CN117727666B - Control system and method for wafer conveying carrier in ultrahigh vacuum environment - Google Patents
Control system and method for wafer conveying carrier in ultrahigh vacuum environment Download PDFInfo
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- 235000012431 wafers Nutrition 0.000 claims description 109
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Abstract
The invention relates to the technical field of a method for controlling a conveying carrier, in particular to a system and a method for controlling a wafer conveying carrier in an ultra-high vacuum environment, comprising the following steps: collecting first data information of a wafer to be transmitted and second data information of a transmission carrier; carrying out data processing on the first data information and the second data information to obtain wafer carrying quantity information of the conveying carrier; and carrying out data processing on the wafer carrying quantity information and the second data information to acquire the stacking number of the wafer stacked on the conveying carrier and the data of the center of gravity height of the stack with the largest stacking number of the wafer. According to the invention, the moving path of the conveying carrier is segmented according to the path node relation to form i sub-road sections, the center point of the upper stacking wafer of the conveying carrier is collected, and the speed control coefficient is generated according to the environment information and the gravity center height data of each sub-road section, so that the conveying carrier can pass at different speeds in the sub-road sections of different environments, and the reasonable speed adjustment of the different sub-road sections is realized.
Description
Technical Field
The invention relates to the technical field of a transfer carrier control method, in particular to a control system and a control method of a wafer transfer carrier in an ultra-high vacuum environment.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, and a silicon wafer is formed after a silicon crystal bar is ground, polished and sliced, namely the wafer. The domestic wafer production line mainly comprises 8 inches and 12 inches, and the main processing modes of the wafers are wafer processing and batch processing, namely 1 wafer or a plurality of wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more advanced, so that new data features appear in wafer processing. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and reliability of the processed wafer is increased during the processing of the wafer, and along with the improvement of the cleanliness, the particle number also has the new data characteristic, and the particle number is conveyed by a conveying carrier during the processing of the existing wafer lot;
chinese patent publication No. CN114104635A discloses an automatic wafer handling crown block, comprising a frame, a moving driving mechanism and a multi-stage gripping mechanism; the frame comprises a top platform, a front vertical frame and a rear vertical frame, wherein the front vertical frame and the rear vertical frame are respectively positioned at the front end and the rear end of the lower side of the top platform; the movable driving mechanism is arranged on the upper side of the top platform and is used for driving the frame to walk along the track; the multistage grabbing mechanism is arranged on the lower side of the top platform and located between the front vertical frame and the rear vertical frame, and is used for stretching, lifting and grabbing objects below, and the multistage grabbing mechanism can properly improve the running speed of the crown block and improve the wafer carrying efficiency while improving the running stability of the crown block through optimizing the moving driving mechanism of the crown block.
However, it is known that when a wafer is transported by a transport carrier, the transport carrier is different in height due to different stacking heights, so that the transport speeds are also different, and the transport speeds are also different due to different curvature and gradient of road sections, if a single movement speed control transport carrier is provided to move, the transport carrier cannot reasonably adjust the speeds for different road sections, i.e. the transport carrier can only travel at the safe speed of the worst road section, so that the transport efficiency is lower.
Disclosure of Invention
In order to solve the above problems, the present invention provides a control system and method for a wafer carrier in an ultra-high vacuum environment.
The invention adopts the following technical scheme that the control method of the wafer conveying carrier in the ultra-high vacuum environment comprises the following steps:
Collecting first data information of a wafer to be transmitted and second data information of a transmission carrier;
carrying out data processing on the first data information and the second data information to obtain wafer carrying quantity information of the conveying carrier;
Carrying out data processing on the wafer carrying quantity information and the second data information to obtain the stacking number of the wafer stacking on the conveying carrier and the data of the center of gravity height of the stack with the largest stacking number of the wafer;
Acquiring moving path data information of a transport carrier, segmenting the whole moving path according to a path node relation, dividing the whole moving path into i sub-road sections, wherein i is an integer greater than or equal to 1, and marking the i sub-road sections, namely 1,2, … … and i in sequence;
collecting sub-road section environment information of each sub-road section, wherein the sub-road section environment information comprises a gradient value and a curvature value;
Generating a speed control coefficient according to the environmental information of the ith sub-road section and the gravity center height data, and judging and generating the moving speed grade of the transport vehicle on the ith sub-road section according to the speed control coefficient.
