wiring board 10 is assembled in the image display device 60 having the display unit 610. At this time, the wiring board 10 is disposed on the display unit 610. The mesh wiring layer 20 of the wiring substrate 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received through the mesh wiring layer 20, and communication can be performed using the image display device 60.

According to the present embodiment, the protective layer 17 exists in the 1 st area A1 which does not overlap with the display area 61a of the image display device 60. The protective layer 17 is not present in the 2 nd area A2 overlapping with the display area 61a of the image display device 60. Thus, when the observer views the image display device 60 from the light emitting surface 64 side, the reflected light at the interface between the protective layer 17 and the substrate 11 or the interface between the protective layer 17 and the 4 th adhesive layer 960 is not seen. Therefore, it is difficult to see the wiring substrate 10 with the naked eye of an observer. In particular, in the case where the 3 rd adhesive layer 950 and the 4 th adhesive layer 960 each have a larger area than the substrate 11, the outer edge of the substrate 11 can be made difficult to be seen by the naked eye of the observer, and the observer can be made not to recognize the presence of the substrate 11.

In addition, according to the present embodiment, in the 2 nd region A2, the protective layer 17 does not overlap with the 4 th adhesive layer 960. Thus, a step is less likely to occur at a position corresponding to the outer edge of the substrate 11 in the 4 th adhesive layer 960. Therefore, the outer edge of the substrate 11 can be made difficult to be seen by the naked eye of the observer, and the observer can not recognize the presence of the substrate 11.

In addition, according to the present embodiment, the protective layer 17 is present on the metal layer 90 located in the 1 st region A1. This can prevent damage to the metal layer 90 or breakage of the metal layer 90 when the wiring board 10 is mounted.

In particular, when a part of the wiring board 10 is bent in the 1 st region A1, the metal layer 90 is prevented from being broken or peeled off by a tensile force at the time of bending the wiring board 10. That is, as shown in fig. 30, when the wiring board 10 is bent, the relatively flexible board 11 and the protective layer 17 are respectively stretched outward. On the other hand, in the metal layer 90 located between the substrate 11 and the protective layer 17, a force acts in the opposite direction (inside). Thus, the metal layer 90 does not stretch significantly. Thus, the metal layer 90 is protected by the protective layer 17, and occurrence of cracking or peeling of the metal layer 90 is suppressed.

Further, according to the present embodiment, the wiring board 10 includes a transparent substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. The mesh wiring layer 20 has a mesh-like pattern formed of a conductor portion, which is a formation portion of the opaque conductor layer, and a plurality of opening portions, and thus ensures transparency of the wiring substrate 10. Thus, when the wiring board 10 is arranged on the display unit 610, the display region 61a can be seen from the opening 23 of the mesh wiring layer 20, and visibility of the display region 61a is not impaired.

Examples (example)

Next, specific examples in the above embodiments will be described.

Example A1

A wiring board including a substrate, a metal layer, and a protective layer was produced (example A1). The substrate was made of polyethylene terephthalate and had a thickness of 10. Mu.m. The metal layer was made of copper and had a thickness of 2. Mu.m. The line width of the mesh wiring layer was all 2 μm, and the opening was square with one side of 100 μm. The protective layer is formed only in the 1 st region of the metal layer which does not overlap the display region. The protective layer was made of an acrylic resin and had a thickness of 10. Mu.m.

Example A2

A wiring substrate (example A2) was produced in the same manner as in example A1 except that the thickness of the substrate was 25 μm and the thickness of the protective layer was 25 μm.

Comparative example A1

A wiring board (comparative example A1) was produced in the same manner as in example A1, except that the protective layer was not provided.

Comparative example A2

A wiring board (comparative example A2) was produced in the same manner as in example A1 except that the protective layer was formed in the 2 nd region except that the 1 st region was formed with the thickness of the protective layer being 12 μm.

Next, the wiring boards of examples A1-2 and comparative examples A1-2 were evaluated for mounting resistance, invisibility, and bending resistance when they were assembled into an image display device, respectively. The results are shown in Table 1.

The "mounting resistance" is determined to be "high" when no damage such as wire breakage, twisting, collapse or the like is caused when heat or pressure is applied to mount the wiring board, and "low" when damage such as wire breakage, twisting, collapse or the like is caused when heat or pressure is applied to mount the wiring board.

Regarding "invisibility", the case where the outer edge of the wiring substrate cannot be visually recognized when viewed at angles of 30 °, 60 °, and 90 ° with respect to the front surface of the base material under a general visual inspection environment is determined as "high", and the case where the outer edge of the wiring substrate can be visually recognized when viewed at angles of 30 °, 60 °, and 90 ° with respect to the front surface of the base material under a general visual inspection environment is determined as "low".

