CN118194814A - Evaluation method, device, equipment, medium and product for electronic component - Google Patents
Evaluation method, device, equipment, medium and product for electronic component Download PDFInfo
- Publication number
- CN118194814A CN118194814A CN202410308136.2A CN202410308136A CN118194814A CN 118194814 A CN118194814 A CN 118194814A CN 202410308136 A CN202410308136 A CN 202410308136A CN 118194814 A CN118194814 A CN 118194814A
- Authority
- CN
- China
- Prior art keywords
- stress
- test
- value
- evaluated
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011156 evaluation Methods 0.000 title claims abstract description 70
- 238000012360 testing method Methods 0.000 claims abstract description 461
- 238000004590 computer program Methods 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 38
- 230000035882 stress Effects 0.000 claims description 761
- 238000004088 simulation Methods 0.000 claims description 36
- 230000008646 thermal stress Effects 0.000 claims description 26
- 238000012797 qualification Methods 0.000 claims description 22
- 238000011990 functional testing Methods 0.000 claims description 20
- 230000007613 environmental effect Effects 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- 230000000977 initiatory effect Effects 0.000 claims description 8
- 230000008859 change Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000013500 data storage Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000009662 stress testing Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Tests Of Electronic Circuits (AREA)
Abstract
The present application relates to an evaluation method, an apparatus, a computer device, a storage medium and a computer program product for electronic components. The method comprises the following steps: responding to the evaluation instruction, and acquiring the stress type required to be evaluated by the electronic component to be evaluated; determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated; performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress stepping; and according to the result of the stress test, obtaining an evaluation result of the electronic component to be evaluated. By adopting the method, the test cost can be reduced.
Description
Technical Field
The present application relates to the field of reliability evaluation technologies, and in particular, to an evaluation method, an evaluation apparatus, a computer device, a storage medium, and a computer program product for electronic components.
Background
In the traditional technology, the limit evaluation of the electronic components is carried out continuously until the components are damaged, and the corresponding evaluation result can not be obtained.
However, in the conventional method, the electronic component must be damaged after each evaluation, and cannot be used for other tests, resulting in higher test cost.
Disclosure of Invention
In view of the foregoing, it is desirable to provide an evaluation method, an apparatus, a computer device, a computer-readable storage medium, and a computer program product for electronic components that can reduce test costs.
In a first aspect, the present application provides a method for evaluating an electronic component. The method comprises the following steps:
Responding to the evaluation instruction, and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated;
Performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress step;
and according to the result of the stress test, obtaining the evaluation result of the electronic component to be evaluated.
In one embodiment, the determining the test start stress value, the test end stress value and the stress step according to the type of the stress to be evaluated includes:
acquiring an actual stress maximum value and a stress specification limit value corresponding to the type of the stress to be evaluated of the electronic component to be evaluated;
And determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of the stress test according to the actual stress maximum value and the stress specification limit value.
In one embodiment, the determining the test start stress value, the test end stress value and the stress step according to the actual stress maximum value and the stress specification limit value includes:
Taking the minimum value of the actual stress maximum value and the stress specification limit value as the test initial stress value;
Multiplying the maximum value of the actual stress and the maximum value in the stress specification limit value by a preset multiple to obtain the test termination stress value;
and determining the stress step according to the test initial stress value and the test final stress value.
In one embodiment, the stress test includes a functional test and a critical performance parameter test; and performing a stress test on the electronic component to be evaluated according to the test start stress value, the test end stress value and the stress step, including:
acquiring a plurality of stress values participating in the test according to the test initial stress value, the test ending stress value and the stress stepping;
and according to the magnitude relation of the stress values participating in the test, sequentially performing functional test and key performance parameter test until the stress value participating in the stress test is not smaller than the test termination stress value, and ending the stress test.
In one embodiment, the method further comprises:
before the stress test is executed, under the condition of no stress application, testing the qualification of the electronic component to be evaluated;
And executing the stress test on the electronic component to be evaluated under the condition that the test result of the qualification test is qualified.
In one embodiment, the stress type includes one of electrical stress, thermal stress, or mechanical stress; the process for obtaining the actual stress maximum value corresponding to the stress type to be evaluated of the electronic component to be evaluated comprises the following steps:
under the condition that the stress type is the electric stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the electric stress according to a circuit simulation test;
Under the condition that the stress type is the thermal stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the thermal stress according to an environmental simulation test;
and under the condition that the stress type is the mechanical stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the mechanical stress according to running simulation test.
In a second aspect, the application further provides an evaluation device for electronic components. The device comprises:
the type acquisition module is used for responding to the evaluation instruction and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
the numerical value determining module is used for determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of the stress test according to the type of the stress to be evaluated;
The test execution module is used for executing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress stepping;
And the result acquisition module is used for acquiring the evaluation result of the electronic component to be evaluated according to the result of the stress test.
In a third aspect, the present application also provides a computer device. The computer device comprises a memory storing a computer program and a processor which when executing the computer program performs the steps of:
Responding to the evaluation instruction, and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated;
Performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress step;
and according to the result of the stress test, obtaining the evaluation result of the electronic component to be evaluated.
