CN117917321A

CN117917321A - Composite laminate

Info

Publication number: CN117917321A
Application number: CN202311363955.9A
Authority: CN
Inventors: 宫泽英明
Original assignee: Asahi Glass Co Ltd
Current assignee: AGC Inc
Priority date: 2022-10-21
Filing date: 2023-10-20
Publication date: 2024-04-23
Also published as: JP2024061483A; KR20240056429A

Abstract

Provided is a composite laminate which can prevent a resin film of a composite from generating concave defects. The present invention relates to a composite laminate comprising: a plurality of composite bodies each having a resin film disposed on a main surface of a glass plate; and a clip which is interposed between the composite members, wherein in the composite laminate, when the arithmetic average height Sa of the principal surface of the clip disposed on the resin film side is X and the kurtosis Sku is Y, the following formula (1) is satisfied, and Y is less than or equal to-0.18X+4.3 … … (1).

Description

Composite laminate

Technical Field

The present invention relates to a composite laminate.

Background

For example, electronic devices such as solar cell Panels (PV), liquid crystal panels (LCD), organic EL panels (OLED), or receiving sensor panels that sense electromagnetic waves, X-rays, ultraviolet rays, visible rays, infrared rays, and the like are increasingly light and thin as well as light. With this, the thickness of a support substrate such as a polyimide resin substrate for an electronic device is also reduced.

If the strength of the support substrate is reduced by the reduction in thickness, the operability of the support substrate is reduced, and problems such as deformation of the support substrate, damage to the circuit, and the like may occur in a step of forming a component for an electronic device on the support substrate (component forming step).

Therefore, recently, in order to improve the operability of the support substrate, for example, a technique has been proposed in which a composite in which a resin film such as a polyimide resin is disposed on a main surface of a glass plate is used as the support substrate. For example, patent document 1 describes a laminate of a support substrate and a cured thermosetting resin composition layer, that is, a cured laminate, and describes that a resin varnish is applied to a surface that is not in contact with the support substrate of the cured thermosetting resin composition layer to form a thin resin varnish layer, and the thin resin varnish layer is heated to form a cured resin varnish film.

Patent document 2 describes that: when a plurality of glass sheets are conveyed in a stacked state, a glass sheet paper is interposed between the glass sheets, thereby preventing damage to the surface of the glass sheets during conveyance. Patent document 2 describes: by setting the arithmetic average height Sa of the paper jam to be equal to or greater than a predetermined value and setting the smoothness to be equal to or greater than 20 seconds, both suppression of particles and suppression of damage can be achieved.

Patent document 1: japanese patent laid-open publication No. 2018-193544

Patent document 2: japanese patent application laid-open No. 2022-83995

When the composite as described in patent document 1 is conveyed, it is considered that a plurality of laminated bodies are laminated as in the case of glass sheets. However, it is known from the study of the present inventors that: when such a composite is laminated, even if a clip such as the clip paper shown in patent document 2 is interposed, a concave defect may occur in the resin film due to the convex shape of the clip surface. If a concave defect occurs in the resin film, the quality of the electronic device member or the like formed on the resin film may be lowered, and the quality of the support substrate may be lowered.

Disclosure of Invention

Accordingly, an object of the present invention is to provide a composite laminate capable of suppressing occurrence of concave defects in a resin film of the composite.

The present inventors have conducted intensive studies and as a result found that: the present invention has been completed by the fact that the concave defect of the resin film can be suppressed by satisfying a predetermined condition with respect to the surface properties of the principal surface of the clip disposed on the resin film side in the composite laminate.

Namely, the present invention relates to the following 1 to 2.

1. A composite laminate is provided with: a plurality of composite bodies each having a resin film disposed on a main surface of each glass plate; and a clip which is interposed between the composite members, wherein in the composite laminate, when the arithmetic average height Sa of the principal surface of the clip disposed on the resin film side is X in μm and the kurtosis Sku is Y, the following formula (1) is satisfied, and Y is not more than-0.18X+4.3 … … (1).

2. In the composite laminate according to the above 1, the above X and Y satisfy the following formulas (2) and (3),

X≤7.5……(2)

Y≤3.84……(3)

According to the present invention, a composite laminate can be provided in which occurrence of concave defects in a resin film of the composite can be suppressed.

Drawings

Fig. 1 is a side view showing an example of a composite laminate according to the present embodiment.

Fig. 2A is a plan view of the principal surface side of the resin film provided with the composite.

Fig. 2B is a side view of the composite.

Fig. 3 is a side view of a portion of a composite.

