CN117300389B - Protective film preparation process and die cutting device - Google Patents
Protective film preparation process and die cutting device Download PDFInfo
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- CN117300389B CN117300389B CN202311614256.7A CN202311614256A CN117300389B CN 117300389 B CN117300389 B CN 117300389B CN 202311614256 A CN202311614256 A CN 202311614256A CN 117300389 B CN117300389 B CN 117300389B
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- 230000001681 protective effect Effects 0.000 title claims abstract description 140
- 238000005520 cutting process Methods 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 45
- 238000003698 laser cutting Methods 0.000 claims abstract description 17
- 230000033001 locomotion Effects 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims 3
- 230000000694 effects Effects 0.000 description 9
- 239000000779 smoke Substances 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 238000004080 punching Methods 0.000 description 5
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 3
- 239000003546 flue gas Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000001815 facial effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 230000035807 sensation Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The application relates to the technical field of laser cutting and provides a preparation process of a protective film, wherein the protective film comprises a mask, a use layer and a base film, and the process comprises the steps of stacking the mask, the use layer and the base film together from top to bottom in sequence to form a protective film blank; an upper protective film is attached to the top surface of the mask, and a lower protective film is attached to the bottom surface of the bottom film to form a protective film assembly; the protective film component adopts a laser cutting process, a laser head is vertically positioned on the upper protective film, the distance between the focal length of the laser head and the upper protective film is adjusted to be 2-4mm, and positive focal cutting is adopted; and adjusting the energy of a laser head to 80-97%, and performing laser chamfering processing on the protective film component at the speed of 90-150mm/s to obtain the protective film. Based on this, the protection film edge that this application cut out can not directly present 90 degrees right angles, can produce the state structure of oblique angle, can cause obvious thorn feel when avoiding the user to use after pasting. In addition, a die cutting device is also provided.
Description
Technical Field
The application relates to the technical field of laser cutting, in particular to a protective film preparation process and a die cutting device.
Background
Electronic products such as mobile phones are commonly used in daily life, and the use effect of the screen is directly affected. Therefore, in the production process, in order to prevent the liquid crystal screen and the mobile phone screen from being accidentally subjected to factors such as friction, contact and the like in the factory sales process of manufacturing and assembling the whole set of products, the screen is scraped, or is stained with foreign matters, the screen is stained, and the liquid crystal screen and the mobile phone screen are protected by using a protective film in the production process.
In order to meet the sizes of the protective films of different electronic products, the protective films are generally required to be punched by a die cutting device, the die cutting device comprises punching cutting and laser cutting, the protective films are punched into sheets with prefabricated sizes in advance by the punching cutting, then the sheets are precisely formed by the laser cutting, in the traditional laser cutting process, the edges of the cut protective films are generally 90-degree right angles, and the edges are obviously thorn to feel when the protective films are touched by users during use, so that the protective films are required to be further improved.
Disclosure of Invention
In order to solve the problem that the edge of the existing protective film after being cut is a right angle of 90 degrees, so that the hand feeling is thorn, the application aims to provide a protective film preparation process and a die cutting device.
In a first aspect, the present application provides a protective film preparation process that adopts the following technical scheme:
the preparation process of the protective film comprises stacking the mask, the using layer and the base film together from top to bottom in sequence to form a protective film blank; an upper protective film is attached to the top surface of the mask, and a lower protective film is attached to the bottom surface of the bottom film to form a protective film assembly; the protective film component adopts a laser cutting process, a laser head is vertically positioned on the upper protective film, the distance between the focal length of the laser head and the upper protective film is adjusted to be 2-4mm, and positive focal cutting is adopted; and adjusting the energy of a laser head to 80-97%, and performing laser chamfering processing on the protective film component at the speed of 90-150mm/s to obtain the protective film.
