CN117343483B - Epoxy resin molding compound with high transmittance and low release force, and preparation method and application thereof - Google Patents
Epoxy resin molding compound with high transmittance and low release force, and preparation method and application thereof Download PDFInfo
- Publication number
- CN117343483B CN117343483B CN202311659890.2A CN202311659890A CN117343483B CN 117343483 B CN117343483 B CN 117343483B CN 202311659890 A CN202311659890 A CN 202311659890A CN 117343483 B CN117343483 B CN 117343483B
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- molding compound
- resin molding
- agent
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 73
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 73
- 238000000465 moulding Methods 0.000 title claims abstract description 36
- 238000002834 transmittance Methods 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 150000001875 compounds Chemical class 0.000 title claims description 33
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 239000004033 plastic Substances 0.000 claims abstract description 8
- 229920003023 plastic Polymers 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 11
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 11
- 239000003963 antioxidant agent Substances 0.000 claims description 10
- 230000003078 antioxidant effect Effects 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 239000007822 coupling agent Substances 0.000 claims description 8
- 150000001412 amines Chemical class 0.000 claims description 7
- 239000002518 antifoaming agent Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- -1 alicyclic amine Chemical class 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims description 2
- 239000013530 defoamer Substances 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000005022 packaging material Substances 0.000 abstract description 6
- 230000035939 shock Effects 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 3
- 239000012778 molding material Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 14
- 238000012360 testing method Methods 0.000 description 12
- 229920006336 epoxy molding compound Polymers 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 238000007718 adhesive strength test Methods 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229940057995 liquid paraffin Drugs 0.000 description 2
- 229920000747 poly(lactic acid) Polymers 0.000 description 2
- 239000004626 polylactic acid Substances 0.000 description 2
- 230000003578 releasing effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical group CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to the technical field of optical epoxy resin packaging, in particular to an epoxy resin plastic packaging material with high transmittance and low release force, a preparation method and application thereof, wherein the preparation raw materials of the epoxy resin plastic packaging material comprise: epoxy resin, parting agent and curing agent. By adding the specific release agent, tepic-s or Tepic-ss in the system can keep excellent performance of low light attenuation and thermal shock resistance at minus 40-125 ℃, meanwhile, the problem that a mold is easy to be stuck in the molding process can be solved, and the prepared epoxy resin molding material has the characteristics of high transmittance, low release force and low light attenuation, and solves the problem that three effects cannot be cooperated in the prior art.
Description
Technical Field
The invention relates to the technical field of optical epoxy resin packaging, in particular to an epoxy resin plastic packaging material with high transmittance and low release force, and a preparation method and application thereof.
Background
In the field of optical epoxy resin packaging materials of automotive semiconductor devices, in order to meet the requirements of IATF and 16949 standards in the automotive industry, characteristic epoxy resins Tepic-s or Tepic-ss with lower refractive index (less than 1.52%) and higher transmittance (more than 80%) are often used. The epoxy resin has the characteristics of low molecular weight, high number of epoxy groups per unit mass and higher crosslinking density than bisphenol A epoxy resin commonly used in the market, and the epoxy resin has the excellent performance of low light attenuation and thermal shock resistance at-40-125 ℃ by virtue of the characteristics, but the problem of sticking to the mold is more easily generated in the molding process, and the problem is solved by adding a mold release agent. The existing release agent with excellent performance on the market is generally high in refractive index, so that the problem of low system transmittance after being added exists, and the release agent with low refractive index cannot achieve the release effect, so that the release agent is difficult to achieve both release effect and the problem of transmittance after the epoxy resin molding material system is molded.
The epoxy resin system without the release agent has various problems in the packaging link, such as poor continuous operation performance, the release agent needs to be sprayed on the surface of the die after continuous production of a certain modulus, the requirement of the semiconductor material for the vehicle gauge on light transmittance is higher, and the residual release agent can pollute the surface of the die, so that the consistency of the packaged product is poor; the customer needs to spray the release agent once every mould pressing, and the mould needs to be cleaned once every 3 moulds, so that the mould sticking problem is prevented, the production efficiency is seriously reduced, and the like. The epoxy resin system without the release agent has certain advantages in the packaging link, such as high transmittance; the adhesive force is strong; good reliability, etc.
