CN117431534A - Preparation method of magnetic field assisted chemical nickel plating - Google Patents
Preparation method of magnetic field assisted chemical nickel plating Download PDFInfo
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- CN117431534A CN117431534A CN202311410957.9A CN202311410957A CN117431534A CN 117431534 A CN117431534 A CN 117431534A CN 202311410957 A CN202311410957 A CN 202311410957A CN 117431534 A CN117431534 A CN 117431534A
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- magnetic field
- plating
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- chemical
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 126
- 238000007747 plating Methods 0.000 title claims abstract description 74
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 63
- 239000000126 substance Substances 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 66
- 238000000034 method Methods 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 230000009471 action Effects 0.000 claims abstract description 16
- 230000000694 effects Effects 0.000 claims abstract description 13
- 230000003213 activating effect Effects 0.000 claims abstract description 5
- 230000001235 sensitizing effect Effects 0.000 claims abstract description 5
- 239000002923 metal particle Substances 0.000 claims abstract description 4
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 4
- 239000002585 base Substances 0.000 claims description 43
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 34
- 239000004917 carbon fiber Substances 0.000 claims description 34
- 239000000243 solution Substances 0.000 claims description 28
- 238000007772 electroless plating Methods 0.000 claims description 24
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims description 22
- 230000003647 oxidation Effects 0.000 claims description 21
- 238000007254 oxidation reaction Methods 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011259 mixed solution Substances 0.000 claims description 20
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 238000011282 treatment Methods 0.000 claims description 17
- 150000003839 salts Chemical class 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 12
- 238000005406 washing Methods 0.000 claims description 11
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- 230000004913 activation Effects 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 9
- 230000009467 reduction Effects 0.000 claims description 8
- 238000006722 reduction reaction Methods 0.000 claims description 8
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 7
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 6
- -1 alkylamine boranes Chemical class 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 6
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 6
- 239000001509 sodium citrate Substances 0.000 claims description 6
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 6
- 239000000725 suspension Substances 0.000 claims description 6
- 206010070834 Sensitisation Diseases 0.000 claims description 5
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 5
- 238000000053 physical method Methods 0.000 claims description 5
- 238000000746 purification Methods 0.000 claims description 5
- 230000008313 sensitization Effects 0.000 claims description 5
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims description 4
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000001119 stannous chloride Substances 0.000 claims description 4
- 235000011150 stannous chloride Nutrition 0.000 claims description 4
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 3
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 3
- 229910000085 borane Inorganic materials 0.000 claims description 3
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 claims description 3
- 229910000361 cobalt sulfate Inorganic materials 0.000 claims description 3
- 229940044175 cobalt sulfate Drugs 0.000 claims description 3
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005238 degreasing Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000006056 electrooxidation reaction Methods 0.000 claims description 3
- 239000008103 glucose Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 3
- 238000009830 intercalation Methods 0.000 claims description 3
- 230000002687 intercalation Effects 0.000 claims description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 3
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 claims description 3
- 229910000360 iron(III) sulfate Inorganic materials 0.000 claims description 3
- 239000007791 liquid phase Substances 0.000 claims description 3
- 238000003760 magnetic stirring Methods 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 3
- 239000012071 phase Substances 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 239000012279 sodium borohydride Substances 0.000 claims description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 3
- 239000007790 solid phase Substances 0.000 claims description 3
- 238000000967 suction filtration Methods 0.000 claims description 3
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 abstract description 10
- 230000007547 defect Effects 0.000 abstract description 7
- 239000008139 complexing agent Substances 0.000 abstract description 5
- 229910052755 nonmetal Inorganic materials 0.000 abstract description 3
- 238000004381 surface treatment Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 229910017870 Cu—Ni—Al Inorganic materials 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 8
- 229910001096 P alloy Inorganic materials 0.000 description 7
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 6
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 6
- 229910001453 nickel ion Inorganic materials 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 241000080590 Niso Species 0.000 description 3
- 244000137852 Petrea volubilis Species 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000002386 leaching Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000006174 pH buffer Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 239000001632 sodium acetate Substances 0.000 description 2
- 235000017281 sodium acetate Nutrition 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1673—Magnetic field
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
The invention provides a preparation method of magnetic field assisted chemical nickel plating, which belongs to the technical field of metal and nonmetal surface treatment and comprises the following steps: firstly, purifying, sensitizing and activating a base material, forming a noble metal catalytic reduction center on the surface of the base material, secondly, forming a magnetic metal layer on the surface of the base material by using a chemical nickel plating method under the auxiliary action of a magnetic field, wherein the strength of an externally applied auxiliary magnetic field is 0.01-5T during chemical plating, the magnets are symmetrically arranged at the periphery or two sides of a chemical plating container, and the magnetic field generated by the magnets enables electrons in the base material to move in the same direction, so that magnetic metal particles form a magnetic metal plating layer on the surface of the base material. The substrate material adopting the magnetic field to assist the chemical plating of the magnetic metal has good electric conduction, heat conduction, corrosion resistance and wear resistance, the effect of the magnetic field greatly reduces the time of chemical plating, the uniformity of a metal plating layer is improved, the consumption of complexing agent and reducing agent is reduced, and the obtained plating layer has compact structure, few defects and good binding force.
Description
Technical Field
The invention relates to the technical field of metal and nonmetal surface treatment, in particular to a preparation method of magnetic field assisted chemical nickel plating.
Background
One of the most important processes in the surface treatment technology is chemical plating, which not only can play a role in protecting a common substrate material, but also can play a role in repairing the material and achieve functionalization. Electroless plating of base materials has also evolved from the very beginning of steel to different metallic materials, even non-metallic materials such as ceramics, plastics, etc.
An alloy is a substance having metallic characteristics obtained by melting and solidifying two or more metals and non-metals. The casting process of the alloy is complex and the cost is high. Some alloys have extremely high chemical activity at high temperature, for example, titanium alloys are easy to react with hydrogen and oxygen at high temperature to generate a hardening layer to influence the performance of the alloy. The carbon fiber is high-strength high-modulus fiber with carbon content of more than 90%, and is an excellent material for manufacturing high-technology equipment such as aerospace and the like. There is a very high demand in the aerospace field for high strength and high modulus of carbon fibers, and development of high performance carbon fibers and their composite technologies will continue to advance. Amorphous alloys, also known as liquid metals or metallic glasses, are new alloys that form conventional metal crystals with crystalline materials. Amorphous alloys are a new class of materials with great potential for development, but have brittle defects as other glass materials.
To sufficiently exhibit the properties of a base material such as an alloy, a carbon fiber, or an amorphous alloy, it is necessary to enhance the bonding force between the base material and the metal plating layer. The surface of the base material is treated by a physical or chemical method, oxide films on the surfaces of the alloy and the amorphous alloy are removed by physical polishing, colloid substances on the surfaces of the carbon fibers are removed by a chemical method, and then the base material is sensitized and activated.
However, in the conventional electroless plating process, the metal plating layer tends to be aggregated around the base material in the form of spherical large particles, and a uniform plating layer cannot be formed on the surface of the substrate. When the deposition rate is high, the normal growth rate of the coating particles is greater than the tangential growth rate, and effective coating on the substrate surface is difficult.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a preparation method of magnetic field assisted chemical nickel plating, wherein a substrate material of magnetic field assisted chemical nickel plating magnetic metal has good electric conduction, heat conduction, corrosion resistance and wear resistance, the effect of a magnetic field greatly reduces the time of chemical plating, the uniformity of a metal plating layer is improved, the consumption of complexing agent and reducing agent is reduced, and the obtained plating layer has compact structure, few defects and good binding force.
In order to achieve the above purpose, the invention provides a preparation method of magnetic field assisted chemical nickel plating, which is characterized in that a base material is subjected to purification, sensitization and activation pretreatment, a noble metal catalytic reduction center is formed on the surface of the base material, a magnetic metal layer is formed on the surface of the base material by using a chemical nickel plating method under the auxiliary effect of a magnetic field, the intensity of an externally applied auxiliary magnetic field is 0.01-5T during chemical plating, magnets are symmetrically arranged at the periphery or at two sides of a chemical plating container, electrons in the base material are all moved in the same direction by the magnetic field generated by the magnets, and magnetic metal particles form a magnetic metal plating layer on the surface of the base material, wherein the thickness of the magnetic metal plating layer is 1-1000nm.
Preferably, the substrate is one or more of copper, aluminum, iron alloy, amorphous alloy and carbon fiber.
