CN117801715A - Adhesive layer, laminate, adhesive composition, and optical semiconductor device - Google Patents
Adhesive layer, laminate, adhesive composition, and optical semiconductor device Download PDFInfo
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- CN117801715A CN117801715A CN202410034629.1A CN202410034629A CN117801715A CN 117801715 A CN117801715 A CN 117801715A CN 202410034629 A CN202410034629 A CN 202410034629A CN 117801715 A CN117801715 A CN 117801715A
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- layer
- optical semiconductor
- adhesive layer
- meth
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- 230000003287 optical effect Effects 0.000 title claims abstract description 176
- 239000012790 adhesive layer Substances 0.000 title claims abstract description 111
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- 239000000853 adhesive Substances 0.000 title claims abstract description 41
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- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- AAYRWMCIKCRHIN-UHFFFAOYSA-N propane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CCCS(O)(=O)=O AAYRWMCIKCRHIN-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000006234 thermal black Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Adhesive Tapes (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to an adhesive layer, a laminated sheet, an adhesive composition and an optical semiconductor device. Provided is an adhesive layer which has excellent anti-reflection properties when attached to an adherend and can suppress the brightness unevenness of transmitted light. The laminate sheet (1) is provided with at least an adhesive layer (21). The adhesive layer (21) has a haze value of 61% or more and a total light transmittance of 69% or less. The laminate sheet (1) may be provided with a layer (42) having antiglare and/or antireflection properties on one surface. The thickness of the laminate sheet (1) is preferably 500 μm or less.
Description
The present application is a divisional application of application having application date 2023, 2 and 14, application number 202310112194.3, and title of the invention of an adhesive layer, a laminate, an adhesive composition, and an optical semiconductor device.
Technical Field
The present invention relates to an adhesive layer. More specifically, the present invention relates to an adhesive layer suitable for sealing optical semiconductor elements such as mini/micro LEDs.
Background
In recent years, as a new generation display device, a self-luminous display device typified by a Mini/micro LED display device (Mini/Micro Light Emitting Diode Display) has been designed. As a basic configuration of a mini/micro LED display device, a substrate in which a large number of micro optical semiconductor elements (LED chips) are densely arranged is used as a display panel, the optical semiconductor elements are sealed with a sealing material, and a cover member such as a resin film or a glass plate is laminated on the outermost layer.
In a display body including a self-luminous display device such as a mini/micro LED display device, wiring (metal wiring) of a metal oxide such as metal or ITO is arranged on a substrate of a display panel. Such a display device has the following problems, for example: when the light is turned off, the light is reflected by the metal wiring or the like, and the appearance of the screen is deteriorated. Therefore, as a sealing material for sealing the optical semiconductor element, a technique using an antireflection layer for preventing reflection by a metal wiring is adopted.
In addition, in a display using a self-luminous display device, there is a problem in that uneven brightness (uneven brightness) occurs due to a light source of an optical semiconductor element. When the brightness unevenness occurs, a phenomenon of "Color shift" in which the Color tone changes between when viewed from the front of the display and when viewed from an oblique view occurs.
Patent document 1 discloses an adhesive film in which an adhesive layer in which carbon black is dispersed is provided on one surface of a transparent substrate. Patent document 2 discloses an adhesive sheet having an adhesive layer containing light diffusing fine particles. Patent document 3 discloses a colored pressure-sensitive adhesive sheet having a colored pressure-sensitive adhesive layer with a haze value of 1% or more and 60% or less.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 11-335639
Patent document 2: japanese patent laid-open No. 2021-138825
Patent document 3: japanese patent laid-open No. 2020-164702
Disclosure of Invention
Problems to be solved by the invention
However, the adhesive layers in the adhesive sheets of patent documents 1 and 3 are expected to have an effect of preventing reflection by the metal wiring when sealing the optical semiconductor element, but do not suppress luminance unevenness. The pressure-sensitive adhesive layer in the pressure-sensitive adhesive sheet of patent document 2 has no antireflection property, although an effect of suppressing luminance unevenness can be expected. Therefore, an adhesive layer is required that has excellent antireflection properties when attached to an adherend and can suppress luminance unevenness of transmitted light.
The present invention has been made in view of these circumstances, and an object thereof is to provide an adhesive layer which is excellent in antireflection property when attached to an adherend and can suppress luminance unevenness of transmitted light.
Solution for solving the problem
As a result of intensive studies to achieve the above object, the present inventors have found that an adhesive layer having a specific haze value and total light transmittance is excellent in antireflection property when adhered to an adherend and can suppress luminance unevenness of transmitted light. The present invention has been completed based on these findings.
That is, the present invention provides an adhesive layer having a haze value of 61% or more and a total light transmittance of 69% or less.
The present invention also provides a laminate sheet comprising the adhesive layer.
The laminate sheet may have an antiglare and/or antireflection layer on one surface.
The thickness of the laminate sheet is preferably 500 μm or less.
The present invention also provides an adhesive composition containing a colorant and light-diffusing fine particles, wherein the haze value at the time of forming an adhesive layer is 61% or more and the total light transmittance is 69% or less.
The present invention also provides an optical semiconductor device including: a substrate; an optical semiconductor element disposed on the substrate; and the laminate sheet or a cured product thereof for sealing the optical semiconductor element.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the pressure-sensitive adhesive layer of the present invention, the pressure-sensitive adhesive layer is excellent in antireflection property when attached to an adherend, and can suppress uneven brightness of transmitted light. Therefore, when the optical semiconductor element is sealed with the laminate sheet provided with the adhesive layer of the present invention, the antireflection property of the substrate surface is excellent, and uneven brightness caused by light emitted from the optical semiconductor element is less likely to occur.
Drawings
Fig. 1 is a cross-sectional view of an optical semiconductor element sealing sheet according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of an optical semiconductor element sealing sheet according to another embodiment of the present invention.
Fig. 3 is a partial cross-sectional view showing an embodiment of an optical semiconductor device using the optical semiconductor element sealing sheet shown in fig. 1.
Fig. 4 is a partial cross-sectional view showing an embodiment of an optical semiconductor device using the optical semiconductor element sealing sheet shown in fig. 2.
Fig. 5 is a partial cross-sectional view showing another embodiment of an optical semiconductor device using the optical semiconductor element sealing sheet shown in fig. 2.
Description of the reference numerals
1 optical semiconductor element sealing sheet
2 resin layer for sealing
21. Adhesive layers of the invention
22. Non-diffusion functional layer
3 Release liner
4 base material portion
41. Substrate film
42 functional layer
5 substrate
6-photon semiconductor element
7 sealing resin layer
71. Diffusion function coloring layer
72. Non-diffusion functional layer
10. Optical semiconductor device
Detailed Description
[ adhesive layer ]
The adhesive layer of the present invention has a haze value of 61% or more and a total light transmittance of 69% or less. The adhesive layer of the present invention is a layer formed of a single layer and having adhesiveness. The adhesive layer of the present invention is preferably a resin layer composed of a resin.
The haze value (initial haze value) of the pressure-sensitive adhesive layer of the present invention is 61% or more, preferably 70% or more, more preferably 80% or more, still more preferably 90% or more, may be 95% or more, 97% or more, and may be in the vicinity of 99.9%. When the haze value is 61% or more, uneven brightness of light transmitted through the pressure-sensitive adhesive layer can be suppressed when the pressure-sensitive adhesive layer is bonded to an adherend. The upper limit of the haze value is not particularly limited, and may be 100%.
The total light transmittance of the adhesive layer of the present invention is 69% or less, preferably 60% or less, more preferably 50% or less, further preferably 40% or less, further preferably 30% or less. From the viewpoint of ensuring light transmittance, the total light transmittance is preferably 0.5% or more, more preferably 1% or more, further preferably 1.5% or more, further preferably 2% or more, further preferably 2.5% or more, and particularly preferably 3% or more.
The haze value and the total light transmittance are each a single layer value, and can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type of the pressure-sensitive adhesive layer, the thickness, the colorant, the type of the light diffusing fine particles, the blending amount, and the like.
The pressure-sensitive adhesive layer of the present invention may be a resin layer (radiation-curable resin layer) having a property of being cured by radiation irradiation, or may be a resin layer (non-radiation-curable resin layer) having no property of being cured by radiation irradiation. Examples of the radiation include electron beam, ultraviolet ray, α ray, β ray, γ ray, and X ray.
The adhesive layer of the present invention preferably contains a colorant. The colorant may be a dye or a pigment as long as it can be dissolved or dispersed in the adhesive layer of the present invention. Dyes are preferred in that they have no sedimentation and are easily and uniformly distributed as pigments. In addition, pigments are also preferred in terms of high color rendering properties even when added in small amounts. When pigments are used as colorants, it is preferred that the conductivity be low or not. The colorant may be used alone or in combination of two or more.
The colorant is preferably a black colorant. The black-based colorant may be any of known conventional colorants (pigments, dyes, etc.) for black color, and examples thereof include carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, pine black, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (nonmagnetic ferrite, magnetic ferrite, etc.), magnet (magnetite), chromium oxide, iron oxide, molybdenum disulfide, chromium complex, anthraquinone-based colorant, zirconium nitride, etc. Further, a colorant that is combined and mixed to exhibit a color other than black may be used and functions as a black-based colorant.
In the case where the pressure-sensitive adhesive layer of the present invention is a radiation-curable resin layer, the colorant is preferably a colorant that absorbs visible light and has light transmittance at a wavelength at which the radiation-curable resin layer can be cured.
The content ratio of the colorant in the pressure-sensitive adhesive layer of the present invention is preferably 0.04 mass% or more, more preferably 0.1 mass% or more, and may be 0.2 mass% or more, or 0.4 mass% or more, relative to 100 mass% of the total amount of the pressure-sensitive adhesive layer of the present invention, from the viewpoint of imparting an appropriate antireflection capability to an adherend. The content of the colorant is, for example, 10 mass% or less, preferably 5 mass% or less, more preferably 3 mass% or less, still more preferably 1 mass% or less, and may be 0.8 mass% or less, or 0.1 mass% or less. The content ratio may be appropriately set according to the type of the colorant, the color tone of the adhesive layer, the light transmittance, and the like. The colorant may be added to the composition in the form of a solution or dispersion dissolved or dispersed in a suitable solvent.
The adhesive layer of the present invention preferably contains light diffusing particles. The adhesive layer of the present invention particularly preferably contains light-diffusing fine particles dispersed in a resin layer. The light diffusing fine particles may be used alone or in combination of two or more.
