CN117739293A - LED filament lamp production method - Google Patents
LED filament lamp production method Download PDFInfo
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- CN117739293A CN117739293A CN202311873657.4A CN202311873657A CN117739293A CN 117739293 A CN117739293 A CN 117739293A CN 202311873657 A CN202311873657 A CN 202311873657A CN 117739293 A CN117739293 A CN 117739293A
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- fiber board
- bonding pad
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000003365 glass fiber Substances 0.000 claims abstract description 67
- 239000000843 powder Substances 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000010586 diagram Methods 0.000 claims description 30
- 230000017525 heat dissipation Effects 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 239000011889 copper foil Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
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Abstract
The invention discloses a production method of an LED filament lamp, which comprises the steps of cutting out a strip-shaped glass fiber plate from a plate; paving a first power supply bonding pad, a second power supply bonding pad and a first chip bonding pad on the glass fiber board; paving a circuit connection line on the glass fiber board; welding an LED chip on the first chip bonding pad; a fluorescent powder medium layer is arranged on the glass fiber plate; bonding wires on the first power supply bonding pad and the second power supply bonding pad; and inserting the glass fiber board into the slot of the plastic plug, and installing the plastic plug, the bulb shell and the lamp cap together. According to the technical scheme, the first power supply bonding pad, the second power supply bonding pad and the first chip bonding pad are arranged on the glass fiber board, the LED chips are welded on the first chip bonding pad, meanwhile, fluorescent powder medium layers are covered on all the LED chips to manufacture filament light source modules, and finally, the filament light source modules, lamp bulbs, plastic plugs and lamp caps are assembled together to complete production of filament lamps, and the production of the filament lamps can be completed without using glass columns.
Description
Technical Field
The invention relates to the technical field of LED illumination, in particular to a production method of an LED filament lamp.
Background
LED fixtures take up a tremendous share in the lighting market, while filament-like LED fixtures are favored by customers because of their unique shape.
The production flow of the LED filament lamp in the current market is extremely complex, equipment is required to be used for assembling the LED filament lamp group, the cost is high, and the LED filament lamp is not suitable for production projects with less production quantity. In the production process of the traditional LED filament lamp, the traditional LED filament is required to be fixed on a glass column, then the glass column is fixed at the bottom of a bulb shell by using machine equipment, then the bulb shell is required to be inflated by using the machine equipment, and finally the tightness of a finished product is required to be ensured. Therefore, the existing LED filament lamp has higher production process requirement.
Disclosure of Invention
In order to solve one or more of the above technical problems, the present invention is directed to a method for producing an LED filament lamp.
The invention adopts the technical scheme that:
the production method of the LED filament lamp comprises the following steps:
step 1, cutting out strip-shaped glass fiber plates from a plate;
step 2, paving a first power supply bonding pad, a second power supply bonding pad and a plurality of first chip bonding pads on one surface of the glass fiber board;
step 3, paving circuit connection lines on the glass fiber board to enable the first power supply pad, the second power supply pad and each first chip pad to be electrically connected according to a first preset circuit diagram;
step 4, welding a plurality of LED chips on the corresponding first chip bonding pads one by one;
step 5, arranging fluorescent powder medium layers on one surface of the glass fiber board provided with the LED chips or on two surfaces of the glass fiber board, and enabling the fluorescent powder medium layers to cover all the LED chips;
step 6, welding upper leads on the first power supply bonding pad and the second power supply bonding pad respectively;
step 7, inserting the glass fiber board into a slot of the plastic plug, and installing the plastic plug at the bottom of the lamp bulb so that the glass fiber board is arranged in the lamp bulb;
and 8, mounting the lamp cap on the bottom of the bulb shell of the lamp and enabling the lead wires to be electrically connected with the lamp cap.
As a further improvement of the above technical solution, in step 2, a first heat dissipation copper foil and a second heat dissipation copper foil are laid on one surface of the glass fiber board, the first power supply pad is disposed in the first heat dissipation copper foil, the second power supply pad is disposed in the second heat dissipation copper foil, at this time, the first power supply pad is electrically connected with the first heat dissipation copper foil, and the second power supply pad is electrically connected with the second heat dissipation copper foil.
As a further improvement of the above technical solution, in step 4, the LED chip soldered to the first chip pad is a flip-chip LED chip.
