CN118034410A - Etching solution atomization spraying temperature control device and method - Google Patents
Etching solution atomization spraying temperature control device and method Download PDFInfo
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- CN118034410A CN118034410A CN202410439614.3A CN202410439614A CN118034410A CN 118034410 A CN118034410 A CN 118034410A CN 202410439614 A CN202410439614 A CN 202410439614A CN 118034410 A CN118034410 A CN 118034410A
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- 238000005530 etching Methods 0.000 title claims abstract description 161
- 238000005507 spraying Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000000889 atomisation Methods 0.000 title claims description 13
- 239000007788 liquid Substances 0.000 claims abstract description 198
- 238000010438 heat treatment Methods 0.000 claims abstract description 136
- 238000005259 measurement Methods 0.000 claims abstract description 64
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 238000009688 liquid atomisation Methods 0.000 claims abstract description 8
- 238000003860 storage Methods 0.000 claims description 28
- 238000002156 mixing Methods 0.000 claims description 27
- 238000001802 infusion Methods 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 238000003756 stirring Methods 0.000 claims description 12
- 238000005485 electric heating Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 4
- 230000001154 acute effect Effects 0.000 claims description 3
- 230000001276 controlling effect Effects 0.000 description 6
- 239000000110 cooling liquid Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The invention belongs to the technical field of etching liquid treatment, and particularly discloses an etching liquid atomization spraying temperature control device and method, wherein the temperature control device comprises a compressed gas passing module, a liquid heating module, a gas heating module, a temperature control module, a liquid temperature feedback measurement module, a liquid flow measurement module, a gas temperature feedback measurement module and a gas flow measurement module, wherein the liquid heating module, the gas heating module, the liquid temperature feedback measurement module, the liquid flow measurement module, the gas temperature feedback measurement module and the gas flow measurement module are electrically connected with the temperature control module; the temperature control module calculates heating power required by reaching a preset gas-liquid temperature T according to the received temperature feedback and flow feedback, and adjusts the heating power of the liquid heating module and each gas heating unit so that the temperature of the gas-liquid mixture after the etching liquid and the compressed gas are mixed reaches the preset gas-liquid temperature T.
Description
Technical Field
The invention belongs to the technical field of etching liquid treatment, and particularly relates to an etching liquid atomization spraying temperature control device and method.
Background
When the circuit board is etched, the temperature of the etching solution is required to be kept within a proper process temperature range, otherwise, the etching quality of the circuit board is affected.
In the prior art, the utility model with the bulletin number of CN217008060U discloses a semiconductor etching cooling liquid temperature control device, the main classification number of which is G05D23/30, which relates to the field of semiconductor processing, and comprises a temperature control device body, wherein the temperature control device body comprises an outer shell, two sides of the outer shell are respectively communicated with a liquid inlet and a liquid outlet, an inclined baffle which divides the outer shell into two parts is arranged in the outer shell, and a liquid pump is arranged at the middle section of the inclined baffle; the extrusion assembly is arranged on one side inner wall of the outer shell and comprises an extrusion plate sliding downwards, the lower surface of the extrusion plate is provided with an electric heating wire, and the electric heating wire is in contact with cooling liquid and extrudes towards the liquid outlet. The liquid is input to one side of the liquid outlet through a liquid pump, when the temperature of the cooling liquid is low, the extrusion plate is used for driving the heating wire to contact with the liquid level, and the cooling liquid is regulated in temperature; the liquid level is extruded by the extrusion plate, so that the flow rate of the cooling liquid flowing out of the liquid outlet is faster, and the adjustment of the flow rate of the cooling liquid can be completed when the temperature adjustment is completed; another chinese patent publication No. CN115079748a discloses a method for controlling the temperature of an etching chamber, which has a main classification No. G05D23/30, and the method includes: when the downtime is abnormal in the production process of the etching machine, the initial temperature of the window at the upper part of the etching cavity is obtained, the window heater is started, the cooling device is closed, the temperature of the upper window is controlled to be adjusted to a preset temperature from the initial temperature, the temperature is kept warm until the etching machine resumes production, and the window heater is closed, the cooling device is started, so that the temperature of the upper window is increased to the production temperature of the etching process at a preset heating rate.
