CN117790196A - Super-capacitor energy storage device, temperature control method and electronic equipment - Google Patents
Super-capacitor energy storage device, temperature control method and electronic equipment Download PDFInfo
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Abstract
The invention discloses a super-capacitor energy storage device, a temperature control method and electronic equipment. The flexible thermoelectric module is arranged between the corresponding capacitor module and the corresponding liquid cooling plate, the capacitor management system is connected with two ends of the flexible thermoelectric module, and the capacitor management system is used for applying counter-potential to two ends of the flexible thermoelectric module under the condition that overheat of the capacitor module is detected, so that the flexible thermoelectric module performs electric refrigeration for the corresponding capacitor module. The thermoelectric assembly with at least two flexible thermoelectric modules connected in series generates recovery electric energy by utilizing the temperature difference between the capacitor module and the corresponding liquid cooling plate to supply power for the capacitor management system, so that auxiliary cooling of the super capacitor by thermoelectric materials is realized, the thermoelectric power generation is utilized to supplement electricity for the electricity utilization element in the device, and the electricity utilization efficiency of the super capacitor is improved while the cooling effect is enhanced.
Description
Technical Field
The invention relates to the field of energy storage capacitors, in particular to a super-capacitor energy storage device, a temperature control method and electronic equipment.
Background
The super capacitor for the vehicle has the excellent characteristics of high multiplying power, rapid charge and discharge and the like, but the problem of heating is to be solved in the following. Under the condition that the cooling device is not arranged, the heating temperature range of the super capacitor in normal operation can reach 45-70 ℃. Under the working condition of long-term high temperature, the capacity of the super capacitor is reduced.
The existing temperature control scheme adopts liquid cooling or air cooling, and the effect is often limited when the scheme is used for coping with a super capacitor energy storage device with large capacity and large current.
Disclosure of Invention
The invention provides a super-capacitor energy storage device, a temperature control method and electronic equipment, which are used for improving the power utilization efficiency of a super-capacitor while enhancing the cooling effect.
According to an aspect of the present invention, there is provided a super capacitor energy storage device, including a plurality of capacitor modules, a capacitor management system, a flexible thermoelectric module and a liquid cooling plate corresponding to the capacitor modules;
the flexible thermoelectric module is arranged between the corresponding capacitor module and the corresponding liquid cooling plate and comprises a plurality of PN junction units which are connected in series and arranged in an array manner, and each PN junction unit comprises a P-type thermoelectric material semiconductor, an N-type thermoelectric material semiconductor, a heat conducting plate, a first heat preservation plate and a second heat preservation plate; the first cold insulation plate and the second cold insulation plate are arranged on a first film layer adjacent to the liquid cooling plate, the cold end of the P-type thermoelectric material semiconductor is connected with one surface of the first cold insulation plate, which is closer to the liquid cooling plate, and the cold end of the P-type thermoelectric material semiconductor is connected with one surface of the second cold insulation plate, which is closer to the liquid cooling plate; the heat conducting plate is arranged on the second film layer, and the hot end of the P-type thermoelectric material semiconductor and the N-type thermoelectric material are arranged on the heat conducting plateThe hot ends of the semiconductors are respectively connected with two ends of one surface, which is closer to the liquid cooling plate, of the heat conducting plate; wherein the heat conduction coefficient of the heat conduction plate is higher than the heat conduction coefficients of the first cold insulation plate and the second cold insulation plate; the expansion area of the cold insulation plate is 1 to 2mm 2 Within the range of (1), gaps are arranged between the adjacent heat conducting plates and gaps are arranged between the adjacent cold insulation plates
The capacitance management system is connected with two ends of the flexible thermoelectric module, and is used for applying counter-potential to the two ends of the flexible thermoelectric module under the condition that the overheat of the capacitance module is detected, so that the flexible thermoelectric module performs electric refrigeration for the corresponding capacitance module;
the thermoelectric assembly formed by connecting at least two flexible thermoelectric modules in series is connected with the capacitance management system, and the thermoelectric assembly is used for generating recovery electric energy by utilizing the temperature difference between the capacitance module and the corresponding liquid cooling plate to supply power for the capacitance management system.
Optionally, the heat conducting plate comprises a metal plate; the first cold-retaining plate and the second cold-retaining plate each comprise a ceramic plate.
Optionally, the flexible thermoelectric module further includes a buffer layer, and the buffer layer is disposed between the capacitor module and the heat conducting plate.
Optionally, the P-type thermoelectric material semiconductor comprises a P-type bismuth telluride semiconductor; the N-type thermoelectric material semiconductor includes an N-type bismuth telluride semiconductor.
Optionally, the capacitance management system is further configured to apply a counter potential to two ends of the flexible thermoelectric module corresponding to the overheated capacitance module when the capacitance management system detects that the capacitance module is overheated, so that the flexible thermoelectric module performs electric refrigeration for the corresponding capacitance module.