The light diffusing fine particles have an appropriate refractive index difference from the resin constituting the adhesive layer of the present invention, and impart diffusing properties to the adhesive layer of the present invention. Examples of the light diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of the material of the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxide. Examples of the material of the polymer microparticles include silicone resins, acrylic resins (for example, a polymethacrylate resin such as polymethyl methacrylate), polystyrene resins, polyurethane resins, melamine resins, polyethylene resins, and epoxy resins.
The polymer fine particles are preferably fine particles made of silicone resin. The inorganic fine particles are preferably fine particles composed of a metal oxide. The metal oxide is preferably titanium oxide or barium titanate, more preferably titanium oxide. With such a constitution, the pressure-sensitive adhesive layer of the present invention is more excellent in light diffusibility and further suppressed in luminance unevenness. Among the polymer fine particles, fine particles composed of a silicone resin are preferable, and in this case, the color tone of the colorant based on the adhesive layer is less likely to change, and the polymer fine particles stably exhibit more excellent transparency.
The shape of the light diffusing fine particles is not particularly limited, and may be, for example, spherical, flat, or irregular.
The average particle diameter of the light diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, still more preferably 0.2 μm or more, and particularly preferably 0.25 μm or more, from the viewpoint of imparting an appropriate light diffusing property. In addition, the average particle diameter of the light diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and even more preferably 8 μm or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. The average particle diameter can be measured, for example, using a coulter counter.
The refractive index of the light diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, still more preferably 1.3 to 4, and particularly preferably 1.35 to 3.
From the viewpoint of reducing luminance unevenness more efficiently, the absolute value of the refractive index difference between the light diffusing fine particles and the binder constituting the binder layer of the present invention (for example, the binder layer of the present invention excluding various additives such as colorants and light diffusing fine particles) is preferably 0.001 or more, more preferably 0.01 or more, still more preferably 0.02 or more, particularly preferably 0.03 or more, and may be 0.04 or more, or 0.05 or more. In addition, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the absolute value of the refractive index difference between the light diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, and still more preferably 3 or less.
The content of the light diffusing fine particles in the pressure-sensitive adhesive layer of the present invention is preferably 0.01 part by mass or more, more preferably 0.05 part by mass or more, still more preferably 0.1 part by mass or more, still more preferably 0.15 part by mass or more, still more preferably 0.6 part by mass or more, still more preferably 1 part by mass or more, or 2 parts by mass or more, 5 parts by mass or more, and particularly preferably 10 parts by mass or more, relative to 100 parts by mass of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer of the present invention, from the viewpoint of imparting an appropriate light diffusing property to the pressure-sensitive adhesive layer of the present invention. From the viewpoint of preventing the haze value from becoming too high, the content of the light diffusing fine particles is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, further preferably 50 parts by mass or less, but may be 40 parts by mass or less, 30 parts by mass or less, and particularly preferably 20 parts by mass or less, relative to 100 parts by mass of the resin constituting the pressure-sensitive adhesive layer of the present invention.
In the case where the pressure-sensitive adhesive layer of the present invention is the above-mentioned resin layer, the resin constituting the above-mentioned resin layer may be any of known and conventional resins, and examples thereof include acrylic resins, urethane acrylate resins, urethane resins, rubber resins, epoxy acrylate resins, oxetane resins, silicone acrylic resins, polyester resins, polyether resins (such as polyvinyl ether), polyamide resins, fluorine resins, vinyl acetate/vinyl chloride copolymers, modified polyolefins, and the like. The resin may be used alone or in combination of two or more.
The resin may be a pressure-sensitive adhesive conventionally known. Examples of the adhesive include acrylic adhesives, rubber adhesives (natural rubber adhesives, synthetic rubber adhesives, and mixed systems thereof), silicone adhesives, polyester adhesives, urethane adhesives, polyether adhesives, polyamide adhesives, and fluorine adhesives. The binder may be used alone or in combination of two or more.
The acrylic resin is a polymer containing a structural unit derived from an acrylic monomer (a monomer component having a (meth) acryloyl group in a molecule) as a structural unit of the polymer. The acrylic resin may be used alone or in combination of two or more.
The acrylic resin is preferably a polymer in which the structural unit derived from (meth) acrylic acid ester is most contained in terms of mass ratio. In the present specification, "(meth) acrylic acid" means "acrylic acid" and/or "methacrylic acid" ("acrylic acid" and "methacrylic acid" either or both), and the other is the same.
Examples of the (meth) acrylate include hydrocarbon group-containing (meth) acrylates. Examples of the hydrocarbon group-containing (meth) acrylate include (meth) acrylic acid esters having an alicyclic hydrocarbon group such as alkyl (meth) acrylate and cycloalkyl (meth) acrylate having a linear or branched aliphatic hydrocarbon group, and (meth) acrylic acid esters having an aromatic hydrocarbon group such as aryl (meth) acrylate. The hydrocarbon group-containing (meth) acrylate may be used alone or in combination of two or more.
Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, isopentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, octadecyl (meth) acrylate, and nonadecyl (meth) acrylate.
Among these alkyl (meth) acrylates, preferred are alkyl (meth) acrylates having a linear or branched aliphatic hydrocarbon group having 1 to 20 carbon atoms (preferably 1 to 14 carbon atoms, more preferably 2 to 10 carbon atoms). When the carbon number is within the above range, the glass transition temperature of the acrylic resin can be easily adjusted, and the adhesiveness of the resin layer can be easily improved.
Examples of the alicyclic hydrocarbon group-containing (meth) acrylate include: (meth) acrylic esters having a monocyclic aliphatic hydrocarbon ring such as cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cycloheptyl (meth) acrylate, and cyclooctyl (meth) acrylate; (meth) acrylic esters having a bicyclic aliphatic hydrocarbon ring such as isobornyl (meth) acrylate; and (meth) acrylic esters having an aliphatic hydrocarbon ring having three or more rings, such as dicyclopentyl (meth) acrylate, dicyclopentyloxyethyl (meth) acrylate, tricyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate, 2-methyl-2-adamantyl (meth) acrylate, and 2-ethyl-2-adamantyl (meth) acrylate.
Examples of the (meth) acrylic acid ester having an aromatic hydrocarbon group include phenyl (meth) acrylate and benzyl (meth) acrylate.
Among these (meth) acrylic acid esters containing hydrocarbon groups, alkyl (meth) acrylates containing a linear or branched aliphatic hydrocarbon group are preferable, and (meth) acrylic acid esters containing an alicyclic hydrocarbon group are more preferable. In this case, the balance of the adhesiveness of the resin layer is good, and the following property to the irregularities of the adherend is excellent.
In order to properly exhibit basic properties such as adhesiveness due to the hydrocarbon group-containing (meth) acrylate and adhesiveness to an adherend in the resin layer, the ratio of the hydrocarbon group-containing (meth) acrylate in all the monomer components constituting the acrylic resin is preferably 40% by mass or more, more preferably 50% by mass or more, and still more preferably 60% by mass or more, relative to the total amount (100% by mass) of all the monomer components. The ratio is preferably 95% by mass or less, more preferably 80% by mass or less, from the viewpoint that the effect of the other monomer component can be obtained by copolymerizing the monomer component with the other monomer component.
The ratio of the alkyl (meth) acrylate having a linear or branched aliphatic hydrocarbon group in the total monomer components constituting the acrylic resin is preferably 30 mass% or more, more preferably 40 mass% or more, relative to the total amount (100 mass%) of the total monomer components. The ratio is preferably 90% by mass or less, more preferably 70% by mass or less.
The ratio of the (meth) acrylate having an alicyclic hydrocarbon group in the total monomer components constituting the acrylic resin is preferably 1% by mass or more, more preferably 5% by mass or more, relative to the total amount (100% by mass) of the total monomer components. The ratio is preferably 30% by mass or less, more preferably 20% by mass or less.
The acrylic resin may contain a structural unit derived from another monomer component copolymerizable with the hydrocarbon group-containing (meth) acrylate for the purpose of introducing the 1 st functional group described later and for the purpose of modifying the cohesive force, heat resistance, and the like. Examples of the other monomer component include monomers containing polar groups such as carboxyl group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, and nitrogen atom-containing monomers. The other monomer components may be used singly or in combination of two or more.
Examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Examples of the acid anhydride monomer include maleic anhydride and itaconic anhydride.
Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate.
Examples of the glycidyl group-containing monomer include glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate.
Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloxynaphthalene sulfonic acid.
Examples of the phosphate group-containing monomer include 2-hydroxyethyl acryloyl phosphate.
Examples of the nitrogen atom-containing monomer include morpholino-containing monomers such as (meth) acryloylmorpholine, cyano-containing monomers such as (meth) acrylonitrile, and amide-containing monomers such as (meth) acrylamide.
The polar group-containing monomer constituting the acrylic resin preferably contains a hydroxyl group-containing monomer. The hydroxyl group-containing monomer facilitates the introduction of the 1 st functional group described later. The acrylic resin and the resin layer are excellent in water resistance, less prone to fogging even when used in an environment of high humidity, and excellent in whitening resistance.
The hydroxyl group-containing monomer is preferably 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and more preferably 2-hydroxyethyl (meth) acrylate.
In order to properly exhibit basic properties such as adhesiveness due to the hydrocarbon group-containing (meth) acrylate and adhesion to an adherend in the resin layer, the ratio of the polar group-containing monomer in the total monomer components (100 mass%) constituting the acrylic resin is preferably 5 to 50 mass%, more preferably 10 to 40 mass%. In particular, the ratio of the hydroxyl group-containing monomer is preferably within the above range from the viewpoint that the water resistance of the resin layer is also more excellent.
The other monomer component may further include a vinyl monomer such as a caprolactone adduct of (meth) acrylic acid, vinyl acetate, vinyl propionate, styrene, and α -methylstyrene; glycol-based acrylate monomers such as polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, methoxyethylene glycol (meth) acrylate, and methoxypolypropylene glycol (meth) acrylate; tetrahydrofurfuryl (meth) acrylate, fluoro (meth) acrylate, silicone (meth) acrylate, alkoxy-substituted hydrocarbon group-containing (meth) acrylate (such as 2-methoxyethyl (meth) acrylate and 3-phenoxybenzyl (meth) acrylate).
The ratio of the other monomer components in the total monomer components (100 mass%) constituting the acrylic resin may be, for example, about 3 to 50 mass%, or may be 5 to 40 mass% or 10 to 30 mass%.
