CN117690945A - Driving backboard, display panel, manufacturing method of display panel and electronic equipment - Google Patents

Abstract

According to the driving backboard, the display panel, the manufacturing method of the display panel and the electronic equipment, the bearing assembly is arranged on the substrate of the driving backboard, the bearing supporting portion included by the bearing assembly is sticky and relatively fixed in shape, when the light-emitting device is pre-positioned, the light-emitting device can be adhered and fixed through the bearing supporting portion of the bearing assembly, when the light-emitting device is bonded under pressure, the bearing supporting portion can be bent and deformed, and the light-emitting device can press the bearing assembly to enable the bearing supporting portion to deform until the light-emitting device is electrically connected with the connecting electrode on the driving backboard. Therefore, the bearing assembly can improve the alignment precision of the light-emitting device in the pre-positioning process, reduce the risk of the light-emitting device shifting, rotating or overturning along with colloid, and can not influence the electric connection between the light-emitting device and the connecting electrode on the driving backboard in the pressure bonding process, thereby improving the bonding yield of the light-emitting device.

Description

Driving backboard, display panel, manufacturing method of display panel and electronic equipment

Technical Field

The application relates to the technical field of display equipment, in particular to a driving backboard, a display panel manufacturing method and electronic equipment.

Background

With the development of display device manufacturing technology, mini light emitting diodes (Mini LEDs) and Micro light emitting diodes (Micro-LEDs) have been widely used because of their superior brightness, resolution, contrast, power consumption, lifetime, response speed, thermal stability, and the like.

In the manufacturing process of Mini LEDs or Micro-LEDs, light emitting devices with different colors need to be transferred to a driving backboard through a mass transfer process. In some light-emitting device transfer schemes, a receiving layer is firstly adopted to bond the light-emitting devices on a substrate to achieve preset positions, and after transfer is completed, all the light-emitting devices are integrally bonded. However, if a receiving layer with a larger crosslinking degree and higher elasticity is adopted, in order to reduce the influence of the substrate effect on the light-emitting device, the thickness of the film layer required to be arranged is larger, so that the effective electric connection between the subsequent light-emitting device and the driving backboard can be influenced; if the receiving layer with smaller crosslinking degree is adopted, the light-emitting device may deviate, rotate or turn over along with the colloid due to better colloid mobility of the receiving layer, so that the light-emitting device cannot be accurately electrically connected with the bonding electrode on the driving backboard.

Disclosure of Invention

In order to overcome the technical problems mentioned in the background of the present application, a driving back plate according to an embodiment of the present application includes:

a substrate;

a connection electrode and a receiving assembly positioned at one side of the substrate;

wherein the connection electrode is electrically connected with the light emitting device; the bearing assembly comprises at least two bearing supporting parts; the connecting electrode is positioned between the bearing support parts; the receiving support part has viscosity and can be bent and deformed.

In one possible implementation, the receiving support is made of a flexible material having tackiness.

In one possible implementation, the receiving support has a distance from an end of the substrate that is greater than or equal to a distance from an end of the connection electrode that is remote from the substrate to the substrate.

In one possible implementation, at least two of the receiving supports distributed on both sides of the same connection electrode have different distances from the end of the substrate away from the substrate.

In one possible implementation manner, in the at least two receiving support portions distributed on both sides of the same connection electrode, a thickness of the receiving support portion having a larger distance from one end of the substrate to the substrate is larger, and a thickness of the receiving support portion having a smaller distance from one end of the substrate to the substrate is smaller.

In one possible implementation, there is a gap between adjacent ones of the receiving assemblies;

optionally, the gap has a width greater than 15 microns.

In one possible implementation manner, grooves are formed on one surface, opposite to the receiving support parts, of at least two of the receiving support parts distributed on two sides of the same connecting electrode;

alternatively, the receiving support portion includes a plurality of receiving support columns aligned in the same direction.

The application also provides a display panel, which comprises the driving backboard and at least one light-emitting device arranged on the driving backboard;

optionally, an edge of a side of the light emitting device facing the substrate has an arc chamfer or chamfer.