As a further improvement of the technical scheme, the glass fiber plate is a light-transmitting glass fiber plate, and the light transmittance of the glass fiber plate is 20-95%.
As a further improvement of the above technical solution, in the step 2, a second chip bonding pad is laid on one surface of the glass fiber board, in the step 3, circuit wires are laid on the glass fiber board to electrically connect the first power bonding pad, the second power bonding pad, each first chip bonding pad and the second chip bonding pad according to a second preset circuit diagram, and in the step 4, the first monolithic chip is soldered on the second chip bonding pad.
As a further improvement of the above technical solution, in the step 2, a first element pad is laid on one surface of the glass fiber board, in the step 3, a circuit wire is laid on the glass fiber board to electrically connect the first power supply pad, the second power supply pad, each of the first chip pad, the second chip pad and the first element pad according to a third preset circuit diagram, and in the step 4, a diode D1 is soldered on the first element pad.
As a further improvement of the above technical solution, in the step 2, a third chip bonding pad is laid on one surface of the glass fiber board, in the step 3, circuit wires are laid on the glass fiber board to electrically connect the first power bonding pad, the second power bonding pad, each of the first chip bonding pad and the third chip bonding pad according to a fourth preset circuit diagram, and in the step 4, a second monolithic chip is soldered on the second chip bonding pad.
As a further improvement of the above technical solution, in the step 2, a second element pad and a third element pad are laid on one surface of the glass fiber board, in the step 3, circuit wires are laid on the glass fiber board to electrically connect the first power pad, the second power pad, each of the first chip pad, the third chip pad, the second element pad and the third element pad according to a fifth preset circuit diagram, and in the step 4, a diode D2 is welded on the second element pad, and a capacitor C1 is welded on the third element pad.
The beneficial effects of the invention are as follows: according to the technical scheme, the first power supply bonding pad, the second power supply bonding pad and the plurality of first chip bonding pads are arranged on the glass fiber board, the LED chips are welded on the first chip bonding pads, meanwhile, fluorescent powder medium layers are covered on all the LED chips to form the filament light source module, and finally, the filament light source module, the lamp bulb shell, the plastic plug and the lamp cap are assembled together to complete production of the filament lamp, and the production of the filament lamp can be completed without using glass columns in the process, so that the production flow of the filament lamp is effectively simplified.
Drawings
The invention is further illustrated by the following description and examples of the embodiments in conjunction with the accompanying drawings.
FIG. 1 is a schematic flow chart of a method of producing a filament lamp of the present invention;
FIG. 2 is a circuit diagram of a first embodiment of a filament light source module according to the present invention;
FIG. 3 is a wiring diagram of a first embodiment of a filament light source module according to the present invention;
FIG. 4 is a block diagram of a first embodiment of a filament light source module according to the present invention;
FIG. 5 is a circuit diagram of a second embodiment of a filament light source module according to the present invention;
FIG. 6 is a wiring diagram of a second embodiment of a filament light source module of the present invention;
FIG. 7 is a block diagram of a second embodiment of a filament light source module of the present invention;
FIG. 8 is a circuit diagram of a third embodiment of a filament light source module according to the present invention;
fig. 9 is a wiring diagram of a third embodiment of the filament light source module of the present invention;
fig. 10 is a block diagram of a third embodiment of a filament light source module according to the present invention.
Detailed Description
Reference will now be made in detail to the present embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present invention, but not to limit the scope of the present invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Referring to fig. 1, the application discloses a method for producing an LED filament lamp, a first embodiment of which comprises the following steps:
step 1, cutting out a strip-shaped glass fiber board 100 from a plate material;
step 2, paving a first power supply pad 300, a second power supply pad 400 and a plurality of first chip pads 200 on one surface of the glass fiber board 100;
step 3, laying circuit wires on the glass fiber board 100 to electrically connect the first power supply pad 300, the second power supply pad 400 and each first chip pad 200 according to a first preset circuit diagram;
step 4, welding a plurality of LED chips on the corresponding first chip bonding pads 200 one by one;
step 5, arranging one side of the glass fiber board 100 provided with the LED chips or two sides of the glass fiber board 100, and enabling the fluorescent powder medium layer 700 to cover all the LED chips;
step 6, bonding wires on the first power supply pad 300 and the second power supply pad 400 respectively;
step 7, inserting the glass fiber board 100 into a slot of the plastic plug, and installing the plastic plug at the bottom of the lamp bulb so that the glass fiber board 100 is arranged in the lamp bulb;
and 8, mounting the lamp cap on the bottom of the bulb shell of the lamp and enabling the lead wires to be electrically connected with the lamp cap.