Fig. 4 is a perspective view showing a package of the composite laminate according to the present embodiment.

Fig. 5 is a graph showing the results of the defect evaluation on a graph having Sku on the vertical axis and Sa on the horizontal axis.

Description of the reference numerals

A complex; 2. a composite laminate; a clip; g. glass plate; r. resin film; protective layer; a storage container; back support; back receiving member; a support member; pressing the member; 15a. belt; a tension imparting unit; bottom plate; pedestal; a receiving surface; a mounting surface; pressing part; resin plate; pressing the frame.

Detailed Description

The present invention will be described in detail below, but the present invention is not limited to the following embodiments and can be implemented by arbitrarily changing the scope of the present invention without departing from the gist of the present invention. The terms "to" representing the numerical range are used in the sense of including the numerical values described before and after the term "to" as the lower limit value and the upper limit value.

In the drawings below, members and portions that serve the same function are denoted by the same reference numerals, and overlapping description may be omitted or simplified. The embodiments described in the drawings are schematically illustrated for the sake of clarity of explanation of the present invention, and actual dimensions and scales are not necessarily accurately represented.

(Composite laminate)

The composite laminate according to the present embodiment includes: a plurality of composite bodies each having a resin film disposed on a main surface of each glass plate; and a clip which is interposed between the composite members, wherein in the composite laminate, when an arithmetic average height Sa of a main surface of the clip disposed on the resin film side is X (in μm) and a kurtosis Sku is Y, the following formula (1) is satisfied,

Y≤-0.18X+4.3……(1)。

Fig. 1 is a side view schematically illustrating a composite laminate according to the present embodiment. The composite laminate 2 includes a plurality of composites 1 each having a resin film R disposed on a main surface of a glass plate G, and a clip 5 interposed between the composites.

The inventors found that: the present invention has been completed by satisfying the above-described expression (1) with respect to the surface properties of the principal surface of the clip disposed on the resin film side in the composite laminate, and by suppressing the occurrence of concave defects in the resin film when the composite is formed into the composite laminate.

This will be described below. As the surface property, a relatively small arithmetic mean height Sa means that the level difference of the irregularities existing on the surface is relatively small. The kurtosis Sku indicates the sharpness of the height distribution of the surface irregularities, and indicates that the height distribution is normal in the case of sku=3, that the height distribution is sharp in the case of Sku > 3, and that the height distribution of the surface irregularities is flattened in the case of Sku < 3. That is, in the case of Sku > 3, the surface properties tend to be sharp peaks and valleys, and in the case of Sku < 3, the peaks and valleys tend to be relatively rounded even when the surface has irregularities.

It is considered that the smaller Sa is, the smaller the height difference of the irregularities is, and thus the concave defect of the resin film can be suppressed, but when Sku is too large, the sharp peaks and valleys are many, and the concave defect of the resin film is likely to occur. On the other hand, it is considered that the smaller Sku is, the more easily the concave defect of the resin film is suppressed, but when Sa is too large, the larger the level difference of the concave and convex is, the more easily the concave defect of the resin film is generated. For this case, the present invention finds that: if Sa and Sku satisfy the expression (1), both Sa and Sku fall within an appropriate range, and occurrence of concave defects of the resin film due to the convex shape of the clip surface can be suppressed. The composite laminate according to the present embodiment will be described in more detail below.

(Composite body)

As illustrated in fig. 2A and 2B, the composite 1 constituting the composite laminate 2 is a plate-like body having a glass plate G and a resin film R disposed on a main surface of the glass plate G. The composite 1 is used as a support substrate in a process of forming a member for an electronic device, for example.

(Glass plate)

The shape of the main surface of the glass sheet G is not particularly limited as long as it is a plate-like body capable of forming the resin film R, and is generally rectangular when viewed from a direction perpendicular to the main surface, that is, a direction perpendicular to the main surface.

The main surface of the glass plate G is not particularly limited in size, but in the case of a rectangular shape, for example, the length of at least one side is preferably 300mm or more, more preferably 700mm or more, and even more preferably 1500mm or more. The upper limit is not particularly limited, but is preferably 2000mm or less, for example. That is, in the case where the glass plate G is rectangular, the length of one side may be 300mm to 2000mm, for example. The glass plate G may be, for example, a large-sized glass plate of the 6 th generation (long side 1850mm, short side 1500 mm). In the case of conveying a composite body using glass plates of such a size, from the viewpoints of excellent conveying efficiency, prevention of breakage of the composite body, and the like, one of the preferable conveying methods is to pack and convey a composite body laminate formed by laminating the composite bodies.

