CN117321712A - Capacitor and inverter device - Google Patents

Capacitor and inverter device Download PDF

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Publication number
CN117321712A
CN117321712A CN202280035761.3A CN202280035761A CN117321712A CN 117321712 A CN117321712 A CN 117321712A CN 202280035761 A CN202280035761 A CN 202280035761A CN 117321712 A CN117321712 A CN 117321712A
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CN
China
Prior art keywords
case
capacitor
mounting groove
inverter device
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280035761.3A
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Chinese (zh)
Inventor
山本裕加
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Meidensha Corp
Original Assignee
Meidensha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Corp filed Critical Meidensha Corp
Publication of CN117321712A publication Critical patent/CN117321712A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/04—Mountings specially adapted for mounting on a chassis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inverter Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

A capacitor (1) for use in an inverter device such as an electric automobile is provided with a rectangular parallelepiped case (2), capacitor elements (3) disposed in the case (2), and a potting material (4) that is filled in the case (2) so as to embed the capacitor elements (3) therein and cured. The case (2) is box-shaped and has a mounting flange (15) at the opening edge, and is mounted so as to be fitted into a mounting groove (22) formed in a case (21) of the inverter device, through which a refrigerant flows. The refrigerant fed by the pump flows through a flow path formed by a gap between the housing (2) and the inner side surface of the installation groove (22).

Description

Capacitor and inverter device
Technical Field
The present invention relates to a capacitor, particularly a capacitor that needs cooling, in an inverter (inverter) device used in an electric vehicle, a hybrid vehicle, or the like, and to an inverter device provided with the capacitor.
Background
For example, a capacitor is one of components constituting an inverter device used in an electric vehicle or the like, which occupies a relatively large volume. In order to miniaturize an inverter device mounted on a vehicle, it is necessary to miniaturize components including a capacitor, and in order to miniaturize the capacitor, it is necessary to efficiently cool the capacitor, which is a component having relatively low heat resistance. In particular, in the case where the capacitor is used in an environment where the ambient temperature exceeds the heat-resistant temperature of the capacitor, some kind of active cooling is required.
Patent document 1 discloses the following structure in relation to a capacitor previously proposed by the applicant: a flow path through which cooling water flows is formed between an inner case and an outer case each having a rectangular parallelepiped shape, and a capacitor element is disposed in the inner case and filled with a thermally conductive potting material. The two ends of the outer case are respectively connected with pipes serving as a cooling water inlet and a cooling water outlet.
Since the capacitor includes the independent outer case having the cooling water inlet and the cooling water outlet, it is necessary to draw a pipe for cooling water from the case of the inverter device, and the number of components such as the pipe and the connector increases. In addition, since the independent capacitor is spatially disposed outside the case of the inverter device, there is room for improvement in downsizing the entire inverter device.
Prior art literature
Patent document 1 Japanese patent laid-open No. 2020-058214
Disclosure of Invention
The capacitor according to the present invention is provided with:
a case having a box shape with one surface being an opening surface, and having a mounting flange extending outward around the opening surface;
a capacitor element disposed in the case through the opening surface so that a terminal is positioned on the opening surface; and
a thermally conductive potting material filled in the case so as to bury the capacitor element while leaving the terminal,
the capacitor is used by fitting a box-like portion of the case into an installation groove portion in which a refrigerant flows, the installation groove portion being provided in a box of the inverter device.
That is, the capacitor of the present invention is not provided with the outer case for constituting the refrigerant flow path, but the case-shaped portion of the case is fitted into the mounting groove portion of the case of the inverter device, so that the outer surface of the case is exposed to the refrigerant flowing in the mounting groove portion. Therefore, no external piping is required, and the overall structure is simple and compact.
In general, the case of the inverter device includes a refrigerant passage in the case for cooling the semiconductor switching element, and a mounting groove portion for the capacitor is incorporated in a part of a circuit of the refrigerant passage.
In a preferred embodiment of the invention,
the size of the above-mentioned shell is set as: a gap which becomes a flow path of the refrigerant remains between the outer side surface of the housing and the inner side surface of the mounting groove portion,
fins along the direction of the refrigerant flow are formed on at least one surface of the outer side of the case.