By adopting the technical scheme, the mask, the using layer and the bottom die are core supporting structures of the protective film, the pollution of smoke to the surface in the process of beveling the laser head can be avoided by arranging the upper protective film, and meanwhile, friction scratches caused by contact with equipment are avoided by arranging the lower protective film; through adjusting the interval between laser head and the protection film, make the protection film subassembly edge make the chamfer effect of different angles, simultaneously with the energy value adjustment of laser head for 80-97%, speed is 90-150mm/s for whole laser head can realize the effect of chamfer to the protection film subassembly at the in-process of cutting under specific energy and the settlement of speed, the protection film edge that cuts out can not directly present 90 degrees right angles, can produce the status structure of oblique angle, can cause obvious thorn feel when avoiding the user to use after pasting, skin-friendly is effectual.
Optionally, a laser cutting process is adopted, and the protective film assembly is subjected to first laser chamfering processing according to a preset laser head focal length to obtain a protective film with a first inclined plane;
wherein, the initial processing point of the first laser chamfering processing is positioned on the upper protective film, and the final processing point is positioned on the lower protective film.
Through adopting above-mentioned technical scheme, utilize first laser chamfer processing, can prepare to obtain the protection film subassembly that has first inclined plane to reduce the feel of thorn hand when the user touches the protection film.
Optionally, a laser cutting process is adopted, and the protective film component is subjected to secondary laser chamfering processing according to a preset laser head focal length to obtain a protective film with a first inclined plane and a second inclined plane;
wherein, the initial processing point of the second laser chamfering processing is positioned on the first inclined plane, and the final processing point is positioned on the lower protective film.
By adopting the technical scheme, the protective film assembly with the second inclined plane can be prepared by utilizing the second laser chamfering processing, and the protective film assembly with the third inclined plane is subjected to bedding cutting in advance.
Optionally, a laser cutting process is adopted, and the film assembly is subjected to laser chamfering processing for the third time according to the preset focal length of the laser head, so that a protective film with a first inclined plane, a second inclined plane and a third inclined plane is obtained;
wherein, the initial processing point of the third laser chamfering processing is positioned on the first inclined plane, and the final processing point is positioned on the second inclined plane.
Through adopting above-mentioned technical scheme, utilize the processing of third laser chamfer, can prepare to obtain the protection film subassembly that has the third inclined plane to further reduce the sensation of thorn hand when the user touches the protection film, improve user experience.
Optionally, the energy of the laser head for the first laser chamfering is 80-90%, the speed is 90-120mm/s, the energy of the laser head for the second laser chamfering is 90-97%, the speed is 120-150mm/s, the energy of the laser head for the third laser chamfering is 80-90%, and the speed is 120-150mm/s.
Through adopting above-mentioned technical scheme, utilize above-mentioned three laser chamfer's different energy and speed, can the adaptation be to three inclined planes of response shaping in proper order, every inclined plane all only need the independent processing in proper order, alright rapid prototyping, after three inclined planes are shaped in proper order, the marginal sense of touch of protection film experiences and promotes.
Optionally, the laser bias angle of the protective film assembly is 91-140 degrees.
Through adopting above-mentioned technical scheme, the laser chamfer angle of protection film subassembly is 91-140 degrees, utilizes this obtuse angle to avoid the edge of protection film to have the sensation of thorn hand, and the sense of touch comfort level of this angle is the best simultaneously.
In a second aspect, the die cutting device provided by the application adopts the following technical scheme:
the laser head is connected with the laser head, the laser head is slidably connected with the two-dimensional motion platform, the laser head can slide transversely or vertically along the two-dimensional motion platform, and the protective film component to be beveled is placed on the grating plate.
Through adopting above-mentioned technical scheme, protection film subassembly is placed on the grid board, along with two-dimensional motion platform drives laser head horizontal or vertical displacement, and laser hair ray bundle scans protection film subassembly, receives and records the laser beam that reflects back through the receiver, obtains shape, profile and the texture information on object surface through computer processing again, cuts to the laser bias point position of predetermineeing simultaneously.
Optionally, the device further comprises a connecting plate, wherein the connecting plate is located below the grating plate and connected with the grating plate, the grating plate is provided with an array of through holes, the connecting plate is connected to the periphery of the grating plate in a closed mode, and one side, away from the grating plate, of the connecting plate is provided with a negative pressure hole.
Through adopting above-mentioned technical scheme, utilize the connecting plate that sets up, when protection film assembly places on the grid board, when the laser head is at the cutting, corresponding waste material and flue gas can utilize the negative pressure mouth, follow the downdraft in the opening for waste material and flue gas can not be to detaining on the grid board, and can not pollute protection film assembly.