The thickness of the glass sheet G is not particularly limited, but is preferably 0.3mm or more, more preferably 0.5mm or more, from the viewpoint of improving strength and suppressing deflection. On the other hand, the thickness is preferably 1.0mm or less, more preferably 0.7mm or less, from the viewpoint of reducing the loading load. The thickness of the glass plate G may be, for example, 0.3 to 1.0mm.

Further, from the viewpoint of rigidity, the Young's modulus of the glass plate G is preferably 60GPa or more, more preferably 65GPa or more. From the viewpoint of productivity, the Young's modulus is preferably 95GPa or less, more preferably 90GPa or less. The Young's modulus of the glass plate G may be, for example, 60 to 95GPa.

The specific type of the glass plate is not particularly limited, but for example, alkali-free borosilicate glass, quartz glass, soda lime glass, or the like can be used, and alkali-free borosilicate glass or quartz glass is preferable from the viewpoint of preventing the influence of alkali components on the device.

The method for producing a glass sheet is not particularly limited, but may be, for example, a method such as a press method, a down-draw method, or a float method, in which a glass sheet having a predetermined size or shape is formed by slowly cooling and then grinding or polishing.

(Resin film)

The resin film R is disposed on the main surface of the glass plate G. When the composite 1 is used as a support substrate for forming an electronic device, a component for an electronic device is usually formed on the resin film R. The resin film R may be disposed on at least one main surface of the glass plate G, but may be disposed on both main surfaces. The resin film R may be disposed on the entire main surface of the glass plate G or may be disposed in a part thereof. For example, as illustrated in fig. 2A and 2B, the resin film R may have a rectangular shape when viewed from the vertical direction, and may be disposed on a main surface of the glass plate G except for a region along the outer edge portion. The resin film R is preferably disposed at least 25% of the area of the main surface of the glass plate G, and more preferably at least 50%.

From the viewpoint of cushioning properties against foreign matter, the thickness of the resin film R is preferably 1 μm or more, more preferably 3 μm or more, and even more preferably 5 μm or more. On the other hand, the thickness is preferably 50 μm or less, more preferably 25 μm or less, and even more preferably 10 μm or less, from the viewpoint of preventing cracks from occurring in the resin film R. The thickness of the resin film R may be, for example, 1 to 50. Mu.m.

From the viewpoint of suppressing concave defects caused by foreign matter or the like, the young's modulus of the resin film R is preferably 0.1GPa or more, more preferably 0.5GPa or more, and even more preferably 1.0GPa or more. From the viewpoint of suppressing bending of the composite, the Young's modulus is preferably 7.0GPa or less, more preferably 5.0GPa or less, and even more preferably 3.0GPa or less. The Young's modulus of the resin film R may be, for example, 0.1 to 7.0GPa. The young's modulus of the resin film R can be measured by nanoindentation.

Examples of the resin used for the resin film R include polyimide, silicone resin, acrylic resin, polyolefin, and fluororesin. In forming the electronic device member on the resin film, the resin is more preferably heat-resistant at 300 ℃ or higher, and for example, polyimide, silicone resin, or the like is more preferably used.

The softening point of the resin used for the resin film R is preferably 30 ℃ or higher, more preferably 45 ℃ or higher, and still more preferably 60 ℃ or higher, from the viewpoint of suppressing concave defects due to foreign substances or the like.

The resin film R may be a film composed of 1 resin layer or a film composed of a plurality of resin layers.

(Protective layer)

As shown in fig. 3, the composite 1 preferably further includes a protective layer P formed on the resin film R in a releasable manner. When the composite 1 is used as a support substrate for forming an electronic device, the protective layer P is used for protecting the resin film R formed by the electronic device member in the composite laminate 2 and the composite 1 before the electronic device member is formed, for example. That is, when forming the member for an electronic device on the composite 1, the protective layer P is peeled off from the resin film R, and thereafter, an electronic device such as an organic EL (OLED) is formed on the resin film R.

The thickness of the protective layer P is preferably 10 μm or more, more preferably 30 μm or more, and even more preferably 50 μm or more, from the viewpoints of improving the strength and suppressing the concave defects of the resin film R. On the other hand, the thickness is preferably 200 μm or less, more preferably 150 μm or less, and further preferably 100 μm or less, from the viewpoint of suppressing deformation due to moisture absorption. The thickness of the protective layer P may be, for example, 10 to 200. Mu.m.