The application also provides a manufacturing method of the display panel, which comprises the following steps:

providing a driving backboard, wherein the driving backboard comprises a substrate, a connecting electrode and a bearing assembly; the connecting electrode is electrically connected with the light-emitting device; the bearing assembly comprises at least two bearing supporting parts; the connecting electrode is positioned between the bearing support parts; the bearing support part is viscous and can be bent and deformed;

placing a light emitting device on the bearing assembly, and adhering and fixing the edge of the light emitting device and the bearing support part;

and applying pressure towards the driving backboard to the light-emitting device, so that the light-emitting device moves towards the connecting electrode and presses the bearing support part to deform until the light-emitting device is bonded and connected with the connecting electrode.

The application also provides electronic equipment, which comprises the display panel.

Compared with the prior art, the application has the following beneficial effects:

according to the driving backboard, the display panel manufacturing method and the electronic equipment, the bearing assembly is arranged on the substrate of the driving backboard, the bearing supporting portion included by the bearing assembly is sticky and relatively fixed in shape, when the light-emitting device is pre-positioned, the light-emitting device can be adhered and fixed through the bearing supporting portion of the bearing assembly, when the light-emitting device is bonded under pressure, the bearing supporting portion can be bent and deformed, and the light-emitting device can press the bearing assembly to enable the bearing supporting portion to deform until the light-emitting device is electrically connected with the connecting electrode on the driving backboard. Therefore, the bearing assembly can improve the alignment precision of the light-emitting device in the pre-positioning process, reduce the risk of the light-emitting device shifting, rotating or overturning along with colloid, and can not influence the electric connection between the light-emitting device and the connecting electrode on the driving backboard in the compression bonding process, thereby improving the bonding yield of the light-emitting device.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a driving back plate according to the present embodiment;

fig. 2 is a schematic diagram of a bonding process of a light emitting device according to the present embodiment;

FIG. 3 is a second schematic diagram of a bonding process of a light emitting device according to the present embodiment;

FIG. 4 is a second schematic diagram of the driving back plate according to the present embodiment;

FIG. 5 is a third schematic diagram of the driving back plate according to the present embodiment;

FIG. 6 is a schematic diagram of a driving back plate according to the present embodiment;

FIG. 7 is a fifth schematic diagram of the driving back plate according to the present embodiment;

FIG. 8 is a schematic diagram of a driving back plate according to the present embodiment;

FIG. 9 is a schematic diagram of a driving back plate according to the present embodiment;

FIG. 10 is a schematic diagram of a driving back plate according to the present embodiment;

FIG. 11 is a third schematic diagram of the bonding process of the light emitting device according to the present embodiment;

FIG. 12 is a diagram illustrating a bonding process of a light emitting device according to the present embodiment;

fig. 13 is a flowchart illustrating a manufacturing method of a display panel according to the present embodiment.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present application, it should be noted that, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is commonly put when the product of the application is used, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

It should be noted that, in the case of no conflict, different features in the embodiments of the present application may be combined with each other.

Referring to fig. 1, fig. 1 is a schematic diagram of a driving back plate according to the present embodiment, where the driving back plate may include a substrate 110, a connection electrode 120, and a receiving component 130.

In this embodiment, the substrate 110 may include a plurality of metal wires for transmitting signals or electric energy, and the metal wires may be electrically connected to a driving chip or a driving circuit for driving the light emitting device.

The connection electrode 120 and the receiving member 130 are disposed on one side of the substrate 110. The connection electrode 120 may be a plurality or a plurality of pairs, and optionally, a pair of the connection electrodes 120 is used for electrically connecting with one light emitting device, for example, a pair of the connection electrodes 120 includes two connection electrodes 120 respectively connected with an N-pole and a P-pole of the light emitting device, and the two electrodes may be also electrically connected with a common electrode line and a pixel electrode line in the substrate 110, respectively.

Each of the receiving assemblies 130 includes at least two receiving supports between which the connection electrode 120 is positioned, for example, the connection electrode 120 may be positioned between two or more of the receiving supports in the receiving assembly 130. The receiving support part has viscosity and can be bent and deformed.