By providing the fins in this way, the heat exchange area between the case and the refrigerant is enlarged.
In addition, in a preferred embodiment of the present invention,
the mounting flange is screwed to the opening peripheral edge portion of the mounting groove portion with a sealing material interposed therebetween.
Further, an inverter device according to the present invention includes:
a mounting groove portion formed in a part of a case of the inverter device and opened at a surface of the case so that a refrigerant flows therein;
a case having a box shape with one surface being an opening surface, and having an outwardly extending mounting flange around the opening surface, the mounting flange being fitted into the mounting groove so as to remain as a gap of a flow path, the mounting flange being fixed to the case;
a capacitor element disposed in the case through the opening surface so that a terminal is positioned on the opening surface; and
and a thermally conductive potting material filled in the case so as to bury the capacitor element while leaving the terminal.
In a preferred embodiment of the present invention,
a 2 nd mounting groove is formed in the case so that the refrigerant flows in series with the mounting groove for the capacitor element,
the semiconductor element unit is fitted in the above-mentioned 2 nd mounting groove portion so that the refrigerant flows therearound.
According to the present invention, since the flow path of the refrigerant flowing outside the case is formed by the case of the inverter device, external piping, a connector attached thereto, and the like are not required. In addition, by incorporating the case of the capacitor into the case, the entire inverter device can be miniaturized.
Drawings
Fig. 1 is a perspective view showing a capacitor according to an embodiment together with a mounting groove portion of a case.
Fig. 2 (a) is a top view of the capacitor, fig. 2 (b) is a front view of the capacitor, and fig. 2 (c) is a side view of the capacitor.
Fig. 3 is an exploded perspective view of the capacitor.
Fig. 4 is a cross-sectional view along line A-A of fig. 1 showing the flow of refrigerant.
Fig. 5 is a cross-sectional view along line B-B of fig. 4 showing the flow of refrigerant.
Fig. 6 is a perspective view of the inverter device of embodiment 1.
Fig. 7 is an exploded perspective view of the inverter device of embodiment 1.
Fig. 8 is a perspective view showing the back surface of the semiconductor element unit.
Fig. 9 is a cross-sectional view of the 2 nd mounting groove portion along the longitudinal direction.
Fig. 10 is a cross-sectional view similar to fig. 9 in a state where the semiconductor element unit is mounted.
Fig. 11 is a perspective view of an inverter device of embodiment 2.
Fig. 12 is an exploded perspective view of the inverter device of embodiment 2.
Detailed Description
Hereinafter, an embodiment of the present invention will be described in detail based on the drawings. Fig. 1 is a perspective view showing one embodiment of a capacitor 1 used as a component of an inverter device in an electric vehicle or a hybrid vehicle, for example. Fig. 2 shows a top view, a front view, and a side view of the capacitor 1 of this embodiment. Fig. 3 is an exploded perspective view of the capacitor 1. The capacitor 1 includes a case 2 having a rectangular parallelepiped shape, a capacitor element 3 disposed in the case 2, and a potting material 4 filled in the case 2 so as to embed the capacitor element 3 and cured. Fig. 3 shows the case 2 and the capacitor element 3 in an exploded manner. As described above, in the capacitor 1 mounted on the vehicle, in addition to heat generation of the capacitor element 3, the atmosphere temperature in the engine room or the like in which the capacitor 1 is disposed may be a relatively high temperature (100 ° or more in one example), and therefore forced cooling using a refrigerant is required. As the refrigerant, for example, liquid-phase refrigerants such as cooling water and mineral oil containing water as a main component can be used.
The case 2 is formed of a metal, preferably a metal excellent in heat conduction, and is integrally formed by, for example, cutting processing of an aluminum alloy base material or aluminum die casting. The case 2 has a box shape in which one of the 6 principal surfaces (largest surface) constituting the rectangular parallelepiped is open. That is, the housing 2 includes: a pair of end walls 11 that constitute end faces at both ends in the longitudinal direction; a pair of side walls 12 that constitute side surfaces along the length direction; a bottom wall 13 constituting a bottom surface as one of the main surfaces; and an opening surface 14 facing the bottom wall 13.