From the viewpoint of suppressing the concave defects of the resin film R, the young's modulus of the protective layer P is preferably 0.1GPa or more, more preferably 2.0GPa or more, and even more preferably 4.0GPa or more. From the viewpoint of suppressing bending of the composite, the Young's modulus is preferably 7.0GPa or less, more preferably 6.0GPa or less, and even more preferably 5.0GPa or less. The Young's modulus of the protective layer P may be, for example, 0.1 to 7.0GPa. The Young's modulus of the protective layer P can be measured by a tensile test method.

The protective layer P is preferably formed of a resin from the viewpoints of scratch resistance, impact absorption, and productivity. Examples of the resin include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), and Polyethylene (PE), and polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) are preferable from the viewpoints of scratch resistance and productivity. For example, the protective layer may also be a polyethylene terephthalate (PET) film.

As the protective layer P, a resin is suitably used as described above. In the case where the composite in the composite laminate includes such a protective layer P, the resin film R does not directly contact the clip, but a concave portion may be formed in the protective layer P due to a convex portion on the surface of the clip. In addition, a concave defect may be generated in the resin film R in contact with the protective layer P. According to the present invention, even when the composite includes the protective layer P, occurrence of the concave portion of the resin film can be appropriately suppressed.

The method for producing the composite is not particularly limited, and for example, a resin film may be formed on at least one main surface of a glass plate by a known method. Further, a resin film and a protective layer may be laminated in this order on at least one main surface of the glass plate. Further, for example, a laminated film in which a resin film and a protective layer are laminated in advance may be formed by roll-to-roll, and the resin film and the protective layer may be formed on at least one principal surface of the glass plate by bonding the resin film side surface of the laminated film to the at least one principal surface of the glass plate.

When the composite 1 having the resin film R provided on the glass plate G is used as a support substrate for forming an electronic device, the formed electronic device can be easily peeled off from the support substrate, as compared with the case where the electronic device is separated from the support substrate by an expensive laser device.

(Clamping piece)

As shown in fig. 1, the clips 5 are interposed between the composite body 1 in the composite body laminate 2. By sandwiching the clip 5 between the composites 1, scratching and contamination of the composites 1 can be suppressed. Further, by sandwiching the clips 5 between the composite body 1, the protective layer P and the resin film R of the composite body 1 can be prevented from adhering to the glass plate G of another composite body 1 stacked adjacent to each other and peeling off at an undesired position (for example, between the protective layer P and the resin film R) when the composite body is taken out.

The clip may have the same shape as the main surface of the composite body, for example. Since the composite body stacked together with the clip according to the present embodiment is rectangular, for example, the clip according to the present embodiment is also preferably rectangular. However, the clip may be formed into a shape other than a straight line, for example, in order to improve the operability in unpacking and the like.

For example, when the composite body is rectangular and has a size of 1850mm×1500mm, the clip is preferably rectangular with a size of about 1890mm×1540 mm. When the composite body is rectangular, the length of each side of the clip is preferably about 1.01 to 1.05 times the length of the corresponding side of the composite body (glass plate).

The thickness of the clip is preferably 20 μm or more, more preferably 50 μm or more, and even more preferably 80 μm or more from the viewpoint of improving strength and cushioning properties. On the other hand, the thickness is preferably 1000 μm or less, more preferably 500 μm or less, and even more preferably 100 μm or less, from the viewpoint of suppressing the lamination height when the composite laminate is formed. The thickness of the clip may be, for example, 20 to 1000. Mu.m.

If the clamp is small in weight, the clamp may have low strength and be easily broken. Therefore, the basis weight of the clip is preferably 20g/m ² or more, more preferably 30g/m ² or more, still more preferably 40g/m ² or more, and particularly preferably 45g/m ² or more.

On the other hand, if the amount is large, the weight increases, and the lamination height when the composite laminate is formed increases, so that the number of containers that can be stored at a predetermined height decreases. Therefore, the basis weight of the clip is preferably 100g/m ² or less, more preferably 90g/m ² or less, still more preferably 80g/m ² or less, and particularly preferably 70g/m ² or less. The quantitative amount may be, for example, 20 to 100g/m ².

The quantification can be performed according to JIS P8124: 2011.

Examples of the material of the clip include paper, resin, and cloth, and paper is preferable from the viewpoints of ease of separation from the composite body and productivity. Examples of the resin include polyethylene terephthalate (PET) and Polyethylene (PE). In addition, when the clip is paper, the clip is also referred to as a clip.