Optionally, the capacitance management system is further configured to apply a counter potential to both ends of all the flexible thermoelectric modules when the capacitance management system detects that the capacitance module is overheated, so that the flexible thermoelectric modules electrically refrigerates the corresponding capacitance modules.
According to another aspect of the present invention, there is provided a temperature control method of a supercapacitor energy storage device, which is characterized in that the temperature control method applied to the supercapacitor energy storage device of the first aspect includes:
acquiring temperature data of each capacitor module;
controlling the liquid cooling plate to cool the capacitor module under the condition that the highest temperature value in the temperature data is within a preset temperature range;
and under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, controlling the liquid cooling plate to cool the capacitor module, and applying counter electromotive force to the two ends of the flexible thermoelectric module so as to electrically cool the corresponding capacitor module by the flexible thermoelectric module.
Optionally, under the condition that a highest temperature value in the temperature data exceeds an upper limit of the preset temperature range, controlling the liquid cooling plate to cool the capacitor module, and applying counter electromotive force to two ends of the flexible thermoelectric module, so that the flexible thermoelectric module performs electric refrigeration for the capacitor module corresponding to the flexible thermoelectric module, including:
and under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, applying counter electromotive force to the two ends of all the flexible thermoelectric modules so that the flexible thermoelectric modules electrically refrigerate the corresponding capacitor modules.
Optionally, under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, controlling the liquid cooling plate to cool the super capacitor, and applying counter electromotive force to two ends of the flexible thermoelectric module, so that the flexible thermoelectric module performs electric refrigeration for the capacitor module corresponding to the flexible thermoelectric module, including:
under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, determining the capacitor module corresponding to the temperature data exceeding the upper limit of the preset temperature range as a target module;
and applying counter electromotive force to two ends of the flexible thermoelectric module corresponding to the target module, so that the flexible thermoelectric module performs electric refrigeration on the target module.
According to another aspect of the present invention, there is provided an electronic apparatus including:
at least one processor; and
a memory communicatively coupled to the at least one processor; wherein,
the memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the method for controlling the temperature of the supercapacitor energy storage device according to any one of the embodiments of the present invention.
In the super-capacitor energy storage device, the temperature control method and the electronic equipment provided by the embodiment of the invention, the super-capacitor energy storage device comprises a plurality of capacitor modules, a capacitor management system, a flexible thermoelectric module and a liquid cooling plate, wherein the flexible thermoelectric module and the liquid cooling plate correspond to the capacitor modules. The flexible thermoelectric module is arranged between the corresponding capacitor module and the corresponding liquid cooling plate, the capacitor management system is connected with two ends of the flexible thermoelectric module, and the capacitor management system is used for applying counter-potential to two ends of the flexible thermoelectric module under the condition that overheat of the capacitor module is detected, so that the flexible thermoelectric module performs electric refrigeration for the corresponding capacitor module. The total positive electrode and the total negative electrode of the at least two flexible thermoelectric modules which are connected in series are respectively connected with the capacitance management system to supply power for the capacitance management system, so that the auxiliary cooling of the thermoelectric material to the super capacitor is realized, the thermoelectric power generation is utilized to supplement electricity for the electricity utilization element in the device, and the electricity utilization efficiency of the super capacitor is improved while the cooling effect is enhanced.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows the microscopic principle of the seebeck effect;
fig. 2 is a schematic diagram of a supercapacitor energy storage device according to an embodiment of the present invention;
fig. 3 is a schematic plan view of a capacitive module and a flexible thermoelectric module and a liquid cooling plate corresponding to the capacitive module according to an embodiment of the present invention;
fig. 4 is a schematic perspective view of a capacitor module and a flexible thermoelectric module and a liquid cooling plate corresponding to the capacitor module according to an embodiment of the present invention;
fig. 5 is a schematic plan view of another capacitor module and a flexible thermoelectric module and a liquid cooling plate corresponding to the capacitor module according to an embodiment of the present invention;
fig. 6 is a schematic plan view of a capacitor module and a flexible thermoelectric module and a liquid cooling plate corresponding to the capacitor module according to an embodiment of the present invention;
fig. 7 is a schematic flow chart of a temperature control method of a super capacitor energy storage device according to an embodiment of the present invention;
FIG. 8 shows a schematic diagram of an electronic device that may be used to implement an embodiment of the invention;
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As described in the background art, the research of the inventor of the application finds that the super capacitor has the excellent characteristics of high multiplying power, high charging and discharging speed and the like, and under normal working conditions, the output power and the output current of the super capacitor in unit time far exceed those of the traditional energy storage device, so that the heat production capacity of the super capacitor is higher compared with that of the traditional energy storage device, and the super capacitor has higher requirements on the cooling effect compared with that of the traditional energy storage device. Under the working condition of long-term high temperature, the capacity of the super capacitor is reduced. The existing temperature control scheme adopts single liquid cooling or air cooling, and when the scheme is used for coping with the super capacitor energy storage device with large capacity and large current, the effect is limited, and the problems that the capacity of the super capacitor decays too quickly and even thermal runaway occurs are caused. There is a need for a more efficient cooling scheme for supercapacitors.
