CN117439626A - Array type radio frequency system - Google Patents

Abstract

The invention discloses an array type radio frequency system which comprises an extensible mother circuit carrier plate and a plurality of sub-modules realized by a radio frequency package radiation structure. The sub-modules are embedded into the mother circuit carrier board through the plug-in interfaces to form a replaceable and extensible co-structure of the sub-module and the mother module. The mother circuit carrier receives an input intermediate frequency signal and performs up-conversion on the input intermediate frequency signal to generate a plurality of first high frequency signals. The sub-modules of the radio frequency package radiation structure are embedded on the mother circuit carrier board in a horizontal layout and are arranged into a one-dimensional or two-dimensional array, and the sub-modules are electrically connected with the mother circuit carrier board (including radio frequency signals, power supply, control signals and the like). The radio frequency package radiation structure receives the first high-frequency signals respectively and transmits a plurality of first radio frequency signals according to the first high-frequency signals, the radio frequency package radiation structure receives a plurality of second radio frequency signals to generate a plurality of second high-frequency signals, and the mother circuit carrier board carries out frequency reduction on the second high-frequency signals to generate an output intermediate-frequency signal.

Description

Array type radio frequency system

Technical Field

The present invention relates to a radio frequency system, and more particularly, to a detachable hierarchical array radio frequency system.

Background

The active array antenna is constructed to realize the dual functions of high gain and intelligent beam scanning operation. According to the application scene planning pluralism, the required antenna characteristics need to be quickly constructed, and it is difficult to customize the product in a single situation to adapt to each scene situation in a wide area.

The prior art uses passive components including capacitors, resistors and antennas, beam forming chips including power amplifiers, phase shifters and low noise amplifiers, frequency up chips, frequency down chips, power chips and microprocessors integrated into a single system. For large array antennas, the prior art reduces the flexibility of the system and increases the complexity and uncertainty of the problem, so that the maintenance cost is quite high because the large-scale production cannot be performed, the risk of system failure caused by single component failure can occur, the system expansibility is low, and the system cannot be flexibly constructed according to the different antenna gain requirements of each system.

Accordingly, the present invention addresses the above-mentioned problems by providing a modular, array-type rf system that solves the problems of the prior art.

Disclosure of Invention

The invention provides a modularized and array type radio frequency system, which is characterized by simplifying the complexity of the system, reducing the manufacturing cost and the maintenance cost, increasing the stability of the antenna characteristic and the application expansion degree of the product, generating an air cavity by the interface, increasing the air flow heat dissipation, reducing the influence of heat energy on the system and taking the mechanical and electronic characteristics into account.

In one embodiment of the present invention, an array type radio frequency system includes a mother circuit carrier and a plurality of sub-modules implemented in a radio frequency package radiation structure. The mother circuit carrier is used for receiving an input intermediate frequency signal and up-converting the input intermediate frequency signal to generate a plurality of first high frequency signals. All the sub-modules realized by the radio frequency package radiation structure are embedded on the mother circuit carrier plate in a horizontal layout and are arranged into a one-dimensional or two-dimensional periodic array, and the electrical property (comprising radio frequency signals, power sources and control signals) is connected with the mother circuit carrier plate, wherein the interface ports of the mother circuit carrier plate are in periodic arrangement, and the interface ports of the sub-modules are positioned at or close to the phase center point of the radio frequency package radiation structure of the sub-modules for radiating an electromagnetic field. All the radio frequency package radiation structures are divided into a plurality of radio frequency radiation module groups, and all the radio frequency radiation module groups of all the radio frequency package radiation structures are used for respectively receiving all the first high-frequency signals and transmitting a plurality of first radio frequency signals according to the first high-frequency signals. All the radio frequency radiation module groups of all the radio frequency package radiation structures are used for receiving a plurality of second radio frequency signals, so that a plurality of second high frequency signals are generated respectively corresponding to all the radio frequency radiation module groups, and the mother circuit carrier board carries out frequency reduction on all the second high frequency signals, so that an output intermediate frequency signal is generated.

In one embodiment of the present invention, the mother circuit carrier includes a dielectric board, an intermediate frequency input port, a first power divider, a plurality of frequency up-converters, and a plurality of second power dividers. The dielectric plate is provided with ports for embedding all sub-modules realized by the radio frequency package radiation structure, and the intermediate frequency input port is arranged on the dielectric plate. The first power divider is disposed on the dielectric board and electrically connected to the intermediate frequency input port. The first power divider is used for receiving the input intermediate frequency signals through the intermediate frequency input ports, dividing the power of the input intermediate frequency signals according to the number of the output ends of the first power divider so as to generate a plurality of first intermediate frequency signals at all the output ends of the first power divider, wherein the output ends are input ports of the sub-modules of the link radio frequency package radiation structure, and the input ports are in one-dimensional or two-dimensional periodic arrangement. All the frequency boosters are arranged on the dielectric plate and are respectively and electrically connected with all the output ends of the first power distributor. All the up-converters are used for receiving all the first intermediate frequency signals and up-converting the first intermediate frequency signals to generate a plurality of up-converted signals. All the second power distributors are arranged on the dielectric plate and are respectively and electrically connected with all the frequency boosters and all the radio frequency radiation module groups of all the radio frequency package radiation structures. Each second power divider is used for receiving the corresponding up-conversion signals and distributing the corresponding up-conversion signals according to the number of a plurality of output ends of the second power divider so as to generate first high-frequency signals.