In a fourth aspect, the present application also provides a computer-readable storage medium. The computer readable storage medium having stored thereon a computer program which when executed by a processor performs the steps of:
Responding to the evaluation instruction, and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated;
Performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress step;
and according to the result of the stress test, obtaining the evaluation result of the electronic component to be evaluated.
In a fifth aspect, the present application also provides a computer program product. The computer program product comprises a computer program which, when executed by a processor, implements the steps of:
Responding to the evaluation instruction, and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated;
Performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress step;
and according to the result of the stress test, obtaining the evaluation result of the electronic component to be evaluated.
The above evaluation method, device, computer equipment, storage medium and computer program product for electronic components, respond to the evaluation instruction, obtain the stress type that the electronic components to be evaluated need to evaluate; determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated; performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress stepping; and according to the result of the stress test, obtaining an evaluation result of the electronic component to be evaluated. By adopting the method, the occurrence of the condition that the performance of the electronic component can be evaluated only by determining the corresponding test initial stress value, test final stress value and stress stepping of the stress test and performing the stress test in the related technology is reduced, so that the test cost is reduced. Meanwhile, the efficiency of evaluating the electronic components can be improved.
Drawings
FIG. 1 is an application environment diagram of an evaluation method for electronic components in one embodiment;
FIG. 2 is a flow chart of a method of evaluating electronic components in one embodiment;
FIG. 3 is a flow chart illustrating the determination of parameters of a stress test in one embodiment;
FIG. 4 is a flow chart of obtaining an actual stress maximum in one embodiment;
FIG. 5 is a flowchart of another embodiment of a method for evaluating electronic components;
FIG. 6 is a block diagram of an evaluation apparatus for electronic components in one embodiment;
Fig. 7 is an internal structural diagram of a computer device in one embodiment.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
The evaluation method for the electronic component provided by the embodiment of the application can be applied to an application environment shown in fig. 1. Wherein the terminal 102 communicates with the server 104 via a network. The data storage system may store data that the server 104 needs to process. The data storage system may be integrated on the server 104 or may be located on a cloud or other network server.
Specifically, the terminal 102 sends an evaluation instruction to the server 104, and the server 104 responds to the evaluation instruction to obtain the stress type of the electronic component to be evaluated; determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated; performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress stepping; and according to the result of the stress test, obtaining an evaluation result of the electronic component to be evaluated, and sending the evaluation result of the electronic component to be evaluated to the terminal 102.
The terminal 102 may be, but is not limited to, various personal computers, notebook computers, smart phones, tablet computers, and portable wearable devices, among others. The portable wearable device may be a smart watch, smart bracelet, headset, or the like. The server 104 may be implemented as a stand-alone server or as a server cluster of multiple servers.
In one embodiment, as shown in fig. 2, an evaluation method for electronic components is provided, where the method is applied to a server for illustration, it is to be understood that the method may also be applied to a server, and may also be applied to a system including a terminal and a server, and implemented through interaction between the terminal and the server, and includes the following steps:
step 202, responding to the evaluation instruction, and obtaining the stress type required to be evaluated by the electronic component to be evaluated.
The evaluation instruction is used for indicating the terminal to evaluate the limit stress of the electronic component. The evaluation instruction may include identification information of the electronic component to be evaluated and a stress type to be evaluated.
Illustratively, the stress types include electrical stress, thermal stress, and mechanical stress. Electrical stress includes, but is not limited to, voltage, current, and power. Thermal stress includes high and low temperatures. Mechanical stresses include, but are not limited to, vibration, shock, and acceleration. Specifically, the stress type may be determined according to the actual use environment and functional requirements of the electronic component.
In particular practice, identification information of the electronic components to be evaluated and the type of stress to be evaluated may be determined based on user requirements. For example, if the user's requirement is that a voltage limit of an electronic component be tested, the type of stress to be evaluated is voltage stress.
Step 204, determining a corresponding test start stress value, test end stress value and stress step according to the type of stress to be evaluated.
The specific parameters of the stress test are determined according to the type of the stress to be evaluated, wherein the specific parameters comprise a test start stress value, a test end stress value and a stress step. In particular, the test initiation stress value generally refers to the lowest stress level at which an electronic component can function properly. The test termination stress value generally refers to the highest stress level that may lead to failure of the electronic component. Stress stepping refers to the magnitude of the increase in stress in each test. The stress step determines the fineness of the test.
And 206, performing a stress test on the electronic component to be evaluated according to the test start stress value, the test end stress value and the stress step.
Illustratively, the electronic component to be evaluated is stress tested according to the test initiation stress value, the test termination stress value, and the stress step. Specifically, during stress testing, it is desirable to record performance characteristics, such as electrical, mechanical, etc., of the electronic component under evaluation at different stress levels.
And step 208, obtaining an evaluation result of the electronic component to be evaluated according to the result of the stress test.
Illustratively, an evaluation result of the electronic component to be evaluated is obtained according to the result of the stress test. Specifically, according to the stress test result, the performance change condition and failure mode of the electronic component are analyzed. And comparing the standard performance or the expected performance, judging whether the electronic component meets the use requirement, and giving out a corresponding evaluation result.
In the above evaluation method for electronic components, the stress type of the electronic components to be evaluated is obtained in response to the evaluation instruction; determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated; performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress stepping; and according to the result of the stress test, obtaining an evaluation result of the electronic component to be evaluated. By adopting the method, the occurrence of the condition that the performance of the electronic component can be evaluated only by determining the corresponding test initial stress value, test final stress value and stress stepping of the stress test and performing the stress test in the related technology is reduced, so that the test cost is reduced. Meanwhile, the efficiency of evaluating the electronic components can be improved.
In one embodiment, referring to FIG. 3, a flow diagram of determining parameters of a stress test in one embodiment is shown. Step 204, including:
Step 302, obtaining the actual stress maximum value and the stress specification limit value corresponding to the stress type of the electronic component to be evaluated.
The stress specification limit value can be obtained through identification information of the electronic component to be evaluated. Specifically, the maximum stress value allowed under the type of stress to be evaluated can be obtained by referring to a technical document or specification of the electronic component.
The maximum value of the actual stress can be obtained through actual measurement or simulation analysis, and the maximum stress value possibly suffered by the electronic component in the actual working environment, namely the maximum value of the actual stress is obtained. This value reflects the level of stress to which the electronic component may be subjected under practical use conditions.
And step 304, determining a corresponding test initial stress value, a corresponding test final stress value and a corresponding stress step of the stress test according to the actual stress maximum value and the stress specification limit value.
Wherein the stress step may be determined based on the fineness of the test and the time requirements. Smaller stress stepping may provide more detailed performance change data, but may increase test time and cost; larger stress steps may shorten the test time, but may not capture subtle performance changes.
Illustratively, based on the actual stress maximum and the stress specification limit, a corresponding test start stress value, test end stress value, and stress step for the stress test are determined to perform the stress test based on the test start stress value, the test end stress value, and the stress step.
In the above embodiment, according to the actual stress maximum value and the stress specification limit value, the test start stress value, the test end stress value and the stress step corresponding to the stress test are determined, so that the test parameters are more close to the actual working conditions of the electronic component, and the performance of the electronic component under the specific stress type can be more accurately evaluated. And moreover, by reasonably setting the initial stress and the termination stress of the test, the excessive stress on the electronic components can be avoided, and the damage risk in the test process is reduced.
In one embodiment, step 304 includes:
step 3042, using the minimum value of the actual stress maximum value and the stress specification limit value as the test initial stress value.
The initial stress value is the minimum value of the actual stress maximum value and the stress specification limit value.
Specifically, the actual stress maximum is expressed as; Stress specification limit value is expressed as; The corresponding test initiation stress value may be. That is to say,. The initial stress value of the test is the minimum value of the maximum value of the actual stress and the limit value of the stress specification, so that the electronic component cannot be fully evaluated due to the too low stress when the stress test starts, and cannot be immediately disabled due to the too high stress.
And step 3044, multiplying the maximum value of the actual stress and the maximum value in the stress specification limit value by a preset multiple to obtain the test termination stress value.
Wherein the maximum value of the actual stress and the maximum value of the stress specification limit value are multiplied by a preset multiple (such as 1.1, 1.2, 1.5, etc.), so as to obtain the test termination stress value.
Specifically, the preset multiple may be adjusted according to the characteristics of the electronic component and the test requirements to ensure that the test is able to cover higher stress levels to which the component may be subjected, thereby more fully evaluating its performance.
Taking a preset multiple of 1.1 as an example, the test termination stress valueThe method comprises the following steps:
；
Wherein, the setting of the preset multiple is more than 1. Ensuring that the termination conditions necessarily exceed the maximum value of the stresses used ensures that the application requirements are met and the risk of damaging the electronic components during testing is largely avoided. For example, in the case where the preset multiple is 1.1, the purpose is to ensure a margin of 10% and avoid subsequent use risks due to individual differences of electronic components.
Step 3046, determining the stress step according to the test start stress value and the test end stress value.
And determining the size of the stress step according to the test initial stress value and the test final stress value. Specifically, in combination with the test time and accuracy requirements, the appropriate stress step is determined. The selection of stress stepping needs to be compatible with testing accuracy and efficiency, and can be determined based on empirical values.
Smaller stress steps may provide more detailed data, but may increase test time, requiring more test resources to occupy, and being less efficient; larger stress steps may reduce test time, but may sacrifice some data accuracy.
For example, the stress step is described asIn the case where the test point is selected to be 6, the stress step is:。
In the above embodiment, the minimum value of the actual stress maximum value and the stress specification limit value is taken as the test initial stress value; multiplying the maximum value of the actual stress and the maximum value in the limit value of the stress specification by a preset multiple to obtain a test termination stress value; according to the initial stress value and the final stress value, the stress step is determined, so that the electronic component can be ensured to be stressed enough in the test process to evaluate the performance of the electronic component, and meanwhile, the situation that the component is damaged immediately due to excessive stress and complete performance change data cannot be obtained is avoided.
In one embodiment, the stress test includes a functional test and a critical performance parameter test; step 206, including:
acquiring a plurality of stress values participating in the test according to the test initial stress value, the test ending stress value and the stress stepping;
and according to the magnitude relation of the stress values participating in the test, sequentially performing functional test and key performance parameter test until the stress value participating in the stress test is not smaller than the test termination stress value, and ending the stress test.
The functional test is used for verifying whether the electronic component can work normally under a specific stress level or not and whether the electronic component meets the expected functional requirement or not. For example, testing of input/output signals, checking of control logic. In specific practice, a corresponding product manual of the electronic component can be obtained, and a testing instrument with a corresponding testing function can be selected for testing. For example, if the electronic component is a diode, the power device analyzer may be used to test parameters such as reverse withstand voltage, reverse leakage current, forward conduction current, and forward voltage drop.
Illustratively, according to the initial stress value, the final stress value and the stress step, a plurality of stress values participating in the test are obtained, so that according to the magnitude relation of the stress values participating in the test, the functional test and the key performance parameter test are sequentially carried out until the stress value participating in the stress test is not smaller than the final stress value, and the stress test is ended. Specifically, the stress value participating in the stress test can be gradually increased according to the stress step, the functional test and the key performance parameter test are performed on one stress value participating in the stress test, and the test result under the stress value is recorded.
In specific practice, a series of multiple stress values participating in the test may be calculated based on the test initiation stress value, the test termination stress value, and the stress step. These stress values will be used in the stress test in order from small to large. And starting from the minimum stress value, namely the test initial stress value, performing functional test on the electronic component, and performing key performance parameter test on the electronic component after performing the functional test. These parameters may include power consumption, response time, signal to noise ratio, etc. to understand the trend of performance of the electronic component under different stress levels. And repeating the functional test and the key performance parameter test according to the stress step increment stress value, and ending the stress test when the stress value reaches or exceeds the test termination stress value or when the failure of the electronic component is detected. With the increase of the stress value, the change condition of the performance of the electronic component is recorded, including whether the performance is reduced, failed and the like. Specifically, when the stress value participating in the stress test is not less than the test termination stress value and the electronic component functions normally at this time, the limit capability of the electronic component at the stress is determined to meet the actual application requirement.
In the above embodiments, by testing multiple stress values, it is possible to cover different stress levels to which an electronic component may be subjected, thereby more fully evaluating its performance.
In one embodiment, prior to performing the stress test, the electronic component to be evaluated is tested for eligibility without stress application;
And executing the stress test on the electronic component to be evaluated under the condition that the test result of the qualification test is qualified.
The qualification test may be a functional test and a key performance parameter test of the electronic component to be evaluated under the condition of no stress application, so as to obtain a test result under the condition of no stress application. And if the test result meets the product specification requirement of the electronic component, determining that the test result is qualified. The product specification requirements may be obtained from a product specification or product manual of the electronic component.
For example, before performing the stress test, the electronic component to be evaluated needs to be subjected to a qualification test, so that the stress test is performed if the test result of the qualification test is qualified.
In the embodiment, the electronic components with problems can be eliminated by performing the qualification test, so that the components participating in the stress test are ensured to meet the basic requirements. And meanwhile, components which do not meet the requirements are screened out through qualification tests, so that unnecessary stress tests on the components can be avoided, and test resources and cost are saved.
In one embodiment, referring to FIG. 4, a schematic flow diagram of one embodiment for obtaining an actual stress maximum is shown. The stress type comprises one of electrical stress, thermal stress or mechanical stress; the process for obtaining the actual stress maximum value corresponding to the stress type to be evaluated of the electronic component to be evaluated comprises the following steps:
step 402, obtaining a corresponding actual stress maximum value when the stress type to be evaluated is the electric stress according to a circuit simulation test under the condition that the stress type is the electric stress.
And step 404, obtaining a corresponding actual stress maximum value when the stress type to be evaluated is the thermal stress according to an environmental simulation test under the condition that the stress type is the thermal stress.
And step 406, obtaining a corresponding actual stress maximum value when the stress type to be evaluated is the mechanical stress according to the running simulation test under the condition that the stress type is the mechanical stress.
Specifically, the stress type includes one of an electrical stress, a thermal stress, or a mechanical stress.
For electrical stress, the actual stress maximum is typically obtained through circuit simulation testing. The circuit simulation test can simulate and analyze a circuit model of the electronic component through circuit simulation software so as to evaluate the performance of the electronic component under different electric stress conditions. In the process of circuit simulation, parameters such as voltage, current and the like can be gradually increased until components reach performance limit or failure point, so that corresponding actual stress maximum value is determined.
For thermal stress, the stress evaluation is dependent on environmental simulation testing. The environmental simulation test is used for observing the performance and reliability of the components under the conditions by simulating the thermal stress conditions such as temperature change, humidity change and the like possibly encountered by the components in the actual working environment. By continuously adjusting the environment simulation parameters, the performance limit of the component under the thermal stress can be found out, and the actual stress maximum value is further determined.
For mechanical stress, running simulation tests are generally employed to obtain the actual stress maximum. The running simulation test evaluates the stability and reliability of the components under the stress conditions such as mechanical vibration, impact and the like possibly suffered by the components in the actual working process. Through running simulation tests, the performance change of the component under different mechanical stress levels can be observed, so that the actual stress maximum value of the component is determined.
In the above embodiment, according to the type of stress to be evaluated, a corresponding simulation test method is selected to obtain the maximum value of actual stress, so that the stress level of the electronic component in the actual working environment is obtained more accurately, and a powerful support is provided for the subsequent stress test.
In one example, limiting evaluation of the temperature of an electronic component is illustrated.
And step 1, obtaining the maximum value of the stress bearing required by the electronic component in practical application and the temperature specification limit value of the electronic component.
Wherein the acquisition can be performed by thermal simulation testing. For example, the highest temperature of the component is 88 ℃ as measured. Thus, it can be recorded that. The rated maximum working temperature of the electronic component is 105 ℃ after being inquired, thus can be recorded。
And step 2, determining a test start stress value, a test end stress value and a stress step under the condition that the test result of the qualification test of the electronic component is qualified.
Wherein, test initiation stress value:
test termination stress value:
。
After the rounding treatment is carried out, the method is that, 。
Stress stepping:。
Step3, obtaining a plurality of stress values participating in the test according to the test initial stress value, the test final stress value and the stress stepping; and according to the magnitude relation of the stress values participating in the test, sequentially performing functional test and key performance parameter test until the stress value participating in the stress test is not smaller than the test termination stress value, and ending the stress test.
Wherein, the temperature of the environment where the components are positioned is stabilized at 94 ℃,100 ℃,106 ℃,112 ℃ and 118 ℃ respectively by taking 6 ℃ as a step. And (3) performing a stress test at 94 ℃,100 ℃,106 ℃,112 ℃ and 118 ℃ to obtain a stress test result, and under the condition that the stress test result at 118 ℃ meets the product specification requirement, determining that the limit capability of the electronic component at high temperature meets the actual application requirement and a certain allowance exists.
For a better understanding of the complete process for evaluating electronic components in an embodiment of the present invention, a complete example is described, referring to fig. 5, which shows a schematic flow chart of a method for evaluating electronic components in another embodiment, including the following steps:
step 502, in response to the evaluation instruction, obtaining a stress type required to be evaluated by the electronic component to be evaluated.
Step 504, under the condition of no stress application, testing the qualification of the electronic component to be evaluated; and under the condition that the test result of the qualification test is qualified, acquiring the corresponding actual stress maximum value and stress specification limit value of the to-be-evaluated electronic component in the stress type to be evaluated.
Specifically, under the condition that the stress type is electric stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is electric stress according to a circuit simulation test; under the condition that the stress type is thermal stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is thermal stress according to an environmental simulation test; and under the condition that the stress type is mechanical stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is mechanical stress according to running simulation test.
Step 506, taking the minimum value of the actual stress maximum value and the stress specification limit value as the test initial stress value.
And step 508, multiplying the maximum value of the actual stress and the maximum value in the stress specification limit value by a preset multiple to obtain a test termination stress value.
Step 510, determining a stress step according to the test initiation stress value and the test termination stress value.
Step 512, obtaining a plurality of stress values participating in the test according to the test start stress value, the test end stress value and the stress step.
And step 514, sequentially performing functional test and key performance parameter test according to the magnitude relation of the stress values participating in the test until the stress value participating in the stress test is not smaller than the test termination stress value, and ending the stress test.
And step 516, obtaining an evaluation result of the electronic component to be evaluated according to the result of the stress test.
In the embodiment, in response to an evaluation instruction, the type of stress required to be evaluated by the electronic component to be evaluated is obtained; determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated; performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress stepping; and according to the result of the stress test, obtaining an evaluation result of the electronic component to be evaluated. By adopting the method, the occurrence of the condition that the performance of the electronic component can be evaluated only by determining the corresponding test initial stress value, test final stress value and stress stepping of the stress test and performing the stress test in the related technology is reduced, so that the test cost is reduced. Meanwhile, the efficiency of evaluating the electronic components can be improved.
It should be understood that, although the steps in the flowcharts related to the embodiments described above are sequentially shown as indicated by arrows, these steps are not necessarily sequentially performed in the order indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in the flowcharts described in the above embodiments may include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of the steps or stages is not necessarily performed sequentially, but may be performed alternately or alternately with at least some of the other steps or stages.
Based on the same inventive concept, the embodiment of the application also provides an evaluation device for the electronic component, which is used for realizing the evaluation method for the electronic component. The implementation of the solution provided by the device is similar to the implementation described in the above method, so the specific limitation in one or more embodiments of the evaluation device for electronic components provided below may refer to the limitation of the evaluation method for electronic components hereinabove, and will not be repeated herein.
In one embodiment, as shown in fig. 6, there is provided an evaluation apparatus for an electronic component, including: a type acquisition module 602, a value determination module 604, a test execution module 606, and a result acquisition module 608, wherein:
the type obtaining module 602 is configured to obtain a stress type of the electronic component to be evaluated, in response to the evaluation instruction;
The numerical value determining module 604 is configured to determine a test start stress value, a test end stress value and a stress step corresponding to the stress test according to the type of stress to be evaluated;
A test execution module 606, configured to execute a stress test on the electronic component to be evaluated according to the test start stress value, the test end stress value, and the stress step;
And the result obtaining module 608 is configured to obtain an evaluation result of the electronic component to be evaluated according to the result of the stress test.