Further studies by the inventors of the present application have found that some thermoelectric materials have an optimal dimensionless thermoelectric performance figure of merit (also referred to as ZT value) equal to about 1 under operating conditions of 25 ℃, and their good seebeck coefficient can enable their good flexibility in the application fields of the seebeck effect and the peclet effect. The formula of the Seebeck coefficient isThe formula of ZT value is +.>Wherein dV is the potential difference across the thermoelectric material, dT is the temperature difference across the thermoelectric material, S is the Seebeck coefficient, σ is the electrical conductivity, T is the absolute temperature, k is the thermal conductivity, and the microscopic principle of the Seebeck effect is shown in FIG. 1. However, when a reverse electromotive force is applied to the thermoelectric material, carriers flow from the cold side to the hot side of the thermoelectric material, so that the conversion from the plug Bei Kexiao to the Peltier effect can be realized, and the Peltier effect can absorb heat. If the principle is applied to the cooling mode of the super capacitor, on one hand, the energy recovery can be carried out by utilizing the Seebeck effect by utilizing the temperature difference between the liquid cooling plate and the super capacitor, and on the other hand, when the temperature of the super capacitor is too high, the electric potential can be applied to the thermoelectric material, so that the thermoelectric material realizes the Peltier effect and the auxiliary cooling effect. The foregoing is a description of the general inventive concept.
Based on the above, the embodiment of the invention provides a super capacitor energy storage device. Fig. 2 is a schematic composition diagram of a super capacitor energy storage device provided by the embodiment of the present invention, fig. 3 is a schematic planar structure diagram of a capacitor module and a corresponding flexible thermoelectric module and a liquid cooling plate provided by the embodiment of the present invention, and fig. 4 is a schematic three-dimensional structure diagram of a capacitor module and a corresponding flexible thermoelectric module and a liquid cooling plate provided by the embodiment of the present invention, wherein, in order to facilitate structural observation, the capacitor module in fig. 4 is subjected to transparent processing, and in combination with fig. 2, fig. 3 and fig. 4, the super capacitor energy storage device 200 includes a plurality of capacitor modules 201, a capacitor management system 202, a flexible thermoelectric module 203 corresponding to the capacitor modules 201, and a liquid cooling plate 204.
The flexible thermoelectric module 203 is disposed between the corresponding capacitor module 201 and the corresponding liquid cooling plate 204, and the flexible thermoelectric module 203 includes a plurality of PN junction units 301 (only a portion of a row of PN junction units 301 is exemplarily shown in fig. 3) that are connected in series and arranged in an array, and the PN junction units 301 include a P-type thermoelectric material semiconductor 305, an N-type thermoelectric material semiconductor 306, a heat conducting plate 302, a first heat retaining plate 303, and a second heat retaining plate 304; the first cold-keeping plate 303 and the second cold-keeping plate 304 are arranged on a first film layer adjacent to the liquid cooling plate 204, the cold end of the P-type thermoelectric material semiconductor 305 is connected with one surface of the first cold-keeping plate 303, which is closer to the liquid cooling plate 204, and the cold end of the P-type thermoelectric material semiconductor 305 is connected with one surface of the second cold-keeping plate 304, which is closer to the liquid cooling plate 204; the heat conducting plate 302 is arranged on the second film layer, and the hot end of the P-type thermoelectric material semiconductor 305 and the hot end of the N-type thermoelectric material semiconductor 306 are respectively connected with two ends of one surface, which is closer to the liquid cooling plate 204, of the heat conducting plate 302; wherein the thermal conductivity of the thermal conductive plate 302 is higher than the thermal conductivity of the first and second cold-keeping plates 303, 304. The lead of the first cold plate 303 of the first PN junction unit 301 of the PN junction units 301 connected in series in the flexible thermoelectric module 203 serves as the positive electrode 401 of the flexible thermoelectric module 203, and the second cold plate 304 of the last PN junction unit 301 of the PN junction units 301 connected in series in the flexible thermoelectric module 203 serves as the negative electrode 402 of the flexible thermoelectric module 203.
The capacitance management system 202 is connected to two ends of the flexible thermoelectric module 203, and the capacitance management system 202 is configured to apply a counter potential to two ends of the flexible thermoelectric module 203 when the overheating of the capacitance module 201 is detected, so that the flexible thermoelectric module 203 performs electric refrigeration for the corresponding capacitance module 201.
The thermoelectric assembly formed by connecting at least two flexible thermoelectric modules 203 in series is connected with the capacitance management system 202, and the thermoelectric assembly can supply power to the capacitance management system 202 by using recovered electric energy. The flexible thermoelectric modules 203 can generate electricity by using the seebeck effect generated by the temperature difference between the liquid cooling plate 204 and the capacitor module 201, so that the thermoelectric assembly formed by connecting at least two flexible thermoelectric modules 203 in series can generate recovered electric energy to supply power to the capacitor management system 202 or other direct current electric appliances (such as various sensors) in the super capacitor energy storage device 200.
Specifically, the capacitor modules 201 refer to standard-sized energy storage modules formed by connecting a plurality of single capacitors in series, and each capacitor module 201 may include three layers, and each layer is provided with 6 single capacitors. The PN junction unit 301 is a flexible component that generates power by recovering a heat source to generate seebeck effect and receives reverse potential to generate peltier effect to cool by forming a PN junction using P-type and N-type thermoelectric materials. Series connection and array arrangement are arranged on the capacitor moduleAll PN junction units 301 between 201 and a corresponding liquid cooling plate 204 can form a flexible thermoelectric module 203. The P-type thermoelectric material semiconductor 305 in the PN junction unit 301 refers to a semiconductor formed of a P-type thermoelectric material, the N-type thermoelectric material semiconductor 306 in the PN junction unit 301 refers to a semiconductor formed of an N-type thermoelectric material, and the P-type thermoelectric material may be, for example, P-type bismuth telluride, the N-type thermoelectric material may be N-type bismuth telluride, the thickness of the single PN junction unit 301 is between 1 and 2mm, and the volume of the single PN junction unit 301 is between 1 and 8mm 3 Between each other, the area of the extension surface of the single cold-keeping plate is 1 to 2mm 2 In which the extended surface of the cold-retaining plate is a plane perpendicular to the thickness direction on the cold-retaining plate, and the arrangement of a plurality of small-sized units can reduce the heat loss. Gaps are respectively arranged between the heat conducting plates 302 of the adjacent PN junction units 301 and between the two adjacent cold insulation plates, the length of each gap can be larger than 1mm, the cooling effect of the liquid cooling plates 204 can be guaranteed through the arrangement of the gaps, and certain buffering can be formed on the flexible thermoelectric module 203 under the condition that the super-capacitor energy storage device 200 is extruded by external force, so that the compression resistance of the capacitor module 201 is improved. The clearance that sets up between the adjacent heat-conducting plate 302 to and the clearance that sets up between the adjacent cold-retaining plate (including first cold-retaining plate and second cold-retaining plate), leave the displacement allowance for the minimum PN junction unit 301 of size, make flexible thermoelectric module 203 can buckle the surface of laminating its corresponding electric capacity module 201, be applicable to the electric capacity module 201 that the surface has the radian, further improve the cooling effect, in addition, if the surface of electric capacity module 201 produces certain radian because of external force or other factors at the in-process of use, flexible thermoelectric module 203 all can adapt to buckle the laminating, guarantee the continuous reliability of cooling effect.
The thermal conductivity of the heat conducting plate 302 is better than that of the first heat insulating plate 303 and the second heat insulating plate 304, so that the temperature difference between the hot end and the cold end of the PN junction unit 301 can be increased, and the thermoelectric generation efficiency is improved. It should be noted that, the "first" and "second" in the first cold plate 303 and the second cold plate 304 in the PN junction unit 301 are concepts of the inside of the PN junction unit 301, and are intended to distinguish the cold plate connected to the P-type thermoelectric material semiconductor 305 from the cold plate connected to the N-type thermoelectric material semiconductor 306 in the PN junction unit 301, however, two adjacent PN junction units 301 in the flexible thermoelectric module 203 may share one cold plate to realize the series connection of adjacent PN junction units 301, and the shared cold plate may be used as the second cold plate 304 in one PN junction unit 301, or may be used as the first cold plate 303 in the other PN junction unit 301, and the series connection line between the two PN junction units 301 may be disposed in the shared cold plate. Illustratively, the heat conductive plate 302 may be a metal plate, the first and second cold-keeping plates 303 and 304 may be ceramic plates, and a series line between the two PN junction units 301 connected in series may be disposed inside the common ceramic plate. Fig. 5 is a schematic plan view of another capacitor module and a corresponding flexible thermoelectric module and liquid cooling plate according to an embodiment of the present invention, and referring to fig. 2 and 5, the adjacent PN junction units 301 may not share a cold insulation plate, the PN junction units 301 may be connected in series by flexible wires, the first cold insulation plate 303 of one PN junction unit 301 is connected with the second cold insulation plate 304 of another PN junction unit 301 through wires, and such wires are connected in series and combined with a gap between the PN junction units 301, so that a bendable angle of the flexible thermoelectric module 203 may be increased, and a more fitting coating on the outer surface of the capacitor module 201 is achieved.