A mounting flange 15 is integrally formed around the opening surface 14, and the mounting flange 15 and the opening surface 14 extend outward along the same plane. The mounting flange 15 is continuous along four sides of the opening surface 14, and has a rectangular outer periphery, which is similar to the opening surface 14. The mounting flange 15 includes a plurality of through holes 16 through which mounting screws (not shown) pass (see fig. 2 (a)). As shown in fig. 3, the housing 2 having the mounting flange 15 in this way has a rectangular deep dish shape having a rectangular parallelepiped concave portion 17. Hereinafter, the portion of the housing 2 other than the mounting flange 15 is referred to as a "box-like portion". The recess 17 formed inside the box-like portion has a flat rectangular parallelepiped shape having a depth smaller than a width dimension along a direction orthogonal to the longitudinal direction.
The mounting flange 15 may be formed by welding or brazing a frame member formed of a plate material to the box-like portion of the housing 2.
A plurality of cooling fins 18 are formed on the surfaces of the pair of side walls 12 and the bottom wall 13, and the cooling fins 18 extend linearly along the longitudinal direction of the housing 2. For example, a plurality of cooling fins 18 are formed on the entire surfaces of the side wall 12 and the bottom wall 13 at equal intervals.
As shown in fig. 3, the capacitor element 3 accommodated in the recess 17 of the case 2 includes a wound film capacitor flattened into an oblong shape corresponding to the cross-sectional shape of the case 2. For example, a film capacitor of the following general structure can be used: a resin film of polypropylene, polyethylene terephthalate, or the like is used as a dielectric, and a metal foil or a metal layer formed by coating the resin film is used as an electrode, and wound in a flat roll shape. In the illustrated example, two film capacitors are integrated in advance in a row, and terminals 5a and 5b are provided at both ends thereof. That is, the two terminals 5a and 5b are located at both longitudinal end portions of the capacitor element 3 having an elongated shape as a whole so as to be separated from each other, and extend parallel to each other.
The capacitor element 3 does not have a generally cylindrical case in order to improve heat dissipation. That is, the film capacitor formed by winding the film and adding the terminals 5a, 5b and the like is stored in the case 2 without being accommodated in the cylindrical case. Further, the central axis of the winding of the film in the film capacitor is along the length direction of the case 2.
The capacitor element 3 is disposed in the recess 17 of the case 2 in a state in which the pair of terminals 5a and 5b protrude from the opening surface 14. The recess 17 of the case 2 is filled with a potting material 4 so as to cover the capacitor element 3 with the terminals 5a and 5b left, and the potting material 4 has thermal conductivity and insulation. The potting material 4 fills substantially the entire internal volume of the case 2, and the surface of the potting material 4 filled in the recess 17 is substantially flush with the mounting flange 15 of the case 2. As shown in fig. 4 and 5 described later, the capacitor element 3 is surrounded by the potting material 4 so as not to directly contact the inner wall surface of the case 2.
As the potting material 4, for example, epoxy resin potting materials, which are generally commercially available as potting materials for circuit boards, and the like can be used. The potting material 4 is in a liquid state having appropriate fluidity when uncured, and is cured by heating in a heating furnace or the like after filling or injection. The potting material 4 may be a two-liquid mixed material in which a main agent and a curing agent are mixed and used.
As shown in fig. 1, the capacitor 1 configured as described above is directly mounted in a mounting groove 22 formed in a case 21 of an inverter device. The case 21 accommodates at least some of the other components of the inverter device, and may be made of metal, hard synthetic resin, or the like, and is formed by die casting of an aluminum alloy excellent in heat dissipation property in a preferred embodiment. A refrigerant passage 23 through which a refrigerant such as cooling water or mineral oil flows is formed in the case 21, and a rectangular attachment groove 22 is formed in a so-called drain (japanese: water collection ) shape in the middle of the passage of the refrigerant passage 23. That is, the mounting groove 22 is a rectangular parallelepiped concave portion having one of the main surfaces as an opening surface, and has a pair of end surfaces 22a, a pair of side surfaces 22b, and a bottom surface 22c. A seal groove 24 is formed around the opening surface above the drawing over the entire circumference, and screw holes 25 are provided at positions corresponding to the through holes 16 of the mounting flange 15, respectively, and the seal groove 24 accommodates an O-ring (not shown) serving as a sealing material.
The mounting groove portion 22 is substantially similar in shape to the box-like portion of the housing 2, and has a relatively larger size than the box-like portion of the housing 2. The ends of the refrigerant passage 23 are circular ports open at the centers of the end surfaces 22a of the respective longitudinal ends of the mounting groove 22. One of the pair of opposite ports serves as an inlet for the refrigerant to the mounting groove 22, and the other serves as an outlet for the refrigerant from the mounting groove 22.
The capacitor 1 is mounted to the case 21 such that the box-like portion of the case 2 is positioned in the mounting groove 22 and the mounting flange 15 overlaps the upper surface of the opening edge of the mounting groove 22. That is, the box-like portion of the housing 2 is fitted into the mounting groove 22 through the opening surface of the mounting groove 22, and thereby is placed at a predetermined position, and the mounting flange 15 is fixed to the housing 21 by a plurality of screws (not shown). The mounting flange 15 and the case 21 are sealed by an O-ring (not shown) disposed in the seal groove 24.
The liquid-phase refrigerant is forcibly circulated to the refrigerant passage 23 of the tank 21 by a pump not shown. Fig. 4 and 5 are cross-sectional views along the longitudinal direction of the capacitor 1 in a state where the capacitor 1 is mounted in the mounting groove 22, and the flow of the refrigerant is indicated by arrows. As shown in the drawing, the outer dimension of the box-like portion of the housing 2 is relatively smaller than the inner dimension of the installation groove portion 22, and therefore, a gap that becomes a flow path of the refrigerant remains between the outer side surface of the housing 2 and the inner side surface of the installation groove portion 22. Specifically, gaps, that is, flow paths 29 are formed between the end wall 11 of the case 2 and the end surface 22a of the mounting groove 22, between the side wall 12 of the case 2 and the side surface 22b of the mounting groove 22, and between the bottom wall 13 of the case 2 and the bottom surface 22c of the mounting groove 22, respectively, and the refrigerant flows from one port denoted by reference numeral 23a to the other port denoted by reference numeral 23 b. That is, the refrigerant flows along the 5 faces other than the opening face 14 side where the terminals 5a, 5b are located, and the capacitor element 3 surrounded by these 5 faces is effectively cooled together with the potting material 4. The potting material 4 having excellent thermal conductivity is in close contact with the surface of the capacitor element 3 and the inner wall surface of the case 2, and reliably transfers heat to the refrigerant through the case 2, so that efficient heat recovery can be achieved. By further providing the cooling fins 18 in the case 2, the heat exchange area between the case 2 and the refrigerant increases, and heat transfer from the case 2 to the refrigerant increases.
The potting material 4 also contributes to the insulation between the capacitor element 3 and the housing 2 on the basis of heat conduction. In other words, the thermal conductivity is improved while insulating between the capacitor element 3 and the case 2. As described above, the capacitor element 3 composed of the film capacitor is accommodated in the case 2 so as not to have a cylindrical case, and is insulated and protected by the potting material 4. Therefore, the intermediate member that has a thermal resistance with the refrigerant is minimized, and the refrigerant can be effectively recovered with heat of the capacitor element 3 constituted by the film capacitor that has a problem in heat resistance.
On the other hand, when case 21 has a higher temperature than capacitor element 3, substantially the entire capacitor element 3 is surrounded by flow path 29 of the refrigerant, and therefore, the thermal influence on capacitor element 3 is reduced. That is, the space between the case 21 and the case 2 is substantially insulated by the refrigerant flow path 29, and the temperature of the case 2, and thus the temperature of the capacitor element 3, is maintained low.
