CN117500149A

CN117500149A - Vapor chamber, circuit board assembly and electronic equipment

Info

Publication number: CN117500149A
Application number: CN202311813433.4A
Authority: CN
Inventors: 杨帆; 王晓岩; 张璁雨
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-12-27
Filing date: 2023-12-27
Publication date: 2024-02-02
Anticipated expiration: 2043-12-27
Also published as: CN117500149B

Abstract

The application relates to the technical field of electronic equipment, in particular to a vapor chamber, a circuit board assembly and electronic equipment. The soaking plate comprises: a housing including a first plate body for facing the heat source; the first plate body comprises a heat absorption area, and the heat absorption area is used for being arranged in a front projection area of the heat source; the heat absorbing area protrudes toward the heat source to reduce the thickness of the heat conducting medium between the heat absorbing area and the heat source. The heat absorption area of the vapor chamber can be utilized to protrude towards the heat source, so that the thickness of a heat conducting medium between the vapor chamber and the heat source is reduced, and the heat dissipation effect of the heat source is improved.

Description

Vapor chamber, circuit board assembly and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a vapor chamber, a circuit board assembly and electronic equipment.

Background

With the development of diversification of functions of electronic devices, chip power density in the electronic devices is gradually increased, so that chip heating is more and more serious. The chip operating at high temperature may not only cause power consumption problems, but may also reduce the reliability of the chip and related devices.

At present, due to the development of light and thin electronic equipment, heat conducting gel is filled between the chip and the shielding structure and between the shielding structure and the heat dissipation structure, so as to improve the heat dissipation effect. But the thickness of the thermally conductive gel cannot be further reduced due to the influence of manufacturing tolerances of the chip, the shielding structure and the heat dissipating structure during processing. The heat conductivity of the heat conducting gel is limited, so that the heat dissipation efficiency of the chip is limited, and the heat dissipation effect of the chip is difficult to be further improved.

Disclosure of Invention

In order to solve the above problems, the present application provides a vapor chamber, a circuit board assembly, and an electronic device, which can utilize a heat absorbing region of the vapor chamber to protrude toward a heat source to reduce a thickness of a heat conducting medium between the vapor chamber and the heat source, thereby improving a heat dissipation effect to the heat source.

To achieve the above object, in a first aspect, an embodiment of the present application provides a soaking plate, including: a housing including a first plate body for facing the heat source; the first plate body comprises a heat absorption area, and the heat absorption area is used for being arranged in the orthographic projection area of the heat source and protruding towards the heat source so as to reduce the thickness of the heat conducting medium between the heat absorption area and the heat source.

The vapor chamber provided by the embodiment comprises the heat absorption area arranged on the first plate body, and the heat absorption area can deform before the assembly of the heat absorption area and the heat source is completed, so that the heat conduction medium between the heat source and the first plate body is extruded by utilizing the deformation, the thickness of the heat conduction medium is reduced, the heat conduction path is shortened, the thermal resistance is reduced, and the heat dissipation effect of the heat source is improved. At the same time, the deformation of the heat absorption area can absorb the size of the tolerance chain so as to further reduce the thickness of the heat conducting medium. In addition, the deformation of the heat absorption area can absorb a part of extrusion force so as to reduce the extrusion force applied to the heat source and improve the reliability of the heat source.

In an alternative embodiment, the heat absorbing region comprises a shape memory alloy sheet; the shape memory alloy plate is configured to be deformable by the flat plate structure to cause the heat absorbing region to protrude toward the heat source; the shape memory alloy sheet has a one-way memory effect. In this way, the deformable nature of the heat absorption area can be achieved with the memory alloy plate, so that the thickness of the heat transfer medium can be reduced.

In an alternative embodiment, the first plate body comprises a first plate body; the first plate body is provided with a through hole penetrating through the front projection area of the heat source in the thickness direction; the shape memory alloy plate is welded to the first plate body and covers the through hole. Like this, through set up the through-hole on first board body, shape memory alloy board can directly transmit to the cycle working medium on the capillary structure after receiving the heat from the heat source to improve the radiating effect.

In an alternative embodiment, the first plate body includes a weld adjacent the through hole; the welding part is provided with a welding surface facing the heat source direction; the shape memory alloy plate is positioned at one side of the first plate body facing the heat source and is welded and connected to the welding surface; the shape memory alloy plate is configured to: before deformation, the shape memory alloy plate is in a flat plate structure state and is parallel to the first plate body, after deformation, the shape memory alloy plate protrudes towards the heat source and drives the welding part to protrude towards the heat source. In this way, it is possible to facilitate the connection of the shape memory alloy plate with the first plate body.

In an alternative embodiment, the via includes a via sidewall; the shape memory alloy plate is positioned in the through hole and welded and connected to the side wall of the hole; one side surface of the shape memory alloy plate facing the heat source is positioned on the same plane with one side surface of the first plate body facing the heat source; the shape memory alloy plate is configured to: before deformation, the shape memory alloy plate and the first plate body are in a flat plate structure state, and after deformation, the shape memory alloy plate and the first plate body form a curved surface protruding towards the heat source. In this way, it is possible to avoid the formation of a stepped structure between the shape memory alloy plate and the first plate body, thereby facilitating the connection with the heat-conducting medium.

In an alternative embodiment, the first plate body is a shape memory alloy plate; the shape memory alloy plate is configured to: the heat absorbing area can be locally deformed by the flat plate structure so as to be protruded towards the heat source. Therefore, a connecting structure such as a welding surface does not exist at other positions of the heat absorption area and the first plate body, so that the heat resistance can be further reduced, the heat absorption speed of the heat absorption area is improved, and the heat dissipation effect of a heat source is improved.

In an alternative embodiment, the first plate body comprises a first plate body; the shape memory alloy plate is welded and connected to one side surface of the first plate body, which faces the heat source; the shape memory alloy plate is configured to: before deformation, the shape memory alloy plate and the first plate body are in a flat plate structure state, and after deformation, the shape memory alloy plate drives the first plate body to protrude towards the heat source. Therefore, the shape memory alloy plate can be directly connected with the heat conducting medium, and heat generated by the heat source is transferred to the first plate body and the circulating working medium in the sealing cavity, so that the heat dissipation effect on the heat source is realized.

In an alternative embodiment, the housing further comprises a second plate opposite the first plate; the second plate body is positioned at one side of the first plate body, which is away from the heat source, and is connected with the first plate body in a sealing way; the shell further comprises a first supporting part; the first supporting part is positioned between the first plate body and the second plate body, and one end of the first supporting part is connected with the second plate body; the first support is located in the projection of the heat absorption area in the second plate. Thus, the first supporting part can form supporting ribs on the second plate body so as to strengthen the structural strength of the second plate body. Meanwhile, even if the second plate body is pressed and deformed, the first supporting part can keep a certain distance between the first plate body and the second plate body, so that the continuity of the sealing cavity is ensured.

In an alternative embodiment, the other ends of the first supporting parts are respectively connected to the heat absorbing areas; the first supporting part is configured to drive the second plate body to deform along with the heat absorption region when the heat absorption region deforms. Therefore, when the heat absorption area deforms, the heat absorption area can drive the second plate body to deform through the first supporting part so as to maintain the distance between the heat absorption area and the second plate body.

In an alternative embodiment, the first plate body includes a first elastic portion; the first elastic part is adjacent to the heat absorption area; the first elastic part is configured to deform so as to increase the deformation capacity of the first plate body; the first elastic part comprises at least one first groove, and the first groove is an annular groove; the opening of the first groove faces the direction of the heat source. In this way, the first elastic part can deform so that the heat absorbing area connected to the first elastic part deforms and protrudes towards the heat source.

In an alternative embodiment, the second plate body is provided with a second elastic portion; the second elastic part is close to the outer edge of the projection area of the second plate body; the second elastic part is configured to deform so as to increase the capacity of the second plate body to deform; the second elastic part comprises at least one second groove, and the second groove is an annular groove; the opening of the second groove faces away from the first plate body. Like this, when the heat absorption area drives the second plate body through first supporting part and takes place deformation, the setting of second elastic part can be convenient for the second plate body and take place deformation to reduce the deformation pressure of heat absorption area.

In an alternative embodiment, along the stacking direction of the first plate body and the second plate body, the first elastic portion and the second elastic portion are arranged in a staggered manner, and the first elastic portion is located at one side of the second elastic portion, which is away from the first supporting portion. Like this, when first plate body and second plate body set up first elastic part and second elastic part simultaneously, can avoid first elastic part and second elastic part to block sealed chamber to be convenient for realize sealed chamber's intercommunication, thereby guarantee cycle working medium's normal circulation route.

In an alternative embodiment, the heat absorbing region includes a first protrusion; the first plate body further comprises a first plate body; the first protruding part is connected to the first plate body and protrudes towards the heat source; when the first bulge is configured to be abutted against the heat source through the heat conducting medium, the first bulge is subjected to extrusion force of the heat conducting medium and deforms under the action of the extrusion force so as to absorb the extrusion force. Thus, the first protruding portion can improve the heat radiation effect of the heat source and the reliability of the connection structure of the heat source.

In an alternative embodiment, the first protruding portion includes a curved elastic sheet, and the curved elastic sheet is welded to the first plate body; when the curved elastic sheet receives the extrusion force of the heat conducting medium, the curved elastic sheet can drive the first plate body to deform, so that the self-bulge degree is reduced, and the extrusion force is absorbed. Like this, curved surface shell fragment can drive first board body and take place deformation, reduces self bulge, under the circumstances that reduces heat conduction medium thickness, can also absorb the extrusion force, reduces the extrusion force to the heat source, improves the connection reliability of heat source.

In an alternative embodiment, the first plate body is provided with a through hole penetrating through the front projection area of the heat source in the thickness direction; the curved elastic sheet is connected to the first plate body through airtight welding and covers the through hole; the curved spring plate protrudes towards the heat source; the curved elastic sheet is used for being abutted against the heat-conducting medium; when the curved elastic sheet receives the extrusion force of the heat conducting medium, the curved elastic sheet can deform, so that the self-bulge degree is reduced, and the extrusion force is absorbed. Like this, through set up the through-hole on first board body, curved surface shell fragment can directly transmit to the cycle working medium on the capillary structure after receiving the heat from the heat source to improve the radiating effect.