The acrylic resin may contain a structural unit derived from a multifunctional (meth) acrylate copolymerizable with a monomer component constituting the acrylic resin in order to form a crosslinked structure in the polymer skeleton thereof. Examples of the polyfunctional (meth) acrylate include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like. The polyfunctional monomer may be used alone or in combination of two or more.
In order to properly exhibit basic properties such as adhesiveness due to the hydrocarbon group-containing (meth) acrylate and adhesion to an adherend in the resin layer, the ratio of the polyfunctional monomer in all monomer components (100 mass%) constituting the acrylic resin is preferably 40 mass% or less, more preferably 30 mass% or less.
When the resin layer is a radiation curable resin layer, examples of the resin layer include: a layer containing a base polymer and a radiation-polymerizable monomer component and an oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond; a layer containing a polymer having a radiation polymerizable functional group (particularly, an acrylic resin) as a base polymer, and the like.
Examples of the radiation polymerizable functional group include a radiation radical polymerizable group such as a group containing a carbon-carbon unsaturated bond such as an ethylenically unsaturated group, a radiation cation polymerizable group, and the like. Examples of the group containing a carbon-carbon unsaturated bond include vinyl, propenyl, isopropenyl, acryl, and methacryl. Examples of the radiation cationically polymerizable group include an epoxy group, an oxetanyl group, and an oxetanyl group. Among them, a group containing a carbon-carbon unsaturated bond is preferable, and acryl and methacryl are more preferable. The radiation polymerizable functional group may be one kind or two or more kinds. The position of the radiation polymerizable functional group may be any of a polymer side chain, a polymer main chain, and a polymer main chain terminal.
The polymer having a radiation polymerizable functional group can be produced, for example, by a method in which a polymer having a reactive functional group (1 st functional group) and a compound having a functional group (2 nd functional group) capable of reacting with the 1 st functional group to form a bond are reacted and bonded in a state in which the radiation polymerization property of the radiation polymerizable functional group is maintained. Therefore, the polymer having a radiation polymerizable functional group preferably includes a structural portion derived from the polymer having a 1 st functional group and a structural portion derived from the compound having a 2 nd functional group and a radiation polymerizable functional group.
Examples of the combination of the 1 st functional group and the 2 nd functional group include a carboxyl group and an epoxy group, an epoxy group and a carboxyl group, a carboxyl group and an aziridine group, an aziridine group and a carboxyl group, a hydroxyl group and an isocyanate group, and an isocyanate group and a hydroxyl group. Among these, a combination of a hydroxyl group and an isocyanate group and a combination of an isocyanate group and a hydroxyl group are preferable from the viewpoint of ease of reaction tracking. The combination may be one kind or two or more kinds.
Examples of the compound having a radiation polymerizable functional group and an isocyanate group include methacryloyl isocyanate, 2-acryloyloxyethyl isocyanate, 2-methacryloyloxyethyl isocyanate (MOI), m-isopropenyl- α, α -dimethylbenzyl isocyanate, and the like. The above-mentioned compounds may be used singly or in combination of two or more.
The content of the structural portion derived from the compound having the 2 nd functional group and the radiation polymerizable functional group in the acrylic resin having the radiation polymerizable functional group is preferably 0.5 mol or more, more preferably 1 mol or more, still more preferably 3 mol or more, and particularly preferably 10 mol or more, based on 100 mol of the total amount of the structural portion derived from the acrylic resin having the 1 st functional group, from the viewpoint of enabling further progress of curing of the radiation curable resin layer. The content is, for example, 100 mol or less.
The molar ratio of the 2 nd functional group to the 1 st functional group [ 2 nd functional group/1 st functional group ] in the acrylic resin having a radiation-polymerizable functional group is preferably 0.01 or more, more preferably 0.05 or more, still more preferably 0.2 or more, and particularly preferably 0.4 or more, from the viewpoint of enabling further progress of curing of the radiation-curable resin layer. In addition, from the viewpoint of further reducing the low molecular weight substance in the radiation curable resin layer, the above molar ratio is preferably less than 1.0, more preferably 0.9 or less.
The acrylic resin is obtained by polymerizing the various monomer components. The polymerization method is not particularly limited, and examples thereof include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by irradiation of active energy rays (active energy ray polymerization method), and the like. The acrylic resin obtained may be any of a random copolymer, a block copolymer, a graft copolymer, and the like.
The acrylic resin having a radiation polymerizable functional group can be produced, for example, by the following method: after polymerizing (copolymerizing) a raw material monomer containing a monomer component having the 1 st functional group to obtain an acrylic resin having the 1 st functional group, the above-mentioned compound having the 2 nd functional group and the radiation polymerizable functional group is subjected to a condensation reaction or an addition reaction with the acrylic resin in a state where the radiation polymerization property of the radiation polymerizable functional group is maintained.
In the polymerization of the monomer component, various general solvents can be used. Examples of the solvent include: esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; alicyclic hydrocarbons such as cyclohexane and methylcyclohexane; organic solvents such as ketones including methyl ethyl ketone and methyl isobutyl ketone. The solvent may be used alone or in combination of two or more.
The polymerization initiator, chain transfer agent, emulsifier, etc. used in the radical polymerization of the monomer component are not particularly limited, and may be appropriately selected and used. The weight average molecular weight of the acrylic polymer can be controlled by the amount of the polymerization initiator, the amount of the chain transfer agent, and the reaction conditions, and the appropriate amount thereof can be adjusted according to the kind of the polymerization initiator, the chain transfer agent, and the reaction conditions.
As the polymerization initiator used in the polymerization of the monomer component, a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), or the like can be used depending on the kind of polymerization reaction. The polymerization initiator may be used alone or in combination of two or more.
The thermal polymerization initiator is not particularly limited, and examples thereof include azo-based polymerization initiators, peroxide-based polymerization initiators, redox-based polymerization initiators, and the like. The amount of the thermal polymerization initiator used is preferably 1 part by mass or less, more preferably 0.005 to 1 part by mass, and still more preferably 0.02 to 0.5 part by mass, based on 100 parts by mass of the total amount of all monomer components constituting the acrylic resin having the 1 st functional group.
Examples of the photopolymerization initiator include benzoin ether photopolymerization initiators, acetophenone photopolymerization initiators, α -ketol photopolymerization initiators, aromatic sulfonyl chloride photopolymerization initiators, photoactive oxime photopolymerization initiators, benzoin photopolymerization initiators, benzil photopolymerization initiators, benzophenone photopolymerization initiators, ketal photopolymerization initiators, thioxanthone photopolymerization initiators, acylphosphine oxide photopolymerization initiators, and titanocene photopolymerization initiators. Among them, acetophenone photopolymerization initiators are preferable.
Examples of the acetophenone photopolymerization initiator include 2, 2-diethoxyacetophenone, 2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, 4-phenoxydichloroacetophenone, 4- (tert-butyl) dichloroacetophenone, 1- [4- (2-hydroxyethoxy) -phenyl ] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, and methoxyacetophenone.
The amount of the photopolymerization initiator used is preferably 0.005 to 1 part by mass, more preferably 0.01 to 0.7 part by mass, and even more preferably 0.18 to 0.5 part by mass, based on 100 parts by mass of the total amount of all the monomer components constituting the acrylic resin. When the amount used is 0.005 parts by mass or more (particularly 0.18 parts by mass or more), the following tends to be the case: the molecular weight of the acrylic resin can be easily controlled to be small, and the concave-convex following property of the resin layer can be improved.
The reaction of the acrylic resin having the 1 st functional group and the compound having the 2 nd functional group and the radiation polymerizable functional group may be carried out, for example, by stirring in a solvent in the presence of a catalyst. The solvent may be the solvent described above. The above-mentioned catalyst is appropriately selected according to the combination of the 1 st functional group and the 2 nd functional group. The reaction temperature in the above reaction is, for example, 5 to 100℃and the reaction time is, for example, 1 to 36 hours.
The acrylic resin may have a structural part derived from a crosslinking agent. For example, the acrylic resin can be crosslinked to further reduce the low molecular weight substance in the resin layer. In addition, the weight average molecular weight of the acrylic resin can be increased. When the acrylic resin has a radiation polymerizable functional group, the crosslinking agent is a substance that crosslinks functional groups other than the radiation polymerizable functional group (for example, the 1 st functional group, the 2 nd functional group, or the 1 st functional group and the 2 nd functional group). The crosslinking agent may be used alone or in combination of two or more.
Examples of the crosslinking agent include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, amine-based crosslinking agents, silicone-based crosslinking agents, and silane-based crosslinking agents. Among these, isocyanate-based crosslinking agents and epoxy-based crosslinking agents are preferable, and isocyanate-based crosslinking agents are more preferable, from the viewpoint of excellent adhesion to the semiconductor element and low impurity ions.
Examples of the isocyanate-based crosslinking agent (polyfunctional isocyanate compound) include: lower aliphatic polyisocyanates such as 1, 2-ethylene diisocyanate, 1, 4-butylene diisocyanate, and 1, 6-hexamethylene diisocyanate; alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, and hydrogenated xylene diisocyanate; aromatic polyisocyanates such as 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, 4' -diphenylmethane diisocyanate, and xylylene diisocyanate. Examples of the isocyanate-based crosslinking agent include trimethylolpropane/toluene diisocyanate adduct, trimethylolpropane/hexamethylene diisocyanate adduct, and trimethylolpropane/xylylene diisocyanate adduct.
The content of the structural part derived from the crosslinking agent is not particularly limited, but is preferably 5 parts by mass or less, more preferably 0.001 to 5 parts by mass, and still more preferably 0.01 to 3 parts by mass, based on 100 parts by mass of the total amount of the acrylic resin excluding the structural part derived from the crosslinking agent.
The resin layer may contain other components than the above components within a range that does not impair the effects of the present invention. Examples of the other components include a curing agent, a crosslinking accelerator, a tackifying resin (rosin derivative, polyterpene resin, petroleum resin, oil-soluble phenol, etc.), an oligomer, an anti-aging agent, a filler (metal powder, organic filler, inorganic filler, etc.), an antioxidant, a plasticizer, a softener, a surfactant, an antistatic agent, a surface lubricant, a leveling agent, a light stabilizer, an ultraviolet absorber, a polymerization inhibitor, a particulate matter, a foil-like matter, and the like. The other components may be used alone or in combination of two or more.
The adhesive layer of the present invention is L when measured from the adhesive layer side under the conditions of 10 DEG field of view and light source D65 in a state of being adhered to an aluminum foil * a * b * L in (SCI) * (SCI), and/or L * a * b * L in (SCE) * (SCE) is preferably 70 or less, more preferably 60 or less, and still more preferably 50 or less. In addition, L * (SCE) is more preferably 40 or less. When the light reflected by the object includes regular reflected light and diffuse reflected light, the regular reflected light is light that is difficult to recognize by naked eyes. L (L) * (SCE) is a value obtained by measuring reflected light not including regular reflected light, L * When (SCE) is 70 or less, the appearance is excellent when the image display apparatus is visually recognized. On the other hand, L * (SCI) is a value obtained by measuring reflected light including regular reflected light, and can measure a color tone similar to the true color tone of an object, although the correlation with visibility to the naked eye is low. Thus, L * When (SCI) is 70 or less, the visibility of the image display device is excellent even when the image display device is affected by the environment. In the present specification, the above L may be referred to as L * (SCI) is called "reflection L * (SCI) ", the above L * (SCE) is called "reflection L * (SCE) ". Reflection L * (SCI) and reflection L * Specifically, (SCE) can be measured by the method described in examples. The reflection L * (SCI) and reflection L * (SCE) may be measured in a state where a transparent layer such as a release liner is provided on the surface of the pressure-sensitive adhesive layer opposite to the aluminum foil.
The diameter of the circular shape measured by the light diffusion effect confirmation test described below is preferably 60mm or more (particularly, more than 60 mm), more preferably 65mm or more, still more preferably 70mm or more, and particularly preferably 80mm or more, using a measurement sample obtained by bonding to a glass plate as the pressure-sensitive adhesive layer of the present invention. When the diameter of the circular shape is 60mm or more, uneven brightness is further suppressed.
< light diffusion Effect confirmation test >
An LED lamp was provided on the screen, the glass plate was brought into close contact with the LED lamp, and when light was irradiated from the LED lamp onto the screen through the glass plate, the position where the light having a circular shape with a diameter of 16mm appeared on the screen was set as the position of the LED lamp. Then, the diameter of the circular light that appears when light is irradiated from the LED lamp onto the screen through the glass plate and the adhesive layer was measured in a state where the glass plate side of the measurement sample obtained by bonding the adhesive layer of the present invention to the glass plate was in close contact with the LED lamp. The measurement may be performed in a state where a transparent layer such as a release liner is provided on the surface of the pressure-sensitive adhesive layer opposite to the glass plate.
The pressure-sensitive adhesive layer of the present invention may be in any form, and may be, for example, emulsion type, solvent type (solution type), active energy ray-curable type, hot melt type (hot melt type), or the like. Examples of the active energy ray include an ionizing radiation such as an α ray, a β ray, a γ ray, a neutron ray, and an electron ray, and ultraviolet rays are particularly preferable. That is, the active energy ray-curable adhesive layer is preferably an ultraviolet ray-curable adhesive layer.
The adhesive layer of the present invention can be produced, for example, as follows: coating (coating) an adhesive composition for forming an adhesive layer on a release liner, and drying and curing the resulting adhesive composition layer; the adhesive composition is coated (coated) on a release liner, and the adhesive composition layer obtained is cured by irradiation with active energy rays. If necessary, the material may be further dried by heating.
The pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer of the present invention contains, for example, the above-mentioned colorant, the above-mentioned light-diffusing fine particles, and other components as needed. When the pressure-sensitive adhesive layer of the present invention is the resin layer, the pressure-sensitive adhesive composition may contain a resin forming the resin layer, a monomer component as a constituent component of the resin, an oligomer of the monomer component, a partial polymer, and other pressure-sensitive adhesive components. Examples of the adhesive composition containing a resin include a so-called solvent type adhesive composition. Examples of the adhesive composition containing a monomer component, an oligomer component, or a partial polymer include so-called active energy ray-curable adhesive compositions.
The adhesive layer of the present invention is preferably used in a sheet for sealing 1 or more optical semiconductor elements disposed on a substrate. When the optical semiconductor element is sealed with the sheet including the adhesive layer of the present invention, the substrate surface is excellent in antireflection property, and uneven brightness due to light emitted from the optical semiconductor element is less likely to occur. And, it is difficult to cause color shift.
[ laminate sheet ]
The adhesive layer of the present invention may be laminated with other layers to form a laminate. Examples of the other layer include an adhesive layer other than the adhesive layer of the present invention, a resin layer, a base material portion described later, a layer having antiglare properties, a layer having antireflection properties, and the like. The laminate sheet may be provided with a plurality of adhesive layers of the present invention directly or indirectly. In this case, the plurality of adhesive layers of the present invention may be the same layer in thickness, composition, physical properties, or the like, or may be different layers.
The laminate sheet is preferably a sheet for sealing 1 or more optical semiconductor elements arranged on a substrate (sometimes referred to as an "optical semiconductor element sealing sheet"). The optical semiconductor element sealing sheet includes at least a sealing resin layer. In the present specification, "sealing the optical semiconductor element" means embedding at least a part of the optical semiconductor element in the sealing resin layer or following and covering the optical semiconductor element with the sealing resin layer. The sealing resin layer has flexibility that enables at least a part of the optical semiconductor element to be embedded therein or to be covered by following the sealing resin layer.
When the adhesive layer of the present invention is used as a constituent element of an optical semiconductor element sealing sheet, it functions as a layer having both the property of diffusing light and the property of preventing reflection of light by a metal wiring or the like provided on a substrate. Therefore, by using the adhesive layer of the present invention, it is possible to realize a thickness equivalent to 1 layer, as compared with the case of using 2 layers, that is, a light diffusion functional layer for the purpose of exerting a function of diffusing light and a colored layer for the purpose of preventing reflection of light by a metal wiring or the like provided on a substrate, as constituent elements of the optical semiconductor element sealing sheet, and therefore, it is possible to make the optical semiconductor device thinner, contributing to downsizing of the optical semiconductor device.
When the laminate sheet is the optical semiconductor element sealing sheet, the adhesive layer of the present invention is preferably a layer constituting the sealing resin layer. The sealing resin layer may include a non-diffusion functional layer as the other layer, which does not have a function of diffusing light.
The non-diffusion functional layer is a non-colored layer different from a colored layer described later. The non-diffusion functional layer may be a colorless layer or may be slightly colored. The non-diffusion functional layer may be transparent or non-transparent.
The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but is preferably less than 30%, more preferably 10% or less, further preferably 5% or less, particularly preferably 1% or less, and may be 0.5% or less, from the viewpoint of improving the light transmittance of the laminate. The lower limit of the haze value of the non-diffusion functional layer is not particularly limited.
The total light transmittance of the non-diffusion functional layer is not particularly limited, but is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, and particularly preferably 90% or more from the viewpoint of improving the light transmittance of the laminate sheet. The upper limit of the total light transmittance of the non-diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less.
The haze value and the total light transmittance of the non-diffusion functional layer are each a single layer, and can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, and the like of the non-diffusion functional layer.
The non-diffusion functional layer is preferably the resin layer. In this case, the constituent monomers of the resin in the non-diffusion functional layer and the resin that can be contained in the adhesive layer of the present invention may be the same or different in their composition ratio.
From the viewpoint of improving the light transmittance of the laminate sheet, the content of the colorant and/or the light-diffusing fine particles in the non-diffusion functional layer is preferably less than 0.01 parts by mass, more preferably less than 0.005 parts by mass, relative to 100 parts by mass of the resin constituting the non-diffusion functional layer.
When the sealing resin layer includes the pressure-sensitive adhesive layer of the present invention and the non-diffusion functional layer, the non-diffusion functional layer is preferably located on the side opposite to the adherend as compared with the pressure-sensitive adhesive layer of the present invention, and more preferably located on the surface of the sealing resin layer. When the non-diffusion functional layer is provided at the above-mentioned position, even when the adhesive layer surface of the present invention has a concave-convex shape in a state where the optical semiconductor element sealing sheet is bonded, the adhesive layer surface of the present invention is prevented from being exposed on the sealing resin layer surface on the opposite side to the optical semiconductor element, and the sealing resin layer surface on the front side is easily flattened, whereby the external light is less likely to be scattered and reflected, and the appearance of the optical semiconductor device is improved both at the time of extinction and at the time of light emission.
The sealing resin layer may include a layer other than the adhesive layer and the non-diffusion functional layer of the present invention. Examples of the other layer include a coloring layer and a diffusion functional layer. The colored layer and the diffusion functional layer are layers not belonging to the adhesive layer of the present invention. The colored layer is a layer that is intended to prevent reflection of light by a metal wiring or the like provided on a substrate and is not intended to perform a function of diffusing light. The diffusion functional layer is a non-colored layer for the purpose of performing a function of diffusing light and for the purpose of preventing reflection of light by a metal wiring or the like provided on a substrate. The diffusion functional layer may be a colorless layer or may be slightly colored. The diffusion functional layer may be transparent or non-transparent.
The total number of layers constituting the sealing resin layer is not particularly limited, and may be 2 or more, or 3 or more. The total number of the layers may be, for example, 10 or less, or 5 or less, or 4 or less from the viewpoint of reducing the thickness of the optical semiconductor device.
The coloring layer contains at least the coloring agent. The colored layer is preferably the resin layer. The content ratio of the colorant in the colored layer is preferably 0.2 mass% or more, more preferably 0.4 mass% or more, relative to 100 mass% of the total amount of the colored layer. The content of the colorant is, for example, 10 mass% or less, preferably 5 mass% or less, and more preferably 3 mass% or less.
The haze value (initial haze value) of the colored layer is preferably 50% or less, more preferably 40% or less, further preferably 30% or less, and particularly preferably 20% or less. The haze value of the colored layer is preferably 1% or more, more preferably 3% or more, still more preferably 5% or more, particularly preferably 8% or more, and may be 10% or more.
The total light transmittance of the colored layer is preferably 40% or less, more preferably 30% or less, further preferably 25% or less, and particularly preferably 20% or less. The total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, particularly preferably 2% or more, and may be 2.5% or more, or 3% or more.
The haze value and the total light transmittance of the colored layer are each a single-layer value, which can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, type of colorant, blending amount, and the like.
The diffusion functional layer preferably contains the light diffusing fine particles. The diffusion functional layer is preferably the resin layer. The diffusion functional layer may be transparent or non-transparent. The content ratio of the colorant in the diffusion functional layer is preferably less than 0.2 mass%, more preferably less than 0.1 mass%, still more preferably less than 0.05 mass%, and may be less than 0.01 mass% or less than 0.005 mass% relative to 100 mass% of the total diffusion functional layer.
The content of the light-diffusing fine particles in the diffusion functional layer is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, still more preferably 0.1 parts by mass or more, and particularly preferably 0.15 parts by mass or more, based on 100 parts by mass of the resin constituting the diffusion functional layer. The content of the light diffusing fine particles is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, based on 100 parts by mass of the resin constituting the diffusion functional layer.
The haze value (initial haze value) of the diffusion functional layer is preferably 30% or more, more preferably 40% or more, further preferably 50% or more, particularly preferably 60% or more, and may be 70% or more, 80% or more, 90% or more, 95% or more, 97% or more, further preferably 99.9% or more. The upper limit of the haze value of the diffusion functional layer may be 100%.
The total light transmittance of the diffusion functional layer is preferably 40% or more, more preferably 60% or more, further preferably 70% or more, and particularly preferably 80% or more. The total light transmittance of the diffusion functional layer may be less than 100%, 99.9% or less, or 99% or less.
The haze value and the total light transmittance of the diffusion functional layer are each a single layer, and can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, type of light diffusing fine particles, the amount of blending, and the like of the diffusion functional layer.
Each layer constituting the laminate may or may not have, independently, an adhesive property and/or an adhesive property. The layers constituting the sealing resin layer are particularly preferably adhesive and/or cohesive. With such a configuration, the sealing resin layer can easily seal the optical semiconductor element, and the sealing resin layer has excellent adhesion and/or adhesiveness between the layers, and further has excellent sealing properties. It is particularly preferable that at least the layer in contact with the optical semiconductor element has adhesion and/or adhesiveness. With such a configuration, the optical semiconductor element based on the sealing resin layer is excellent in following property and landfill property. As a result, the optical semiconductor device has excellent appearance even when the height difference due to the optical semiconductor device is high. The layer other than the layer in contact with the optical semiconductor element may not have adhesiveness and/or adhesiveness. In this case, the adhesion between the adjacent sealing resin layers in the flat state is low, and when the adjacent small-sized laminate (laminate in which the sealing resin layers seal the optical semiconductor elements arranged on the substrate) is pulled apart from each other, chipping of the sheet and adhesion of the adjacent sealing resin layers are less likely to occur.
Each of the layers constituting the sealing resin layer may be a radiation curable resin layer or a non-radiation curable resin layer independently.
The sealing resin layer may have a single-layer structure formed of a single layer of the adhesive layer of the present invention or a laminated structure including the adhesive layer of the present invention. The lamination structure of the sealing resin layer includes: a structure consisting of 2 adhesive layers of the present invention; the adhesive layer of the present invention is composed of 2 layers, 1 layer is the adhesive layer of the present invention, and 1 layer is the structure (different in order) of the adhesive layer, the colored layer, the diffusion functional layer, or the non-diffusion functional layer of the present invention; the adhesive layer of the present invention is composed of 3 layers, 1 layer, and 2 layers are each the structure (different in order) of the adhesive layer, the colored layer, the diffusion functional layer, or the non-diffusion functional layer of the present invention; the adhesive layer of the present invention is composed of 4 layers, 1 layer, and 3 layers are each the adhesive layer, the colored layer, the diffusion functional layer, or the structure (different order) of the non-diffusion functional layer of the present invention. More specifically, examples thereof include: [ adhesive layer of the present invention ], [ adhesive layer/non-diffusion functional layer of the present invention ], [ adhesive layer/non-diffusion functional layer/diffusion functional layer of the present invention ] (the order from the optical semiconductor element side is the above), and the like.
< substrate portion >
The laminate sheet may include a base material portion. In the above-described optical semiconductor element sealing sheet, the sealing resin layer may be provided on at least one surface of the base material portion. When the base material portion is provided on the opposite side of the sealing resin layer from the optical semiconductor element side in the optical semiconductor element sealing sheet, the surface of the sealing resin layer can be flattened, whereby light reflection disorder is less likely to occur, and the appearance of the optical semiconductor device is improved both at the time of extinction and at the time of light emission. Further, by forming an antiglare layer and an antireflection layer described later on the base material portion, antiglare properties and antireflection properties can be provided to the optical semiconductor device. In addition, the support, which is the adhesive layer of the present invention, in the laminate sheet is excellent in handling properties by providing the base material portion. The base material portion may not be provided.
The base material portion may be a single layer or may be a plurality of layers having the same composition, different thickness, or the like. When the base material portion is a plurality of layers, the layers may be bonded by other layers such as an adhesive layer. The base material layer used in the base material portion is a portion to be adhered to an adherend together with the pressure-sensitive adhesive layer and the sealing resin layer of the present invention, and a release liner to be peeled off at the time of use (at the time of adhesion) of the laminate sheet and a surface protective film for protecting only the surface of the base material portion are not included in the "base material portion".
Examples of the substrate layer constituting the substrate portion include glass, a plastic substrate (particularly, a plastic film), and the like. Examples of the resin constituting the plastic base material include: polyolefin resins such as low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homo-polypropylene, polybutene, polymethylpentene, ionomer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer; polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT), and the like; a polycarbonate; polyimide resin; polyether ether ketone; a polyetherimide; polyamides such as aramid and wholly aromatic polyamide; polyphenylene sulfide; a fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulose resins such as triacetyl cellulose (TAC); a silicone resin; acrylic resins such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; polyvinyl acetate, and the like. The resin may be used alone or in combination of two or more. The base material layer may be various optical films such as an Antireflection (AR) film, a polarizing plate, and a retardation plate.
The thickness of the plastic film is preferably 20 to 300. Mu.m, more preferably 40 to 250. Mu.m. When the thickness is 20 μm or more, the supporting property and handling property of the laminate are further improved. When the thickness is 300 μm or less, the overall thickness when the adhesive is adhered to an adherend can be further reduced.
For the purpose of improving adhesion, retention, and the like, the surface of the substrate portion on the side having the adhesive layer and the sealing resin layer may be subjected to physical treatments such as corona discharge treatment, plasma treatment, blasting treatment, ozone exposure treatment, flame exposure treatment, high-voltage electric shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; surface treatment such as easy adhesion treatment by a coating agent (primer). The surface treatment for improving the adhesion is preferably performed on the entire surface of the substrate portion on the side of the adhesive layer or the side of the sealing resin layer.
The thickness of the base material portion is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent functions as a support and scratch resistance of the surface. The thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of further excellent transparency.
< laminate sheet >
The laminate sheet may have a layer having antiglare properties and/or antireflection properties. With such a configuration, when the optical semiconductor element is sealed, gloss and reflection of light can be suppressed, and the appearance can be improved. The antiglare layer may be an antiglare layer. The antireflective layer may be an antireflective treatment layer. The antiglare treatment and the antireflection treatment can be carried out by known and conventional methods, respectively. The antiglare layer and the antireflection layer may be the same layer or may be different layers. The antiglare and/or antireflection layer may be provided in one layer or two or more layers. The antiglare and/or antireflection layer is preferably provided on one surface of the laminate sheet.
Fig. 1 and 2 are sectional views showing one embodiment of an optical semiconductor element sealing sheet having an adhesive layer of the present invention. As shown in fig. 1 and 2, the optical semiconductor element sealing sheet 1 is used for sealing 1 or more optical semiconductor elements arranged on a substrate, and includes a base material portion 4 and a sealing resin layer 2 formed on the base material portion 4. The base material portion 4 is composed of the base material film 41 and the functional layer 42 as the surface treatment layer, but may be composed of the base material film 41 without the functional layer 42.
In the optical semiconductor element sealing sheet 1 shown in fig. 1, the sealing resin layer 2 is formed of a single layer of the adhesive layer 21 of the present invention. A release liner 3 is attached to one surface of the pressure-sensitive adhesive layer 21 of the present invention, and a base material portion 4 is attached to the other surface.
In the optical semiconductor element sealing sheet 1 shown in fig. 2, the sealing resin layer 2 is formed of a laminate of the adhesive layer 21 and the non-diffusion functional layer 22 of the present invention. The non-diffusion functional layer 22 is directly laminated with the adhesive layer 21 of the present invention. The release liner 3 is attached to the pressure-sensitive adhesive layer 21 of the present invention, and the base material portion 4 is attached to the non-diffusion functional layer 22.
In fig. 1 and 2, the functional layer 42 is not included in the sealing resin layer, and examples thereof include layers that can impart various functions to the optical semiconductor element sealing sheet. Examples of the functional layer include a layer including a surface treatment layer. With such a configuration, the optical semiconductor element sealing sheet in which the functional layer including the surface treatment layer is laminated is excellent in light diffusion property and light extraction efficiency. Examples of the surface treatment layer include an antiglare treatment layer (antiglare treatment layer), an antireflection treatment layer, and a hard coat treatment layer. The functional layer may be laminated on the sealing resin layer in the optical semiconductor element sealing sheet, or may be laminated on the base material portion, preferably on the base material portion, and preferably on the side of the base material portion opposite to the side provided with the sealing resin layer when the base material portion is provided.
The haze value (initial haze value) of the laminate sheet is not particularly limited, but is preferably 80% or more, more preferably 85% or more, still more preferably 90% or more, particularly preferably 95% or more, from the viewpoint of making the effect of suppressing luminance unevenness and the appearance more excellent. The upper limit of the haze value is not particularly limited.
The total light transmittance of the laminate is not particularly limited, but is preferably 40% or less, more preferably 30% or less, and still more preferably 20% or less, from the viewpoint of further improving the function of preventing reflection of metal wiring or the like and improving contrast. From the viewpoint of securing brightness, the total light transmittance is preferably 0.5% or more.
The haze value and the total light transmittance can be measured by the methods defined in JIS K7136 and JIS K7361-1, and can be controlled by the lamination order, type, thickness, and the like of the layers constituting the laminate, for example, the sealing resin layer and the base material portion.
The thickness of the pressure-sensitive adhesive layer of the present invention is preferably 5 to 100. Mu.m, more preferably 10 to 80. Mu.m, still more preferably 20 to 70. Mu.m. When the thickness is 5 μm or more, the antireflection property and the light diffusion function are more excellent. When the thickness is 100 μm or less, the light transmittance is more easily ensured. The pressure-sensitive adhesive layer of the present invention can have a thickness of 100 μm or less while having functions of both the conventional colored layer and the light diffusion functional layer.
The thickness of the non-diffusion functional layer is, for example, 5 to 480. Mu.m, preferably 5 to 100. Mu.m, more preferably 10 to 80. Mu.m, still more preferably 20 to 70. Mu.m. When the thickness is 5 μm or more, the sealing property of the optical semiconductor element becomes more excellent. When the thickness is 480 μm or less, the luminance of the optical semiconductor element at the time of light emission can be more easily ensured.
The thickness of the sealing resin layer is, for example, 100 to 500. Mu.m, preferably 120 to 400. Mu.m, and more preferably 150 to 300. Mu.m. When the thickness is 100 μm or more, the sealing property of the optical semiconductor element becomes more excellent. When the thickness is 500 μm or less, the thickness of the optical semiconductor device becomes thinner.
The thickness of the laminate sheet (for example, the optical semiconductor element sealing sheet) is not particularly limited, but is preferably 500 μm or less, more preferably 400 μm or less, and still more preferably 300 μm or less. The pressure-sensitive adhesive layer of the present invention has both functions of the conventional colored layer and the light diffusion functional layer, and therefore can be thinned as compared with the conventional laminated sheet having both the colored layer and the light diffusion functional layer. The thickness is, for example, 10 μm or more.
[ Release liner ]
The pressure-sensitive adhesive layer and the sealing resin layer of the present invention may be formed on a release treated surface of a release liner. When the adhesive layer and the sealing resin layer of the present invention are formed on the base material portion, the side of the adhesive layer and the sealing resin layer of the present invention opposite to the base material layer is in contact with the release liner. When the base material portion is not provided, both surfaces of the adhesive layer and the sealing resin layer of the present invention may be the sides in contact with the release liner. The release liner is used as a protective material for the pressure-sensitive adhesive layer and the laminate sheet of the present invention, and is peeled off when attached to an adherend. It should be noted that the release liner may not be provided.
Examples of the release liner include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic film surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent, and papers.
The thickness of the release liner is, for example, 10 to 200. Mu.m, preferably 15 to 150. Mu.m, more preferably 20 to 100. Mu.m. When the thickness is 10 μm or more, breakage due to slitting is less likely to occur during processing of the release liner. When the thickness is 200 μm or less, the release liner is more easily peeled from the laminate sheet at the time of use.
[ method for producing optical semiconductor element sealing sheet ]
An embodiment of the method for manufacturing the optical semiconductor element sealing sheet will be described. For example, with respect to the optical semiconductor element sealing sheet 1 shown in fig. 1, the adhesive layer 21 of the present invention sandwiched by the release treated surfaces of 2 release liners was produced. One release liner attached to the adhesive layer 21 of the present invention is the release liner 3. Next, one of the release liners (not the release liner 3) attached to the pressure-sensitive adhesive layer 21 of the present invention is peeled off to expose the surface of the pressure-sensitive adhesive layer 21 of the present invention, and the exposed surface is attached to the base material portion 4. In this way, the optical semiconductor element sealing sheet 1 shown in fig. 1 in which the pressure-sensitive adhesive layer 21 and the release liner 3 of the present invention are laminated in this order on the base material portion 4 can be produced.
In addition, regarding the optical semiconductor element sealing sheet 1 shown in fig. 2, for example, the pressure-sensitive adhesive layer 21 and the non-diffusion functional layer 22 of the present invention each sandwiched by release treated surfaces of 2 release liners are produced. One release liner attached to the adhesive layer 21 of the present invention is the release liner 3. Then, one of the release liners attached to the non-diffusion functional layer 22 is peeled off to expose the surface of the non-diffusion functional layer 22, and the exposed surface is attached to the base material portion 4. Then, one of the release liners (not the release liner 3) attached to the pressure-sensitive adhesive layer 21 of the present invention is peeled off, and the exposed surface of the pressure-sensitive adhesive layer 21 of the present invention is attached to the surface of the non-diffusion functional layer 22 exposed by peeling off the release liner on the surface of the non-diffusion functional layer 22. The lamination of the various layers may be performed using a known roll or laminator. In this way, the optical semiconductor element sealing sheet 1 shown in fig. 2 in which the non-diffusion functional layer 22, the pressure-sensitive adhesive layer 21 of the present invention, and the release liner 3 are laminated in this order on the base material portion 4 can be produced.
[ optical semiconductor device ]
The optical semiconductor device such as a display can be manufactured using the optical semiconductor element sealing sheet of the present invention. An optical semiconductor device manufactured using the optical semiconductor element sealing sheet includes: a substrate, an optical semiconductor element arranged on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element or a cured product obtained by curing the sheet. In the case where the optical semiconductor element sealing sheet includes a radiation curable resin layer, the cured product is a cured product obtained by curing the radiation curable resin layer by irradiation with radiation.
Examples of the optical semiconductor element include Light Emitting Diodes (LEDs) such as blue light emitting diodes, green light emitting diodes, red light emitting diodes, and ultraviolet light emitting diodes.
In the above-described optical semiconductor device, the optical semiconductor element sealing sheet preferably seals a plurality of optical semiconductor elements at one time because the optical semiconductor element sealing sheet has excellent following property for irregularities and excellent following property and landfill property for the optical semiconductor elements when the optical semiconductor elements are convex portions and gaps between the plurality of optical semiconductor elements are concave portions.
The height of the optical semiconductor element on the substrate (the height from the substrate surface to the end on the front surface side of the optical semiconductor element) is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer is more excellent in following the concave-convex shape.
Fig. 3 shows an embodiment of an optical semiconductor device using the optical semiconductor element sealing sheet 1 shown in fig. 1. The optical semiconductor device 10 shown in fig. 3 includes: the semiconductor device includes a substrate 5, a plurality of optical semiconductor elements 6 arranged on one surface of the substrate 5, a sealing resin layer 7 sealing the optical semiconductor elements 6, and a base material portion 4 laminated on the sealing resin layer 7. The plurality of optical semiconductor elements 6 are sealed by the sealing resin layer 7 at one time. The sealing resin layer 7 is formed of a single layer of the diffusion function coloring layer 71. The diffusion function coloring layer 71 adheres to the optical semiconductor element 6 and the substrate 5 in accordance with the irregularities formed by the plurality of optical semiconductor elements 6, and fills the optical semiconductor element 6. The diffusion functional coloring layer 71 follows the concave-convex shape, and thus the interface on the optical semiconductor element 6 side has a concave-convex shape, and the interface on the other side is flat.
Fig. 4 shows an embodiment of an optical semiconductor device using the optical semiconductor element sealing sheet 1 shown in fig. 2. The optical semiconductor device 10 shown in fig. 4 includes: the semiconductor device includes a substrate 5, a plurality of optical semiconductor elements 6 arranged on one surface of the substrate 5, a sealing resin layer 7 sealing the optical semiconductor elements 6, and a base material portion 4 laminated on the sealing resin layer 7. The plurality of optical semiconductor elements 6 are sealed by the sealing resin layer 7 at one time. The sealing resin layer 7 is formed by laminating a diffusion functional coloring layer 71 and a non-diffusion functional layer 73. The diffusion function coloring layer 71 adheres to the optical semiconductor element 6 and the substrate 5 in accordance with the irregularities formed by the plurality of optical semiconductor elements 6, and fills the optical semiconductor element 6. The diffusion functional coloring layer 71 follows the concave-convex shape, and thus the interface on the optical semiconductor element 6 side has a concave-convex shape, and the interface on the other side is flat.
The sealing resin layer 7 is formed of the sealing resin layer 2. Specifically, in the optical semiconductor element sealing sheet 1, when the sealing resin layer 2 does not have a radiation curable resin layer, the sealing resin layer 2 becomes the sealing resin layer 7 in the optical semiconductor device 10. On the other hand, in the optical semiconductor element sealing sheet 1, when the sealing resin layer 2 has a radiation curable resin layer, for example, when the adhesive layer 21 of the present invention is a radiation curable resin layer, the adhesive layer 21 of the present invention is cured to form the diffusion functional coloring 71, thereby forming the sealing resin layer 7.
In the optical semiconductor device 10 shown in fig. 4, the optical semiconductor element 6 is completely embedded in the diffusion function colored layer 71 and sealed, and is indirectly sealed by the non-diffusion function layer 72. That is, the optical semiconductor element 6 is sealed with the sealing resin layer 7 formed of a laminate of the diffusion functional coloring layer 71 and the non-diffusion functional layer 72. The optical semiconductor device is not limited to this type, and for example, as shown in fig. 5, the optical semiconductor element 6 may be entirely embedded in the diffusion function colored layer 71 and the non-diffusion function layer 72 and sealed.
The optical semiconductor device may be a device in which the respective optical semiconductor devices are tiled. That is, the optical semiconductor device may be a device in which a plurality of optical semiconductor devices are arranged in a tile shape in a planar direction.
The optical semiconductor device preferably includes a self-luminous display device. The self-luminous display device can be combined with a display panel as needed to form a display body as an image display device. The optical semiconductor element in this case is an LED element. Examples of the self-luminous display device include an LED display, a backlight, and an organic electroluminescence (organic EL) display device. The backlight is particularly preferably a full-surface direct type backlight. The backlight includes, for example, a laminate including the substrate and a plurality of optical semiconductor elements disposed on the substrate as at least a part of a constituent member. For example, in the self-luminous display device, a metal wiring layer for transmitting a light emission control signal to each LED element is laminated on the substrate. The LED elements that emit light of red (R), green (G), and blue (B) are alternately arranged on the substrate with a metal wiring layer interposed therebetween. The metal wiring layer is made of a metal such as copper, and displays each color by adjusting the light emission degree of each LED element.
The optical semiconductor element sealing sheet can be used for an optical semiconductor device that is used for bending, for example, an optical semiconductor device having a bendable image display device (flexible display) (particularly, a foldable image display device (foldable display)). Specifically, the present invention can be used for a foldable backlight, a foldable self-luminous display device, and the like.
The optical semiconductor element sealing sheet is excellent in the following property and landfill property of the optical semiconductor element, and therefore can be preferably used both in the case of the mini LED display device and in the case of the micro LED display device.
[ method for manufacturing optical semiconductor device ]
The optical semiconductor device can be manufactured, for example, by bonding the optical semiconductor element sealing sheet to a substrate on which the optical semiconductor element is arranged and sealing the optical semiconductor element with a sealing resin layer.