The epoxy resin system added with the release agent has various problems in the packaging link, such as low adhesion, obvious cracking of the contact surface of the plastic packaging material and the substrate after the packaging body circulates at high and low temperatures of-40-125 ℃, or low transmittance, and reduced transmittance of the packaging material. After the release agent is added, the product is attractive in surface and high in product stability. The downstream customer can spray the parting agent once every 5 moulds, continuously produce 30-50 moulds and then moisten the moulds once, and greatly improve the production efficiency.
The Chinese invention patent with publication number of CN116063886A and publication date of 2023, 5 and 5 provides a high-temperature resistant non-silicon release material, a non-silicon release film, a preparation method and application thereof, and can be applied to the high-temperature resistant non-silicon release film in the fields of electronic chips, electronic device manufacturing and processing, ion exchange resin films and the like.
Disclosure of Invention
The first aspect of the invention provides an epoxy resin molding compound with high transmittance and low release force, which is prepared from the following raw materials: epoxy resin, a release agent and a curing agent, wherein the structural formula of the release agent is shown in the formula I,
A method for preparing the compound of formula I,
Wherein n is a polyethylene segment, n is more than 12 and less than 27, m is a polylactic acid segment, m is more than 1 and less than 105, the polyethylene segment mainly plays a role in releasing in the system, and when n is less than 12, the releasing effect cannot be achieved, and when n is more than 27, even if m is more than 105, the polyethylene segment cannot be melted and transparent in an epoxy resin system. The polylactic acid fragment plays a role in improving the compatibility with epoxy resin in a system, and the release agent is opaque when m is smaller than 1, and cannot effectively achieve the release effect when m is larger than 105. The applicant found in a large number of research experiments that the release property increases with the increase of the n value, and the transparency increases with the increase of the m value, and only when n is more than 12 and less than 27 and m is more than 1 and less than 105, the effects of high transmittance and low release force can be achieved.
Further, the relative molecular mass of the release agent is 408-8316, and the preferred source is Bekkes.
In some embodiments, the epoxy resin comprises at least one of epoxy resin Tepic-s, epoxy resin Tepic-ss.
The release agent is specifically used in epoxy resin Tepic-s and/or epoxy resin Tepic-ss systems, the molecular weight of the epoxy resin is low, but the number of epoxy groups per unit mass is high, so that the crosslinking density of the epoxy resin is higher than that of bisphenol A epoxy resin in the prior art, and the epoxy resin has the excellent performance of low light attenuation and thermal shock resistance at-40-125 ℃, but the problem of sticking to a mold is more easily generated in the molding process. Epoxy Tepic-s, and epoxy Tepic-ss are all commercially available from Nissan Chemie.
In some embodiments, the curing agent comprises at least one of a polyamide-based curing agent, an aliphatic amine-based curing agent, an aromatic amine-based curing agent, a cycloaliphatic amine-based curing agent, a polyether amine-based curing agent, an imidazole-based curing agent.
Further, the present invention is not particularly limited in the kind of the curing agent, and may be selected from the kinds commonly used in the art, for example, aliphatic amine-based curing agents.
In some embodiments, the preparation feedstock further comprises: at least one of Lan Guangji resistance, antioxidant, coupling agent, defoamer and catalyst.
Further, the present invention is not particularly limited in the kind of the blue light resistant agent, and may be selected from the kinds commonly used in the art, such as amine-based ultraviolet absorbers.
Further, the present invention is not particularly limited in the kind of antioxidant, and may be selected from the kinds commonly used in the art, such as amine antioxidants.
Further, the present invention is not particularly limited in the kind of the coupling agent, and may be selected from the kinds commonly used in the art, for example, silane coupling agents.
Further, the present invention is not particularly limited in the kind of the antifoaming agent, and may be selected from the kinds commonly used in the art, such as liquid paraffin.
Further, the present invention is not particularly limited in the kind of catalyst, and may be selected from the kinds commonly used in the art, such as imidazole-based catalysts.
