CN117650085A - Semiconductor chip packaging device - Google Patents
Semiconductor chip packaging device Download PDFInfo
- Publication number
- CN117650085A CN117650085A CN202410115264.5A CN202410115264A CN117650085A CN 117650085 A CN117650085 A CN 117650085A CN 202410115264 A CN202410115264 A CN 202410115264A CN 117650085 A CN117650085 A CN 117650085A
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- China
- Prior art keywords
- packaging
- glue
- seat
- fixed
- packing element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 105
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 72
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000004140 cleaning Methods 0.000 claims abstract description 44
- 238000002360 preparation method Methods 0.000 claims abstract description 20
- 238000007599 discharging Methods 0.000 claims abstract description 10
- 238000005538 encapsulation Methods 0.000 claims abstract 5
- 238000012856 packing Methods 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 2
- 238000003860 storage Methods 0.000 abstract description 12
- 238000003825 pressing Methods 0.000 abstract description 11
- 238000012546 transfer Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Basic Packing Technique (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to the technical field of chip packaging, and particularly provides a semiconductor chip packaging device which comprises a transfer tray, a feeding manipulator, a packaging preparation mechanism, a paster mechanism and a discharging manipulator, wherein the feeding manipulator is used for placing a packaging shell on a fixing mechanism, the packaging preparation mechanism is used for filling glue into the packaging shell, the paster mechanism is used for placing a chip into the packaging shell, and the discharging manipulator is used for discharging the packaging shell in the fixing mechanism; the encapsulation preparation mechanism comprises a dispensing head, a glue storage cylinder, a lower pressing cylinder, a glue cylinder seat and a cleaning head, wherein the cleaning head is arranged below the dispensing head, and the cleaning head can move from the middle of the encapsulation shell to two sides to clean the inside of the encapsulation shell. The glue cylinder seat is driven to move downwards through the lower air cylinder, the cleaning head moves from the middle of the packaging shell to two sides, the inside of the packaging shell is cleaned, glue in the glue storage cylinder is filled into the cleaned packaging shell through the glue dispensing head after cleaning is finished, and therefore the chip is attached into the packaging shell by the chip attaching mechanism.
Description
Technical Field
The present invention relates to the field of chip packaging technologies, and in particular, to a semiconductor chip packaging apparatus.
Background
In chip packaging, the chip packaging shell not only plays a role in mounting and fixing, but also ensures normal heat dissipation, sealing and chip protection of the chip, so that the chip is required to be subjected to dispensing treatment in the chip packaging shell, the chip is adhered in the chip packaging shell, the packaging shell cannot be damaged in the dispensing process, and meanwhile, the uniform and consistent dispensing quantity is ensured, so that the dispensing effect is required to be ensured by cleaning the dispensing surface of the packaging shell, air is prevented from entering glue to generate bubbles, and the heat dissipation effect of the chip is influenced.
A semiconductor chip packaging device and a packaging process with the publication number of CN113270345B comprise a packaging jig, a temperature adjusting chamber and a temperature adjusting component; the packaging jig comprises a placing plate, wherein a plurality of ball seat are arranged on the upper surface of the placing plate, and the ball seat can rotate in a universal mode. Is connected with a ball head; the bulb is formed by detachably connecting an upper hemisphere and a lower hemisphere, the lower hemisphere is provided with a packaging positioning groove, and the upper hemisphere is provided with a packaging cover plate; a placing frame, a friction plate and a horizontal moving assembly are arranged in the temperature adjusting chamber; the placing plate is provided with an oblique abutting rod for abutting against the lower hemisphere to be positioned and a driving assembly for driving the abutting rod to perform abutting against and loosening movements, the ball seat is provided with an opening for the abutting rod to extend into, and the opening is communicated with the inside of the ball seat. However, this patent still suffers from a number of disadvantages: when the glue shakes, air is easy to enter the glue to generate bubbles, and the chip shakes to possibly cause the chip to be not tightly attached to the packaging shell.
Disclosure of Invention
The invention aims to solve the technical problems that: in order to solve the problem of the non-tight adhesion between the chip and the packaging shell, the invention provides a semiconductor chip packaging device for solving the problem.
