CN118073263A - Chip high-efficiency suction device compatible with normal mounting and flip chip - Google Patents
Chip high-efficiency suction device compatible with normal mounting and flip chip Download PDFInfo
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- CN118073263A CN118073263A CN202410470770.6A CN202410470770A CN118073263A CN 118073263 A CN118073263 A CN 118073263A CN 202410470770 A CN202410470770 A CN 202410470770A CN 118073263 A CN118073263 A CN 118073263A
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Abstract
The invention discloses a chip high-efficiency suction device compatible with normal mounting and flip chip, which comprises a rotary suction module, a transfer bearing module and a chip feeding plate, wherein the rotary suction module comprises a second motor, a rotary bracket driven by the second motor to rotate around an X axis, a third motor fixed on the rotary bracket and a chip suction nozzle driven by the third motor to perform telescopic movement; the transfer bearing module comprises a fourth motor, a second supporting plate driven by the fourth motor to move left and right, a fifth motor fixed on the second supporting plate and a chip bearing plate driven by the fifth motor to move up and down; the chip suction nozzle sucks the chip at the horizontal material taking position, and downwards overturns for 90 degrees to release the chip on the chip feeding plate according to the normal assembly requirement, or upwards overturns for 90 degrees to release the chip on the chip receiving plate according to the flip assembly requirement, and the chip receiving plate downwards moves to release the chip on the chip feeding plate. The invention is compatible with the chip material taking of the forward mounting and the flip-chip technology, and has high efficiency and fast beat.
Description
Technical Field
The invention belongs to the technical field of chip feeding, and particularly relates to a chip efficient suction device compatible with normal mounting and flip mounting.
Background
With the development of technology, many intelligent products are emerging on the market, and most of the intelligent products are provided with special chips, and the chips are electronic components which are commonly used in the electronic industry at present. The chip mounting process is one of the important processes of the chip packaging process, and according to different packaging requirements, the chip mounting process comprises a flip-chip process and a forward-mounting process; in the forward mounting process, the mounting equipment generally adopts a horizontal crystal disc to feed the wafer chips, then utilizes an adsorption mechanism to absorb a single chip on a positioning platform, and utilizes a mounting suction nozzle to absorb the chip on the positioning platform to mount the chip on a set position, as disclosed in patent publication No. CN116153820A in the prior art, and a full-automatic mixed mounting equipment and a mounting method for the chips; if the flip-chip process is required, the mounting equipment also adopts a horizontal crystal disc to feed the wafer chips, then utilizes an extraction suction nozzle with the functions of overturning and lifting to suck a single chip from the crystal disc, then overturns 180 degrees to the reverse side upwards, and then the mounting suction nozzle sucks the chip from the extraction suction nozzle to mount, as a multifunctional chip assembly all-in-one machine disclosed in patent publication No. CN117059519A in the prior art. However, the chip sucking and feeding devices have the following disadvantages:
(1) The wafer disc is required to be clamped and fixed by the clamp, and a two-dimensional transfer mechanism is required to be configured to realize the position movement of a horizontal plane so that the mounting suction nozzle or the extracting suction nozzle can absorb each chip on the wafer disc, the wafer disc in the device is horizontally arranged, the mounting suction nozzle needs to be moved to the center position of wafer ring feeding during movement, the movement path is long, only one chip is absorbed by one back and forth action, and the chip absorption efficiency is low; and the occupied space of the equipment is large;
(2) If flip-chip is to be realized, each chip needs to be subjected to the processes of sucking the chip by the extraction nozzle, turning over 180 degrees and sucking the chip by the mounting head from the extraction nozzle, and the extraction nozzle sucks the chip and turns over 180 degrees to release the chip and then turns over 180 degrees again to return to the material taking position, so that 360 degrees of turning over are needed in one period, the time consumption is high, and the sucking efficiency is reduced.
Therefore, it is necessary to provide a new efficient suction device compatible with the normal mounting and flip chip to solve the above technical problems.
Disclosure of Invention
The invention mainly aims to provide the efficient chip sucking device compatible with forward mounting and flip mounting, which can be compatible with the requirements of the forward mounting and flip mounting processes of chips, and has the advantages of small structure, high chip sucking efficiency and fast beat.