Optionally, the device further comprises a frame and a lifting assembly, the frame is provided with a placement containing cavity, the lifting assembly is connected to the grating plate, the lifting assembly is slidingly connected to the frame and located in the placement containing cavity, the lifting assembly comprises a fixing plate, a fixing seat, a screw rod, a fixing sleeve and a knob, the fixing seat is installed on the fixing plate, the fixing plate is slidingly connected to the frame, the fixing sleeve is connected with the grating plate, the screw rod is connected to the fixing sleeve and is rotationally connected to the fixing seat, and the knob sequentially penetrates through the grating plate and the fixing sleeve and is connected with the screw rod.
By adopting the technical scheme, the lifting component is slidingly connected with the frame and is positioned in the accommodating cavity, so that the grating plates are synchronously positioned in the frame, and when the laser head cuts, the generated laser can be blocked through the frame, so that safety protection is realized; when the knob rotates clockwise, the screw is driven to rotate clockwise synchronously, the screw drives the fixed sleeve to ascend at the moment, the fixed sleeve is connected with the grating plate, the grating plate is driven to ascend integrally and synchronously, and the distance between the grating plate and the laser head is gradually reduced at the moment; when the knob rotates anticlockwise, the screw is driven to rotate anticlockwise synchronously, the screw drives the fixed sleeve to descend, the fixed sleeve drives the grating plate to descend integrally and synchronously, the distance between the grating plate and the laser head is gradually increased, and the distance between the focal length of the laser head and the upper protective film is controlled through the lifting assembly.
Optionally, the fixing base, the screw rod, the fixed sleeve and the knob are respectively provided with three, each fixing base is internally provided with a belt wheel, the belt wheel is connected to one end of the screw rod, which is far away from the knob, and a transmission bar is connected between the three belt wheels.
Through adopting above-mentioned technical scheme, fixing base, screw rod, fixed cover are provided with three respectively with the knob, and are connected through the transmission strip between the three band pulley, when rotatory through screw rod drive one of them band pulley rotate, the band pulley moves two other band pulleys synchronous rotation through the transmission strip, two other band pulleys pass through screw rod synchronous control fixed cover lift this moment, utilize three fixed cover to connect in the different positions of grid board, control grid board stability is better at the in-process of lift.
In summary, the present application includes at least one of the following beneficial effects:
1. the mask, the using layer and the bottom die are core supporting structures of the protective films, so that the pollution of smoke to the surface in the process of beveling of the laser head can be avoided by arranging the upper protective film, and meanwhile, friction scratches caused by contact with equipment can be avoided by arranging the lower protective film; the distance between the laser head and the protective film is adjusted, so that the edge of the protective film component has beveling effects at different angles, the energy value of the laser head is adjusted to 80-97%, the speed is 90-150mm/s, the whole laser head can realize the beveling effect on the protective film component in the cutting process under the specific energy and speed setting, the cut edge of the protective film cannot directly show a 90-degree right angle, a bevel angle state structure can be generated, the phenomenon that a user can cause obvious thorn hand feeling when using the protective film after pasting is avoided, the skin-friendly effect is good, and the whole practicability is strong;
2. the laser beveling angle of the protective film component is 91-140 degrees, the feeling of a thorn hand at the edge of the protective film can be avoided by utilizing the obtuse angle, and meanwhile, the touch sense comfort of the angle is optimal;
3. the protective film component is placed on the grating plate, the laser head is driven by the two-dimensional motion platform to move transversely or vertically, the laser beam is scanned by the laser beam, the reflected laser beam is received and recorded by the receiver, the shape, the outline and the texture information of the surface of the object are obtained through computer processing, and meanwhile, the laser beam is cut at the preset laser oblique tangential point position;
4. when the protective film component is placed on the grating plate by using the arranged connecting plate, and the laser head is cut, corresponding waste and smoke can be downwards drained from the through hole by using the negative pressure port, so that the waste and the smoke cannot be retained on the grating plate and cannot pollute the protective film component;
5. the lifting component is slidingly connected with the frame and is positioned in the accommodating cavity, so that the grating plates are synchronously positioned in the frame, and when the laser head cuts, the generated laser can be blocked through the frame, so that safety protection is realized; when the knob rotates clockwise, the screw is driven to rotate clockwise synchronously, the screw drives the fixed sleeve to ascend at the moment, the fixed sleeve is connected with the grating plate, the grating plate is driven to ascend integrally and synchronously, and the distance between the grating plate and the laser head is gradually reduced at the moment; when the knob rotates anticlockwise, the screw is driven to rotate anticlockwise synchronously, the screw drives the fixed sleeve to descend, the fixed sleeve drives the grating plate to descend integrally and synchronously, the distance between the grating plate and the laser head is gradually increased, and the distance between the focal length of the laser head and the upper protective film is controlled through the lifting assembly.