In an alternative embodiment, the first projection comprises a curved protrusion formed by partial stamping of the first plate body; the curved surface bulge protrudes towards the heat source; the curved surface bulge is used for abutting against the heat-conducting medium; when the curved surface bulge receives the extrusion force of the heat conducting medium, the curved surface bulge can deform, so that the bulge degree of the curved surface bulge is reduced, and the extrusion force is absorbed. In this way, when the curved surface protrusion receives the extrusion force of the heat conducting medium in the process of assembling the soaking plate and the heat source, the thickness of the heat conducting medium can be reduced. Meanwhile, the curved surface bulge can deform, the tolerance chain size is absorbed, the self-bulge degree is reduced, the extrusion force is absorbed, the extrusion force on a heat source is reduced, and the connection reliability of the heat source is improved.

In an alternative embodiment, the first projection includes a first boss; the first boss comprises a first side wall and a first bottom wall; the first bottom wall is parallel to the first plate body and protrudes out of the first plate body along the direction facing the heat source; the first side wall is an annular side wall, and two ends of the first side wall are respectively connected with the first plate body and the first bottom wall; the first bottom wall is used for abutting against the heat conducting medium; when the first bottom wall receives the extrusion force of the heat conducting medium, the first bottom wall and the first side wall can deform, so that the self-bulge degree is reduced, and the extrusion force is absorbed. Therefore, the tolerance chain size can be absorbed through deformation, part of extrusion force can be absorbed, extrusion force applied to the heat source is reduced, and connection reliability of the heat source is improved.

In an alternative embodiment, the housing further comprises a second plate opposite the first plate; the second plate body is positioned at one side of the first plate body, which is away from the heat source, and is connected with the first plate body in a sealing way; the shell further comprises a first supporting part; the first supporting part is located between the first bottom wall and the second plate body, and one end of the first supporting part is connected to the second plate body. Like this, the setting of first supporting part can form the supporting rib at the second plate body to strengthen the structural strength of second plate body self, simultaneously, even second plate body is pressed and is taken place deformation, the setting of first supporting part also can make can keep certain interval between first plate body and the second plate body, thereby guarantees the continuity in sealed chamber.

In an alternative embodiment, the second plate body includes a second plate body and a second projection; the second plate body is positioned at the periphery of the second protruding part and is connected with the first plate body in a sealing way; the second protruding part is connected with the second plate body and is arranged corresponding to the first protruding part, and the protruding direction of the second protruding part is the same as that of the first protruding part; two ends of the first supporting part are respectively connected with the first bottom wall and the second protruding part; the first supporting part is configured to transmit the extrusion force to the second protruding part when the first bottom wall receives the extrusion force so as to drive the second protruding part to deform. Like this, when first diapire received the extrusion force, first supporting part can transmit the extrusion force to the second bulge to drive the second bulge and take place deformation, thereby guarantee the interval between first boss and the second bulge, with the continuity of assurance sealed chamber.

In an alternative embodiment, the second projection includes a second boss; the second boss comprises a second side wall and a second bottom wall; the second bottom wall is parallel to the second plate body and protrudes out of the second plate body along the direction facing the heat source; the second side wall is an annular side wall, and two ends of the second side wall are respectively connected with the second plate body and the second bottom wall; the first supporting part is connected with the first bottom wall and the second bottom wall; the first supporting portion is configured to transmit the extrusion force to the second bottom wall when the first bottom wall receives the extrusion force so as to drive the second bottom wall and the second side wall to deform. Thus, when the first bottom wall receives the extrusion force, the first supporting part can transmit the extrusion force to the second bottom wall so as to drive the second bottom wall and the second side wall to deform.

In an alternative embodiment, a third elastic part is further arranged on the first side wall; the third elastic part is configured to deform, and when the first bottom wall is subjected to the extrusion force, the third elastic part deforms so as to increase the deformation capacity of the first side wall; the third elastic part comprises at least one third groove; the third groove is an annular groove, and the opening of the third groove faces the heat source. Like this, when first diapire received the extrusion force, the third elastic part can take place to drive first diapire and take place the deformation, thereby can be convenient for realize the deformation of first lateral wall and first diapire, further reduce the extrusion force to the heat source.

In an alternative embodiment, a fourth elastic portion is further provided on the second side wall; the fourth elastic part is configured to deform, and when the second bottom wall is subjected to extrusion force, the fourth elastic part deforms so as to increase the deformation capacity of the second side wall; the fourth elastic part comprises at least one fourth groove; the fourth groove is an annular groove, and an opening of the fourth groove faces away from the first plate body. Like this, when the second diapire received the extrusion force, the fourth elastic part can take place deformation to drive the second diapire and take place deformation, thereby can be convenient for realize the deformation of second lateral wall and second diapire.

In an alternative embodiment, the shell is further provided with a hollowed-out portion, and the hollowed-out portion penetrates through the first side wall and the second side wall; the shell is in sealing connection with the hollow part. In this way, the structural strength of the first and second sidewalls can be weakened so that the first and second sidewalls deform.

In an alternative embodiment, the first bottom wall and the second bottom wall are square bottom walls; the hollowed-out parts comprise a plurality of first hollowed-out parts; the first hollowed-out part is positioned at the corner positions of the first bottom wall and the second bottom wall so as to break the annular structures of the first side wall and the second side wall. In this way, the structural strength of the first and second sidewalls can be weakened so that the first and second sidewalls deform.

In an alternative embodiment, the hollowed-out portion further includes a plurality of second hollowed-out portions; the second hollowed-out part at least corresponds to the middle position of the two opposite sides of the square bottom wall. In this way, the structural strength of the first side wall and the second side wall can be further weakened, so that the first side wall and the second side wall deform.

In order to achieve the above object, a second aspect, the present embodiment provides a circuit board assembly, including: a substrate and a vapor chamber as described above in the first aspect; the substrate is provided with a chip which is a heat source; one side of the chip, which is away from the substrate, is provided with a vapor chamber; a heat conducting medium is also arranged between the chip and the soaking plate; the heat absorption area of the vapor chamber is connected with the heat conducting medium and protrudes towards the chip so as to reduce the thickness of the heat conducting medium.

In an alternative embodiment, a shielding structure is further arranged between the soaking plate and the chip; the heat conducting medium comprises a first heat conducting part and a second heat conducting part; the first heat conduction part is arranged between the shielding structure and the chip; the second heat conduction part is arranged between the shielding structure and the soaking plate; the heat absorption area can enable the second heat conduction part to extrude the shielding structure by extruding the second heat conduction part, and enable the shielding structure to extrude the first heat conduction part, so that the thickness of the first heat conduction part and the thickness of the second heat conduction part are reduced.

In order to achieve the above object, in a third aspect, the present embodiment provides an electronic device, including a middle frame and a circuit board assembly as in the above second aspect; the middle frame comprises a connecting piece and a supporting piece; the connecting piece is arranged close to the edge of the supporting piece, and the connecting piece and the supporting piece are enclosed to form a containing groove; the base plate is connected to the connecting piece; the substrate and the chip are positioned in the accommodating groove, the soaking plate is positioned on one side surface of the supporting piece, which is away from the accommodating groove, and the soaking plate is connected with the supporting piece; the support piece is provided with a connecting hole; the heat absorption area is connected with the heat conducting medium through the connecting holes.

It is to be appreciated that the advantages of the second aspect and the third aspect are described in the first aspect, and are not described herein.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a mobile phone according to the present embodiment;

FIG. 2 is a partial cross-sectional view taken along the direction A-A in FIG. 1;

fig. 3 is a schematic perspective view of a view angle of a first vapor chamber according to the present embodiment;

fig. 4 is a schematic perspective view of another view angle of the first vapor chamber according to the present embodiment;

FIG. 5A is a schematic view of a sectional structure along the direction B-B in FIG. 3;

FIG. 5B is a schematic cross-sectional view of the deformed structure of FIG. 5A;

fig. 6 is an assembled state diagram of a soaking plate and a heat source according to the present embodiment;

fig. 7A is a schematic cross-sectional structure of a second soaking plate before deformation according to the present embodiment;

fig. 7B is a schematic cross-sectional structure of a second soaking plate after deformation according to the present embodiment;

fig. 8A is a schematic cross-sectional structure of a third soaking plate before deformation according to the present embodiment;

Fig. 8B is a schematic cross-sectional structure of a third soaking plate after deformation according to the present embodiment;

fig. 9A is a schematic cross-sectional structure of a fourth soaking plate before deformation according to the present embodiment;

fig. 9B is a schematic cross-sectional structure of a fourth soaking plate after deformation according to the present embodiment;

fig. 10A is a schematic cross-sectional view of a fifth soaking plate before deformation according to the present embodiment;

fig. 10B is a schematic cross-sectional view of a fifth soaking plate according to the present embodiment after deformation;

FIG. 11 is a schematic view showing the distribution of the first supporting portion in the sealing cavity according to the present embodiment;

fig. 12A is a schematic cross-sectional view of a sixth soaking plate before deformation according to the present embodiment;

fig. 12B is a schematic cross-sectional view of a sixth soaking plate according to the present embodiment after deformation;

fig. 13A is a schematic cross-sectional view of a seventh soaking plate before deformation according to the present embodiment;

fig. 13B is a schematic cross-sectional view of a seventh soaking plate according to the present embodiment after deformation;

fig. 14A is a schematic cross-sectional view of an eighth soaking plate before deformation according to the present embodiment;

fig. 14B is a schematic cross-sectional view of the eighth soaking plate according to the present embodiment after deformation;

Fig. 15A is a schematic cross-sectional view of a ninth soaking plate before deformation according to the present embodiment;

fig. 15B is a schematic cross-sectional view of a ninth soaking plate according to the present embodiment after deformation;

fig. 16 is a schematic perspective view of a tenth vapor chamber according to the present embodiment;

fig. 17A is a schematic cross-sectional view of a tenth soaking plate before deformation according to the present embodiment;

fig. 17B is a schematic cross-sectional view of a tenth soaking plate after deformation according to the present embodiment;

fig. 18A is a schematic cross-sectional view of an eleventh soaking plate provided in the present embodiment before deformation;

fig. 18B is a schematic cross-sectional view of an eleventh soaking plate according to the present embodiment after deformation;

fig. 19 is a schematic perspective view showing a view angle of a twelfth vapor chamber according to the present embodiment;

fig. 20 is a schematic perspective view showing another view angle of a twelfth vapor chamber according to the present embodiment;

fig. 21A is a schematic cross-sectional view of a twelfth soaking plate before deformation according to the present embodiment;

fig. 21B is a schematic cross-sectional view of a twelfth soaking plate according to the present embodiment after deformation;

Fig. 22 is a schematic cross-sectional structure of a circuit board assembly provided in this embodiment;

fig. 23 is a schematic view of a partial cross-sectional structure of an electronic device according to the present embodiment.