The invention realizes the aim through the following technical scheme: a chip efficient suction device compatible with normal and flip-chip mounting, comprising:
The rotary suction module comprises a second motor, a rotary bracket driven by the second motor to rotate around an X axis, a third motor fixed on the rotary bracket and a chip suction nozzle driven by the third motor to perform telescopic motion perpendicular to the X axis, and the chip suction nozzle is driven by the second motor to perform rotary motion between a horizontal material taking position and an upper material discharging position or between a horizontal material taking position and a lower material discharging position to realize position switching;
The transfer bearing module comprises a fourth motor, a second supporting plate driven by the fourth motor to move left and right, a fifth motor fixed on the second supporting plate and a chip bearing plate driven by the fifth motor to move up and down;
A chip feed plate;
The lower surface of the chip receiving plate and the upper surface of the chip feeding plate are respectively provided with a plurality of bearing positions which are distributed along the left-right direction, and the bearing positions are provided with adsorption holes;
the chip receiving plate receives the chip released by the chip suction nozzle at the loading and unloading position; the chip feeding plate is used for receiving the chips released by the chip suction nozzles at the discharging position or receiving the chips released by the chip receiving plate at the side of the discharging position.
Further, the device also comprises a mounting vertical plate, a first motor fixed on the mounting vertical plate and a first supporting plate driven by the first motor to move left and right; the rotary sucking module and the transfer bearing module are fixed on the first supporting plate, so that sucking of all chips in the same row on the wafer disc is realized.
Further, the third motor body is arranged parallel to the rotation axis of the second motor, and the rotation axis of the third motor is collinear with the rotation axis of the second motor; the chip suction nozzle is characterized in that a sliding block seat sliding in the direction perpendicular to the X axis is arranged in the rotating support, a first gear is arranged at the rotating end of the third motor, a first rack meshed with the first gear is arranged on the sliding block seat, and the chip suction nozzle is fixed on the front side surface of the sliding block seat.
Further, the rotary bracket comprises an upper connecting plate, a lower connecting plate and left and right side plates; the upper connecting plate, the lower connecting plate and the left and right side plates jointly surround to form a hollow cavity with an open structure at the front side; the third motor is fixed in the hollow cavity; the inner wall surface of the hollow cavity is provided with a chute or a slide rail, and the slide block seat is in matched sliding connection with the chute or the slide rail.
Further, an avoidance groove is formed in one side surface of the sliding block seat facing the third motor, the first rack is installed at the top of the avoidance groove in a way that the tooth surface faces downwards or at the bottom of the avoidance groove in a way that the tooth surface faces upwards, and the first gear installed at the rotating end of the third motor stretches into the avoidance groove to be meshed with the first rack.
Further, the chip suction nozzle is mounted on the front side surface of the sliding block seat in a locking mode through screws.
Further, a pair of first sliding rails extending leftwards and rightwards are arranged on the first supporting plate, and the second supporting plate is arranged on the first sliding rails in a sliding manner through a sliding block; the fourth motor body is distributed left and right, the movable tail end is provided with a left and right extending screw rod, and the second support plate is fixedly provided with a nut sleeve which is sleeved on the screw rod and is matched with the screw rod for transmission.
Further, a second sliding rail which extends vertically is arranged on the second supporting plate, an upright connecting plate is arranged on the second sliding rail in a sliding mode, and the chip bearing plate is fixed to the bottom of the upright connecting plate in a horizontal plate structure.
Further, the fifth motor body is fixed on the second supporting plate in the left-right direction and is positioned between the two first sliding rails; the rotating end of the fifth motor is provided with a second gear, and the vertical connecting plate is provided with a second rack which is meshed with the second gear and extends vertically.
Further, the chip feeding plate is driven by a horizontal transfer module to move left and right.
Compared with the prior art, the efficient chip sucking device compatible with normal mounting and flip chip has the beneficial effects that:
(1) The chip suction nozzle for sucking the chip is provided with a rotating function, a chip receiving plate is arranged above the chip suction nozzle, a chip feeding plate is arranged below the chip suction nozzle, the chip receiving plate and the chip feeding plate are respectively used for receiving materials above and below the chip suction nozzle, and the front feeding of the chip and the back feeding of the chip are realized by utilizing the rotating movement of the chip suction nozzle, so that the chip suction nozzle is suitable for the process requirement of the front chip and the process requirement of the flip chip, and the universality of the chip feeding device is improved;
(2) The chip suction nozzle adopts a mode of horizontally sucking chips to realize the material taking of the chips, the horizontal telescopic distance is very short, and the efficiency of a single chip suction nozzle is very high; because the rotating radius is small and the rotating load moment is small, the chip suction nozzle can rotate at high speed; in addition, the chip suction nozzle is provided with two discharging positions, and only needs to rotate 90 degrees, so that the chip can be rotated from the discharging position to realize the high-rotation switching position, the processes of sucking the chip at high speed and releasing the chip at high speed by the chip suction nozzle are realized, and the chip sucking and feeding efficiency is improved;
(3) The chip receiving plate and the feeding plate are respectively provided with a plurality of receiving positions, so that a plurality of chips can be received, and the chip receiving plate can move downwards to transfer the chips onto the chip feeding plate after receiving the inverted chips, so that the chips are uniformly output and fed by the chip feeding plate no matter positively installed or reversely installed, and the feeding of the chips can be realized at one time, and the feeding efficiency is improved.
Drawings
FIG. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a schematic side view of an embodiment of the present invention;
FIG. 3 is a schematic view of a partially exploded view of an embodiment of the present invention;
FIG. 4 is a schematic diagram of a rotary suction module according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a part of an exploded structure of a rotary suction module according to an embodiment of the present invention;
the figures represent the numbers:
100-compatible chip high-efficiency suction device of forward and reverse installation;
200-chip feeding plate, 201-adsorption hole;
1-a first motor;
2-a first supporting plate and 21-a first sliding rail;
The device comprises a 3-rotary suction module, a 31-second motor, a 32-rotary support, a 321-upper connecting plate, a 322-lower connecting plate, 323-left and right side plates, a 324-hollow cavity, a 325-chute, a 33-third motor, a 34-chip suction nozzle, a 35-slide block seat, a 351-avoidance groove, a 36-first rack, a 37-first gear, a 38-bearing seat and a 39-coupling;
4-transferring bearing modules, 41-fourth motors, 42-second supporting plates, 43-fifth motors, 44-chip bearing plates, 45-screw rods, 46-nut sleeves, 47-second sliding rails, 48-vertical connecting plates, 49-second gears and 410-second racks;
And 5-installing a vertical plate.
Detailed Description
Embodiment one:
Referring to fig. 1-5, the present embodiment is a chip efficient sucking device 100 compatible with normal mounting and flip-chip mounting, which includes a mounting vertical plate 5, a first motor 1 fixed on the mounting vertical plate 5, a first support plate 2 driven by the first motor 1 to move left and right, a rotary sucking module 3 fixed on the first support plate 2 for sucking chips, and a transfer bearing module 4 fixed on the first support plate 2 and located above the rotary sucking module 3.
The rotary suction module 3 comprises a second motor 31 fixed on the first support plate 2, a rotary bracket 32 driven by the second motor 31 to rotate around the X axis, a third motor 33 fixed on the rotary bracket 32, and a chip suction nozzle 34 driven by the third motor 33 to move back and forth, wherein the chip suction nozzle 34 is driven by the second motor 31 to switch the rotary position between a horizontal material taking position and an upper material discharging position or between the horizontal material taking position and a lower material discharging position, and the chip suction nozzle 34 is driven by the third motor 33 to suck a horizontal telescopic chip in the horizontal material taking position; in either the upper or lower discharge position, the chip suction nozzle 34 vents to release the chip.
When the chip suction nozzle 34 sucks chips, the chips are horizontally faced to the crystal disc, the left and right positions of the chip suction nozzle 34 are adjusted through the first motor 1, so that the chips in the same row can be sucked, and the chips in all rows can be sucked through adjusting the upper and lower positions of the crystal disc; after the chip suction nozzle 34 is aligned with the chip to be sucked, the third motor 33 drives the chip suction nozzle 34 to extend horizontally to suck the chip while being matched with the chip ejection unit to eject the chip; then the sucked chips are turned down for 90 degrees to face upwards according to the front surface mounting requirement, the chips are just placed on the chip feeding plate 200, or the sucked chips are turned up for 90 degrees to face upwards according to the flip-chip mounting requirement, and the chips are just placed on the transfer bearing module 4; after the transfer bearing module 4 is fully filled with a set number of chips, the whole group of chips are downwards transferred onto the chip feeding plate 200, and the chips are sent out by the chip feeding plate 200, so that the disposable feeding of a plurality of chips is realized.
In order to improve the frequency of sucking the chip by the chip suction nozzle 34 and further improve the efficiency of sucking the chip, in this embodiment, the overturning radius of the chip suction nozzle 34 is reduced as much as possible through the structural design of the rotary sucking module 3, and as the radial telescopic movement of the chip suction nozzle 34 relative to the rotation axis is to be realized, the radial telescopic movement precision of the chip suction nozzle 34 is also ensured, the radial telescopic movement driving of the chip suction nozzle 34 is performed by the third motor 33, but the volume of the third motor 33 is large, if the conventional screw-nut transmission is adopted, on one hand, the volume of the rotary bracket 32 is greatly increased, and on the other hand, the rotary load moment of the second motor 31 is greatly increased, so that the high-speed rotary driving cannot be realized. Therefore, in the present embodiment, the body of the third motor 33 is disposed in the rotating bracket 32 in parallel to the rotation axis of the second motor 31, and the central axis of the third motor 33 is collinear with the rotation axis of the second motor 31, reducing the rotational load moment of the second motor 31 as much as possible.
The rotating bracket 32 includes an upper connecting plate 321, a lower connecting plate 322, and left and right side plates 323; the upper connecting plate 321, the lower connecting plate 322 and the left and right side plates 323 jointly surround to form a hollow cavity 324 with an open structure at the front side; the third motor 33 is fixed in the hollow cavity 324, the inner wall surface of the hollow cavity 324 is provided with a sliding groove 325 extending radially, a sliding seat 35 matched with the sliding groove 325 is arranged in the sliding groove 325 in a sliding manner, the chip suction nozzle 34 is fixed on the front side surface of the sliding seat 35, an avoidance groove 351 is formed in the surface, facing the third motor 33, of the sliding seat 35, a first rack 36 facing downwards or upwards is arranged in the avoidance groove 351, and a first gear 37 extending into the avoidance groove 351 and meshed with the first rack 36 is arranged at the rotating end of the third motor 33. The third motor 33 drives the first gear 37 to rotate, and the sliding block seat 35 is driven to perform front-back telescopic movement under the meshing transmission of the first gear 37 and the first rack 36, so that the telescopic movement of the chip suction nozzle 34 is realized. The sliding fit between the hollow cavity 324 and the slide block seat 35 can also be realized by arranging a sliding rail in the hollow cavity 324 and arranging a sliding groove structure on the slide block seat 35 in a matching way.
Through the structural layout of the third motor 33 and the adoption of rack-and-pinion transmission, the telescopic motion of the chip suction nozzle 34 is realized, so that the circumferential dimension of the rotary bracket 32 around the rotation axis of the rotary bracket can be designed to be smaller, the rotary load moment of the second motor 31 is reduced, and meanwhile, the main load weight is arranged along the rotation axis of the second motor 31, so that the load is greatly reduced, the overturning speed of the second motor 31 can be set faster, and the chip suction efficiency is improved.
The chip suction nozzle 34 is locked and installed on the front side surface of the slider seat 35 through a screw, and when the chip size on the wafer disc is changed, the chip suction nozzle 34 is only required to be replaced, so that the replacement is convenient and quick.
The left and right side plates 323 of the rotating bracket 32 are provided with support shafts, the first support plate 2 is provided with a bearing seat 38, and the support shafts are rotatably arranged on the bearing seat 38 through bearings; the support shaft at one end is connected to the rotating end of the second motor 31 through a coupling 39.
The transfer carrier module 4 comprises a fourth motor 41 fixed on the first support plate 2, a second support plate 42 driven by the fourth motor 41 to move left and right, a fifth motor 43 fixed on the second support plate 42, and a chip receiving plate 44 driven by the fifth motor 43 to move up and down and positioned above the rotating bracket 32.
The first support plate 2 is provided with a pair of first slide rails 21 extending from left to right, and the second support plate 42 is slidably provided on the first slide rails 21 by a slider. The fourth motor 41 body is distributed left and right, the movable tail end is provided with a left and right extending screw rod 45, and the second support plate 42 is fixedly provided with a nut sleeve 46 which is sleeved on the screw rod 45 and is matched and driven with the screw rod 45. The second support plate 42 is provided with a second slide rail 47 extending vertically, the second slide rail 47 is provided with an upright connecting plate 48 in a sliding manner, and the chip receiving plate 44 is fixed at the bottom of the upright connecting plate 48 in a horizontal plate structure.
The lower surface of the chip receiving plate 44 and the upper surface of the chip feeding plate 200 are arranged with a plurality of carrying positions (not labeled in the figure) along the left-right direction, and the carrying positions are provided with adsorption holes 201 for adsorbing the chips.
The chip feeding plate 200 is driven to move left and right by the horizontal transfer module.
In order to further improve the transfer speed of the first support plate 2, and design the whole volume of the suction device to be more miniaturized, in this embodiment, the fifth motor 43 body is fixed on the second support plate 42 in the left-right direction and is located between the two first slide rails 21, so that the load on the first support plate 2 is distributed vertically as much as possible, the load on the horizontal direction is avoided from extending, the transfer speed of the first support plate 2 and the second support plate 42 is improved to be faster, and the chip suction efficiency is improved and the whole miniaturization design of the suction device is realized. The rotating end of the fifth motor 43 is provided with a second gear 49, and the upright connecting plate 48 is provided with a second rack 410 which is meshed with the second gear 49 and extends vertically.
The chip receiving plate 44 is driven to move left and right by the fourth motor 41, so that all receiving positions on the chip receiving plate 44 sequentially move to a receiving position to receive chips released by the chip suction nozzles 34, a plurality of chips are output at one time, and the chip feeding efficiency is improved.
The working principle of the chip efficient suction device 100 compatible with normal mounting and flip-chip mounting in this embodiment is as follows: the chip suction nozzle 34 is a crystal disc in a horizontal state and faces to an upright state, the first motor 1 drives the chip suction nozzle 34 to move left and right to align with a chip to be sucked, and the third motor 33 drives the chip suction nozzle 34 to extend out of the sucking chip horizontally; if the chip is mounted, the second motor 31 drives the chip suction nozzle 34 to rotate downwards by 90 degrees, and the front surface of the chip faces upwards, at this time, the chip feeding plate 200 is positioned right below the chip suction nozzle 34, and the chip suction nozzle 34 leaks air or stretches downwards to release the chip onto the chip feeding plate 200; the chip suction nozzle 34 reversely rotates by 90 degrees to return to a horizontal state to suck the next chip, the chip feeding plate 200 horizontally moves for a set distance, so that the next receiving position is aligned with the chip suction nozzle 34, after the chip feeding plate 200 is fully filled with a set number of chips, the chip feeding plate horizontally moves to a material taking position of the mounting equipment, and the chips are sucked before the mounting head; if the chip is flipped, the second motor 31 drives the chip suction nozzle 34 to rotate upwards by 90 degrees, the back surface of the chip faces upwards, at this time, the chip receiving plate 44 is positioned right above the chip suction nozzle 34, the chip suction nozzle 34 leaks air or stretches upwards, and the chip is released to the chip receiving plate 44; the chip suction nozzle 34 reversely rotates by 90 degrees to return to a horizontal state to suck the next chip, the fourth motor 41 drives the chip receiving plate 44 to horizontally move for a set distance, so that the next receiving position is aligned with the chip suction nozzle 34, after the chip receiving plate 44 is fully filled with a set number of chips, the fourth motor 41 drives the chip receiving plate 44 to move to a set position, the position avoids the rotary suction module 3, at the moment, the chip feeding plate 200 is positioned right below the chip receiving plate 44, the fifth motor 43 drives the chip receiving plate 44 to downwards move to be close to the chip feeding plate 200, the chip receiving plate 44 releases all chips to be transferred onto the chip feeding plate 200, and the chip feeding plate 200 sends a group of chips to a material taking position of the mounting equipment for sucking before the mounting head.
What has been described above is merely some embodiments of the present invention. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the invention.
Claims (10)
1. A compatible normal dress and high-efficient suction means of flip-chip which characterized in that: it comprises the following steps:
The rotary suction module comprises a second motor, a rotary bracket driven by the second motor to rotate around an X axis, a third motor fixed on the rotary bracket and a chip suction nozzle driven by the third motor to perform telescopic motion perpendicular to the X axis, and the chip suction nozzle is driven by the second motor to perform rotary motion between a horizontal material taking position and an upper material discharging position or between a horizontal material taking position and a lower material discharging position to realize position switching;
The transfer bearing module comprises a fourth motor, a second supporting plate driven by the fourth motor to move left and right, a fifth motor fixed on the second supporting plate and a chip bearing plate driven by the fifth motor to move up and down;
A chip feed plate;
The lower surface of the chip receiving plate and the upper surface of the chip feeding plate are respectively provided with a plurality of bearing positions which are distributed along the left-right direction, and the bearing positions are provided with adsorption holes;
The chip receiving plate receives the chip released by the chip suction nozzle at the loading and unloading position; the chip feeding plate is used for receiving the chips released by the chip suction nozzles at the lower discharging position or receiving the chips released by the chip receiving plate at the side of the lower discharging position.
2. The compatible front-loading and flip-chip high efficiency suction device of claim 1, wherein: the device also comprises a mounting vertical plate, a first motor fixed on the mounting vertical plate and a first supporting plate driven by the first motor to move left and right; the rotary sucking module and the transfer bearing module are fixed on the first supporting plate, so that sucking of all chips in the same row on the wafer disc is realized.
3. The compatible front-loading and flip-chip high efficiency suction device of claim 1, wherein: the third motor body is arranged parallel to the rotation axis of the second motor, and the rotation axis of the third motor is collinear with the rotation axis of the second motor; the chip suction nozzle is characterized in that a sliding block seat sliding in the direction perpendicular to the X axis is arranged in the rotating support, a first gear is arranged at the rotating end of the third motor, a first rack meshed with the first gear is arranged on the sliding block seat, and the chip suction nozzle is fixed on the front side surface of the sliding block seat.
4. The positive and flip-chip compatible efficient suction device according to claim 3, wherein: the rotary support comprises an upper connecting plate, a lower connecting plate and left and right side plates; the upper connecting plate, the lower connecting plate and the left and right side plates jointly surround to form a hollow cavity with an open structure at the front side; the third motor is fixed in the hollow cavity; the inner wall surface of the hollow cavity is provided with a chute or a slide rail, and the slide block seat is in matched sliding connection with the chute or the slide rail.
5. The positive and flip-chip compatible efficient suction device according to claim 3, wherein: the sliding block seat faces to one side surface of the third motor, an avoidance groove is formed in the side surface of the sliding block seat, the first rack is installed on the top of the avoidance groove in a tooth surface downward mode or installed on the bottom of the avoidance groove in a tooth surface upward mode, and the first gear installed at the rotating end of the third motor stretches into the avoidance groove to be meshed with the first rack.
6. The positive and flip-chip compatible efficient suction device according to claim 3, wherein: the chip suction nozzle is locked and installed on the front side surface of the sliding block seat through a screw.
7. The compatible front-loading and flip-chip high efficiency suction device according to claim 2, wherein: a pair of first sliding rails extending leftwards and rightwards are arranged on the first supporting plate, and the second supporting plate is arranged on the first sliding rails in a sliding manner through a sliding block; the fourth motor body is distributed left and right, the movable tail end is provided with a left and right extending screw rod, and the second support plate is fixedly provided with a nut sleeve which is sleeved on the screw rod and is matched with the screw rod for transmission.