Regarding "bending resistance", it was determined as "high" that peeling and disconnection of the metal layer did not occur and that the variation in resistance value was less than 0.5 Ω/≡when the wiring substrate was bent 180 ° around a cylinder having a diameter of 2mm using a cylindrical mandrel bending tester, and as "low" that peeling or disconnection of the metal layer occurred or that the variation in resistance value was 0.5 Ω/≡when the wiring substrate was bent 180 ° around a cylinder having a diameter of 2mm using a cylindrical mandrel bending tester.

TABLE 1

Thus, it was found that: the wiring boards of examples A1-2 were high in mounting resistance, invisibility, and bending resistance. The judgment is that: the wiring boards of comparative examples A1-2 were low in any of mounting resistance, invisibility, and bending resistance.

Modification example

Next, a modified example of the wiring board will be described.

(Modification 1)

Fig. 31 shows a modification 1 of the wiring board. The modification shown in fig. 31 is different in that: the dummy wiring layer 30 is provided around the mesh wiring layer 20, and the other structures are substantially the same as those of the embodiment shown in fig. 1 to 30 described above. In fig. 31, the same reference numerals are given to the same portions as those in fig. 1 to 30, and detailed description thereof is omitted.

In the wiring substrate 10 shown in fig. 31, a dummy wiring layer 30 is provided along the periphery of the mesh wiring layer 20. The dummy wiring layer 30 does not substantially function as an antenna unlike the mesh wiring layer 20. In this case, the metal layer 90 includes the mesh wiring layer 20, the dummy wiring layer 30, and the power supply unit 40. The protective layer 17 exists in the 1 st region A1 and does not exist in the 2 nd region A2.

In this way, by disposing the dummy wiring layer 30 electrically independent of the mesh wiring layer 20 around the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be made unclear. As a result, the mesh wiring layer 20 can be hardly seen on the front surface of the image display device 60, and it is possible to make it difficult for the user of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

(Modification 2)

Fig. 32 shows a modification 2 of the wiring board. The modification shown in fig. 32 is different in that: a plurality of dummy wiring layers 30A and 30B having different aperture ratios are provided around the mesh wiring layer 20, and the other configuration is substantially the same as that of the embodiment shown in fig. 1 to 31. In fig. 32, the same reference numerals are given to the same portions as those in fig. 1 to 31, and detailed description thereof is omitted.

In the wiring substrate 10 shown in fig. 32, a plurality of (in this case, 2) dummy wiring layers 30A, 30B (1 st dummy wiring layer 30A and 2 nd dummy wiring layer 30B) having different aperture ratios are provided along the periphery of the mesh wiring layer 20. Specifically, the 1 st dummy wiring layer 30A is arranged along the periphery of the mesh wiring layer 20, and the 2 nd dummy wiring layer 30B is arranged along the periphery of the 1 st dummy wiring layer 30A. The dummy wiring layers 30A and 30B do not substantially function as antennas unlike the mesh wiring layer 20. The metal layer 90 includes the mesh wiring layer 20, the dummy wiring layers 30A, 30B, and the power supply portion 40. The protective layer 17 exists in the 1 st region A1 and does not exist in the 2 nd region A2.

By disposing the dummy wiring layers 30A and 30B electrically independent of the mesh wiring layer 20 in this way, the outer edge of the mesh wiring layer 20 can be made clearer. As a result, the mesh wiring layer 20 can be hardly seen on the front surface of the image display device 60, and it is possible to make it difficult for the user of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

(Modification 3)

Fig. 33 shows a modification 3 of the wiring board. The modification shown in fig. 33 is different in that: the undercoat layer 15 is disposed between the substrate 11 and the mesh wiring layer 20, and the other structures are substantially the same as those of the embodiment shown in fig. 1 to 32 described above. In fig. 33, the same reference numerals are given to the same portions as those in fig. 1 to 32, and detailed description thereof is omitted.

In the wiring board 10 shown in fig. 33, the undercoat layer 15 is formed on the substrate 11, and the mesh wiring layer 20 is formed on the undercoat layer 15. The undercoat layer 15 serves to improve adhesion between the mesh wiring layer 20 and the substrate 11. In this case, the primer layer 15 is provided in substantially the entire region of the front surface of the substrate 11. Further, the undercoat layer 15 may be provided only in a region where the mesh wiring layer 20 is provided in the front surface of the substrate 11.

Primer layer 15 may also comprise a polymeric material. This effectively improves the adhesion between the mesh wiring layer 20 and the substrate 11. In this case, as a material of the undercoat layer 15, a colorless transparent polymer material can be used. The primer layer 15 preferably contains an acrylic resin or a polyester resin. This can more effectively improve the adhesion with the mesh wiring layer 20.

The thickness of the undercoat layer 15 is preferably 0.05 μm or more and 0.5 μm or less. By setting the thickness of the undercoat layer 15 to the above range, the adhesion between the mesh wiring layer 20 and the substrate 11 can be improved, and the transparency of the wiring substrate 10 can be ensured.