The graphic indicia:

100-a mobile phone, 110-a machine body, 111-a middle frame piece, 1111-an opening structure, 1112-a supporting structure, 112-a rear cover piece, 120-a display screen, 130-a main board and 131-a first surface; 132-a second surface; 140-semiconductor devices, 141-first semiconductor components, 142-second semiconductor components, 150-first shielding members, 160-brackets, 170-second shielding members, 180-heat dissipation structures, 181-temperature equalizing plates and 182-heat conduction gel;

200-soaking plates, 2-shells, 21-first plate bodies, 210-heat absorbing areas, 211-shape memory alloy plates and 212-first protruding parts; 2121-curved spring sheet, 2122-curved protrusion, 2123-first boss, 212 a-first side wall, 212 b-first bottom wall, 212 c-third elastic portion, 213-first plate body, 2131-through hole, 2132-welded portion, 213 a-welded face, 213 b-hole side wall, 214-first elastic portion; 22-second plate body, 221-second elastic part, 222-second protruding part, 2221-second boss, 222 a-second side wall, 222 b-second bottom wall, 222 c-fourth elastic part, 223-second plate body, 23-first supporting part, 231-first supporting piece, 24-second supporting part, 241-second supporting piece, 25-hollowed part, 251-first hollowed part, 252-second hollowed part, 3-sealed cavity, 4-capillary structure;

300-circuit board assembly, 310-heat source, 320-heat conducting medium, 321-first heat conducting part, 322-second heat conducting part, 330-substrate, 340-chip, 350-shielding structure;

400-electronic equipment, 410-middle frame, 411-connecting piece, 412-support piece, 413-accommodation groove, 414-connecting hole.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments of the present application, other embodiments that may be obtained by a person of ordinary skill in the art without making any inventive effort are within the scope of the present application.

Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

Furthermore, in this application, the terms "upper," "lower," "inner," "outer," and the like are defined relative to the orientation in which components are schematically depicted in the drawings, and it should be understood that these directional terms are relative terms, which are used for descriptive and clarity relative, and which may vary accordingly depending on the orientation in which components are depicted in the drawings.

As electronic devices continue to develop toward high performance, the power density of chips inside the electronic devices is gradually increased, resulting in an increased amount of heat generated by the chips. The chip operating at high temperature is not only easy to cause power consumption problem, but also easy to influence the reliability of the chip and related devices, thereby influencing the normal operation of the electronic equipment.

It is understood that the electronic devices described in the embodiments of the present application include, but are not limited to, mobile phones, folding screen mobile phones, notebook computers, tablet computers, laptop computers, personal digital assistants, or wearable devices.

Fig. 1 is a schematic structural diagram of a mobile phone according to the present embodiment.

Fig. 2 is a partial cross-sectional view taken along the direction A-A in fig. 1.

As shown in fig. 1 and 2, taking an electronic device as an example of a mobile phone, for convenience in description of the structure of the mobile phone, a width direction of the mobile phone is taken as an X-axis direction, a length direction of the mobile phone is taken as a Y-axis direction, and a thickness direction of the mobile phone is taken as a Z-axis direction.

The handset 100 may include a body 110 and a display 120.

The display 120 is fastened to the main body 110 for displaying images. The display 120 and the body 110 can enclose to form a receiving cavity for setting up the battery, speaker assembly, camera module, antenna, and other structures of the mobile phone 100, which are not illustrated herein.

The body 110 may include a middle frame member 111 and a rear cover member 112. The middle frame member 111 can be used to attach to the display screen 120 and can also support other structures. The middle frame member 111 includes an opening structure 1111 for coupling to the rear cover member 112 and a support structure 1112 for supporting other structures and also for coupling to the display screen 120. In this way, the middle frame member 111 can divide the accommodation chamber between the display screen 120 and the rear cover member 112 into two parts so as to realize arrangement of other structures.

The mobile phone 100 may further include a motherboard 130, and the motherboard 130 may be a printed circuit board. The main board 130 may be connected to the supporting structure 1112 of the middle frame member 111 by a screw, so as to fix the main board 130. The motherboard 130 may also be provided with a semiconductor device 140 such as a chip, resistor, capacitor, etc. to provide support for the operation of the various functions of the handset 100.

For example, in order to facilitate the light and thin arrangement of the mobile phone 100, when more semiconductor devices 140 are required to be arranged in the mobile phone 100, the semiconductor devices 140 may be arranged on two opposite surfaces of the same motherboard 130, so that the structural arrangement of the motherboard 130 may be saved, so as to facilitate the light and thin arrangement.

Specifically, the main board 130 may include a first surface 131 and a second surface 132 opposite to each other, where the first surface 131 faces the opening structure 1111 of the middle frame member 111, and the second surface 132 faces the supporting structure 1112 of the middle frame member 111. The semiconductor device 140 may be divided into a first semiconductor component 141 and a second semiconductor component 142, and each of the first semiconductor component 141 and the second semiconductor component 142 may include at least one semiconductor device 140. The first semiconductor device 141 is disposed on the first surface 131, and the second semiconductor device 142 is disposed on the second surface 132.

The first surface 131 may further be provided with a first shield 150 and a holder 160, the first shield 150 being surrounded by the first semiconductor assembly 141, and the holder 160 being provided at an outer circumference of the first shield 150 and being surrounded by the first shield 150. In this way, shielding protection of the first semiconductor assembly 141 can be achieved with the first shield 150, and structural protection of the first shield 150 and the first semiconductor assembly 141 can be achieved with the bracket 160.

When the first semiconductor assembly 141 is operated, heat generated by the first semiconductor assembly 141 can be transferred to the main board 130 and also can be radiated toward the first shield 150 and the bracket 160. In addition, since the bracket 160 is relatively close to the rear cover 112, the rear cover 112 is typically made of metal. The heat generated by the first semiconductor assembly 141 can be transferred to the outside of the mobile phone 100 through the rear cover 112, thereby achieving heat dissipation.

The second surface 132 may further be provided with a second shielding member 170, where the second shielding member 170 surrounds the second semiconductor device 142, so as to realize shielding protection of the second semiconductor device 142.

When the second semiconductor device 142 operates, heat generated from the second semiconductor device 142 can be transferred to the main board 130 and also to the second shield 170. Because the second semiconductor component 142 and the second shielding member 170 face the supporting structure 1112 of the middle frame member 111, and the display screen 120 is further disposed on the supporting structure 1112, heat generated by the second semiconductor component 142 during operation cannot be timely transferred to the outside of the mobile phone 100, and the heat dissipation effect of the first semiconductor component 141 is affected.

In order to improve the heat dissipation effect on the semiconductor device 140 on the second surface 132, a heat dissipation structure 180 is further provided between the second surface 132 and the middle frame member 111.

Illustratively, the heat dissipating structure 180 includes a temperature plate 181 and a thermally conductive gel 182.

The temperature equalizing plate 181 is connected to the supporting structure 1112 of the middle frame 111, and is located on two sides of the supporting structure 1112 with the main board 130 respectively. The support structure 1112 is provided with openings corresponding to the locations of the chips in the first semiconductor element 141. Like this, the heat that the chip produced in the operation in-process can be through trompil transmission to samming board 181 to utilize samming board 181 to realize the heat dissipation effect to the chip.

The thermally conductive gel 182 is disposed between the chip and the second shield 170, and between the second shield 170 and the temperature uniformity plate 181. In this way, the air gap between the chip and the second shield 170, and the air gap between the second shield 170 and the temperature equalizing plate 181 can be filled with the heat conductive gel 182 to increase the heat conductive speed.

It will be appreciated that the greater the thickness of the thermally conductive gel 182, the greater the thermal resistance and the poorer the thermally conductive effect. The filling thickness of the thermally conductive gel 182 is not only related to the size of the thermally conductive filler particles therein, but also the size of the filling gaps thereof.

However, the stacked arrangement of the chip, the second shield 170, and the temperature equalizing plate 181 results in a larger tolerance chain range in the stacking direction (e.g., the Z-axis direction in fig. 2), resulting in that the total thickness of the thermal conductive gel 182 filled in the gap needs to be maintained at a certain thickness, and it is difficult to further reduce the thickness of the thermal conductive gel 182. While the greater the thickness of the thermally conductive gel 182, the greater its thermal resistance is not suitable for heat dissipation from chips having high power densities.

In order to further improve the heat dissipation effect on the chip, the embodiment provides a vapor chamber, a main board assembly and electronic equipment.

Fig. 3 is a schematic perspective view of a view angle of a first vapor chamber according to the present embodiment.

Fig. 4 is a schematic perspective view of another view angle of the first vapor chamber according to the present embodiment.

Fig. 5A is a schematic sectional structure along the direction B-B in fig. 3.

Fig. 5B is a schematic cross-sectional structure of the deformed structure of fig. 5A.

As shown in fig. 3, 4, 5A and 5B, in a first aspect, the present embodiment provides a soaking plate 200, where the soaking plate 200 includes a housing 2.

The housing 2 comprises a first plate 21 for facing the heat source. The housing 2 further includes a second plate 22 opposite to the first plate 21, the second plate 22 is located on a side of the first plate 21 facing away from the heat source, and the second plate 22 is connected to the first plate 21 in a sealing manner.

Wherein the heat source may be a chip or other heat generating device.

The whole structure of the shell 2 of the vapor chamber 200 is a closed structure, and a sealing cavity 3 is also arranged inside the shell 2. A capillary structure 4 can be further arranged in the sealing cavity 3, and the capillary structure 4 can be attached to the inner wall of the sealing cavity 3. The sealing cavity 3 can be filled with circulating working medium and the sealing cavity 3 is vacuumized.

The first plate 21 includes a heat absorbing region 210, and the heat absorbing region 210 is configured to be disposed in a forward projection region of a heat source. Thus, when the heat absorbing region 210 contacts the heat source, the heat absorbing region 210 absorbs heat from the heat source. The circulating working fluid in the heat absorption region 210 absorbs heat and evaporates to become vapor which rapidly moves to the heat radiation side of the housing 2. The circulating working medium is condensed into liquid state on the heat radiation side, releases heat, and returns to the position of the heat absorption area 210 through the capillary structure 4, and circulates in this way, so that the heat radiation effect on the heat source is realized.

The heat absorbing region 210 is capable of being deformed when assembled with the heat source, such that the heat absorbing region 210 is capable of protruding toward the heat source to reduce the thickness of the heat transfer medium between the heat absorbing region 210 and the heat source. In this way, compensation of the tolerance chain of the structural arrangement between the first plate body 21 and the heat source can be achieved by means of the deformation of the heat absorption area 210.

