CN117219564A - Ejector pin for rapidly stripping blue film from chip - Google Patents
Ejector pin for rapidly stripping blue film from chip Download PDFInfo
- Publication number
- CN117219564A CN117219564A CN202311227187.4A CN202311227187A CN117219564A CN 117219564 A CN117219564 A CN 117219564A CN 202311227187 A CN202311227187 A CN 202311227187A CN 117219564 A CN117219564 A CN 117219564A
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- CN
- China
- Prior art keywords
- blue film
- joint
- cavity
- chip
- vacuum tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a thimble for rapidly stripping a blue film from a chip, which is provided with an expansion joint, a fixed joint, a pressure spring and a vacuum tube cavity. The telescopic joint is movably sleeved at the upper part in the cavity of the fixed joint, the pressure spring is movably sleeved at the lower part in the cavity of the fixed joint, and a gap between the telescopic joint and the fixed joint is a vacuum tube cavity. The side wall or the bottom of the fixed joint is provided with an air hole, the outside of the air hole is communicated with a vacuum tube, and the inside of the air hole is communicated with a vacuum tube cavity. The upper annular outlet of the vacuum tube cavity is in an asymmetric shape, and one side is large and the other side is small, so that the air flow is sucked unevenly. The ejector pin disclosed by the invention has multiple functions of ejection function, air sucking function, asymmetric blue film stripping function and blue film cooling function, so that a chip can strip the blue film quickly, easily and cleanly.
Description
Technical Field
The invention relates to a thimble structure for taking a chip from a blue film.
Background
The blue film is also called an electronic grade adhesive tape, is suitable for chip bonding and cutting due to high cost performance, and is one of the mainstream wafer cutting adhesive tapes for domestic wafer cutting.
The partial manufacturing process of the semiconductor chip comprises the following steps: after the blue film is stuck on the back of the wafer from the wafer front process, the wafer is cut into small grains which are arrayed together after the dicing process. Then, the ejector pin is adopted to prop against the chip from the lower part of the blue film, so that the chip is stripped from the blue film, and the chip is sucked above the chip by the suction nozzle; the ejector pin and the suction nozzle are combined together, each chip grain is taken and fixed on a corresponding lead frame by using die bonding equipment according to requirements, and subsequent packaging treatment is carried out.
However, the viscosity of the adhesive on the blue film is greatly affected by temperature, when the temperature is high, the viscosity is high, the peeling force of the blue film for bonding the chip is high, sometimes the ejector pin is not easy to eject the chip, and the suction nozzle is not easy to absorb the chip to rapidly peel the blue film. Even the tip of the thimble needs to burst the blue film, and the chip can be taken down only by the suction nozzle with high vacuum degree to suck the chip.
The invention of application number 200810067930.3 discloses a thimble module and a method for separating a wafer from a blue film by using the module, wherein the thimble module comprises a thimble ring and a thimble arranged in the thimble ring, the thimble ring is provided with a vacuumizing passage, the thimble ring is provided with an adsorption surface for adsorbing a glue film, and the adsorption surface is provided with an air flow hole and a thimble hole. In use, when the thimble jacks up the wafer, the blue film is not punctured by the upward movement of the needle point of the thimble, but is punctured by the relative downward movement of the blue film. The adhesive of the blue film has high temperature and high viscosity, and even if the blue film is pierced, a small amount of adhesive is adhered to the back of the chip; and the blue film is essentially discarded after piercing without other uses.
Disclosure of Invention
The invention aims to:
the ejector pin capable of rapidly stripping the blue film of the chip can achieve the ejection function and the air sucking function, can reduce the viscosity of the blue film and reduce the stripping force of the blue film.
The technical scheme is as follows:
the invention discloses a thimble for rapidly stripping a blue film from a chip, which is provided with an expansion joint (the diameter of the upper end is smaller, the diameter of the lower end is larger), a fixed joint (the center of the thimble is provided with a cylindrical cavity, the diameter of the cavity is larger than that of the lower end of the expansion joint, so that the expansion joint can conveniently move up and down in the cavity and is embodied as up and down expansion, the cavity is provided with a beam opening, and the diameter of the beam opening is smaller than that of the lower end of the expansion joint, so that the lower end of the expansion joint cannot deviate from the cavity of the fixed joint), a pressure spring and a vacuum tube cavity.
The telescopic joint is movably sleeved on the upper part of the cavity of the fixed joint, and the pressure spring (the diameter of the pressure spring is smaller than that of the cylinder cavity) is movably sleeved on the lower part of the cavity of the fixed joint, so that the telescopic joint can be compressed to different degrees along with the expansion and contraction of the telescopic joint. The gap between the expansion joint and the fixed joint is a vacuum tube cavity.
The side wall or the bottom of the fixed joint is provided with an air hole, the outside of the air hole is communicated with a vacuum pipe (the vacuum pipe is connected with a vacuum pump), and the inside of the air hole is communicated with a vacuum pipe cavity.
The bottom of the fixed joint is provided with an inserting joint, so that the fixed joint can be inserted into a hole of the workbench for fixing when in use.
The upper opening of the vacuum tube cavity is an annular outlet of the telescopic joint which is movably connected with the fixed joint.
When the ejector pin is used for ejecting chips bonded on the blue film (the blue film is used as a carrier for a plurality of chips subjected to wafer dividing treatment, the orderly arranged chips are bonded on the upper surface of the blue film), the ejector pin integrally moves upwards, and the expansion joint sequentially pushes each chip from the lower part of the blue film. Because the periphery of the macromolecule blue film is clamped by the clamp arranged on the ejection mechanism, when each chip is ejected, the lower surface of the chip is gradually peeled off from the upper surface of the blue film. The chip is provided with a suction nozzle above, and the suction nozzle sucks the chip when the chip is jacked up by the ejector pin, so that the chip is picked up and transferred to the next process.
Preferably, when the ejector pin works, the vacuum pump starts to suck, so that the vacuum tube cavity forms negative pressure, the upper opening of the vacuum tube cavity sucks air below the blue film, the blue film is sucked to tear away the chip downwards, the blue film and the chip are helped to be peeled off, the peeling force is reduced, and the peeling efficiency is improved.
When air is sucked, air below the blue film quickens flow, so that the blue film is cooled down quickly, the temperature of the adhesive on the upper surface of the blue film is lowered after the temperature is cooled down, the adhesive force is lowered, the chip and the blue film are more convenient to peel off, the adhesive is not easy to leave on the bottom surface of the chip, and the chip is cleaner.
Further preferably, the annular outlet of the vacuum tube cavity is in an asymmetric shape similar to an ellipse, the axial lead of the expansion joint passes through about one focus of the ellipse, the clearance around the focus is relatively uniform, the gas circulation is relatively uniform, and the clearance is relatively small but the blockage is not easy. Namely, one side is big, the other side is small, so that the air flow is not balanced, one side is quick to suck, the other side is slow to suck, the tearing force on one side of the blue film is big, the tearing speed is high, the tearing force on the other side is small, and the tearing speed is slow. The blue film is torn off from one side and is easier to peel off from the chip.
The beneficial effects are that:
the ejector pin disclosed by the invention has multiple functions of ejection function, air sucking function, asymmetric blue film stripping function and blue film cooling function. The invention can make the chip peel off the blue film quickly and easily, and has higher cleanliness.
The ejector pin has the functions of ejection and suction, and the pipeline for sucking air is preset in the ejector pin, so that the ejector pin is compact in structure, does not need to be additionally provided with an external air pipeline, and reduces occupation of surrounding space.
The thimble of the invention has the cooling function, reduces the adhesion force and the stripping force, and the chip strips the blue film more rapidly.
According to the invention, the top end of the thimble does not need to be pointed, the chip and the blue film can be easily separated without piercing the blue film, the subsequent recycling of the blue film is facilitated, the thimble does not pierce the blue film and can not contact the adhesive on the upper surface of the blue film, the top end of the thimble does not adhere to the adhesive, and the cleanness is maintained; and the chip is not contacted with the tip, and the back of the chip is not easily damaged.
Drawings
FIG. 1 is a schematic diagram of the present invention under a chip blue film;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a schematic cross-sectional view of the present invention;
fig. 4 is a schematic view of a partial cross-sectional structure of the present invention in operation.
In the figure: 1-a suction nozzle; 2-chip; 3-blue film; 4-annular outlet; 5-a compression spring; 6-plug connectors; 7-air holes (connected with vacuum tubes); 8-vacuum tube cavity; 13-clamping; 20-telescopic joint; 21-fixed knot.
Detailed Description
Embodiment one:
the ejector pin for rapidly stripping blue film of the chip shown in fig. 1 and 2 is provided with an expansion joint 20, a fixed joint 21, a pressure spring 5 and a vacuum tube cavity 8.
The diameter of the upper end of the expansion joint 20 is smaller, and the diameter of the lower end is larger; the center of the fixed joint 21 is provided with a cylindrical cavity, and the diameter of the cavity is larger than that of the lower end of the telescopic joint 20; the cavity has a collar with a diameter smaller than the diameter of the lower end of the telescopic joint 20. The telescopic joint 20 is movably sleeved on the upper part of the cavity of the fixed joint 21, and the pressure spring 5 is movably sleeved on the lower part of the cavity of the fixed joint 21, so that the telescopic joint 20 can be compressed to different degrees along with the expansion and contraction of the telescopic joint.
The gap between the telescopic joint 20 and the fixed joint 21 is a vacuum tube cavity 8. The side wall of the fixed joint 21 is provided with an air hole 7, the outside of the air hole 7 is communicated with a vacuum tube, and then is communicated with a vacuum pump, and the inside of the air hole 7 is communicated with a vacuum tube cavity 8.
The movable joint of the vacuum tube cavity 8 and the fixed joint 21 is an annular outlet 4; when the ejector pin works, the vacuum pump starts to suck, so that the vacuum tube cavity 8 forms negative pressure, air below the blue film 3 is sucked at the annular outlet 4 in an asymmetric shape, and the blue film 3 is sucked from one side to tear away the chip 2 downwards, as shown in fig. 4.
Embodiment two:
the ejector pin for rapidly stripping the blue film of the chip shown in fig. 3 is provided with an expansion joint 20, a fixed joint 21, a pressure spring 5 and a vacuum tube cavity 8.
The diameter of the upper end of the expansion joint 20 is smaller, and the diameter of the lower end is larger; the center of the fixed joint 21 is provided with a cylindrical cavity, and the diameter of the cavity is larger than that of the lower end of the telescopic joint 20; the cavity has a collar with a diameter smaller than the diameter of the lower end of the telescopic joint 20.
The telescopic joint 20 is movably sleeved at the upper part in the cavity of the fixed joint 21, the pressure spring 5 is movably sleeved at the lower part in the cavity of the fixed joint 21, and a gap between the telescopic joint 20 and the fixed joint 21 is a vacuum tube cavity 8. The lower part of the fixed joint 21 is provided with an air hole 7, the air hole 7 is externally communicated with a vacuum tube and then is communicated with a vacuum pump, and the air hole 7 is internally communicated with a vacuum tube cavity 8.
The bottom of the fixed joint 21 is provided with a plug connector 6 with a smaller diameter, so that the thimble can be conveniently plugged into a hole of the workbench to be fixed.
When the device works, the whole thimble moves upwards along with the workbench, the chip 2 above the blue film 3 is propped up from the bottom surface of the blue film 3, the pressure spring 5 is compressed, larger elasticity is generated, and each chip 2 above the blue film 3 is propped up in sequence; simultaneously, the vacuum tube cavity 8 sucks air, so that the blue film 3 is torn downwards, meanwhile, the temperature of the blue film 3 is reduced by flowing air flow, the viscosity reduction performance of the adhesive is reduced at the temperature, and the suction nozzle 1 above the chip 2 is matched with the chip 2, so that the chip 2 is smoothly peeled from the blue film 3.
Claims (5)
1. The utility model provides a thimble of quick stripping blue membrane of chip which characterized in that: the device is provided with an expansion joint (20), a fixed joint (21), a pressure spring (5) and a vacuum tube cavity (8);
the diameter of the upper end of the expansion joint (20) is smaller, and the diameter of the lower end is larger;
the center of the fixed joint (21) is provided with a cylindrical cavity, and the diameter of the cavity is larger than that of the lower end of the telescopic joint (20); the cavity is provided with a binding opening, and the diameter of the binding opening is smaller than the diameter of the lower end of the telescopic joint (20);
the telescopic joint (20) is movably sleeved at the upper part in the cavity of the fixed joint (21), the pressure spring (5) is movably sleeved at the lower part in the cavity of the fixed joint (21), and a gap between the telescopic joint (20) and the fixed joint (21) is a vacuum tube cavity (8);
the side wall or the bottom of the fixed joint (21) is provided with an air hole (7), the air hole (7) is externally communicated with a vacuum tube, and the air hole (7) is internally connected with a vacuum tube cavity (8).
2. The ejector pin for rapidly peeling a blue film of a chip according to claim 1, wherein: the bottom of the fixed joint (21) or the plug (6) with smaller diameter is convenient for the thimble to be inserted and fixed in the hole of the workbench when in use.
3. The ejector pin for rapidly peeling a blue film of a chip according to claim 1, wherein: the upper opening of the vacuum tube cavity (8) is an annular outlet (4) which is movably connected with the telescopic joint (20) and the fixed joint (21); when the ejector pin works, the ejector pin moves upwards to prop against the chip above from the bottom surface of the blue film; simultaneously, the vacuum pump starts to suck, so that the vacuum tube cavity (8) forms negative pressure, the annular outlet (4) sucks air below the blue film (3) and sucks the blue film (3) to tear away the chip (2) downwards.
4. The ejector pin for rapidly peeling a blue film of a chip according to claim 1, wherein: the annular outlet (4) of the vacuum tube cavity (8) is in an asymmetric shape, and one side is large and the other side is small, so that the air flow is sucked unevenly.
5. The ejector pin for rapidly peeling a blue film of a chip according to claim 4, wherein: the annular outlet (4) is in an elliptical shape, and the axial lead of the expansion joint (20) passes through one focus of the ellipse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311227187.4A CN117219564A (en) | 2023-09-22 | 2023-09-22 | Ejector pin for rapidly stripping blue film from chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311227187.4A CN117219564A (en) | 2023-09-22 | 2023-09-22 | Ejector pin for rapidly stripping blue film from chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117219564A true CN117219564A (en) | 2023-12-12 |
Family
ID=89040366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311227187.4A Pending CN117219564A (en) | 2023-09-22 | 2023-09-22 | Ejector pin for rapidly stripping blue film from chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117219564A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117894720A (en) * | 2024-03-15 | 2024-04-16 | 视睿（杭州）信息科技有限公司 | Method and device for sorting semiconductor wafer chips |
-
2023
- 2023-09-22 CN CN202311227187.4A patent/CN117219564A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117894720A (en) * | 2024-03-15 | 2024-04-16 | 视睿（杭州）信息科技有限公司 | Method and device for sorting semiconductor wafer chips |
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