CN117884413B - Silicon wafer cleaning machine - Google Patents
Silicon wafer cleaning machine Download PDFInfo
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- CN117884413B CN117884413B CN202410288082.8A CN202410288082A CN117884413B CN 117884413 B CN117884413 B CN 117884413B CN 202410288082 A CN202410288082 A CN 202410288082A CN 117884413 B CN117884413 B CN 117884413B
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- silicon wafer
- supporting
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- 238000004140 cleaning Methods 0.000 title claims abstract description 130
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 92
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 92
- 239000010703 silicon Substances 0.000 title claims abstract description 92
- 238000003860 storage Methods 0.000 claims abstract description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 35
- 230000005540 biological transmission Effects 0.000 claims abstract description 19
- 238000001035 drying Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 7
- 230000008569 process Effects 0.000 claims abstract description 6
- 238000011010 flushing procedure Methods 0.000 claims abstract description 3
- 235000012431 wafers Nutrition 0.000 claims description 81
- 239000007788 liquid Substances 0.000 claims description 16
- 238000005406 washing Methods 0.000 claims description 15
- 239000007921 spray Substances 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 5
- 238000013016 damping Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims description 2
- 239000002699 waste material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 238000004506 ultrasonic cleaning Methods 0.000 abstract description 7
- 238000007599 discharging Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241001233242 Lontra Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a silicon wafer cleaning machine table, which belongs to the technical field of silicon wafer processing and comprises a cleaning box, wherein a drain pipe is arranged at the bottom of the cleaning box, a storage mechanism is arranged in the cleaning box, the storage mechanism comprises a storage component used for supporting a silicon wafer and a supporting component used for supporting and drying the storage component, the storage component is detachably arranged at the top of the supporting component, a height adjusting piece used for adjusting the height of the storage mechanism is arranged on the side wall of the cleaning box, and a limit transmission plate corresponding to the supporting component is arranged at the top of the height adjusting piece; ultrasonic cleaning is carried out on the silicon wafer through mutual cooperation of a plurality of structures, and the silicon wafer is controlled to vertically reciprocate in the cleaning process, so that multiple cleaning of the silicon wafer is realized, the cleaning effect on the silicon wafer is remarkably improved, and after cleaning is finished, the silicon wafer is subjected to secondary flushing through mutual cooperation of a plurality of structures, so that sundries are prevented from remaining on the silicon wafer.
Description
Technical Field
The invention belongs to the technical field of silicon wafer processing, and particularly relates to a silicon wafer cleaning machine.
Background
The silicon wafer is an important material for manufacturing an integrated circuit, and the silicon wafer is required to be subjected to the procedures of surface shaping, orientation, cutting, grinding, corrosion, polishing, cleaning and the like in the processing process, and a corresponding silicon wafer cleaning machine is required to be used for cleaning the silicon wafer;
the traditional silicon wafer cleaning machine comprises a supporting leg, a soaking cavity, a control box, a sealing door, a separation plate, an ultrasonic vibration rod, a mounting seat, a dryer, a mounting rack, an electric push rod, a drain pipe, a water adding pipe, an electromagnetic valve, a frequency converter and other structures, and has the advantages that the cleaned silicon wafer can be dried by using the dryer;
however, the traditional silicon wafer cleaning machine table has a relatively simple cleaning structure, so that the cleaning machine table cannot clean the silicon wafer without residues, the cleaning effect of the cleaning machine table on the silicon wafer is not ideal, and improvement is urgently needed.
Disclosure of Invention
The invention aims to provide a silicon wafer cleaning machine table for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a silicon chip cleaning machine platform, includes washs the case, the bottom of washs the case is provided with the drain pipe, the inside of washs the case is provided with storage mechanism, storage mechanism is including being used for playing the storage subassembly of supporting role to the silicon chip and being used for playing supporting role and drying effect's supporting component to storage subassembly, storage subassembly can dismantle the setting at supporting component's top, be provided with the altitude mixture control spare that is used for playing altitude mixture control role to storage mechanism on washs the lateral wall of case, the top of altitude mixture control spare is provided with the spacing drive plate corresponding with supporting component, the spacing through-hole corresponding with spacing drive plate has been seted up at the top of washs the case, storage mechanism's below is provided with and is used for playing the wiper mechanism of shutoff effect to the bottom of washs the case.
As a further scheme of the invention: the top of wasing the case is provided with the washing spray tube that is used for playing the washing effect to storage mechanism, is provided with a plurality of washing shower nozzle on the washing spray tube, and the top of wasing the case still is provided with the hot tuber pipe that is used for playing the drying effect to storage mechanism, and the hot tuber pipe that goes out is located the top of wasing the spray tube.
As still further aspects of the invention: the supporting component comprises a supporting screen plate, first limiting plates are arranged at two ends of the supporting screen plate, limiting transmission pipes are arranged on the lower surface of the supporting screen plate, and filter screens are arranged in the limiting transmission pipes.
As still further aspects of the invention: and one end of the limiting transmission pipe, which is far away from the supporting screen plate, is provided with an elastic pressurizing pipe.
As still further aspects of the invention: the top of supporting the otter board is provided with the second limiting plate, is provided with a plurality of hot air-blower on the second limiting plate.
As still further aspects of the invention: the storage assembly comprises a limiting placing plate, a plurality of placing through holes are formed in the limiting placing plate, a third limiting plate which is connected with the first limiting plate in a damping sliding mode is fixedly connected to the two ends of the limiting placing plate, and a plurality of limiting support rods corresponding to the third limiting plate are arranged below the limiting placing plate.
As still further aspects of the invention: the cleaning mechanism comprises a fourth limiting plate, a limiting piston plate which is in sealing sliding connection with the cleaning box is arranged above the fourth limiting plate, an ultrasonic generator is arranged on the upper surface of the limiting piston plate, and a plurality of elastic supporting pieces which are used for driving the limiting piston plate to move in the direction away from the fourth limiting plate are arranged at two ends of the upper surface of the fourth limiting plate.
As still further aspects of the invention: the elastic support piece is a spring or a metal elastic piece.
As still further aspects of the invention: and the upper surface of the fourth limiting plate is also provided with a limiting bracket, and two ends of the limiting bracket are connected with fifth limiting plates corresponding to the limiting piston plates in a sliding manner.
As still further aspects of the invention: elastic protection plates for playing a role in skid prevention are arranged at two ends of the lower surface of the cleaning box.
Compared with the prior art, the invention has the beneficial effects that: the ultrasonic cleaning device is simple in structure and convenient to use, the ultrasonic cleaning is carried out on the silicon wafer through the mutual matching of multiple structures, the silicon wafer is controlled to vertically reciprocate in the cleaning process, the cleaning effect on the silicon wafer is remarkably improved, the silicon wafer is subjected to secondary cleaning through the mutual matching of multiple structures after the cleaning is finished, sundries are prevented from remaining on the silicon wafer, the silicon wafer is fully cleaned without residues, and secondly, the silicon wafer is subjected to multiple drying through the mutual matching of multiple structures, so that the user can conveniently carry out subsequent treatment on the cleaned silicon wafer, and the ultrasonic cleaning device is worthy of popularization and use.
Drawings
FIG. 1 is a schematic diagram of a silicon wafer cleaning machine;
FIG. 2 is a schematic structural view of a storage mechanism in a silicon wafer cleaning machine;
FIG. 3 is a schematic diagram of the structure of a support screen in a silicon wafer cleaning machine;
FIG. 4 is a schematic structural view of a storage assembly in a silicon wafer cleaning machine;
FIG. 5 is a schematic view of a cleaning mechanism in a silicon wafer cleaning tool;
In the figure: 1-cleaning box, 2-height adjusting piece, 3-storage mechanism, 4-spacing drive plate, 5-hot air outlet pipe, 6-cleaning spray pipe, 7-cleaning spray head, 8-spacing through hole, 9-cleaning mechanism, 10-drain pipe, 11-elasticity guard plate, 31-supporting component, 32-storage component, 310-first limiting plate, 311-supporting screen, 312-hot air blower, 313-second limiting plate, 314-spacing drive pipe, 315-elasticity pressurization pipe, 316-filter screen, 320-spacing bracing piece, 321-third limiting plate, 322-spacing board, 323-arrangement through hole, 90-spacing support, 91-fourth limiting plate, 92-elastic support piece, 93-supersonic generator, 94-spacing piston plate, 95-fifth limiting plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed.
The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1, the present embodiment provides a silicon wafer cleaning machine, including a cleaning tank 1, the cleaning tank 1 is composed of a cleaning portion, a transition portion and a discharging portion, the length of the discharging portion is greater than that of the cleaning portion, the discharging portion is located below the cleaning portion, the transition portion is used for connecting the cleaning portion and the discharging portion, a drain pipe 10 is disposed at the bottom of the cleaning tank 1, a storage mechanism 3 is disposed inside the cleaning tank 1, the storage mechanism 3 includes a storage component 32 for supporting silicon wafers and a supporting component 31 for supporting and drying the storage component 32, the storage component 32 is detachably disposed at the top of the supporting component 31, a height adjusting member 2 for adjusting the height of the storage mechanism 3 is disposed on a side wall of the cleaning tank 1, the height adjusting member 2 is a hydraulic cylinder or an air cylinder, a limit transmission plate 4 corresponding to the supporting component 31 is disposed at the top of the height adjusting member 2, a limit through hole 8 corresponding to the limit transmission plate 4 is disposed at the top of the cleaning tank 1, the limit transmission plate 8 is used for accommodating a limit transmission plate 4 and a plugging mechanism 9 for plugging the cleaning mechanism 1 below the storage mechanism 3 is disposed.
Referring to fig. 1, in an embodiment, in order to enrich the functions of the cleaning machine, in this embodiment, preferably, a cleaning nozzle 6 for performing a flushing function on the storage mechanism 3 is disposed at the top of the cleaning tank 1, a plurality of cleaning nozzles 7 are disposed on the cleaning nozzle 6, during use, the cleaned silicon wafer is flushed by the cleaning nozzles 7, impurities are prevented from remaining on the silicon wafer, a hot air outlet pipe 5 for performing a drying function on the storage mechanism 3 is further disposed at the top of the cleaning tank 1, and hot air is supplied to the hot air outlet pipe 5 by a hot air blower, so that the hot air outlet pipe 5 discharges hot air into the cleaning tank 1 to rapidly dry the cleaned silicon wafer, and the hot air outlet pipe 5 is disposed above the cleaning nozzle 6.
Referring to fig. 1,2 and 3, in one embodiment, in order to make the use of the support assembly 31 more reliable, in this embodiment, preferably, the support assembly 31 includes a support screen 311, the support screen 311 is a stainless steel screen, two ends of the support screen 311 are provided with a first limiting plate 310, a lower surface of the support screen 311 is provided with a limiting transmission pipe 314, a filter screen 316 is disposed in the limiting transmission pipe 314, one end of the limiting transmission pipe 314 far away from the support screen 311 is provided with an elastic pressurization pipe 315, the elastic pressurization pipe 315 is a rubber pipe, a second limiting plate 313 is disposed on the top of the support screen 311, and a plurality of heat blowers 312 are disposed on the second limiting plate 313.
In another embodiment, the supporting component 31 includes a supporting screen 311, the supporting screen 311 is an aluminum alloy screen, two ends of the supporting screen 311 are provided with a first limiting plate 310, a lower surface of the supporting screen 311 is provided with a limiting transmission pipe 314, a filter screen 316 is arranged in the limiting transmission pipe 314, one end of the limiting transmission pipe 314 away from the supporting screen 311 is provided with an elastic pressurizing pipe 315, the elastic pressurizing pipe 315 is a silicone tube, the top of the supporting screen 311 is provided with a second limiting plate 313, and a plurality of heat blowers 312 are arranged on the second limiting plate 313.
Referring to fig. 1,2 and 4, in one embodiment, in order to make the use of the storage component 32 more reliable, preferably, in this embodiment, the storage component 32 includes a limiting plate 322, a plurality of placing through holes 323 are formed on the limiting plate 322, two ends of the limiting plate 322 are fixedly connected with a third limiting plate 321 in damping sliding connection with the first limiting plate 310, the third limiting plate 321 is slidably connected with a supporting screen 311, a plurality of limiting support rods 320 corresponding to the third limiting plate 321 are disposed below the limiting plate 322, when in use, a silicon wafer is placed through the placing through holes 323 on the limiting plate 322, the limiting plate 322 is used for limiting the silicon wafer, and the limiting support rods 320 are used for supporting the placed silicon wafer.
In another embodiment, the storage component 32 comprises a limiting placing plate 322, a plurality of placing through holes 323 are formed in the limiting placing plate 322, a third limiting plate 321 in damping sliding connection with the first limiting plate 310 is fixedly connected to two ends of the limiting placing plate 322, the third limiting plate 321 is in sliding connection with the supporting net 311, a supporting net is arranged below the limiting placing plate 322, the supporting net is a steel wire net and is fixedly connected with the third limiting plate 321, a silicon wafer passes through the placing through holes 323 on the limiting placing plate 322 to be placed when in use, the limiting placing plate 322 is used for limiting the silicon wafer, and the limiting supporting rod 320 is used for supporting the placed silicon wafer.
Referring to fig. 1 and 5, in one embodiment, in order to make the use of the cleaning mechanism 9 more reliable, preferably, in this embodiment, the cleaning mechanism 9 includes a fourth limiting plate 91, a limiting piston plate 94 that is in sealed sliding connection with the cleaning tank 1 is disposed above the fourth limiting plate 91, the limiting piston plate 94 is in sealed sliding connection with a cleaning portion on the cleaning tank 1, an ultrasonic generator 93 is disposed on an upper surface of the limiting piston plate 94, the use of the ultrasonic generator 93 is in the prior art, a plurality of elastic supporting members 92 for driving the limiting piston plate 94 to move in a direction away from the fourth limiting plate 91 are disposed at two ends of an upper surface of the fourth limiting plate 91, the elastic supporting members 92 are springs, a limiting bracket 90 is also disposed on an upper surface of the fourth limiting plate 91, two ends of the limiting bracket 90 are slidably connected with a fifth limiting plate 95 corresponding to the limiting piston plate 94, and when in use, the limiting piston plate 94 is prevented from tilting by the interaction of the limiting bracket 90 and the fifth limiting plate 95, and the reliability of the cleaning mechanism 9 is improved.
In another embodiment, the cleaning mechanism 9 includes a fourth limiting plate 91, a limiting piston plate 94 in sealing sliding connection with the cleaning box 1 is disposed above the fourth limiting plate 91, the limiting piston plate 94 is in sealing sliding connection with a cleaning part on the cleaning box 1, an ultrasonic generator 93 is disposed on the upper surface of the limiting piston plate 94, the ultrasonic generator 93 is used in the prior art, a plurality of elastic supporting pieces 92 for driving the limiting piston plate 94 to move towards a direction far away from the fourth limiting plate 91 are disposed at two ends of the upper surface of the fourth limiting plate 91, the elastic supporting pieces 92 are metal elastic sheets, a plurality of limiting sleeves are further disposed on the upper surface of the fourth limiting plate 91, limiting rods are slidably connected to the tops of the limiting sleeves, and the limiting piston plate 94 is prevented from inclining through the mutual matching of the limiting sleeves and the limiting rods during use, and reliability of the cleaning mechanism 9 is improved.
Referring to fig. 1, in an embodiment, in order to enrich the functions of the cleaning machine, in this embodiment, preferably, two ends of the lower surface of the cleaning tank 1 are provided with elastic protection plates 11 for anti-skidding, the elastic protection plates 11 are rubber plates or silica gel plates, and in use, the elastic protection plates 11 play roles in anti-skidding and shock absorption, so as to improve the reliability of the cleaning machine.
The working principle and the using flow of the invention are as follows: in the state shown in fig. 1, a proper amount of cleaning liquid is injected into the cleaning tank 1, then the height adjusting piece 2 is controlled to extend, the supporting screen plate 311 is moved to the upper side of the cleaning tank 1, then a user pulls out the storage component 32 in the supporting screen plate 311, the storage component 32 with the silicon wafer placed therein is inserted into the supporting screen plate 311, then the height adjusting piece 2 is controlled to shrink, the cleaning machine table is restored to the initial state shown in fig. 1, at the moment, the power supply of the ultrasonic generator 93 is connected, so that the silicon wafer is cleaned by ultrasonic waves, at the same time, the height adjusting piece 2 is controlled to continuously extend and shrink in small amplitude, so that the silicon wafer is continuously vertically reciprocated, the silicon wafer is cleaned by the movement of the silicon wafer relative to the cleaning liquid, in addition, when the elastic pressurizing pipe 315 moves downwards to be in contact with the limiting piston plate 94, the cleaning liquid is stored in the interior of the elastic pressurizing pipe 315, along with the further downward movement of the supporting screen plate 311, the cleaning liquid in the elastic pressurizing pipe 315 passes through the filter screen 316 to be sprayed out from the bottom of the supporting screen plate, the cleaning liquid is further flushed by the sprayed cleaning liquid, the cleaning agent 316 is used for cleaning the silicon wafer, the silicon wafer in the cleaning filter screen plate is further, and the silicon wafer is cleaned by the filter screen plate, and impurities in the cleaning mode are completely matched with each other, and the silicon wafer is cleaned by the mode;
After the silicon wafer is cleaned, the height adjusting piece 2 is controlled to further shrink, at this time, the limiting piston plate 94 is pressed by the limiting driving pipe 314, so that the limiting piston plate 94 moves downwards to be separated from contact with the cleaning part, at this time, the limiting piston plate 94 loses the plugging function, the cleaning solution in the cleaning box 1 is discharged through the drain pipe 10, thereby realizing automatic discharge of waste cleaning solution, avoiding pollution of the silicon wafer by the cleaning solution containing stains, then the height adjusting piece 2 is controlled to gradually stretch, the supporting screen 311 gradually moves upwards, during the upward movement of the supporting screen 311, the limiting piston plate 94 gradually resets to the initial position shown in fig. 1, along with the further upward movement of the supporting screen 311, the silicon wafer in the limiting placing plate 322 moves to the position corresponding to the cleaning spray nozzle 7, at this time, the cleaned silicon wafer is further washed by spraying the cleaning liquid through the cleaning spray nozzle 7, the cleaning liquid is matched with the gradual upward movement of the supporting screen plate 311, the omnibearing washing of the silicon wafer is realized, the washed cleaning liquid is stored at the bottom of the cleaning box 1 so as to clean the subsequent silicon wafer, after the washing is finished, the supporting screen plate 311 is controlled to further move upwards, the silicon wafer is air-dried in the moving process, meanwhile, the silicon wafer is dried by spraying hot air through the hot air outlet pipe 5, in addition, the power supply of the hot air blower 312 is connected, the silicon wafer is further dried through the hot air blower 312, at this time, the temperature at the top of the cleaning box 1 is quickly increased, the silicon wafer is further dried, the quick and full drying of the silicon wafer is realized through the mutual cooperation of a plurality of drying modes, then the supporting screen plate 311 is further controlled to move upwards, the supporting screen plate 311 is enabled to move to the upper part of the cleaning box 1, then the user pulls out the storage component 32 in the supporting screen 311, inserts the storage component 32 with the silicon wafer placed in the supporting screen 311, and repeats the cleaning operation;
The ultrasonic cleaning device is simple in structure and convenient to use, the ultrasonic cleaning is carried out on the silicon wafer through the mutual matching of the multiple structures, the silicon wafer is controlled to vertically reciprocate in the cleaning process, the double cleaning is carried out on the silicon wafer through the vertical reciprocation of the silicon wafer, the cleaning effect on the silicon wafer is remarkably improved, the silicon wafer is washed for the second time through the mutual matching of the multiple structures after the cleaning is finished, sundries are prevented from remaining on the silicon wafer, the residual-free full cleaning of the silicon wafer is realized, and secondly, the multiple drying is carried out on the silicon wafer through the mutual matching of the multiple structures, so that the user can conveniently carry out subsequent treatment on the cleaned silicon wafer, and the ultrasonic cleaning device is worthy of popularization and use.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (3)
1. The utility model provides a silicon chip cleaning machine platform, includes washs case, its characterized in that: the bottom of the cleaning box is provided with a drain pipe, the inside of the cleaning box is provided with a storage mechanism, the storage mechanism comprises a storage component used for supporting a silicon wafer and a support component used for supporting the storage component and drying the storage component, the storage component is detachably arranged at the top of the support component, the side wall of the cleaning box is provided with a height adjusting piece used for adjusting the height of the storage component, the top of the height adjusting piece is provided with a limit transmission plate corresponding to the support component, the top of the cleaning box is provided with a limit through hole corresponding to the limit transmission plate, the lower part of the storage mechanism is provided with a cleaning mechanism used for plugging the bottom of the cleaning box, the top of the cleaning box is provided with a cleaning spray pipe used for flushing the storage mechanism, a plurality of cleaning spray heads are arranged on the cleaning spray pipe, the top of the cleaning box is also provided with a hot air outlet pipe used for drying the storage mechanism, the hot air outlet pipe is positioned above the cleaning spray pipe, the supporting component comprises a supporting screen plate, the two ends of the supporting screen plate are provided with first limiting plates, the lower surface of the supporting screen plate is provided with a limiting transmission pipe, a filter screen is arranged in the limiting transmission pipe, one end of the limiting transmission pipe, far away from the supporting screen plate, is provided with an elastic pressurizing pipe, the top of the supporting screen plate is provided with a second limiting plate, the second limiting plate is provided with a plurality of hot air blowers, the material storage component comprises a limiting placing plate, a plurality of placing through holes are formed in the limiting placing plate, a third limiting plate which is in damping sliding connection with the first limiting plate is fixedly connected to the two ends of the limiting placing plate, a plurality of limiting support rods corresponding to the third limiting plate are arranged below the limiting placing plate, the cleaning mechanism comprises a fourth limiting plate, a limiting piston plate which is in sealing sliding connection with the cleaning box is arranged above the fourth limiting plate, an ultrasonic generator is arranged on the upper surface of the limiting piston plate, a plurality of elastic support pieces which are used for driving the limiting piston plate to move towards a direction far away from the fourth limiting plate are arranged at the two ends of the upper surface of the fourth limiting plate, a limiting support is further arranged on the upper surface of the fourth limiting plate, the two ends of the limiting bracket are slidably connected with a fifth limiting plate corresponding to the limiting piston plate, the height adjusting piece is controlled to continuously extend and retract in a small range, so that the silicon wafer is continuously subjected to vertical reciprocating movement, the silicon wafer is washed by moving relative to the washing liquid, when the elastic pressurizing pipe moves downwards to be in contact with the limiting piston plate, the washing liquid is stored in the elastic pressurizing pipe, along with the further downwards movement of the supporting screen plate, the washing liquid in the elastic pressurizing pipe passes through the filter screen to be sprayed out from the bottom of the supporting screen plate, the silicon wafer is further washed by the sprayed washing liquid, after the silicon wafer is washed, the height adjusting piece is controlled to further retract, the limiting piston plate is pressed by the limiting driving pipe, so that the limiting piston plate moves downwards to separate from the contact with the cleaning part, at the moment, the limiting piston plate loses the plugging function, the cleaning liquid in the cleaning box is discharged through the drain pipe, the automatic discharge of waste cleaning liquid is realized, then the height adjusting piece is controlled to be gradually stretched, the supporting screen plate is gradually moved upwards, along with the further upward movement of the supporting screen plate, the silicon wafer in the limiting placing plate moves to the position corresponding to the cleaning spray head, at the moment, the cleaned silicon wafer is further washed by the cleaning spray head, the silicon wafer is gradually moved upwards in combination with the supporting screen plate, the omnibearing washing of the silicon wafer is realized, the washing liquid used for washing is stored at the bottom of the washing box so as to wash the subsequent silicon wafers, and after washing is finished, the supporting screen plate is controlled to further move upwards, and the silicon wafers are air-dried in the moving process.
2. The wafer cleaning tool according to claim 1, wherein: the elastic support piece is a spring or a metal elastic piece.
3. The wafer cleaning tool according to claim 1, wherein: elastic protection plates for playing a role in skid prevention are arranged at two ends of the lower surface of the cleaning box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410288082.8A CN117884413B (en) | 2024-03-14 | 2024-03-14 | Silicon wafer cleaning machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410288082.8A CN117884413B (en) | 2024-03-14 | 2024-03-14 | Silicon wafer cleaning machine |
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| CN117884413A CN117884413A (en) | 2024-04-16 |
| CN117884413B true CN117884413B (en) | 2024-05-31 |
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