In some embodiments, the value determination module 604 includes:
the maximum value acquisition unit is used for acquiring the actual stress maximum value and the stress specification limit value corresponding to the stress type of the electronic component to be evaluated;
And the numerical value determining unit is used for determining a test initial stress value, a test ending stress value and a stress step corresponding to the stress test according to the actual stress maximum value and the stress specification limit value.
In some embodiments, the numerical determination unit is specifically configured to: taking the minimum value of the actual stress maximum value and the stress specification limit value as the test initial stress value; multiplying the maximum value of the actual stress and the maximum value in the stress specification limit value by a preset multiple to obtain the test termination stress value; and determining the stress step according to the test initial stress value and the test final stress value.
In some embodiments, the stress test includes a functional test and a critical performance parameter test; a test execution module 606, comprising:
The stress value acquisition unit is used for acquiring a plurality of stress values participating in the test according to the test initial stress value, the test ending stress value and the stress stepping;
And the test execution unit is used for sequentially carrying out functional test and key performance parameter test according to the magnitude relation of the stress values participating in the test until the stress value participating in the stress test is not smaller than the test termination stress value and ending the stress test.
In some embodiments, the apparatus further comprises:
The qualification testing module is used for performing qualification testing on the electronic component to be evaluated under the condition of no stress application before the stress test is executed;
and the execution module is used for executing the stress test on the electronic component to be evaluated under the condition that the test result of the qualification test is qualified.
In some embodiments, the stress type comprises one of electrical stress, thermal stress, or mechanical stress; the maximum value acquisition unit is specifically configured to: under the condition that the stress type is the electric stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the electric stress according to a circuit simulation test; under the condition that the stress type is the thermal stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the thermal stress according to an environmental simulation test; and under the condition that the stress type is the mechanical stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the mechanical stress according to running simulation test.
The respective modules in the above-described evaluation device for electronic components may be implemented in whole or in part by software, hardware, and combinations thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.
In one embodiment, a computer device is provided, which may be a server, the internal structure of which may be as shown in fig. 7. The computer device includes a processor, a memory, an Input/Output interface (I/O) and a communication interface. The processor, the memory and the input/output interface are connected through a system bus, and the communication interface is connected to the system bus through the input/output interface. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database of the computer device is used for storing stress specification limit values of different electronic components. The input/output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a method of evaluating an electronic component.
The display unit of the computer device is used for forming a visual picture, and can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be a key, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.
It will be appreciated by those skilled in the art that the structure shown in FIG. 7 is merely a block diagram of some of the structures associated with the present inventive arrangements and is not limiting of the computer device to which the present inventive arrangements may be applied, and that a particular computer device may include more or fewer components than shown, or may combine some of the components, or have a different arrangement of components.
In one embodiment, a computer device is provided comprising a memory and a processor, the memory having stored therein a computer program, the processor when executing the computer program performing the steps of:
Responding to the evaluation instruction, and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated;
Performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress step;
and according to the result of the stress test, obtaining the evaluation result of the electronic component to be evaluated.
In one embodiment, the processor when executing the computer program further performs the steps of:
acquiring an actual stress maximum value and a stress specification limit value corresponding to the type of the stress to be evaluated of the electronic component to be evaluated;
And determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of the stress test according to the actual stress maximum value and the stress specification limit value.
In one embodiment, the processor when executing the computer program further performs the steps of:
Taking the minimum value of the actual stress maximum value and the stress specification limit value as the test initial stress value;
Multiplying the maximum value of the actual stress and the maximum value in the stress specification limit value by a preset multiple to obtain the test termination stress value;
and determining the stress step according to the test initial stress value and the test final stress value.
In one embodiment, the processor when executing the computer program further performs the steps of:
acquiring a plurality of stress values participating in the test according to the test initial stress value, the test ending stress value and the stress stepping;
and according to the magnitude relation of the stress values participating in the test, sequentially performing functional test and key performance parameter test until the stress value participating in the stress test is not smaller than the test termination stress value, and ending the stress test.
In one embodiment, the processor when executing the computer program further performs the steps of:
before the stress test is executed, under the condition of no stress application, testing the qualification of the electronic component to be evaluated;
And executing the stress test on the electronic component to be evaluated under the condition that the test result of the qualification test is qualified.
In one embodiment, the processor when executing the computer program further performs the steps of:
under the condition that the stress type is the electric stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the electric stress according to a circuit simulation test;
Under the condition that the stress type is the thermal stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the thermal stress according to an environmental simulation test;
and under the condition that the stress type is the mechanical stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the mechanical stress according to running simulation test.
In one embodiment, a computer readable storage medium is provided having a computer program stored thereon, which when executed by a processor, performs the steps of:
Responding to the evaluation instruction, and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated;
Performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress step;
and according to the result of the stress test, obtaining the evaluation result of the electronic component to be evaluated.