As described above, since the capacitor 1 of the above embodiment is used by being fitted into the box-like portion of the case 2 in which the mounting groove portion 22 provided in the case 21 of the inverter device through which the refrigerant flows, the capacitor 1 requiring forced cooling can be simply structured with a small number of components, and reliable cooling of the capacitor element 3 can be achieved. The mounting flange 15, which is a part of the case 2, functions as a cover or sealing portion for covering the mounting groove 22, as well as supporting the case 21 of the capacitor 1. That is, the mounting groove 22 can be sealed by simply mounting the capacitor 1 to the mounting groove 22 without a separate cover or the like for covering the mounting groove 22.
Fig. 6 and 7 show embodiment 1 of an inverter device including a semiconductor switching element and the capacitor 1 of the above embodiment. In this embodiment, the case 21 of the inverter device includes two installation groove portions in which the liquid-phase refrigerant flows in series. That is, the mounting groove 22 for the capacitor 1 (hereinafter, referred to as the 1 st mounting groove 22 for convenience) and the 2 nd mounting groove 31 for the semiconductor switching element are formed adjacent to each other so as to be parallel to each other. The refrigerant passage 23 includes an inlet refrigerant passage 23A, an outlet refrigerant passage 23B, and an intermediate refrigerant passage 23C. The inlet refrigerant passage 23A is connected to one end of the 2 nd mounting groove 31 in the longitudinal direction. The outlet refrigerant passage 23B is connected to one end of the 1 st mounting groove 22 in the longitudinal direction. An intermediate refrigerant passage 23C is provided between the other end of the 2 nd mounting groove 31 and the other end of the 1 st mounting groove 22. Therefore, the refrigerant sent by the pump outside the figure passes through the 2 nd mounting groove portion 31, and then is guided to the 1 st mounting groove portion 22 through the intermediate refrigerant passage 23C, and passes through the 1 st mounting groove portion 22. That is, the refrigerant flows in series from the 2 nd mounting groove 31 to the 1 st mounting groove 22.
In the illustrated example, a part of the passage length of each of the refrigerant passages 23A, 23B, and 23C is depicted as an external pipe, but may be configured as an internal passage penetrating through the inside of the tank 21.
As the semiconductor switching element, for example, an IGBT module can be used. Specifically, a rectangular semiconductor element unit 33 is configured by a so-called "6in1" type IGBT module having a total of 6 arms constituting each phase U, V, W in1 package. Fig. 8 shows a structure of the back surface of the semiconductor element unit 33, and as shown in fig. 8, the semiconductor element unit 33 composed of the IGBT module of "6in1" has a rectangular plate-shaped bottom plate portion 34, and a plurality of pin-shaped fins 35 are formed in the bottom plate portion 34 to promote heat exchange with the refrigerant. A plurality of through holes 36 through which mounting screws, not shown, pass are provided around the bottom plate 34.
The 2 nd mounting groove 31 to which the semiconductor element unit 33 is mounted is formed substantially in the same manner as the 1 st mounting groove 22, and is rectangular and opened on the upper surface of the case 21 of the inverter device so as to be aligned parallel to the 1 st mounting groove 22. The semiconductor element unit 33 is mounted such that the bottom plate 34 covers the opening of the 2 nd mounting groove 31, and is fixed to the case 21 by a mounting screw, not shown, passing through the through hole 36. As shown in fig. 7, a seal groove 37 for accommodating an O-ring (not shown) serving as a sealing material is formed around the opening of the 2 nd mounting groove 31, and the space between the 2 nd mounting groove 31 and the semiconductor element unit 33 is sealed by the O-ring disposed therein.
Fig. 9 shows a cross section of the case 21 along the longitudinal direction of the 2 nd mounting groove 31, and fig. 10 shows the same cross section in a state where the semiconductor element unit 33 is mounted. As shown in these cross-sectional views, unlike the capacitor 1, the semiconductor element unit 33 has only the pin fin 35 fitted into the 2 nd mounting groove 31, and most of the IGBT module is exposed upward from the bottom plate 34. Therefore, the 2 nd mounting groove 31 includes a mesa-shaped portion 31b so that the position of the bottom surface 31a is made shallow except for both end portions in the longitudinal direction. In other words, the following structure is adopted: both longitudinal ends of the ports having circular end openings of the refrigerant passages 23A and 23C are locally deep. The height of the bottom surface 31a approximately corresponds to the end position of the pin fin 35. By making the thickness shallower, the refrigerant is guided to flow along the bottom surface of the semiconductor element unit 33, and the refrigerant flow collides with the pin fin 35, whereby good heat exchange is achieved.
In this way, by using the capacitor 1 according to the above embodiment, the capacitor 1 and the semiconductor element unit 33 can be arranged in the case 21 of the inverter device together, and the entire inverter device including the capacitor 1 and the semiconductor element unit 33 can be made compact.
Next, fig. 11 and 12 show embodiment 2 of an inverter device including a capacitor 1 and a semiconductor element unit 33. The 2 nd embodiment is: regarding the flow of the refrigerant, the 1 st mounting groove 22 and the capacitor 1 are disposed on the upstream side, and the 2 nd mounting groove 31 and the semiconductor element unit 33 are disposed on the downstream side. That is, the refrigerant sent from the pump outside the figure is guided from the inlet refrigerant passage 23A to the 2 nd mounting groove portion 31, and after cooling the capacitor 1, the refrigerant passes through the intermediate refrigerant passage 23C and is guided to the 1 st mounting groove portion 22, thereby cooling the semiconductor element unit 33.
Since the other structures are not particularly changed from those of embodiment 1, the description thereof will be omitted. In embodiment 2, the capacitor 1 is cooled preferentially. The flow path structure of embodiment 1 or the flow path structure of embodiment 2 can be selected in consideration of the heat generation amount, heat resistance, and the like of each of the capacitor 1 and the semiconductor element unit 33.

Claims (5)

1. A capacitor is provided with:
a case having a box shape with one surface thereof being an opening surface, and having a mounting flange extending outward around the opening surface;
a capacitor element disposed in the case through the opening surface so that a terminal is positioned on the opening surface; and
a thermally conductive potting material filled in the case so as to bury the capacitor element while leaving the terminal,
the capacitor is used by fitting a box-like portion of the case into an installation groove portion in which a refrigerant flows, the installation groove portion being provided in a box of the inverter device.
2. The capacitor as claimed in claim 1, wherein,
the size of the above-mentioned shell is set as: a gap which becomes a flow path of the refrigerant remains between the outer side surface of the housing and the inner side surface of the mounting groove portion,
fins along the direction of the refrigerant flow are formed on at least one surface of the outer side of the case.
3. The capacitor according to claim 1 or 2, wherein,
the mounting flange is screwed to the opening peripheral edge portion of the mounting groove portion with a sealing material interposed therebetween.
4. An inverter device, wherein the inverter device comprises:
a mounting groove portion formed in a part of a case of the inverter device and opened at a surface of the case so that a refrigerant flows therein;
a case having a box shape with one surface being an opening surface, and having an outwardly extending mounting flange around the opening surface, the mounting flange being fitted into the mounting groove so as to remain as a gap of a flow path, the mounting flange being fixed to the case;
a capacitor element disposed in the case through the opening surface so that a terminal is positioned on the opening surface; and
and a thermally conductive potting material filled in the case so as to bury the capacitor element while leaving the terminal.
5. The inverter device according to claim 4, wherein,
a 2 nd mounting groove is formed in the case so that the refrigerant flows in series with the mounting groove for the capacitor element,
the semiconductor element unit is fitted in the above-mentioned 2 nd mounting groove portion so that the refrigerant flows therearound.
CN202280035761.3A 2021-05-20 2022-02-08 Capacitor and inverter device Pending CN117321712A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-085170 2021-05-20
JP2021085170A JP7124929B1 (en) 2021-05-20 2021-05-20 Inverter device
PCT/JP2022/004790 WO2022244337A1 (en) 2021-05-20 2022-02-08 Capacitor and inverter device

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Publication Number Publication Date
CN117321712A true CN117321712A (en) 2023-12-29

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CN (1) CN117321712A (en)
WO (1) WO2022244337A1 (en)

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