8. The compatible front-loading and flip-chip high efficiency suction device of claim 1, wherein: the chip is characterized in that a second sliding rail which extends vertically is arranged on the second supporting plate, an upright connecting plate is arranged on the second sliding rail in a sliding mode, and the chip bearing plate is fixed at the bottom of the upright connecting plate in a horizontal plate structure.
9. The compatible front-loading and flip-chip high efficiency suction device of claim 8, wherein: the fifth motor body is fixed on the second supporting plate in the left-right direction; the rotating end of the fifth motor is provided with a second gear, and the vertical connecting plate is provided with a second rack which is meshed with the second gear and extends vertically.
10. The compatible front-loading and flip-chip high efficiency suction device of claim 1, wherein: the chip feeding plate is driven by a horizontal transfer module to move left and right.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410470770.6A CN118073263A (en) | 2024-04-18 | 2024-04-18 | Chip high-efficiency suction device compatible with normal mounting and flip chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410470770.6A CN118073263A (en) | 2024-04-18 | 2024-04-18 | Chip high-efficiency suction device compatible with normal mounting and flip chip |
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|---|---|
| CN118073263A true CN118073263A (en) | 2024-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410470770.6A Pending CN118073263A (en) | 2024-04-18 | 2024-04-18 | Chip high-efficiency suction device compatible with normal mounting and flip chip |
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| CN (1) | CN118073263A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10125699A (en) * | 1996-10-23 | 1998-05-15 | Matsushita Electric Ind Co Ltd | Die-bonding device |
| EP0895450A2 (en) * | 1997-07-28 | 1999-02-03 | Matsushita Electric Industrial Co., Ltd. | Component feeder and mounter |
| JP2009147132A (en) * | 2007-12-14 | 2009-07-02 | Hitachi High-Tech Instruments Co Ltd | Chip component mounting device |
| KR20130051254A (en) * | 2011-11-09 | 2013-05-20 | 삼성테크윈 주식회사 | Multiplication system of flip chip mounters |
| JP5544461B1 (en) * | 2013-01-15 | 2014-07-09 | 上野精機株式会社 | Attitude correction device, electronic component transfer device, and electronic component transfer device |
| KR20170006343A (en) * | 2015-07-07 | 2017-01-18 | 주식회사 프로텍 | Apparatus and Method for Bonding Flip Chip |
| CN109950188A (en) * | 2017-12-20 | 2019-06-28 | 安世有限公司 | Equipment and system |
| CN114464557A (en) * | 2015-05-12 | 2022-05-10 | 安世有限公司 | Method and system for transferring semiconductor devices from a wafer to a carrier structure |
| CN115410939A (en) * | 2021-05-26 | 2022-11-29 | 苏州艾科瑞思智能装备股份有限公司 | High-speed high-precision reverse loading machine |
-
2024
- 2024-04-18 CN CN202410470770.6A patent/CN118073263A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10125699A (en) * | 1996-10-23 | 1998-05-15 | Matsushita Electric Ind Co Ltd | Die-bonding device |
| EP0895450A2 (en) * | 1997-07-28 | 1999-02-03 | Matsushita Electric Industrial Co., Ltd. | Component feeder and mounter |
| JP2009147132A (en) * | 2007-12-14 | 2009-07-02 | Hitachi High-Tech Instruments Co Ltd | Chip component mounting device |
| KR20130051254A (en) * | 2011-11-09 | 2013-05-20 | 삼성테크윈 주식회사 | Multiplication system of flip chip mounters |
| JP5544461B1 (en) * | 2013-01-15 | 2014-07-09 | 上野精機株式会社 | Attitude correction device, electronic component transfer device, and electronic component transfer device |
| CN114464557A (en) * | 2015-05-12 | 2022-05-10 | 安世有限公司 | Method and system for transferring semiconductor devices from a wafer to a carrier structure |
| KR20170006343A (en) * | 2015-07-07 | 2017-01-18 | 주식회사 프로텍 | Apparatus and Method for Bonding Flip Chip |
| CN109950188A (en) * | 2017-12-20 | 2019-06-28 | 安世有限公司 | Equipment and system |
| CN115410939A (en) * | 2021-05-26 | 2022-11-29 | 苏州艾科瑞思智能装备股份有限公司 | High-speed high-precision reverse loading machine |
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