In one embodiment, the computer program when executed by the processor further performs the steps of:
acquiring an actual stress maximum value and a stress specification limit value corresponding to the type of the stress to be evaluated of the electronic component to be evaluated;
And determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of the stress test according to the actual stress maximum value and the stress specification limit value.
Taking the minimum value of the actual stress maximum value and the stress specification limit value as the test initial stress value;
Multiplying the maximum value of the actual stress and the maximum value in the stress specification limit value by a preset multiple to obtain the test termination stress value;
and determining the stress step according to the test initial stress value and the test final stress value.
In one embodiment, the computer program when executed by the processor further performs the steps of:
acquiring a plurality of stress values participating in the test according to the test initial stress value, the test ending stress value and the stress stepping;
and according to the magnitude relation of the stress values participating in the test, sequentially performing functional test and key performance parameter test until the stress value participating in the stress test is not smaller than the test termination stress value, and ending the stress test.
In one embodiment, the computer program when executed by the processor further performs the steps of:
before the stress test is executed, under the condition of no stress application, testing the qualification of the electronic component to be evaluated;
And executing the stress test on the electronic component to be evaluated under the condition that the test result of the qualification test is qualified.
In one embodiment, the computer program when executed by the processor further performs the steps of:
under the condition that the stress type is the electric stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the electric stress according to a circuit simulation test;
Under the condition that the stress type is the thermal stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the thermal stress according to an environmental simulation test;
and under the condition that the stress type is the mechanical stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the mechanical stress according to running simulation test.
In one embodiment, a computer program product is provided comprising a computer program which, when executed by a processor, performs the steps of:
Responding to the evaluation instruction, and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated;
Performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress step;
and according to the result of the stress test, obtaining the evaluation result of the electronic component to be evaluated.
In one embodiment, the computer program when executed by the processor further performs the steps of:
acquiring an actual stress maximum value and a stress specification limit value corresponding to the type of the stress to be evaluated of the electronic component to be evaluated;
And determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of the stress test according to the actual stress maximum value and the stress specification limit value.
In one embodiment, the computer program when executed by the processor further performs the steps of:
Taking the minimum value of the actual stress maximum value and the stress specification limit value as the test initial stress value;
Multiplying the maximum value of the actual stress and the maximum value in the stress specification limit value by a preset multiple to obtain the test termination stress value;
and determining the stress step according to the test initial stress value and the test final stress value.
In one embodiment, the computer program when executed by the processor further performs the steps of:
acquiring a plurality of stress values participating in the test according to the test initial stress value, the test ending stress value and the stress stepping;
and according to the magnitude relation of the stress values participating in the test, sequentially performing functional test and key performance parameter test until the stress value participating in the stress test is not smaller than the test termination stress value, and ending the stress test.
In one embodiment, the computer program when executed by the processor further performs the steps of:
before the stress test is executed, under the condition of no stress application, testing the qualification of the electronic component to be evaluated;
And executing the stress test on the electronic component to be evaluated under the condition that the test result of the qualification test is qualified.
In one embodiment, the computer program when executed by the processor further performs the steps of:
under the condition that the stress type is the electric stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the electric stress according to a circuit simulation test;
Under the condition that the stress type is the thermal stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the thermal stress according to an environmental simulation test;
and under the condition that the stress type is the mechanical stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the mechanical stress according to running simulation test.
It should be noted that, the user information (including but not limited to user equipment information, user personal information, etc.) and the data (including but not limited to data for analysis, stored data, presented data, etc.) related to the present application are information and data authorized by the user or sufficiently authorized by each party, and the collection, use and processing of the related data need to comply with the related laws and regulations and standards of the related country and region.
Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, database, or other medium used in embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high density embedded nonvolatile Memory, resistive random access Memory (ReRAM), magneto-resistive random access Memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric Memory (Ferroelectric Random Access Memory, FRAM), phase change Memory (PHASE CHANGE Memory, PCM), graphene Memory, and the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, and the like. By way of illustration, and not limitation, RAM can be in various forms such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), etc. The databases referred to in the embodiments provided herein may include at least one of a relational database and a non-relational database. The non-relational database may include, but is not limited to, a blockchain-based distributed database, and the like. The processor referred to in the embodiments provided in the present application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic unit, a data processing logic unit based on quantum computing, or the like, but is not limited thereto.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the application and are described in detail herein without thereby limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be assessed as that of the appended claims.
Claims (10)
1. An evaluation method for an electronic component, the method comprising:
Responding to the evaluation instruction, and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of a stress test according to the type of the stress to be evaluated;
Performing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress step;
and according to the result of the stress test, obtaining the evaluation result of the electronic component to be evaluated.
2. The method of claim 1, wherein determining the corresponding test initiation stress value, test termination stress value, and stress step for the stress test based on the type of stress to be evaluated comprises:
acquiring an actual stress maximum value and a stress specification limit value corresponding to the type of the stress to be evaluated of the electronic component to be evaluated;
And determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of the stress test according to the actual stress maximum value and the stress specification limit value.