The technical scheme adopted for solving the technical problems is as follows: the semiconductor chip packaging device comprises a transfer tray, a fixing mechanism, a feeding manipulator, a packaging preparation mechanism, a paster mechanism and a discharging manipulator, wherein the fixing mechanism is installed on the surface of the transfer tray, the feeding manipulator, the packaging preparation mechanism, the paster mechanism and the discharging manipulator are arranged around the periphery of the transfer tray, the feeding manipulator is used for placing and fixing the packaging shell on the fixing mechanism, the packaging preparation mechanism is used for filling glue into the packaging shell, the paster mechanism is used for placing a chip into the packaging shell, and the discharging manipulator is used for discharging the packaging shell in the fixing mechanism; the packaging preparation mechanism comprises a dispensing head, a glue storage cylinder, a lower pressing cylinder, a glue cylinder seat and a cleaning head, wherein the glue cylinder seat is fixedly connected with a piston rod of the lower pressing cylinder, the lower pressing cylinder is used for driving the glue cylinder seat to move up and down, the glue storage cylinder is fixed in the glue cylinder seat, the glue storage cylinder is communicated with the dispensing head, the glue can be filled into the packaging shell by the dispensing head, the cleaning head is arranged below the glue dispensing head, and the cleaning head can move from the middle of the packaging shell to two sides to clean the inside of the packaging shell.
Preferably, the fixing mechanism comprises a chassis, four corners of the chassis are respectively fixed with a clamping seat, the packaging shell can be placed on the chassis, and corners of the packaging shell can be abutted against the clamping seats.
Preferably, the clamping seat comprises a fixed block, a guide rod, a tight abutting spring, a connecting block and a clamping block, wherein the fixed block is fixed on the chassis, the guide rod is slidably mounted on the fixed block, the connecting block is fixedly connected with the end part of the guide rod, the clamping block is L-shaped and is fixed on the connecting block, the tight abutting spring is sleeved on the guide rod, and two ends of the tight abutting spring are respectively abutted with the connecting block and the fixed block.
Preferably, the surface mounting mechanism comprises a lifting cylinder, a pneumatic sucker, a transplanting cylinder and a transplanting support, wherein the transplanting cylinder is horizontally fixed on the transplanting support, the transplanting cylinder can drive the lifting cylinder to horizontally move, the lifting cylinder can drive the pneumatic sucker nozzle to move towards the transferring tray, and the pneumatic sucker is used for taking and placing chips.
Preferably, the bottom sliding sealing sleeve of the dispensing head is provided with a sleeve, the bottom of the sleeve is provided with a glue nozzle, the glue nozzle is of a strip-shaped structure and is provided with an opening at the bottom, and the length of the glue nozzle is larger than the outer diameter of the sleeve.
Preferably, the packaging preparation mechanism further comprises two cleaning seats, wherein one cleaning head is fixed at the bottom of each cleaning seat, a sliding block is fixed at the top of each cleaning seat, an inclined sliding groove is formed in the side wall of the rubber cylinder seat, and the sliding blocks are slidably installed in the inclined sliding grooves.
Preferably, the side of the glue storage cylinder is fixed on the inner wall of the glue cylinder seat through a support seat, a push rod is vertically and slidably arranged on the support seat, a push block is fixed at the upper end of the push rod, a rocker is further rotatably arranged on the inner wall of the glue cylinder seat, one end of the rocker is abutted to the upper surface of the push block, the slider can push the other end of the rocker to move upwards, a threaded ring is sleeved on the outer surface of the sleeve, the threaded ring is in threaded connection with the outer wall of the sleeve, and the lower end of the push rod is fixedly connected with the outer ring of the threaded ring through a connecting rod.
Preferably, a rod frame is fixed above the sliding block, a cross rod is vertically fixed on the rod frame, and when the sliding block moves upwards along the inclined sliding groove, the cross rod can push the end part of the seesaw to move upwards.
The packaging preparation mechanism has the beneficial effects that the glue cylinder seat is driven to move downwards through the pressing cylinder, so that the cleaning head is in contact with the surface of the packaging shell, then the cleaning head moves from the middle of the packaging shell to two sides to clean the inside of the packaging shell, and after the cleaning is finished, glue in the glue storage cylinder is filled into the cleaned packaging shell through the glue dispensing head, so that packaging preparation can be finished, and the chip is attached into the packaging shell by the chip attaching mechanism.