With continued reference to fig. 2, 3, and 4, the capacitance management system 202 (also referred to as CMS) refers to a supercapacitor manager, which can intelligently maintain the safety of each individual capacitor and each capacitor module 201, and can monitor the states of each capacitor module 201 and individual capacitor, so as to prevent over-temperature, over-charge, and over-discharge. In this application, the capacitance management system 202 further integrates a control function for the flexible thermoelectric module 203, and can apply a counter electromotive force to two ends of the flexible thermoelectric module 203 when overheat of the capacitance module 201 is detected, so that the flexible thermoelectric module 203 performs electric refrigeration for the corresponding capacitance module 201, where the counter electromotive force refers to an electromotive force opposite to an electromotive force direction generated by power generation of the flexible thermoelectric module 203. Illustratively, the manner in which the capacitance management system 202 applies a back-emf across the flexible thermoelectric module 203 may be to control the conduction of a back-supply circuit loop that powers the flexible thermoelectric module 203.
The super capacitor energy storage device provided by the embodiment comprises a plurality of capacitor modules, a capacitor management system, a flexible thermoelectric module and a liquid cooling plate, wherein the flexible thermoelectric module and the liquid cooling plate correspond to the capacitor modules. The flexible thermoelectric module is arranged between the corresponding capacitor module and the corresponding liquid cooling plate, the capacitor management system is connected with two ends of the flexible thermoelectric module, and the capacitor management system is used for applying counter-potential to two ends of the flexible thermoelectric module under the condition that overheat of the capacitor module is detected, so that the flexible thermoelectric module performs electric refrigeration for the corresponding capacitor module. The total positive electrode and the total negative electrode of the at least two flexible thermoelectric modules which are connected in series are respectively connected with the capacitance management system to supply power for the capacitance management system, so that the auxiliary cooling of the thermoelectric material to the super capacitor is realized, the thermoelectric power generation is utilized to supplement electricity for the electricity utilization element in the device, and the electricity utilization efficiency of the super capacitor is improved while the cooling effect is enhanced.
Optionally, fig. 6 is a schematic plan view of a capacitor module and a flexible thermoelectric module and a liquid cooling plate corresponding to the capacitor module according to another embodiment of the present invention, and on the basis of the foregoing embodiment, referring to fig. 6, the flexible thermoelectric module 203 further includes a buffer layer 501, where the buffer layer 501 is disposed between the capacitor module 201 and the heat conducting plate 302. Illustratively, the buffer layer 501 may include an epoxy material. The buffer layer 501 can be arranged between the capacitor module 201 and the heat conducting layer of the flexible thermoelectric module 203 by adopting a pressure injection method, the thickness of the buffer layer 501 can be between 1 and 2mm, the small thickness of the buffer layer 501 and the PN junction unit 301 can greatly reduce the heat transfer distance, the PN junction unit 301 is rapidly utilized to convert heat energy into electric energy, and meanwhile, the cooling effect of the liquid cooling plate 204 is improved. The buffer layer 501 can form insulation, buffering and protection between the capacitor module 201 and the corresponding flexible thermoelectric module 203, and the buffer layer 501 can absorb part of external force to prevent the single capacitor in the capacitor module 201 from being damaged when the super capacitor is extruded by external force.
With continued reference to fig. 6, the P-type thermoelectric material semiconductor 305 may include a P-type bismuth telluride semiconductor; the N-type thermoelectric material semiconductor 306 comprises an N-type bismuth telluride semiconductor. The ZT value of the bismuth telluride material at 25 ℃ is approximately equal to 1, and the bismuth telluride material has good Seebeck coefficient, so that the bismuth telluride material has the following properties in a plugThe application of the Beck effect and the Peltier effect has good flexibility, and the efficiency of heat recovery power generation and the auxiliary refrigeration effect are improved. While the heat conducting plate 302 can be made of copper material with better heat conductivity, the first cooling plate and the second cooling plate can be made of ceramic material with weaker heat conductivity, and the area of the extension surfaces of the heat conducting plate 302 and the cold insulation plate is controlled to be 1-2mm 2 In this case, the cooling effect of the liquid cooling plate 204 can be further improved.
With continued reference to fig. 2, the capacitance management system 202 is configured to apply counter-potential to both ends of all the flexible thermoelectric modules 203 when the capacitance management system 202 detects that the capacitance modules 201 are overheated, so that the flexible thermoelectric modules 203 perform electric refrigeration on the corresponding capacitance modules 201, thereby implementing unified control on the flexible thermoelectric modules 203, performing electric auxiliary cooling on all the flexible thermoelectric modules 203 when any capacitance module 201 is detected to be overheated, reducing control difficulty of the capacitance management system 202, and further improving effect of electric auxiliary cooling.
With continued reference to fig. 2, the capacitance management system 202 is configured to apply a counter potential to two ends of the flexible thermoelectric module 203 corresponding to the overheated capacitance module 201 when the capacitance management system 202 detects that the capacitance module 201 is overheated, so that the flexible thermoelectric module 203 performs electric refrigeration on the corresponding capacitance module 201, one-to-one refrigeration control on the flexible thermoelectric module 203 is achieved, and electric auxiliary cooling is performed on the capacitance module 201 accurately for the overtemperature, so that an effect of energy saving and emission reduction can be achieved.