Along with the high-speed development of the current electronic industry, electronic integrated components are finer, thinner and finer, so that the arrangement lines of the circuit board are finer, and the traditional developing/etching device can only meet the requirement of line widths/line distances of more than 45um/45um, and the line widths/line distances of less than 45um are required to be used for the two-fluid precise developing/etching device. For circuit boards with line width/line distance below 45um, a gas-liquid mixed etching solution is also needed for secondary etching, during the secondary etching, compressed gas is mixed in the etching solution, the temperature of the compressed gas is usually far lower than that of the etching solution, if the compressed gas is mixed with the etching solution without heating, the temperature of the mixed gas-liquid mixed etching solution can not reach the process temperature, and the etching quality can be affected. However, the temperature control device for etching copper etching solution provided by the patent can only control the temperature of the etching solution, and cannot effectively control the temperature of the gas-liquid mixture of the etching solution and the compressed air, so that the quality of secondary etching is affected.
Disclosure of Invention
The invention aims to provide an etching liquid atomization spraying temperature control device and method, and aims to solve the problems that the conventional copper etching liquid etching temperature control device can only control the temperature of etching liquid, cannot effectively control the temperature of a gas-liquid mixture of the etching liquid and compressed air, and can influence the secondary etching quality.
In order to achieve the above object, according to a first aspect of the present invention, there is provided an etching liquid atomizing and spraying temperature control device, including a compressed gas passing module, a liquid heating module, a gas heating module, a temperature control module, a liquid temperature feedback measurement module, a liquid flow measurement module, a gas temperature feedback measurement module, and a gas flow measurement module, wherein the liquid heating module, the gas heating module, the liquid temperature feedback measurement module, the liquid flow measurement module, the gas temperature feedback measurement module, and the gas flow measurement module are all electrically connected with the temperature control module; the compressed gas passing module is provided with a heating area section which is divided into a plurality of compressed gas passing units according to the sequence of compressed gas passing paths, and the gas heating module comprises a plurality of gas heating units which are in one-to-one correspondence with the compressed gas passing units; the gas temperature feedback measurement module comprises a plurality of first temperature sensors which are in one-to-one correspondence with the compressed gas passing units and are arranged at the tail ends of the compressed gas passing units, and a second temperature sensor which is arranged at one side of the air inlet end of the heating area section, wherein the first temperature sensors are used for detecting the temperature of the compressed air at the tail ends of the corresponding compressed gas passing units and transmitting the temperature to the temperature control module; the temperature control module calculates heating power required by reaching a preset gas-liquid temperature T according to the received temperature feedback and flow feedback, and adjusts the heating power of the liquid heating module and each gas heating unit so that the temperature of the gas-liquid mixture after the etching liquid and the compressed gas are mixed reaches the preset gas-liquid temperature T.
Further, the liquid heating module comprises an electric heating element arranged in the etching liquid storage structure and a stirring device arranged on the etching liquid storage structure, wherein the stirring device is used for stirring the etching liquid stored in the etching liquid storage structure, so that the temperatures of the etching liquid at different positions in the etching liquid storage structure tend to be uniform.
Further, the liquid temperature feedback measurement module comprises a first thermometer and a second thermometer, and the first thermometer and the second thermometer are electrically connected with the temperature control module; the pipeline for conveying the etching liquid comprises an indoor section infusion pipe and an outdoor section infusion pipe, one end of the outdoor section infusion pipe is connected with the etching liquid conveying pump, the other end of the outdoor section infusion pipe is in contact with the etching treatment chamber, and the first thermometer is arranged on the etching liquid storage structure and is used for measuring the temperature of the etching liquid in the etching liquid storage structure and transmitting the measured value to the temperature control module; the second thermometer is arranged on the outdoor section infusion tube, is arranged at one end of the outdoor section infusion tube, which is contacted with the etching treatment chamber, and is used for measuring the temperature of etching liquid entering the indoor section infusion tube and transmitting the measured value to the temperature control module.
Further, the liquid flow measuring module is a liquid flowmeter, and the liquid flowmeter is arranged on the outdoor section infusion tube; the gas flow measuring module is a gas flowmeter, and the gas flowmeter is arranged on the compressed gas passing module and is positioned on one side of the heating area section, which is close to the gas source.
Further, the heating area section of the compressed gas passing module is a metal pipeline, the heating area section of the compressed gas passing module is positioned outside the etching treatment chamber, and one end of the heating area section, which is far away from the gas source, is in contact with the etching treatment chamber.
Further, the compressed gas passing unit comprises a heating area and a temperature measuring area, and the temperature measuring area is positioned at one side of the air outlet end of the heating area; the gas heating units are electric heating rings wrapped on the heating areas of the compressed gas passing units; and each first temperature sensor of the gas temperature feedback measurement module is respectively arranged on the temperature measuring area of each compressed gas passing unit and is respectively used for detecting the temperature of the compressed gas passing through the corresponding temperature measuring area and transmitting the detected value to the temperature control module.
Further, in each compressed gas passing unit of the heating area section, except for the first compressed gas passing unit in the sequence of the compressed gas passing paths, at least one compressed gas passing unit of each other compressed gas passing units comprises a heating area and a temperature measuring area, and a mixing area, wherein the mixing area is positioned at one side of the air inlet end of the heating area of the compressed gas passing unit where the mixing area is positioned, and a flow dividing element for dispersing air flow is arranged in the mixing area.
Further, the flow dividing element comprises a conical body, a first circular ring and a second circular ring, wherein the conical body, the first circular ring and the second circular ring and the metal pipeline are coaxial, and the tip end of the conical body faces the air inlet end; the first circular ring and the second circular ring are respectively arranged close to two ends of the conical body in the axial direction; the first circular ring is connected with the conical body through a group of first guide connecting plates, the second circular ring is connected with the conical body through a group of second guide connecting plates, the first guide connecting plates and the second guide connecting plates are respectively provided with a wind guiding surface which forms a certain acute angle with the axial direction of the metal pipeline, and the deflection directions of the wind guiding surfaces of the first circular ring and the conical body are opposite to the axial direction of the metal pipeline.
Further, the inner diameter of the pipeline of the mixing zone is larger than that of the heating zone, and the outer diameters of the first circular ring and the second circular ring are the same as that of the pipeline of the mixing zone; each first guide connecting plate is uniformly arranged along the circumferential direction of the first circular ring, each second guide connecting plate is uniformly arranged along the circumferential direction of the second circular ring, the number of the first guide connecting plates is the same as that of the second guide connecting plates, and each first guide connecting plate and each second guide connecting plate are sequentially staggered along the circumferential direction of the first circular ring or the second circular ring.
According to a second aspect of the present invention, there is provided a method for controlling an etching liquid spray temperature, using the etching liquid spray temperature control device, comprising the steps of:
s100, inputting an etching liquid atomization spraying temperature, namely a preset gas-liquid temperature T, to a temperature control module;
s200, controlling a liquid heating module to heat etching liquid by a temperature control module until the temperature is the same as the preset gas-liquid temperature T;
S300, when etching is performed, feeding back the temperature T1 of etching liquid in the etching liquid storage structure and the temperature T2 of the etching liquid in the etching liquid conveying pipeline entering the etching treatment chamber to a temperature control module through a liquid temperature feedback measurement module, wherein the temperature control module controls the start and stop of the liquid heating module according to the ratio of the temperature T1 to the preset gas-liquid temperature T, so that the temperature T1 tends to the preset gas-liquid temperature T; feeding back the original temperature T3 of the compressed gas to the temperature control module through a second temperature sensor of the gas temperature feedback measurement module, and feeding back the temperature T41 … … T4n of the compressed gas in the tail end of each compressed gas passing unit to the temperature control module through each first temperature sensor of the gas temperature feedback measurement module, wherein n is a positive integer, and the number of the n is the same as that of the first temperature sensors;
S400, feeding back the flow Q1 of the transmission etching liquid to the temperature control module through the liquid flow measurement module, and feeding back the flow Q2 of the transmission compressed gas to the temperature control module through the gas flow measurement module;
S500, controlling the heating power of each gas heating unit by the temperature control module according to the following formula ：W1=C2×Q2×ρ2×（T-T3）,W2=C2×Q2×ρ2×（T-T41）,...,W（n-1）=C2×Q2×ρ2×（T-T4（n-2））,Wn=C2×Q2×ρ2×（T-T4（n-1））+C1×Q1×ρ1×（T-T2）;
Wherein, W1, … … W (n-1), wn is the heating power of each gas heating unit along the flowing direction of the compressed gas, C1 is the specific heat capacity of the etching liquid, C2 is the specific heat capacity of the compressed gas, ρ1 is the density of the etching liquid, ρ2 is the density of the compressed gas.
Compared with the prior art, the invention has the following beneficial effects:
1. The invention can heat and control the temperature of the etching liquid and the compressed gas, and can obtain the etching liquid and the atomized spraying liquid of the compressed gas which meet the process temperature.
2. The heating power of each gas heating unit for heating the compressed gas is dynamically adjusted, and the adjustment of the heating power of the next gas heating unit depends on the exhaust temperature of the previous compressed gas passing unit along the conveying direction of the compressed gas, so that the temperature of the compressed gas can be easily and accurately reached to the required temperature finally after multiple measurement and adjustment, the accurate control of the heating temperature of the compressed gas is realized, the accurate control of the temperature of etching liquid and the atomized spraying liquid of the compressed gas is further realized, and the etching quality is effectively ensured.
3. The liquid heating module comprises the electric heating element arranged in the etching liquid storage structure and the stirring device arranged on the etching liquid storage structure, wherein the stirring device is used for stirring the etching liquid stored in the etching liquid storage structure, so that the temperature of the etching liquid at different positions in the etching liquid storage structure tends to be uniform, and the temperature feedback of the etching liquid in the etching liquid storage structure is more accurate.
4. The compressed gas passing unit comprises a heating area and a temperature measuring area, and also comprises a mixing area, wherein a flow dividing element for dispersing air flow is arranged in the mixing area, so that the compressed gas entering the mixing area can be well divided and dispersed through the action of the flow dividing element, and then mixed, the temperature distribution of the compressed gas is more uniform, the compressed gas with uniform temperature can be obtained, the measurement result of the gas temperature feedback measurement module is more accurate, and the temperature control of the gas-liquid mixture is more accurate.
Drawings
FIG. 1 is an electrical control structure block diagram of an etching solution atomizing spray temperature control device according to the invention;
FIG. 2 is a schematic view of a structure in which an etching liquid and a compressed gas are supplied to a gas-liquid mixing nozzle in an etching process chamber through an etching liquid supply pipe and a compressed gas supply pipe;
FIG. 3 is a schematic view of a portion of a heating zone section of a compressed gas passing module according to the present invention;
FIG. 4 is a schematic perspective view of a flow splitting element disposed in a mixing zone of a heating zone section of a compressed gas passing module according to the invention;
fig. 5 is a front view of a flow dividing element provided in the mixing zone of the heating zone section of the compressed gas passage module according to the invention.
In the figure: 1. a heating zone; 2. a temperature measuring region; 3. an electric heating ring; 4. a first temperature sensor; 5. a first thermometer; 6. a second thermometer; 7. an indoor section transfusion tube; 8. an outdoor section transfusion tube; 9. an etching processing chamber; 10. a liquid flow meter; 11. a gas flow meter; 12. a mixing zone; 13. a shunt element; 131. a cone; 132. a first ring; 133. a second ring; 134. a first guide connection plate; 135. a second guide connection plate; 14. and a second temperature sensor.
Detailed Description
Further description will be made with reference to the accompanying drawings and specific embodiments.
Example 1
The etching liquid atomization spraying temperature control device comprises a compressed gas passing module, a liquid heating module, a gas heating module, a temperature control module, a liquid temperature feedback measurement module, a liquid flow measurement module, a gas temperature feedback measurement module and a gas flow measurement module, wherein the liquid heating module, the gas heating module, the liquid temperature feedback measurement module, the liquid flow measurement module, the gas temperature feedback measurement module and the gas flow measurement module are electrically connected with the temperature control module as shown in fig. 1. The temperature control module can select a touch screen with an MCU chip, and has the functions of display, input, storage, calculation and the like. The temperature control module calculates heating power required by reaching a preset gas-liquid temperature T according to the received temperature feedback and flow feedback, and adjusts the heating power of the liquid heating module and each gas heating unit so that the temperature of the gas-liquid mixture after the etching liquid and the compressed gas are mixed reaches the preset gas-liquid temperature T.
As shown in fig. 2 and 3, the compressed gas passing module is a pipe for conveying compressed gas, which has a heating zone section where the compressed gas is heated to a desired temperature. The heating zone section of the compressed gas passing module is a metal pipeline, the heating zone section of the compressed gas passing module is positioned outside the etching treatment chamber 9, and one end of the heating zone section, which is far away from the gas source, is contacted with the etching treatment chamber 9. The heating area section is divided into a plurality of compressed gas passing units according to the compressed gas passing path sequence, and the gas heating module comprises a plurality of gas heating units which are in one-to-one correspondence with the compressed gas passing units. The compressed gas passing unit comprises a heating area 1 and a temperature measuring area 2, wherein the temperature measuring area 2 is positioned at one side of the air outlet end of the heating area 1. The gas heating unit is an electric heating coil 3 wrapped around the heating zone 1 of each compressed gas passing unit. The gas temperature feedback measurement module comprises a plurality of first temperature sensors 4 which are in one-to-one correspondence with the compressed gas passing units and are arranged on the temperature measuring areas 2, and a second temperature sensor 14 which is arranged on one side of the air inlet end of the heating area section, wherein the first temperature sensors 4 are used for detecting the temperature of the compressed gas in the temperature measuring areas 2 of the corresponding compressed gas passing units and transmitting the detected value to the temperature control module, and the second temperature sensors 14 are used for detecting the original temperature of the compressed gas and transmitting the detected value to the temperature control module.
As shown in fig. 3,4 and 5, at least one of the compressed gas passing units of the heating area section, except for the first compressed gas passing unit in the order of the compressed gas passing paths, includes a mixing area 12 in addition to the heating area 1 and the temperature measuring area 2. The mixing zone 12 is located on the side of the inlet end of the heating zone 1 of the compressed gas passing unit where it is located, and a flow dividing element 13 for dispersing the gas flow is provided in the mixing zone 12. The flow dividing element 13 comprises a cone 131, a first ring 132 and a second ring 133, the cone 131, the first ring 132 and the second ring 133 being concentric with the metal pipe, the tip of the cone 131 being directed towards the air inlet end. The first ring 132 and the second ring 133 are disposed near both ends of the cone 131 in the axial direction, respectively. The first circular ring 132 is connected with the conical body 131 through a group of first guide connection plates 134, the second circular ring 133 is connected with the conical body 131 through a group of second guide connection plates 135, the first guide connection plates 134 and the second guide connection plates 135 are respectively provided with a wind guiding surface which forms an acute angle with the axial direction of the metal pipeline, and the deflection directions of the wind guiding surfaces of the first circular ring 132 and the conical body 131 are opposite to the axial direction of the metal pipeline. The cone 131 is used for guiding the compressed gas in the middle of the pipeline to the pipeline wall, the first guiding connection plate 134 and the second guiding connection plate 135 are used for deflecting the compressed gas in a certain direction, and the dispersion mixing effect of the compressed gas is enhanced due to the fact that the deflection directions of the wind guiding surfaces of the first guiding connection plate 134 and the second guiding connection plate 135 relative to the axial direction of the metal pipeline are opposite. Therefore, through the effect of the flow dividing element 13, the compressed gas entering the mixing zone 12 can be well divided and dispersed, and then mixed, so that the temperature distribution of the compressed gas is more uniform, the compressed gas with uniform temperature can be obtained, the measurement result of the gas temperature feedback measurement module is more accurate, and the temperature control of the gas-liquid mixture is more accurate.
As shown in fig. 3,4 and 5, the inner diameter of the pipe of the mixing zone 12 is larger than that of the heating zone 1, and the outer diameters of the first ring 132 and the second ring 133 are the same as that of the mixing zone 12. Each first guide connection plate 134 is uniformly arranged along the circumferential direction of the first circular ring 132, each second guide connection plate 135 is uniformly arranged along the circumferential direction of the second circular ring 133, the number of the first guide connection plates 134 and the number of the second guide connection plates 135 are the same, and each first guide connection plate 134 and each second guide connection plate 135 are sequentially staggered along the circumferential direction of the first circular ring 132 or the second circular ring 133, so that the dispersion mixing effect of compressed gas can be further improved.
As shown in fig. 2, the pipe for transporting the etching liquid includes an indoor section liquid transporting pipe 7 and an outdoor section liquid transporting pipe 8, one end of the outdoor section liquid transporting pipe 8 is connected to the etching liquid transporting pump, and the other end is in contact with the etching processing chamber 9. The liquid temperature feedback measurement module comprises a first thermometer 5 and a second thermometer 6, and the first thermometer 5 and the second thermometer 6 are electrically connected with the temperature control module. The first thermometer 5 is disposed on the etching solution storage structure, and is used for measuring the temperature of the etching solution in the etching solution storage structure and transmitting the measured value to the temperature control module. In this embodiment, the liquid heating module includes the stirring device that sets up on the electric heating element in etching solution storage structure and etching solution storage structure, and stirring device is arranged in stirring etching solution that deposits in the etching solution storage structure for the temperature of different positions etching solution tends to be even in the etching solution storage structure, also makes the testing result of first thermometer 5 more accurate. The second thermometer 6 is arranged on the outdoor section infusion tube 8, and the second thermometer 6 is arranged at one end of the outdoor section infusion tube 8 contacted with the etching treatment chamber 9 and is used for measuring the temperature of the etching liquid entering the indoor section infusion tube 7 and transmitting the measured value to the temperature control module.
As shown in fig. 2, the liquid flow measuring module is a liquid flow meter 10, the liquid flow meter 10 is arranged on the outdoor section infusion tube 8, and the liquid flow meter 10 is used for measuring the conveying flow of the etching liquid and transmitting the detected value to the temperature control module. The gas flow measuring module is a gas flow meter 11, the gas flow meter 11 is arranged on the compressed gas passing module, and the gas flow meter 11 is used for measuring the conveying flow of the compressed gas and transmitting the detection value to the temperature control module. The gas flowmeter 11 is located at one side of the heating region section close to the gas source, so that the gas flowmeter 11 detects the compressed gas which is not heated, and the service life of the gas flowmeter 11 is prolonged.