In the composite laminate according to the present embodiment, when the arithmetic average height Sa of the principal surface of the clip disposed on the resin film side is X (in μm), and the kurtosis Sku is Y, the following expression (1) is satisfied. That is, as the clip for the composite laminate, a clip satisfying the following formula (1) when the arithmetic average height Sa (unit is μm) of at least one main surface is set to X and the kurtosis Sku is set to Y is used,

Y≤-0.18X+4.3……(1)。

The principal surface of the clip disposed on the resin film side (hereinafter, also referred to as the resin film side principal surface) refers to the principal surface of the clip disposed on the side on which the resin film is formed when viewed from the glass plate of the composite in the composite laminate. The resin film side main surface of the clip may be in direct contact with the resin film, but the resin film side main surface of the clip may not be in direct contact with the resin film through, for example, a protective layer.

As described above, in the composite laminate according to the present embodiment, the surface properties of the resin film side main surface of the clip satisfy the above formula (1), and thus occurrence of concave defects in the resin film is suppressed. X and Y preferably satisfy Y.ltoreq.0.18X+3.84, more preferably satisfy Y.ltoreq.0.18X+3.53.

The arithmetic mean height Sa (X) of the resin film side main surface is preferably 7.5 μm or less, more preferably 7.0 μm or less, and even more preferably 5.5 μm or less, from the viewpoint of suppressing occurrence of concave defects by reducing the level difference of the resin film side main surface. The lower limit of Sa (X) is not particularly limited, but may be, for example, 1.96 μm or more. That is, sa (X) may be, for example, 1.96 to 7.5. Mu.m.

The kurtosis Sku (Y) of the resin film side main surface is preferably 4.3 or less, more preferably 3.84 or less, and even more preferably 3.6 or less, from the viewpoint of suppressing formation of sharp peaks and valleys on the resin film side main surface. The lower limit of Sku (Y) is not particularly limited, but may be, for example, 2.4 or more. Specifically, sku (Y) may be, for example, 2.4 to 4.3.

For example, in the composite laminate according to the present embodiment, it is more preferable that X and Y satisfy the following formulas (1) to (3),

Y≤-0.18X+4.3……(1)

X≤7.5……(2)

Y≤3.84……(3)。

As the clip, a clip satisfying the above surface properties may be produced from a raw material, or a commercially available paper satisfying the above surface properties may be used as the clip. In the case where the clip is paper, for example, the clip can be manufactured by separating and pulping raw pulp and papermaking the pulp. As commercially available papers, for example, "OKBlizzard" manufactured by Oji Material Co., ltd., "Acacia" manufactured by Oji Material Co., ltd., "ELIMINATE PLASTIC PAPER" manufactured by King paper Co., ltd. (quantitative 380g/m ²), and "Shirao" manufactured by Japanese paper Co., ltd. (quantitative 209.3g/m ²) are suitably used.

The number of composite layers in the composite laminate is not particularly limited, and may be two or more, but from the viewpoint of loading efficiency, for example, 300 or more, and more preferably 400 or more. On the other hand, from the viewpoint of suppressing the concave defect of the resin film R due to the pressure, the number of layers is preferably 500 or less, more preferably 450 or less.

The number of stacks of the composite body 1 and the clips 5 is generally the same as the number of the composite body 1 and the clips 5 or the number of the clips 5 is 1 more than the number of the composite bodies 1.

As an example, 5 composite bodies 1 are stacked in fig. 1, sandwiching a clip 5 therebetween, and the clip 5 is also arranged on one end face in the stacking direction (up-down direction in the drawing) of the composite body stack 2. In this way, the clips 5 may be disposed on one or both end surfaces in the lamination direction of the composite laminate 2.

The composite laminate is manufactured, for example, by alternately laminating a composite and a clip. In this case, the composite laminate according to the present embodiment is obtained by disposing the clip so that the principal surface satisfying the above formula (1) becomes the principal surface on the resin film side.

The composite laminate according to the present embodiment is suitable for use in transporting or storing a composite used as a support substrate for forming an electronic device. According to the composite laminate of the present embodiment, the occurrence of concave defects in the resin layer that can form the member for an electronic device is suppressed, and therefore, the composite can be transported or stored without deteriorating the quality of the composite.

(Packaging body)

The package according to the present embodiment is a package packaged by housing the composite laminate according to the present embodiment in a housing container. In the case of transporting or storing the composite laminate, it is preferable to be in the state of a package. The form of the storage container is not limited to the following exemplary form, and at least the composite laminate may be placed or stored.