Based on the above design, referring to fig. 2, when bonding the light emitting device 200 to the driving backplate, the pins of the light emitting device 200 may be aligned with the connection electrodes 120, and then the light emitting device 200 may be placed on the receiving component 130, so that the edge of the light emitting device 200 is located on the receiving component 130 and bonded to the receiving component 130. Because the supporting portion of the supporting component 130 has viscosity and relatively fixed shape, the supporting component 130 can be stably adhered to the light-emitting device 200, so that the light-emitting device 200 is pre-positioned, and the relative position between the light-emitting device 200 and the driving backboard is ensured to be fixed. Thus, the alignment accuracy of the light emitting device 200 can be improved, and the risk of the light emitting device 200 shifting, rotating or turning along with the colloid can be reduced.

In one possible implementation, the receiving support is made of a flexible material having tackiness. For example, the receiving support part can be made of one or more of silicon-based glue, epoxy resin glue and acrylic glue with high crosslinking degree and high viscosity. After the connection electrode 120 is formed on the substrate 110, the receiving component 130 may be disposed around the connection electrode 120 by nano-imprinting.

In one possible implementation, the receiving support is spaced from the substrate 110 by a distance greater than or equal to the distance from the end of the connection electrode 120 remote from the substrate 110 to the substrate 110.

In this embodiment, the receiving support portion may have a thin wall extending from the substrate 110 in a direction away from the substrate 110, and may be curved and deformed to both sides in the direction of the force applied to the substrate 110 when the receiving support portion receives the force applied to the substrate 110.

Referring to fig. 3, when the light emitting device 200 is bonded under pressure, the light emitting device 200 may move toward the substrate 110 under the action of the bonding apparatus, and the receiving support portion has flexibility, so that the light emitting device 200 may further move toward the connection electrode 120 on the substrate 110 after being pressed to deform, until the pins of the light emitting device 200 contact the connection electrode 120 and are bonded. In this way, the receiving component 130 does not affect the electrical connection between the light emitting device 200 and the connection electrode 120 on the driving back plate, and ensures the effective electrical connection between the light emitting device 200 and the connection electrode 120.

In this embodiment, at least two of the receiving supports may be symmetrically distributed around the connection electrode 120. For example, referring to fig. 4, the receiving and supporting portions may be located at two sides of the connection electrode 120, and during bonding and pressurization, the two receiving and supporting portions may respectively bend and deform toward two sides far from the connection electrode 120. For another example, referring to fig. 5, the receiving and supporting portions may be located around the connecting electrode 120, and each receiving and supporting portion may be respectively bent and deformed in each direction away from the connecting electrode 120 during bonding and pressurization. The distribution of the receiving and supporting portions may be adaptively adjusted according to the shape of the light emitting device 200 to be bonded, which is not particularly limited in the present embodiment.

Referring to fig. 6, based on some processes of the light emitting device 200, the heights of two ends of one side of the light emitting device 200 away from the light emitting surface may be different, so in some possible implementations of the present embodiment, the distances from the end of the at least two receiving support portions, which are distributed on two sides of the same connection electrode 120, away from the substrate 110 to the substrate 110 are different. For example, the receiving assembly 130 may include a first receiving support 131 and a second receiving support 132, wherein a distance D1 from an end of the first receiving support 131 away from the substrate 110 to the substrate 110 is greater than a distance D2 from an end of the second receiving support 132 away from the substrate 110 to the substrate 110. In this way, when the two ends of the light emitting device 200 are respectively adhered to the first receiving support portion 131 and the second receiving support portion 132, the light emitting surface of the light emitting device 200 may be kept substantially parallel to the surface of the substrate 110, which is beneficial to the uniform stress of the light emitting device 200 in the subsequent press bonding process.

Alternatively, in the present embodiment, the first receiving support 131 and the second receiving support 132 having different heights may be supported by embossing using different thicknesses of the nanoimprint mold. In one example, the second receiving support 132 having a low height may be formed on the substrate 110 using a nano-imprinting mold having a low thickness, and then the first receiving support 131 having a high height may be formed on the substrate 110 using a nano-imprinting mold having a high thickness. In another example, the first receiving support 131 and the second receiving support 132 may be formed at one time using the same nanoimprint mold including a first portion having a thicker thickness for forming the first receiving support 131 and a second portion having a thinner thickness for forming the second receiving support 132.