Specifically, in this embodiment, the first power supply pad 300, the second power supply pad 400 and the plurality of first chip pads 200 are disposed on the glass fiber board 100, the LED chips are welded on each first chip pad 200, and meanwhile, the fluorescent powder medium layer 700 is covered on all the LED chips to form a filament light source module, and finally, the filament light source module, the lamp bulb shell, the plastic plug and the lamp cap are assembled together to complete the production of the filament lamp, and the production of the filament lamp can be completed without using a glass column in this process, so that the production flow of the filament lamp is effectively simplified.
Referring to fig. 2, 3 and 4, in this embodiment, in the step 2, a first heat dissipation copper foil 500 and a second heat dissipation copper foil 600 are laid on one surface of the glass fiber board 100, the first power pad 300 is disposed in the first heat dissipation copper foil 500, the second power pad 400 is disposed in the second heat dissipation copper foil 600, at this time, the first power pad 300 is electrically connected to the first heat dissipation copper foil 500, and the second power pad 400 is electrically connected to the second heat dissipation copper foil 600. In this embodiment, the first heat dissipation copper foil 500 and the second heat dissipation copper foil 600 are provided to conduct the heat generated when the LED chips are powered on to the lamp cap of the filament lamp through the first heat dissipation copper foil 500 and the second heat dissipation copper foil 600, so as to improve the heat dissipation effect. Of course, the areas of the first heat dissipation copper foil 500 and the second heat dissipation copper foil 600 need to be adaptively designed according to the size of the glass fiber board 100 and the placement position of the LED chip in practical applications.
Further, in this embodiment, in the step 4, the LED chip soldered to the first chip pad 200 is a flip-chip LED chip.
Further as a preferred embodiment, in this example, the glass fiber board 100 is a light-transmitting glass fiber board 100, and the light transmittance of the glass fiber board 100 is 20% to 95%. In this embodiment, the light-transmitting glass fiber board 100 is used as a carrier of the LED chip, so that the light emitted by the LED chip is transmitted through the back of the board, and the light-emitting effect of the filament light source module is improved.
In this embodiment, the connection structures between the LED chips may be all series-connected, all parallel-connected, and all series-connected, then parallel-connected, then series-connected, and so on.
Referring to fig. 5, 6 and 7, in the second embodiment of the present application, in comparison with the first embodiment, in step 2, a second chip pad 800b is laid on one surface of the glass fiber board 100, in step 3, circuit wires are laid on the glass fiber board 100 to electrically connect the first power pad 300, the second power pad 400, each of the first chip pad 200 and the second chip pad 800b according to a second preset circuit diagram, and in step 4, a first monolithic chip 800a is soldered on the second chip pad 800 b. At this time, each LED chip is divided into a red LED chip, a green LED chip and a blue LED chip, the first single chip 800a is configured with a power supply end, a ground end, a first signal end, a second signal end and a third signal end, at this time, the second preset circuit diagram is that the first power supply pad 300 is respectively connected with the negative electrode of each LED chip and the power supply end of the first single chip 800a, the second power supply pad 400 is connected with the ground end of the first single chip 800a, the first signal end of the first single chip 800a is connected with the positive electrode of each red LED chip, the second signal end of the first single chip 800a is connected with the positive electrode of each green LED chip, and the third signal end of the first single chip 800a is connected with the positive electrode of each blue LED chip. The first single chip microcomputer 800a is configured with functions for controlling the light emitting modes and the light emitting effects of the red LED chip, the green LED chip and the blue LED chip, so that the effects of hopping, slow changing, gradual changing and the like of various colors are achieved through the internal program of the first single chip microcomputer 800 a.