In an embodiment of the present invention, the mother circuit carrier further includes a plurality of third power dividers, a plurality of frequency downconverters, a fourth power divider, and an intermediate frequency output port. All third power distributors are arranged on the dielectric plate and are respectively and electrically connected with all radio frequency radiation module groups of all radio frequency package radiation structures. Each third power divider is used for receiving the corresponding second high-frequency signal and summing the power of the corresponding second high-frequency signal to generate a summed high-frequency signal. All the frequency reducers are arranged on the dielectric plate and are respectively and electrically connected with all the third power distributors. All of the down-converters are configured to receive their corresponding added total frequency signals and down-convert them to generate a plurality of second intermediate frequency signals. The fourth power distributor is arranged on the dielectric plate and is electrically connected with all the frequency down converters. The fourth power divider is used for receiving all the second intermediate frequency signals and adding up the power of all the second intermediate frequency signals to generate output intermediate frequency signals. The intermediate frequency output port is arranged on the dielectric plate and is electrically connected with the fourth power distributor, wherein the intermediate frequency output port is used for outputting the output intermediate frequency signal.

In an embodiment of the invention, the mother circuit carrier further includes a plurality of first signal ports and a plurality of second signal ports. All the first signal ports are arranged on the dielectric plate and are divided into a plurality of first groups, all the first groups are respectively and electrically connected with all the second power distributors and all the radio frequency radiation module groups, and each first group is electrically connected between the corresponding second power distributor and the radio frequency radiation module group. All the second signal ports are arranged on the dielectric plate and are divided into a plurality of second groups, all the second groups are respectively and electrically connected with all the third power distributors and all the radio frequency radiation module groups, and each second group is electrically connected between the corresponding third power distributor and the radio frequency radiation module group.

In one embodiment of the present invention, the first signal port and the second signal port are subminiature Push-on Micro (SMPM) ports.

In an embodiment of the invention, the mother circuit carrier further includes a plurality of first power supply ports and a plurality of second power supply ports disposed on the dielectric board.

In one embodiment of the present invention, the first power port and the second power port are serial peripheral interfaces (Serial Peripheral InterfaceBus, SPI) or signal control lines.

In an embodiment of the invention, each radio frequency package radiation structure includes a multilayer conductive wiring substrate, a plurality of radio frequency radiation structures, a plurality of high frequency transmitting radio frequency integrated circuit chips, a plurality of low frequency receiving radio frequency integrated circuit chips, a transmitting signal port and a receiving signal port. The multi-layer conductive wiring substrate comprises a multi-layer dielectric layer, a conductive trace, a first conductive through hole and a second conductive through hole, wherein the conductive trace is electrically connected with the first conductive through hole and the second conductive through hole. All the radio frequency radiation structures are arranged at the bottom of the multi-layer conductive wiring substrate and are embedded in the multi-layer conductive wiring substrate. All transmitting radio frequency integrated circuit chips and all receiving radio frequency integrated circuit chips are arranged on the top of the multilayer conductive wiring substrate. All the transmitting radio frequency integrated circuit chips are electrically connected with the first conductive through holes through the first conductive structures, so that all the radio frequency radiation structures are electrically connected respectively. All the receiving radio frequency integrated circuit chips are electrically connected with the second conductive through holes through the second conductive structures, so that all the radio frequency radiation structures are respectively and electrically connected. The transmitting signal port and the receiving signal port are arranged on the top of the multilayer conductive wiring substrate and are electrically connected with the mother circuit carrier. The transmitting signal port is electrically connected with all the high-frequency transmitting radio-frequency integrated circuit chips through the conductive trace and the first conductive structure. The receiving signal port is electrically connected with all the low-frequency receiving radio frequency integrated circuit chips through the conductive trace and the second conductive structure. The multi-layer conductive wiring substrate and all the transmitting radio frequency integrated circuit chips are used for receiving the first transmitting signals and transmitting the first radio frequency signals through all the radio frequency radiation structures according to the first transmitting signals. The multi-layer conductive wiring substrate and all the receiving radio frequency integrated circuit chips are used for receiving the second radio frequency signals through all the radio frequency radiation structures and generating second high frequency signals.

In an embodiment of the invention, each of the rf package radiation structures further includes a first power port and a second power port. The first power port and the second power port are arranged at the top of the multilayer conductive wiring substrate and are electrically connected with the mother circuit carrier plate, the first power port is electrically connected with all the high-frequency emission radio-frequency integrated circuit chips through the first conductive through holes and the first conductive structures, and the second power port is electrically connected with all the low-frequency receiving radio-frequency integrated circuit chips through the second conductive through holes and the second conductive structures.

In an embodiment of the present invention, each of the rf radiating structures includes a first antenna layer and a second antenna layer. The first antenna layer is arranged at the bottom of the multi-layer conductive wiring substrate, and the second antenna layer is embedded between two dielectric layers closest to the bottom of the multi-layer conductive wiring substrate and is electrically connected with the first conductive through hole and the second conductive through hole.