As a further description of the above technical solution: the first data information comprises size and weight data of a wafer, and the size of the wafer comprises thickness data and radius data of the wafer; the second data information includes load weight data and load area data of the transfer carrier.
As a further description of the above technical solution: the method for acquiring the wafer carrying quantity information of the conveying carrier comprises the following steps:
；
wherein, Carry quantity for wafer,/>To carry weight data,/>Is the weight data of the single wafer.
As a further description of the above technical solution: the method for acquiring the stacking number of the wafer stacking on the conveying carrier comprises the following steps:
；
Wherein R is the radius of the wafer, C is the length of the bearing area, K is the width of the bearing area, X is the stacking number of the wafer, To round down the symbol.
As a further description of the above technical solution: the method for acquiring the height data of the center of gravity of the stack of the most stacked wafers comprises the following steps:
；
Wherein Z is the center height, hd is the thickness data, To round the symbol up.
As a further description of the above technical solution: the node is a turning point on the whole moving path, and the turning point is a connecting point of a straight line path and a curve path, a connecting point of the straight line path and a gradient path and a connecting point of the curve path and the gradient path.
As a further description of the above technical solution: the calculation formula of the speed control coefficient is as follows:
；
Wherein the method comprises the steps of For the speed control coefficient of the ith sub-section,/>For the gradient value of the ith sub-section,/>For the curvature value of the ith sub-section, N is a correction coefficient,/>、/>And/>Are all weight factors,/>、/>And/>Are all greater than 0.
As a further description of the above technical solution: the moving speed grade comprises a first-stage moving speed, a second-stage moving speed, a third-stage moving speed and a fourth-stage moving speed, wherein the moving speeds of the first-stage moving speed, the second-stage moving speed, the third-stage moving speed and the fourth-stage moving speed are sequentially reduced;
the method for generating the moving speed level of the transport vehicle comprises the following steps:
The preset speed control coefficient threshold values are KV 1、KV2 and KV 3, wherein KV 1＜KV2＜KV3,
When (when)The first-order moving speed is generated when KV 1 is less than the first-order moving speed;
When KV 1 is less than or equal to The secondary moving speed is generated when KV 2 is smaller than that of the primary moving speed;
When KV 2 is less than or equal to The third-level moving speed is generated when KV 3 is less than KV;
When (when) And (5) generating a four-stage moving speed if the speed is not less than KV 3.
As a further description of the above technical solution: the gradient value acquisition method of the ith sub-road section comprises the following steps:
Taking the ground as a reference, acquiring a lowest point height value h 1 of an ith sub-road section, then acquiring a height value h 2 of a highest point of the ith sub-road section, and then acquiring the length L of the ith sub-road section;
according to the calculation formula: To the i-th sub-road section gradient value/> ；
The method for acquiring the curvature value of the ith sub-road section comprises the following steps:
scanning an ith sub-road section by using a laser scanner, using the central line of the road to represent a road path, mapping the road path to a built two-dimensional coordinate system, using coordinate points of the central line of the road on the two-dimensional coordinate system to represent the road contour, namely representing the contour of the ith sub-road section by using coordinate points (Xn, yn) in the coordinate system, wherein n is 1,2, 3, … … and m, and then performing curvature calculation;
；
；
wherein, Representing coordinate points (/ >)，/>) To a coordinate point (/ >)，/>) Is provided for the curvature of the lens.
A control system for a wafer transfer carrier in an ultra-high vacuum environment, comprising:
the first data acquisition module acquires first data information of a wafer to be transmitted and second data information of a transmission carrier;
The first data analysis module is used for carrying out data processing on the first data information and the second data information, acquiring the wafer carrying quantity information of the conveying carrier and acquiring the gravity center height data of the stack with the largest number of stacked wafers;
The path segmentation module is used for collecting the data information of the moving path of the transport carrier, segmenting the whole moving path according to the relation of path nodes, dividing the whole moving path into i sub-road sections, wherein i is an integer greater than or equal to 1, and marking the i sub-road sections, namely 1, 2, … … and i in sequence;
The second data acquisition module acquires sub-road section environment information of each sub-road section;
And the second data analysis module is used for generating a speed control coefficient according to the environmental information of the ith sub-road section and the gravity center height data, and judging and generating the moving speed grade of the transport vehicle on the ith sub-road section according to the speed control coefficient.
An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements a method for controlling a wafer transfer carrier in an ultra-high vacuum environment when executing the computer program.
A computer readable storage medium, wherein a computer program is stored on the computer readable storage medium, and the computer program is executed to implement the method for controlling the wafer transfer carrier in the ultra-high vacuum environment.
Compared with the prior art, the invention has the beneficial effects that:
According to the control system for the wafer conveying carrier in the ultra-high vacuum environment, provided by the invention, the moving path of the conveying carrier is segmented according to the path node relation to form i sub-sections, the center point of the upper stacking wafer of the conveying carrier is collected, and the speed control coefficient is generated according to the environmental information and the gravity center height data of each sub-section, so that the conveying carrier passes through the sub-sections in different environments at different speeds, the reasonable speed adjustment of the different sub-sections is realized, the condition that the conveying carrier can only run on the whole moving path at the safety speed of the worst section is overcome, and the conveying efficiency of the conveying carrier is further improved.
Drawings
The invention is further explained below with reference to the drawings and examples:
FIG. 1 is a flow chart of a method for controlling a wafer carrier in an ultra-high vacuum environment according to the present invention;
FIG. 2 is a block diagram of a control system for a wafer carrier in an ultra-high vacuum environment according to the present invention;
FIG. 3 is a schematic diagram of an electronic device according to the present invention;
FIG. 4 is a schematic view of a wafer placed in a carrier region according to the present invention.
Detailed Description
The application is further described with reference to the following detailed drawings in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the implementation of the application easy to understand. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
Example 1:
referring to fig. 1, the embodiment of the present invention provides a technical solution: a control method of a wafer conveying carrier in an ultra-high vacuum environment comprises the following steps:
Collecting first data information of a wafer to be transmitted and second data information of a transmission carrier; the first data information comprises size and weight data of a wafer, and the size of the wafer comprises thickness data and radius data of the wafer; the second data information comprises load weight data and load area data of the transmission carrier;
it should be noted that, the weight data of the wafer, the thickness data and the radius data of the wafer can be directly obtained through the production information of the wafer;
The carrying weight data of the conveying carrier can be obtained through a using instruction of the conveying carrier, the carrying area data are obtained through manual measurement, the length of the carrying area and the width of the carrying area are measured manually, and then the carrying weight data are obtained through a rectangular area calculation formula.
Carrying out data processing on the first data information and the second data information to obtain wafer carrying quantity information of the conveying carrier;
the method for acquiring the wafer carrying quantity information of the carrier comprises the following steps:
；
wherein, Carry quantity for wafer,/>To carry weight data,/>Is the weight data of the single wafer.
Carrying out data processing on the wafer carrying quantity information and the second data information to obtain the stacking number of the wafer stacking on the conveying carrier;
the method for acquiring the stacking number of the wafers on the conveying carrier comprises the following steps:
；
Wherein R is the radius of the wafer, C is the length of the carrying area, K is the width of the carrying area, and X is the stacking number of the wafer. To round down the sign, e.g./>2.
For a better understandingThe acquisition procedure of (2) is exemplified as follows:
Referring to FIG. 4, P represents the carrying region, C represents the length of the carrying region, K represents the width of the carrying region, e.g., C is 3.8, e.g., K is 3.5, R is 1, i.e Is 3,/>3, Because the remaining area is no longer available for wafer placement.
Acquiring the data of the gravity center height of a stack with the largest number of stacked wafers;
The method for acquiring the height data of the center of gravity of the stack with the largest number of stacked wafers comprises the following steps:
；
wherein, To round up the sign, e.g./>3.
Wherein Z is the center height and Hd is the thickness data.
For a better understanding of the Z acquisition process, examples are as follows:
For example 61,/>Is 3/>21;
it should be noted that for a uniform wafer chop with an average density distribution, its center of gravity is located at its geometric center and perpendicular to the plane, i.e. the height of the center of gravity is equal to half the overall height of the palletized wafer.
Collecting moving path data information of a transport carrier;
The travel speed of the transfer vehicle varies between the case of different route data information and the case of different center of gravity height data, and the safety speed is the maximum speed at which the vehicle can stably pass through the road section on a route having a larger gradient, a larger curvature, and a larger center of gravity height data.
Segmenting the whole moving path according to the path node relation, so as to divide the whole moving path into i sub-road sections, wherein i is an integer greater than or equal to 1, and marking the i sub-road sections, namely 1,2, … … and i in sequence;
The node is a turning point on the whole moving path, and the turning point is a connecting point of a straight line path and a curve path, a connecting point of the straight line path and a gradient path and a connecting point of the curve path and the gradient path;
the method comprises the steps that sub-road section environment information of each sub-road section is collected in sequence, the sub-road section environment information comprises a gradient value and a curvature value, and the fact that the existing transport carrier for wafers is required to be explained is that the moving path of the existing transport carrier for wafers is connected with each wafer processing device, the moving path is arranged to ensure the moving stability of the existing transport carrier, and the gradient cannot be set on a bent road section, namely, the gradient is set in the process of linear movement;
generating a speed control coefficient according to the sub-road section environment information and the gravity center height data;
The calculation formula of the speed control coefficient is as follows:
；
Wherein the method comprises the steps of For the speed control coefficient of the ith sub-section,/>For the gradient value of the ith sub-section,/>For the curvature value of the ith sub-section, N is a correction coefficient,/>、/>And/>Are all weight factors,/>、/>And/>Are all greater than 0.
、/>And/>Collecting a plurality of groups of sample data by a person skilled in the art and setting a corresponding weight factor for each group of sample data; substituting the set weight factors and the acquired sample data into formulas, forming a ternary once equation set by any three formulas, screening and averaging the calculated coefficients to obtain/>、/>And/>Is a value of (2).
In addition, it should be noted that the size of the weight factor is a specific numerical value obtained by quantizing each parameter, so that the subsequent comparison is convenient, and the size of the coefficient depends on the number of sample data and the corresponding weight factor is preliminarily set for each group of sample data by a person skilled in the art; as long as the proportional relation between the parameter and the quantized value is not affected.
Judging and generating the moving speed grade of the transport vehicle on the sub-section according to the speed control coefficient;
The moving speed grade comprises a first-stage moving speed, a second-stage moving speed, a third-stage moving speed and a fourth-stage moving speed, wherein the moving speeds of the first-stage moving speed, the second-stage moving speed, the third-stage moving speed and the fourth-stage moving speed are sequentially reduced;
the method for generating the moving speed level of the transport vehicle comprises the following steps:
The preset speed control coefficient threshold values are KV 1、KV2 and KV 3, wherein KV 1＜KV2＜KV3,
When (when)The first-order moving speed is generated when KV 1 is less than the first-order moving speed;
When KV 1 is less than or equal to The secondary moving speed is generated when KV 2 is smaller than that of the primary moving speed;
When KV 2 is less than or equal to The third-level moving speed is generated when KV 3 is less than KV;
When (when) And (5) generating a four-stage moving speed if the speed is not less than KV 3.
The gradient value of the ith sub-road section is obtained by the following method,
Taking the ground as a reference, acquiring a lowest point height value h 1 of an ith sub-road section, then acquiring a height value h 2 of a highest point of the ith sub-road section, and then acquiring the length L of the ith sub-road section;
according to the calculation formula: To the i-th sub-road section gradient value/> ；
It should be noted that, the height value of the lowest point and the height value of the highest point can be obtained by measuring through a level gauge;
The method for acquiring the curvature value of the ith sub-road section comprises the following steps:
scanning an ith sub-road section by using a laser scanner, using the central line of the road to represent a road path, mapping the road path to a built two-dimensional coordinate system, using coordinate points of the central line of the road on the two-dimensional coordinate system to represent the road contour, namely representing the contour of the ith sub-road section by using coordinate points (Xn, yn) in the coordinate system, wherein n is 1,2, 3, … … and m, and then performing curvature calculation;
；
；
wherein, Representing coordinate points (/ >)，/>) To a coordinate point (/ >)，/>) Is provided for the curvature of the lens.
Example 2:
Referring to fig. 2, a control system of a wafer carrier in an ultra-high vacuum environment is implemented based on the control method of the wafer carrier in the ultra-high vacuum environment, and includes:
the first data acquisition module acquires first data information of a wafer to be transmitted and second data information of a transmission carrier;
The first data analysis module is used for carrying out data processing on the first data information and the second data information, acquiring the wafer carrying quantity information of the conveying carrier and acquiring the gravity center height data of the stack with the largest number of stacked wafers;
The path segmentation module is used for collecting the data information of the moving path of the transport carrier, segmenting the whole moving path according to the relation of path nodes, dividing the whole moving path into i sub-road sections, wherein i is an integer greater than or equal to 1, and marking the i sub-road sections, namely 1, 2, … … and i in sequence;
The second data acquisition module acquires sub-road section environment information of each sub-road section;
And the second data analysis module is used for generating a speed control coefficient according to the environmental information of the ith sub-road section and the gravity center height data, and judging and generating the moving speed grade of the transport vehicle on the ith sub-road section according to the speed control coefficient.
Example 3:
An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements a method for controlling a wafer transfer carrier in an ultra-high vacuum environment when executing the computer program.
Since the electronic device described in this embodiment is an electronic device used to implement the method for controlling a wafer carrier in an ultra-high vacuum environment in this embodiment, a person skilled in the art can understand the specific implementation of the electronic device and various modifications thereof, so that the method for implementing the embodiment of the application will not be described in detail. As long as those skilled in the art implement the electronic device adopted by the control method of the wafer carrier in the ultra-high vacuum environment in the embodiment of the application, the electronic device belongs to the scope of protection required by the application.
Example 4:
referring to fig. 3, a computer-readable storage medium has a computer program stored thereon, which when executed, implements the method for controlling a wafer transfer carrier in an ultra-high vacuum environment.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the foregoing embodiments, and that the foregoing embodiments and description are merely illustrative of the principles of this invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, and these changes and modifications fall within the scope of the invention as hereinafter claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (12)
1. The control method of the wafer conveying carrier in the ultra-high vacuum environment is characterized by comprising the following steps:
Collecting first data information of a wafer to be transmitted and second data information of a transmission carrier;
carrying out data processing on the first data information and the second data information to obtain wafer carrying quantity information of the conveying carrier;
Carrying out data processing on the wafer carrying quantity information and the second data information to obtain the stacking number of the wafer stacking on the conveying carrier and the data of the center of gravity height of the stack with the largest stacking number of the wafer;
Acquiring moving path data information of a transport carrier, segmenting the whole moving path according to a path node relation, dividing the whole moving path into i sub-road sections, wherein i is an integer greater than or equal to 1, and marking the i sub-road sections, namely 1,2, … … and i in sequence;
collecting sub-road section environment information of each sub-road section, wherein the sub-road section environment information comprises a gradient value and a curvature value;
Generating a speed control coefficient according to the environmental information of the ith sub-road section and the gravity center height data, and judging and generating the moving speed grade of the transport vehicle on the ith sub-road section according to the speed control coefficient.
2. The method of claim 1, wherein the first data information includes wafer size and weight data, and the wafer size includes wafer thickness data and wafer radius data; the second data information includes load weight data and load area data of the transfer carrier.
3. The method for controlling a wafer carrier in an ultra-high vacuum environment according to claim 1, wherein the method for acquiring the wafer carrying quantity information of the carrier is as follows:
；
wherein, Carry quantity for wafer,/>To carry weight data,/>Is the weight data of the single wafer.
4. The method for controlling a wafer carrier in an ultra-high vacuum environment according to claim 3, wherein the method for obtaining the number of stacks of wafer stacks on the carrier is as follows:
；
Wherein R is the radius of the wafer, C is the length of the bearing area, K is the width of the bearing area, X is the stacking number of the wafer, To round down the symbol.
5. The method for controlling a wafer carrier in an ultra-high vacuum environment according to claim 4, wherein the method for acquiring the height data of the center of gravity of the stack of the most stacked wafers comprises:
；
Wherein Z is the center height, hd is the thickness data, To round the symbol up.
6. The method of claim 1, wherein the node is a turning point on the entire moving path, and the turning point is a connection point between a straight path and a curved path, a connection point between a straight path and a sloped path, and a connection point between a curved path and a sloped path.
7. The method for controlling a wafer carrier in an ultra-high vacuum environment according to claim 5, wherein the speed control coefficient is calculated by the formula:
；
Wherein the method comprises the steps of For the speed control coefficient of the ith sub-section,/>For the gradient value of the ith sub-section,/>For the curvature value of the ith sub-section, N is a correction coefficient,/>、/>And/>Are all weight factors,/>、/>And/>Are all greater than 0.
8. The method according to claim 7, wherein the moving speed classes include a first moving speed, a second moving speed, a third moving speed, and a fourth moving speed, and the moving speeds of the first moving speed, the second moving speed, the third moving speed, and the fourth moving speed are sequentially decreased;
the method for generating the moving speed level of the transport vehicle comprises the following steps:
The preset speed control coefficient threshold values are KV 1、KV2 and KV 3, wherein KV 1＜KV2＜KV3,
When (when)The first-order moving speed is generated when KV 1 is less than the first-order moving speed;
When KV 1 is less than or equal to The secondary moving speed is generated when KV 2 is smaller than that of the primary moving speed;
When KV 2 is less than or equal to The third-level moving speed is generated when KV 3 is less than KV;
When (when) And (5) generating a four-stage moving speed if the speed is not less than KV 3.