Drawings
FIG. 1 is a schematic view of the construction of the protective film assembly of the present application;
FIG. 2 is a schematic structural view of a first inclined plane, a second inclined plane and a third inclined plane of the present application;
FIG. 3 is a schematic view of the external structure of the die cutting device of the present application;
FIG. 4 is a schematic view of the internal structure of the die cutting device of the present application;
fig. 5 is an exploded view of the lift assembly of the present application.
Reference numerals illustrate:
100. a protective film assembly; 110. a facial mask; 120. a use layer; 130. a base film; 140. an upper protective film; 150. a lower protective film; 160. a first inclined surface; 170. a second inclined surface; 180. a third inclined surface; 200. a grating plate; 210. a through port; 220. a connecting plate; 230. a negative pressure port; 300. a two-dimensional motion platform; 400. a laser; 500. a laser head; 600. a frame; 610. a containing cavity is arranged; 620. opening and closing a door; 700. a lifting assembly; 710. a fixing plate; 720. a fixing seat; 730. a screw; 740. a fixed sleeve; 750. a knob; 760. a belt wheel; 770. a transmission bar.
Detailed Description
The following description of the technical solutions of the present application will be made with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. This application may be embodied in many different forms and is not limited to the embodiments described herein.
In the description of the present application, reference to the terms "one embodiment," "some embodiments," "examples," "particular examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
In the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and may be, for example, secured; or can be a detachable connection; or integrated into one piece; or may be a mechanical connection. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
Some embodiments of the present application are described in detail below with reference to fig. 1-5. Those skilled in the art may combine and combine the features of the different embodiments or examples and the different embodiments or examples presented in this application without conflict.
Example 1: referring to fig. 1, the raw materials of the protective film comprise a mask 110, a use layer 120 and a bottom film 130, wherein the mask 110 is positioned above the use layer 120, the bottom film 130 is positioned below the use layer 120, the mask 110, the use layer 120 and the bottom film 130 are sequentially stacked from top to bottom to form a protective film blank, and when the protective film blank is assembled on a screen of an electronic product, the bottom film 130 is attached to the screen of the electronic product.
Wherein, the top laminating of facial mask 110 has last protection film 140, can avoid follow-up laser head 500 chamfer in-process flue gas to produce the pollution to the surface through setting up protection film 140, and the bottom surface laminating of bottom film 130 has lower protection film 150, avoids causing friction scratch when contacting with equipment through setting up lower protection film 150.
After the upper protective film 140 and the lower protective film 150 are attached to the protective film raw material, the protective film assembly 100 is formed, the protective film assembly 100 needs to be subjected to punching cutting and laser cutting in the process of processing the protective film, and when the protective film assembly 100 is subjected to punching cutting, the protective film assembly 100 is integrally wound into a cylindrical shape in advance, and then is sequentially conveyed into a punching cutting area to be punched into a sheet with a preset size, and the sheet with the preset size is like the protective film of a mobile phone, a flat panel or a television.