In an embodiment of the present invention, the first antenna layer includes four first transmitting antenna blocks and four first receiving antenna blocks, and the second antenna layer includes four second transmitting antenna blocks and four second receiving antenna blocks. All the first transmitting antenna blocks are respectively positioned right below all the second transmitting antenna blocks, and all the first receiving antenna blocks are respectively positioned right below all the second receiving antenna blocks. All the second transmitting antenna blocks are electrically connected with the corresponding first conductive structures and the high-frequency transmitting radio-frequency integrated circuit chip through the first conductive through holes. All the second receiving antenna blocks are electrically connected with the corresponding second conductive structures and the low-frequency receiving radio frequency integrated circuit chip through the second conductive holes. All the first transmitting antenna blocks and all the second transmitting antenna blocks are used for transmitting the first radio frequency signals, and all the first receiving transmitting antenna blocks and all the second receiving antenna blocks are used for receiving the second radio frequency signals.

In an embodiment of the present invention, all first transmitting antenna blocks of the radio frequency radiation structure are arranged as a first square matrix, all first receiving antenna blocks of the radio frequency radiation structure are arranged as a second square matrix, and a plurality of rows of the first square matrix and a plurality of rows of the second square matrix are alternately arranged.

Based on the above, the array radio frequency system embeds a plurality of radio frequency package radiation structures on a mother circuit carrier board in a horizontal layout, so as to simplify the complexity of the system and reduce the manufacturing cost, and increase the stability of the antenna characteristics and the application expansion of the product, as if the mainstream automobile adopts a common chassis. The array type radio frequency system has a reconfigurable structure so as to generate different radio frequency power corresponding to different application situations. When the array radio frequency system has an abnormal problem, part of the radio frequency packaging radiation structure can be replaced to quickly detect the fault problem, and the damage of the whole radio frequency system caused by the failure of one module is avoided, so that the maintenance cost is reduced. The radio frequency packaging radiation structure is a module formed by radio frequency and an antenna, and the main functions of the system such as signal transmission, power supply, lifting of radio frequency signals and the like are the mother circuit carrier plate. Therefore, the design of the radio frequency packaging radiation structure emphasizes the radio frequency and antenna co-constructed module which is modularized, has the main advantages of mass production convenience and maintenance replacement. The mother circuit carrier plate emphasizes the expansibility of the system, including the size of the array antenna, the expansion of the operation voltage, the serial-parallel connection of signal transmission and the realization of a heat dissipation mechanism. The array type radio frequency system uses a universal interface to improve the sharing property of the system, and the interface of the radio frequency packaging radiation structure and the mother circuit carrier plate is integrated to form an air channel to conduct heat and emit heat so as to reduce the system influence of heat energy and give consideration to mechanical and electronic characteristics.

Drawings

Fig. 1 is a structural cross-sectional view of a portion of a radio frequency package radiating structure in accordance with an embodiment of the present invention.

Fig. 2 is a top view of a radio frequency package radiating structure according to an embodiment of the present invention.

Fig. 3 is a bottom view of a radio frequency package radiating structure according to an embodiment of the present invention.

Fig. 4 is a top view of a mother circuit carrier in accordance with an embodiment of the present invention.

Fig. 5 is a circuit block diagram corresponding to a radio frequency package radiating structure according to an embodiment of the present invention.

Fig. 6 is a circuit block diagram corresponding to a radio frequency package radiating structure according to an embodiment of the present invention.

Fig. 7 is a circuit block diagram corresponding to a mother circuit carrier according to an embodiment of the invention.

Fig. 8 is a circuit block diagram corresponding to a mother circuit carrier according to an embodiment of the invention.

Reference numerals illustrate:

1 is a radio frequency package radiation structure

10 is a multilayer conductive wiring substrate

100 is a dielectric layer

101 are conductive traces

102 is a first conductive via

103 is a second conductive via

104 is a power divider

11 is a radio frequency radiating structure

Reference numeral 110 denotes a first antenna layer

1100 is a first transmit antenna block

1101 is a first receive antenna block

Reference numeral 111 denotes a second antenna layer

1110 is a second transmit antenna block

1111 is the second receiving antenna block

12 is a high frequency transmitting radio frequency integrated circuit chip

Reference numeral 13 denotes a low frequency receiving radio frequency integrated circuit chip

14 is a first conductive structure

15 is a second conductive structure

Reference numeral 16 denotes a transmit signal port

Reference numeral 17 denotes a receiving signal port

18 is a first power port

19 is a second power port

2 is a mother circuit carrier plate

200 is a dielectric plate

201 is an intermediate frequency input port

202 is a first power splitter

Reference numeral 203 denotes an up converter

204 is a second power divider

205 is a third power divider

206 is a down converter

Reference numeral 207 denotes a fourth power divider

Reference numeral 208 denotes an intermediate frequency output port

Reference numeral 209 is a first signal port

Reference numeral 210 denotes a second signal port

211 is a first power supply port

212 is a second power supply port

H is a horizontally polarized signal

V is a vertically polarized signal

IM is input intermediate frequency signal

H1 is a first high-frequency signal

R1 is a first radio frequency signal

R2 is a second radio frequency signal

H2 is a second high-frequency signal

OM is the output intermediate frequency signal

M1 is a first intermediate frequency signal

U is an up-conversion signal

TH is the sum high frequency signal

M2 is a second intermediate frequency signal

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

When an element is referred to as being "on …," it can be broadly interpreted as referring to the elements as being directly on the other element or intervening elements may be present. Conversely, when one component is referred to as being "directly on" another component, it cannot have other components in between. As used herein, the term "and/or" includes any combination of one or more of the listed associated items.