For example, the above-mentioned heat-conducting medium can change its thickness of the heat-conducting structure after receiving the pressing force under certain conditions. For example, the heat conducting medium may be a heat conducting gel, graphite, or the like.

Fig. 6 is an assembled state diagram of a soaking plate and a heat source according to the present embodiment.

Referring to fig. 5A, 5B, and 6, the heat sink area 210 is not deformed temporarily before the soaking plate 200 is assembled with the heat source 310. When the soaking plate 200 is assembled with the heat source 310, the heat absorbing area 210 is deformed and finally protrudes toward the heat source 310.

It should be noted that the deformation of the heat absorbing region 210 may be changed from a planar shape to a convex shape. Alternatively, the deformation of the heat absorption zone 210 may be changed from a convex surface with a greater degree of protrusion to a convex surface with a lesser degree of protrusion. Fig. 5A and 5B show only the former case at present.

In assembly, the heat absorption area 210 has a range of deformation, whether from a planar shape to a convex shape or from a convex shape with a greater degree of protrusion to a convex shape with a lesser degree of protrusion. In this way, it is possible to achieve the compression of the heat transfer medium 320 using the deformation range of the heat absorption region 210 and absorb a larger tolerance chain generated due to the manufacturing process limitation, so as to reduce the compression force applied to the heat source 310 while reducing the thickness of the heat transfer medium 320.

Taking the heat source 310 as an example, if the manufacturing tolerance range of the chip is + -0.05 mm along the thickness direction of the chip, the thickness difference between the chip with the largest thickness and the chip with the smallest thickness in the chips meeting the manufacturing requirement can reach 0.1mm after the chip is manufactured. This dimensional difference will have a major impact on the tolerance chain that is formed by the chip, the first plate 21 and other structures therebetween. However, since the heat absorbing region 210 is capable of elastic deformation when assembled with the heat source 310. In this way, the heat transfer medium 320 can be compressed by the heat absorbing area 210 to deform to absorb the size of the tolerance chain, absorb the redundant space generated by the tolerance chain after assembly, and reduce the thickness of the heat transfer medium 320, so that the thickness of the heat transfer medium 320 between the first plate 21 and the heat source 310 can be further reduced, the heat transfer medium 320, the chip and the soaking plate 200 can be abutted more tightly, and the air hole structure existing in the heat transfer medium 320 in the filling process can be eliminated, thereby improving the heat dissipation effect on the chip. Meanwhile, when the heat absorbing region 210 and the heat conducting medium 320 are pressed, the heat conducting medium 320 also generates a pressing force on the chip and the heat absorbing region 210. The heat absorbing region 210 can absorb a part of the extrusion force through elastic deformation, so that the extrusion to the chip is reduced, and the situation that the reliability of connection between the chip and the circuit board is affected due to overlarge extrusion force to the chip is prevented.

As shown in fig. 5B, when the heat absorbing region 210 protrudes toward the heat source, the distance H1 by which the heat absorbing region 210 can protrude is 0 to 1mm along the thickness direction (e.g., the Z direction in fig. 5B) of the housing 2. Specifically, H1 may be 0.01mm, 0.02mm, 0.04mm, 0.05mm, 0.06mm, 0.08mm, 0.1mm, etc. Thus, the heat absorption region 210 can absorb the tolerance chain size of 0-1 mm to reduce the thickness of the heat conducting medium of 0-1 mm, and improve the heat dissipation effect on the heat source.

The vapor chamber 200 provided in this embodiment includes a heat absorbing region 210 disposed on a first plate 21, where the heat absorbing region 210 can deform before the assembly with a heat source is completed, so that the heat conducting medium between the heat source and the first plate 21 is extruded by using the deformation, so as to reduce the thickness of the heat conducting medium, thereby shortening the heat conducting path, reducing the thermal resistance, and improving the heat dissipation effect of the heat source. The deformation of the heat absorbing area 210 can make the heat conducting medium, the heat source and the soaking plate 200 abut more tightly, and can eliminate the air hole structure existing in the heat conducting medium in the filling process, so as to improve the heat dissipation effect on the chip. In addition, the deformation of the heat absorbing region 210 can also absorb the size of the tolerance chain to absorb the redundant space generated due to the tolerance chain after assembly, thereby further reducing the thickness of the heat conductive medium. In addition, the deformation of the heat absorbing region 210 can absorb a part of the pressing force to reduce the pressing force applied to the heat source and improve the reliability of the heat source.

The deformation of the heat absorbing region 210 may be described as a planar deformation to a convex surface.

As shown in fig. 5A and 5B, the heat absorbing region 210 includes a shape memory alloy plate 211, and the shape memory alloy plate 211 is configured to be deformable by a flat plate structure so that the heat absorbing region 210 protrudes toward a heat source. It can be seen that when the soaking plate 200 is assembled with the heat source, the shape memory alloy plate 211 can be excited to deform so as to protrude toward the heat source, press the heat-conducting medium, and reduce the thickness of the heat-conducting medium. Meanwhile, the shape memory alloy plate 211 has a one-way memory effect. In this way, after assembly is completed, the protruding state can be maintained all the time, so that the flat plate structure is not restored.

It should be noted that the deformation of the shape memory alloy plate 211 may be activated by a temperature condition or a pressure condition, and is not limited in this embodiment.

Illustratively, the shape memory alloy plate 211 has a thickness of 0.03mm to 0.2mm. Specifically, the thickness of the shape memory alloy plate 211 may be 0.03mm, 0.05mm, 0.08mm, 0.1mm, 0.13mm, 0.15mm, 0.16mm, 0.18mm, 0.2mm. If the thickness of the shape memory alloy plate 211 is less than 0.03mm, the structural strength of the shape memory alloy plate 211 may be insufficient, and the soaking plate 200 may be easily damaged. If the thickness of the shape memory alloy plate 211 is greater than 0.2mm, the structural strength of the shape memory alloy plate 211 may be excessively high, and deformation may not be easily performed.

Alternatively, the first plate body 21 includes a first plate body 213.

In one implementation, the shape memory alloy plate 211 is welded to a side of the first plate body 213 facing the heat source.

As shown in fig. 5A, before the shape memory alloy plate 211 is deformed, the shape memory alloy plate 211 and the first plate body 213 are in a flat plate structure.

As shown in fig. 5B, after the shape memory alloy plate 211 is deformed, the shape memory alloy plate 211 drives the first plate body 213 to protrude toward the heat source.

In this implementation manner, the shape memory alloy plate 211 can be directly connected to the heat conducting medium, and transfer the heat generated by the heat source to the first plate body 213 and the circulating working medium in the sealed cavity 3, so as to realize the heat dissipation effect on the heat source.

Fig. 7A is a schematic cross-sectional structure of a second soaking plate before deformation according to the present embodiment.

Fig. 7B is a schematic cross-sectional structure of the second soaking plate after deformation according to the present embodiment.

As shown in fig. 7A and 7B, in one implementation, the first plate body 213 is provided with a through hole 2131 penetrating in its own thickness direction in the orthographic projection area of the heat source, and it can be seen that the axis of the through hole 2131 is parallel to the Z-axis direction. The shape memory alloy plate 211 is connected to the first plate body 213 by gas-tight welding and covers the through hole 2131, thereby securing sealability of the sealed cavity 3. Thus, by providing the through holes 2131 on the first plate body 213, the shape memory alloy plate 211 can directly transfer to the circulating working fluid on the capillary structure 4 after receiving the heat from the heat source, so as to improve the heat dissipation effect.

In addition, the shape memory alloy plate 211 welded to the through hole 2131 requires a reduced deformation force applied to the first plate body 213, thereby facilitating the deformation of the heat absorbing zone 210.

In one example, the first plate body 213 includes a welding portion 2132 adjacent to the through hole 2131, the welding portion 2132 having a welding face 213a facing the direction of the heat source.

The shape memory alloy plate 211 is positioned on the side of the first plate body 213 facing the heat source, and is welded to the welding surface 213a. As shown in fig. 7A, before the shape memory alloy plate 211 is deformed, the shape memory alloy plate 211 is in a flat plate structure state and parallel to the first plate body 213. As shown in fig. 7B, after the shape memory alloy is deformed, the shape memory alloy plate 211 protrudes toward the heat source, and drives the welding portion 2132 to protrude toward the heat source. In this way, the connection of the shape memory alloy plate 211 and the first plate body 213 can be facilitated.

Fig. 8A is a schematic cross-sectional structure of a third soaking plate before deformation according to the present embodiment. In fig. 8A, the dotted line marking range corresponds to the through hole 2131 on the first plate body 213 for convenience of marking the through hole 2131.

Fig. 8B is a schematic cross-sectional view of a third soaking plate after deformation according to the present embodiment.

As shown in fig. 8A and 8B, in another example, the through hole 2131 includes a hole sidewall 213B.

The shape memory alloy plate 211 is positioned in the through hole 2131 and welded to the hole sidewall 213b to effect sealing of the sealed cavity 3.

As shown in fig. 8A, before the shape memory alloy plate 211 is deformed, the shape memory alloy plate 211 and the first plate body 213 are in a flat plate structure state. As shown in fig. 8B, after the shape memory alloy plate 211 is deformed, the shape memory alloy plate 211 and the first plate body 213 form a curved surface protruding toward the heat source. It can be seen that the side of the shape memory alloy plate 211 facing the heat source is in the same plane as the side of the first plate body 213 facing the heat source before and after the shape memory alloy plate 211 is deformed. In this way, it is possible to avoid the formation of a stepped structure between the shape memory alloy plate 211 and the first plate body 213, thereby facilitating the connection with the heat transfer medium.

Fig. 9A is a schematic cross-sectional view of a fourth soaking plate before deformation according to the present embodiment.

Fig. 9B is a schematic cross-sectional view of a fourth soaking plate after deformation according to the present embodiment.

As shown in fig. 9A and 9B, in one implementation, the entirety of the first plate body 21 may be a shape memory alloy plate 211. In this way, the shape memory alloy plate 211 can be trained to locally deform in the heat absorbing region 210 so that the heat absorbing region 210 protrudes toward the heat source.

As shown in fig. 9A, the shape memory alloy plate 211 is in a flat plate structure state before the shape memory alloy plate 211 is deformed. As shown in fig. 9B, after the shape memory alloy plate 211 is locally deformed, the heat absorbing region 210 protrudes toward the heat source. In this way, there is no connection structure, such as the welding surface 213a, between the heat absorbing region 210 and other positions of the first plate 21, so that the thermal resistance can be further reduced, the heat absorbing speed of the heat absorbing region 210 can be increased, and the heat dissipating effect of the heat source can be improved.