Preferably, the method specifically comprises the following steps:
purifying, sensitizing and activating the base material;
preparing an electroless plating main salt mixed solution A1 and an electroless plating reduction mixed solution A2;
placing the pretreated base material into a main salt mixed solution A1, and forming a uniform suspension A3 under the action of external force;
placing the reduction mixed solution A2 in the suspension A3, placing the electroless plating container in a magnetic field, and controlling the strength of the magnetic field, the electroless plating time, the pH value and the temperature;
separating and extracting the substrate chemically plated with nickel on the lower surface under the assistance of a magnetic field by high-speed centrifugal separation or vacuum suction filtration, and drying to obtain a uniform nickel layer well combined with the surface of the substrate.
Preferably, the purification treatment is a physical method or a chemical oxidation method;
the physical method is one or more of grinding, ultrasonic dispersion and centrifugal dispersion;
the chemical oxidation method is one or more of a gas phase oxidation method, a liquid phase oxidation method, a solid phase oxidation method, an electrooxidation method and an intercalation oxidation method.
Preferably, the unused substrate pretreatment methods vary, and include the following:
selecting alloy as a base material, removing greasy dirt and impurities on the surface of the material by acid washing and alkali washing, removing an oxide film on the surface of the material by multiple zincating treatments, improving the activity of the material, and increasing the binding force with a plating layer;
carbon fibers are selected as a base material, a colloid target one-step activation method or a stannous chloride and palladium chloride two-step method is adopted to respectively sensitize and activate the carbon fibers, and one or more methods of magnetic stirring, heating stirring and ultrasonic dispersing are adopted to fully disperse the carbon fibers;
the amorphous alloy is selected as a base material, and the oxidation layer and impurities on the surface of the base material are removed by adopting polishing, degreasing and cleaning methods, so that the activity of the amorphous alloy is improved.
Preferably, the main salt mixed solution A1 comprises one or more of nickel sulfate, nickel chloride, ferric sulfate, ferric chloride, cobalt sulfate and cobalt chloride.
Preferably, the components of the reducing mixed solution A2 are one or more of citric acid, sodium citrate, sodium hypophosphite, sodium borohydride, alkylamine boranes, hydrazine or salts thereof, hydrazine hydrate, formaldehyde and glucose.
Preferably, the electroless plating time is 0.1-5 h, the pH value is 8-12 for alkaline electroless plating solution, 4-6 for acidic electroless plating solution, and the temperature is 0-90 ℃.
Preferably, the drying temperature is 80-150 ℃ and the drying time is 0.5-4 h.
According to the specific technical scheme provided by the invention, the invention has the following technical effects:
the invention provides a preparation method of magnetic field assisted chemical nickel plating, which utilizes a magnetic field to chemically plate magnetic metal nickel on the surfaces of various substrates, and magnetic metal nickel ions in plating solution are reduced into metal nickel under the action of a reducing agent. Under the action of an externally applied magnetic field, nickel ions are accelerated to be adsorbed in the structure of the base material, so that the rate of chemical plating is improved; meanwhile, the magnetic metal nickel on the surface of the base material stretches the base material under the action of a magnetic field, so that the uniformity of the obtained coating is improved, the obtained coating is compact in structure, small in pore space and good in binding force, and the defect of poor binding between the base material and the metal coating is overcome.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for preparing magnetic field assisted electroless nickel plating according to the present invention;
FIG. 2 is a schematic diagram of a magnetic field assisted electroless nickel plating apparatus according to an embodiment of the present invention;
FIG. 3 is an SEM image of electroless nickel 6028 aluminum provided in an embodiment of the invention;
FIG. 4 is an SEM image of electroless nickel plating of carbon fiber with or without magnetic field provided by an embodiment of the present invention;
FIG. 5 is an SEM image of an electroless nickel coating interface of a Zr-Cu-Ni-Al amorphous alloy rod under the action of a magnetic field or not, which is provided by the embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention aims to provide a preparation method of magnetic field assisted chemical nickel plating, which utilizes a magnetic field to chemically plate magnetic metal nickel on the surfaces of various substrates, and magnetic metal nickel ions in plating solution are reduced into metal nickel under the action of a reducing agent. Under the action of an externally applied magnetic field, nickel ions are accelerated to be adsorbed in the structure of the base material, so that the rate of chemical plating is improved; meanwhile, the magnetic metal nickel on the surface of the base material stretches the base material under the action of a magnetic field, so that the uniformity of the obtained coating is improved, the obtained coating is compact in structure, small in pore space and good in binding force, and the defect of poor binding between the base material and the metal coating is overcome.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Fig. 1 is a flow chart of a preparation method of magnetic field assisted chemical nickel plating according to the present invention, as shown in fig. 1, the present invention provides a preparation method of magnetic field assisted chemical nickel plating, which comprises the steps of purifying, sensitizing and activating a substrate, forming a noble metal catalytic reduction center on the surface of the substrate, and forming a magnetic metal layer on the surface of the substrate by using a chemical nickel plating method under the assistance of a magnetic field. FIG. 2 is a schematic view of the magnetic field assisted electroless nickel plating apparatus of the present invention, as shown in FIG. 2, wherein the intensity of the externally applied auxiliary magnetic field is 0.01-5T, the magnets are symmetrically arranged around or at both sides of the electroless plating container, the magnetic field generated by the magnets causes electrons in the substrate to move in one direction, and magnetic metal particles form a magnetic metal plating layer on the surface of the substrate, and the thickness of the magnetic metal plating layer is 1-1000nm.
Wherein the base material is one or more of copper, aluminum, iron alloy, amorphous alloy and carbon fiber.
The method specifically comprises the following steps:
step 100, purifying, sensitizing and activating the base material;
wherein the purification treatment adopts a physical method or a chemical oxidation method;
the physical method is one or more of grinding, ultrasonic dispersion and centrifugal dispersion;
the chemical oxidation method is one or more of gas phase oxidation method, liquid phase oxidation method, solid phase oxidation method, electro-oxidation method and intercalation oxidation method.
In addition, the different pretreatment methods of the unused base materials include the following specific steps:
selecting alloy as a base material, removing greasy dirt and impurities on the surface of the material by acid washing and alkali washing, removing an oxide film on the surface of the material by multiple zincating treatments, improving the activity of the material, and increasing the binding force with a plating layer;
carbon fibers are selected as a base material, a colloid target one-step activation method or a stannous chloride and palladium chloride two-step method is adopted to respectively sensitize and activate the carbon fibers, and one or more methods of magnetic stirring, heating stirring and ultrasonic dispersing are adopted to fully disperse the carbon fibers;
the amorphous alloy is selected as a base material, and the oxidation layer and impurities on the surface of the base material are removed by adopting polishing, degreasing and cleaning methods, so that the activity of the amorphous alloy is improved.
Step 200, preparing an electroless plating main salt mixed solution A1 and an electroless plating reduction mixed solution A2;
wherein the main salt mixed solution A1 comprises one or more of nickel sulfate, nickel chloride, ferric sulfate, ferric chloride, cobalt sulfate and cobalt chloride;
the components of the reduction mixed solution A2 are one or more of citric acid, sodium citrate, sodium hypophosphite, sodium borohydride, alkylamine boranes, hydrazine or salts thereof, hydrazine hydrate, formaldehyde and glucose.
Step 300, placing the pretreated substrate in a main salt mixed solution A1, and forming a uniform suspension A3 under the action of external force;
step 400, placing the reduction mixed solution A2 in the suspension A3, placing the electroless plating container in a magnetic field, and controlling the strength of the magnetic field, the electroless plating time, the pH value and the temperature;
wherein the electroless plating time is 0.1-5 h, the pH value is 8-12 of alkaline electroless plating solution, the acidic electroless plating solution is 4-6, and the temperature is 0-90 ℃.
And 500, separating and extracting the substrate chemically plated with nickel on the lower surface assisted by a magnetic field through high-speed centrifugal separation or vacuum suction filtration, and drying to obtain a uniform nickel layer well combined with the surface of the substrate.
Wherein the drying temperature is 80-150 ℃ and the drying time is 0.5-4 h.
The invention will be further elucidated by means of specific embodiments.
Example 1
The embodiment provides a preparation method of magnetic field assisted 6082 aluminum electroless nickel plating, and the process steps of the invention are described below with reference to the accompanying drawings.
Step 100: purification treatment of 6082 aluminium
And (3) polishing the cut sample by using sand paper, polishing by using 600-mesh, 800-mesh and 1000-mesh sand paper respectively, polishing the edge in the polishing process, cleaning the edge by using clear water, and timely drying.
Step 200: alkaline washing treatment of 6082 aluminum
And (3) absolute ethyl alcohol and ultrasonic vibration oil removal are carried out on the aluminum substrate, then the aluminum substrate is soaked in NaOH aqueous solution with the temperature of 75 ℃ and the concentration of 70g/L for 20 seconds, and the aluminum substrate is taken out and then placed into clear water for ultrasonic vibration for 10 minutes.
Step 300: acid washing treatment of 6082 aluminum
600ml/L HNO was added to the beaker 3 Solution and 12.5g/L NH 4 HF 2 The powder is evenly mixed to prepare pickling solution, the aluminum substrate after alkaline washing is put into the pickling solution, soaked for 10 seconds at the temperature of 45 ℃, and then fished out and washed clean for the next treatment.
Step 400: zinc impregnation activation treatment of 6082 aluminum
And (3) carrying out primary zinc leaching on the acid-washed aluminum substrate by using a ZnO solution, then carrying out dezincification by using a concentrated nitric acid solution with the concentration of 1:1, and carrying out secondary zinc leaching on the surface of the aluminum substrate.
Step 500:6082 aluminium electroless nickel-phosphorus alloy
(1) Preparing a main salt mixed solution A1 of an electroless nickel-phosphorus alloy: comprises 1000ml deionized water, main salt nickel sulfate (NiSO) 4 ·6H 2 O) 35g, complexing agent sodium citrate (Na 3 C 6 H 5 O 7 ·2H 2 O) 10g, stabilizer thiourea (CH) 4 N 2 S) 0.02g, and fully stirring;
(2) A reducing mixture solution A2 was prepared, and 30g of sodium hypophosphite (NaH) as a reducing agent was added to 1000ml of water 2 PO 2 ·H 2 O)；
(3) Mixing A1 and A2 to carry out magnetic field assisted chemical nickel-phosphorus alloy plating, wherein the magnetic field intensity is 2T, the pH value is 9-10, the temperature is 60 ℃, the reaction time is 30min, ammonia water is used for regulating the pH value in the reaction process, and finally the aluminum base material with the surface plated with a uniform nickel layer is obtained by drying in a vacuum drying oven at the temperature of 120 ℃.
Fig. 3 is an SEM image of 6082 aluminum plating with or without magnetic field, as shown in fig. 3, the uniformity of the nickel-phosphorus plating of 6082 aluminum of fig. (b) is better than that of electroless nickel 6082 aluminum of fig. (a).
Example two
The embodiment provides a preparation method of magnetic field assisted carbon fiber chemical nickel plating, and the following description is given of the process steps of the embodiment with reference to the accompanying drawings.
Step 100: photoresist removing and roughening treatment for carbon fiber
The carbon fiber was burned in a heating furnace at 420 ℃ for 1 hour, followed by soaking in acetone for 1 hour, washing with water 5 times, and immersing the degummed carbon fiber in concentrated nitric acid for 1 hour. Then washing with water for 5 times;
step 200: sensitization and activation treatment of carbon fiber
(1) Preparing a sensitization solution, namely placing 20g of stannous chloride in a beaker, adding 40ml of hydrochloric acid, adding deionized water, stirring uniformly, pouring the mixed solution into a 500ml volumetric flask for constant volume, placing a proper amount of tin particles in the beaker, placing coarsened carbon fibers in the beaker, adding the sensitization solution until the carbon fibers are not used, and treating for 25 minutes at normal temperature;
(2) Preparing an activation solution, taking 0.05g of palladium chloride in a beaker, adding a proper amount of deionized water to dissolve the palladium chloride, pouring the solution into a 500ml volumetric flask to fix the volume, and putting sensitized carbon fibers into the activation solution for normal temperature treatment for 25min;
step 300: reduction treatment of carbon fibers
Preparing a reducing solution, and putting the activated carbon fiber into 30g/L sodium hypophosphite solution for normal temperature treatment for 1min;
step 400: chemical nickel plating for carbon fiber
(1) Preparing a main salt solution A1 of an electroless nickel-phosphorus alloy: comprises 500ml deionized water, main salt nickel sulfate (NiSO 4 ·6H 2 O) 15g, complexing agent sodium citrate (Na 3 C 6 H 5 O 7 ·2H 2 O) 12.5g and ammonium chloride (NH) 4 Cl) 10g, and fully stirring to uniformly mix the materials;
(2) A reducing agent solution A2 was prepared, and sodium hypophosphite (NaH) as a reducing agent was added to 500ml of water 2 PO 2 ·H 2 O)；
(3) And mixing A1 and A2 to perform magnetic field assisted chemical nickel-phosphorus alloy plating, wherein the magnetic field intensity is 4T, the pH value is about 8, the temperature is 70 ℃, the reaction time is 50min, sodium hydroxide is used for regulating the pH value in the reaction, 15-15 g/L sodium acetate solution is used as a pH buffer, then the carbon fiber is centrifugally separated and vacuum filtered, and finally the carbon fiber with the surface plated with a uniform nickel layer is obtained by drying in a vacuum drying oven at the temperature of 120 ℃.
Fig. 4 is an SEM image of electroless nickel plating of carbon fiber under the presence or absence of a magnetic field, wherein fig. (a) is an SEM image of electroless nickel plating of carbon fiber under the absence of a magnetic field, fig. (b) is an SEM image of electroless nickel plating of carbon fiber under the effect of weak magnetic field, and fig. (c) is an SEM image of electroless nickel plating of carbon fiber under the effect of strong magnetic field.
Example III
The embodiment provides a preparation method of magnetic field assisted Zr-Cu-Ni-Al amorphous alloy rod electroless nickel plating, and the following description is made on the process steps of the embodiment by referring to the accompanying drawings.
Step 100: polishing treatment of Zr-Cu-Ni-Al amorphous alloy rod
Polishing Zr-Cu-Ni-Al amorphous alloy rods with the side section diameter of 2mm and the length of about 5cm from small to large by using sand paper of different types respectively, and removing oxide layers and the like on the amorphous surfaces;
step 200: oil removal and cleaning of Zr-Cu-Ni-Al amorphous alloy rod
Carrying out oil removal treatment on the polished amorphous sample by adopting an oil removing agent, and putting the amorphous sample into absolute ethyl alcohol, and carrying out ultrasonic vibration for 15min so as to achieve the purpose of cleaning the sample;
step 300: electroless nickel plating of Zr-Cu-Ni-Al amorphous alloy
(1) Preparing a main salt solution A1 of an electroless nickel-phosphorus alloy: comprises 500ml deionized water, main salt nickel sulfate (NiSO) 4 ·6H 2 O) 15g, complexing agent sodium citrate (Na 3 C 6 H 5 O 7 ·2H 2 O) 12.5g and ammonium chloride (NH) 4 Cl) 10g, and fully stirring to uniformly mix the materials;
(2) Preparing a reducer solution A2, and adding 10g of reducer sodium hypophosphite into 500ml of water;
(3) And mixing A1 and A2 to perform magnetic field assisted chemical nickel-phosphorus alloy plating, wherein the magnetic field strength is 4T, the pH value is about 8, the temperature is 70 ℃, the reaction time is 50min, the pH value is regulated by sodium hydroxide solution in the reaction, 10-15 g/L sodium acetate solution is used as a pH buffer agent, and finally the mixture is dried in a vacuum drying oven at the temperature of 120 ℃ to obtain the Zr-Cu-Ni-Al amorphous alloy with the surface plated with a uniform nickel layer.
FIG. 5 is an SEM image of a cross section of an electroless nickel coating of a Zr-Cu-Ni-Al amorphous alloy rod in the presence or absence of a magnetic field, wherein FIG. (a) is an SEM image of a cross section of an electroless nickel coating of a Zr-Cu-Ni-Al amorphous alloy rod in the absence of a magnetic field, with a thickness of 2.86 μm; the drawing (b) is an SEM image of a cross section of an electroless nickel coating of a Zr-Cu-Ni-Al amorphous alloy rod under the action of weak magnetism, and the thickness is 6.09 mu m; and (c) is an SEM image of a cross section of the electroless nickel coating of the Zr-Cu-Ni-Al amorphous alloy rod under the action of strong magnetic force, and the thickness is 38.46 mu m.
Therefore, the preparation method of the magnetic field assisted chemical nickel plating adopts the magnetic field to chemically plate the magnetic metal nickel on the surfaces of various substrates, and the magnetic metal nickel ions in the plating solution are reduced into the metal nickel under the action of the reducing agent. Under the action of an externally applied magnetic field, nickel ions are accelerated to be adsorbed in the structure of the base material, so that the rate of chemical plating is improved; meanwhile, the magnetic metal nickel on the surface of the base material stretches the base material under the action of a magnetic field, so that the uniformity of the obtained coating is improved, the obtained coating is compact in structure, small in pore space and good in binding force, and the defect of poor binding between the base material and the metal coating is overcome.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to assist in understanding the methods of the present invention and the core ideas thereof; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.
Claims (9)
1. A preparation method of magnetic field assisted chemical nickel plating comprises purifying, sensitization and activation pretreatment of a substrate, forming a noble metal catalytic reduction center on the surface of the substrate, and forming a magnetic metal layer on the surface of the substrate by using a chemical nickel plating method under the assistance of a magnetic field, wherein the intensity of an externally applied auxiliary magnetic field is 0.01-5T during chemical plating, magnets are symmetrically arranged at the periphery or at two sides of a chemical plating container, electrons in the substrate are all moved in the same direction by the magnetic field generated by the magnets, and magnetic metal particles form a magnetic metal coating on the surface of the substrate, and the thickness of the magnetic metal coating is 1-1000nm.
2. The method for preparing the magnetic field assisted electroless nickel plating according to claim 1, wherein the substrate is one or more of copper, aluminum, iron alloy, amorphous alloy and carbon fiber.
3. The method for preparing the magnetic field assisted electroless nickel plating according to claim 1, which is characterized by comprising the following steps:
purifying, sensitizing and activating the base material;
preparing an electroless plating main salt mixed solution A1 and an electroless plating reduction mixed solution A2;
placing the pretreated base material into a main salt mixed solution A1, and forming a uniform suspension A3 under the action of external force;
placing the reduction mixed solution A2 in the suspension A3, placing the electroless plating container in a magnetic field, and controlling the strength of the magnetic field, the electroless plating time, the pH value and the temperature;
separating and extracting the substrate chemically plated with nickel on the lower surface under the assistance of a magnetic field by high-speed centrifugal separation or vacuum suction filtration, and drying to obtain a uniform nickel layer well combined with the surface of the substrate.
4. A method of preparing magnetic field assisted electroless nickel plating according to claim 3, wherein said purification is performed by physical or chemical oxidation;
the physical method is one or more of grinding, ultrasonic dispersion and centrifugal dispersion;
the chemical oxidation method is one or more of a gas phase oxidation method, a liquid phase oxidation method, a solid phase oxidation method, an electrooxidation method and an intercalation oxidation method.
5. A method for preparing magnetic field assisted electroless nickel plating according to claim 3, characterized in that the unused substrate pretreatment methods are different, comprising the following specific steps:
selecting alloy as a base material, removing greasy dirt and impurities on the surface of the material by acid washing and alkali washing, removing an oxide film on the surface of the material by multiple zincating treatments, improving the activity of the material, and increasing the binding force with a plating layer;
carbon fibers are selected as a base material, a colloid target one-step activation method or a stannous chloride and palladium chloride two-step method is adopted to respectively sensitize and activate the carbon fibers, and one or more methods of magnetic stirring, heating stirring and ultrasonic dispersing are adopted to fully disperse the carbon fibers;
the amorphous alloy is selected as a base material, and the oxidation layer and impurities on the surface of the base material are removed by adopting polishing, degreasing and cleaning methods, so that the activity of the amorphous alloy is improved.
6. The method for preparing the magnetic field assisted chemical nickel plating according to claim 3, wherein the main salt mixed solution A1 comprises one or more of nickel sulfate, nickel chloride, ferric sulfate, ferric chloride, cobalt sulfate and cobalt chloride.
7. The method for preparing the magnetic field assisted chemical nickel plating according to claim 3, wherein the reducing mixed solution A2 comprises one or more of citric acid, sodium citrate, sodium hypophosphite, sodium borohydride, alkylamine boranes, hydrazine or salts thereof, hydrazine hydrate, formaldehyde and glucose.
8. The method for preparing the magnetic field assisted electroless nickel plating according to claim 3, wherein the electroless plating time is 0.1-5 h, the pH value is 8-12 of alkaline electroless plating solution, the acidic electroless plating solution is 4-6, and the temperature is 0-90 ℃.
9. The method for preparing the magnetic field assisted chemical nickel plating according to claim 3, wherein the drying temperature is 80-150 ℃ and the drying time is 0.5-4 h.
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