Further, referring to fig. 7, the receiving supports made of the same material and having different heights may have different amounts of bending, and the lower the height, the smaller the amount of bending may be. Thus, in one possible implementation, among the at least two receiving supports distributed on both sides of the same connection electrode 120, the receiving support having a larger distance from one end of the substrate 110 to the substrate 110 has a larger thickness, and the receiving support having a smaller distance from one end of the substrate 110 to the substrate 110 has a smaller thickness.

For example, referring to fig. 8, orthographic projections of the first receiving support portion 131 and the second receiving support portion 132 on the substrate 110 extend along a first direction, and a thickness W1 of the first receiving support portion 131 is greater than a thickness W2 of the second receiving support portion 132 in a second direction perpendicular to the first direction. That is, the thickness of the second receiving support 132 having a relatively low height may be relatively small, so that the deformation amounts of the first receiving support 131 and the second receiving support 132 may be balanced, thereby ensuring that the light emitting device 200 may relatively smoothly move toward the connection electrode 120 during the press bonding.

In some possible implementations, referring again to fig. 3, there is a gap 133 between adjacent ones of the socket assemblies 130. For example, the gap has a width greater than 15 microns. In this way, when the two adjacent receiving assemblies 130 are deformed, the gap 133 may ensure that the receiving support portions in the receiving assemblies 130 are not mutually affected, and the two receiving assemblies can smoothly bend and deform.

In some possible implementations, at least two of the receiving supports distributed on both sides of the same connection electrode 120 are provided with grooves on opposite sides. For example, referring to fig. 9, the receiving assembly 130 includes a first receiving support portion 131 and a second receiving support portion 132, and a surface of the first receiving support portion 131 opposite to the second receiving support portion 132 is provided with a groove. Preferably, the width of the groove may be slightly larger than the width of the light emitting device 200, so that, in the press bonding process, after the light emitting device 200 is pressed to deform the first receiving and supporting portion 131 and the second receiving and supporting portion 132, the groove may bind the moving direction of the light emitting device 200, thereby avoiding the dislocation of the light emitting device 200 in the moving process towards the connection electrode 120, and improving the bonding accuracy of the light emitting electrode and the connection electrode 120.

In some possible implementations, referring to fig. 10, the receiving support portion may include a plurality of receiving support columns aligned in the same direction. In this way, different receiving support columns can bend relatively independently, which is more beneficial for the light emitting device 200 to compress and deform each receiving support column.

Based on the same inventive concept, the present embodiment also provides a display panel, which includes the driving back plate provided in the present embodiment and at least one light emitting device 200 disposed on the driving back plate. Wherein, the orthographic projection of the light emitting device 200 on the substrate 110 coincides with the orthographic projection of the end of the receiving support portion near the substrate 110 on the substrate 110.

In this embodiment, the light emitting device 200 may be a Micro-LED or a Mini LED.

In one possible implementation, referring to fig. 11 and 12, an edge of a side of the light emitting device 200 facing the substrate 110 has an arc chamfer or a chamfer. In this way, in the press bonding process, the arc chamfer or the chamfer of the light emitting device 200 may guide the receiving support portion to bend away from the connecting electrode 120, so as to ensure that the receiving support portion does not affect the electrical connection between the light emitting device 200 and the connecting electrode 120.

Based on the same inventive concept, please refer to fig. 12, the present embodiment also provides a method for manufacturing a display panel, which may include the following steps.

In step S110, a driving back plate is provided, and the driving back plate includes a substrate 110, a connection electrode 120 and a receiving assembly 130. The connection electrode 120 and the receiving component 130 are located on one side of the substrate 110. The pair of connection electrodes 120 are used for electrically connecting with one light emitting device 200. Each of the receiving assemblies 130 includes at least two receiving supports. A pair of the connection electrodes 120 is located between two of the receiving supports in one of the receiving assemblies 130. The receiving support part has viscosity and can be bent and deformed.

Wherein the receiving support part is made of a flexible material with viscosity, and the distance from one end of the receiving support part far away from the substrate 110 to the substrate 110 is greater than the distance from one end of the connecting electrode 120 far away from the substrate 110 to the substrate 110.

In this embodiment, in step S110, the driving back plate described in the foregoing embodiment may be provided.

In step S120, the light emitting device 200 is placed on the receiving assembly 130, so that the edge of the light emitting device 200 is adhered and fixed to the receiving support portion.