Fig. 4 is a perspective view showing an example of the package according to the present embodiment. The composite laminate 2 stored in the storage container 100 and packaged is transported by being loaded on a transport vehicle (e.g., a trailer, a truck), a ship, or the like. The clip included in the composite laminate 2 in fig. 4 is not specifically shown.

The storage container 100 shown in fig. 4 is placed on the upper surface of the pedestal 19. The storage container 100 includes a back support portion 10, a bottom support portion 17 serving as a bottom plate, a pressing portion 30, and a fastening mechanism 15.

The back support portion 10 includes a back support member 13 and a plate-shaped back receiving member 11. The back support member 13 supports the back surface of the composite laminate 2 via the back receiving member 11 in a state where the main surface of the glass sheet G is inclined with respect to the vertical direction. The back receiving member 11 is provided with a receiving surface 23 on the opposite side of the back support member 13 to the composite laminate 2. The receiving surface 23 may have a buffer sheet, not shown.

The back support portion 10 is in surface contact with the composite laminate 2, and supports the composite laminate 2 in an upright posture in which it stands up against the back support member 11. The back support member 13 and the bottom support portion 17 are preferably made of a material having load resistance (for example, a metal material such as an iron material or an aluminum alloy material, or a resin material).

Here, regarding the lamination direction of the composite body 1, the pressing portion 30 side of the composite body laminate 2 is referred to as "front side" or "front surface side", and the back surface support portion 10 side is also referred to as "back surface side".

The bottom support 17 is provided on the upper part of the pedestal 19 and on the front side (support side of the composite laminate 2) of the lower end of the back support member 11. The bottom support 17 is made of, for example, a plate material, and the upper surface of the plate material serves as the mounting surface 27 for the composite laminate 2. The bottom support 17 is disposed with the mounting surface 27 inclined with respect to the upper surface of the pedestal 19. The mounting surface 27 preferably has a buffer sheet, not shown.

The angle formed by the receiving surface 23 of the back receiving member 11 and the mounting surface 27 of the bottom support 17 is preferably substantially 90 °. The side surface of the back support member 13 that supports the back receiving member 11 is preferably an angle such that the inclination angle θ between the main surface of the glass plate G of the composite laminate 2 and the vertical direction is 10 ° or more and 45 ° or less. By making this inclination angle, the composite laminate 2 can be stably supported by the back surface support portion 10.

In this way, the composite laminate 2 in which the composite bodies 1 are laminated is placed on the bottom support 17, and is stored in the storage container 100 in an upright posture in which it is raised against the back support 10.

The pressing portion 30 is disposed on the front surface side (opposite side to the back surface support portion 10 side) of the composite laminate 2. The pressing portion 30 includes a pressing frame 33 and a resin plate 31 serving as a buffer disposed between the pressing frame 33 and the composite laminate 2. The pressing frame 33 is preferably made of a lightweight and non-deformable material (e.g., aluminum or aluminum alloy material, resin material, etc.).

The pressing portion 30 is pressed against the composite laminate 2 by fastening by the fastening mechanism 15, and presses the composite laminate 2 toward the back surface support portion 10.

The fastening mechanism 15 generates a fastening force that sandwiches the composite laminate 2 supported by the back surface support portion 10 between the pressing portion 30 and the back surface support portion 10. The fastening mechanism 15 according to the present embodiment includes a belt-shaped belt 15a and a tension applying portion 15b that applies tension to the belt 15 a. In this example, the fastening mechanism 15 is disposed at two positions (upper region and lower region) of the composite laminate 2, which are different in height, and the two tapes 15a are hung on the pressing frame 33 in front of the composite laminate 2 in the horizontal direction, so that the composite laminate 2 is fixed to the back surface support portion 10, but 1 tape may be hung horizontally in the center region of the composite laminate 2 in the height direction, so that the fixing may be performed. Further, the belts may be hung on the upper region, the lower region, and the central region of the composite laminate 2, respectively.

The belt 15a is fixed at both ends to the back support member 13, and a tension applying portion 15b such as a ratchet is provided at a part of the belt such as one end. Tension is applied to the belt 15a by the tension applying portion 15b. The belt 15a to which the tension is applied generates a tightening force for pressing the composite laminate 2 against the back surface support portion 10, and the composite laminate 2 is stored in the storage container 100 while being held in a state where the composite laminate 2 is fixed to the back surface support portion 10.

The pressing portion 30 is preferably configured to be in surface contact with the composite laminate 2. The pressing frame 33 is not limited to the illustrated lattice-shaped frame, and may be plate-shaped or block-shaped. Instead of the pressing frame 33, for example, a thick paper or a buffer plate which is provided at the corner of the composite laminate 2 so as to intersect with the belt 15a and is bent in an L-shape, or another shape may be used.

In this way, the illustrated package of the composite laminate 2 can be transported while keeping the composite laminate 2 stationary in the standing posture. By fixing in the standing posture, the space efficiency of disposing the composite laminate 2 is improved.

The composite bodies 1 are preferably stacked such that the resin film R disposed on one principal surface of the glass plate G faces the other principal surface (non-formation surface of the resin film R) of the adjacent glass plate G with one side of the glass plate G facing downward. In the storage container 100, each composite body 1 is placed as a composite body laminate 2 by being stacked together with the clips 3 (not shown in fig. 4) interposed between the composite bodies 1 in a state where the main surfaces of the glass plates G are inclined with respect to the vertical direction in which one side of the glass plates G, which are downward end surfaces, are brought into contact with and supported by the bottom supporting portion 17.

When the composite laminate 2 is arranged such that the one principal surface side of each composite 1 on which the resin film R is arranged and the back receiving member 11 face each other, the other principal surface (non-forming surface of the resin film R) of the glass plate G becomes the front surface when the composite 1 is taken out from the storage container 100. Therefore, the resin film R is not disposed on the take-out side of the glass plate G, so that the glass plate G can be easily held without fear of interference (contact) with the resin film R. As a result, the operation of taking out each composite 1 from the composite laminate 2 can be simplified.

Examples

The present invention will be specifically described below with reference to examples, but the present invention is not limited thereto. Examples 1 to 3, 7 to 9, and 11 are examples, and examples 4 to 6, 10, and 12 are comparative examples. Further, the measurement of the clip was performed in accordance with JIS P8111:1998 is performed after the clip is subjected to a humidity conditioning treatment in a standard state.

(Surface Property of the clip)

The arithmetic average height Sa and kurtosis Sku of the surface properties of the clip were measured using a non-contact surface property measuring device (PF-60, sanying Co., ltd.). The measurement was performed on both sides of the clip, with the smaller side of Sa being the I side and the larger side of Sa being the II side. The arithmetic average height Sa and kurtosis Sku are measured at the substantially central portion of the surface to be measured.

(Thickness of the clip)

According to JIS P8188: 2014 "test methods for paper and cardboard-thickness, density and specific volume" the thickness of the clip of each example was measured.

(Preparation of composite)

A silicone resin film (thickness 7 μm) was formed on a resin film (thickness 50 μm) composed of polyethylene terephthalate (PET) by coating the surface with a silicone resin, and heating at 140 ℃ for 10 minutes using a heating plate and curing it. After the pollution-preventing PET film was bonded to the formed silicone resin film, the film was cut into a size of 50mm by 50 mm. Next, a glass plate G was prepared which was washed with a water-based glass cleaner (PK-LCG 213 manufactured by Kagaku Kogyo Parker Corporation) and then washed with pure water. The contamination preventing PET film on the silicone resin film was peeled off and bonded to the main surface of the glass plate G. Thus, the composite 1 in which the silicone resin film is disposed as the resin film R and the resin film is disposed as the protective layer on the main surface of the glass plate G is produced. In the resin film R, the softening point of the resin was 60 ℃ and the young's modulus was 1GPa.

As the glass plate G, a glass plate (trade name "AN Wizus" manufactured by AGC Co., ltd.) composed of alkali-free borosilicate glass having a size of 100mm X100 mm and a thickness of 0.5mm was used. The linear expansion coefficient of the glass plate G was 39X 10 ^-7/. Degree.C.

Next, the produced composite 1 was placed in an autoclave, and heated at 65 ℃ and 1MPa for 30 minutes to remove the contained bubbles.

(Production of composite laminate)

The clips of each example shown in table 1 were molded to a size of 110mm×110mm, and each of the clips was sandwiched between 10 of the above-described composites so that the I-plane was arranged on the resin film side of the composite, and a composite laminate for I-plane evaluation was obtained in which 10 composites were laminated. The protruding amount of the clip on each side of the glass plate G was 5mm.

A composite laminate for evaluation of the II surface was obtained in the same manner except that the II surface of each clip was disposed on the resin film side of the composite.

The details of the clips of each example shown in table 1 are as follows.

A paper: the raw stock paper is produced by a known production method.

B paper: the raw stock paper is produced by a known production method.

C paper: glassine paper is manufactured by known manufacturing methods.

