CN117410212B - Irregular tuning fork wafer folding method and system - Google Patents
Irregular tuning fork wafer folding method and system Download PDFInfo
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- CN117410212B CN117410212B CN202311705585.2A CN202311705585A CN117410212B CN 117410212 B CN117410212 B CN 117410212B CN 202311705585 A CN202311705585 A CN 202311705585A CN 117410212 B CN117410212 B CN 117410212B
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000001788 irregular Effects 0.000 title claims abstract description 27
- 235000012431 wafers Nutrition 0.000 claims abstract description 79
- 230000003014 reinforcing effect Effects 0.000 claims description 16
- 238000004458 analytical method Methods 0.000 claims description 6
- 238000004590 computer program Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000012545 processing Methods 0.000 abstract description 7
- 239000013078 crystal Substances 0.000 abstract description 2
- 238000012797 qualification Methods 0.000 abstract description 2
- 238000003860 storage Methods 0.000 description 6
- 238000004364 calculation method Methods 0.000 description 2
- 238000007405 data analysis Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229940095676 wafer product Drugs 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
The invention relates to the technical field of crystal processing, in particular to an irregular tuning fork wafer folding method and system, wherein the folding method comprises the following steps: acquiring coordinate data of an original wafer, and establishing a rectangular coordinate system according to the coordinate data; modifying the index and the use state of the coordinate data corresponding to the fixed frame position; extracting coordinate data with the same ordinate in a rectangular coordinate system to form a tree data structure, and marking sub-nodes corresponding to the coordinate data of each tuning fork wafer in the tree data structure; the method comprises the steps of obtaining folding knife information in a folding knife mechanism, analyzing the service condition of the folding knife according to a tree data structure, child nodes and the folding knife information, and determining a folding path of the folding knife according to the service condition of the folding knife; and controlling the folding knife to operate according to the folding path so as to fold the original wafer and obtain the tuning fork wafer. The invention improves the folding efficiency of the tuning fork wafers, improves the qualification rate of the tuning fork wafers after folding, and reduces the production cost.
Description
Technical Field
The invention relates to the technical field of crystal processing, in particular to a tuning fork wafer irregular folding method and system.
Background
Along with the continuous development of electronic product processing miniaturization, tuning fork wafer is folded and still adopts traditional manual folding, and manual folding has production efficiency low, and manual folding easily causes irreversible damage to tuning fork wafer product surface, can't carry out quality control, makes the production control be in the edge of risk, and manufacturing cost rises simultaneously.
Disclosure of Invention
The present invention is directed to solving at least one of the technical problems existing in the related art. Therefore, the invention provides the irregular folding method of the tuning fork wafer, which solves the technical problems that the traditional tuning fork wafer is easy to damage and the production is uncontrollable in the folding process, improves the folding efficiency of the tuning fork wafer, improves the qualification rate of the tuning fork wafer after folding, and reduces the production cost.
The invention provides an irregular folding method of a tuning fork wafer, wherein an original wafer comprises a fixed frame and a bearing plate, a plurality of tuning fork wafers are borne on the bearing plate at intervals, and the method comprises the following steps:
s1: acquiring coordinate data of an original wafer, and establishing a rectangular coordinate system according to the coordinate data, wherein the coordinate data comprises an abscissa, an ordinate, an index and a use state;
s2: modifying the index and the use state of the coordinate data corresponding to the fixed frame position;
s3: extracting coordinate data with the same ordinate in the rectangular coordinate system to form a tree data structure, and marking sub-nodes corresponding to the coordinate data of each tuning fork wafer in the tree data structure;
s4: the method comprises the steps of obtaining folding knife information in a folding knife mechanism, analyzing the service condition of a folding knife according to the tree data structure, the child nodes and the folding knife information, and determining a folding path of the folding knife according to the service condition of the folding knife;
s5: and controlling the folding knife to operate according to the folding path so as to fold the original wafer, and obtaining the tuning fork wafer.