When the sheet-shaped stamping of the prefabricated size is completed, the sheet-shaped stamping is cut through a laser cutting process, the laser head 500 is vertically positioned above the upper protective film 140, the distance between the focal length of the laser head 500 and the upper protective film 140 is 2-4mm, the distance between the focal length of the laser head 500 and the upper protective film 140 in the embodiment is preferably 2mm or 3mm, and positive focal cutting is adopted. The energy of the laser head 500 is 80-97%, the speed is 90-150mm/s, the whole laser head 500 can realize the beveling effect on the protective film assembly 100 in the cutting process under the specific energy and speed setting, the edge of the cut protective film can not directly present a 90-degree right angle, a bevel angle state structure can be generated, and obvious thorn hand feeling can be caused when a user uses the laser head after pasting the protective film.
Referring to fig. 2, a laser cutting process is adopted to perform a first laser chamfering process on the outer circumference of the protective film assembly 100 according to a preset focal length of the laser head 500 and a distance between the upper protective film 140 of 4mm, and the first laser chamfering process circularly cuts once around the outer circumference of the protective film assembly, thereby obtaining a protective film with a first inclined surface 160; wherein, the initial processing point of the first laser chamfering process is located at the upper protective film 140, and the final processing point is located at the upper protective film 140, and the protective film assembly 100 having the first inclined surface 160 can be manufactured by using the first laser chamfering process, so as to reduce the feeling of a hand pricking when a user touches the protective film.
In some embodiments, a laser cutting process is adopted, and according to the preset focal length of the laser head 500 and the interval between the upper protective film 140 being 2mm, the outer periphery of the protective film assembly 100 is subjected to a second laser chamfering process, and the second laser chamfering process circularly cuts once around the outer periphery of the protective film assembly, so as to obtain the protective film with the first inclined surface 160 and the second inclined surface 170; wherein, the starting point processing point of the second laser chamfering process is located at the first inclined plane 160, the end point processing point is located at the lower protective film 150, and the protective film assembly 100 having the second inclined plane 170 can be manufactured by using the second laser chamfering process, and the protective film assembly 100 having the third inclined plane 180 is pre-padded and cut.
In some embodiments, a laser cutting process is adopted, and according to the preset focal length of the laser head 500 and the interval between the upper protective film 140 being 3mm, the outer periphery of the protective film assembly 100 is subjected to a third laser chamfering process, and the third laser chamfering process circularly cuts once around the outer periphery of the protective film assembly, so as to obtain a protective film with a first inclined plane 160, a second inclined plane 170 and a third inclined plane 180; wherein, the initial processing point of the third laser chamfering process is located on the first inclined plane 160, the final processing point is located on the second inclined plane 170, and the protective film assembly 100 with the third inclined plane 180 can be prepared by utilizing the third laser chamfering process, so as to further reduce the feeling of a hand pricking when a user touches the protective film, and improve the user experience.
It should be noted that, in this embodiment, the energy of the laser head 500 for the first laser chamfering process is 80-90%, the speed is 90-120mm/s, the energy of the laser head 500 for the second laser chamfering process is 90-97%, the speed is 120-150mm/s, the energy of the laser head 500 for the third laser chamfering process is 80-90%, the speed is 120-150mm/s, and by using the different energies and speeds of the above three laser chamfering processes, three inclined planes can be formed in sequence, and each inclined plane can be formed quickly only by processing in sequence.
The base energy of the laser head 500 is 60W, the energy of the laser head 500 for the first laser chamfering process is 48-54W, the energy of the laser head 500 for the second laser chamfering process is 54-58.2W, and the energy of the laser head 500 for the third laser chamfering process is 48-54W.
In this embodiment, the laser bias angle of the protective film assembly 100 is 91-140 degrees, and the actual laser bias angle in this embodiment is 140 degrees, and by using this obtuse angle, the feeling of a stab hand on the edge of the protective film can be avoided, and at the same time, the touch feeling comfort of this angle is optimal.
It should be noted that laser chamfering is not limited to protecting the peripheral side edges of the membrane modules, but may be performed on any edge segments, holes, points of the membrane modules.
The implementation principle of the embodiment of the application is as follows: through adjusting the interval between laser head 500 and the protection film, make protection film subassembly 100 edge make the chamfer effect of different angles, simultaneously with the energy value adjustment of laser head 500 for 80-97%, speed is 90-150mm/s for whole laser head 500 can realize the effect of chamfer to protection film subassembly 100 at the in-process of cutting under the setting of specific energy and speed, and the protection film edge that cuts can not directly present 90 degrees right angles, can produce the state structure of oblique angle, avoids the user to cause obvious thorn feel when using after pasting.
