CN117438263A

CN117438263A - Electrode assembly for plasma cleaning machine, manufacturing method and plasma cleaning machine

Info

Publication number: CN117438263A
Application number: CN202211054447.8A
Authority: CN
Inventors: 金海东
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-07-15
Filing date: 2022-08-31
Publication date: 2024-01-23
Also published as: KR20240010160A; WO2024014611A1

Abstract

The method for manufacturing an electrode assembly for a plasma cleaning machine according to an embodiment of the present invention includes: a first step of preparing a main body of a non-conductive material; a second step of forming an electrode on one surface of the main body; and a third step of forming an insulating portion by applying a non-conductive material to one surface of the main body so that the electrode is not exposed to the outside, wherein in the second step, the electrode may be formed by applying a conductive material to one surface of the main body. The invention can minimize the deformation of the electrode by the electrode in the shape of a rod, and can improve the electric energy efficiency and the cleaning efficiency.

Description

Electrode assembly for plasma cleaning machine, manufacturing method and plasma cleaning machine

Technical Field

The present invention relates to an electrode assembly for a plasma cleaning machine, a method of manufacturing an electrode assembly for a plasma cleaning machine, and a plasma cleaning machine including an electrode assembly for a plasma cleaning machine, and more particularly, to an electrode assembly for a plasma cleaning machine, a method of manufacturing an electrode assembly for a plasma cleaning machine, and a plasma cleaning machine including an electrode assembly for a plasma cleaning machine, which can minimize deformation of an electrode by a rod-shaped electrode and can improve electric energy efficiency and cleaning efficiency.

Background

In the production of semiconductor substrates and the like, a substrate cleaning process is performed, and a plasma technique, which is a dry technique, has been recently used in many cases.

In general, plasma (plasma) generates flux of a large amount of reactive species (reactive species) such as ions and radicals, and is thus widely used in industry for surface treatment of objects.

In the case of electrodes required for driving a conventional plasma cleaning machine, a metal electrode such as titanium is disposed on a ceramic body, and a molding process is performed with silicon to manufacture a ceramic electrode form. However, this manufacturing method has problems that the consumed working time is long, the cost is high, and the performance of the plasma cleaning machine varies with the proficiency of the worker.

Further, there are problems that the silicon molded body is lifted up due to an increase in the temperature of the ceramic electrode, heat dissipation efficiency is lowered due to heat generation, and the metal electrode is deformed/detached.

Therefore, there is a recent need to study an electrode assembly for a plasma cleaning machine, which is easy to manufacture, has excellent electrical energy efficiency and cleaning efficiency, and can reduce the problem of deformation/detachment due to heat generation.

Disclosure of Invention

Technical problem

The invention aims to provide an electrode assembly for a plasma cleaning machine and a plasma cleaning machine, which can minimize deformation of an electrode and improve electric energy efficiency and cleaning efficiency.

Further, an object of the present invention is to provide a method for manufacturing an electrode assembly for a plasma cleaning machine, which can easily manufacture electrodes of various sizes and can reduce manufacturing costs.

Technical proposal

The method for manufacturing an electrode assembly for a plasma cleaning machine according to an embodiment of the present invention includes: 1. a method of manufacturing an electrode assembly for a plasma cleaning machine, comprising: a first step of preparing a main body of a non-conductive material; a second step of forming an electrode on one surface of the main body; and a third step of forming an insulating portion by coating a non-conductive material on one surface of the main body so that the electrode is not exposed to the outside; in the second step, the electrode may be formed by coating a substance of a conductive material on one surface of the main body.

The electrode in the second step may be formed by melting a powder or a linear material and spraying the melted material on one surface of the body portion, followed by solidification.

And, the main body portion of the first step may include: a base portion which forms a bottom surface; and a side portion protruding along an edge of the base portion to form an electrode receiving groove on an inner side.

And, the upper surface of the base may have an electrode coating groove formed to be sunk into a predetermined depth.

And, the electrode coating groove may include a connection groove connecting a pair of horizontal grooves formed in parallel along a length direction of the base with the horizontal grooves.