3. The method of claim 2, wherein determining the corresponding test initiation stress value, test termination stress value, and stress step for the stress test based on the actual stress maximum and the stress specification limit comprises:
Taking the minimum value of the actual stress maximum value and the stress specification limit value as the test initial stress value;
Multiplying the maximum value of the actual stress and the maximum value in the stress specification limit value by a preset multiple to obtain the test termination stress value;
and determining the stress step according to the test initial stress value and the test final stress value.
4. The method of claim 1, wherein the stress test comprises a functional test and a critical performance parameter test; and performing a stress test on the electronic component to be evaluated according to the test start stress value, the test end stress value and the stress step, including:
acquiring a plurality of stress values participating in the test according to the test initial stress value, the test ending stress value and the stress stepping;
and according to the magnitude relation of the stress values participating in the test, sequentially performing functional test and key performance parameter test until the stress value participating in the stress test is not smaller than the test termination stress value, and ending the stress test.
5. The method according to claim 1, wherein the method further comprises:
before the stress test is executed, under the condition of no stress application, testing the qualification of the electronic component to be evaluated;
And executing the stress test on the electronic component to be evaluated under the condition that the test result of the qualification test is qualified.
6. The method of claim 2, wherein the stress type comprises one of electrical stress, thermal stress, or mechanical stress; the process for obtaining the actual stress maximum value corresponding to the stress type to be evaluated of the electronic component to be evaluated comprises the following steps:
under the condition that the stress type is the electric stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the electric stress according to a circuit simulation test;
Under the condition that the stress type is the thermal stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the thermal stress according to an environmental simulation test;
and under the condition that the stress type is the mechanical stress, acquiring a corresponding actual stress maximum value when the stress type to be evaluated is the mechanical stress according to running simulation test.
7. An evaluation device for an electronic component, the device comprising:
the type acquisition module is used for responding to the evaluation instruction and acquiring the stress type required to be evaluated by the electronic component to be evaluated;
the numerical value determining module is used for determining a corresponding test initial stress value, a corresponding test ending stress value and a corresponding stress step of the stress test according to the type of the stress to be evaluated;
The test execution module is used for executing a stress test on the electronic component to be evaluated according to the test initial stress value, the test final stress value and the stress stepping;
And the result acquisition module is used for acquiring the evaluation result of the electronic component to be evaluated according to the result of the stress test.
8. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor implements the steps of the method of any of claims 1 to 6 when the computer program is executed.
9. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 1 to 6.
10. A computer program product comprising a computer program, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410308136.2A CN118194814A (en) | 2024-03-18 | 2024-03-18 | Evaluation method, device, equipment, medium and product for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410308136.2A CN118194814A (en) | 2024-03-18 | 2024-03-18 | Evaluation method, device, equipment, medium and product for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118194814A true CN118194814A (en) | 2024-06-14 |
Family
ID=91414794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410308136.2A Pending CN118194814A (en) | 2024-03-18 | 2024-03-18 | Evaluation method, device, equipment, medium and product for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118194814A (en) |
-
2024
- 2024-03-18 CN CN202410308136.2A patent/CN118194814A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114357812B (en) | Product reliability test method and device, computer equipment and storage medium | |
| CN115841046B (en) | Accelerated degradation test data processing method and device based on wiener process | |
| US20130111268A1 (en) | Testing device capable of simulating plugging and unplugging operations and method thereof | |
| CN116227240B (en) | Product life evaluation method, device and equipment based on comprehensive stress acceleration test | |
| CN115795928B (en) | Gamma process-based accelerated degradation test data processing method and device | |
| CN116069571A (en) | Storage device performance automatic test method, device, equipment and storage medium | |
| CN114355094B (en) | Product reliability weak link comprehensive evaluation method and device based on multi-source information | |
| CN113946986A (en) | Method and device for evaluating average time before product failure based on accelerated degradation test | |
| CN112416670A (en) | Hard disk test method, device, server and storage medium | |
| CN113946983A (en) | Method and device for evaluating weak links of product reliability and computer equipment | |
| CN112420117B (en) | Method, device, computer equipment and storage medium for testing SRAM | |
| CN118194814A (en) | Evaluation method, device, equipment, medium and product for electronic component | |
| CN111696618A (en) | Method and system for testing power-on and power-off stability of SSD (solid State disk) | |
| CN114384365A (en) | Method, device and equipment for determining weak link test scheme of exposed product | |
| CN111340349B (en) | Product reliability evaluation method, device, computer equipment and storage medium | |
| CN115792582B (en) | Chip testing method, device and equipment | |
| CN116051518B (en) | Trojan horse position positioning method, trojan horse position positioning device, computer equipment and storage medium | |
| CN114356061B (en) | Power failure detection method, device, system and detection equipment | |
| CN115061866B (en) | Analog data generation method, system and computer equipment | |
| CN113986142B (en) | Disk fault monitoring method, device, computer equipment and storage medium | |
| CN116795723B (en) | Chain unit test processing method and device and computer equipment | |
| US20210173994A1 (en) | Method and system for viewing simulation signals of a digital product | |
| CN118191559A (en) | CPLD reliability test method, CPLD reliability test device, computer equipment and storage medium | |
| CN117930017A (en) | Health state determining method and device based on machine learning and computer equipment | |
| CN116483721A (en) | Medical equipment software testing method and device, computer equipment and storage medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination |