CN108987942B - Surface-mounted flat active phased-array antenna system architecture - Google Patents
Surface-mounted flat active phased-array antenna system architecture Download PDFInfo
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- CN108987942B CN108987942B CN201810683104.5A CN201810683104A CN108987942B CN 108987942 B CN108987942 B CN 108987942B CN 201810683104 A CN201810683104 A CN 201810683104A CN 108987942 B CN108987942 B CN 108987942B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
Abstract
The invention discloses a surface-mounted flat active phased array antenna system architecture, and aims to provide an antenna system architecture which integrates in the longitudinal dimension and the transverse dimension simultaneously so as to realize low profile, light weight and low cost of an active phased array antenna. The invention is realized by the following technical scheme: in the transverse dimension, an antenna array surface layer, a low-frequency power supply, a control function layer, a beam forming network layer and a device surface-mounted conversion layer in the multifunctional motherboard are subjected to digital-analog mixed integration and distribution in different areas by a multilayer digital-analog mixed-voltage printed board technology, and a radio frequency active chip, an electronic component, a microsystem packaging T/R assembly and possible passive elements are integrated in the same package and are integrated in an SIP package tube shell by a system-in-package SIP technology; in the longitudinal dimension, the following are formed from top to bottom in sequence: the antenna system comprises an antenna array surface layer, a low-frequency power supply and control layer, a beam forming network layer, a device surface-mounted conversion layer, a microsystem packaging T/R assembly and an antenna system framework of a heat dissipation structural member.
Description
Technical Field
The invention relates to a surface-mounted type flat active phased array antenna system framework which can be applied to the technical field of radar and communication active phased array antennas.
Background
In recent years, phased array antennas have received much attention as an important development in civil and military antenna technology. The radiating element of a phased array antenna is an array antenna formed by arranging a plurality of radiating elements. Phased array antennas come in many forms, such as linear, planar, circular, cylindrical, spherical, and conformal arrays. The active phased array antenna has the characteristics of free and flexible beam forming, rapid electric scanning speed, capability of simultaneously tracking and monitoring multiple targets and the like, so that the active phased array antenna is widely applied, and the key point for improving the performance of the active phased array antenna is to fully exert the characteristics and the application potential of the active phased array antenna. The development of the high-density integrated active phased-array antenna extends from a microwave frequency band to a millimeter wave frequency band and a THz frequency band; the working bandwidth will develop towards the directions of multiband, broadband and ultra-wideband; the functions will develop towards multifunction, low RCS, digitalization and intellectualization; the volume will move forward to the miniaturization, integration, conformality and scale; phased array technology is gradually fusing other disciplines, not only has the electric function, still possesses the effect that the structure bore, has gradually developed to subsystem, major system direction by single extension. In addition, the microwave circuit assembly interconnection technology has undergone the development from discrete circuits to hybrid integrated circuits (HMIC), to Monolithic Microwave Integrated Circuits (MMIC), to microwave multi-chip modules (MMCM), and to three-dimensional microwave multi-chip modules (3D-MMCM), which has promoted the development of active phased array antennas toward higher frequency bands, smaller size, and better performance. An active phased array antenna array structure relates to the layout of electric properties and structures such as radiation units, array synthesis, T/R components, power distribution networks, beam control, power supplies and the like. The key device in the active phased array antenna is a transmitting/receiving assembly (T/R assembly), the number and the arrangement of the T/R assemblies in the antenna array are compact and have high density, the arrangement interval of the T/R assemblies is only about half of the wavelength, so that the heat flow density of an antenna array surface is high, meanwhile, the heat productivity of the T/R assemblies is very large, the heat dissipation space is small, the heat flow density of a unit area is increased sharply, if the heat cannot be taken away from the antenna array surface in time, the temperature of the antenna array surface is increased rapidly, and the amplification performance of a high-power amplification chip in the T/R assembly is deteriorated sharply and even burnt; on the other hand, the phase of the amplified signal of the high-power amplification chip can drift along with the temperature change, and the phase difference of the output signal of the high-power amplification chip can affect the beam space synthesis performance of the antenna, so that the overall performance of the antenna is reduced and even fails, and the performance of the whole circuit system is affected.