The electrode in the second step may be formed by melting a powder or a linear type of a material to be melted, spraying the melted material into the horizontal groove and the connecting groove, and solidifying the melted material.

And, the second step may include a step of attaching an external electrode connection terminal to the electrode through a conductive adhesive after forming the electrode.

And, in the third step, a non-conductive substance may be coated to form an insulating part such that at least a portion of the external electrode connection terminal is exposed to the outside.

And, the second step may include a step of curing the substance of the conductive material in an oven, and the third step includes a step of curing the non-conductive material in an oven.

An electrode assembly for a plasma cleaning machine according to an embodiment of the present invention may be manufactured by the above-described manufacturing method.

A plasma cleaning machine according to an embodiment of the present invention may include: a housing having an interior space; a cover plate coupled to an upper surface of the housing and formed with a voltage port connection hole and a gas port connection hole; a ground plate coupled to the lower surface of the housing and formed with micro holes; a partition plate provided in the housing to divide an inner space of the housing in a width direction of the housing; the plasma cleaning machine electrode assembly according to claim 10, wherein the electrode assemblies are disposed in the inner space of the casing partitioned by the partition plate, and are spaced apart from the ground plate; a section module coupled to one surface of the cover plate and provided to communicate with the section chamber, and sucking air inside the section chamber; a high voltage connection port coupled to the voltage port connection hole and electrically connected to the electrode assembly for the plasma cleaning machine; and a gas connection port coupled to the gas port connection hole and disposed to communicate with the inner space of the housing.

The separator is connected to a voltage supply terminal connected to an external power source through the voltage connection port, and one end of the voltage supply terminal is branched and electrically connectable to the electrode assemblies for the plasma cleaning machine disposed on both sides of the separator.

The micropores may be provided along a longitudinal direction of the housing and may face the electrode assembly for the plasma cleaning machine.

And, the inner side surface of the housing may be provided with a stopper for determining the position of the electrode assembly for the plasma cleaning machine.

And, the housing may include: a main body frame having an inner space, wherein a segment chamber generating groove is formed on the outer surface of the lateral wall in the width direction; and side plates coupled to both sides of the main body frame in the width direction to cover the segment chamber generating grooves, and forming a segment chamber having an open lower portion between the side plates and the main body frame.

Technical effects

The electrode assembly for a plasma cleaning machine and the plasma cleaning machine according to an embodiment of the present invention can minimize heat generation, electrode deformation, and electrode damage caused by the application of high voltage.

In addition, the electrode assembly for the plasma cleaning machine and the plasma cleaning machine according to one embodiment of the invention can improve the electric energy efficiency and the cleaning efficiency.

Also, the method of manufacturing an electrode assembly for a plasma cleaning machine according to an embodiment of the present invention can easily manufacture electrodes of various sizes, and can be manufactured at low cost.

Drawings

FIG. 1 is a schematic perspective view of a plasma cleaning machine according to one embodiment of the invention;

FIG. 2 is a schematic bottom perspective view of a plasma cleaning machine according to one embodiment of the invention;

FIG. 3 is a schematic exploded perspective view of a housing of a plasma cleaning machine according to one embodiment of the present invention;

FIG. 4 is a simplified overall exploded perspective view of a plasma cleaning machine according to one embodiment of the present invention;

FIG. 5 is a schematic cross-sectional view taken along line A-A' of FIG. 1;

fig. 6 is a schematic plan view of a main body portion of an electrode assembly for a plasma cleaning machine according to an embodiment of the present invention;

FIG. 7 is a schematic cross-sectional view taken along B-B' of FIG. 1;

FIG. 8 is a schematic cross-sectional view taken along line C-C' of FIG. 1;

fig. 9 is a schematic cross-sectional view of an electrode assembly for a plasma cleaning machine according to steps in a method of manufacturing the electrode assembly for a plasma cleaning machine according to an embodiment of the present invention.

Description of the reference numerals

1: plasma cleaning machine 100: outer casing

110: the main body frame 120: side plate

200: cover plate 210: voltage port connecting hole

220: gas port connection hole 300: grounding plate

400: partition 410: terminal accommodating groove gap

420: manifold receiving slot 500: electrode assembly for plasma cleaning machine

510: body portion 520: electrode

530: external electrode connection terminal 540: insulation part

600: section module 610: pipeline

620: segment port 700: high voltage connection port

800: gas connection port

Detailed Description

Specific embodiments for implementing the inventive concept are described in detail below with reference to the accompanying drawings.

In the description of the present invention, when it is determined that a specific description of a known structure or function may be used to confuse the gist of the present invention, the specific description thereof is omitted.

In addition, when a certain component is referred to as being "connected", "supported", or "in contact with" another component, it is to be understood that the other component may be directly connected, supported, or in contact with the other component.

The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular description includes the plural where there is no explicit other meaning in the context.

Further, it is stated herein that the descriptions of the upper side, the lower side, the side, etc. in this specification are described with reference to the drawings, and that the descriptions may be changed accordingly in the case where the direction of the object is changed. For the same reason, some of the constituent elements in the drawings are exaggerated or omitted or briefly shown, and the sizes of the constituent elements do not all reflect actual sizes.

Also, the terms including ordinal numbers of first, second, etc. may be used to describe various elements, but the elements are not limited to these terms. These terms are only used to distinguish one element from another.

The use of the terms "comprises" and "comprising" in the specification is taken to specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but does not preclude the presence or addition of other features, regions, integers, steps, operations, elements, and/or groups thereof.

Terms concerning directions are defined herein. The longitudinal direction refers to the y-axis direction with reference to fig. 1, the width direction refers to the x-axis direction with reference to fig. 1, and the thickness direction refers to the z-axis direction with reference to fig. 1. However, this is defined with reference to fig. 1 of the drawings, and the meaning of the drawing is interpreted as other meaning in the case of the drawing modification.

Fig. 1 is a schematic perspective view of a plasma cleaning machine according to an embodiment of the present invention, fig. 2 is a schematic bottom perspective view of the plasma cleaning machine according to an embodiment of the present invention, fig. 3 is a schematic exploded perspective view of a housing of the plasma cleaning machine according to an embodiment of the present invention, and fig. 4 is a schematic overall exploded perspective view of the plasma cleaning machine according to an embodiment of the present invention.

Referring to fig. 1 to 4, a plasma cleaning machine 1 according to an embodiment of the present invention may include a housing 100, a cover plate 200, a ground plate 300, a partition 400, an electrode assembly 500 for a plasma cleaning machine, a segment module 600, a high voltage connection port 700, and a gas connection port 800.

The case 100 may include a main body frame 110 having an inner space, and side plates 120 coupled to both sides of the main body frame 110 in a width direction and forming a section chamber 110a between the side plates and the main body frame 110.

The main body frame 110 may be provided to be opened at upper and lower portions. The upper portion of the main body frame 110 may be coupled with the cover plate 200 and the lower portion may be coupled with the ground plate 300.

The outer surface of the lateral side wall of the main body frame 110 may be formed with a segment chamber generating groove 111 sunk to a predetermined depth toward the inner side of the main body frame 110. The segment chamber generating slot 111 may extend to a lower end portion of a sidewall of the main body frame 110. Accordingly, the lower portion of the segment chamber 110a formed by the side plate 120 coupled to the main body frame 110 may be opened. The segment chamber generating groove 111 may include a section in which the width-direction depth increases from the lower portion toward the upper portion. For example, the width direction depth d1 of the lower end portion in the segment chamber generation tank 111 may be lower than the width direction depth d2 of the upper end portion. By reducing the widthwise cross-sectional area toward the lower end portion, the harmful gas suction force can be improved. Further, the segment chamber generating groove 111 may include a segment inclined upward from the front direction to the rear direction. By having the section inclined upward, the harmful gas can be effectively sucked in the entire length direction of the housing 100. The widthwise side wall upper end of the main body frame 110 may have an opening 112 communicating with the segment chamber generating groove 111. The segment module 600 may suck in the harmful gas inside the segment chamber 110a through the opening 112.

The side plates 120 may be coupled to both sides of the body frame 110 in the width direction. The side plate 120 may be coupled to the main body frame 110 to cover the section chamber generating groove 111 of the main body frame 110. A segment chamber 110a may be formed between the side plate 120 and the main body frame 110. The lower end portion of the segment chamber 110a may be opened, and harmful gases such as ozone, nitrogen oxides (NOx) and the like generated by the plasma may be inhaled through the opened lower end portion.

The cover plate 200 may be provided on the upper surface of the housing 100. The cover plate 200 may have a voltage port connection hole 210 and a gas port connection hole 220 thereon. The high voltage connection port 700 may be coupled to the voltage port connection hole 210, and the gas connection port 800 may be coupled to the gas port connection hole 220.

The ground plate 300 may be coupled to the underside of the housing 100. The ground plate 300 may be formed of a conductive material. The ground plate 300 may have micro-holes 300a thereon. The micro-holes 300a may be disposed along the length direction of the ground plate 300. For example, the micro-holes 300a may be formed at a position opposite to the electrode assembly 500 for the plasma cleaning machine. The number and arrangement of the micro holes 300a may be variously changed so as to correspond to the electrode assembly 500 for a plasma cleaning machine. The radicals may be sprayed to the article to be cleaned through the micro-holes 300a of the ground plate 300. In other words, when the plasma cleaning machine 1 is driven, the high voltage is applied to the electrode assembly 500 for the plasma cleaning machine, and the process gas supplied to the space in which the electrode assembly 500 for the plasma cleaning machine is disposed is ionized, so that plasma and radicals are generated between the electrode assembly 500 for the plasma cleaning machine and the ground plate 300. The generated radicals may be discharged to the outside through the micro holes 300a, and may be finally sprayed to the article to be cleaned disposed at the lower portion of the ground plate 300.

The ground plate 300 may be provided with an open lower portion of the segment chamber 110a on both sides in the width direction. Accordingly, the harmful substances discharged to the outside of the ground plate 300 may flow into the open lower portion of the segment chamber 110a and be discharged.

The partition 400 may be provided inside the housing 100. For example, the partition 400 may be provided inside the main body frame 110. The inner sides of both sides of the body frame 110 in the length direction may be convexly provided with bosses 114 for seating the partition 400. The both lengthwise side ends of the partition 400 may be seated on the boss 114 to be fixed to the main body frame 110. The separator 400 may be composed of a material having high heat resistance, for example, teflon (PTFE).

The partition 400 may divide the inner space of the main body frame 110 in the width direction. For example, the partition 400 may divide the inner space of the main body frame 110 into a first space S1 and a second space S2 (see fig. 5).

The upper end of the partition 400 may be provided with a terminal receiving groove 410 for receiving the voltage supply terminal 710. The terminal receiving groove 410 may be formed by cutting at least a portion of the upper end of the spacer 400. Here, one end 710a and 710b of the voltage supply terminal 710 may be branched, and the branched ends may be disposed opposite to each other with reference to the separator 400. For example, the branched ends of the voltage supply terminal 710 may be disposed in the first space S1 and the second space S2, respectively.

A manifold receiving groove 420 may be formed in a portion of the upper end portion of the separator 400 where the terminal receiving groove 410 is not formed. The manifold receiving groove 420 may be partially cut in the upper end portion of the separator 400. A manifold 810 may be disposed over the manifold receiving slot 420. Here, at least a part of the gas discharge holes 810a of the manifold 810 may be disposed in the first space S1 of the main body frame 110, and the remaining part may be disposed in the second space S2 of the main body frame 110.

Fig. 5 is a schematic cross-sectional view taken along A-A' of fig. 1, and fig. 6 is a schematic plan view of a main body portion of an electrode assembly for a plasma cleaning machine according to an embodiment of the present invention.

Referring to fig. 5 and 6, an electrode assembly 500 for a plasma cleaning machine may be provided inside the case 100. As an example, the electrode assembly 500 for a plasma cleaning machine may be provided in the first space S1 and the second space S2 of the main body frame 110 divided by the partition 400, respectively.

The electrode assembly 500 for the plasma cleaning machine may be disposed to be spaced apart from the upper surface of the ground plate 300 by a predetermined interval. For this, the inner side surface of the main body frame 110 may be provided with a stopper 113 to determine the position of the electrode assembly 500 for the plasma cleaning machine. The electrode assembly 500 for a plasma cleaning machine may be positioned by contacting the upper surface with the bottom surface of the stopper 113.

The electrode assembly 500 for a plasma cleaning machine may include, for example, a main body portion 510 made of a non-conductive material and including an internal space, an electrode 520 provided on a bottom surface of the main body portion 510, and an insulating portion 540 made of a non-conductive material provided to cover an upper surface of the electrode 520.

The main body 510 may be made of a nonconductive material, for example, synthetic resin, ceramic, or the like. The body portion 510 may include a base portion 511 constituting a bottom surface and a side portion 512 provided convexly along an edge of the base portion 511.

An electrode 520 may be provided on the upper surface of the base 511. The electrode 520 may be configured in a rod configuration. For example, the electrode 520 may be formed by melting a powder of a conductive material or a linear-shaped sol-gel material and coating the same on the upper surface of the base 511 and solidifying the same.

The upper surface of the base 511 may be provided with electrode coating grooves 510a, 510b. The electrode coating grooves 510a, 510b may be formed to be sunk into a predetermined depth from the upper surface of the base 511. The electrode coating grooves 510a, 510b may be coated with a sol-gel material and cured to form the electrode 520. Accordingly, the electrode coating grooves 510a, 510b and the electrode 520 may be configured in corresponding shapes.

As an example, the electrode coating grooves 510a, 510b may include a pair of horizontal grooves 510a formed in parallel along the length direction of the base 511 and a connection groove 510b connecting the horizontal grooves 510a. Therefore, in the case where the electrode 520 is formed by coating the horizontal groove 510a and the connection groove 510b with the dissolution material, the electrode 520 may be formed in an overall 'H' shape.

The external electrode connection terminal 530 may be connected to the electrode 520. The external electrode connection terminal 530 may be connected to the electrode 520 through a conductive adhesive. As an example, silver paste can be used as the conductive adhesive. The external electrode connection terminal 530 may be disposed on the connection groove 510b to be connected to the electrode 520. The external electrode connection terminal 530 may be connected to the voltage supply terminal 710 to obtain a high-voltage current.

The insulating part 540 may be provided to cover the upper surface of the electrode 520. The insulating portion 540 is used to insulate the electrode 520, and may be made of a nonconductive material. For example, the insulating portion 540 may be made of synthetic resin, ceramic, or the like. The insulating part 540 may be formed by curing after being applied to the body part 510 in a powder form. The insulating portion 540 may be manufactured in a bulk ceramic (cured) form and bonded to the main body 510.

The upper surface of the electrode 520 may be sealed by an insulating part 540. Here, at least a portion of the external electrode connection terminal 530 may be exposed to an upper portion of the insulating portion 540.

The high voltage connection port 700 may be coupled to the cap plate 200. For example, the high voltage connection port 700 may be coupled to the voltage port connection hole 210 of the cap plate 200. The high voltage connection port 700 may include a voltage supply terminal 710. In the case where an external power source is connected to the high voltage connection port 700, a high voltage current supplied from the external power source may be supplied to the electrode 520 through the voltage supply terminal 710 and the external electrode connection terminal 530. Here, the ends 710a and 710b of the voltage supply terminal 710 are branched, and a high-voltage current can be supplied to the electrodes 520 provided in the first space S1 and the second space S2 of the main body frame 110, respectively. Although not shown, the voltage supply terminal 710 may be connected to the external electrode connection terminal 530 through another wire or conductive material.

Fig. 7 is a schematic cross-sectional view taken along B-B' of fig. 1. Referring to fig. 7, a gas connection port 800 may be coupled to the cover plate 200. For example, the gas connection port 800 may be coupled to the gas port connection hole 220 of the cover plate 200. The gas connection port 800 may be connected to an external gas supply to obtain engineering gas required for driving the plasma cleaning machine 1. The process gas may be composed of an inert gas required for generating plasma. For example, the process gas may comprise nitrogen and CDA (clean dry air).

In order to smoothly supply the process gas to the inside of the housing 100, the gas connection port 800 may include a manifold 810. The manifold 810 may be coupled to the bottom surface of the cover plate 200, and a gas inflow space S3 may be formed between the manifold 810 and the bottom surface of the cover plate 200. The gas connection port 800 is provided to communicate with the gas inflow space S3, and is capable of supplying the process gas to the gas inflow space S3.

The manifold 810 may include, for example, a horizontal portion 811 disposed in the manifold receiving slot 420 of the spacer 400 and a vertical portion 812 protruding upward along an edge of the horizontal portion 811. The horizontal portion 811 may be formed across the bulkhead 400. For example, at least a part of the horizontal portion 811 may be disposed in the first space S1, and the other part may be disposed in the second space S2. The horizontal portion 811 may have a plurality of gas discharge holes 810a thereon. The gas discharge hole 810a may be formed through the horizontal portion 811, and may communicate the gas inflow space S3 with the first space S1 and the second space S2. At least a portion of the gas discharge hole 810a may communicate with the first space S1, and another portion may communicate with the second space S2. The gas discharge hole 810a may be connected to a gas discharge pipe 810b. The process gas supplied from the external gas supply unit may flow into the first space S1 and the second space S2 after passing through the gas connection port 800, the gas inflow space S3, and the gas discharge pipe 810b in this order.

Fig. 8 is a schematic cross-sectional view along C-C' of fig. 1. Referring to fig. 8, the section module 600 may be coupled to an upper portion of the housing 100. The segment module 600 may be connected to an external pump. The segment module 600 is provided to communicate with the segment chamber 110a, and can inhale a harmful gas through the segment chamber 110a.

As an example, the segment module 600 may include a pipe 610 coupled to an upper portion of the housing 100 and a segment port 620 connected to an external pump. The duct 610 may include an inner space 610a with an opened lower portion. The duct 610 may be disposed to cover the opening 112 of the housing 100, so that the inner space 610a of the duct 610 and the segment chamber 110a can communicate through the opening 112.

A brief driving method of the plasma cleaning machine 1 will be described below based on the above-described constitution of the plasma cleaning machine 1 according to an embodiment of the present invention.

In the case where the high voltage connection port 700 is connected to an external power source, a high voltage current supplied from the external power source may be supplied to the electrode 520 through the voltage supply terminal 710, the external electrode connection terminal 530. Here, the ends 710a and 710b of the voltage supply terminal 710 may supply high voltage current to the electrodes 520 provided in the first space S1 and the second space S2 of the main body frame 110, respectively.

Meanwhile, the process gas may be supplied into the housing 100, i.e., the first space S1 and the second space S2, through the gas connection port 800. The process gas may correspond to an inert gas required for generating plasma, for example, a mixed gas of nitrogen and CDA (clean dry air).

When a high voltage current is applied to the electrode 520, plasma and radicals may be generated between the electrode 520 and the ground plate 300. That is, the inert gas supplied to the periphery of the electrode 520 is ionized, so that plasma and radicals can be generated. The radicals may be sprayed to the article to be cleaned through the micro-holes 300a of the ground plate 300.

In addition, harmful substances such as ozone and nitrogen oxides can be generated by the generated plasma. Such harmful substances may be inhaled through the segment chamber 110a and discharged to the outside after passing through the segment module 600.

The surface treatment operation of the article to be cleaned may be performed through a series of processes as described above.