Example 2: the die cutting device is applied to the aforementioned protective film preparation process, referring to fig. 3 and 4, and comprises a grid plate 200, a two-dimensional motion platform 300, a laser 400, a laser head 500 and a frame 600, wherein a placement cavity 610 is formed in the frame 600, the placement cavity 610 is communicated with the outside, the two-dimensional motion platform 300 is installed in the placement cavity 610 and is positioned at the upper part of the grid plate 200, the laser 400 is connected with the laser head 500, the laser head 500 is slidingly connected to the two-dimensional motion platform 300, the laser head 500 can slide transversely or vertically along the two-dimensional motion platform 300, the two-dimensional motion platform 300 is an application of a known structure, and in this embodiment, the laser 400 is installed on the frame 600 and provides energy for the laser head 500.
Specifically, the prefabricated sheet-shaped protective film assembly 100 is sequentially placed on the grid plate 200, and along with the transverse or vertical displacement of the laser head 500 driven by the two-dimensional motion platform 300, the laser head 500 emits a ray beam to scan the protective film assembly 100, the reflected laser beam is received and recorded by the receiver, and the shape, the outline and the texture information of the surface of the object are obtained through computer processing, and meanwhile, the laser head 500 cuts at the preset laser oblique point position.
The laser beveling position is set through a system, the laser head 500 scans the prefabricated sheet-shaped protective film assembly 100 through computer processing in the process of transverse or vertical movement, and finally accurate positioning cutting is realized according to program design, and three laser beveling processes are sequentially realized, so that the forming of the final protective film is completed. It should be noted that the scanning and cutting process of the laser head 500 is an application of the existing structure, and detailed description is omitted in this embodiment.
With the placement cavity 610 of the frame 600, the grating plate is positioned in the placement cavity 610, and when the laser head 500 cuts, the generated laser can be blocked by the frame 600, thus realizing safety protection.
Referring to fig. 4 and 5, in some embodiments, the laser head further includes a connection plate 220, the connection plate 220 is located below the grid plate 200 and is fixedly connected with the grid plate 200, the grid plate 200 is provided with an array of through holes 210, the connection plate 220 is connected to the periphery of the grid plate 200 in a ring-shaped closed manner, one side of the connection plate 220 away from the grid plate 200 is provided with a negative pressure hole 230, the negative pressure hole 230 passes through the frame 600 and is communicated with the outside, when the protection film assembly 100 is placed on the grid plate 200, and when the laser head 500 is cut, corresponding waste and smoke can flow downwards from the through holes 210 by using the negative pressure hole 230, so that the waste and the smoke cannot be retained on the grid plate 200 and cannot pollute the protection film assembly 100.
In some embodiments, the lifting assembly 700 is further included, the lifting assembly 700 is connected to the grid plate 200 and is located below the grid plate 200, the lifting assembly 700 is slidingly connected to the frame 600 and is located in the accommodating cavity 610, the lifting assembly 700 includes a fixing plate 710, a fixing seat 720, a screw 730, a fixing sleeve 740 and a knob 750, the fixing plate 710 is slidingly connected to the frame 600, the fixing seat 720 is installed on the fixing plate 710, the fixing sleeve 740 is fixedly connected to the periphery of the grid plate 200, the screw 730 is in threaded connection with the fixing sleeve 740 and is rotationally connected to the fixing seat 720, and the knob 750 sequentially passes through the grid plate 200 and the fixing sleeve 740 from top to bottom and is fixedly connected with the screw 730.
When the knob 750 rotates clockwise, the screw 730 is driven to rotate clockwise synchronously, at this time, the screw 730 drives the fixing sleeve 740 to ascend, the fixing sleeve 740 is connected with the grating plate 200, the grating plate 200 is driven to ascend synchronously and integrally, and at this time, the distance between the grating plate 200 and the laser head 500 is gradually reduced; when the knob 750 rotates anticlockwise, the screw 730 is driven to rotate anticlockwise synchronously, at this time, the screw 730 drives the fixing sleeve 740 to descend, the fixing sleeve 740 drives the grid plate 200 to descend integrally and synchronously, at this time, the distance between the grid plate 200 and the laser head 500 is gradually increased, and the distance between the focal length of the laser head 500 and the upper protective film 140 is controlled by the lifting assembly 700.