The invention further improves the irregular folding method of the tuning fork wafer, wherein the step S1 further comprises the following steps:
s11: acquiring row spacing and column spacing of the original wafer;
s12: and dot-matrix the pattern formed by the row spacing and the column spacing to form coordinate data.
The irregular folding method of the tuning fork wafer is further improved in that the bearing plate comprises a plurality of reinforcing ribs which are arranged transversely and longitudinally in a crossing way,
based on the fact that before the child node is marked,
s31: modifying the use state of the coordinate data corresponding to the positions of the reinforcing ribs;
s32: dividing a plurality of areas in the tree data structure according to the coordinate data of the positions of the reinforcing ribs, marking each area as a father node, and analyzing the coordinate data marking child nodes corresponding to each tuning fork wafer in each father node.
The irregular folding method of the tuning fork wafer is further improved, and the irregular folding method further comprises the following steps:
based on the marking of the child node in step S3,
s321: arranging the coordinate data in the father node in an increasing condition according to the abscissa;
s322: taking the minimum value of the abscissa in the coordinate data as the first coordinate data of a child node;
s323: subtracting the abscissa of the first coordinate data from the abscissa of the coordinate data in sequence to obtain a difference value, comparing the difference value with the transverse width of the tuning fork wafer, and when the difference value is larger than the transverse width of the tuning fork wafer, establishing another sub-node by using the coordinate data and taking the coordinate data as the first coordinate data of the corresponding sub-node;
s324: and repeating S323 until analysis is completed, wherein the analysis corresponds to all coordinate data in the father node.
The irregular folding method of the tuning fork wafer is further improved in that the folding knife comprises a main folding knife and an auxiliary folding knife,
based on the information of the folding knife in the folding knife mechanism obtained in the step S4,
s41: identifying a first tooth number of the main folding knife and a second tooth number of the auxiliary folding knife;
s42: judging the number of child nodes under each father node;
s43: comparing the number of child nodes with the first number of teeth;
s44: when the number of the child nodes is greater than or equal to the first tooth number, a corresponding parent node uses a main folding knife;
s45: and when the number of the child nodes is smaller than the first tooth number, the corresponding parent node uses the auxiliary folding knife.
The irregular folding method of the tuning fork wafer is further improved in that the main folding knife comprises a plurality of first knife teeth which are arranged at intervals;
based on the determination that the primary folding knife is in use,
s441: acquiring a first tooth number of the first cutter tooth;
s442: recording first coordinate data of child nodes in the corresponding father nodes;
s443: sequentially summing the index of the coordinate data of the child node with the first tooth number to obtain a numerical value;
s444: comparing the quantity value with the quantity of the child nodes in the corresponding father node;
s445: and when the number value is greater than or equal to the number of the child nodes corresponding to the parent node, the termination position of the main folding knife corresponding to the parent node is obtained.
The irregular folding method of the tuning fork wafer is further improved in that the auxiliary folding knife comprises a plurality of second knife teeth which are arranged at intervals;
based on the determination that the auxiliary folding knife is used,
s451: obtaining a second tooth number of the second cutter tooth;
s452: recording first coordinate data of child nodes in the corresponding father nodes;
s453: sequentially summing the index of the coordinate data of the child node with the second tooth number to obtain a numerical value;
s454: comparing the quantity value with the quantity of the child nodes in the corresponding father node;
s455: and when the number value is greater than or equal to the number of the child nodes corresponding to the parent node, the ending position of the auxiliary folding knife corresponding to the parent node is obtained.
The irregular folding method of the tuning fork wafer is further improved, and the irregular folding method further comprises the following steps:
s46: establishing a folding knife path coordinate set according to the corresponding relation between the child node in the father node and the folding knife, according to the termination position of the main folding knife corresponding to the father node and according to the termination position of the auxiliary folding knife corresponding to the father node;
s47: and controlling the folding path of the folding knife according to the folding knife path coordinate set.
An irregular folding system of tuning fork wafers is used for executing the irregular folding method, and comprises a storage module and an execution module, wherein a computer program is stored in the storage module, and the storage module is in control connection with the execution module.
The irregular folding method of the tuning fork wafer is based on the primary coordinate data of the tuning fork wafer, performs secondary data analysis and calculation to form specific folding path planning data, realizes automatic production requirements, overcomes the defect of traditional manual folding, improves the processing efficiency and the processing precision, and is suitable for folding tuning fork wafers of any different specifications.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flow chart of a method of irregularly picking up a tuning fork wafer according to the present invention.
FIG. 2 is a schematic diagram of an original wafer according to the present invention.
Fig. 3 is a schematic view of a tuning fork wafer obtained by folding in the present invention.
Fig. 4 is a schematic view of a main folding knife of the folding knife structure of the present invention.
Fig. 5 is a schematic view of an auxiliary folding knife of the folding knife structure of the present invention.
Reference numerals:
1. fixing the frame; 2. a carrying plate; 3. reinforcing ribs; 4. a main folding knife; 5. an auxiliary folding knife; 6. tuning fork wafers; 61. and (5) connecting wires.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. The following examples are illustrative of the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In describing embodiments of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present invention will be understood in detail by those of ordinary skill in the art.
In embodiments of the invention, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
The following describes an irregular folding method of tuning fork wafers 6 according to the present invention with reference to fig. 1, wherein an original wafer includes a fixed frame 1 and a carrier plate 2, and a plurality of tuning fork wafers 6 are supported on the carrier plate 2 at intervals, and the method comprises the following steps:
s1: acquiring coordinate data of an original wafer, and establishing a rectangular coordinate system according to the coordinate data, wherein the coordinate data comprises an abscissa, an ordinate, an index and a use state;
s2: modifying the index and the use state of the coordinate data corresponding to the position of the fixed frame 1;
s3: extracting coordinate data with the same ordinate in the rectangular coordinate system to form a tree data structure, and marking sub-nodes corresponding to the coordinate data of each tuning fork wafer 6 in the tree data structure;
s4: the method comprises the steps of obtaining folding knife information in a folding knife mechanism, analyzing the service condition of a folding knife according to the tree data structure, the child nodes and the folding knife information, and determining a folding path of the folding knife according to the service condition of the folding knife;
s5: and controlling the folding knife to operate according to the folding path so as to fold the original wafer, and obtaining the tuning fork wafer 6.
Preferably, a plurality of carrier plates 2 are arranged on the original wafer at intervals along the height direction, the heights of the carrier plates 2 and the tuning fork wafers 6 are matched, a plurality of tuning fork wafers 6 are arranged on the original wafer at intervals along the length direction of the carrier plates 2, and the tuning fork wafers 6 and the carrier plates 2 are connected through a plurality of connecting points.
Preferably, as shown in fig. 3, the connection point is a connection line, a connection line is arranged between the top of the tuning fork wafer 6 and the carrier plate 2, two connection lines 61 are arranged between the bottom of the tuning fork wafer 6 and the carrier plate 2, and the tuning fork wafer 6 can be taken down from the carrier plate 2 only by cutting off the connection lines 61 by a folding knife.
Preferably, as shown in fig. 2, in a specific embodiment, the middle part of the fixed frame 1 is circular, and the middle part is provided with a reinforcing belt, and the bearing plate 2 is arranged at a corresponding circular position.
In a preferred embodiment of the method for irregularly picking up a tuning fork wafer of the present invention, the step S1 further includes:
s11: acquiring row spacing and column spacing of the original wafer;
s12: and dot-matrix the pattern formed by the row spacing and the column spacing to form coordinate data.
Preferably, when the original coordinates are obtained, only the abscissa and the ordinate after the connection at the connecting line of all the bearing plates 2 corresponding to the same position are correspondingly obtained.
Preferably, the coordinate data in the rectangular coordinate system isWhere x is the abscissa, y is the ordinate, index is the index, and state is the state of use.
Preferably, the index of the coordinate data of the original wafer indicates the position, for example, the first data of the first row is 1-1, the usage state identifies the usage situation of the coordinate point, and when state=0 indicates that the coordinate of the corresponding position is not used, state=1 indicates that the ordinate of the corresponding position is used.
Further, as shown in fig. 2, the loading plate 2 includes a plurality of reinforcing ribs 3 disposed to intersect in a transverse and longitudinal direction,
based on the fact that before the child node is marked,
s31: modifying the use state of the coordinate data corresponding to the position of the reinforcing rib 3;
s32: dividing a plurality of areas in the tree data structure according to the coordinate data of the positions of the reinforcing ribs 3, marking each area as a father node, and analyzing the coordinate data marking child nodes corresponding to each tuning fork wafer 6 in each father node.
Preferably, the position of the reinforcing rib 3 is not provided with the tuning fork wafer 6, and the carrier plate 2 is broken if the folding knife cuts the corresponding position of the reinforcing rib 3, so that the folding knife needs to avoid the position of the reinforcing rib 3 in the process of folding the tuning fork wafer 6.
Specifically, the method further comprises the following steps:
based on the marking of the child node in step S3,
s321: arranging the coordinate data in the father node in an increasing condition according to the abscissa;
s322: taking the minimum value of the abscissa in the coordinate data as the first coordinate data of a child node;
s323: subtracting the abscissa of the first coordinate data from the abscissa of the coordinate data in sequence to obtain a difference value, comparing the difference value with the transverse width of the tuning fork wafer 6, and when the difference value is larger than the transverse width of the tuning fork wafer 6, establishing another sub-node by using the coordinate data and taking the coordinate data as the first coordinate data of the corresponding sub-node;
s324: and repeating S323 until analysis is completed, wherein the analysis corresponds to all coordinate data in the father node.
Preferably, after the corresponding child node is analyzed, the use state of the corresponding coordinate data is modified, the use state state=1 of the coordinate data of the corresponding child node, and the use state state=0 of the coordinate data of the non-corresponding child node.
Further, as shown in fig. 4 and 5, the folding knife includes a main folding knife 4 and an auxiliary folding knife 5,
based on the information of the folding knife in the folding knife mechanism obtained in the step S4,
s41: identifying a first tooth number of the main folding knife 4 and identifying a second tooth number of the auxiliary folding knife 5;
s42: judging the number of child nodes under each father node;
s43: comparing the number of child nodes with the first number of teeth;
s44: when the number of the child nodes is greater than or equal to the first tooth number, the corresponding parent node uses the main folding knife 4;
s45: when the number of the child nodes is smaller than the first number of teeth, the corresponding parent node uses the auxiliary folding knife 5.
Preferably, the main folding knife 4 or the auxiliary folding knife 5 is planned to be used according to the number of the child nodes, so that the movement frequency of the folding knife is reduced, and the folding efficiency of the folding knife mechanism is improved.
Further, the main folding knife 4 comprises a plurality of first knife teeth which are arranged at intervals;
based on the determination that the main folding knife 4 is used,
s441: acquiring a first tooth number of the first cutter tooth;
s442: recording first coordinate data of child nodes in the corresponding father nodes;
s443: sequentially summing the index of the coordinate data of the child node with the first tooth number to obtain a numerical value;
s444: comparing the quantity value with the quantity of the child nodes in the corresponding father node;
s445: and when the number value is greater than or equal to the number of the child nodes corresponding to the parent node, the termination position of the parent node corresponding to the main folding knife 4 is obtained.
Preferably, the power mechanism of the folding knife mechanism sends out a pulse, the corresponding main folding knife 4 moves by a set distance, when the main folding knife 4 folds the position corresponding to one father node, the first falling position of the main folding knife 4 is the position corresponding to the minimum value of the abscissa, the final falling position of the tail end is the position corresponding to the maximum value of the abscissa, and then the power mechanism of the folding knife mechanism sends out a set pulse value, so that the first end of the main folding knife 4 corresponds to the position corresponding to the minimum value of the abscissa in the next father node.