Further, in this embodiment, in the step 2, a first element pad is laid on one surface of the glass fiber board 100, in the step 3, a circuit wire is laid on the glass fiber board 100 to electrically connect the first power supply pad 300, the second power supply pad 400, each of the first chip pad 200, the second chip pad 800b, and the first element pad according to a third preset circuit diagram, and in the step 4, the diode D1 is soldered on the first element pad. In this case, in the third preset circuit diagram, on the basis of the second preset circuit diagram, the first power pad 300 is connected to the positive electrode of the diode D1, and the negative electrode of the diode D1 is connected to the negative electrode of each LED chip and the power supply terminal of the first monolithic chip 800 a.
Referring to fig. 8, 9 and 10, in the third embodiment of the present application, in comparison with the first embodiment, in step 2 of the present embodiment, a third chip pad 900b is laid on one surface of the glass fiber board 100, in step 3, circuit wires are laid on the glass fiber board 100 to electrically connect the first power supply pad 300, the second power supply pad 400, each of the first chip pad 200 and the third chip pad 900b according to a fourth preset circuit diagram, and in step 4, a second single chip microcomputer chip 900a is soldered on the second chip pad 800 b. At this time, the fourth preset circuit diagram is that the second single-chip microcomputer chip 900a is configured with a power supply end, a ground end and a plurality of control ends, the first power supply pad 300 is connected with the power supply end of the second single-chip microcomputer chip 900a and the cathodes of the LED chips, the second power supply pad 400 is connected with the ground end of the second single-chip microcomputer chip 900a, and each control end of the second single-chip microcomputer chip 900a is connected with the anodes of the LED chips in a one-to-one correspondence manner. In this embodiment, the second monolithic chip 900a is configured with a popular horse race effect, a flame light effect, a light burst effect, a full-bright normal-bright effect, and the like for implementing the LED chips.
Further, in this embodiment, in the step 2, a second element pad and a third element pad are laid on one surface of the glass fiber board 100, in the step 3, circuit wires are laid on the glass fiber board 100 to electrically connect the first power pad 300, the second power pad 400, each of the first chip pad 200, the third chip pad 900b, the second element pad and the third element pad according to a fifth preset circuit diagram, and in the step 4, the diode D2 is soldered to the second element pad and the capacitor C1 is soldered to the third element pad. In the fifth preset circuit diagram, on the basis of the fourth preset circuit diagram, the first power supply pad 300 is connected with the positive electrode of the diode D2, the negative electrode of the diode D2 is respectively connected with the power supply end of the second singlechip chip 900a and the negative electrodes of the LED chips, one end of the capacitor C1 is connected with the negative electrode of the diode D2, and the other end of the capacitor C1 is connected with the second power supply pad 400.
The foregoing description of the preferred embodiments of the present invention should not be construed as limiting the scope of the invention, but rather utilizing equivalent structural changes made in the present invention description and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. The production method of the LED filament lamp is characterized by comprising the following steps of:
step 1, cutting out strip-shaped glass fiber plates from a plate;
step 2, paving a first power supply bonding pad, a second power supply bonding pad and a plurality of first chip bonding pads on one surface of the glass fiber board;
step 3, paving circuit connection lines on the glass fiber board to enable the first power supply pad, the second power supply pad and each first chip pad to be electrically connected according to a first preset circuit diagram;
step 4, welding a plurality of LED chips on the corresponding first chip bonding pads one by one;
step 5, arranging fluorescent powder medium layers on one surface of the glass fiber board provided with the LED chip or on two surfaces of the glass fiber board;
step 6, welding upper leads on the first power supply bonding pad and the second power supply bonding pad respectively;
step 7, inserting the glass fiber board into a slot of the plastic plug, and installing the plastic plug at the bottom of the lamp bulb so that the glass fiber board is arranged in the lamp bulb;
and 8, mounting the lamp cap on the bottom of the bulb shell of the lamp and enabling the lead wires to be electrically connected with the lamp cap.
2. The method according to claim 1, wherein in the step 2, a first heat dissipation copper foil and a second heat dissipation copper foil are laid on one surface of the glass fiber board, the first power supply pad is disposed in the first heat dissipation copper foil, and the second power supply pad is disposed in the second heat dissipation copper foil.
3. The method according to claim 1, wherein in the step 4, the LED chip soldered to the first chip pad is a flip-chip LED chip.
4. The method of claim 1, wherein the glass fiber board is a light-transmitting glass fiber board, and the light transmittance of the glass fiber board is 20% to 95%.