The following description of "one embodiment" or "an embodiment" refers to a particular component, structure, or feature associated with at least one embodiment. Thus, the appearances of the phrase "one embodiment" or "an embodiment" in various places in the following are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, and characteristics of one or more embodiments may be combined in any suitable manner.

The present invention is described with respect to the following examples which are intended to be illustrative only, since various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Throughout the specification and claims, unless the context clearly dictates otherwise, the meaning of "a" and "an" includes such recitation as "one or at least one" of the stated elements or components. Furthermore, as used in this application, the singular articles also include a recitation of a plurality of components or elements unless it is apparent from the specific context that the plural is excluded. Moreover, as used in this description and throughout the claims that follow, the meaning of "in" may include "in" and "on" unless the context clearly dictates otherwise. The term "as used throughout the specification and claims" is used in its ordinary sense in the present application and in the claims unless otherwise indicated herein, as commonly understood in the art to which each term pertains. Certain terms used to describe the present invention will be discussed below or elsewhere in this specification to provide additional guidance to the practitioner (practioner) in describing the present invention. The use of examples anywhere in the specification including any examples of words discussed herein is illustrative only and certainly not limiting of the scope and meaning of the invention or any exemplary words. As such, the present invention is not limited to the various embodiments set forth in the specification.

Furthermore, the term "electrically coupled" or "electrically connected" as used herein includes any direct or indirect electrical connection. For example, if a first device is electrically coupled to a second device, that connection may be made directly to the second device or indirectly to the second device through other devices or connection means. In addition, if the transmission and provision of electrical signals are described, those skilled in the art will understand that the transmission of electrical signals may be accompanied by attenuation or other non-ideal changes, but the source and the receiving end of the transmission or provision of electrical signals are regarded as substantially the same signal unless otherwise indicated. For example, if an electrical signal S is transmitted (or provided) from terminal a of the electronic circuit to terminal B of the electronic circuit, a voltage drop may occur through the source/drain of a transistor switch and/or the possible stray capacitance, but the purpose of this design is to achieve certain specific technical effects if attenuation or other non-ideal changes in transmission (or provision) are not intended, the electrical signal S should be considered to be substantially the same signal at terminal a and terminal B of the electronic circuit.

Unless specifically stated otherwise, some terms or words such as "can", "possible", "about", "may", "about", or "may" are generally intended to mean that an embodiment of the present invention has, but may also be construed as an unnecessary feature, element, or step. In other embodiments, these features, components, or steps may not be required.

It will be understood that the terms "include," "comprises," "including," "has," "contains," "containing," "includes," "having," "contains," "with" and the like, as used herein, are open-ended, i.e., are meant to include, but not be limited to. Furthermore, not all of the objects, advantages, or features of the disclosure are required to be achieved by any one embodiment of the invention or the scope of the claims. Furthermore, the Abstract is provided solely for the purposes of facilitating the retrieval of a patent document and is not intended to limit the scope of the present invention.

The following provides a radio frequency package radiation structure, which uses a multi-layer conductive wiring substrate to construct a plurality of input/output ports, wherein different frequency bands and different polarization directions respectively correspond to different input/output ports, and the different input/output ports are respectively connected with different antenna blocks so as to perform independent operation and reduce the dependence on a duplexer and a circulator. In addition, the transmitting antenna blocks and the receiving antenna blocks are arranged in a staggered mode, and isolation is improved through physical isolation, so that cross polarization is reduced. The radio frequency packaging radiation structure can meet the requirements of the upper chain, the lower chain and the 5G Frequency Range (FR) 2 of a low-orbit satellite on double frequencies, can be used for constructing bilinear or double circular polarization radiation requirements according to various application requirements, and meets the high gain and the antenna characteristics required by intelligent scanning when an array antenna is constructed.

Fig. 1 is a structural cross-sectional view of a portion of a radio frequency package radiation structure according to an embodiment of the present invention, fig. 2 is a top view of the radio frequency package radiation structure according to an embodiment of the present invention, and fig. 3 is a bottom view of the radio frequency package radiation structure according to an embodiment of the present invention. Referring to fig. 1, 2 and 3, an embodiment of a radio frequency package radiation structure 1 of the present invention is described below. The rf package radiation structure 1 includes a multi-layer conductive wiring substrate 10, a plurality of rf radiation structures 11, a plurality of rf transmission rf integrated circuit chips 12, a plurality of rf reception rf integrated circuit chips 13, a first conductive structure 14 and a second conductive structure 15. The first conductive structure 14 and the second conductive structure 15 may be, but are not limited to, conductive solder balls. The multilayer conductive wiring substrate 10 includes a multilayer dielectric layer 100, a conductive trace 101, a first conductive via 102 and a second conductive via 103, wherein the conductive trace 101 is electrically connected to the first conductive via 102 and the second conductive via 103. All the radio frequency radiation structures 11 are arranged at the bottom of the multilayer conductive wiring substrate 10 and are embedded in the multilayer conductive wiring substrate 10. All the high-frequency transmitting rf integrated circuit chips 12 and all the low-frequency receiving rf integrated circuit chips 13 are disposed on top of the multi-layer conductive wiring substrate 10, wherein all the high-frequency transmitting rf integrated circuit chips 12 are electrically connected to the first conductive vias 102 through the first conductive structures 14 to thereby electrically connect all the rf radiating structures 11 respectively, and all the low-frequency receiving rf integrated circuit chips 13 are electrically connected to the second conductive vias 103 through the second conductive structures 15 to thereby electrically connect all the rf radiating structures 11 respectively.

In some embodiments of the present invention, each rf radiating structure 11 may include a first antenna layer 110 and a second antenna layer 111. The first antenna layer 110 is disposed at the bottom of the multi-layer conductive wiring substrate 10, and the second antenna layer 111 is embedded between the two dielectric layers 100 closest to the bottom of the multi-layer conductive wiring substrate 10 and electrically connects the first conductive via 102 and the second conductive via 103.

Specifically, the first antenna layer 110 may include four first transmit antenna blocks 1100 and four first receive antenna blocks 1101, and the second antenna layer 111 may include four second transmit antenna blocks 1110 and four second receive antenna blocks 1111. All of the first transmit antenna blocks 1100, all of the first receive antenna blocks 1101, all of the second transmit antenna blocks 1110, and all of the second receive antenna blocks 1111 may be, but are not limited to, rectangular. All first transmit antenna blocks 1100 are located directly below all second transmit antenna blocks 1110, respectively, and all first receive antenna blocks 1101 are located directly below all second receive antenna blocks 1111, respectively. All the second transmitting antenna blocks 1110 are electrically connected to their corresponding first conductive structures 14 and the rf-transmitting ic chip 12 through the first conductive vias 102, and all the second receiving antenna blocks 1111 are electrically connected to their corresponding second conductive structures 15 and the rf-receiving ic chip 13 through the second conductive vias 15. For example, the first conductive vias 102 corresponding to one rf-transmitting ic chip 12 can be divided into four groups, and each group of the first conductive vias 102 further includes two sets of sub vias for respectively transmitting the high-frequency horizontal polarization signal H and the high-frequency vertical polarization signal V. Each group of first conductive vias 102 is electrically connected to the same second transmit antenna block 1110. The second conductive vias 103 corresponding to one low-frequency receiving rf ic chip 13 may be divided into four groups, and each group of the second conductive vias 103 further includes two groups of sub vias for respectively transmitting the low-frequency horizontal polarization signal H and the low-frequency vertical polarization signal V. Each group of second conductive vias 103 is electrically connected to the same second receiving antenna block 1111. Each group of sub-vias is regarded as an independent I/O port, which can operate independently to reduce the interference of frequency isolation and the dependence on the diplexer and the circulator.

All the first transmitting antenna blocks 1100 of all the radio frequency radiating structures 11 are arranged in a first square matrix, all the first receiving antenna blocks 1101 of all the radio frequency radiating structures 11 are arranged in a second square matrix, a plurality of rows of the first square matrix and a plurality of rows of the second square matrix are alternately arranged, and a plurality of columns of the first square matrix and a plurality of columns of the second square matrix are alternately arranged. Therefore, the first square matrix and the second square matrix are arranged in a staggered way, and the isolation degree is improved by physical isolation so as to reduce the generation of cross polarization.

A transmit signal port 16 and a receive signal port 17 may be provided on top of the multilayer conductive wiring substrate 10. The transmit signal port 16 and the receive signal port 17 may be, but are not limited to, ultra-small Push-on Micro (SMPM) ports. The transmit signal port 16 is electrically connected to all of the high frequency transmit rf integrated circuit chips 12 by conductive traces 101 with the first conductive structure 14. The receiving signal port 17 is electrically connected to all of the low frequency receiving rf integrated circuit chips 13 through the conductive trace 101 and the second conductive structure 15. The top of the multi-layer conductive wiring substrate 10 may further be provided with a first power port 18 and a second power port 19. The first power port 18 and the second power port 19 may be, but are not limited to, a serial peripheral interface (SerialPeripheralInterfaceBus, SPI). The first power port 18 is electrically connected to all the rf-transmitting rf-integrated circuit chips 12 through the first conductive via 102 and the first conductive structure 14, and the second power port 19 is electrically connected to all the rf-receiving rf-integrated circuit chips 13 through the second conductive via 103 and the second conductive structure 15. The following provides an array type radio frequency system, which embeds a plurality of radio frequency package radiation structures on a mother circuit carrier board in a horizontal layout, so as to simplify the complexity of the system and reduce the manufacturing cost, and increase the stability of the antenna characteristics and the application expansion of the product, as if the main stream automobile adopts a common chassis. The array type radio frequency system has a reconfigurable structure so as to generate different radio frequency power corresponding to different application situations. When the array radio frequency system has abnormal problems, part of the radio frequency packaging radiation structure can be replaced to quickly detect the fault problem, and the damage of the whole radio frequency system caused by the failure of one module is avoided, so that the maintenance cost is reduced. The radio frequency packaging radiation structure is a module formed by radio frequency and an antenna, and the main functions of the system such as signal transmission, power supply, lifting of radio frequency signals and the like are taken as a mother circuit carrier plate. Therefore, the design of the radio frequency packaging radiation structure emphasizes the radio frequency and antenna co-constructed module which is modularized, has the main advantages of mass production convenience and maintenance replacement. The mother circuit carrier plate emphasizes the expansibility of the system, including the size of the array antenna, the expansion of the operation voltage, the serial-parallel connection of signal transmission and the realization of a heat dissipation mechanism. The array type radio frequency system uses a universal interface to promote the sharing of the system, and the interface of the radio frequency packaging radiation structure and the mother circuit carrier board is integrated to form an air channel to conduct heat and emit heat so as to reduce the system influence of heat energy and give consideration to mechanical and electronic characteristics.

Fig. 4 is a top view of a mother circuit carrier in accordance with an embodiment of the present invention. Referring to fig. 4 and 2, an embodiment of the array rf system is described below. The array type radio frequency system comprises a mother circuit carrier plate 2 and a plurality of radio frequency package radiation structures 1. All the radio frequency package radiation structures 1 are embedded on the mother circuit carrier plate 2 in a horizontal layout and are arranged into an array, and are electrically connected with the mother circuit carrier plate 2. All the radio frequency package radiation structures 1 are divided into a plurality of radio frequency radiation module groups. Taking fig. 4 as an example, all the rf package radiating structures 1 are arranged in a 4×4 array, and each rf radiating module group includes four rf package radiating structures 1 in each row of the array.

Fig. 5 and fig. 6 are circuit block diagrams corresponding to a radiation structure of a radio frequency package according to an embodiment of the present invention, and fig. 7 and fig. 8 are circuit block diagrams corresponding to a mother circuit carrier according to an embodiment of the present invention. Please refer to fig. 2, fig. 4, fig. 5, fig. 6, fig. 7 and fig. 8. In operation, the mother circuit carrier 2 receives an input intermediate frequency signal IM and up-converts the input intermediate frequency signal IM to thereby generate a plurality of first high frequency signals H1. The multi-layer conductive wiring substrate 10 of each radio frequency package radiation structure 1 is provided with a power divider 104, and the power divider 104 is used for dividing or summing the power of the high frequency signals. All the rf module groups of all the rf package radiating structures 1 respectively receive all the first high-frequency signals H1, and accordingly transmit a plurality of the first rf signals R1. All the radio frequency radiation module groups of all the radio frequency package radiation structures 1 receive a plurality of second radio frequency signals R2, so as to respectively generate a plurality of second high frequency signals H2 corresponding to all the radio frequency radiation module groups, and the mother circuit carrier board 2 performs frequency down conversion on all the second high frequency signals H2, so as to generate an output intermediate frequency signal OM.

In some embodiments of the present invention, the mother circuit carrier 2 may include a dielectric board 200, an intermediate frequency input port 201, a first power divider 202, a plurality of frequency up-converters 203, a plurality of second power dividers 204, a plurality of third power dividers 205, a plurality of frequency down-converters 206, a fourth power divider 207, an intermediate frequency output port 208, a plurality of first signal ports 209, a plurality of second signal ports 210, a plurality of first power supply ports 211, and a plurality of second power supply ports 212. All of the first signal ports 209 and all of the second signal ports 210 may be, but are not limited to, ultra-small Push-on Micro (SMPM) ports. All of the first power ports 211 and all of the second power ports 212 may be, but are not limited to, serial peripheral interfaces (Serial Peripheral Interface Bus, SPIs). The intermediate frequency input port 201 and the intermediate frequency output port 208 may be, but are not limited to, a Sub-Miniature A (SMA) port.

The dielectric board 200 is provided with all the rf package radiating structures 1, the intermediate frequency input ports 201, the first power dividers 202, all the upconverters 203, all the second power dividers 204, all the third power dividers 205, all the downconverters 206, the fourth power dividers 207, the intermediate frequency output ports 208, all the first signal ports 209, all the second signal ports 210, all the first power supply ports 211 and all the second power supply ports 212. The first power divider 202 is electrically connected to the intermediate frequency input port 201, all the frequency up-converters 203 are electrically connected to the plurality of output ends of the first power divider 202, and all the second power dividers 204 are electrically connected to all the frequency up-converters 203 and all the rf radiation module groups of all the rf package radiation structures 1. All third power dividers 205 are electrically connected to all rf module groups of all rf package radiating structures, all frequency dividers 206 are electrically connected to all third power dividers 205, and fourth power divider 207 is electrically connected to all frequency dividers 206, and intermediate frequency output port 208 is electrically connected to fourth power divider 207.

The first power divider 202 receives the input intermediate frequency signal IM through the intermediate frequency input port 201, and divides the power of the input intermediate frequency signal IM according to the number of all the output terminals of the first power divider 202, so as to generate a plurality of first intermediate frequency signals M1 at all the output terminals of the first power divider 202. All the upconverters 203 receive and upconvert all the first intermediate frequency signals M1 to generate a plurality of upconverted signals U. Each second power divider 204 receives the corresponding up-conversion signal U, and distributes the corresponding up-conversion signal U according to the number of the plurality of output terminals of the second power divider 204 to generate the first high-frequency signal H1.

Each third power divider 205 receives its corresponding second high frequency signal H2 and sums the power of the corresponding second high frequency signal H2 to generate a sum total high frequency signal TH. All downconverters 206 receive their respective summed high frequency signals TH and downconvert them to produce a plurality of second intermediate frequency signals M2. The fourth power divider 207 receives all the second intermediate frequency signals M2 and sums up the power of all the second intermediate frequency signals M2 to generate the output intermediate frequency signal OM. The intermediate frequency output port 208 is used for outputting the output intermediate frequency signal OM.

All the first signal ports 209 are divided into a plurality of first groups, all the first groups are electrically connected to all the second power dividers 204 respectively, and all the transmitting signal ports 16 of the rf radiation module groups are electrically connected respectively, and each first group is electrically connected between its corresponding second power divider 204 and the transmitting signal port 16 of the rf radiation module group. All the second signal ports 210 are divided into a plurality of second groups, all the second groups are respectively and electrically connected to all the third power dividers 205, and are respectively and electrically connected to the receiving signal ports 17 of all the rf radiation module groups, and each second group is electrically connected between its corresponding third power divider 205 and the receiving signal port 17 of the rf radiation module group. In addition, all the first power supply ports 211 are electrically connected to the first power supply ports 18 of all the rf package radiating structures 1, and all the second power supply ports 212 are electrically connected to the second power supply ports 19 of all the rf package radiating structures 1.

Since the plurality of radio frequency package radiation structures 1 are embedded on the mother circuit carrier 2 in a horizontal layout, the system complexity can be simplified, the manufacturing cost can be reduced, and the stability of the antenna characteristic and the application expansion of the product can be increased. The array type radio frequency system has a reconfigurable structure so as to generate different radio frequency power corresponding to different application situations. When the array type radio frequency system has an abnormal problem, part of the radio frequency packaging radiation structure 1 can be replaced to quickly detect the fault problem, and the damage of the whole radio frequency system caused by the failure of one module is avoided, so that the maintenance cost is reduced. The interface of the radio frequency package radiation structure 1 and the mother circuit carrier board 2 forms an air channel to conduct heat and radiate heat so as to reduce the system influence of heat energy and give consideration to mechanical and electronic characteristics.

Please refer to fig. 1, fig. 5 and fig. 6. The power distributor 104 of the multilayer conductive wiring substrate 10 and the high-frequency transmitting radio frequency integrated circuit chip 12 receive the first high-frequency signal H1, and accordingly transmit the first radio frequency signal R1 through the radio frequency radiating structure 11. The power divider 104 of the multi-layer conductive wiring substrate 10 and the low frequency receiving rf integrated circuit chip 13 receive the second rf signal R2 through the rf radiating structure 11, and thereby generate a second high frequency signal H2. The first transmitting antenna block 1100 and the second transmitting antenna block 1110 are used for transmitting the first rf signal R1, and the first receiving transmitting antenna block 1101 and the second receiving antenna block 1111 are used for receiving the second rf signal R2.

According to the embodiment, the array type radio frequency system simplifies the system complexity, reduces the manufacturing cost and the maintenance cost, increases the stability of the antenna characteristic and the application expansion of the product, reduces the system influence of heat energy, and combines the mechanical and electronic characteristics.

The foregoing description of the preferred embodiment of the present invention is not intended to limit the scope of the invention, but rather to cover all equivalent variations and modifications in shape, construction, characteristics and spirit according to the scope of the present invention as defined in the appended claims.

Claims (11)

1. An array radio frequency system, comprising:

the mother circuit carrier board is used for receiving an input intermediate frequency signal and carrying out frequency up conversion on the input intermediate frequency signal so as to generate a plurality of first high frequency signals; and

the plurality of radio frequency package radiation structures are embedded on the mother circuit carrier plate in a horizontal layout and are arranged into an array and are electrically connected with the mother circuit carrier plate, wherein the plurality of radio frequency package radiation structures are divided into a plurality of radio frequency radiation module groups, the plurality of radio frequency radiation module groups of the plurality of radio frequency package radiation structures are used for respectively receiving a plurality of first radio frequency signals and transmitting a plurality of first radio frequency signals according to the first radio frequency signals, the plurality of radio frequency radiation module groups of the plurality of radio frequency package radiation structures are used for receiving a plurality of second radio frequency signals so as to respectively generate a plurality of second high frequency signals for the plurality of radio frequency radiation module groups, and the mother circuit carrier plate is used for carrying out frequency reduction on the plurality of second high frequency signals so as to generate an output intermediate frequency signal.

2. The array radio frequency system of claim 1, wherein the mother circuit carrier comprises:

a dielectric plate provided with the plurality of radio frequency package radiation structures;

an intermediate frequency input port arranged on the dielectric plate;

the first power distributor is arranged on the dielectric plate and is electrically connected with the intermediate frequency input port, wherein the first power distributor is used for receiving the input intermediate frequency signal through the intermediate frequency input port and distributing the power of the input intermediate frequency signal according to the number of a plurality of output ends of the first power distributor so as to generate a plurality of first intermediate frequency signals at the plurality of output ends of the first power distributor;

the frequency boosters are arranged on the dielectric plate and are respectively and electrically connected with the output ends of the first power distributor, and the frequency boosters are used for receiving the first intermediate frequency signals and frequency-boosting the first intermediate frequency signals so as to generate frequency-boosting signals; and

the second power distributors are arranged on the dielectric plate and are respectively and electrically connected with the frequency boosters and the radio frequency radiation module groups of the radio frequency package radiation structures, wherein each second power distributor is used for receiving the corresponding frequency boost signals and distributing the corresponding frequency boost signals according to the number of the output ends of the second power distributor so as to generate the first high-frequency signals.

3. The array radio frequency system of claim 2, wherein the mother circuit carrier further comprises:

the third power distributors are arranged on the dielectric plate and are respectively and electrically connected with the plurality of radio frequency radiation module groups of the radio frequency package radiation structures, wherein each third power distributor is used for receiving the corresponding second high-frequency signals and summing the power of the corresponding second high-frequency signals so as to generate a summed total-frequency signal;

the frequency dividers are arranged on the dielectric plate and are respectively and electrically connected with the third power distributors, wherein the frequency dividers are used for receiving the corresponding summation high-frequency signals and frequency-dividing the summation high-frequency signals so as to generate a plurality of second intermediate-frequency signals;

the fourth power distributor is arranged on the dielectric plate and is electrically connected with the plurality of frequency reducers, wherein the fourth power distributor is used for receiving the plurality of second intermediate frequency signals and summing the power of the plurality of second intermediate frequency signals so as to generate the output intermediate frequency signals; and

and the intermediate frequency output port is arranged on the dielectric plate and is electrically connected with the fourth power distributor, wherein the intermediate frequency output port is used for outputting the output intermediate frequency signal.

4. The array radio frequency system of claim 3, wherein the mother circuit carrier further comprises:

the first signal ports are arranged on the dielectric plate and are divided into a plurality of first groups, the plurality of first groups are respectively and electrically connected with the plurality of second power distributors and the plurality of radio frequency radiation module groups, and each first group is electrically connected between the corresponding second power distributor and the radio frequency radiation module group; and

the second signal ports are arranged on the dielectric plate and are divided into a plurality of second groups, the second groups are respectively and electrically connected with the third power distributors and the radio frequency radiation module groups, and each second group is electrically connected between the corresponding third power distributor and the radio frequency radiation module group.

5. The array radio frequency system of claim 4, wherein the plurality of first signal ports and the plurality of second signal ports are microminiature push-in microport.

6. The array radio frequency system of claim 4, wherein the mother circuit carrier further comprises a plurality of first power ports and a plurality of second power ports disposed on the dielectric plate.

7. The array radio frequency system of claim 6, wherein the first plurality of power ports and the second plurality of power ports are serial peripheral interfaces.

8. The array radio frequency system of claim 1, wherein each of the radio frequency package radiating structures comprises:

a multilayer conductive wiring substrate comprising a multilayer dielectric layer, a conductive trace, a first conductive via and a second conductive via, wherein the conductive trace is electrically connected to the first conductive via and the second conductive via;

the radio frequency radiation structures are arranged at the bottom of the multilayer conductive wiring substrate and are embedded in the multilayer conductive wiring substrate;

the high-frequency transmitting radio frequency integrated circuit chips are electrically connected with the first conductive through holes through first conductive structures so as to be electrically connected with the radio frequency radiation structures respectively, and the low-frequency receiving radio frequency integrated circuit chips are electrically connected with the second conductive through holes through second conductive structures so as to be electrically connected with the radio frequency radiation structures respectively; and

a transmitting signal port and a receiving signal port, which are arranged on the top of the multilayer conductive wiring substrate and electrically connected with the mother circuit carrier, wherein the transmitting signal port is electrically connected with the plurality of high-frequency transmitting radio-frequency integrated circuit chips through the conductive trace and the first conductive structure, and the receiving signal port is electrically connected with the plurality of low-frequency receiving radio-frequency integrated circuit chips through the conductive trace and the second conductive structure;

the multi-layer conductive wiring substrate and the plurality of high-frequency emission radio frequency integrated circuit chips are used for receiving the first high-frequency signals and emitting the first radio frequency signals through the plurality of radio frequency radiation structures according to the first high-frequency signals;

the multi-layer conductive wiring substrate and the plurality of low frequency receiving radio frequency integrated circuit chips are used for receiving the second radio frequency signals through the plurality of radio frequency radiation structures and generating the second high frequency signals.

9. The array rf system of claim 8, wherein each of the rf package radiating structures further includes a first power port and a second power port, the first power port and the second power port being disposed on the top of the multilayer conductive wiring substrate and electrically connected to the mother circuit carrier, the first power port being electrically connected to the plurality of rf-transmitting integrated circuit chips through the first conductive via and the first conductive structure, and the second power port being electrically connected to the plurality of rf-receiving integrated circuit chips through the second conductive via and the second conductive structure.

10. The array radio frequency system of claim 8, wherein each of the radio frequency radiating structures comprises:

a first antenna layer arranged at the bottom of the multilayer conductive wiring substrate; and

and the second antenna layer is embedded between the two dielectric layers closest to the bottom of the multilayer conductive wiring substrate and is electrically connected with the first conductive through hole and the second conductive through hole.

11. The array rf system of claim 10 wherein the first antenna layer includes four first transmit antenna blocks and four first receive antenna blocks, the second antenna layer includes four second transmit antenna blocks and four second receive antenna blocks, the first transmit antenna blocks are respectively located directly below the second transmit antenna blocks, the first receive antenna blocks are respectively located directly below the second receive antenna blocks, the second transmit antenna blocks are electrically connected to their corresponding first conductive structures and the rf ic chip through the first conductive vias, the second receive antenna blocks are electrically connected to their corresponding second conductive structures and the rf ic chip through the second conductive vias, the first transmit antenna blocks and the second transmit antenna blocks are used to transmit the first rf signals, and the first receive antenna blocks and the second receive antenna blocks are used to receive the rf signals.