Further, the auxiliary folding knife 5 comprises a plurality of second knife teeth which are arranged at intervals;
based on the determination that the auxiliary folding knife 5 is used,
s451: obtaining a second tooth number of the second cutter tooth;
s452: recording first coordinate data of child nodes in the corresponding father nodes;
s453: sequentially summing the index of the coordinate data of the child node with the second tooth number to obtain a numerical value;
s454: comparing the quantity value with the quantity of the child nodes in the corresponding father node;
s455: and when the number value is greater than or equal to the number of the child nodes corresponding to the parent node, the ending position of the auxiliary folding knife 5 corresponding to the parent node is obtained.
Preferably, the power mechanism of the folding knife mechanism sends a pulse, the corresponding auxiliary folding knife 5 moves for a set distance, when the auxiliary folding knife 5 folds the position corresponding to one father node, the first falling position of the head end of the auxiliary folding knife 5 is the position corresponding to the minimum value of the abscissa, the final falling position of the tail end is the position corresponding to the maximum value of the abscissa, and then the power mechanism of the folding knife mechanism sends a set pulse value, so that the head end of the auxiliary folding knife 5 corresponds to the position of the minimum value of the abscissa in the next father node.
Specifically, the method further comprises the following steps:
s46: establishing a folding knife path coordinate set according to the corresponding relation between the child node in the father node and the folding knife, according to the termination position of the main folding knife 4 corresponding to the father node and according to the termination position of the auxiliary folding knife 5 corresponding to the father node;
s47: and controlling the folding path of the folding knife according to the folding knife path coordinate set.
Preferably, the data in the folding knife path coordinate set includes an abscissa, an ordinate, a folding knife index, and a state, wherein the abscissa and the ordinate correspond to coordinate data in the tree data structure, the folding knife index represents a moving position of the folding knife, and the state represents the use of the main folding knife 4 or the auxiliary folding knife 5.
Preferably, the width of the first cutter teeth of the main folding knife 4 is larger than the width of the second cutter teeth of the auxiliary folding knife 5, and the number of the first cutter teeth of the main folding knife 4 is smaller than the number of the second cutter teeth of the auxiliary folding knife 5, so that the main folding knife 4 can move for a plurality of times, the main folding knife 4 is prevented from moving to the position of the reinforcing rib 3, and the main folding knife 4 and the auxiliary folding knife 5 are convenient to avoid the reinforcing rib 3.
An irregular folding system of tuning fork wafers is used for executing the irregular folding method, and comprises a storage module and an execution module, wherein a computer program is stored in the storage module, and the storage module is in control connection with the execution module.
The irregular folding method of the tuning fork wafer is based on the original coordinate data of the tuning fork wafer 6, performs secondary data analysis and calculation to form specific folding path planning data, realizes automatic production requirements, overcomes the defects of traditional manual folding, improves the processing efficiency and the processing precision, and is suitable for folding any tuning fork wafer 6 with different specifications.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. The irregular folding method of the tuning fork wafer is characterized by comprising the following steps of:
s1: acquiring coordinate data of an original wafer, and establishing a rectangular coordinate system according to the coordinate data, wherein the coordinate data comprises an abscissa, an ordinate, an index and a use state;
s2: modifying the index and the use state of the coordinate data corresponding to the fixed frame position;
s3: extracting coordinate data with the same ordinate in the rectangular coordinate system to form a tree data structure, and marking sub-nodes corresponding to the coordinate data of each tuning fork wafer in the tree data structure;
s4: the method comprises the steps of obtaining folding knife information in a folding knife mechanism, analyzing the service condition of a folding knife according to the tree data structure, the child nodes and the folding knife information, and determining a folding path of the folding knife according to the service condition of the folding knife;
s5: and controlling the folding knife to operate according to the folding path so as to fold the original wafer, and obtaining the tuning fork wafer.
2. The method of claim 1, wherein the step S1 further comprises:
s11: acquiring row spacing and column spacing of the original wafer;
s12: and dot-matrix the pattern formed by the row spacing and the column spacing to form coordinate data.
3. The method of claim 1, wherein the carrier plate comprises a plurality of reinforcing ribs disposed to intersect in a horizontal and vertical direction,
based on the fact that before the child node is marked,
s31: modifying the use state of the coordinate data corresponding to the positions of the reinforcing ribs;
s32: dividing a plurality of areas in the tree data structure according to the coordinate data of the positions of the reinforcing ribs, marking each area as a father node, and analyzing the coordinate data marking child nodes corresponding to each tuning fork wafer in each father node.
4. The irregular retrieving method of tuning fork wafers as claimed in claim 3, further comprising:
based on the marking of the child node in step S3,
s321: arranging the coordinate data in the father node in an increasing condition according to the abscissa;
s322: taking the minimum value of the abscissa in the coordinate data as the first coordinate data of a child node;
s323: subtracting the abscissa of the first coordinate data from the abscissa of the coordinate data in sequence to obtain a difference value, comparing the difference value with the transverse width of the tuning fork wafer, and when the difference value is larger than the transverse width of the tuning fork wafer, establishing another sub-node by using the coordinate data and taking the coordinate data as the first coordinate data of the corresponding sub-node;
s324: and repeating S323 until analysis is completed, wherein the analysis corresponds to all coordinate data in the father node.
5. The method of claim 4, wherein the pocket knife comprises a main pocket knife and an auxiliary pocket knife,
based on the step S4, obtaining the folding knife information in the folding knife mechanism;
s41: identifying a first tooth number of the main folding knife and a second tooth number of the auxiliary folding knife;
s42: judging the number of child nodes under each father node;
s43: comparing the number of child nodes with the first number of teeth;
s44: when the number of the child nodes is greater than or equal to the first tooth number, a corresponding parent node uses a main folding knife;
s45: and when the number of the child nodes is smaller than the first tooth number, the corresponding parent node uses the auxiliary folding knife.
6. The method of claim 5, wherein the main folding blade comprises a plurality of first teeth arranged at intervals;
based on the determination that the primary folding knife is in use,
s441: acquiring a first tooth number of the first cutter tooth;
s442: recording first coordinate data of child nodes in the corresponding father nodes;
s443: sequentially summing the index of the coordinate data of the child node with the first tooth number to obtain a numerical value;
s444: comparing the quantity value with the quantity of the child nodes in the corresponding father node;
s445: and when the number value is greater than or equal to the number of the child nodes corresponding to the parent node, the termination position of the main folding knife corresponding to the parent node is obtained.
7. The method of claim 6, wherein the auxiliary folding blade comprises a plurality of second blades spaced apart;
based on the determination that the auxiliary folding knife is used,
s451: obtaining a second tooth number of the second cutter tooth;
s452: recording first coordinate data of child nodes in the corresponding father nodes;
s453: sequentially summing the index of the coordinate data of the child node with the second tooth number to obtain a numerical value;
s454: comparing the quantity value with the quantity of the child nodes in the corresponding father node;
s455: and when the number value is greater than or equal to the number of the child nodes corresponding to the parent node, the ending position of the auxiliary folding knife corresponding to the parent node is obtained.
8. The method of irregular retrieval of a tuning fork wafer according to claim 7, further comprising:
s46: establishing a folding knife path coordinate set according to the corresponding relation between the child node in the father node and the folding knife, according to the termination position of the main folding knife corresponding to the father node and according to the termination position of the auxiliary folding knife corresponding to the father node;
s47: and controlling the folding path of the folding knife according to the folding knife path coordinate set.
9. An irregular retrieval system for tuning fork wafers for performing the irregular retrieval method according to any one of claims 1 to 8, comprising a memory module and an execution module, wherein the memory module has a computer program stored therein, and wherein the memory module is in control connection with the execution module.
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