(Modification 4)

Fig. 34 shows a 4 th modification of the wiring board. The modification shown in fig. 34 is different in that: the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 have the blackened layer 28, and the other structures are substantially the same as those of the embodiment shown in fig. 1 to 33. In fig. 34, the same reference numerals are given to the same parts as those shown in fig. 1 to 33, and detailed description thereof is omitted.

In the wiring board 10 shown in fig. 34, the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 each have a main body 27 and a blackened layer 28 formed on the outer periphery of the main body 27. The main body 27 constitutes a main portion of the 1 st-direction wiring 21 and the 2 nd-direction wiring 22, and is located at the center of the 1 st-direction wiring 21 and the 2 nd-direction wiring 22. The blackened layer 28 is located on the outermost surfaces of the 1 st-direction wiring 21 and the 2 nd-direction wiring 22.

The material of the main body 27 may be any metal material having conductivity. In the present modification, the material of the main body 27 is copper, but is not limited thereto. As a material of the main body 27, for example, a metal material (including an alloy thereof) such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel is used.

The blackened layer 28 is formed so as to cover the outer surface of the main body portion 27. The blackened layer 28 is formed on the front surface (surface on the positive side in the Z direction) and the side surface (surface orthogonal to the Z direction) of the main body 27, respectively. The blackened layer 28 is preferably formed over the entire area of the front and side surfaces of the main body portion 27. On the other hand, the blackened layer 28 may not be formed on the back surface (the surface on the negative side in the Z direction) of the main body 27. The blackened layer 28 has a black appearance as a whole, and is a layer that is more difficult to reflect visible light than the main body portion 27. Further, black includes not only achromatic black but also black with dark gray and tone, or dark gray.

The material of the blackened layer 28 is preferably a black metal material, and may contain palladium or tellurium, for example. Palladium or tellurium may be formed by substitution treatment of the body 27. Specifically, the metal atoms on the outer surface of the body 27 may be replaced with atoms of palladium or tellurium. Alternatively, the blackened layer 28 may be a layer obtained by oxidizing the body 27. Specifically, the blackening layer 28, which is an oxide film oxidized in the main body 27, may be formed on the outer surface of the main body 27 by oxidizing the outer surface of the main body 27 with a blackening liquid. For example, in the case where the material of the body portion 27 is copper, the blackened layer 28 may contain copper oxide.

The thickness of the blackened layer 28 may be 10nm or more, preferably 20nm or more. By setting the thickness of the blackened layer 28 to 10nm or more, the body portion 27 is sufficiently covered with the blackened layer 28, and thus the blackened layer 28 can sufficiently absorb visible light. This suppresses reflection of visible light by the blackened layer 28, and makes the mesh wiring layer 20 less visible to the naked eye. The thickness of the blackened layer 28 may be 100nm or less, and preferably 60nm or less. By setting the thickness of the blackened layer 28 to 100nm or less, it is possible to suppress a decrease in the conductivity of the mesh wiring layer 20 due to the presence of the blackened layer 28, and it is not difficult for a current to flow in the mesh wiring layer 20 when transmitting and receiving radio waves. The thickness of the blackened layer 28 can be measured by using STEM-EDS (Scanning Transmission Electron Microscopy-ENERGY DISPERSIVE X-ray Spectroscopy: scanning transmission electron microscope-energy dispersive X-ray spectrometry).

According to this modification, the 1 st-direction wiring 21 and the 2 nd-direction wiring 22 each have a main body 27 and a blackened layer 28 formed on the outer periphery of the main body 27. Thus, the blackened layer 28 absorbs visible light, and thus can suppress reflection of visible light by the body portion 27. As a result, the mesh wiring layer 20 can be hardly seen on the front surface of the image display device 60, and the mesh wiring layer 20 can be hardly recognized by the observer with the naked eye.

(Embodiment 3)

Next, embodiment 3 will be described with reference to fig. 35 to 37. Fig. 35 to 37 are diagrams showing the present embodiment. In fig. 35 to 37, the same reference numerals are given to the same parts as those of embodiment 1 shown in fig. 1 to 22 or the same parts as those of embodiment 2 shown in fig. 23 to 34, and detailed description thereof may be omitted.

[ Structure of image display device ]

The configuration of the image display device according to the present embodiment will be described with reference to fig. 35.

As shown in fig. 35, the image display device 60 of the present embodiment includes a laminate 70 for an image display device and a display unit (display) 610 having a display area 61a, which is laminated on the laminate 70 for an image display device. In the present embodiment, the protective layer 17 covers the metal layer 90. The difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 is 0.1 or less.