9. The method for controlling a wafer carrier in an ultra-high vacuum environment according to claim 7, wherein the method for obtaining the gradient value of the ith sub-section is as follows:
Taking the ground as a reference, acquiring a lowest point height value h 1 of an ith sub-road section, then acquiring a height value h 2 of a highest point of the ith sub-road section, and then acquiring the length L of the ith sub-road section;
according to the calculation formula: To the i-th sub-road section gradient value/> ；
The method for acquiring the curvature value of the ith sub-road section comprises the following steps:
scanning an ith sub-road section by using a laser scanner, using the central line of the road to represent a road path, mapping the road path to a built two-dimensional coordinate system, using coordinate points of the central line of the road on the two-dimensional coordinate system to represent the road contour, namely representing the contour of the ith sub-road section by using coordinate points (Xn, yn) in the coordinate system, wherein n is 1,2, 3, … … and m, and then performing curvature calculation;
；
；
wherein, Representing coordinate points (/ >)，/>) To a coordinate point (/ >)，/>) Is provided for the curvature of the lens.
10. A control system for an ultra-high vacuum environment wafer transfer carrier, which is realized based on the control method for an ultra-high vacuum environment wafer transfer carrier according to any one of claims 1 to 9, comprising
The first data acquisition module acquires first data information of a wafer to be transmitted and second data information of a transmission carrier;
The first data analysis module is used for carrying out data processing on the first data information and the second data information, acquiring the wafer carrying quantity information of the conveying carrier and acquiring the gravity center height data of the stack with the largest number of stacked wafers;
The path segmentation module is used for collecting the data information of the moving path of the transport carrier, segmenting the whole moving path according to the relation of path nodes, dividing the whole moving path into i sub-road sections, wherein i is an integer greater than or equal to 1, and marking the i sub-road sections, namely 1, 2, … … and i in sequence;
The second data acquisition module acquires sub-road section environment information of each sub-road section;
And the second data analysis module is used for generating a speed control coefficient according to the environmental information of the ith sub-road section and the gravity center height data, and judging and generating the moving speed grade of the transport vehicle on the ith sub-road section according to the speed control coefficient.
11. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements a method for controlling a wafer transfer carrier in an ultra-high vacuum environment according to any one of claims 1 to 9 when executing the computer program.
12. A computer readable storage medium, wherein a computer program is stored on the computer readable storage medium, and when executed, the computer program implements a method for controlling a wafer transfer carrier in an ultra-high vacuum environment according to any one of claims 1 to 9.
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| CN116551700A (en) * | 2023-07-10 | 2023-08-08 | 泓浒(苏州)半导体科技有限公司 | Wafer conveying mechanical arm control system and method in ultrahigh vacuum environment |
| WO2023165189A1 (en) * | 2022-03-04 | 2023-09-07 | 弥费科技(上海)股份有限公司 | Wafer transfer supervision control method and system, computer device and storage medium |
| CN116960041A (en) * | 2023-09-19 | 2023-10-27 | 弥费科技(上海)股份有限公司 | Travel control method and device for overhead traveling vehicle and storage medium |
| CN117316835A (en) * | 2023-11-28 | 2023-12-29 | 泓浒(苏州)半导体科技有限公司 | Environment detection and early warning method for semiconductor wafer transmission under ultrahigh vacuum environment |
| CN117446507A (en) * | 2023-10-09 | 2024-01-26 | 南通知力机械科技有限公司 | Intelligent logistics stacking robot control system |
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| WO2023165189A1 (en) * | 2022-03-04 | 2023-09-07 | 弥费科技(上海)股份有限公司 | Wafer transfer supervision control method and system, computer device and storage medium |
| CN116551700A (en) * | 2023-07-10 | 2023-08-08 | 泓浒(苏州)半导体科技有限公司 | Wafer conveying mechanical arm control system and method in ultrahigh vacuum environment |
| CN116960041A (en) * | 2023-09-19 | 2023-10-27 | 弥费科技(上海)股份有限公司 | Travel control method and device for overhead traveling vehicle and storage medium |
| CN117446507A (en) * | 2023-10-09 | 2024-01-26 | 南通知力机械科技有限公司 | Intelligent logistics stacking robot control system |
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