The embodiment of the invention also provides a temperature control method of the super-capacitor energy storage device, which can be implemented by a capacitor management system. Fig. 7 is a schematic flow chart of a temperature control method of a super capacitor energy storage device according to an embodiment of the present invention, and based on the foregoing embodiment, referring to fig. 7, the temperature control method of the super capacitor energy storage device includes:
s601, acquiring temperature data of each capacitor module.
Specifically, the temperature acquisition units may be respectively disposed in the inner portion or the surface of each capacitor module in the super capacitor energy storage device so as to acquire temperature data of the capacitor module, where the temperature data of the capacitor module may include at least one set of surface temperatures and/or at least one set of inner temperatures of the capacitor module, and the temperature acquisition units may include a patch type temperature sensor, and may acquire temperature data of a corresponding capacitor module in real time or at preset intervals.
S602, controlling the liquid cooling plate to cool the capacitor module under the condition that the highest temperature value in the temperature data is within a preset temperature range.
Specifically, the maximum temperature value refers to the maximum temperature value in the temperature data of all the capacitor modules. The preset temperature range is a higher temperature region in a normal working temperature range of the capacitor module, and is exemplified by a normal working temperature range below 60 degrees, wherein the temperature range capable of ensuring the highest working efficiency of the super capacitor is below 45 degrees, so that the preset temperature range can be set to be 45-60 degrees for the best working state of the super capacitor, and the cooling of the super capacitor by the liquid cooling system can be started when the highest temperature value is in the preset temperature range.
And determining the highest temperature value according to the temperature data of all the capacitor modules in the super capacitor energy storage device. And further judging whether the highest temperature is within a preset temperature range, and generating a start-up signal to instruct the liquid cooling plate to cool the super capacitor under the condition that the highest temperature value in the temperature data is within the preset temperature range. It should be specifically noted that when the maximum temperature value is lower than the lower limit of the preset temperature range, the flexible thermoelectric module can generate electricity by utilizing the temperature difference between the cooling plate and the capacitor module to supply power to the capacitor management system, and when the maximum temperature value in the temperature data is within the preset temperature range, the control liquid cooling plate performs cooling operation on the super capacitor,
and S603, under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, controlling the liquid cooling plate to cool the super capacitor, and applying counter electromotive force to the two ends of the flexible thermoelectric module so as to electrically cool the flexible thermoelectric module for the corresponding capacitor module.
Specifically, if the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, the fact that the single capacitor is overheated in the super capacitor energy storage device is indicated, and in this case, the liquid cooling plate can be continuously controlled to cool the super capacitor, and the power of the air compressor corresponding to the liquid cooling plate can be higher than the power when the highest temperature value is in the preset temperature range. When the liquid cooling plate is cooled, counter potential can be applied to two ends of the flexible thermoelectric module by the capacitance management system, so that PN junction units in the flexible thermoelectric module are converted from Seebeck effect to Peltier effect, and the flexible thermoelectric module performs electric refrigeration for the corresponding capacitance module.
On the one hand, under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, counter electromotive force is applied to the two ends of all the flexible thermoelectric modules, so that the flexible thermoelectric modules electrically refrigerate corresponding capacitor modules, one-to-one refrigeration control of the flexible thermoelectric modules is realized, and the capacitor modules which are precisely over-temperature are electrically assisted to be cooled, so that the effects of energy conservation and emission reduction can be achieved.
On the other hand, under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, determining the capacitor module corresponding to the temperature data exceeding the upper limit of the preset temperature range as a target module; and then apply counter electromotive force for the both ends of the flexible thermoelectric module that the goal module corresponds to make the flexible thermoelectric module carry out electric refrigeration for the goal module, realized the unified control to flexible thermoelectric module, under the overheated circumstances of arbitrary electric capacity module of monitoring, carry out electric auxiliary cooling to all flexible thermoelectric modules, reduce the control degree of difficulty of electric capacity management system, further improve electric auxiliary cooling's effect.
According to the temperature control method of the super capacitor energy storage device, temperature data of each capacitor module are obtained. And under the condition that the highest temperature value in the temperature data is within a preset temperature range, controlling the liquid cooling plate to cool the capacitor module. Under the condition that the highest temperature value in the temperature data exceeds the upper limit of a preset temperature range, the liquid cooling plate is controlled to cool the capacitor module, counter electromotive force is applied to the two ends of the flexible thermoelectric module, so that the flexible thermoelectric module performs electric refrigeration on the corresponding capacitor module, auxiliary cooling of the super capacitor by thermoelectric materials is realized, the thermoelectric power generation is utilized to supplement electricity for the electricity utilization element in the device, and the electricity utilization efficiency of the super capacitor is improved while the cooling effect is enhanced.
Fig. 8 shows a schematic diagram of the structure of an electronic device that may be used to implement an embodiment of the invention. Electronic devices are intended to represent various forms of digital computers, such as laptops, desktops, workstations, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. Electronic equipment may also represent various forms of mobile devices, such as personal digital processing, cellular telephones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the inventions described and/or claimed herein.
As shown in fig. 8, the electronic device 700 includes at least one processor 701, and a memory, such as a Read Only Memory (ROM) 702, a Random Access Memory (RAM) 703, etc., communicatively connected to the at least one processor 701, in which the memory stores a computer program executable by the at least one processor, and the processor 701 may perform various suitable actions and processes according to the computer program stored in the Read Only Memory (ROM) 702 or the computer program loaded from the storage unit 708 into the Random Access Memory (RAM) 703. In the RAM 703, various programs and data required for the operation of the electronic device 700 may also be stored. The processor 701, the ROM 702, and the RAM 703 are connected to each other through a bus 704. An input/output (I/O) interface 705 is also connected to bus 704.
Various components in the electronic device 700 are connected to the I/O interface 705, including: an input unit 706 such as a keyboard, a mouse, etc.; an output unit 707 such as various types of displays, speakers, and the like; a storage unit 708 such as a magnetic disk, an optical disk, or the like; and a communication unit 709 such as a network card, modem, wireless communication transceiver, etc. The communication unit 709 allows the electronic device 700 to exchange information/data with other devices through a computer network, such as the internet, and/or various telecommunication networks.
The processor 701 may be a variety of general and/or special purpose processing components having processing and computing capabilities. Some examples of processor 701 include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), various specialized Artificial Intelligence (AI) computing chips, various processors running machine learning model algorithms, digital Signal Processors (DSPs), and any suitable processor, controller, microcontroller, etc. The processor 701 performs the various methods and processes described above, such as the temperature control method of the supercapacitor energy storage device.
In some embodiments, the temperature control method of the supercapacitor energy storage device may be implemented as a computer program tangibly embodied on a computer-readable storage medium, such as the storage unit 708. In some embodiments, part or all of the computer program may be loaded and/or installed onto the electronic device 700 via the ROM 702 and/or the communication unit 709. When the computer program is loaded into RAM 703 and executed by processor 701, one or more steps of the temperature control method of the supercapacitor energy storage device described above may be performed. Alternatively, in other embodiments, the processor 701 may be configured to perform the temperature control method of the supercapacitor energy storage device in any other suitable manner (e.g., by means of firmware).
Various implementations of the systems and techniques described here above may be implemented in digital electronic circuitry, integrated circuit systems, field Programmable Gate Arrays (FPGAs), application Specific Integrated Circuits (ASICs), application Specific Standard Products (ASSPs), systems On Chip (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include: implemented in one or more computer programs, the one or more computer programs may be executed and/or interpreted on a programmable system including at least one programmable processor, which may be a special purpose or general-purpose programmable processor, that may receive data and instructions from, and transmit data and instructions to, a storage system, at least one input device, and at least one output device.
A computer program for carrying out methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the computer programs, when executed by the processor, cause the functions/acts specified in the flowchart and/or block diagram block or blocks to be implemented. The computer program may execute entirely on the machine, partly on the machine, as a stand-alone software package, partly on the machine and partly on a remote machine or entirely on the remote machine or server.
In the context of the present invention, a computer-readable storage medium may be a tangible medium that can contain, or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer readable storage medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. Alternatively, the computer readable storage medium may be a machine readable signal medium. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
To provide for interaction with a user, the systems and techniques described here can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to a user; and a keyboard and a pointing device (e.g., a mouse or a trackball) through which a user can provide input to the electronic device. Other kinds of devices may also be used to provide for interaction with a user; for example, feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form, including acoustic input, speech input, or tactile input.
The systems and techniques described here can be implemented in a computing system that includes a background component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front-end component (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such background, middleware, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local Area Networks (LANs), wide Area Networks (WANs), blockchain networks, and the internet.
The computing system may include clients and servers. The client and server are typically remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, also called a cloud computing server or a cloud host, and is a host product in a cloud computing service system, so that the defects of high management difficulty and weak service expansibility in the traditional physical hosts and VPS service are overcome.
It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present invention may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present invention are achieved, and the present invention is not limited herein.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (10)
1. A supercapacitor energy storage device, comprising: the flexible thermoelectric module comprises a plurality of capacitance modules, a capacitance management system, a flexible thermoelectric module and a liquid cooling plate, wherein the flexible thermoelectric module and the liquid cooling plate correspond to the capacitance modules;
the flexible thermoelectric module is arranged between the corresponding capacitor module and the corresponding liquid cooling plate and comprises a plurality of PN junction units which are connected in series and arranged in an array manner, and each PN junction unit comprises a P-type thermoelectric material semiconductor, an N-type thermoelectric material semiconductor, a heat conducting plate, a first heat preservation plate and a second heat preservation plate; the first cold insulation plate and the second cold insulation plate are arranged on a first film layer adjacent to the liquid cooling plate, the cold end of the P-type thermoelectric material semiconductor is connected with one surface of the first cold insulation plate, which is closer to the liquid cooling plate, and the cold end of the P-type thermoelectric material semiconductor is connected with one surface of the second cold insulation plate, which is closer to the liquid cooling plate; the heat conducting plate is arranged on the second film layer, and the hot end of the P-type thermoelectric material semiconductor and the hot end of the N-type thermoelectric material semiconductor are respectively connected with two ends of one surface, which is closer to the liquid cooling plate, of the heat conducting plate; wherein the heat conductivity of the heat conducting plate is higher than that of the first heat insulating plate and the second heat insulating plate, and the expansion area of the heat insulating plate is 1 to 2mm 2 In the range of (2), gaps are arranged between adjacent heat conducting plates, and gaps are arranged between adjacent cold insulation plates;
the capacitance management system is connected with two ends of the flexible thermoelectric module, and is used for applying counter-potential to the two ends of the flexible thermoelectric module under the condition that the overheat of the capacitance module is detected, so that the flexible thermoelectric module performs electric refrigeration for the corresponding capacitance module;
the thermoelectric assembly formed by connecting at least two flexible thermoelectric modules in series is connected with the capacitance management system, and the thermoelectric assembly is used for generating recovery electric energy by utilizing the temperature difference between the capacitance module and the corresponding liquid cooling plate to supply power for the capacitance management system.
2. The supercapacitor energy storage device of claim 1, wherein the thermally conductive plate comprises a metal plate; the first cold-retaining plate and the second cold-retaining plate each comprise a ceramic plate.
3. The supercapacitor energy storage device of claim 1, wherein the flexible thermoelectric module further comprises a buffer layer disposed between the capacitor module and the thermally conductive plate.
4. The supercapacitor energy storage device according to claim 1, wherein the P-type thermoelectric material semiconductor comprises a P-type bismuth telluride semiconductor; the N-type thermoelectric material semiconductor includes an N-type bismuth telluride semiconductor.
5. The super capacitor energy storage device as claimed in any one of claims 1-4, wherein the capacitance management system is further configured to apply a counter potential to two ends of the flexible thermoelectric module corresponding to the overheated capacitor module when the capacitance management system detects that the capacitor module is overheated, so that the flexible thermoelectric module performs electrical refrigeration for the corresponding capacitor module.
6. The super capacitor energy storage device as claimed in any one of claims 1-4, wherein said capacitance management system is further configured to apply a counter potential to both ends of all of said flexible thermoelectric modules to electrically cool said flexible thermoelectric modules for said capacitor modules when said capacitor modules are detected to be overheated.
7. A temperature control method of a super capacitor energy storage device, which is characterized in that the temperature control method is applied to an energy storage capacitor management system in the super capacitor energy storage device according to any one of claims 1 to 6, and the temperature control method of the super capacitor energy storage device comprises the following steps:
acquiring temperature data of each capacitor module;
controlling the liquid cooling plate to cool the capacitor module under the condition that the highest temperature value in the temperature data is within a preset temperature range;
and under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, controlling the liquid cooling plate to cool the capacitor module, and applying counter electromotive force to the two ends of the flexible thermoelectric module so as to electrically cool the corresponding capacitor module by the flexible thermoelectric module.
8. The method according to claim 7, wherein when the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, controlling the liquid cooling plate to cool the capacitor module and applying counter electromotive force to two ends of the flexible thermoelectric module, so that the flexible thermoelectric module performs electric refrigeration on the capacitor module corresponding to the flexible thermoelectric module, and the method comprises:
and under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, applying counter electromotive force to the two ends of all the flexible thermoelectric modules so that the flexible thermoelectric modules electrically refrigerate the corresponding capacitor modules.
9. The method according to claim 7, wherein when the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, controlling the liquid cooling plate to cool the super capacitor and applying counter electromotive force to two ends of the flexible thermoelectric module, so that the flexible thermoelectric module performs electric refrigeration on the capacitor module corresponding to the flexible thermoelectric module, and the method comprises:
under the condition that the highest temperature value in the temperature data exceeds the upper limit of the preset temperature range, determining the capacitor module corresponding to the temperature data exceeding the upper limit of the preset temperature range as a target module;
and applying counter electromotive force to two ends of the flexible thermoelectric module corresponding to the target module, so that the flexible thermoelectric module performs electric refrigeration on the target module.
10. An electronic device, the electronic device comprising:
at least one processor; and
a memory communicatively coupled to the at least one processor; wherein,
the memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the method of controlling the temperature of the supercapacitor energy storage device of any one of claims 7-9.
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