It should be noted that three fixing seats 720, a screw rod 730, fixing sleeves 740 and a knob 750 are respectively provided, each fixing seat 720 is internally provided with a belt wheel 760, the belt wheel 760 is located at the bottom of each fixing seat 720 and is connected to one end of the screw rod 730 far away from the knob 750, a transmission bar 770 is connected between the three belt wheels 760, when one belt wheel 760 is driven to rotate by the screw rod 730 through rotation, the belt wheel 760 drives the other two belt wheels 760 to synchronously rotate through the transmission bar 770, at this time, the other two belt wheels 760 synchronously control the fixing sleeves 740 to lift through the screw rod 730, the three fixing sleeves 740 are connected to different positions of the grid plate 200, and stability of the grid plate 200 is better in the lifting process.
In some embodiments, a switch door 620 is opened at one side of the outer circumference of the frame 600, and when the protection film assembly 100 is required to be placed on the grill assembly, the switch door 620 is opened, and then the fixing plate 710 is pulled out, so that the grill assembly is positioned at the outer circumference of the frame 600, at which time the protection film assembly 100 is conveniently placed; after the protective film assembly 100 is placed, the protective effect can be achieved by using the frame 600 when the laser head 500 is cut after the fixing plate 710 is pushed into the placement cavity 610.
The embodiments of this embodiment are all preferred embodiments of the present application, and are not intended to limit the scope of the present application, in which like parts are denoted by like reference numerals. Therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (6)
1. A preparation process of a protective film is characterized in that: the protective film comprises a mask (110), a use layer (120) and a base film (130), wherein the process comprises stacking the mask (110), the use layer (120) and the base film (130) together from top to bottom in sequence to form a protective film blank;
an upper protective film (140) is attached to the top surface of the mask (110), and a lower protective film (150) is attached to the bottom surface of the bottom film (130) to form a protective film assembly (100);
the protective film assembly (100) adopts a laser cutting process, a laser head (500) is vertically positioned on the upper protective film (140), the distance between the focal length of the laser head (500) and the upper protective film (140) is adjusted to be 2-4mm, and positive focal cutting is adopted;
adjusting the energy of the laser head (500) to be 80-97% of the basic energy of the laser head, and performing laser chamfering processing on the protective film assembly (100) at the speed of 90-150mm/s to obtain the protective film;
in the laser cutting process, performing first laser chamfering processing on the protective film assembly (100) according to a preset focal length of a laser head (500) to obtain a protective film with a first inclined plane (160);
wherein a starting processing point of the first laser chamfering processing is located on the upper protective film (140), and an ending processing point is located on the lower protective film (150);
performing secondary laser chamfering processing on the protective film assembly (100) according to a preset focal length of the laser head (500) to obtain a protective film with a first inclined surface (160) and a second inclined surface (170);
wherein a start processing point of the second laser chamfering process is located at the first inclined surface (160), and an end processing point is located at the lower protective film (150);
performing laser chamfering processing on the protective film assembly (100) for the third time according to the preset focal length of the laser head (500) to obtain a protective film with a first inclined surface (160), a second inclined surface (170) and a third inclined surface (180);
wherein a starting machining point of a third laser chamfering machining is located on the first inclined surface (160), and an ending machining point is located on the second inclined surface (170);
the energy of the laser head (500) for the first laser chamfering processing is 80-90% of the basic energy of the laser head, the speed is 90-120mm/s, the energy of the laser head (500) for the second laser chamfering processing is 90-97% of the basic energy of the laser head, the speed is 120-150mm/s, the energy of the laser head (500) for the third laser chamfering processing is 80-90% of the basic energy of the laser head, and the speed is 120-150mm/s.
2. The protective film manufacturing process according to claim 1, wherein: the laser bias angle of the protective film assembly (100) is 91-140 degrees.