Fig. 9 is a schematic cross-sectional view of an electrode assembly for a plasma cleaning machine according to steps in a method of manufacturing the electrode assembly for a plasma cleaning machine according to an embodiment of the present invention. A method of manufacturing an electrode assembly for a plasma cleaning machine according to an embodiment of the present invention will be described with reference to fig. 9.

A first step of: step of preparing a Main body of non-conductive Material (see FIG. 9 (a))

In the first step, the body portion 510 may be composed of a non-conductive material. For example, the body portion 510 may be formed by melting/sintering ceramic powder. The body 510 may be made of synthetic resin. The body part 510 may include a base 511 constituting a bottom surface and side parts 512 convexly provided along edges of the base 511. An electrode coating groove 510a may be provided on the upper surface of the base 511. The electrode coating groove 510a may be formed by sinking a predetermined depth from the upper surface of the base 511.

In addition, a step of attaching a masking tape to the body portion 510 may be performed. Although not shown, masking tape may be attached to one surface of the electrode where the body portion 510 is not formed. For example, masking tape may be attached to an area other than the electrode coating groove 510a.

And a second step of: step of forming an electrode on one surface of the body portion (see FIGS. 9 (b) and (c))

In the second step, an electrode 520 may be formed on one surface of the body portion 510. The electrode 520 may be formed by, for example, a solvent-coating method. The solvent coating is a technique of injecting a solvent material in a powder or linear form into a solvent device which is directed to a heat source generating a high temperature, then changing the solvent material into a molten state, and injecting and colliding the solvent material onto the surface of a base material, and then solidifying the solvent material to form a thin film. The material used to form electrode 520 may be a conductive material.

In the second step, the electrode 520 may be formed along the electrode coating groove 510a. In other words, the electrode 520 may be formed by spraying a molten powder or a linear-shaped shot material to the horizontal groove 510a (see fig. 6) and the connection groove 510b (see fig. 6) and then solidifying. Thus, the electrode 520 may be formed in an overall 'H' -shape. Among them, as a method for curing the coated radiation material of the conductive material, an oven can be used. In other words, the electrode 520 may be formed by coating the body 510 with the sol material and then curing the sol material in an oven.

After the electrode 520 is formed, a step of attaching the external electrode connection terminal 530 to the electrode 520 with a conductive adhesive may be performed. As an example, silver paste can be used as the conductive adhesive. The external electrode connection terminal 530 may be disposed in the connection groove 510b to be connected to the electrode 520.

In the case where the electrode 520 is formed in a rod shape by the sol-gel coating method as described above, deformation of the electrode 520 can be minimized even when the current of high voltage is applied and heat is generated. In addition, by minimizing heat generation when a high voltage current is applied, electric energy efficiency and cleaning efficiency can be improved. In addition, the electrode can be easily manufactured by the solvent-coating method, and the manufacturing cost can be reduced.

And a third step of: a step of forming an insulating portion by applying a non-conductive substance to one surface of the main body portion so that the electrode is not exposed to the outside (see FIG. 9 (d))

In a third step, an insulating material of a non-conductive material may be applied for insulation of the electrode 520. Masking tape attached to the body portion 510 may be removed prior to application of the insulating material. As the insulating material, ceramics can be used. The insulating portion 540 may be formed by coating an insulating material of a non-conductive material on the body portion 510 and curing. Here, an oven may be used as the curing method.

The insulating portion 540 may be formed so as to be bonded to the upper surface of the base portion 511 of the main body portion 510 in a state where the sintered ceramic is processed into a bulk ceramic form.

The embodiments of the present invention have been described above as specific embodiments, but this is merely an example, and the present invention is not limited thereto and should be construed to have the maximum scope based on the basic concept disclosed in the present specification. Those skilled in the art can combine/substitute the disclosed embodiments to implement modes of undisclosed shape, but this also falls within the scope of the invention. Furthermore, modifications or variations of the disclosed embodiments may be readily made by those skilled in the art in light of the present description, and such modifications or variations are clearly within the scope of the appended claims.