(sealing Process)
The method for manufacturing an optical semiconductor device using the optical semiconductor element sealing sheet includes the following sealing steps: the optical semiconductor element sealing sheet is bonded to a substrate on which the optical semiconductor element is disposed, and the optical semiconductor element is sealed with a sealing resin layer. Specifically, in the sealing step, the release liner is peeled off from the optical semiconductor element sealing sheet to expose the sealing resin layer. Then, when the laminate is provided with a plurality of optical semiconductor elements, the plurality of optical semiconductor elements are further arranged so that the sealing resin layer fills gaps between the plurality of optical semiconductor elements, and the plurality of optical semiconductor elements are sealed together. Specifically, the release liner 3 is peeled off from the optical semiconductor element sealing sheet 1 shown in fig. 1 or 2, the exposed adhesive layer 21 of the present invention is disposed so as to face the surface of the substrate 5 on which the optical semiconductor element 6 is disposed, the optical semiconductor element sealing sheet 1 is bonded to the surface of the substrate 5 on which the optical semiconductor element 6 is disposed, and the optical semiconductor element 6 is embedded in the sealing resin layer 2.
The temperature at the time of bonding is, for example, in the range of room temperature to 110 ℃. In addition, the pressure may be reduced or increased during the bonding. By the pressure reduction and the pressure increase, formation of a void between the sealing resin layer and the substrate or the optical semiconductor element can be suppressed. In the sealing step, it is preferable that the optical semiconductor element sealing sheet is bonded under reduced pressure and then pressurized. The pressure at the time of depressurization is, for example, 1 to 100Pa, and the depressurization time is, for example, 5 to 600 seconds. The pressure at the time of pressurization is, for example, 0.05 to 0.5MPa, and the pressurization time is, for example, 5 to 600 seconds.
(radiation irradiation step)
When the sealing resin layer includes a radiation curable resin layer, the manufacturing method may further include a radiation irradiation step of: and irradiating a laminate including the substrate, the optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element with radiation, and curing the radiation-curable resin layer to form a cured layer. Examples of the radiation include electron beam, ultraviolet ray, α ray, β ray, γ ray, and X ray, as described above. Among them, ultraviolet rays are preferable. The temperature at the time of irradiation with the radiation is, for example, in the range of room temperature to 100℃and the irradiation time is, for example, 1 minute to 1 hour.
(cutting step)
The above manufacturing method may further include the following dicing step: cutting a laminate including the substrate, the optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element. The laminate may be subjected to the radiation irradiation step. When the laminate includes a cured product layer obtained by curing the radiation-curable resin layer by irradiation with the radiation, the cured product layer of the optical semiconductor element sealing sheet and the side end portion of the substrate are cut and removed in the dicing step. This makes it possible to expose the surface of the cured product layer, which is sufficiently cured and has low adhesion, on the side surface. The cutting may be performed by a known and conventional method, for example, by a method using a cutting blade or by irradiation with a laser.
(tiling step)
The above manufacturing method may further include a tiling step of: the plurality of optical semiconductor devices obtained in the dicing step are arranged so as to be in contact with each other in the planar direction. In the tiling step, the plurality of laminated bodies obtained in the dicing step are aligned so as to be in contact with each other in the planar direction, and are tiled. In this way, 1 large display can be manufactured.
As described above, an optical semiconductor device can be manufactured. In the optical semiconductor element sealing sheet 1, when the sealing resin layer 2 does not have a radiation-curable resin layer, the sealing resin layer 2 becomes the sealing resin layer 7 in the optical semiconductor device 10. On the other hand, in the optical semiconductor element sealing sheet 1, when the sealing resin layer 2 has a radiation curable resin layer, for example, when the adhesive layer 21 of the present invention is a radiation curable resin layer, the adhesive layer 21 of the present invention is cured to form the diffusion functional colored layer 71, thereby forming the sealing resin layer 7.
Examples
The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.
Production example 1
(preparation of acrylic prepolymer solution A)
67 parts by mass of Butyl Acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 19 parts by mass of 4-hydroxybutyl acrylate (4-HBA), 0.09 parts by mass of a photopolymerization initiator (trade name "omnirad184", manufactured by IGM Resins Italia Srl Co.) and 0.09 parts by mass of a photopolymerization initiator (trade name "omnirad 651", manufactured by IGM Resins Italia Srl Co.) were charged into a separable flask equipped with a thermometer, a stirrer, a reflux condenser and a nitrogen inlet tube, and nitrogen was introduced thereinto, followed by stirring for nitrogen substitution for about 1 hour. Then, at 5mW/cm 2 Irradiating ultraviolet rays to polymerize, and adjusting the reaction rate to 5-15% to obtain the acrylic prepolymer solution A.
Production example 2
(preparation of adhesive composition A)
To an acrylic prepolymer solution A prepared in production example 1 (the total amount of the prepolymer was 100 parts by mass), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 8 parts by mass of 4-hydroxybutyl acrylate (4 HBA), 0.02 parts by mass of dipentaerythritol hexaacrylate (trade name "KAYARAD DPHA", manufactured by Xinzhongcun chemical Co., ltd.), 0.35 parts by mass of a silane coupling agent (trade name "KBM-403", manufactured by Xinyue chemical Co., ltd., 3-glycidoxypropyl trimethoxysilane) and 0.3 parts by mass of a photopolymerization initiator (trade name "omnirad 651", manufactured by IGM Resins Italia Srl Co.) were added to obtain an adhesive composition A.
Examples 1 to 12
The adhesive composition a and the additive were mixed in the mass ratio of table 1 or table 2. The mixture (adhesive composition) was applied to a release-treated surface of a release liner (trade name "MRE38", mitsubishi chemical Co., ltd.) and a release-treated surface of a polyethylene terephthalate film was subjected to a release treatment to a thickness of 38 μm to form a resin composition layer, and then the release-treated surface of the release liner (trade name "MRF38", mitsubishi chemical Co., ltd.) was also bonded to the resin composition layer. Next, black is used The light was irradiated with ultraviolet rays of illuminance described in Table 1 or Table 2 until the cumulative light amount was 2520mJ/cm 2 Polymerization was carried out to prepare the adhesive layers (thickness: 50 μm) of examples 1 to 12. 9256BLACK is a 20% dispersion of BLACK pigment (trade name "9256BLACK", manufactured by tokusiki co., ltd.). In addition, tospin 145 is under the trade name "Tospin 145" (silicone resin manufactured by Momentive Performance Materials Japan, refractive index: 1.42, average particle diameter: 4.5 μm). Ti-PURE R-706 is a titanium dioxide pigment having a trade name of "Ti-PURE-PAINT COATINGS-DRY GRADES R-706" (manufactured by DUPONT Corp.).
The adhesive sheets of examples 1 to 12 were produced by peeling one release liner (trade name "MRE 38") from the adhesive layer obtained as described above, and bonding the exposed adhesive surface to the adhesive surface of a non-diffusion functional adhesive layer (thickness 150 μm, total light transmittance: 92.1%, haze value: 0.4%) which did not function to diffuse light.
Examples 13 to 15
The adhesive composition a and the additive were mixed in the mass ratio of table 2. The mixture (adhesive composition) was applied to a release-treated surface of a release liner (trade name "MRE38", mitsubishi chemical Co., ltd.) and a release-treated surface of a polyethylene terephthalate film was subjected to a release treatment to a thickness of 38 μm to form a resin composition layer, and then the release-treated surface of the release liner (trade name "MRF38", mitsubishi chemical Co., ltd.) was also bonded to the resin composition layer. Next, the ultraviolet rays of illuminance described in Table 2 were irradiated with a black light until the cumulative light amount was 2520mJ/cm 2 Polymerization was carried out to prepare the adhesive layers (adhesive sheets) (thickness: 50 μm) of examples 13 to 15. The BA is butyl acrylate. Further, DPHA is dipentaerythritol hexaacrylate (trade name "KAYARAD DPHA", manufactured by Xinzhou chemical Co., ltd.). In addition, 4HBA is 4-hydroxybutyl acrylate.
Comparative examples 1 to 4
The adhesive composition a and the additive were mixed in the mass ratio of table 2. The mixture (adhesive composition) was coated on a release liner (trade name "MRE38", mitsubishi chemical)After a resin composition layer was formed on a release-treated surface of a polyethylene terephthalate film, which had been subjected to a release treatment and had a thickness of 38 μm, a release liner (trade name "MRF38", manufactured by Mitsubishi chemical Co., ltd.) was also attached to the resin composition layer. Next, the ultraviolet rays of illuminance described in Table 2 were irradiated with a black light until the cumulative light amount was 2520mJ/cm 2 The adhesive layers (thickness: 50 μm) of comparative examples 1 to 4 were produced by polymerization.
< evaluation >
The adhesive layers obtained in examples and comparative examples were evaluated as follows. The results are shown in tables 3 and 4.
(1) Total light transmittance
The release liners on one side were peeled off from the adhesive layers (in the form of being sandwiched by 2 release liners) produced in examples and comparative examples, and the exposed surfaces of the adhesive layers were bonded to glass plates (glass slides, model "S-9112", manufactured by Song Nitro Corp Co., ltd.). Then, the other side of the release liner was peeled off to prepare a measurement sample having a layer structure of [ glass plate/adhesive layer ]. For the above measurement samples, total light transmittance was measured by a haze meter (device name "HM-150", manufactured by color technology research, inc.). Measurement light is incident from the adhesive layer side to perform measurement.
(2) Haze value
For the measurement sample prepared for measuring the total light transmittance, the total light transmittance and the diffuse transmittance were measured by a haze meter (device name "HM-150", manufactured by color technology research, inc.). Then, the haze value of the measurement sample was obtained by the mathematical expression of "diffuse transmittance/total transmittance×100", and was used as the initial haze value. Measurement light is incident from the adhesive layer side to perform measurement.