In some embodiments, the epoxy molding compound has a 1mm transmission of > 80%.
In some embodiments, the release force of the epoxy molding compound is 0 to 45N but not 0.
In some embodiments, the blue light attenuation value of the epoxy resin molding compound is less than 2%, and the test conditions are as follows: 1000h,100 ℃ and 200mA.
In some embodiments, the adhesive strength of the epoxy molding compound to Ag and Cu varies by 1.30-1.50% relative to the adhesive strength of the epoxy molding compound without the release agent to Ag and Cu.
The special release agent is added into the epoxy resin Tepic-s and/or epoxy resin Tepic-ss system, and the prepared epoxy resin plastic package material can continuously operate about 30-50 mold cleaning dies once through testing; the transmittance of the molded 1mm sample wafer of the epoxy resin molding compound is higher than 80%, the lighting brightness of the packaged chip of the epoxy resin molding compound is higher than 98%, and the chip is far higher than the prior art, and the characteristics of high transmittance, low release force and low light attenuation are considered.
The second aspect of the invention provides a preparation method of an epoxy resin molding compound, which comprises the following steps:
S1, mixing and stirring epoxy resin and two-thirds to one-half of a curing agent to obtain a composition I;
S2, mixing and stirring the rest curing agent, the release agent, the Lan Guangji, the antioxidant, the coupling agent and the defoaming agent to obtain a composition II;
S3, mixing and stirring the first composition, the second composition and the catalyst to obtain the epoxy resin molding compound.
The third aspect of the invention provides application of the epoxy resin plastic package material, wherein the epoxy resin plastic package material is applied to packaging of semiconductor devices for vehicles.
Compared with the prior art, the invention has the following beneficial effects:
1. The release agent can effectively reduce the release force of an epoxy resin system in a body system, realize continuous operation of about 30-50 mold cleaning and wetting of the mold for one time, and remarkably reduce the cost;
2. the release agent disclosed by the invention has excellent compatibility with Tepic-s or Tepic-ss, the transmittance of a 1mm sample wafer after the molding of the prepared epoxy resin molding compound finished product is higher than 80%, and the lighting brightness of a chip after the encapsulation of the epoxy resin molding compound finished product is higher than 98%;
3. According to the invention, through the combined action of the specific release agent and other components, the prepared epoxy resin molding compound has the characteristics of high transmittance, low release force and low light attenuation, and the problem that three effects cannot be cooperated in the prior art is solved;
4. By adding a specific release agent, tepic-s or Tepic-ss in the system can keep excellent performance of low light attenuation and thermal shock resistance at minus 40-125 ℃, and meanwhile, the problem that a mold is easy to stick in the molding process can be solved;
5. The preparation method disclosed by the invention is simple in preparation process, low in raw material cost, suitable for large-scale production and good in application prospect.
Drawings
Fig. 1 is a physical diagram of the epoxy resin molding compound prepared in example 1, example 2 and example 3.
FIG. 2 is a graph of the release force test results.
FIG. 3 is a graph showing the transmittance test results.
FIG. 4 is a graph showing the results of the adhesive strength test.
Detailed Description
Example 1
An epoxy resin molding compound with high transmittance and low release force, which is prepared from the following raw materials: epoxy resin, a release agent, a curing agent, lan Guangji resistant, an antioxidant, a coupling agent, a defoaming agent and a catalyst, wherein the structural formula of the release agent is shown in the formula I,
A method for preparing the compound of formula I,
Where n=20 and m=50, purchased from beckhaus under the trade designation DIAX TM L-375.
The preparation method of the epoxy resin molding compound comprises the following steps:
S1, continuously stirring epoxy resin and two-thirds of curing agent for 10 hours at 80 ℃ to obtain a composition I;
s2, continuously stirring the rest curing agent, the release agent, the Lan Guangji, the antioxidant, the coupling agent and the defoaming agent for 40 minutes at 90 ℃ to obtain a composition II;
S3, continuously stirring the first composition, the second composition and the catalyst for 1.5 hours at the temperature of 80 ℃ to obtain the epoxy resin molding compound.
Example 2
The present embodiment is different from embodiment 1 in the addition amount of the release agent.
Example 3
This example differs from example 2 in the amount of release agent added.
Example 4
This example differs from example 2 in that n=13, m=2, purchased from beckhaus under the trade designation DIAX TM L-330.
Example 5
This example differs from example 2 in that n=26, m=104, purchased from beckhaus under the trade designation DIAX TM L-775.
Comparative example 1
This comparative example differs from example 2 in that the release agent is behenamide, purchased from aladine.
Comparative example 2
This comparative example differs from example 2 in that the release agent is a montan wax, purchased from cola.
Comparative example 3
This comparative example differs from example 2 in that the release agent is a silicone release agent, purchased from elken under the designation POLY 368.
Comparative example 4
This comparative example differs from example 2 in that n=50, m=120, purchased from beckhaus under the trade designation DIAX TM L-730.
Comparative example 5
This comparative example differs from example 2 in that n=3, m=1, purchased from beckhaus.
The preparation raw materials and parts by weight of examples 1 to 5 and comparative examples 1 to 5 are shown in Table 1. Wherein the Lan Guangji is a hindered amine ultraviolet absorber purchased from basf; the antioxidant is a hindered amine antioxidant, purchased from Cyanut, the coupling agent is a silane coupling agent, and purchased from Jiangxi morning light New Material Co., ltd; the defoaming agent is liquid paraffin, and is purchased from Tianjin Dongtian fine chemical reagent factories in Tianjin; the catalyst is 2E4MZ, the main component is imidazole catalyst, and the catalyst is purchased from four countries.
TABLE 1
Performance testing
The following tests were carried out on the epoxy resin molding compounds prepared in examples 1 to 5 and comparative examples 1 to 5, and the physical diagrams are shown in FIG. 1:
1. and (3) testing release force: the package after being opened is subjected to tensile test by using a digital display type push-pull tester, the test result is shown in fig. 2, the specific data is shown in table 2, and the unit is N.
TABLE 2
2. Transmittance test: the 1mm thick plaques of the examples and comparative examples were subjected to transmittance testing using a spectrophotometer, the test results are shown in fig. 3, and the specific data are shown in table 3 in%.
TABLE 3 Table 3
/>
/>
/>
/>
/>
3. And (3) adhesive strength test: the tensile test was performed using a digital display type push-pull tester on the Cu/Ag tape bonded with the epoxy resin of the examples and the comparative examples, and the test results are shown in fig. 4.
Claims (9)
1. The epoxy resin plastic package material with high transmittance and low release force is characterized by comprising the following preparation raw materials: epoxy resin, a release agent and a curing agent, wherein the structural formula of the release agent is shown in the formula I,
(I)
Wherein n is more than 12 and less than 27,1 and m is more than 105;
the epoxy resin comprises at least one of epoxy resin Tepic-s and epoxy resin Tepic-ss.
2. The epoxy resin molding compound according to claim 1, wherein the curing agent comprises at least one of a polyamide curing agent, an aliphatic amine curing agent, an aromatic amine curing agent, an alicyclic amine curing agent, a polyether amine curing agent, and an imidazole curing agent.
3. The epoxy resin molding compound according to any one of claims 1 to 2, wherein the raw materials for preparation further comprise: at least one of Lan Guangji resistance, antioxidant, coupling agent, defoamer and catalyst.
4. The epoxy resin molding compound of any one of claims 1-2, wherein the epoxy resin molding compound has a 1mm transmission of > 80%.
5. The epoxy resin molding compound according to any one of claims 1 to 2, wherein the release force of the epoxy resin molding compound is 0 to 45N but not 0.
6. The epoxy resin molding compound of any one of claims 1-2, wherein the blue light attenuation value of the epoxy resin molding compound is less than 2%.
7. The epoxy resin molding compound according to any one of claims 1 to 2, wherein the adhesive strength of the epoxy resin molding compound to Ag and Cu is changed by 1.30 to 1.50% with respect to the adhesive strength of the epoxy resin molding compound containing no release agent to Ag and Cu.