Claims

1. A method of manufacturing an electrode assembly for a plasma cleaning machine, comprising:

a first step of preparing a main body of a non-conductive material;

a second step of forming an electrode on one surface of the main body; and

a third step of forming an insulating portion by coating a non-conductive material on one surface of the main body so that the electrode is not exposed to the outside;

in the second step, the electrode is formed by coating a substance of a conductive material on one surface of the main body.

2. The method for manufacturing an electrode assembly for a plasma cleaning machine according to claim 1, wherein:

the electrode in the second step is formed by melting a powder or a linear material and spraying the melted material on one surface of the body portion and solidifying the melted material.

3. The method for manufacturing an electrode assembly for a plasma cleaning machine according to claim 1, wherein the main body portion of the first step includes:

a base portion which forms a bottom surface; and

and a side portion protruding along an edge of the base portion to form an electrode receiving groove on an inner side.

4. The method for manufacturing an electrode assembly for a plasma cleaning machine according to claim 3, wherein:

the base has an electrode coating groove formed thereon to a predetermined depth.

5. The method for manufacturing an electrode assembly for a plasma cleaning machine according to claim 4, wherein:

the electrode coating groove includes a connection groove connecting a pair of horizontal grooves formed in parallel along a length direction of the base with the horizontal grooves.

6. The method for manufacturing an electrode assembly for a plasma cleaning machine according to claim 5, wherein:

the electrode in the second step is formed by melting a powder or a linear form of a soluble material, spraying the soluble material into the horizontal groove and the connecting groove, and solidifying the soluble material.

7. The method for manufacturing an electrode assembly for a plasma cleaning machine according to claim 1, wherein:

the second step includes a step of attaching an external electrode connection terminal to the electrode through a conductive adhesive after forming the electrode.

8. The method for manufacturing an electrode assembly for a plasma cleaning machine according to claim 7, wherein:

in the third step, a non-conductive substance is applied to form an insulating portion so that at least a portion of the external electrode connection terminal is exposed to the outside.

9. The method for manufacturing an electrode assembly for a plasma cleaning machine according to claim 1, wherein:

the second step includes the step of oven curing the substance of the conductive material,

the third step includes the step of curing the non-conductive material in an oven.

10. An electrode assembly for a plasma cleaning machine manufactured by the manufacturing method according to any one of claims 1 to 9.

11. A plasma cleaning machine, comprising:

a housing having an interior space;

a cover plate coupled to an upper surface of the housing and formed with a voltage port connection hole and a gas port connection hole;

a ground plate coupled to the lower surface of the housing and formed with micro holes;

a partition plate provided in the housing to divide an inner space of the housing in a width direction of the housing;

the plasma cleaning machine electrode assembly according to claim 10, wherein the electrode assemblies are disposed in the inner space of the casing partitioned by the partition plate, and are spaced apart from the ground plate;

a section module coupled to one surface of the cover plate and provided to communicate with the section chamber, and sucking air inside the section chamber;

a high voltage connection port coupled to the voltage port connection hole and electrically connected to the electrode assembly for the plasma cleaning machine; and

a gas connection port coupled to the gas port connection hole and disposed to communicate with the inner space of the housing.

12. The plasma cleaning machine of claim 11, wherein:

the separator is coupled with a voltage supply terminal connected to an external power source through the voltage connection port,

one end of the voltage supply terminal is branched and electrically connected to the electrode assemblies for the plasma cleaning machine, which are arranged on both sides of the separator.

13. The plasma cleaning machine of claim 11, wherein:

the micropores are provided along a longitudinal direction of the housing and face the electrode assembly for the plasma cleaning machine.

14. The plasma cleaning machine of claim 11, wherein:

and a limiting piece for determining the position of the electrode assembly for the plasma cleaning machine is arranged on the inner side surface of the shell.

15. The plasma cleaning machine of claim 11, wherein the housing comprises:

a main body frame having an inner space, wherein a segment chamber generating groove is formed on the outer surface of the lateral wall in the width direction; and

and side plates coupled to both sides of the main body frame in the width direction to cover the segment chamber generating grooves, and forming a segment chamber having an open lower portion between the side plates and the main body frame.