Example 2
The embodiment provides a control method for an etching solution atomization spraying temperature, which uses the etching solution atomization spraying temperature control device of embodiment 1, and comprises the following steps:
S100, inputting an etching liquid atomization spraying temperature to a temperature control module, namely presetting a gas-liquid temperature T. For the etching process, the preset gas-liquid temperature T is 50 ℃.
S200, the temperature control module controls the liquid heating module to heat the etching liquid in the etching liquid storage structure until the temperature is the same as the preset gas-liquid temperature T.
And S300, when etching is performed, feeding back the temperature T1 of the etching liquid in the etching liquid storage structure to a temperature control module through a first thermometer 5 of the liquid temperature feedback measurement module, feeding back the temperature T2 of the etching liquid in an indoor section infusion tube 7 which enters the etching treatment chamber 9 to the temperature control module through a second thermometer 6 of the liquid temperature feedback measurement module, and controlling the start and stop of the liquid heating module according to the ratio of the temperature T1 to the preset gas-liquid temperature T by the temperature control module, so that the temperature T1 tends to the preset gas-liquid temperature T. The original temperature T3 of the compressed gas is fed back to the temperature control module by the second temperature sensor 14 of the gas temperature feedback measurement module, and the temperature T41 … … T4n of the compressed gas passing through the end of the unit, which is a positive integer, is fed back to the temperature control module by each first temperature sensor 4 of the gas temperature feedback measurement module, where n is the same as the number of first temperature sensors 4. T41 denotes a temperature value detected by the first temperature sensor 4 mounted on the temperature measuring region 2 of the first compressed gas passing unit along the conveying direction of the compressed gas. T42 represents the temperature value detected by the first temperature sensor 4 mounted on the temperature measuring zone 2 of the second compressed gas passing unit along the direction of conveyance of the compressed gas. T4 (n-1) represents the temperature value detected by the first temperature sensor 4 mounted on the temperature measuring zone 2 of the penultimate compressed gas passing unit along the conveying direction of the compressed gas. T4n represents the temperature value detected by the first temperature sensor 4 mounted on the temperature measuring zone 2 of the last compressed gas passing unit along the direction of conveyance of the compressed gas.
S400, feeding back the flow Q1 of the transmission etching liquid to the temperature control module through the liquid flowmeter 10, and feeding back the flow Q2 of the transmission compressed gas to the temperature control module through the gas flowmeter 11.
S500, controlling the heating power of each gas heating unit by the temperature control module according to the following formula:
W1=C2×Q2×ρ2×（T-T3）,W2=C2×Q2×ρ2×（T-T41）,...,W（n-1）=C2×Q2×ρ2×（T-T4（n-2））,Wn=C2×Q2×ρ2×（T-T4（n-1））+C1×Q1×ρ1×（T-T2）;
Wherein, W1, … … W (n-1), wn is the heating power of each gas heating unit along the flowing direction of the compressed gas, C1 is the specific heat capacity of the etching liquid, C2 is the specific heat capacity of the compressed gas, ρ1 is the density of the etching liquid, ρ2 is the density of the compressed gas.
The working principle of the invention is as follows: the invention is provided with a liquid heating module, a gas heating module, a temperature control module, a liquid temperature feedback measurement module, a liquid flow measurement module, a gas temperature feedback measurement module and a gas flow measurement module. The liquid temperature feedback measurement module and the gas temperature feedback measurement module are respectively used for feeding back the temperatures of the etching liquid and the compressed gas to the temperature control module, and the liquid flow measurement module and the gas flow measurement module are respectively used for feeding back the flows of the etching liquid and the compressed gas to the temperature control module. The temperature control module calculates heating power required by reaching a preset gas-liquid temperature T according to the received temperature feedback and flow feedback, and adjusts the heating power of the liquid heating module and each gas heating unit so that the temperature of the gas-liquid mixture after the etching liquid and the compressed gas are mixed reaches the preset gas-liquid temperature T. The invention divides the pipeline for conveying the compressed gas into a heating area section for heating the compressed gas, and divides the heating area section into a plurality of compressed gas passing units according to the sequence of the compressed gas passing paths, wherein the compressed gas passing units comprise a heating area 1 and a temperature measuring area 2, the heating area 1 is wrapped with the gas heating units, and the temperature measuring area 2 is provided with a first temperature sensor 4, so that the heating and the temperature feedback of each compressed gas passing unit can be realized, and the independent calculation and the accurate control of each gas heating unit can be realized. Therefore, the heating power of each gas heating unit is dynamically adjusted, and the adjustment of the heating power of the next gas heating unit depends on the exhaust temperature of the previous compressed gas passing unit along the conveying direction of the compressed gas, so that the compressed gas can finally and accurately reach the required temperature after multiple measurements and adjustments, the accurate control of the heating temperature of the compressed gas is realized, the accurate control of the temperature of etching liquid and the atomized spraying liquid of the compressed gas is further realized, and the etching quality is effectively ensured.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An etching solution atomizing spray temperature control device is characterized in that: including compressed gas through module, liquid heating module, gas heating module and temperature control module, its characterized in that: the system also comprises a liquid temperature feedback measurement module, a liquid flow measurement module, a gas temperature feedback measurement module and a gas flow measurement module;
The liquid heating module, the gas heating module, the liquid temperature feedback measuring module, the liquid flow measuring module, the gas temperature feedback measuring module and the gas flow measuring module are electrically connected with the temperature control module;
the compressed gas passing module is provided with a heating area section which is divided into a plurality of compressed gas passing units according to the sequence of compressed gas passing paths, and the gas heating module comprises a plurality of gas heating units which are in one-to-one correspondence with the compressed gas passing units;
the gas temperature feedback measurement module comprises a plurality of first temperature sensors (4) which are in one-to-one correspondence with the compressed gas passing units and are arranged at the tail ends of the compressed gas passing units, and a second temperature sensor (14) which is arranged at one side of the air inlet end of the heating area section, wherein the first temperature sensors (4) are used for detecting the temperature of the compressed air at the tail ends of the corresponding compressed gas passing units and transmitting the temperature to the temperature control module;
the temperature control module calculates heating power required by reaching a preset gas-liquid temperature T according to the received temperature feedback and flow feedback, and adjusts the heating power of the liquid heating module and each gas heating unit so that the temperature of the gas-liquid mixture after the etching liquid and the compressed gas are mixed reaches the preset gas-liquid temperature T.
2. The etching solution atomization spraying temperature control device according to claim 1, wherein: the liquid heating module comprises an electric heating element arranged in the etching liquid storage structure and a stirring device arranged on the etching liquid storage structure, wherein the stirring device is used for stirring the etching liquid stored in the etching liquid storage structure, so that the temperatures of the etching liquid at different positions in the etching liquid storage structure tend to be uniform.
3. The etching solution atomization spraying temperature control device according to claim 2, wherein: the liquid temperature feedback measurement module comprises a first thermometer (5) and a second thermometer (6), and the first thermometer (5) and the second thermometer (6) are electrically connected with the temperature control module; the pipeline for conveying the etching liquid comprises an indoor section infusion pipe (7) and an outdoor section infusion pipe (8), one end of the outdoor section infusion pipe (8) is connected with the etching liquid conveying pump, the other end of the outdoor section infusion pipe is in contact with the etching treatment chamber (9), and the first thermometer (5) is arranged on the etching liquid storage structure and is used for measuring the temperature of the etching liquid in the etching liquid storage structure and transmitting the measured value to the temperature control module; the second thermometer (6) is arranged on the outdoor section infusion tube (8), and the second thermometer (6) is arranged at one end of the outdoor section infusion tube (8) contacted with the etching treatment chamber (9) and is used for measuring the temperature of etching liquid entering the indoor section infusion tube (7) and transmitting the measured value to the temperature control module.
4. The etching solution atomization spraying temperature control device according to claim 3, wherein: the liquid flow measuring module is a liquid flowmeter (10), and the liquid flowmeter (10) is arranged on the outdoor section infusion tube (8); the gas flow measuring module is a gas flowmeter (11), and the gas flowmeter (11) is arranged on the compressed gas passing module and is positioned on one side of the heating area section, which is close to the gas source.
5. The etching solution atomization spraying temperature control device according to claim 1, wherein: the heating area section of the compressed gas passing module is a metal pipeline, the heating area section of the compressed gas passing module is positioned outside the etching treatment chamber (9), and one end of the heating area section, which is far away from the gas source, is in contact with the etching treatment chamber (9).
6. The etching solution atomization spraying temperature control device according to claim 5, wherein: the compressed gas passing unit comprises a heating area (1) and a temperature measuring area (2), and the temperature measuring area (2) is positioned at one side of the air outlet end of the heating area (1); the gas heating units are electric heating rings (3) wrapped on the heating areas (1) of the compressed gas passing units; each first temperature sensor (4) of the gas temperature feedback measurement module is respectively arranged on the temperature measuring area (2) of each compressed gas passing unit, and is respectively used for detecting the temperature of the compressed gas passing through the corresponding temperature measuring area (2) and transmitting the detected value to the temperature control module.
7. The etching solution atomization spraying temperature control device according to claim 6, wherein: in each compressed gas passing unit of the heating area section, at least one compressed gas passing unit of other compressed gas passing units except the first compressed gas passing unit in the sequence of the compressed gas passing paths comprises a heating area (1) and a temperature measuring area (2), and also comprises a mixing area (12), wherein the mixing area (12) is positioned at one side of the air inlet end of the heating area (1) of the compressed gas passing unit where the mixing area (12) is positioned, and a diversion element (13) for dispersing air flow is arranged in the mixing area (12).
8. The etching solution atomization spraying temperature control device according to claim 7, wherein: the flow dividing element (13) comprises a conical body (131), a first circular ring (132) and a second circular ring (133), wherein the conical body (131), the first circular ring (132) and the second circular ring (133) are coaxial with the metal pipeline, and the tip end of the conical body (131) faces towards the air inlet end; the first circular ring (132) and the second circular ring (133) are respectively arranged close to two ends of the conical body (131) in the axial direction; the first circular ring (132) is connected with the conical body (131) through a group of first guide connecting plates (134), the second circular ring (133) is connected with the conical body (131) through a group of second guide connecting plates (135), the first guide connecting plates (134) and the second guide connecting plates (135) are respectively provided with a wind guiding surface which forms a certain acute angle with the axial direction of the metal pipeline, and the deflection directions of the wind guiding surfaces of the first circular ring and the conical body are opposite to the axial direction of the metal pipeline.
9. The etching solution atomization spraying temperature control device according to claim 8, wherein: the inner diameter of the pipeline of the mixing zone (12) is larger than that of the heating zone (1), and the outer diameters of the first circular ring (132) and the second circular ring (133) are the same as that of the pipeline of the mixing zone (12); each first guide connecting plate (134) is uniformly arranged along the circumferential direction of the first circular ring (132), each second guide connecting plate (135) is uniformly arranged along the circumferential direction of the second circular ring (133), the first guide connecting plates (134) and the second guide connecting plates (135) are the same in number, and each first guide connecting plate (134) and each second guide connecting plate (135) are sequentially staggered along the circumferential direction of the first circular ring (132) or the second circular ring (133).
10. A method for controlling the atomization spraying temperature of etching liquid, which is characterized in that the etching liquid atomization spraying temperature control device is used according to any one of claims 1-9, and is characterized in that: the method comprises the following steps:
s100, inputting an etching liquid atomization spraying temperature, namely a preset gas-liquid temperature T, to a temperature control module;
s200, controlling a liquid heating module to heat etching liquid by a temperature control module until the temperature is the same as the preset gas-liquid temperature T;
S300, when etching is carried out, feeding back the temperature T1 of the etching liquid in the etching liquid storage structure and the temperature T2 of the etching liquid in the etching liquid conveying pipeline entering the etching treatment chamber (9) to a temperature control module through a liquid temperature feedback measurement module, wherein the temperature control module controls the start and stop of the liquid heating module according to the ratio of the temperature T1 to the preset gas-liquid temperature T, so that the temperature T1 tends to the preset gas-liquid temperature T; feeding back the original temperature T3 of the compressed gas to the temperature control module through the second temperature sensor (14) of the gas temperature feedback measurement module, and feeding back the temperature T41 … … T4n of the compressed gas transmitted to the temperature control module through each first temperature sensor (4) of the gas temperature feedback measurement module through the compressed gas in the tail end of each compressed gas passing unit, wherein n is a positive integer, and the number of the n is the same as that of the first temperature sensors (4);
S400, feeding back the flow Q1 of the transmission etching liquid to the temperature control module through the liquid flow measurement module, and feeding back the flow Q2 of the transmission compressed gas to the temperature control module through the gas flow measurement module;
s500, controlling the heating power of each gas heating unit by the temperature control module according to the following formula:
W1=C2×Q2×ρ2×（T-T3）,W2=C2×Q2×ρ2×（T-T41）,...,W（n-1）=C2×Q2×ρ2×（T-T4（n-2））,Wn=C2×Q2×ρ2×（T-T4（n-1））+C1×Q1×ρ1×（T-T2）;
Wherein, W1, … … W (n-1), wn is the heating power of each gas heating unit along the flowing direction of the compressed gas, C1 is the specific heat capacity of the etching liquid, C2 is the specific heat capacity of the compressed gas, ρ1 is the density of the etching liquid, ρ2 is the density of the compressed gas.
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| US4706736A (en) * | 1986-05-20 | 1987-11-17 | Technicon Instruments Corporation | Multi-zone heater arrangement for controlling the temperature of a flowing medium |
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