In this embodiment, the difference between the maximum value and the minimum value among the refractive index of the substrate 11, the refractive index of the protective layer 17, the refractive index of the 3 rd adhesive layer 950, and the refractive index of the 4 th adhesive layer 960 is 0.1 or less, preferably 0.07 or less, and more preferably 0.05 or less. The lower limit of the difference between the maximum value and the minimum value of the refractive index is not particularly limited, and may be 0 or more. The refractive index herein means an absolute refractive index, and can be obtained by the A method according to JIS K-7142. For example, when the material of the 3 rd adhesive layer 950 and the material of the 4 th adhesive layer 960 are acrylic resins (refractive index is 1.49), the refractive indices of the substrate 11 and the protective layer 17 are 1.39 to 1.59, respectively, and the difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 is 0.1 or less.

In this way, the difference between the maximum value and the minimum value among the refractive index of the substrate 11, the refractive index of the protective layer 17, the refractive index of the 3 rd adhesive layer 950, and the refractive index of the 4 th adhesive layer 960 is set to 0.1 or less. This suppresses reflection of visible light at the interface B10 between the 3 rd adhesive layer 950 and the substrate 11, the interface B20 between the substrate 11 and the protective layer 17, and the interface B30 between the protective layer 17 and the 4 th adhesive layer 960, respectively, and makes it difficult for the wiring substrate 10 to be seen by the naked eye of an observer.

Further, the material of the 3 rd adhesive layer 950 and the material of the 4 th adhesive layer 960 are preferably made to be the same as each other. This can further reduce the difference in refractive index between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960, and can suppress reflection of visible light at the interface B40 between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960.

[ Structure of wiring substrate ]

Next, a structure of the wiring board will be described with reference to fig. 36. Fig. 36 is a diagram showing a wiring board according to the present embodiment.

As shown in fig. 36, the wiring board 10 of the present embodiment is used in the image display device 60 (see fig. 35) described above. The wiring board 10 is disposed on the light emitting surface 64 side of the display portion 610, and is disposed between the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. The wiring board 10 includes a transparent substrate 11, a metal layer 90, and a protective layer 17. The metal layer 90 is disposed on the substrate 11. The protective layer 17 covers the metal layer 90. The metal layer 90 includes the mesh wiring layer 20 and the power supply portion 40 electrically connected to the mesh wiring layer 20.

The material of the substrate 11 is a material having transparency in the visible light range and electrical insulation. In the present embodiment, as described above, the material of the substrate 11 is a material having a difference in refractive index from the protective layer 17 of 0.1 or less. As a material of the substrate 11, a material having a difference between the maximum value and the minimum value of the refractive index of the substrate 11, the refractive index of the protective layer 17, the refractive index of the 3 rd adhesive layer 950, and the refractive index of the 4 th adhesive layer 960 of 0.1 or less is preferably used.

The protective layer 17 is formed on the front surface of the substrate 11 so as to cover the metal layer 90. The protective layer 17 protects the metal layer 90. The protective layer 17 may cover the entire area of the mesh wiring layer 20 and the entire area of the power supply portion 40. Alternatively, the protective layer 17 may cover only a partial region of the power supply unit 40. In addition, in the region where the metal layer 90 is not present, the protective layer 17 covers the substrate 11. In this case, the protective layer 17 is formed over the entire region of the substrate 11. Specifically, the protective layer 17 is formed over substantially the entire area in the width direction (X direction) and the length direction (Y direction) of the substrate 11. The protective layer 17 may be provided only in a partial region of the substrate 11. For example, the protective layer 17 may be formed only in a partial region in the width direction of the substrate 11.

The difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 is 0.1 or less, preferably 0.07 or less, and more preferably 0.05 or less. The lower limit of the difference in refractive index is not particularly limited, and may be 0 or more. By suppressing the difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 to 0.1 or less, reflection of visible light at the interface B20 between the substrate 11 and the protective layer 17 can be suppressed, and the wiring substrate 10 can be made difficult to be seen by the naked eye of an observer.

As shown in fig. 35, a part of the wiring board 10 is bent outside the 3 rd adhesive layer 950 and the 4 th adhesive layer 960. Specifically, the substrate 11, the metal layer 90, and the protective layer 17 of the wiring substrate 10 are bent in a substantially C-shape toward the display portion 610 side (Z-direction negative side). However, the substrate 11, the metal layer 90, and the protective layer 17 may be curved toward the opposite side (positive Z-direction side) of the display portion 610. In the present specification, "bending" is not limited to the case of bending into a curve. Also included are cases where the plane is curved in such a way as to form an acute, right or obtuse angle. For example, the substrate 11, the metal layer 90, and the protective layer 17 may be bent in an L shape.

As a material of the protective layer 17, a material having a difference in refractive index from the substrate 11 of 0.1 or less is used. As a material of the protective layer 17, a material having a difference between the maximum value and the minimum value of the refractive index of the substrate 11, the refractive index of the protective layer 17, the refractive index of the 3 rd adhesive layer 950, and the refractive index of the 4 th adhesive layer 960 of 0.1 or less is preferably used. Examples of the material of the protective layer 17 include acrylic resins such as polymethyl (meth) acrylate and polyethyl (meth) acrylate, modified resins thereof, and polyethylene resins such as copolymers thereof, polyesters, polyvinyl alcohols, polyvinyl acetates, polyvinyl acetals, and polyvinyl butyrals, and colorless transparent insulating resins such as copolymers thereof, polyurethanes, epoxy resins, polyamides, and chlorinated polyolefins.