3. The die cutting device is applied to the protective film preparation process as claimed in any one of claims 1 to 2, and is characterized in that: contain grid board (200), two-dimensional motion platform (300), laser instrument (400) and laser head (500), two-dimensional motion platform (300) are located the upper portion of grid board (200), laser instrument (400) are connected with laser head (500), laser head (500) sliding in two-dimensional motion platform (300), laser head (500) can follow two-dimensional motion platform (300) horizontal or vertical slip, treat that the laser chamfer protection film subassembly (100) place in on grid board (200).
4. A die cutting apparatus as claimed in claim 3, wherein: still contain connecting plate (220), connecting plate (220) are located the below of grid board (200), and with grid board (200) are connected, through-hole (210) have been seted up to the array on grid board (200), connecting plate (220) be closed connect in the periphery of grid board (200), connecting plate (220) are kept away from negative pressure mouth (230) have been seted up to one side of grid board (200).
5. The die cutting device of claim 4, wherein: still contain frame (600) and lifting unit (700), offer on frame (600) and settle appearance chamber (610), lifting unit (700) connect in grid board (200), lifting unit (700) sliding connection in frame (600) just are located settle and hold in chamber (610), lifting unit (700) contain fixed plate (710), fixing base (720), screw rod (730), fixed cover (740) and knob (750), fixing base (720) install in fixed plate (710), fixed plate (710) sliding connection in frame (600), fixed cover (740) with grid board (200) are connected, screw rod (730) connect in fixed cover (740) and rotate connect in fixing base (720), knob (750) pass in proper order grid board (200) and fixed cover (740), and with screw rod (730) are connected.
6. The die cutting device of claim 5, wherein: the fixing seat (720), the screw rod (730), the fixing sleeve (740) and the knob (750) are respectively provided with three, each fixing seat (720) is internally provided with a belt wheel (760), the belt wheels (760) are connected to one end, far away from the knob (750), of the screw rod (730), and transmission bars (770) are connected between the three belt wheels (760).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311614256.7A CN117300389B (en) | 2023-11-29 | 2023-11-29 | Protective film preparation process and die cutting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311614256.7A CN117300389B (en) | 2023-11-29 | 2023-11-29 | Protective film preparation process and die cutting device |
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| CN117300389B true CN117300389B (en) | 2024-02-20 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220092327A (en) * | 2020-12-24 | 2022-07-01 | (주)엔피에스 | Film cutting apparatus |
| CN115948129A (en) * | 2023-03-14 | 2023-04-11 | 荣耀终端有限公司 | Screen protection film, preparation method, assembly method of screen assembly and electronic equipment |
| CN116174940A (en) * | 2023-04-24 | 2023-05-30 | 深圳市万卓盛科技有限公司 | Laser cutting device for protective film |
| CN116765636A (en) * | 2023-08-18 | 2023-09-19 | 苏州惠得利电子材料有限公司 | Screen protection film and processing device thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015145807A1 (en) * | 2014-03-24 | 2015-10-01 | リンテック株式会社 | Protective film forming film, protective film forming sheet and work product manufacturing method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220092327A (en) * | 2020-12-24 | 2022-07-01 | (주)엔피에스 | Film cutting apparatus |
| CN115948129A (en) * | 2023-03-14 | 2023-04-11 | 荣耀终端有限公司 | Screen protection film, preparation method, assembly method of screen assembly and electronic equipment |
| CN116174940A (en) * | 2023-04-24 | 2023-05-30 | 深圳市万卓盛科技有限公司 | Laser cutting device for protective film |
| CN116765636A (en) * | 2023-08-18 | 2023-09-19 | 苏州惠得利电子材料有限公司 | Screen protection film and processing device thereof |
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Country or region after: China Address after: 518000, Building 16, 201, Xiashijia First Industrial Zone, Shijia Community, Matian Street, Guangming District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN JINTIAN ELECTRON CO.,LTD. Address before: 518107 room 102-103, building 3, No. 3, youmagang Industrial Zone, Shiwei community, Matian street, Guangming District, Shenzhen, Guangdong Applicant before: SHENZHEN JINTIAN ELECTRON CO.,LTD. Country or region before: China |
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