The composition of the T/R module is not exactly the same for different applications at different wavebands. The main functional circuits are: the power amplifier, LNA, phase shifter, attenuator, receiving and transmitting switch, current converter, amplitude limiter, filter, control logic circuit and driver, monitor protection circuit, and some functional circuits. Due to the components manufactured according to the existing LTCC technology and devices, their individual channel size has almost reached its limit. According to the internal circuit arrangement mode of the T/R component, the active phased array antenna is mainly divided into: a longitudinally arranged "brick" structure and a transversely arranged "tile" structure. The active phased array antennas with the two architectures are based on the idea of modularization, functional circuits such as an antenna array surface, a T/R component, a beam forming network, an up-down frequency conversion channel, a beam control, a power supply and the like are separated into independent modules, and the modules are electrically interconnected through high-low frequency connectors; in addition, in order to maintain the structural strength, each module needs a separate structural member to shield and protect the internal circuit; finally, in terms of production and assembly, the design method of independent modularization needs to be assembled twice at a module level and a complete machine level. In addition, the placement direction of components of the tile-type phased array antenna structure is parallel to the aperture of the array surface of the phased array antenna, the sub-array circuit adopts a Transverse Integrated Longitudinal Assembly (TILA) mode, MMICs are distributed in a plane parallel to the aperture surface of the antenna, and the phased array is formed through longitudinal stacking assembly. The antenna unit is manufactured on the first layer of medium, the MMIC is arranged in the middle layer, and the distributed feed network is distributed in the lower layer. The radiation array element adopts a low-profile microstrip patch antenna which is easy to integrate, although the integration level is higher than that of a brick structure, the volume is small, the cost is low, the integration density and the packaging efficiency are low, and the longitudinal size is larger. Meanwhile, because the space of the antenna is small, the connection is difficult to realize in a general screw installation mode, and although the connection can be realized by matching with mature welding and other processes, because a plurality of welding devices are complex, the installation sequence and the temperature gradient need to be designed reasonably for realizing step welding, which is one of the design difficulties. Therefore, the existing brick and tile type structure active phased array antenna based on the modular design method has the defects of high section height, heavy weight, high cost, low production efficiency and complex process.
Disclosure of Invention
The invention aims to provide a surface-mounted flat active phased array antenna system framework which is designed by integrating an active phased array antenna in the longitudinal dimension and the transverse dimension simultaneously, so as to realize low profile, light weight and low cost of the active phased array antenna, aiming at the basic characteristics and the defects of the active phased array antenna, in particular to the defects of high profile height, heavy weight, high cost, low production efficiency and complex process of the existing modularized 'brick' and 'tile' type framework active phased array antenna.
The above object of the present invention can be achieved by the following measures: a surface mount planar active phased array antenna system architecture, comprising: the multifunctional motherboard integrates an antenna radiation array surface, a power distribution network, a beam control unit, a power supply and a channel, and a microsystem packaging T/R assembly and a structural heat dissipation part based on a system-in-package SIP technology, and is characterized in that: in the transverse dimension, an antenna array surface layer, a low-frequency power supply, a control function layer, a beam forming network layer and a device surface-mounted conversion layer in the multifunctional motherboard are subjected to digital-analog mixed integration and distribution in different areas by a multilayer digital-analog mixed-voltage printed board technology, and all the function areas are electrically interconnected through internal circuit wiring; the radio frequency active chip, the electronic component, the microsystem packaging T/R assembly and possible passive components are integrated in the same package to form a module with system functions, the module is integrated in an SIP packaging tube shell by a system-in-package (SIP) technology, and the module is assembled and fixed between the multifunctional motherboard and the surface-mounted flat plate of the structural heat sink in one step in a full-automatic surface-mounted welding mode; in the longitudinal dimension, the following are formed from top to bottom in sequence: the surface-mounted flat active phased array antenna system comprises an antenna array surface layer, a low-frequency power supply and control layer, a beam forming network layer, a device surface-mounted conversion layer, a microsystem packaging T/R assembly and a heat dissipation structural member.
Compared with the prior art, the invention has the following beneficial effects:
high integration level and low section. The invention breaks through the modularization design method adopted by the traditional 'brick' and 'tile' type active phased array antenna, based on the micro-system SIP packaging and multilayer digital-analog mixed-voltage printed board technology, abandons the traditional 'brick' and 'tile' type structure phased array antenna modularization design, and from the angle of the whole system structure, integrates an antenna array surface, a beam forming network, a channel, wave control and a power supply into a digital-analog mixed multifunctional motherboard, and simultaneously, based on the micro-system SIP packaging technology, completely integrates a radio frequency active chip in a T/R component into a packaging tube shell, and simultaneously, integrates and designs the active phased array antenna in the longitudinal dimension and the transverse dimension, and compared with the traditional active phased array antenna, the invention has the characteristics of high integration level and low section. According to the invention, electronic components and SIP-packaged T/R components based on a microsystem are assembled and fixed between the multifunctional motherboard and the surface-mounted flat plate of the structural heat sink in a one-time manner through a full-automatic surface-mounted welding mode, so that a longitudinal circuit structure is formed, and the structure sequentially comprises the following components from top to bottom: the antenna array surface layer, the low frequency feed, the control layer, the beam forming network layer, the device surface-mounted conversion layer, the microsystem packaging T/R component, the surface-mounted flat active phased array antenna system architecture of the heat radiation structure, the system-in-package SIP technology of the device capable of shielding the noise interference is adopted, the high-performance module formed by one or more bare chips and passive devices is packaged in a shell, the space occupation is small, the electrical performance is stable, the device has the function of a system through the layout and the connection of the device on the carrier, the carrier of the system combination is realized, and the profile height is reduced.
Light weight and low cost. The invention adopts a digital-analog mixed multifunctional motherboard to complete the processing of each functional module at one time by adopting a multilayer high-low frequency digital-analog mixed-pressing printed board technology. Each functional module in the digital-analog hybrid multifunctional motherboard realizes electrical interconnection through internal circuit wiring, has high interconnection density, small parasitic inductance, good thermal property and electrical property, realizes multi-point connection between laminated chips by short wiring, improves the data transmission speed between the chips, does not need additional connectors and metal structure cavities, reduces the height of the antenna, reduces the interconnection loss between each functional module, and saves the related cost of the antenna; the electronic components of each module and the T/R assembly packaged by the SIP based on the microsystem are assembled in a production line in a full-automatic surface-mounted mode, so that the production and manufacturing efficiency of the whole phased array antenna system can be greatly improved, and the cost of human resources is reduced. The SIP technology is utilized to optimize the system performance to the maximum extent, repeated packaging is avoided, the development period is shortened, the cost is reduced, the integration level is improved, the occupied motherboard area and the number of layers and complexity of motherboard wiring are reduced, the space utilization rate of the motherboard is improved, more functional blocks can be integrated in a limited space, the size of a Printed Circuit Board (PCB) is effectively reduced, and the packaging density is improved. The weight can be reduced by more than 50% compared to conventional IC packages.
The heat transfer performance is good. The invention directly fixes the T/R component of the micro system packaging which mainly generates heat in the phased array antenna on the metal cold plate of the structural radiating part through the screw, designs the liquid cooling runner in the metal cold plate of the structural radiating part, and improves the cooling efficiency of the T/R component through the liquid cooling mode of the micro-channel cold plate.
Drawings
Fig. 1 is an overall structure diagram of a surface-mount flat-panel active phased-array antenna according to the present invention.
Fig. 2 is a block diagram of the circuit structure in the vertical dimension of fig. 1.
Fig. 3 is a block diagram of the circuit configuration in the lateral dimension of fig. 1.
Fig. 4 is a flow chart of the manufacturing assembly of fig. 1.
Detailed Description
See fig. 1. In a preferred embodiment described below, a surface mount flat panel active phased array antenna system architecture comprises: the system-in-package type antenna comprises a multifunctional motherboard integrating an antenna radiation array face, a power distribution network, a beam control unit, a power supply and a channel, and a microsystem package T/R assembly and a structural heat dissipation member based on a system-in-package SIP technology. The multifunctional motherboard is realized by a multilayer high-low frequency digital-analog mixed-voltage printed board technology. The structure radiating piece is composed of high heat conduction materials, the multifunctional motherboard and the micro-system packaging T/R assembly are attached and fixed in a screw installation mode, and the structure radiating piece can be used for radiating and protecting and supporting the whole active phased array antenna system. In the transverse dimension, an antenna array surface layer, a low-frequency power supply, a control function layer, a beam forming network layer and a packaging carrier formed by a device surface-mounted conversion layer in the multifunctional motherboard are subjected to digital-analog mixed integration and distribution in different areas by a multilayer digital-analog mixed-voltage printed board technology, and are electrically interconnected through internal circuit wiring; active chip of radio frequency, electronic components, microsystem encapsulation T/R subassembly and possible passive component integration form the module that has the system function in same encapsulation, integrate in SIP encapsulation tube through system level packaging SIP technique, all once only assemble through full-automatic surface-mounted welding mode in addition and fix between multi-functional motherboard and the surface-mounted formula flat board of structure radiating part, in vertical dimension, form from last down to be in proper order: the surface-mounted flat active phased array antenna system comprises an antenna array surface layer, a low-frequency power supply and control layer, a beam forming network layer, a device surface-mounted conversion layer, a microsystem packaging T/R assembly and a heat dissipation structural member.
See fig. 2. The multifunctional motherboard is internally provided with an antenna array surface layer, a low-frequency feed layer, a control layer, a beam forming network layer and a device surface-mounted conversion layer, and in each functional circuit layer, each layer is separated by a metal ground for electromagnetic shielding and isolation. The antenna array surface layer is positioned on the most surface layer of the multifunctional motherboard and plays a role in receiving or radiating electromagnetic waves; the low-frequency feed and control layer is positioned below the antenna array surface layer and distributes power supply and control signals of the terminal machine to the micro-system packaging T/R assembly and the channel. The beam forming network layer is positioned between the low-frequency feed and control layer and the device surface-mounted conversion layer and can synthesize radio-frequency signals received by the antenna array surface or decompose radio-frequency signals transmitted by a channel; the device surface-mounted conversion layer is positioned on the bottommost layer of the multifunctional motherboard, leads are mounted at the bottom of the multifunctional motherboard and are connected with the microsystem packaging T/R assembly through the solder ball array packaging BGA linear array, so that impedance matching of radio-frequency signals between the microsystem packaging T/R assembly and an antenna array surface is realized, low-frequency power supply and control signals transmitted by a low-frequency feed and control layer in the multifunctional motherboard are distributed to the various system packaging T/R assemblies, and the multifunctional motherboard is electrically interconnected with the electronic components and the microsystem packaging T/R assembly in a surface-mounted mode. The microsystem packaging T/R assembly is directly fixed on a metal cold plate of a structural heat dissipation part through a screw, the heat is dissipated through liquid cooling of a micro-channel cold plate, the structural heat dissipation part is a metal cold plate provided with a liquid cooling flow channel, a coolant enters the cold plate from an inlet, the liquid cooling flow directly conducts heat to a metal cold plate heat layer through the liquid cooling flow channel of a metal cavity, and the liquid cooling flow flows out from an outlet after flowing through each heating electronic device installed on the metal cold plate to take away heat.
See fig. 3. Each functional module integrated in the multifunctional motherboard is arranged in a dielectric layer and a wire layer of transverse dimension, and a transverse circuit structure in the wire layer comprises a wave control area, a radio frequency circuit part area, a channel area and a power supply area, wherein the wave control area is responsible for analyzing a control command of a terminal machine to the phased array antenna system, controlling the working frequency and the beam pointing direction of the whole phased array system and realizing other related functions; the radio frequency circuit part area comprises an antenna array surface layer and a beam forming network layer, wherein the antenna array surface layer receives or radiates electromagnetic waves, and the beam forming network layer synthesizes radio frequency signals received by an antenna array surface and sends the radio frequency signals to a channel or decomposes the radio frequency signals transmitted by the channel; the channel region carries out up-conversion on signals sent by the terminal, pushes the signals to a beam forming network layer or receives the signals of the beam forming network layer for down-conversion, and then sends the signals to the terminal for signal processing; the power supply area supplies power to the functional areas, and the functional areas are electrically interconnected through the internal circuit routing and the via holes of the multifunctional motherboard.
See fig. 4. The production and assembly flow charts of the surface-mounted flat active phased-array antenna are respectively as follows: firstly, processing a digital-analog mixed-compression multifunctional motherboard: processing each functional module once by a multilayer high-low frequency digital-analog mixed-voltage printed board technology; secondly, surface mounting of electronic components and micro-system packaging T/R components: carrying out surface-mount assembly on the electronic component and the T/R component based on the microsystem packaging by a vacuum gas phase welding process, wherein the assembly process can realize full-automatic assembly line assembly; and finally, screwing a heat dissipation structural part: and the multifunctional motherboard which is provided with electronic components and is based on the micro-system packaging T/R assembly is screwed with a heat dissipation structural part, so that the heat dissipation and the protective support effects of the whole active phased array antenna system are realized.
The foregoing description of the present invention is provided to enable those skilled in the art to make and use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, without the use of the inventive faculty. Accordingly, the invention is not to be limited except as by the appended claims.
Claims (6)
1. A surface mount planar active phased array antenna system architecture, comprising: the multifunctional motherboard integrates an antenna radiation array surface, a power distribution network, a beam control unit, a power supply and a channel, and a microsystem packaging T/R assembly and a structural heat dissipation part based on a system-in-package SIP technology, and is characterized in that: in the transverse dimension, an antenna array surface layer, a low-frequency power supply, a control function layer, a beam forming network layer and a device surface-mounted conversion layer are arranged in a multifunctional motherboard, the antenna array surface layer is positioned on the topmost layer of the multifunctional motherboard and receives or radiates electromagnetic waves, the low-frequency feed and control function layer is positioned below the antenna array surface layer, the beam forming network layer is positioned between the low-frequency feed and control layer and the device surface-mounted conversion layer, the device surface-mounted conversion layer is positioned on the bottommost layer of the multifunctional motherboard, a lead is arranged at the bottom and is connected with a microsystem packaging T/R assembly through a solder ball array packaging BGA linear array, so that the impedance matching of radio-frequency signals between the microsystem packaging T/R assembly and an antenna array surface is realized, all functional modules integrated in the multifunctional motherboard are arranged in the dielectric layer and a lead layer in the transverse, A radio frequency circuit part area, a domain channel area and a power supply area; digital-analog mixed integration is distributed in different areas by multilayer digital-analog mixed-pressing printed board technology, and all functional areas are electrically interconnected through internal circuit wiring; the radio frequency active chip, the electronic component, the microsystem packaging T/R assembly and possible passive components are integrated in the same package to form a module with system functions, the module is integrated in an SIP packaging tube shell by a system-in-package (SIP) technology, and the module is assembled and fixed between the multifunctional motherboard and the surface-mounted flat plate of the structural heat sink in one step in a full-automatic surface-mounted welding mode; in the longitudinal dimension, the following are formed from top to bottom in sequence: the antenna system comprises an antenna array surface layer, a low-frequency power supply and control layer, a beam forming network layer, a device surface-mounted conversion layer, a micro-system packaging T/R assembly and a surface-mounted flat active phased array antenna system framework of a heat dissipation structural member; the control function layer distributes power supply and control signals of the end machine to the micro system packaging T/R assembly and the channel, the channel region carries out up-conversion on signals sent by the end machine and pushes the signals to the beam forming network layer or receives signals of the beam forming network layer to carry out down-conversion, the beam forming network layer carries out synthesis on radio frequency signals received by an antenna array surface or decomposes the radio frequency signals sent by the channel, meanwhile, the device surface-mounted conversion layer distributes low-frequency power supply and control signals sent by the control layer and the low-frequency power supply in the multifunctional motherboard to each system packaging T/R assembly and then sends the signals to the end machine to be processed, and the wave control region analyzes control commands of the end machine to the phased array antenna system, controls the working frequency and the beam direction of the whole phased array system and realizes other related functions.
2. The surface mount flat panel active phased array antenna system architecture of claim 1, wherein: in each functional circuit layer, the layers are separated by metal ground for electromagnetic shielding and isolation.
3. The surface mount flat panel active phased array antenna system architecture of claim 1, wherein: the multifunctional motherboard is electrically interconnected with electronic components and microsystem packaging T/R assemblies in a surface-mounted manner.
4. The surface mount flat panel active phased array antenna system architecture of claim 1, wherein: the micro-system packaging T/R component is directly fixed on the metal cold plate of the structural heat dissipation piece through a screw, and liquid cooling heat dissipation is carried out through the micro-channel cold plate.
5. The surface mount flat panel active phased array antenna system architecture of claim 1, wherein: the structure heat sink is equipped with the metal cold drawing of liquid cooling runner, and the coolant gets into the cold drawing from the import, and the liquid cooling flow is direct gives the metal cold drawing hot layer with heat-conduction through metal cavity liquid cooling runner, flows through and flows out from the export after installing each electron device that generates heat on the metal cold drawing, takes away the heat.
6. The surface mount flat panel active phased array antenna system architecture of claim 1, wherein: the partial area of the radio frequency circuit comprises an antenna array surface layer and a beam forming network layer, wherein the antenna array surface layer receives or radiates electromagnetic waves, and the beam forming network layer synthesizes radio frequency signals received by the antenna array surface and sends the radio frequency signals to a channel or decomposes the radio frequency signals transmitted by the channel.
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| CN110323561B (en) * | 2019-06-20 | 2023-10-27 | 成都天锐星通科技有限公司 | Printed circuit board integrated with various radio frequency modules and manufacturing method |
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| CN112103634B (en) * | 2020-11-19 | 2021-02-26 | 成都天锐星通科技有限公司 | Planar phased array antenna |
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| CN113078443B (en) * | 2021-04-12 | 2022-07-26 | 中国电子科技集团公司第三十八研究所 | Integrated subarray module and radar antenna array surface |
| CN114050422B (en) * | 2021-10-30 | 2023-07-11 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Self-repairing method for integrated package structure of phased array antenna microsystem |
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