5. The method according to claim 1, wherein in the step 2, a second chip bonding pad is laid on one surface of the glass fiber board, in the step 3, circuit wires are laid on the glass fiber board to electrically connect the first power bonding pad, the second power bonding pad, each of the first chip bonding pad and the second chip bonding pad according to a second preset circuit diagram, and in the step 4, the first monolithic chip is soldered on the second chip bonding pad.
6. The method according to claim 5, wherein in the step 2, a first element pad is laid on one surface of the glass fiber board, in the step 3, circuit wires are laid on the glass fiber board to electrically connect the first power pad, the second power pad, each of the first chip pad, the second chip pad and the first element pad according to a third preset circuit diagram, and in the step 4, the diode D1 is soldered on the first element pad.
7. The method according to claim 1, wherein in the step 2, a third chip bonding pad is laid on one surface of the glass fiber board, in the step 3, circuit wires are laid on the glass fiber board to electrically connect the first power bonding pad, the second power bonding pad, each of the first chip bonding pad and the third chip bonding pad according to a fourth preset circuit diagram, and in the step 4, a second monolithic chip is soldered on the second chip bonding pad.
8. The method according to claim 7, wherein in the step 2, a second element pad and a third element pad are laid on one surface of the glass fiber board, in the step 3, circuit wires are laid on the glass fiber board to electrically connect the first power pad, the second power pad, each of the first chip pad, the third chip pad, the second element pad and the third element pad according to a fifth predetermined circuit diagram, and in the step 4, a diode D2 is soldered on the second element pad, and a capacitor C1 is soldered on the third element pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311873657.4A CN117739293A (en) | 2023-12-29 | 2023-12-29 | LED filament lamp production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311873657.4A CN117739293A (en) | 2023-12-29 | 2023-12-29 | LED filament lamp production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117739293A true CN117739293A (en) | 2024-03-22 |
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ID=90254569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311873657.4A Pending CN117739293A (en) | 2023-12-29 | 2023-12-29 | LED filament lamp production method |
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| Country | Link |
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| CN (1) | CN117739293A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157772A (en) * | 2014-08-27 | 2014-11-19 | 江苏华英光宝科技股份有限公司 | Uprightly-mounted-chip inversion 360-degree light emitting LED light source with LED lamp filaments surrounded at will |
| CN208904063U (en) * | 2018-11-26 | 2019-05-24 | 深圳市灏天光电有限公司 | A kind of LED filament bracket for flip-chip |
| CN209782258U (en) * | 2019-04-12 | 2019-12-13 | 漳州立达信光电子科技有限公司 | Heat dissipation filament and lamp |
| CN113074326A (en) * | 2021-03-09 | 2021-07-06 | 任菊辉 | Self-supporting shadowless LED filament and LED lamp |
| US20230213154A1 (en) * | 2023-02-27 | 2023-07-06 | James Lee | Inverted LED filament and LED bulb having same |
| CN219828752U (en) * | 2023-03-07 | 2023-10-13 | 江门市圣达灯饰有限公司 | Two-wire nonpolar multifunctional lamp wire and lamp string |
-
2023
- 2023-12-29 CN CN202311873657.4A patent/CN117739293A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157772A (en) * | 2014-08-27 | 2014-11-19 | 江苏华英光宝科技股份有限公司 | Uprightly-mounted-chip inversion 360-degree light emitting LED light source with LED lamp filaments surrounded at will |
| CN208904063U (en) * | 2018-11-26 | 2019-05-24 | 深圳市灏天光电有限公司 | A kind of LED filament bracket for flip-chip |
| CN209782258U (en) * | 2019-04-12 | 2019-12-13 | 漳州立达信光电子科技有限公司 | Heat dissipation filament and lamp |
| CN113074326A (en) * | 2021-03-09 | 2021-07-06 | 任菊辉 | Self-supporting shadowless LED filament and LED lamp |
| US20230213154A1 (en) * | 2023-02-27 | 2023-07-06 | James Lee | Inverted LED filament and LED bulb having same |
| CN219828752U (en) * | 2023-03-07 | 2023-10-13 | 江门市圣达灯饰有限公司 | Two-wire nonpolar multifunctional lamp wire and lamp string |
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