(3) Reflection L * Measurement
The surface of an inner roll of aluminum foil (width 30 cm. Times.length 50 m. Times.thickness 12 μm) manufactured by Mitsubishi aluminum Co., ltd.) was laminated with a release liner of the adhesive layer obtained in examples and comparative examples by using a manual roller so as not to mix air bubbles, and a measurement sample was produced. Paste After the combination, the mixture was left under light shielding at 25℃for 30 minutes. The attached samples were then cut out in a size of greater than 5.0cm by 5.0 cm. Then, the measurement sample was left standing on the flat surface with the release liner of the adhesive layer facing outward. Then, L was carried out from the side of the release liner surface by using a spectrocolorimeter (trade name "CM-26dG", manufactured by Konica Minolta, inc.) * (SCI) and L * (SCE) determination. The measurement area of the colorimeter was set so as to reach the center of the measurement sample, and the measurement was performed under the following conditions. Before measurement by the above-mentioned spectrocolorimeter, zero point correction, white correction, and GROSS correction were performed according to the manufacturer's manual. When measuring only aluminum foil (inner wrap surface), L * (SCI) 95.88, L * (SCE) 88.32. Thus, will reflect L * (SCI) and reflection L * Cases where both (SCE) were 60 or less were evaluated as "anti-reflective" and cases where one was higher than 60 and 70 or less and the other was 70 or less (cases other than case number and x) were evaluated as "Δ", and cases where at least one was higher than 70 were evaluated as "anti-reflective" x ".
< measurement conditions >
The measuring method comprises the following steps: color and light ration
Geometry: di:8 °, de:8 degree
Regular reflected light treatment: SCI+SCE
Observation light source: d65 (D65)
Observation conditions: 10 degree view
Diameter measurement: MAV (8 mm)
UV conditions: 100% full
Automatic average measurement: 3 times
Zero point correction: effective and effective
(4) Light diffusion effect confirmation test
One release liner of each adhesive layer produced in examples and comparative examples was peeled off and bonded to a glass plate (glass slide, model "S-9112", manufactured by Song Nitro Co., ltd., 76 mm. Times.52 mm. Times.1.0 to 1.2 mm) using a manual roller so as not to mix air bubbles. After bonding, the laminate was left under light shielding at 25℃for 30 minutes. The size of the adhesive layer to be adhered was cut into the same size as the glass plate, and a measurement sample was prepared. An LED lamp (trade name "LK-3PG", EK JAPAN co., ltd.) was set at the upper part of the screen in a height of 2.4 cm. The glass plate side of the obtained measurement sample was brought into close contact with an LED lamp. A battery case (trade name "AP-180", manufactured by EK JAPAN CO., LTD.) was attached to the LED lamp to turn on the LED lamp, and the diameter of the circular image reflected on the screen was measured. When the measurement was performed only on a glass plate without an adhesive layer, the diameter of light reflected on the screen was 16mm. When measured through the pressure-sensitive adhesive layer, the light diameters of 65mm or more were judged to have a good light diffusion effect (uneven brightness ". Smallness"), the light diameters of more than 60mm and less than 65mm were judged to have a light diffusion effect (uneven brightness ". DELTA."), and the light diameters of 60mm or less were judged to have a no light diffusion effect (uneven brightness ". Smallness").
(5) Compatibility of
The case where both the antireflection property and the luminance unevenness were "Σ" was evaluated as "Σ", the case where one of the antireflection property and the luminance unevenness was "Δγ" or "Δγ" was evaluated as "Δγ", and the case where at least one of the antireflection property and the luminance unevenness was "×" was evaluated as "×".
TABLE 1
(Table 1)
TABLE 2
(Table 2)
TABLE 3
(Table 3)
| Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | Example 7 | Example 8 | Example 9 | Example 10 | |
| Total light transmittance [%] | 19.7 | 21.9 | 5.0 | 22.7 | 14.7 | 12.4 | 13.2 | 63.8 | 62.0 | 40.4 |
| Haze value [%] | 88.8 | 95.4 | 98.0 | 63.0 | 94.6 | 84.7 | 65.2 | 94.4 | 82.4 | 67.8 |
| Light diffusion effect was confirmed [ mm ]] | 85 | 100 | 98 | 70 | 100 | 75 | 70 | 120 | 100 | 75 |
| Reflection L (SCI) | 40.92 | 40.05 | 46.30 | 42.68 | 37.70 | 37.76 | 37.66 | 69.17 | 68.33 | 50.63 |
| Reflection L (SCE) | 25.87 | 25.65 | 34.91 | 28.01 | 18.75 | 18.77 | 18.32 | 62.79 | 61.50 | 41.09 |
| Anti-reflection properties | ○ | ○ | ○ | ○ | ○ | ○ | ○ | △ | △ | ○ |
| Uneven brightness | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
| Compatibility of | ○ | ○ | ○ | ○ | ○ | ○ | ○ | △ | △ | ○ |
TABLE 4
(Table 4)
| Example 11 | Example 12 | Example 13 | Example 14 | Example 15 | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | |
| Total penetrationLight ratio [%] | 38.4 | 18.5 | 24.5 | 32.9 | 45.2 | 19.2 | 91.9 | 17.2 | 92.1 |
| Haze value [%] | 75.8 | 61.0 | 98.0 | 98.2 | 98.2 | 9.9 | 93.7 | 53.5 | 0.4 |
| Light diffusion effect was confirmed [ mm ]] | 80 | 70 | 90 | 100 | 120 | 55 | 130 | 60 | 50 |
| Reflection L (SCI) | 50.87 | 38.59 | 42.44 | 46.53 | 53.94 | 40.04 | 93.77 | 37.88 | 93.69 |
| Reflection L (SCE) | 41.20 | 23.07 | 28.93 | 35.04 | 45.12 | 23.84 | 88.21 | 21.84 | 88.21 |
| Anti-reflection properties | ○ | ○ | ○ | ○ | ○ | ○ | × | ○ | × |
| Uneven brightness | ○ | ○ | ○ | ○ | ○ | × | ○ | × | × |
| Compatibility of | ○ | ○ | ○ | ○ | ○ | × | × | × | × |
The following describes variations of the disclosed invention.
[ appendix 1] an adhesive layer having a haze value of 61% or more and a total light transmittance of 69% or less.
[ additional note 2] a laminate sheet comprising the adhesive layer described in additional note 1.
The laminate according to item 2, which has an antiglare and/or antireflection layer on one surface.
The laminate according to item 2, which has a thickness of 500 μm or less.
[ additional note 5] an adhesive composition comprising a colorant and light-diffusing fine particles, wherein the haze value at the time of forming an adhesive layer is 61% or more and the total light transmittance is 69% or less.
[ additional note 6] an optical semiconductor device comprising: a substrate; an optical semiconductor element disposed on the substrate; and the laminate sheet or the cured product thereof according to any one of supplementary notes 2 to 4 for sealing the optical semiconductor element.
Claims (6)
1. An adhesive layer having a haze value of 61% or more and a total light transmittance of 69% or less,
the adhesive layer contains a colorant and light-diffusing microparticles,
the light diffusing fine particles are fine particles made of silicone resin and have a refractive index of 1.2 to 5.
2. A laminated sheet comprising the adhesive layer according to claim 1.
3. The laminate according to claim 2, which has a layer having antiglare property and/or antireflection property on one surface.
4. The laminate according to claim 2, which has a thickness of 500 μm or less.
5. An adhesive composition comprising a colorant and light diffusing particles,
the light diffusing fine particles are fine particles made of a silicone resin and have a refractive index of 1.2 to 5,
The haze value at the time of forming the adhesive layer is 61% or more and the total light transmittance is 69% or less.
6. An optical semiconductor device, comprising: a substrate; an optical semiconductor element disposed on the substrate; and the laminate sheet or the cured product thereof according to any one of claims 2 to 4 sealing the optical semiconductor element.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022049426 | 2022-03-25 | ||
| JP2022-049426 | 2022-03-25 | ||
| JP2022162870A JP7289008B1 (en) | 2022-03-25 | 2022-10-11 | ADHESIVE LAYER, LAMINATED SHEET, ADHESIVE COMPOSITION, AND OPTICAL SEMICONDUCTOR DEVICE |
| JP2022-162870 | 2022-10-11 | ||
| CN202310112194.3A CN116254071A (en) | 2022-03-25 | 2023-02-14 | Adhesive layer, laminate, adhesive composition, and optical semiconductor device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310112194.3A Division CN116254071A (en) | 2022-03-25 | 2023-02-14 | Adhesive layer, laminate, adhesive composition, and optical semiconductor device |
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| CN117801715A true CN117801715A (en) | 2024-04-02 |
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| CN202410034629.1A Pending CN117801715A (en) | 2022-03-25 | 2023-02-14 | Adhesive layer, laminate, adhesive composition, and optical semiconductor device |
| CN202310112194.3A Pending CN116254071A (en) | 2022-03-25 | 2023-02-14 | Adhesive layer, laminate, adhesive composition, and optical semiconductor device |
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| Country | Link |
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| JP (1) | JP7289008B1 (en) |
| KR (1) | KR20230140504A (en) |
| CN (2) | CN117801715A (en) |
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| JP7495003B1 (en) | 2023-08-23 | 2024-06-04 | ａｒｔｉｅｎｃｅ株式会社 | Encapsulating sheet and display having resin composition layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11335639A (en) | 1998-03-26 | 1999-12-07 | Tomoegawa Paper Co Ltd | Sticking film for electronic display |
| JP2000096035A (en) * | 1998-09-25 | 2000-04-04 | Sekisui Chem Co Ltd | Sheet or tape for sealing |
| JP4992280B2 (en) * | 2006-04-14 | 2012-08-08 | ソニー株式会社 | Liquid crystal display |
| JP2010072453A (en) * | 2008-09-19 | 2010-04-02 | Toppan Printing Co Ltd | Optical diffuser, optical sheet, backlight unit, and display |
| JP7198009B2 (en) * | 2018-07-11 | 2022-12-28 | リンテック株式会社 | Display body manufacturing method |
| JP6792662B2 (en) | 2019-03-29 | 2020-11-25 | リンテック株式会社 | Colored adhesive sheet and display |
| JP2021138825A (en) | 2020-03-04 | 2021-09-16 | リンテック株式会社 | Adhesive sheet, back-light unit and display device |
| JP6945090B1 (en) * | 2020-08-31 | 2021-10-06 | 日東電工株式会社 | Adhesive sheets, display devices and laminates |
| JP2022157898A (en) * | 2021-03-31 | 2022-10-14 | 株式会社巴川製紙所 | Optical film laminate, optical film laminate with polarizer plate and display device |
-
2022
- 2022-10-11 JP JP2022162870A patent/JP7289008B1/en active Active
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- 2023-02-14 CN CN202410034629.1A patent/CN117801715A/en active Pending
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| JP2023143639A (en) | 2023-10-06 |
| JP7289008B1 (en) | 2023-06-08 |
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| TW202409231A (en) | 2024-03-01 |
| KR20230140504A (en) | 2023-10-06 |
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