In the present embodiment, the power supply line 85 may be electrically connected to the power supply portion 40 of the wiring board 10 via the anisotropic conductive film 85 c. The module 80A may be constituted by the wiring board 10 and the power supply line 85 electrically connected to the power supply unit 40 via the anisotropic conductive film 85c (see fig. 1, 2, 7, and the like).

[ Method for producing Wiring Board ]

Next, a method for manufacturing a wiring board according to the present embodiment will be described with reference to fig. 37 (a) to (g). Fig. 37 (a) - (g) are cross-sectional views showing a method of manufacturing a wiring board according to the present embodiment.

As shown in fig. 37 (a), a substrate 11 having transparency is prepared.

At this time, first, as shown in fig. 37 (b), a metal foil 51 is laminated on substantially the entire front surface of the substrate 11. In the present embodiment, the thickness of the metal foil 51 may be 0.1 μm or more and 5.0 μm or less. In the present embodiment, the metal foil 51 may contain copper.

Next, as shown in fig. 37 (c), the photocurable insulating resist 52 is supplied to substantially the entire area of the front surface of the metal foil 51. Examples of the photocurable insulating resist 52 include organic resins such as acrylic resins and epoxy resins.

Next, as shown in fig. 37 (d), an insulating layer 54 is formed by photolithography. In this case, the photocurable insulating resist 52 is patterned by photolithography to form an insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed so that the metal foil 51 corresponding to the metal layer 90 is exposed.

Next, as shown in (e) of fig. 37, the metal foil 51 on the front surface of the substrate 11 at the portion not covered with the insulating layer 54 is removed. At this time, the metal foil 51 is etched so that the front surface of the substrate 11 is exposed by performing wet treatment using a strong acid such as ferric chloride, cupric chloride, sulfuric acid or hydrochloric acid, persulfate, hydrogen peroxide, an aqueous solution of these, a combination of these, or the like.

Subsequently, as shown in fig. 37 (f), the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkali solution, or dry treatment using oxygen plasma.

Thereafter, as shown in fig. 37 (g), the protective layer 17 is formed so as to cover the metal layer 90 on the substrate 11. At this time, the protective layer 17 may be formed over substantially the entire region of the substrate 11. As a method for forming the protective layer 17, roll coating, gravure reverse coating, micro gravure coating, slot die coating, doctor blade coating, inkjet coating, dispenser coating, kiss coating, spray coating, screen printing, offset printing, flexography printing can be used.

[ Action of the present embodiment ]

As shown in fig. 35, the wiring board 10 is assembled in the image display device 60 having the display unit 610. At this time, the wiring board 10 is disposed on the display unit 610. The mesh wiring layer 20 of the wiring substrate 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received through the mesh wiring layer 20, and communication can be performed using the image display device 60.

According to the present embodiment, the difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 is 0.1 or less. This suppresses reflection of visible light at the interface B20 between the substrate 11 and the protective layer 17. As a result, when the observer views the image display device 60 from the light emitting surface 64 side, the substrate 11 of the wiring substrate 10 can be made difficult to be seen by the naked eye.

In addition, according to the present embodiment, the difference between the maximum value and the minimum value among the refractive index of the substrate 11, the refractive index of the protective layer 17, the refractive index of the 3 rd adhesive layer 950, and the refractive index of the 4 th adhesive layer 960 is 0.1 or less. Thereby, reflection of visible light at the interface B10 of the 3 rd adhesive layer 950 and the substrate 11, the interface B20 of the substrate 11 and the protective layer 17, and the interface B30 of the protective layer 17 and the 4 th adhesive layer 960 is suppressed, respectively. As a result, when the observer views the image display device 60 from the light emitting surface 64 side, the substrate 11 of the wiring substrate 10 can be made difficult to be seen by the naked eye. In particular, in the case where the 3 rd adhesive layer 950 and the 4 th adhesive layer 960 each have a larger area than the substrate 11, the outer edge of the substrate 11 can be made difficult to be seen by the naked eye of the observer, and the observer can be made not to recognize the presence of the substrate 11.

In addition, according to the present embodiment, the protective layer 17 is formed so as to cover the metal layer 90. This can protect the metal layer 90 from external impact or the like. In addition, when the wiring board 10 is mounted, damage to the metal layer 90 and breakage of the metal layer 90 can be suppressed.

In particular, when a part of the wiring board 10 is bent outside the 3 rd adhesive layer 950 and the 4 th adhesive layer 960, the metal layer 90 can be prevented from being broken or peeled off by a tensile force at the time of bending the wiring board 10. That is, as shown in fig. 30, when the wiring board 10 is bent, the relatively flexible board 11 and the protective layer 17 are respectively stretched outward. On the other hand, in the metal layer 90 located between the substrate 11 and the protective layer 17, a force acts in the opposite direction (inside). Thus, the metal layer 90 does not stretch significantly. Thus, the metal layer 90 is protected by the protective layer 17, and occurrence of cracking or peeling of the metal layer 90 is suppressed.

Further, according to the present embodiment, the wiring board 10 includes a transparent substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. The mesh wiring layer 20 has a mesh-like pattern formed of a conductor portion, which is a formation portion of the opaque conductor layer, and a plurality of opening portions, and thus ensures transparency of the wiring substrate 10. Thus, when the wiring substrate 10 is disposed on the display region 61a, the display region 61a can be seen from the opening 23 of the mesh wiring layer 20, and visibility of the display region 61a is not impaired.

Examples (example)

Next, specific examples in the above embodiments will be described.

Example B1

A laminate for an image display device including the 3 rd adhesive layer, the 4 th adhesive layer, and the wiring substrate was produced (example B1). The wiring substrate includes a substrate, a metal layer, and a protective layer. The substrate was made of polyethylene terephthalate and had a thickness of 10. Mu.m. The refractive index of the substrate was 1.57. The metal layer was made of copper and had a thickness of 2. Mu.m. The line width of the mesh wiring layer was all 2 μm, and the opening was square with one side of 100 μm. The protective layer is formed over the entire area of the substrate. The protective layer was made of an acrylic resin and had a thickness of 10. Mu.m. The refractive index of the protective layer was 1.53. As the 3 rd adhesive layer, an OCA film made of an acrylic resin having a thickness of 25 μm was used. The refractive index of the 3 rd adhesive layer was 1.55. As the 4 th adhesive layer, an OCA film made of an acrylic resin having a thickness of 25 μm was used. The 4 th adhesive layer had a refractive index of 1.55. In this case, the difference between the refractive index of the substrate and the refractive index of the protective layer was 0.04. The difference between the maximum value and the minimum value among the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the 3 rd adhesive layer, and the refractive index of the 4 th adhesive layer was 0.04.

Example B2

An image display device laminate (example B2) was produced in the same manner as in example B1, except that a substrate having a thickness of 25 μm and a refractive index of 1.51 was used as the substrate, a protective layer having a thickness of 25 μm and a refractive index of 1.57 was used as the protective layer, an adhesive layer having a thickness of 50 μm and a refractive index of 1.54 was used as the 3 rd adhesive layer, and an adhesive layer having a thickness of 75 μm and a refractive index of 1.54 was used as the 4 th adhesive layer. In this case, the difference between the refractive index of the substrate and the refractive index of the protective layer was 0.06. The difference between the maximum value and the minimum value among the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the 3 rd adhesive layer, and the refractive index of the 4 th adhesive layer was 0.06.

Example B3

An image display device laminate (example B3) was produced in the same manner as in example B1, except that a substrate having a thickness of 12 μm and a refractive index of 1.53 was used as the substrate, and a protective layer having a thickness of 0.2 μm and a refractive index of 1.55 was used as the protective layer. In this case, the difference between the refractive index of the substrate and the refractive index of the protective layer is 0.02. The difference between the maximum value and the minimum value among the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the 3 rd adhesive layer, and the refractive index of the 4 th adhesive layer was 0.02.

Comparative example B1

An image display device laminate (comparative example B1) was produced in the same manner as in example B1, except that a substrate having a thickness of 25 μm and a refractive index of 1.51 was used as the substrate, a protective layer having a thickness of 50 μm and a refractive index of 1.65 was used as the protective layer, an adhesive layer having a thickness of 50 μm and a refractive index of 1.54 was used as the 3 rd adhesive layer, and an adhesive layer having a thickness of 75 μm and a refractive index of 1.54 was used as the 4 th adhesive layer. In this case, the difference between the refractive index of the substrate and the refractive index of the protective layer was 0.14. The difference between the maximum value and the minimum value among the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the 3 rd adhesive layer, and the refractive index of the 4 th adhesive layer was 0.14.

Comparative example B2

A laminate for an image display device (comparative example B2) was produced in the same manner as in example B1, except that the protective layer was not provided.

Next, the wiring boards of examples B1-3 and comparative examples B1-2 were evaluated for mounting resistance, invisibility, and bending resistance when they were assembled into an image display device, respectively. The results are shown in Table 2.

TABLE 2

Thus, it was found that: the wiring boards of examples B1-3 were all high in mounting resistance, invisibility, and bending resistance. The judgment is that: the wiring boards of comparative examples B1-2 were low in any of mounting resistance, invisibility, and bending resistance.

Modification example

Next, a modified example of the wiring board will be described.

(Modification 1)

Fig. 38 shows a modification 1 of the wiring board. The modification shown in fig. 38 is different in that: the dummy wiring layer 30 is provided around the mesh wiring layer 20, and the other structures are substantially the same as those of the embodiment shown in fig. 1 to 37 described above. In fig. 38, the same reference numerals are given to the same portions as those in fig. 1 to 37, and detailed description thereof is omitted.

In the wiring substrate 10 shown in fig. 38, the dummy wiring layer 30 is provided along the periphery of the mesh wiring layer 20. The dummy wiring layer 30 does not substantially function as an antenna unlike the mesh wiring layer 20. In this case, the metal layer 90 includes the mesh wiring layer 20, the dummy wiring layer 30, and the power supply unit 40.

(Modification 2)

Fig. 39 shows a modification 2 of the wiring board. The modification shown in fig. 39 is different in that: a plurality of dummy wiring layers 30A and 30B having different aperture ratios are provided around the mesh wiring layer 20, and the other configuration is substantially the same as that of the embodiment shown in fig. 1 to 38. In fig. 39, the same reference numerals are given to the same portions as those in fig. 1 to 38, and detailed description thereof is omitted.

In the wiring substrate 10 shown in fig. 39, a plurality of (in this case, 2) dummy wiring layers 30A, 30B (1 st dummy wiring layer 30A and 2 nd dummy wiring layer 30B) having different aperture ratios are provided along the periphery of the mesh wiring layer 20. Specifically, the 1 st dummy wiring layer 30A is arranged along the periphery of the mesh wiring layer 20, and the 2 nd dummy wiring layer 30B is arranged along the periphery of the 1 st dummy wiring layer 30A. The dummy wiring layers 30A and 30B do not substantially function as antennas unlike the mesh wiring layer 20. The metal layer 90 includes the mesh wiring layer 20, the dummy wiring layers 30A, 30B, and the power supply portion 40.

The plurality of constituent elements disclosed in the above embodiments and modifications may be appropriately combined as necessary. Alternatively, some of the components may be deleted from all of the components shown in the above embodiments and modifications.

Claims

1. A module, wherein,

The module is provided with:

a wiring substrate including a1 st surface and a 2 nd surface located on the opposite side of the 1 st surface, a grid wiring layer disposed on the 1 st surface of the substrate, a power supply portion electrically connected to the grid wiring layer, and a protective layer disposed on the 1 st surface of the substrate and covering the grid wiring layer and the power supply portion; and

A power supply line electrically connected to the power supply portion via an anisotropic conductive film including conductive particles,

The substrate is provided with a transparency and,

The protective layer covers only a portion of the power supply portion,

The anisotropic conductive film covers an area of the power supply portion that is not covered by the protective layer.

2. The module of claim 1, wherein,

A part of the anisotropic conductive film is disposed on the protective layer.

3. The module of claim 1, wherein,

The region of the power supply portion not covered by any one of the protective layer and the anisotropic conductive film is covered by a coating layer containing a material having corrosion resistance.

4. The module of claim 1, wherein,

By making the conductive particles enter the protective layer, the power supply line is electrically connected to the power supply portion.

5. The module of claim 1, wherein,

The thickness of the protective layer is 4.0 μm or more and 8.0 μm or less.

6. The module of claim 1, wherein,

A dummy wiring layer electrically independent of the mesh wiring layer is provided around the mesh wiring layer.

7. The module of claim 1, wherein,

The wiring board has a radio wave transmitting/receiving function.

8. The module of claim 1, wherein,

The grid wiring layer has a transmission unit connected to the power supply unit and a transmission/reception unit connected to the transmission unit.

9. A laminate for an image display device, wherein,

The laminate for an image display device is provided with:

The module of any one of claims 1 to 8;

A 1 st adhesive layer located on the 1 st surface side of the substrate; and

A2 nd adhesive layer located on the 2 nd surface side of the substrate,

A part of the region of the substrate is disposed in a part of the region between the 1 st adhesive layer and the 2 nd adhesive layer.

10. An image display device, wherein,

The image display device includes:

the laminate for an image display device according to claim 9; and

And a display device laminated on the laminate for an image display device.

11. A method of manufacturing a module, wherein,

The method for manufacturing the module comprises the following steps:

a step of preparing a substrate including a1 st surface and a2 nd surface located on the opposite side of the 1 st surface;

Forming a mesh wiring layer and a power supply unit electrically connected to the mesh wiring layer on the 1 st surface of the substrate;

forming a protective layer on the 1 st surface of the substrate so as to cover the mesh wiring layer and the power supply portion; and

A step of electrically connecting a power supply line to the power supply unit via an anisotropic conductive film containing conductive particles,

The substrate is provided with a transparency and,

The protective layer covers only a portion of the power supply portion,

12. A wiring substrate for an image display device, wherein,

The wiring board is provided with:

A substrate;

a metal layer disposed on the substrate; and

A protective layer covering a portion of the metal layer,

The substrate is provided with a transparency and,

The metal layer comprises a mesh wiring layer,

The protective layer is present in the 1 st region that does not overlap with the display region of the image display device, and is not present in the 2 nd region that overlaps with the display region of the image display device.

13. The wiring substrate according to claim 12, wherein,

The difference between the heat shrinkage rate of the protective layer and the heat shrinkage rate of the substrate after 1 hour at 120 ℃ is 1% or less.

14. The wiring substrate according to claim 12, wherein,

The dielectric loss tangent of the protective layer is 0.002 or less.

15. The wiring substrate according to claim 12, wherein,

The ratio T ₁₂/T₁ of the thickness T ₁₂ of the protective layer to the thickness T ₁ of the substrate is 0.02 to 5.0.

16. The wiring substrate according to claim 12, wherein,

The thickness of the substrate is 10 [ mu ] m or more and 50 [ mu ] m or less.

17. The wiring substrate according to claim 12, wherein,

18. The wiring substrate according to claim 12, wherein,

The mesh wiring layer functions as an antenna.

19. The wiring substrate according to claim 12, wherein,

The wiring board further includes a power supply unit electrically connected to the mesh wiring layer, and the mesh wiring layer includes a transmission unit connected to the power supply unit and a transmission/reception unit connected to the transmission unit.

20. The wiring substrate according to claim 12, wherein,

The substrate, the metal layer, and the protective layer are curved in the 1 st region.

21. A module, wherein,

The module is provided with:

The wiring substrate according to any one of claims 12 to 20; and

And a power supply line electrically connected to the wiring board.

22. A laminate for an image display device, wherein,

The laminate for an image display device is provided with:

The wiring substrate of claim 12;

a3 rd adhesive layer having a larger area than the substrate; and

A 4 th adhesive layer having a larger area than the substrate,

The 3 rd adhesive layer has transparency and,

The 4 th adhesive layer has transparency and,

A part of the region of the substrate is disposed in a part of the region between the 3 rd adhesive layer and the 4 th adhesive layer.

23. The laminate for an image display device according to claim 22, wherein,

At least one of the thickness of the 3 rd adhesive layer and the thickness of the 4 th adhesive layer is 1.5 times or more the thickness of the substrate.

24. The laminate for an image display device according to claim 22, wherein,

The material of the 3 rd bonding layer is acrylic resin, and the material of the 4 th bonding layer is acrylic resin.

25. An image display device, wherein,

The image display device includes:

The laminate for an image display device according to any one of claims 22 to 24; and

And a display unit having a display area, which is laminated on the laminate for an image display device.

26. A wiring substrate for an image display device, wherein,

The wiring board is provided with:

A substrate;

a metal layer disposed on the substrate; and

A protective layer covering the metal layer,

The substrate is provided with a transparency and,

The metal layer comprises a mesh wiring layer,

The difference between the refractive index of the substrate and the refractive index of the protective layer is 0.1 or less.

27. The wiring substrate according to claim 26, wherein,

28. The wiring substrate according to claim 26, wherein,

The dielectric loss tangent of the protective layer is 0.002 or less.

29. The wiring substrate according to claim 26, wherein,

30. The wiring substrate according to claim 26, wherein,

The thickness of the substrate is 10 [ mu ] m or more and 50 [ mu ] m or less.

31. The wiring substrate according to claim 26, wherein,

32. The wiring substrate according to claim 26, wherein,

The mesh wiring layer functions as an antenna.

33. The wiring substrate according to claim 26, wherein,

34. The wiring substrate according to claim 26, wherein,

A portion of the substrate, the metal layer, and the protective layer is bent.

35. A module, wherein,

The module is provided with:

The wiring substrate of any one of claims 26 to 34; and

And a power supply line electrically connected to the wiring board.

36. A laminate for an image display device, wherein,

The laminate for an image display device is provided with:

A 3 rd adhesive layer;

A 4 th adhesive layer; and

A wiring board disposed between the 3 rd adhesive layer and the 4 th adhesive layer,

The wiring substrate has a substrate, a metal layer disposed on the substrate, and a protective layer covering the metal layer,

The substrate is provided with a transparency and,

The 3 rd adhesive layer has transparency and,

The 4 th adhesive layer has transparency and,

The metal layer comprises a mesh wiring layer,

The difference between the maximum value and the minimum value among the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the 3 rd adhesive layer, and the refractive index of the 4 th adhesive layer is 0.1 or less.

37. The laminate for an image display device according to claim 36, wherein,

38. The laminate for an image display device according to claim 36, wherein,

39. An image display device, wherein,

The image display device includes:

The laminate for an image display device according to any one of claims 36 to 38; and

And a display unit laminated on the laminate for an image display device.