Referring to fig. 4, 9A and 9B, in some embodiments, the first plate 21 further includes a first elastic portion 214, and the first elastic portion 214 is adjacent to the heat absorbing region 210.

The first elastic portion 214 is capable of deforming to increase the ability of the heat absorbing region to deform, thereby facilitating deformation of the heat absorbing region 210 and protruding toward the heat source.

For example, the first resilient portion 214 may comprise at least one first recess, which is an annular recess, to be arranged around the heat absorbing region 210, and which is open towards the heat source. Thus, when the heat absorbing region 210 deforms and protrudes towards the heat source, the heat absorbing region 210 can pull the first groove to deform, so that the heat absorbing region 210 deforms conveniently.

Alternatively, when the heat absorbing region 210 is not deformed, the depth of the first groove may be 0.03mm to 0.15mm. Specifically, it may be 0.03mm, 0.05mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.13mm, 0.15mm, etc. If the depth of the first groove is less than 0.03mm, the tensile force required for the deformation of the first groove is large, which is inconvenient for the deformation of the heat absorbing area 210. If the groove depth of the first groove is greater than 0.15mm, the groove depth of the first groove is too large, so that more space of the sealing cavity 3 is occupied, and the continuity design of the sealing cavity 3 is affected.

Specifically, when the heat absorbing area 210 is not deformed, the width of the notch of the first groove may be 0.1mm to 0.5mm. Specifically, it may be 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.4mm, 0.45mm, 0.5mm, etc. This can facilitate the formation of the first recess in the first plate 21.

In one example, the first groove may have a V-groove in cross-sectional shape.

Fig. 10A is a schematic cross-sectional view of a fifth vapor chamber 200 according to the present embodiment before deformation.

Fig. 10B is a schematic cross-sectional view of the fifth vapor chamber 200 according to the present embodiment after deformation.

As shown in fig. 10A and 10B, in another example, the cross-sectional shape of the first groove may be a U-groove, where the stress concentration phenomenon of the U-groove is weaker, the structural strength is higher, and the reliability is better.

Alternatively, two, three, or even more first grooves may be provided at intervals or continuously on the first plate body 21. When the first grooves are plural, the shapes of the plural first grooves may be the same or different. For example, if there are two first grooves, both first grooves may be U-shaped grooves. Alternatively, one of the first grooves is a U-shaped groove and the other first groove is a V-shaped groove.

Alternatively, the first elastic portion 214 may be a stretchable elastic sheet, which is not limited in this embodiment.

In some embodiments, the housing 2 further comprises a first support 23.

Referring to fig. 9A and 9B again, in one example, the first supporting portion 23 is located between the first plate 21 and the second plate 22 and is connected to the second plate 22, and the first supporting portion 23 is located in the projection of the heat absorbing area 210 in the second plate 22. Since the vapor chamber 200 receives pressure from the outside at the second plate 22 when assembled with the heat source, in order to avoid the second plate 22 from being greatly deformed under pressure and affecting the continuity of the sealed cavity 3, a first supporting portion 23 may be provided between the first plate 21 and the second plate 22. In this way, the first supporting portion 23 can form a supporting rib on the second plate 22, so as to strengthen the structural strength of the second plate 22 itself. Meanwhile, even if the second plate 22 is deformed by being pressed, the first supporting portion 23 can keep a certain distance between the first plate 21 and the second plate 22, so that the continuity of the sealing cavity 3 is ensured.

Referring again to fig. 10A and 10B, in another example, the first supporting portion 23 is located between the first plate 21 and the second plate 22, and two ends of the first supporting portion 23 are connected to the heat absorbing region 210 and the second plate 22, respectively. Thus, when the heat absorbing area 210 is deformed, the heat absorbing area 210 can drive the second plate 22 to deform through the first supporting portion 23, so as to maintain the distance between the heat absorbing area 210 and the second plate 22.

Fig. 11 is a schematic distribution diagram of the first supporting portion in the seal cavity according to the present embodiment.

As shown in fig. 11, alternatively, the first supporting part 23 may include a plurality of first supporting members 231, the plurality of first supporting members 231 being disposed near the edge of the heat absorbing region 210, and the extending directions of the plurality of first supporting members 231 may be different. In fig. 11, a plurality of first supporting members 231 are spaced apart and formed in a ring-shaped structure to enhance the structural strength of the second plate 22. And communication of the capillary structure 4 can be achieved at the interval of the adjacent two first supports 231, thereby preventing the capillary structure 4 from being ruptured.

As shown in connection with fig. 10B and 11, alternatively, the first supporting member 231 may be a supporting plate, a supporting block, a supporting bar, or the like. The first supporting member 231 may be welded to the second plate 22 or integrally formed with the second plate 22, which is not limited in this embodiment.

As shown in fig. 10A and 10B, in some embodiments, the housing 2 may further include a second support portion 24, where the second support portion 24 is located between the first plate 21 and the second plate 22 and is connected to the first plate 21 and the second plate 22. Unlike the first support 23, the second support 24 is located outside the heat absorption zone 210. It can be seen that the second support 24 is located at a position where it is not deformed. The second supporting portion 24 is arranged to avoid deformation of the housing 2 at other positions, so that structural strength of the housing 2 is guaranteed, and continuity of the sealing cavity 3 is guaranteed.

As shown in fig. 11, alternatively, the second support 24 may comprise a plurality of second supports 241, the plurality of second supports 241 being arranged away from the heat absorbing zone 210, and the extending direction of the plurality of second supports 241 may be different. In fig. 11, a plurality of second supporting members 241 are spaced apart and form a ring structure to enhance the structural strength of the housing 2. And communication of the capillary structure 4 can be achieved at the interval between the adjacent two second supports 241, thereby preventing the capillary structure 4 from being ruptured.

As shown in connection with fig. 10B and 11, the second support 241 may alternatively be a support plate, a support block, a support bar, or the like. The second supporting member 241 may be welded to the first plate 21 and the second plate 22, or may be integrally formed with the second plate 22 and then welded to the first plate 21, which is not limited in this embodiment.

As shown in fig. 10A and 10B, in some embodiments, the second plate 22 is provided with a second elastic portion 221, and the second elastic portion 221 is disposed near the edge of the projection area of the heat absorbing area 210 on the second plate 22. The second elastic portion 221 is capable of being deformed to increase the ability of the second plate 22 to be deformed, thereby facilitating the second plate 22 to protrude toward the heat source. In this way, when the heat absorbing area 210 drives the second plate 22 to deform through the first supporting portion 23, the second elastic portion 221 can facilitate the deformation of the second plate 22 to reduce the deformation pressure of the heat absorbing area 210.

Further, when the first plate 21 is provided with the first elastic portion 214, the first elastic portion 214 and the second elastic portion 221 are disposed offset along the stacking direction (e.g. the Z-axis direction in fig. 10A) of the first plate 21 and the second plate 22, and the first elastic portion 214 is located at a side of the second elastic portion 221 away from the first supporting portion 23. In this way, when the first plate body 21 and the second plate body 22 are provided with the first elastic portion 214 and the second elastic portion 221 at the same time, the first elastic portion 214 and the second elastic portion 221 can be prevented from blocking the seal chamber 3, so that the communication of the seal chamber 3 is conveniently realized, and the normal circulation path of the circulating working medium is ensured.

Illustratively, the second resilient portion 221 may include at least one second recess, which is an annular recess, disposed around the heat absorbing region 210 with the opening direction of the second recess facing away from the first plate 21. Thus, when the heat absorbing region 210 deforms to protrude toward the heat source, the heat absorbing region 210 can pull the second groove to deform through the first supporting portion 23, so that the second plate 22 can deform conveniently.

It should be noted that, the shape, size, number and distribution of the second grooves may refer to the first grooves, which are not described herein.

The deformation of the heat absorbing region 210 will be described below by taking the example that the convex surface with a larger degree of protrusion is changed to the convex surface with a smaller degree of protrusion.

Fig. 12A is a schematic cross-sectional view of a sixth soaking plate before deformation according to the present embodiment.

Fig. 12B is a schematic cross-sectional view of a sixth soaking plate according to the present embodiment after deformation.

Referring to fig. 12A and 12B, in some embodiments, the heat absorbing region 210 includes a first protrusion 212. The first plate body 21 includes a first plate body 213. The first protrusion 212 is connected to the first plate body 213, and the first protrusion 212 protrudes toward the heat source.

The first protrusion 212 may be deformed. As shown in fig. 12A, before the vapor chamber 200 is deformed, the first protrusion 212 protrudes by a distance H1. As shown in fig. 12B, after the vapor chamber 200 is deformed, the protruding distance of the first protruding portion 212 is H2, and the protruding distance is reduced by H3 compared to before the deformation. It can be seen that the first protrusion 212 is configured to absorb the pressing force by deformation when being pressed by the heat transfer medium when being connected to the heat source through the heat transfer medium. In this way, when assembling the vapor chamber 200 with the heat source, the first protrusion 212 receives the pressing force from the heat conductive medium, and the first protrusion 212 can absorb the tolerance dimension of the tolerance chain to absorb the redundant space generated during the assembly. The first protrusion 212 can also squeeze the heat transfer medium to eliminate air holes generated in the heat transfer medium during the filling process, so that the heat spreader plate, the heat transfer medium and the heat source are attached more tightly, thereby further reducing the thickness of the heat transfer medium and improving the heat dissipation effect on the heat source. Further, the first protrusion 212 may absorb a part of the pressing force by deformation, thereby reducing the pressing force to which the heat source is subjected. It can be seen that the first protrusion 212 can improve the reliability of the connection structure of the heat source while improving the heat dissipation effect of the heat source.

As shown in fig. 12A and 12B, in one implementation, the first protruding portion 212 includes a curved elastic piece 2121, and the curved elastic piece 2121 is welded to the first plate body 213. When the curved elastic sheet 2121 receives the extrusion force of the heat conducting medium, the curved elastic sheet 2121 can drive the first plate body 213 to deform, so that the self-protruding degree is reduced, the extrusion force can be absorbed under the condition of reducing the thickness of the heat conducting medium, the extrusion force on a heat source is reduced, and the connection reliability of the heat source is improved.

Fig. 13A is a schematic cross-sectional view of a seventh soaking plate before deformation according to the present embodiment.

Fig. 13B is a schematic cross-sectional view of a seventh soaking plate according to the present embodiment after deformation.

As shown in fig. 13A and 13B, in one implementation, the first plate body 213 is provided with a through hole 2131 penetrating in its own thickness direction in the orthographic projection area of the heat source, and it can be seen that the axis of the through hole 2131 is parallel to the Z-axis direction. The first protruding portion 212 includes a curved elastic piece 2121, and the curved elastic piece 2121 is connected to the first plate body 213 by airtight welding and covers the through hole 2131, thereby ensuring sealability of the seal cavity 3. Thus, by providing the through hole 2131 on the first plate body 213, the curved elastic sheet 2121 can directly transfer the heat from the heat source to the circulating working medium on the capillary structure 4, so as to improve the heat dissipation effect.

In addition, the curved spring 2121 welded to the through hole 2131 requires that the deformation force applied to the first plate body 213 can be reduced, thereby facilitating the deformation of the heat absorbing zone 210.

The curved spring 2121 is located at a side of the first plate body 213 facing the heat source, and is welded to the welding surface 213a. As shown in fig. 13A, the curved spring 2121 protrudes to a greater extent before being deformed. As shown in fig. 13B, after the curved spring 2121 is deformed, the degree of protrusion thereof becomes smaller.

Fig. 14A is a schematic cross-sectional view of an eighth soaking plate before deformation according to the present embodiment. In fig. 14A, the dotted line marking range corresponds to the through hole 2131 on the first plate body 213 for convenience of marking the through hole 2131.

Fig. 14B is a schematic cross-sectional view of the eighth soaking plate according to the present embodiment after deformation.

As shown in fig. 14A and 14B, in another example, the through hole 2131 includes a hole sidewall 213B.

The curved spring 2121 is located in the through hole 2131 and welded to the hole sidewall 213b to seal the seal cavity 3. As shown in fig. 14A, the curved spring 2121 protrudes to a greater extent before being deformed. As shown in fig. 14B, after the curved spring 2121 is deformed, the degree of protrusion thereof becomes smaller. In this way, a stepped structure can be avoided from being formed between the curved elastic piece 2121 and the first plate body 213, thereby facilitating connection with the heat-conducting medium.

Fig. 15A is a schematic cross-sectional view of a ninth soaking plate before deformation according to the present embodiment.

Fig. 15B is a schematic cross-sectional view of a ninth soaking plate according to the present embodiment after deformation.

As shown in fig. 15A and 15B, in one implementation, the first projection 212 may include a curved protrusion 2122 partially stamped from the first plate body 213. The curved protrusion 2122 protrudes toward the heat source and serves to connect the heat conductive medium. As shown in fig. 15A, the curved protrusion 2122 protrudes to a greater extent before being deformed. As shown in fig. 15B, after the curved protrusion 2122 is deformed, the degree of protrusion thereof becomes small. In this way, when the curved protrusions 2122 receive the pressing force of the heat conductive medium during the assembly of the soaking plate 200 with the heat source, the thickness of the heat conductive medium can be reduced. Meanwhile, the curved surface bulges 2122 can deform to absorb the tolerance chain size, so that the self-bulging degree is reduced to absorb the extrusion force, the extrusion force on the heat source is reduced, and the connection reliability of the heat source is improved.

Fig. 16 is a schematic perspective view of a tenth vapor chamber provided in this embodiment.

Fig. 17A is a schematic cross-sectional view of a tenth soaking plate before deformation according to the present embodiment.

Fig. 17B is a schematic cross-sectional view of a tenth soaking plate according to the present embodiment after deformation.

As shown in fig. 16, 17A and 17B, in some embodiments, the first protruding portion 212 includes a first boss 2123, the first boss 2123 may be formed by the first plate body 21 through a stamping process, or the first boss 2123 may be connected to the first plate body 213 through welding, which is not limited herein.

Illustratively, the first boss 2123 includes a first side wall 212a and a first bottom wall 212b.

The first bottom wall 212b is parallel to the first plate body 213 and protrudes from the first plate body 213 in a direction toward the heat source. The first bottom wall 212b is for connection with a heat conductive medium.

The first sidewall 212a is an annular sidewall, and two ends of the first sidewall 212a are respectively connected to the first plate body 213 and the first bottom wall 212b.

The first side wall 212a and the first bottom wall 212b may be deformed. When the soaking plate 200 is assembled with the heat source, the first bottom wall 212b can press the heat conductive medium, thereby reducing the thickness of the heat conductive medium. Meanwhile, the first bottom wall 212b is also subjected to a reverse pressing force of the heat conductive medium, so that the first bottom wall 212b and the first side wall 212a are deformed, thereby reducing the protruding degree of the first boss 2123. Therefore, the tolerance chain size can be absorbed through deformation, the thickness of the heat conducting medium can be reduced, part of extrusion force can be absorbed, and extrusion force applied to the heat source is reduced, so that the connection reliability of the heat source is improved.

Optionally, a third elastic portion 212c is further disposed on the first side wall 212a, and the third elastic portion 212c is capable of being deformed. In this way, when the first bottom wall 212b receives the pressing force, the third elastic portion 212c may deform to increase the ability of the first side wall 212a to deform, so that deformation of the first side wall 212a and the first bottom wall 212b can be easily achieved, and the pressing force on the heat source is further reduced.

For example, the third elastic portion 212c may include at least one third groove, which is an annular groove, and an opening direction of which faces the heat source.

It is understood that the size, the cross-sectional shape and the number of the third grooves may refer to the description of the first grooves, and will not be repeated herein.

Referring again to fig. 17A and 17B, in some embodiments, the housing 2 further includes a first support 23.

In one example, the first supporting portion 23 is located between the first plate 21 and the second plate 22 and is connected to the second plate 22, and the first supporting portion 23 is located in the projection of the first protruding portion 212 on the second plate 22. Since the vapor chamber 200 receives pressure from the outside at the second plate 22 when assembled with the heat source, in order to avoid the second plate 22 from being greatly deformed under pressure and affecting the continuity of the sealed cavity 3, a first supporting portion 23 may be provided between the first plate 21 and the second plate 22. In this way, the first supporting portion 23 is arranged to form a supporting rib on the second plate 22 to strengthen the structural strength of the second plate 22, and meanwhile, even if the second plate 22 is deformed under pressure, the first supporting portion 23 is arranged to enable the first plate 21 and the second plate 22 to keep a certain distance, so that the continuity of the sealing cavity 3 is ensured.

Fig. 18A is a schematic cross-sectional view of an eleventh soaking plate according to the present embodiment before deformation.

Fig. 18B is a schematic cross-sectional view of an eleventh soaking plate according to the present embodiment after deformation.

As shown in fig. 18A and 18B, in another example, the second plate body 22 includes a second protrusion 222 and a second plate body 223.

The second plate body 223 is positioned at the outer circumference of the second protrusion 222, and the second plate body 223 is hermetically connected to the first plate body 213.

The second protruding portion 222 is connected to the second plate body 223, the second protruding portion 222 is disposed corresponding to the first boss 2123, and the protruding direction of the second protruding portion 222 is the same as the protruding direction of the first boss 2123.

At this time, the first supporting portion 23 may be located between the first bottom wall 212b and the second protruding portion 222, and both ends of the first supporting portion 23 are connected to the first bottom wall 212b and the second protruding portion 222, respectively. Thus, when the first bottom wall 212b receives the pressing force, the first supporting portion 23 can transmit the pressing force to the second protruding portion 222 to drive the second protruding portion 222 to deform, so as to ensure the space between the first boss 2123 and the second protruding portion 222, so as to ensure the continuity of the sealing cavity 3.

It is to be understood that the specific structure of the first supporting portion 23 is described in the above description, and will not be repeated here.

Further, the second projection 222 may include a second boss 2221, the second boss 2221 may be formed from the second plate body 22 via a stamping process, or the second boss 2221 may be connected to the second plate body 223 by welding, which is not limited herein.

Illustratively, the second boss 2221 includes a second side wall 222a and a second bottom wall 222b.

The second bottom wall 222b is parallel to the second plate body 223, and protrudes from the second plate body 223 in a direction toward the heat source. The second bottom wall 222b is connected to the first support portion 23.

The second side wall 222a is an annular side wall, and two ends of the second side wall 222a are respectively connected to the second plate body 223 and the second bottom wall 222b.

The second side wall 222a and the second bottom wall 222b may be deformed. Thus, when the first bottom wall 212b receives the pressing force, the first supporting portion 23 can transmit the pressing force to the second bottom wall 222b, so as to deform the second bottom wall 222b and the second side wall 222 a.

In some embodiments, the second side wall 222a is further provided with a fourth elastic portion 222c, and the fourth elastic portion 222c can be deformed. In this way, when the second bottom wall 222b receives the pressing force, the fourth elastic portion 222c can be deformed to increase the ability of the second side wall 222a to deform, so that the deformation of the second side wall 222a and the second bottom wall 222b can be facilitated.

The fourth elastic portion 222c may include at least one fourth groove, which is an annular groove, and the opening direction of the fourth groove faces away from the first plate 21.

It is understood that the size, the cross-sectional shape and the number of the fourth grooves may refer to the description of the first grooves, and will not be repeated herein.

Fig. 19 is a schematic perspective view of a view angle of a twelfth vapor chamber 200 according to the present embodiment.

Fig. 20 is a schematic perspective view of another view angle of a twelfth vapor chamber 200 according to the present embodiment.

Fig. 21A is a schematic cross-sectional view of a twelfth soaking plate 200 provided in the present embodiment before deformation.

Fig. 21B is a schematic cross-sectional view of the twelfth soaking plate 200 according to the present embodiment after deformation.

As shown in fig. 19 to 21B, in some embodiments, the housing 2 is further provided with a hollow portion 25, the hollow portion 25 penetrates through the first sidewall 212a and the second sidewall 222a, and the sealing cavity 3 inside the housing 2 is sealed at the position of the hollow portion 25. The arrangement of the hollowed-out portion 25 can reduce the structural strength of the first side wall 212a and the second side wall 222a, so that the first side wall 212a and the second side wall 222a can be deformed conveniently.

Illustratively, the first and second bottom walls 212b, 222b may be square bottom walls.

The hollowed-out portion 25 includes a plurality of first hollowed-out portions 251, where the first hollowed-out portions 251 are located at corner positions of the first bottom wall 212b and the second bottom wall 222b to break the continuous and annular structures of the first side wall 212a and the second side wall 222a, so as to weaken the structural strength of the first side wall 212a and the second side wall 222a, and facilitate deformation of the first side wall 212a and the second side wall 222 a.

Specifically, the first hollow portion 251 may be a hollow hole penetrating through the first sidewall 212a and the second sidewall 222 a.

Further, the hollowed-out portion 25 may further include a plurality of second hollowed-out portions 252, where the second hollowed-out portions 252 at least correspond to the middle positions of two opposite sides of the square bottom wall. In this way, the structural strength of the first and second sidewalls 212a and 222a can be further weakened so that the first and second sidewalls 212a and 222a deform.

As shown in fig. 18A and 18B, in some embodiments, the housing 2 may further include a second support 24. The second supporting portion 24 is located between the first plate 21 and the second plate 22, and is connected to the first plate 21 and the second plate 22. Unlike the first support 23, the second support 24 is located outside the heat absorption zone 210. It can be seen that the second support 24 is located at a position where it is not deformed. The second supporting portion 24 is arranged to avoid deformation of the housing 2 at other positions, so that structural strength of the housing 2 is guaranteed, and continuity of the sealing cavity 3 is guaranteed.

It should be understood that the specific structure of the second supporting portion 24 is already described in the above description, and will not be repeated here.

Fig. 22 is a schematic cross-sectional view of a circuit board assembly according to the present embodiment.

As shown in fig. 22, in a second aspect, the present embodiment provides a circuit board assembly 300, including a substrate 330 and the vapor chamber 200 according to the first aspect. The substrate 330 is provided with a chip 340, and the chip 340 may serve as the heat source 310. A soaking plate 200 is disposed on a side of the chip 340 facing away from the substrate 330, and a heat transfer medium 320 is disposed between the chip 340 and the soaking plate 200. Before the assembly of the soaking plate 200 and the chip 340 is completed, the heat absorbing area 210 of the soaking plate 200 can be deformed, so that after the soaking plate 200 and the chip 340 are assembled, the heat absorbing area 210 of the soaking plate 200 is connected to the heat conducting medium 320, and the heat absorbing area 210 can be protruded towards the chip 340, so as to reduce the thickness of the heat conducting medium 320. In this way, the heat-transfer medium 320 can be pressed by utilizing the characteristic that the heat-absorbing region 210 of the vapor chamber 200 can be deformed, the thickness of the heat-transfer medium 320 can be reduced, and the air holes generated in the heat-transfer medium 320 during filling can be eliminated, so that the vapor chamber 200, the heat-transfer medium 320 and the chip 340 can be bonded more tightly. The heat dissipation effect on the chip 340 is improved. Meanwhile, the deformable heat absorbing region 210 can absorb manufacturing tolerances of the chip 340 and the soaking plate 200, and absorb redundant space generated in the assembly process, so that the thickness of the heat conducting medium 320 is further reduced. In addition, the heat absorbing region 210 of the soaking plate 200 can reduce the extrusion force to the chip 340, so as to avoid affecting the connection strength between the chip 340 and the substrate 330 and improve the reliability of the chip 340.

Illustratively, the heat-conducting medium 320 described above can change its thickness of the heat-conducting structure after receiving the pressing force under certain conditions. For example, the heat conductive medium 320 may be a heat conductive gel, graphite, silicone grease, or the like.

Further, a shielding structure 350 is further disposed between the soaking plate 200 and the chip 340, and the shielding structure 350 is electrically connected to the ground terminal of the substrate 330.

Illustratively, the shielding structure 350 may be a copper frame that covers the chip 340.

The heat conductive medium 320 includes a first heat conductive part 321 and a second heat conductive part 322. The first heat conducting portion 321 is disposed between the shielding structure 350 and the chip 340, and the second heat conducting portion 322 is disposed between the shielding structure 350 and the soaking plate 200. In this way, the heat absorbing region 210 may cause the second heat conductive portion 322 to press the shielding structure 350 and the shielding structure 350 to press the first heat conductive portion 321 by pressing the second heat conductive portion 322 to reduce the thickness of the first heat conductive portion 321 and the second heat conductive portion 322.

As shown in fig. 23, in a third aspect, the present embodiment provides an electronic device 400, including a middle frame 410 and the circuit board assembly 300 according to the second aspect.

The middle frame 410 includes a connection 411 and a support 412. The connection member 411 is disposed near the edge of the support member 412, and the connection member 411 and the support member 412 enclose to form a receiving groove 413. The substrate 330 is connected to the connecting member 411, the substrate 330 and the chip 340 are located in the accommodating groove 413, and the soaking plate 200 is located on a side surface of the supporting member 412 facing away from the accommodating groove 413. The soaking plate 200 is connected to the support 412. The support 412 is provided with connection holes 414, and the heat absorbing area 210 is connected to the heat conducting medium 320 through the connection holes 414.

The assembly process of the electronic device 400 is described below.

When the electronic device 400 is assembled, the chip 340 is first mounted on the substrate 330, the surface of the chip 340 is filled with the first heat conducting portion 321, and then the shielding structure 350 is covered on the chip 340 and electrically connected to the ground terminal of the substrate 330. The first heat conduction portion 321 is also in a flexible state and can be deformed.

The substrate 330 provided with the shielding structure 350 is connected to the connection 411 of the middle frame 410. The connecting member 411 may be a connecting post with holes to connect the substrate 330 to the connecting member 411 by screws, or the substrate 330 may be connected to the connecting member 411 by glue bonding, which is not limited in this embodiment.

At this time, the second heat conduction portion 322 is coated on the heat absorption region 210 of the soaking plate 200. The soaking plate 200 with the second heat conducting part 322 is buckled and abutted on the shielding structure 350 through the connecting hole 414, and the support and the fixation of the soaking plate 200 are realized by utilizing the support piece 412 of the middle frame 410. In this way, the heat absorbing region 210 can abut against the shielding structure 350 through the second heat conducting portion 322.

When the heat absorbing region 210 includes the shape memory alloy plate 211, after the vapor chamber 200 is connected and fixed to the support 412, the first heat conducting portion 321 and the second heat conducting portion 322 are both in a flexible state and may be deformed. At this time, the chip 340 of the electronic device 400 may be tested, and during the test, the chip 340 may generate heat, which may deform the shape memory alloy plate 211. The shape memory alloy plate 211 protrudes toward the chip 340 to press the second heat conducting portion 322, the shielding structure 350 and the first heat conducting portion 321, so as to reduce the thickness of the first heat conducting portion 321 and the second heat conducting portion 322, and eliminate air holes inside the first heat conducting portion 321 and the second heat conducting portion 322, so that the heat dissipation effect on the chip 340 is improved due to the compactness of the bonding of the heat spreader 200, the second heat conducting portion 322, the shielding structure 350, the first heat conducting portion 321 and the chip 340. In this process, the deformation of the shape memory alloy plate 211 can also absorb the size of the tolerance chain, absorbing the redundant space during the assembly process, to further reduce the thickness of the first and second heat conductive parts 321 and 322. In addition, the elastic deformation of the shape memory alloy plate 211 can absorb a part of the pressing force, so as to avoid affecting the connection strength between the chip 340 and the substrate 330.

After the test, the first and second heat conductive parts 321 and 322 are gradually cured at a high temperature, and remain in a deformed state with the shape memory alloy plate 211 to complete the assembly.

When the heat absorbing region 210 includes the first protruding portion 212, the first protruding portion 212 presses the second heat conducting portion 322, the shielding structure 350 and the first heat conducting portion 321 when the second heat conducting portion 322 on the soaking plate 200 is connected with the shielding structure 350, so that the second heat conducting portion 322, the shielding structure 350 and the first heat conducting portion 321 are deformed, the thicknesses of the first heat conducting portion 321 and the second heat conducting portion 322 are reduced, air holes inside the first heat conducting portion 321 and the second heat conducting portion 322 can be eliminated, the soaking plate 200, the second heat conducting portion 322, the shielding structure 350, the first heat conducting portion 321 and the chip 340 are attached more tightly, and the heat dissipation effect on the chip 340 is improved. Meanwhile, the first protruding portion 212 is also subjected to the reaction force of the second heat conducting portion 322, so as to squeeze the first protruding portion 212 to elastically deform, thereby reducing the protruding degree of the first protruding portion 212. The tolerance chain size can be absorbed, the redundant space in the assembly process can be absorbed, and part of extrusion force can be absorbed through deformation, so that the influence on the connection strength of the chip 340 and the substrate 330 is avoided.

After the first and second heat conductive parts 321 and 322 are cured, the first protrusion 212 is maintained in a deformed state to complete the assembly.

It is noted that other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope of the application being indicated by the following claims.

It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims

1. A soaking plate, comprising:

-a housing (2), the housing (2) comprising a first plate (21) for facing a heat source;

the first plate body (21) comprises a heat absorption area (210), and the heat absorption area (210) is used for being arranged in the orthographic projection area of the heat source;

The heat absorbing region (210) protrudes toward the heat source to reduce a thickness of a heat transfer medium between the heat absorbing region (210) and the heat source.

2. A vapor chamber according to claim 1, wherein:

-the heat absorbing zone (210) comprises a shape memory alloy plate (211);

the shape memory alloy plate (211) is configured to be deformable by a flat plate structure to project the heat absorbing region (210) toward the heat source;

the shape memory alloy plate (211) has a one-way memory effect.

3. A vapor chamber according to claim 2,

the first plate body (21) comprises a first plate body (213);

the first plate body (213) is provided with a through hole (2131) penetrating in the thickness direction of the first plate body in the orthographic projection area of the heat source;

the shape memory alloy plate (211) is welded to the first plate body (213) and covers the through hole (2131).

4. A vapor chamber according to claim 3,

-the first plate body (213) comprises a weld (2132) adjacent to the through hole (2131);

the welding portion (2132) has a welding surface (213 a) facing the heat source;

The shape memory alloy plate (211) is positioned on one side of the first plate body (213) facing the heat source and is welded and connected to the welding surface (213 a);

the shape memory alloy plate (211) is configured to: before deformation, the shape memory alloy plate (211) is in a flat plate structure state and is parallel to the first plate body (213), after deformation, the shape memory alloy plate protrudes towards the heat source, and the welding part (2132) is driven to protrude towards the heat source.

5. A vapor chamber according to claim 3,

the through hole (2131) comprises a hole sidewall (213 b);

the shape memory alloy plate (211) is positioned in the through hole (2131) and welded to the hole side wall (213 b);

a side surface of the shape memory alloy plate (211) facing the heat source is positioned on the same plane with a side surface of the first plate body (213) facing the heat source;

the shape memory alloy plate (211) is configured to: before deformation, the shape memory alloy plate (211) and the first plate body (213) are in a flat plate structure state, and after deformation, the shape memory alloy plate (211) and the first plate body (213) form a curved surface protruding towards the heat source.

6. A vapor chamber according to claim 2,

the first plate body (21) is a shape memory alloy plate (211);

the shape memory alloy plate (211) is configured to: local deformations may be generated in the heat absorbing region (210) by a flat plate structure to cause the heat absorbing region (210) to protrude toward the heat source.

7. A vapor chamber according to claim 2,

the first plate body (21) comprises a first plate body (213);

the shape memory alloy plate (211) is welded and connected to one side surface of the first plate body (213) facing the heat source;

the shape memory alloy plate (211) is configured to: before deformation, the shape memory alloy plate (211) and the first plate body (213) are in a flat plate structure state, and after deformation, the shape memory alloy plate (211) drives the first plate body (213) to protrude towards the heat source.

8. A vapor chamber according to any one of claims 2 to 7,

the housing (2) further comprises a second plate (22) opposite to the first plate (21);

the second plate body (22) is positioned at one side of the first plate body (21) away from the heat source, and the second plate body (22) is connected with the first plate body (21) in a sealing way;

The housing (2) further comprises a first support (23);

the first supporting part (23) is positioned between the first plate body (21) and the second plate body (22), and one end of the first supporting part (23) is connected with the second plate body (22);

the first supporting part (23) is positioned in the projection of the heat absorbing area (210) on the second plate body (22).

9. A vapor chamber according to claim 8,

the other end of the first supporting part (23) is connected with the heat absorption area (210);

the first supporting part (23) is configured to drive the second plate body (22) to deform along with the heat absorbing region (210) when the heat absorbing region (210) deforms.

10. A vapor chamber according to claim 9,

the first plate body (21) comprises a first elastic part (214);

the first elastic portion (214) is adjacent to the heat absorption region (210);

the first elastic portion (214) is configured to be deformable to increase the ability of the first plate body (21) to deform;

the first elastic part (214) comprises at least one first groove, and the first groove is an annular groove;

The opening of the first groove faces the direction of the heat source.

11. A vapor chamber according to claim 10,

the second plate body (22) is provided with a second elastic part (221);

the second elastic part (221) is close to the outer edge of the projection area of the heat absorption area (210) in the second plate body (22);

the second elastic part (221) is configured to be deformable to increase the ability of the second plate body (22) to deform;

the second elastic part (221) comprises at least one second groove, and the second groove is an annular groove;

the opening of the second groove faces away from the first plate body (21).

12. The vapor chamber of claim 11,

along the lamination direction of the first plate body (21) and the second plate body (22), the first elastic part (214) and the second elastic part (221) are arranged in a staggered mode, and the first elastic part (214) is positioned at one side, deviating from the first supporting part (23), of the second elastic part (221).

13. A vapor chamber according to claim 1,

-the heat absorbing zone (210) comprises a first protrusion (212);

The first plate body (21) further comprises a first plate body (213);

the first protruding portion (212) is connected to the first plate body (213), and the first protruding portion (212) protrudes toward the heat source;

the first protrusion (212) is configured to receive a pressing force of the heat-conducting medium when the heat-conducting medium abuts against the heat source, and to deform under the action of the pressing force to absorb the pressing force.

14. The vapor chamber of claim 13,

the first protruding part (212) comprises a curved elastic sheet (2121), and the curved elastic sheet (2121) is welded and connected to the first plate body (213);

when the curved elastic sheet (2121) receives the extrusion force of the heat conducting medium, the curved elastic sheet (2121) can drive the first plate body (213) to deform, so that the self-protrusion degree is reduced, and the extrusion force is absorbed.

15. The vapor chamber of claim 14,

the curved elastic sheet (2121) is connected to the first plate body (213) through airtight welding and covers the through hole (2131);

The curved elastic sheet (2121) protrudes towards the heat source;

the curved elastic sheet (2121) is used for abutting against the heat-conducting medium;

when the curved elastic sheet (2121) receives the extrusion force of the heat conducting medium, the curved elastic sheet (2121) can deform to reduce the self-protruding degree so as to absorb the extrusion force.

16. The vapor chamber of claim 13,

the first protruding part (212) comprises a curved protrusion (2122) formed by partially punching the first plate body (213);

the curved protrusion (2122) protrudes toward the heat source;

the curved surface bulge (2122) is used for abutting against the heat conducting medium;

when the curved surface protrusion (2122) receives the extrusion force of the heat conducting medium, the curved surface protrusion (2122) can deform to reduce the self-protrusion degree so as to absorb the extrusion force.

17. The vapor chamber of claim 13,

the first projection (212) includes a first boss (2123);

the first boss (2123) includes a first side wall (212 a) and a first bottom wall (212 b);

the first bottom wall (212 b) is parallel to the first plate body (213) and protrudes from the first plate body (213) in a direction toward the heat source;

The first side wall (212 a) is an annular side wall, and two ends of the first side wall (212 a) are respectively connected to the first plate body (213) and the first bottom wall (212 b);

the first bottom wall (212 b) is used for abutting against the heat conducting medium;

when the first bottom wall (212 b) receives the extrusion force of the heat conducting medium, the first bottom wall (212 b) and the first side wall (212 a) can deform, so that the extrusion force is absorbed, and the self-bulge degree is reduced.

18. The vapor chamber of claim 17, wherein the vapor chamber comprises,

the housing (2) further comprises a first support (23);

the first supporting portion (23) is located between the first bottom wall (212 b) and the second plate body (22), and one end of the first supporting portion (23) is connected to the second plate body (22).

19. The vapor chamber of claim 18, wherein the vapor chamber comprises,

The second plate body (22) comprises a second plate body (223) and a second protruding part (222);

the second plate body (223) is positioned at the periphery of the second bulge (222), and the second plate body (223) is connected with the first plate body (213) in a sealing way;

the second protruding part (222) is connected to the second plate body (223), the second protruding part (222) is arranged corresponding to the first protruding part (212), and the protruding direction of the second protruding part (222) is the same as the protruding direction of the first protruding part (212);

both ends of the first supporting part (23) are respectively connected to the first bottom wall (212 b) and the second protruding part (222);

the first supporting portion (23) is configured to transmit the pressing force to the second protruding portion (222) to deform the second protruding portion (222) when the first bottom wall (212 b) receives the pressing force.

20. The vapor chamber of claim 19,

the second projection (222) includes a second boss (2221);

the second boss (2221) includes a second side wall (222 a) and a second bottom wall (222 b);

The second bottom wall (222 b) is parallel to the second plate body (223) and protrudes from the second plate body (223) in a direction toward the heat source;

the second side wall (222 a) is an annular side wall, and two ends of the second side wall (222 a) are respectively connected to the second plate body (223) and the second bottom wall (222 b);

the first supporting portion (23) is connected to the first bottom wall (212 b) and the second bottom wall (222 b);

the first supporting portion (23) is configured to transmit the pressing force to the second bottom wall (222 b) to deform the second bottom wall (222 b) and the second side wall (222 a) when the first bottom wall (212 b) receives the pressing force.

21. The vapor chamber of claim 20,

the first side wall (212 a) is also provided with a third elastic part (212 c);

the third resilient portion (212 c) is configured to be deformable to increase deformability of the first sidewall (212 a);

the third elastic portion (212 c) comprises at least one third groove;

the third groove is an annular groove, and an opening of the third groove faces the heat source.

22. The vapor chamber of claim 20,

the second side wall (222 a) is also provided with a fourth elastic part (222 c);

the fourth elastic portion (222 c) is configured to be deformable to increase deformability of the second side wall (222 a);

the fourth elastic portion (222 c) includes at least one fourth groove;

the fourth groove is an annular groove, and an opening of the fourth groove faces away from the first plate body (21).

23. The vapor chamber of claim 20,

the shell (2) is further provided with a hollowed-out part (25), and the hollowed-out part (25) penetrates through the first side wall (212 a) and the second side wall (222 a);

the shell (2) is in sealing connection with the hollow part (25).

24. The vapor chamber of claim 23,

the first bottom wall (212 b) and the second bottom wall (222 b) are square bottom walls;

the hollowed-out parts (25) comprise a plurality of first hollowed-out parts (251);

the first hollowed-out part (251) is located at the corner positions of the first bottom wall (212 b) and the second bottom wall (222 b) so as to break the annular structures of the first side wall (212 a) and the second side wall (222 a).

25. The vapor chamber of claim 24,

the hollowed-out part (25) further comprises a plurality of second hollowed-out parts (252);

the second hollowed-out part (252) at least corresponds to the middle position of two opposite sides of the square bottom wall.

26. A circuit board assembly, comprising: a substrate (330) and a soaking plate according to any one of claims 1-25;

a chip (340) is arranged on the substrate (330), and the chip (340) is a heat source (310);

the vapor chamber is arranged on one side of the chip (340) away from the substrate (330);

a heat conducting medium (320) is further arranged between the chip (340) and the soaking plate;

the heat absorbing region (210) of the soaking plate is connected to the heat conducting medium (320), and the heat absorbing region (210) protrudes toward the chip (340) to reduce the thickness of the heat conducting medium (320).

27. The circuit board assembly of claim 26, wherein the circuit board assembly further comprises a plurality of circuit boards,

a shielding structure (350) is further arranged between the vapor chamber and the chip (340);

the heat conducting medium (320) comprises a first heat conducting part (321) and a second heat conducting part (322);

The first heat conduction part (321) is arranged between the shielding structure (350) and the chip (340);

the second heat conduction part (322) is arranged between the shielding structure (350) and the soaking plate;

the heat absorbing region (210) may compress the shielding structure (350) by compressing the second heat conductive portion (322), causing the second heat conductive portion (322) to compress the first heat conductive portion (321), and causing the shielding structure (350) to compress the first heat conductive portion (321) to reduce the thickness of the first heat conductive portion (321) and the second heat conductive portion (322).

28. An electronic device comprising a center (410) and the circuit board assembly of claim 26 or 27;

the middle frame (410) comprises a connecting piece (411) and a supporting piece (412);

the connecting piece (411) is arranged close to the edge of the supporting piece (412), and the connecting piece (411) and the supporting piece (412) are enclosed to form a containing groove (413);

the base plate (330) is connected to the connecting member (411);

the substrate (330) and the chip (340) are positioned in the accommodating groove (413), the soaking plate is positioned on one side surface of the supporting piece (412) which is away from the accommodating groove (413), and the soaking plate is connected with the supporting piece (412);

The support (412) is provided with a connection hole (414);

the heat absorbing region (210) is connected to the heat conductive medium (320) through the connection hole (414).