In this embodiment, the light emitting devices 200 with different colors may be sequentially transferred to the driving back plate, and adhered and fixed to the receiving assembly 130, and then the subsequent press bonding operation may be uniformly performed.

And step 130, applying pressure to the light-emitting device 200 towards the driving backboard, so that the light-emitting device 200 moves towards the connecting electrode 120 and presses the receiving support part to deform until the light-emitting device 200 is bonded and connected with the connecting electrode 120.

In this embodiment, the present bonding process may apply pressure to each light emitting device 200 by using a pressing plate or a pressing film to move the light emitting device 200 toward the connection electrode 120, and may press the receiving support portion to deform during the movement of each light emitting device 200 until the light emitting device 200 is bonded to the connection electrode 120.

The application also provides electronic equipment, which is characterized by comprising the display panel provided by the application, wherein the electronic equipment can be equipment with display functions such as televisions, spliced screens, mobile terminals and display areas.

In summary, according to the driving backboard, the display panel, the manufacturing method of the display panel and the electronic equipment provided by the application, the light-emitting device can be adhered and fixed through the bearing component when the light-emitting device is pre-positioned by the bearing component, and the light-emitting device can be pressed to deform by pressing the bearing component when the light-emitting device is bonded by pressing until the light-emitting device is electrically connected with the connecting electrode on the driving backboard. Therefore, the bearing assembly can improve the alignment precision of the light-emitting device in the pre-positioning process, reduce the risk of the light-emitting device shifting, rotating or overturning along with colloid, and can not influence the electric connection between the light-emitting device and the connecting electrode on the driving backboard in the pressure bonding process, thereby improving the bonding yield of the light-emitting device.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. A drive back plate, characterized in that the drive back plate comprises:

a substrate;

a connection electrode and a receiving assembly positioned at one side of the substrate;

wherein the connection electrode is electrically connected with the light emitting device; the bearing assembly comprises at least two bearing supporting parts; the connecting electrode is positioned between the bearing support parts; the receiving support part has viscosity and can be bent and deformed.

2. The drive backplate of claim 1, wherein the receiving support is made of a flexible material having a viscosity.

3. The drive backplate of claim 1, wherein the receiving support has a distance from the end of the substrate that is greater than or equal to a distance from the end of the connection electrode that is distal from the substrate to the substrate.

4. The driving back plate according to claim 1, wherein at least two of the receiving supports distributed on both sides of the same connection electrode have different distances from one end of the substrate away from the substrate to the substrate.

5. The driving back plate according to claim 4, wherein, of the at least two receiving support portions distributed on both sides of the same connection electrode, the receiving support portion having a larger distance from one end of the substrate to the substrate is larger in thickness, and the receiving support portion having a smaller distance from one end of the substrate to the substrate is smaller in thickness.

6. The drive backplate of claim 1, wherein there is a gap between adjacent ones of the socket assemblies;

optionally, the gap has a width greater than 15 microns.

7. The driving back plate according to claim 1, wherein grooves are provided on opposite sides of at least two of the receiving supports distributed on both sides of the same connecting electrode;

alternatively, the receiving support portion includes a plurality of receiving support columns aligned in the same direction.

8. A display panel, characterized in that the display panel comprises the driving back plate according to any one of claims 1-6 and at least one light emitting device arranged on the driving back plate;

optionally, an edge of a side of the light emitting device facing the substrate has an arc chamfer or chamfer.

9. A method of manufacturing a display panel, the method comprising:

providing a driving backboard, wherein the driving backboard comprises a substrate, a connecting electrode and a bearing assembly; the connecting electrode is electrically connected with the light-emitting device; the bearing assembly comprises at least two bearing supporting parts; the connecting electrode is positioned between the bearing support parts; the bearing support part is viscous and can be bent and deformed;

placing a light emitting device on the bearing assembly, and adhering and fixing the edge of the light emitting device and the bearing support part;

and applying pressure towards the driving backboard to the light-emitting device, so that the light-emitting device moves towards the connecting electrode and presses the bearing support part to deform until the light-emitting device is bonded and connected with the connecting electrode.

10. An electronic device comprising the display panel of claim 8.