SC64NB: cleaning paper manufactured by sakura.

OK unbleached kraft paper (Japanese: OK insolated cowcoat): kraft paper manufactured by Oji materials.

Copy paper (Japanese: cover plate, [51g/m ² ]: recycled paper manufactured by tokyo paper agency.

OK Blizzard (Japanese: OK drive): single photo-bleached kraft paper made by Oji Material Co.

Acacia (Japanese: wire): double-sided bleaching by Oji materials.

ELIMINATE PLASTIC PAPER (Japanese: p.) [ quantitative 380g/m ² ]: high density thick paper manufactured by King paper Co., ltd.

Fwat-Light (Japanese: pocket) [ N720165]: buffer paper made by northeast fiber society.

Shiraoi (Japanese: company) [ quantitative 209.3g/m ² ]: high quality paper manufactured by japan paper agency.

Low density paper [ basic ]: low density thick paper manufactured by king paper agency.

(Defect evaluation)

For the composite laminate for evaluation of the I-plane and the composite laminate for evaluation of the II-plane of each example, defects of the resin film after holding under the following conditions were evaluated. The following holding conditions are assumed to be conditions assumed when transporting the composite laminate, such as a temperature at which the transport in the ocean in midsummer is possible.

Test environment: clean room (1000 level)

Evaluation of the dimensions: 50mm by 50mm

Load: 1.97g/cm ² (corresponding to the load in the case of stacking 500 6 th-generation-size composites)

Heating conditions: 60 ℃ x 30min (Air)

After the predetermined time period was elapsed, the composite laminate was unpacked, and the surface of the resin film exposed by peeling the protective layer of each composite was visually inspected by projection under the following conditions with n=10 using a point light source device for visual inspection (manufactured by SELIC, MP 160). For a portion where no defect is identified, a is determined as the following evaluation criterion. The surface of the resin film was observed by a non-contact surface texture measuring device (PF-60, manufactured by Sanying Co., ltd.) under the following conditions, and the resin film was evaluated as the evaluation standard B or C.

Observation conditions:

The distance from the light source (point light source device) to the screen was set to 100cm, and a sample was inserted at a position 30cm away from the light source, and appearance was observed by transmission projection. 160W special mercury lamp was used as the light source.

The measurement axes X, Y were measured in a range of 10mm×10mm (non-contact surface texture measuring device). The measurement pitch was set to 50. Mu.m, and the scanning speed was set to 5000. Mu.m/s.

(Evaluation criterion)

A: no defects were identified within the field of view.

B: defects identified in the observation range were less than 10 and were all pits less than 1 μm deep.

C: the number of defects identified in the observation range was 10 or more or one or more depressions of 1 μm or more were identified.

The evaluation results are shown in Table 1. The blank in the table indicates that measurement was not performed. Fig. 5 shows the results of defect evaluation of the composite laminate of each example on a graph with Sku on the vertical axis and Sa on the horizontal axis.

Table 1:

From the results shown in table 1 and fig. 5, the resin film did not recognize defects or the number of defects recognized was small in the I-plane-evaluating composite laminates of examples 1 to 3, 7 to 9, and 11 and the II-plane-evaluating composite laminates of examples 1, 3,8, and 9, in which the surface properties of the resin film side main surface of the clip satisfied the formula (1). In contrast, in the composite laminate in which the surface properties of the resin film side main surface of the clip do not satisfy the formula (1), the defect in the resin film was 10 or more points or one or more depressions of 1 μm or more were confirmed.

While the invention has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope thereof.

The present application is based on japanese patent application 2022-169458 filed on 10/21 of 2022, the contents of which are incorporated herein by reference.

Claims

1. A composite laminate is provided with: a plurality of composite bodies each having a resin film disposed on a main surface of each glass plate; and a clamping member which is clamped between the composite bodies,

The composite laminate is characterized in that,

When the arithmetic average height Sa of the principal surface of the clip disposed on the resin film side is X in μm and the kurtosis Sku is Y, the following expression (1) is satisfied,

Y≤-0.18X+4.3……(1)。

2. The composite laminate according to claim 1, wherein,

X and Y satisfy the following formulas (2) and (3),

X≤7.5……(2)

Y≤3.84……(3)。

3. The composite laminate according to claim 1, wherein,

The thickness of the clamping piece is 20-1000 mu m.

4. The composite laminate according to claim 1, wherein,

The thickness of the glass plate is 0.3-1.0 mm, and the thickness of the resin film is 1-50 mu m.