Drawings
The invention will be further described with reference to the drawings and examples.
Fig. 1 is a schematic view of a semiconductor chip packaging apparatus according to a preferred embodiment of the present invention;
fig. 2 is a schematic view of a structure of a pressing cylinder of a semiconductor chip packaging apparatus according to the present invention;
fig. 3 is a first state diagram of a package preparing mechanism of a semiconductor chip packaging apparatus of the present invention;
fig. 4 is a schematic view showing a second state of a package preparing mechanism of a semiconductor chip packaging apparatus according to the present invention;
fig. 5 is a schematic view showing a structure of a sleeve of a semiconductor chip packaging apparatus according to the present invention;
fig. 6 is a schematic structural view of a chip mounting mechanism of a semiconductor chip packaging apparatus according to the present invention;
fig. 7 is a schematic structural view of a fixing mechanism of a semiconductor chip packaging apparatus according to the present invention.
Reference numerals: 1. a transfer tray; 2. packaging the shell; 3. a fixing mechanism; 4. a feeding manipulator; 5. a package preparation mechanism; 6. a patch mechanism; 7. a blanking manipulator; 8. dispensing heads; 9. a glue storage cylinder; 10. a pressing cylinder; 11. a cartridge holder; 12. a cleaning head; 13. a chassis; 14. a fixed block; 15. a guide rod; 16. a spring is abutted tightly; 17. a connecting block; 18. a clamping block; 19. a lifting cylinder; 20. a pneumatic chuck; 21. transplanting air cylinders; 22. transplanting a bracket; 23. a sleeve; 24. a glue nozzle; 25. a cleaning seat; 26. a slide block; 27. tilting the chute; 28. a push rod; 29. a pushing block; 30. a seesaw; 31. a threaded ring; 32. a connecting rod; 33. a pole frame; 34. a cross bar; 35. and a bracket seat.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
As shown in fig. 1 to 7, the embodiment of the semiconductor chip packaging device provided by the invention comprises a transfer tray 1, a fixing mechanism 3 installed on the surface of the transfer tray 1, a feeding manipulator 4, a packaging preparation mechanism 5, a patch mechanism 6 and a blanking manipulator 7, wherein the feeding manipulator 4 is used for fixing the package 2 on the fixing mechanism 3, the patch mechanism 6 is used for placing the chip into the package 2, after the chip is attached, the package 2 attached with the chip is sucked and moved to the next station through the blanking manipulator 7, and the feeding manipulator 4 and the blanking manipulator 7 are all of the prior art and are not repeated herein.
The fixing mechanism 3 comprises a chassis 13, four corners of the chassis 13 are respectively fixed with a clamping seat, the packaging shell 2 can be placed on the chassis 13, and corners of the packaging shell 2 can be abutted against the clamping seats. After the feeding manipulator 4 sucks the packaging shell 2, the packaging shell 2 is moved to the position right above the fixing mechanism 3, and then the packaging shell 2 is pressed downwards, so that the bottom of the packaging shell 2 is attached to the upper surface of the chassis 13, four corners of the packaging shell 2 are abutted against the clamping seats, the packaging shell 2 is fixed through the clamping seats, the packaging shell 2 is prevented from shaking, and chips are attached to the packaging shell 2 later.
The clamping seat comprises a fixed block 14, a guide rod 15, a propping spring 16, a connecting block 17 and a clamping block 18, wherein the fixed block 14 is fixed on the chassis 13, the guide rod 15 is slidably mounted on the fixed block 14, the connecting block 17 is fixedly connected with the end part of the guide rod 15, the clamping block 18 is L-shaped and is fixed on the connecting block 17, the propping spring 16 is sleeved on the guide rod 15, two ends of the propping spring 16 are respectively propped against the connecting block 17 and the fixed block 14, when the mechanical arm downwards presses the packaging shell 2, corners of the packaging shell 2 are clamped into right angles of the clamping block 18 and push the clamping block 18 to move towards the direction of the fixed block 14, the propping spring 16 is tightly pressed, the clamping block 18 is tightly pressed at the corners of the packaging shell 2 through the elastic force of the propping spring 16, namely, the four corners of the packaging shell 2 are clamped by the clamping block 18, the fixing of the clamping block 18 can be realized, and when the packaging shell 2 needs to be taken down, the packaging shell 2 is directly sucked by the mechanical arm and the packaging shell 2 is upwards lifted, and the packaging shell 2 can be taken down.
The paster mechanism 6 includes lift cylinder 19, pneumatic sucking disc 20, transplants the cylinder 21 and transplant support 22, transplants the cylinder 21 level and fix on transplanting support 22, transplants the cylinder 21 and can drive lift cylinder 19 horizontal migration, and lift cylinder 19 can drive pneumatic sucking disc 20 mouth and move towards transporting tray 1, and pneumatic sucking disc 20 is used for getting and puts the chip.
The packaging preparation mechanism 5 is used for filling glue into the packaging shell 2, the packaging preparation mechanism 5 comprises a glue dispensing head 8, a glue storage cylinder 9, a lower pressing cylinder 10, a glue cylinder seat 11 and a cleaning head 12, the glue cylinder seat 11 is fixedly connected with a piston rod of the lower pressing cylinder 10, the lower pressing cylinder 10 is used for driving the glue cylinder seat 11 to move up and down, the glue storage cylinder 9 is fixed in the glue cylinder seat 11, the glue dispensing head 8 is communicated with the glue storage cylinder 9, the glue dispensing head 8 can fill the glue into the packaging shell 2, the cleaning head 12 is arranged below the glue dispensing head 8, a sleeve 23 is arranged at the bottom sliding seal sleeve of the glue dispensing head 8, a glue nozzle 24 is arranged at the bottom of the sleeve 23, the glue nozzle 24 is of a strip-shaped structure and is provided with an opening at the bottom, and the length of the glue nozzle 24 is larger than the outer diameter of the sleeve 23.
The packaging preparation mechanism 5 further comprises two cleaning seats 25, a cleaning head 12 is fixed at the bottom of each cleaning seat 25, a sliding block 26 is fixed at the top of each cleaning seat 25, an inclined sliding groove 27 is formed in the side wall of the rubber cylinder seat 11, the sliding block 26 is slidably mounted in the inclined sliding groove 27, and the cleaning head 12 can move from the middle of the packaging shell 2 to two sides to clean the interior of the packaging shell 2.
The side of depositing the packing element 9 passes through a support seat 35 to be fixed at the inner wall of packing element seat 11, perpendicular slidable mounting has push rod 28 on the support seat 35, the upper end of push rod 28 is fixed with ejector pad 29, the inner wall of packing element seat 11 still rotates and installs wane 30, wane 30's one end and ejector pad 29's upper surface butt, slider 26 upwards moves the other end that can promote wane 30 upwards to move, sleeve 23's surface cover is equipped with screwed ring 31, screwed ring 31 and sleeve 23's outer wall threaded connection, the lower extreme of push rod 28 passes through connecting rod 32 and screwed ring 31's outer lane fixed connection.
A bar frame 33 is fixed above the sliding block 26, a cross bar 34 is vertically fixed on the bar frame 33, and when the sliding block 26 moves upwards along the inclined sliding groove 27, the cross bar 34 can push the end of the rocker 30 to move upwards.
The operation principle of the package preparation mechanism 5 is: before the chip is attached to the package 2, the package 2 is firstly moved to the lower part of the rubber cylinder seat 11 by transferring the tray 1, then the lower pressure cylinder 10 is started to drive the rubber cylinder seat 11 to move downwards, the rubber cylinder seat 11 moves downwards to drive the cleaning seat 25 and the cleaning head 12 to move downwards, the cleaning head 12 is firstly contacted with the inner surface of the package 2, then the rubber cylinder seat 11 continues to press the cleaning seat 25 downwards, and at the moment, the cleaning head 12 cannot continuously move downwards in contact with the package 2, so that only the rubber cylinder seat 11 moves downwards and the sliding block 26 moves along the inclined sliding groove 27, namely, the rubber cylinder seat 11 presses downwards to enable the sliding block 26 to drive the two cleaning seats 25 and the two cleaning heads 12 to open to two sides, and meanwhile, the cleaning head 12 always contacts with the surface of the package 2, so that the cleaning head 12 can clean the inside of the package 2 in the process of moving to two sides of the package 2.
When the sliding block 26 moves along the inclined sliding groove 27, the position of the sliding block 26 relative to the cartridge seat 11 also moves upwards, so that when the sliding block 26 moves, one end of the rocker 30 can be pushed to move upwards, the other end of the rocker 30 is pushed downwards, the rocker 30 pushes the push block 29 and the push rod 28 to move downwards, an elastic piece is arranged between the push block 29 and the bracket seat 35, the push block 29 moves downwards, the elastic piece is compressed, when the push rod 28 moves downwards, the threaded ring 31 is pushed to move downwards along the outer wall of the sleeve 23 by the connecting rod 32, at this time, the cleaning head 12 is opened to two sides, and when the threaded ring 31 moves downwards, the sleeve 23 is firstly driven to move downwards for a small distance, so that the glue nozzle 24 at the bottom of the sleeve 23 contacts with the inner wall of the cleaned package 2, glue in the glue storage cylinder 9 flows through the glue dispensing head 8, the sleeve 23 and the glue nozzle 24 in sequence, and finally flows from the opening at the bottom of the glue nozzle 24 to the inner surface of the package 2.
The gap between the bottom of the glue nozzle 24 and the surface of the packaging shell 2 is small, so that glue cannot flow out from the gap, in order to enable the glue to cover a larger area, the glue nozzle 24 is arranged to be long and a long opening is formed in the bottom, further, when the glue nozzle 24 cannot move down, the threaded ring 31 is pushed down continuously, at the moment, the threaded ring 31 can push the sleeve 23 to rotate in the downward moving process through the cooperation of the outer wall threads of the sleeve 23 and the threaded ring 31, the sleeve 23 rotates to drive the glue nozzle 24 to rotate, the glue can cover a larger area, finally, the lower pressing cylinder 10 can lift the cleaning head 12 and the dispensing head 8 at the same time, the cleaning head 12 approaches to the center to finish reset under the action of gravity, and the push block 29 is pushed up through the reset of the elastic piece to drive the push block 29 to move up, so that the threaded ring 31 is reset.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention.
Claims (8)
1. The utility model provides a semiconductor chip packaging hardware, includes transport tray (1), and transport tray (1) are used for placing encapsulation shell (2), its characterized in that: the packaging machine is characterized by further comprising a fixing mechanism (3) arranged on the surface of the transferring tray (1), a feeding manipulator (4), a packaging preparation mechanism (5), a patch mechanism (6) and a discharging manipulator (7), wherein the feeding manipulator (4) is arranged around the periphery of the transferring tray (1), the feeding manipulator (4) is used for placing a packaging shell (2) on the fixing mechanism (3) for fixing, the packaging preparation mechanism (5) is used for filling glue into the packaging shell (2), the patch mechanism (6) is used for placing a chip into the packaging shell (2), and the discharging manipulator (7) is used for discharging the packaging shell (2) in the fixing mechanism (3);
encapsulation preparation mechanism (5) are including some glue head (8), deposit packing element (9), lower air cylinder (10), packing element seat (11) and cleaning head (12), packing element seat (11) with the piston rod fixed connection of air cylinder (10) down, air cylinder (10) are used for driving down packing element seat (11) reciprocates, deposit packing element (9) and fix in packing element seat (11), some glue head (8) intercommunication deposit packing element (9), some glue head (8) can to pack glue in packing element (2), cleaning head (12) are installed the below of some glue head (8), cleaning head (12) can follow the centre of packing element (2) is to the inside of both sides removal to packing element (2) is cleaned.
2. A semiconductor chip packaging apparatus according to claim 1, wherein: the fixing mechanism (3) comprises a chassis (13), four corners of the chassis (13) are respectively fixed with a clamping seat, the packaging shell (2) can be placed on the chassis (13), and corners of the packaging shell (2) can be abutted to the clamping seats.
3. A semiconductor chip packaging apparatus according to claim 2, wherein: the clamping seat comprises a fixed block (14), a guide rod (15), a tight abutting spring (16), a connecting block (17) and a clamping block (18), wherein the fixed block (14) is fixed on the chassis (13), the guide rod (15) is slidably mounted on the fixed block (14), the connecting block (17) is fixedly connected with the end part of the guide rod (15), the clamping block (18) is L-shaped and is fixed on the connecting block (17), the tight abutting spring (16) is sleeved on the guide rod (15), and two ends of the tight abutting spring (16) are respectively abutted with the connecting block (17) and the fixed block (14).
4. A semiconductor chip packaging apparatus according to claim 1, wherein: the chip attaching mechanism (6) comprises a lifting cylinder (19), a pneumatic sucker (20), a transplanting cylinder (21) and a transplanting support (22), wherein the transplanting cylinder (21) is horizontally fixed on the transplanting support (22), the transplanting cylinder (21) can drive the lifting cylinder (19) to horizontally move, the lifting cylinder (19) can drive the mouth of the pneumatic sucker (20) to move towards the transferring tray (1), and the pneumatic sucker (20) is used for picking and placing chips.
5. A semiconductor chip packaging apparatus according to claim 1, wherein: the bottom sliding seal cover of the dispensing head (8) is provided with a sleeve (23), the bottom of the sleeve (23) is provided with a glue nozzle (24), the glue nozzle (24) is of a strip-shaped structure, the bottom of the glue nozzle is provided with an opening, and the length of the glue nozzle (24) is larger than the outer diameter of the sleeve (23).
6. A semiconductor chip packaging apparatus according to claim 5, wherein: the packaging preparation mechanism (5) further comprises two cleaning seats (25), one cleaning head (12) is fixed at the bottom of each cleaning seat (25), a sliding block (26) is fixed at the top of each cleaning seat (25), an inclined sliding groove (27) is formed in the side wall of each rubber cylinder seat (11), and the sliding blocks (26) are slidably mounted in the inclined sliding grooves (27).
7. A semiconductor chip packaging apparatus according to claim 6, wherein: the side of depositing packing element (9) is in through a support seat (35) the inner wall of packing element seat (11), perpendicular slidable mounting has push rod (28) on support seat (35), the upper end of push rod (28) is fixed with ejector pad (29), rocker (30) are still installed in the inner wall of packing element seat (11) rotation, one end of rocker (30) with the upper surface butt of ejector pad (29), slider (26) upwards move can promote the other end of rocker (30) upwards moves, the surface cover of sleeve (23) is equipped with screwed ring (31), screwed ring (31) with the outer wall threaded connection of sleeve (23), the lower extreme of push rod (28) pass through connecting rod (32) with the outer lane fixed connection of screwed ring (31).
8. A semiconductor chip packaging apparatus according to claim 7, wherein: a rod frame (33) is fixed above the sliding block (26), a cross rod (34) is vertically fixed on the rod frame (33), and when the sliding block (26) moves upwards along the inclined sliding groove (27), the cross rod (34) can push the end part of the rocker (30) to move upwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410115264.5A CN117650085B (en) | 2024-01-29 | 2024-01-29 | Semiconductor chip packaging device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410115264.5A CN117650085B (en) | 2024-01-29 | 2024-01-29 | Semiconductor chip packaging device |
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| CN117650085A true CN117650085A (en) | 2024-03-05 |
| CN117650085B CN117650085B (en) | 2024-04-16 |
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| CN112466777A (en) * | 2020-10-09 | 2021-03-09 | 肇庆市小凡人科技有限公司 | Chip packaging equipment with bubble removing function |
| CN213558073U (en) * | 2020-10-10 | 2021-06-29 | 周碧媚 | Dispensing equipment for LED packaging |
| CN215141590U (en) * | 2021-04-15 | 2021-12-14 | 无锡力倍思自动化装备有限公司 | Lightweight rubber coating device |
| CN215391316U (en) * | 2021-04-29 | 2022-01-04 | 山东康姆微电子有限公司 | Excessive glue clearing device for integrated circuit packaging |
| CN113941478A (en) * | 2021-10-25 | 2022-01-18 | 刘洋 | Chip packaging dispensing equipment |
| CN216288371U (en) * | 2021-11-02 | 2022-04-12 | 江西佳福微电子科技有限公司 | Semiconductor chip packaging and fixing device |
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