8. A method for preparing the epoxy resin molding compound according to claim 3, wherein the method comprises the following steps:
S1, mixing and stirring epoxy resin and two-thirds to one-half of a curing agent to obtain a composition I;
S2, mixing and stirring the rest curing agent, the release agent, the Lan Guangji, the antioxidant, the coupling agent and the defoaming agent to obtain a composition II;
S3, mixing and stirring the first composition, the second composition and the catalyst to obtain the epoxy resin molding compound.
9. Use of the epoxy resin molding compound according to any one of claims 1-2, wherein the epoxy resin molding compound is used for packaging semiconductor devices for vehicles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311659890.2A CN117343483B (en) | 2023-12-06 | 2023-12-06 | Epoxy resin molding compound with high transmittance and low release force, and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311659890.2A CN117343483B (en) | 2023-12-06 | 2023-12-06 | Epoxy resin molding compound with high transmittance and low release force, and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117343483A CN117343483A (en) | 2024-01-05 |
| CN117343483B true CN117343483B (en) | 2024-04-19 |
Family
ID=89371492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311659890.2A Active CN117343483B (en) | 2023-12-06 | 2023-12-06 | Epoxy resin molding compound with high transmittance and low release force, and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117343483B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014001372A (en) * | 2012-05-25 | 2014-01-09 | Unitika Ltd | Polylactic acid-based resin, and mold and foam using the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10414903B2 (en) * | 2016-11-11 | 2019-09-17 | The Board Of Trustees Of The University Of Illinois | Methods for synthesis of end-functionalized polyolefins |
-
2023
- 2023-12-06 CN CN202311659890.2A patent/CN117343483B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014001372A (en) * | 2012-05-25 | 2014-01-09 | Unitika Ltd | Polylactic acid-based resin, and mold and foam using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117343483A (en) | 2024-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1065259C (en) | Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same | |
| US5489637A (en) | Low temperature flexible die attach adhesive and articles using same | |
| KR19990083403A (en) | Epoxy resin composition for encapsulating photosemiconductor element and photosemiconductor device | |
| CN117343483B (en) | Epoxy resin molding compound with high transmittance and low release force, and preparation method and application thereof | |
| CN114456755A (en) | Epoxy resin composition, and preparation method and application thereof | |
| CN114437508A (en) | High-low temperature resistant high-fluidity epoxy resin composition for industrial control and application thereof | |
| CN102321340B (en) | High-strength halogen-free epoxy molding compound, and preparation method thereof | |
| CN114591598B (en) | Liquid plastic package material for wafer level package and preparation method thereof | |
| KR20010006204A (en) | Semiconductor device and method for producing the same, and semiconductor sealing resin composition | |
| JPH01101363A (en) | Epoxy resin composition and semiconductor device using said resin composition | |
| CN113831878B (en) | Epoxy resin composition and application thereof | |
| CN109517335B (en) | Epoxy resin composition for molding compound and preparation method thereof | |
| KR0139272B1 (en) | Epoxy resin compositions and semiconductor encapsulation method thereof | |
| CN114276652A (en) | Epoxy resin composition and application thereof, epoxy resin and preparation method and application thereof | |
| JPH07309998A (en) | Mold surface release treatment resin composition, release treatment of surface of mold using the composition, production of thermosetting resin molded product using mold release-treated with the composition | |
| JPH11140330A (en) | Thermoplastic resin composition, resin molding, and composite molded article | |
| JPH03166220A (en) | Epoxy resin composition for sealing semiconductor | |
| CN117165236B (en) | Insulating die bond adhesive for LED and preparation method thereof | |
| CN116970262A (en) | Epoxy resin composition for large-size QFN (quad Flat No-lead) product and preparation method thereof | |
| KR20220033034A (en) | Resin molded product for opto-semiconductor sealing | |
| CN114163613B (en) | Packaging material, preparation method and application thereof | |
| CN117511471A (en) | High-operability and high-reliability epoxy resin composition for electronic packaging and preparation method thereof | |
| JPH06157723A (en) | Epoxy resin composition | |
| CN117070173A (en) | Preparation method of high-performance laminated insulating adhesive film and packaging wafer | |
| JPH01185319A (en) | Epoxy resin molding material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |