CN117219537A

CN117219537A - Substrate processing apparatus

Info

Publication number: CN117219537A
Application number: CN202310682656.5A
Authority: CN
Inventors: 山本滋; 岩田敬次; 西野阳祐; 枝光建治; 川井侑哉; 合田和树; 藤井大树
Original assignee: Screen Holdings Co Ltd
Current assignee: Screen Holdings Co Ltd
Priority date: 2022-06-10
Filing date: 2023-06-09
Publication date: 2023-12-12

Abstract

The invention provides a substrate processing apparatus capable of preventing adhesion of particles. The substrate processing apparatus includes: a treatment tank; a chamber surrounding the processing tank; a solvent vapor nozzle provided in the chamber and disposed at a position higher than the treatment tank; an exhaust pump arranged at a position lower than the upper surface of the processing tank, for exhausting the chamber from the exhaust port; a substrate holding unit having a holding member for holding a plurality of substrates arranged in a row so as to face each other in a vertical posture at a predetermined interval, and a back plate for supporting a base end portion of the holding member, the substrate holding unit being movable within the chamber over a position within the processing bath and a position above the processing bath; and a shielding plate provided between a front substrate of the plurality of substrates and a side wall of the chamber facing the front end side of the holding member, the front substrate being farthest from the back plate, in a state where the substrate holding portion is located above the processing bath.

Description

Substrate processing apparatus

Technical Field

The present invention relates to a substrate processing apparatus for processing a substrate. Examples of the substrate include a semiconductor substrate, a substrate for an FPD (Flat Panel Display: flat panel display), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, and a substrate for a solar cell. Examples of the FPD include a liquid crystal display device and an organic EL (electroluminescence) display device.

Background

The conventional substrate processing apparatus includes: a substrate holding unit that holds a plurality of substrates in a vertical posture; a processing tank for storing pure water and accommodating the plurality of substrates held by the substrate holding unit; a chamber surrounding the processing tank; a solvent vapor nozzle that supplies solvent vapor into the chamber; and an exhaust pump that exhausts the chamber (see patent document 1, for example).

The substrate processing apparatus of patent document 2 further includes a shielding member (plate-like member) provided in the outer tank. The shielding member prevents the drying air from containing a large amount of moisture on the outer tank in order to keep the dew point of the drying air low.

Prior art literature

Patent document 1: japanese patent application laid-open No. 2015-070148

Patent document 2: japanese patent laid-open No. 2006-278736

However, the conventional substrate processing apparatus has a problem that a large number of particles adhere to a specific substrate. For example, when a plurality of substrates are positioned above a processing bath in a chamber, the chamber is exhausted by an exhaust pump through an exhaust port provided in a lower portion of the chamber. In this case, the air flow is deteriorated at the tip end side of the holding member of the substrate holding portion, and thus the environment is liable to be retained. As a result, particles mixed in the environment may adhere to the substrate.

Disclosure of Invention

The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate processing apparatus capable of preventing adhesion of particles.

In order to achieve the above object, the present invention adopts the following configuration. That is, the substrate processing apparatus of the present invention includes: a treatment tank for storing a treatment liquid; a chamber surrounding the processing tank; a solvent vapor nozzle provided in the chamber and disposed at a position higher than the treatment tank, the solvent vapor nozzle supplying solvent vapor into the chamber; an exhaust pump that exhausts the chamber from an exhaust port disposed at a position lower than an upper surface of the processing bath; a substrate holding unit that includes a holding member that holds a plurality of substrates arranged in a row so as to face each other in a vertical posture at a predetermined interval, and a back plate that supports a base end portion of the holding member, the substrate holding unit being movable between a position in the chamber and in the processing bath and a position above the processing bath; and a shielding plate provided between a front substrate farthest from the back plate and a side wall of the chamber facing the front end side of the holding member, of the plurality of substrates, in a state where the substrate holding portion is located above the processing bath.

According to the substrate processing apparatus of the present invention, the shielding plate is provided, so that the substrate is protected from particles mixed in the environment where the tip portion side of the holding member stays. In addition, the flow of gas can be improved between the front substrate and the shielding plate. This prevents particles from adhering to the substrate (front substrate).

In the above substrate processing apparatus, the solvent vapor nozzle preferably includes: a tube portion extending horizontally and linearly in the chamber; and a plurality of ejection ports provided in the pipe portion and arranged along a pipe axis, wherein the solvent vapor nozzle further includes a liquid discharge port provided in the pipe portion upstream of the plurality of ejection ports and arranged in a region corresponding to a space between the shielding plate and the side wall of the chamber, the plurality of ejection ports respectively ejecting the solvent vapor into the chamber, and the liquid discharge port discharges a solvent generated by condensation of the solvent vapor to a region between the shielding plate and the side wall of the chamber.

The conventional substrate processing apparatus has the following problems: a liquid (droplet) of the solvent adheres to the substrate, and the liquid may cause particles. That is, the solvent vapor may condense on the upstream side of the solvent vapor nozzle due to a decrease in the pipe temperature, and the condensed solvent liquid may be ejected, for example, in a mist form from a predetermined ejection port on the upstream side of the solvent vapor nozzle. When the mist solvent adheres to the substrate, the adhering solvent liquid may become a cause of particles.

According to the present invention, the liquid of the solvent generated by dew condensation on the upstream side of the solvent vapor nozzle is discharged from the liquid discharge port of the pipe portion provided upstream of the plurality of discharge ports. The liquid discharge port is arranged in a region corresponding to a space between the shielding plate and a side wall of the chamber on the front end portion side of the holding member. Therefore, the liquid of the solvent discharged from the liquid discharge port can be prevented from adhering to the substrate (front substrate). Therefore, particles can be prevented from adhering to the substrate. In addition, the liquid of the solvent can be prevented from being supplied from a predetermined ejection port out of the plurality of ejection ports to the substrate. Therefore, the solvent vapor can be supplied from all of the plurality of ejection ports.

In the above substrate processing apparatus, it is preferable that the liquid discharge port be oriented in a direction different from the plurality of discharge ports. The liquid of the condensed solvent can be directed to the substrate without affecting the adhesion of particles.

In the substrate processing apparatus, it is preferable that an upper end of the shielding plate is disposed at a position higher than an upper end of the front substrate. The atomized solvent discharged from the liquid discharge port of the solvent vapor nozzle can be prevented from passing over the shielding plate higher than the upper end of the front substrate and toward the plurality of substrates.

In the substrate processing apparatus, it is preferable that the upper end of the shielding plate is disposed so as to reach the top surface of the chamber. The mist solvent discharged from the liquid discharge port of the solvent vapor nozzle can be prevented from being directed toward the plurality of substrates beyond the shielding plate reaching the top surface of the chamber.

Further, the substrate processing apparatus described above preferably further includes a water repellent vapor nozzle provided in the chamber and disposed at a position higher than the processing bath, the water repellent vapor nozzle including a second pipe portion extending horizontally in a straight line in the chamber and a plurality of second discharge ports provided in the second pipe portion and disposed along a pipe axis, the water repellent vapor nozzle further including a second liquid discharge port provided in the second pipe portion upstream of the plurality of second discharge ports and disposed in a region corresponding to a region between the shielding plate and the side wall of the chamber, the plurality of second discharge ports discharging the water repellent vapor into the chamber, respectively, the second liquid discharge port discharging a water repellent produced by condensation of the water repellent vapor to a region between the shielding plate and the side wall of the chamber.

The liquid of the waterproofing agent generated by dew condensation on the upstream side of the waterproofing agent vapor nozzle is discharged from the second liquid discharge port of the second pipe portion provided upstream of the plurality of second discharge ports. The second liquid discharge port is arranged in a region corresponding to a space between the shielding plate and a side wall of the chamber on the front end portion side of the holding member. Therefore, the liquid of the waterproofing agent discharged from the second liquid discharge port can be prevented from adhering to the substrate (front substrate). Therefore, particles can be prevented from adhering to the substrate. In addition, the supply of the liquid of the waterproofing agent from the predetermined second discharge port out of the plurality of second discharge ports to the substrate can be prevented. Therefore, the waterproofing agent vapor can be supplied from all of the plurality of second ejection ports.

In the substrate processing apparatus, it is preferable that the shielding plate is attached to the processing bath. Particles can be prevented from adhering to the substrate (front substrate) by the shielding plate attached to the processing bath.

In the substrate processing apparatus, it is preferable that the shielding plate is a dummy substrate held by the holding member. By providing the dummy substrate as a shielding plate, the substrate is protected from particles mixed in the environment where the tip portion side of the holding member stays. In addition, the flow of gas can be improved between the front substrate and the dummy substrate. This prevents particles from adhering to the substrate (front substrate).

In the above substrate processing apparatus, it is preferable that the apparatus further comprises: a carrier rack for placing carriers for storing the plurality of substrates in a horizontal posture; a dummy substrate carrier that accommodates the dummy substrate; a horizontal substrate conveying mechanism that conveys the plurality of substrates and conveys the dummy substrate; a posture changing mechanism that changes the postures of the plurality of substrates and the dummy substrate between a horizontal posture and a vertical posture; and a batch substrate transport mechanism that transports the plurality of substrates and the dummy substrate in a vertical posture, wherein the horizontal substrate transport mechanism transports the plurality of substrates from the carrier placed on the carrier to the posture changing mechanism, wherein the dummy substrate is transported from the carrier for the dummy substrate to the posture changing mechanism, wherein the posture changing mechanism changes the plurality of substrates and the dummy substrate transported by the horizontal substrate transport mechanism from the horizontal posture to the vertical posture, wherein the batch substrate transport mechanism transports the plurality of substrates and the dummy substrate in the vertical posture from the posture changing mechanism, wherein the substrate holding portion holds the plurality of substrates in the vertical posture, and holding the dummy substrate so as to be located between a front end substrate located farthest from the back plate and a side wall of the chamber facing the front end side of the holding member among the plurality of substrates, the substrate holding portion moving over a position in the processing tank and a position above the processing tank in a state where the plurality of substrates and the dummy substrate are held, the batch substrate conveying mechanism conveying the plurality of substrates and the dummy substrate in a vertical posture after being processed in the processing tank from the substrate holding portion to the posture changing mechanism, the posture changing mechanism changing the plurality of substrates and the dummy substrate conveyed by the batch substrate conveying mechanism from a vertical posture to a horizontal posture, the horizontal substrate conveying mechanism returning the plurality of substrates in a horizontal posture from the posture changing mechanism to the carrier placed on the carrier placing frame, and returning the dummy substrate in the horizontal posture from the posture changing mechanism to the dummy substrate carrier.

The substrate holding unit holds a plurality of substrates in a vertical posture, and holds a dummy substrate so as to be positioned between a front substrate and a side wall of the chamber among the plurality of substrates. Therefore, particles can be prevented from adhering to the front substrate. The substrate processing apparatus further includes a dummy substrate carrier that accommodates the dummy substrate for shielding. The dummy substrate is applied to each of the plurality of substrates collectively processed in the processing bath. Then, after processing by the processing bath, the dummy substrate is returned to the dummy substrate carrier separately from the plurality of substrates. Therefore, particles can be prevented from adhering to the front substrate without providing a shielding plate in a chamber surrounding the processing bath.

In addition, the substrate processing apparatus preferably further includes: a holding rack for holding a plurality of carriers; and a carrier transporting mechanism for transporting any carrier stored in the carrier rack to the carrier rack, wherein the carrier for the dummy substrate is stored in the carrier rack in advance. The dummy substrate carrier is transported from a storage rack to a carrier loading rack by a carrier transport mechanism. The horizontal substrate transfer mechanism is capable of transferring the dummy substrate from the dummy substrate carrier placed on the carrier.

In the above substrate processing apparatus, it is preferable that the apparatus further comprises: a carrier rack for placing carriers for storing the plurality of substrates in a horizontal posture; a dummy substrate carrier that accommodates the dummy substrate; a horizontal substrate conveying mechanism that conveys the plurality of substrates and conveys the dummy substrate; a posture changing mechanism that changes the postures of the plurality of substrates and the dummy substrate between a horizontal posture and a vertical posture; a batch substrate conveying mechanism that conveys the plurality of substrates and the dummy substrate in a vertical posture; and a substrate detection sensor unit that detects the presence or absence of a substrate stored in the carrier, wherein the holding member includes a plurality of holding grooves arranged in a row for holding the plurality of substrates, the plurality of holding grooves include a distal end holding groove located at a distal end portion of the holding member, the substrate detection sensor unit detects the presence or absence of a substrate stored in the carrier while moving in a vertical direction with respect to the carrier mounted on the carrier holder, the horizontal substrate transfer mechanism transfers the plurality of substrates from the carrier mounted on the carrier holder to the posture changing mechanism, and when the substrate detection sensor unit detects that there is no corresponding substrate corresponding to the distal end holding groove in the carrier, the horizontal substrate conveying mechanism conveys the dummy substrate from the carrier for dummy substrate to a portion of the array of the plurality of substrates conveyed to the posture changing mechanism where the corresponding substrate is absent, the posture changing mechanism changes the plurality of substrates and the dummy substrate conveyed by the horizontal substrate conveying mechanism from a horizontal posture to a vertical posture, the batch substrate conveying mechanism conveys the plurality of substrates and the dummy substrate in the vertical posture from the posture changing mechanism, the substrate holding section receives the plurality of substrates and the dummy substrate in the vertical posture from the batch substrate conveying mechanism in the plurality of holding grooves of the holding member, the batch substrate conveying mechanism conveys the plurality of substrates and the dummy substrate in the vertical posture processed by the processing groove from the substrate holding section to the posture changing mechanism, the posture changing mechanism changes the plurality of substrates and the dummy substrate conveyed by the batch substrate conveying mechanism from a vertical posture to a horizontal posture, and the horizontal substrate conveying mechanism returns the plurality of substrates in the horizontal posture from the posture changing mechanism to the carrier mounted on the carrier mounting frame, and returns the dummy substrate in the horizontal posture from the posture changing mechanism to the carrier for the dummy substrate.

The plurality of holding grooves of the holding member of the substrate holding portion have tip holding grooves located at the extreme end of the holding member on the tip side. When the substrate detection sensor unit detects that there is no corresponding substrate corresponding to the front end holding groove on the carrier, the horizontal substrate conveying mechanism conveys the dummy substrate to a portion of the array of the plurality of substrates conveyed to the posture changing mechanism where there is no corresponding substrate. Thus, the dummy substrate can be automatically disposed between the front substrate and the side wall of the chamber facing the front end portion side of the holding member. The substrate processing apparatus further includes a dummy substrate carrier that accommodates the dummy substrate for shielding. The dummy substrate is selectively applied to a plurality of substrates processed at once in the processing bath. Then, after processing by the processing bath, the dummy substrate is returned to the dummy substrate carrier separately from the plurality of substrates. Therefore, particles can be prevented from adhering to the front substrate without providing a shielding plate in a chamber surrounding the processing bath.

In the above substrate processing apparatus, it is preferable that the apparatus further comprises: a carrier rack for placing a first carrier for storing a first substrate group composed of more than 2 substrates in a horizontal posture; a dummy substrate carrier for accommodating the dummy substrate; a horizontal substrate conveying mechanism for conveying the first substrate group, conveying a second substrate group composed of more than 2 substrates, and conveying the dummy substrates; a posture changing mechanism for changing the postures of the first substrate group, the second substrate group and the dummy substrate between a horizontal posture and a vertical posture, and combining the first substrate group and the second substrate group to form the plurality of substrates in the vertical posture; a batch substrate conveying mechanism for conveying the plurality of substrates in a vertical posture and the dummy substrate; and a substrate detection sensor unit for detecting the presence or absence of a substrate stored in the first carrier, the holding member including a plurality of holding grooves arranged in a row for holding the plurality of substrates, the plurality of holding grooves including a distal end holding groove located at a distal end portion of the holding member, the substrate detection sensor unit detecting the presence or absence of a substrate stored in the first carrier while moving in a vertical direction with respect to the first carrier mounted on the carrier holder, the substrate detection sensor unit detecting the presence or absence of a substrate stored in the second carrier while moving in a vertical direction with respect to a second carrier mounted on the carrier holder and stored in a horizontal posture, the horizontal substrate transfer mechanism transferring the first substrate group from the first carrier mounted on the carrier holder to the posture conversion mechanism, the horizontal substrate transfer mechanism transfers the second substrate group from the second carrier placed on the carrier to the posture changing mechanism, and when the substrate detection sensor portion detects that there is no corresponding substrate corresponding to the front end holding groove on the first carrier or the second carrier, the horizontal substrate transfer mechanism transfers the dummy substrate from the dummy substrate carrier to a portion of the row of the first substrate group or the second substrate group transferred to the posture changing mechanism, where the corresponding substrate is not present, the posture changing mechanism changes the first substrate group, the second substrate group, and the dummy substrate from a horizontal posture to a vertical posture, and the plurality of substrates in the vertical posture are formed by combining the first substrate group and the second substrate group, the batch substrate transfer mechanism transfers the plurality of substrates and the dummy substrate in the vertical posture from the posture changing mechanism, the substrate holding portion receives the plurality of substrates and the dummy substrate in the vertical posture from the batch substrate transfer mechanism from the plurality of holding grooves of the holding member, the batch substrate transfer mechanism transfers the plurality of substrates and the dummy substrate in the vertical posture processed by the processing groove from the substrate holding portion to the posture changing mechanism, the posture changing mechanism divides the plurality of substrates transferred by the batch substrate transfer mechanism into the first substrate group and the second substrate group, and further, the first substrate group, the second substrate group and the dummy substrate are changed from the vertical posture to the vertical posture, the horizontal substrate transfer mechanism returns the first substrate group in the horizontal posture from the posture changing mechanism to the first carrier of the carrier, returns the second substrate group in the horizontal posture from the changing mechanism to the second carrier, and returns the dummy substrate from the horizontal posture to the carrier.

The plurality of holding grooves of the holding member of the substrate holding portion have tip holding grooves located at the extreme end of the holding member on the tip side. When the substrate detection sensor unit detects that the corresponding substrate corresponding to the front end holding groove is not on the first carrier or the second carrier, the horizontal substrate conveying mechanism conveys the dummy substrate to a portion of the column of the first substrate group or the second substrate group conveyed to the posture changing mechanism, where the corresponding substrate is not present. Thus, the dummy substrate can be automatically disposed between the front substrate and the side wall of the chamber facing the front end portion side of the holding member. The substrate processing apparatus further includes a dummy substrate carrier that accommodates the dummy substrate for shielding. The dummy substrate is selectively applied to a plurality of substrates processed at once in the processing bath. Then, after processing by the processing bath, the dummy substrate is returned to the dummy substrate carrier separately from the plurality of substrates. Therefore, particles can be prevented from adhering to the front substrate without providing a shielding plate in a chamber surrounding the processing bath.

In the above substrate processing apparatus, it is preferable that the substrates of the first substrate group and the substrates of the second substrate group of the plurality of substrates are alternately arranged one by one. When the substrates of the first substrate group and the substrates of the second substrate group are alternately arranged one by one, particles can be prevented from adhering to the substrates (the front end substrates).

In the substrate processing apparatus, it is preferable that the front substrate faces the side wall of the chamber. In the case where the front substrate faces the side wall of the chamber, particles can be prevented from adhering to the substrate (front substrate).

The effects of the present invention are as follows.

According to the substrate processing apparatus of the present invention, adhesion of particles can be prevented.

Drawings

Fig. 1 is a vertical cross-sectional view showing a schematic configuration of the front surface of a substrate processing apparatus according to example 1.

Fig. 2 (a) is a left side view showing a substrate holding portion of the elevator, and (b) is a plan view of (a).

Fig. 3 is a vertical sectional view showing a schematic configuration of a left side surface of the substrate processing apparatus.

Fig. 4 (a) is a vertical cross-sectional view showing a schematic configuration of a left side surface of the substrate processing apparatus when a plurality of substrates are not shown, and (b) is a view showing a solvent vapor nozzle (water repellent vapor nozzle).

Fig. 5 is a vertical sectional view showing a schematic configuration of the front surface of the substrate processing apparatus.

Fig. 6 is a diagram for explaining an operation of the substrate processing apparatus.

Fig. 7 is a diagram for explaining a problem of the substrate processing apparatus.

Fig. 8 (a) to (c) are diagrams for explaining problems of the substrate processing apparatus.

Fig. 9 is a vertical sectional view showing a schematic configuration of the left side surface of the cleaning processing unit of example 2.

Fig. 10 is a plan view showing a schematic configuration of the substrate processing apparatus of example 2.

Fig. 11 is a side view of a substrate processing mechanism.

Fig. 12 (a) to (f) are side views for explaining the structure and operation of the posture changing mechanism (posture changing section and pushing mechanism).

Fig. 13 (a) is a left side view showing a substrate holding portion of the elevator according to example 2, and (b) is a plan view of (a).

Fig. 14 is a flowchart for explaining the operation of the substrate processing apparatus according to embodiment 2.

Fig. 15 is a vertical sectional view showing a schematic configuration of the left side surface of the cleaning processing unit of example 3.

Fig. 16 (a) is a side view showing the structure of the opener, and (b) is a plan view showing the detection state of the substrate detection sensor.

Fig. 17 is a flowchart for explaining the operation of the substrate processing apparatus according to embodiment 3.

Fig. 18 (a) to (f) are side views for explaining the operation of the posture changing mechanism of embodiment 3.

Fig. 19 is a left side view showing a substrate holding portion of the lifter.

Fig. 20 (a) to (f) are side views for explaining the operation of the posture changing mechanism of embodiment 4.

Fig. 21 (a) is a left side view of a shield plate for explaining a modification, and (b) is a view as viewed from the arrow direction of (a).

Fig. 22 is a diagram showing a solvent vapor nozzle (water repellent vapor nozzle) according to a modification example.

Fig. 23 is a left side view for explaining a dummy substrate according to a modification.

In the figure: 1. 1A-substrate processing apparatus, 2-process tank, 3-chamber, 5-substrate holding section, 7-holding member, 7A-front end section, 7B-base end section, 9-back plate, 31, 32-solvent vapor nozzle, 33-water repellent vapor nozzle, 47-exhaust port, 51-exhaust pump, 61-control section, 71, 95-shielding plate, 72-upper end, 73-tube section, AX-tube shaft, 75-exhaust port, 76-liquid exhaust port, 78-region, 83-second tube section, 85-second exhaust port, 86-second liquid exhaust port, WT-front end substrate, RT-moving path, AR 2-equipment face orientation, H1-drying position, H2-processing position, 100-dummy substrate, HTR-substrate processing mechanism, 117-posture changing mechanism, 119-carrier, 137-posture changing section, 139-pushing mechanism, 153-substrate detection sensor section, WTR-conveying mechanism, C-carrier, SL 1-SL 51-tank.

Detailed Description

Hereinafter, embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a vertical cross-sectional view showing a schematic configuration of the front surface of a substrate processing apparatus 1 of example 1. Fig. 2 (a) is a left side view showing the substrate holding portion 5 of the lifter 4. Fig. 2 (b) is a top view of fig. 2 (a).

< 1. Structure of substrate processing apparatus 1 >

Reference is made to fig. 1. The substrate processing apparatus 1 is an apparatus for processing a plurality of substrates W at once. The substrate processing apparatus 1 includes a processing tank 2 for storing a processing liquid, a chamber 3 surrounding the processing tank 2, and an elevator 4. The processing bath 2 is configured to be capable of accommodating a plurality of substrates W in a substantially vertical posture. The processing tank 2 is disposed separately from the side surface and the bottom surface in the chamber 3.

The lifter 4 includes a substrate holding portion 5 that holds a plurality of substrates W, and a lifter mechanism 6 that lifts and lowers the substrate holding portion 5 in the up-down direction (Z direction). The elevating mechanism 6 is capable of elevating the substrate W above the processing bath 2 between a "dry position H1" in the chamber 3 and a "processing position H2" in the processing bath 2. In fig. 1, the substrate holding portion 5 is located at a drying position H1 above the processing bath 2 in the chamber 3. The elevating mechanism 6 includes an electric motor or an air cylinder for elevating the substrate holding unit 5.

The substrate holding portion 5 includes 3 holding members 7 and a back plate 9. As shown in fig. 2 (a) and 2 (b), the holding member 7 is formed to extend linearly in the horizontal direction (Y direction). The holding member 7 holds a plurality of (for example, 50) substrates W arranged in a row so as to face each other in a substantially vertical posture with a predetermined interval therebetween. In other words, the holding member 7 holds a plurality of substrates W arranged in a row along the Y axis extending in the horizontal direction. The holding member 7 holds a plurality of substrates W in a substantially vertical posture. The plurality of substrates W are arranged parallel to each other. The holding member 7 has a plurality of (e.g., 50) groove portions formed in an array in the Y direction at a predetermined pitch (e.g., 5mm (half pitch)).

The 50 slots are referred to as slots (slots) 1-50, respectively. In fig. 2 (a) and fig. 8 (a) to 8 (c) described later, for example, slot 1 is denoted as "SL1", and slot 49 is denoted as "SL49". The groove closest to the back plate 9 is groove 1. The farther away from the back plate 9, as are slots 2, 3 and 4, the more the number of slots increases. And the groove furthest from the back plate 9 is the slot 50. For example, 50 substrates W can be held by the holding member 7 by housing 50 substrates W in 50 grooves.

As shown in fig. 1 and 2 (b), the substrate holding portion 5 includes 3 holding members 7. In this regard, the substrate holding portion 5 may have 1 or more holding members 7.

The back plate 9 supports the base end portions 7B of the 3 holding members 7. That is, the 3 holding members 7 are connected to the lower end portion of the back plate 9. For example, as shown by arrow AR1 in fig. 2 (a), when a plurality of substrates W are viewed from the back plate 9 side, the back plate 9 is formed so as to cover each substrate W, for example. The distal ends 7A of the 3 holding members 7 are connected by a connecting member 11 (see fig. 2 b).

Returning to fig. 1. At the bottom of the treatment tank 2, 2 discharge pipes 13 for supplying the treatment liquid into the treatment tank 2 are provided. Each of the discharge tubes 13 is formed in a straight line along the Y direction in which the plurality of substrates W are arranged. Each of the discharge tubes 13 has a plurality of discharge ports (not shown) arranged in the Y direction (tube axis).

The processing liquid piping 15 connects the 2 discharge pipes 13 to the processing liquid supply source 17. The treatment liquid supply source 17 supplies pure water as a treatment liquid to the treatment liquid pipe 15. As the pure Water, for example, deionized Water (DIW: deionized Water) is used. The processing liquid pipe 15 is provided with an on-off valve V1. The on-off valve V1 supplies and stops the pure water. When the on-off valve V1 is opened, pure water is supplied from the 2 discharge pipes 13 to the processing tank 2. When the on-off valve V1 is closed, the supply of pure water from the 2 discharge tubes 13 is stopped.

The treatment liquid pipe 15 between the 2 discharge pipes 13 and the on-off valve V1 is connected to the tip of the treatment liquid pipe 19. The base end of the treatment liquid pipe 19 is connected to a second treatment liquid supply source 21. The second treatment liquid supply source 21 supplies an isopropyl alcohol liquid diluted with pure water (for example, DIW) (hereinafter, referred to as "diluted IPA liquid") to the treatment liquid pipe 19. The on-off valve V2 is provided in the treatment liquid pipe 19. The on-off valve V2 supplies and stops the diluted IPA liquid. One of the pure water and the diluted IPA liquid is selectively supplied from each discharge pipe 13 by 2 on-off valves V1, V2.

A QDR valve (on-off valve) 23 for discharging the processing liquid in the processing tank 2 to the bottom surface in the chamber 3 is provided at the bottom of the processing tank 2. When QDR valve 23 is opened, the treatment liquid in treatment tank 2 is rapidly released to the bottom surface in chamber 3. When QDR valve 23 is closed, the treatment liquid can be stored in treatment tank 2.

The chamber 3 houses the processing tank 2. The chamber 3 has an upper cover 25 on its upper surface, which can be opened and closed freely. When the upper cover 25 is closed, the upper cover 25 functions as a top wall of the chamber 3.

In the chamber 3, 2 inert gas nozzles 27, 4 solvent vapor nozzles 31, 32, and 2 water repellent vapor nozzles 33 are provided. The 8 nozzles 27, 31, 32, 33 are arranged at a position higher than the treatment tank 2 (or the upper surface of the treatment tank 2). Further, 2 inert gas nozzles 27, 2 solvent vapor nozzles 31, 2 solvent vapor nozzles 32, and 2 water repellent vapor nozzles 33 are arranged in this order from above.

When the substrate holding portion 5 is located at the drying position H1, 2 solvent vapor nozzles 31 are disposed at a height near the upper end of each substrate W. In addition, 2 solvent vapor nozzles 32 are arranged at a height near the center of each substrate W. Further, 2 water repellent vapor nozzles 33 are disposed at a height near the lower end of each substrate W.

The 2 inert gas nozzles 27 supply inert gas into the chamber 3. Each inert gas nozzle 27 is connected to the front end of the supply pipe 35. The base end of the supply pipe 35 is connected to an inert gas supply source 37. The inert gas supply source 37 supplies, for example, nitrogen gas as an inert gas to the supply pipe 35. The supply pipe 35 is provided with an on-off valve V4. The on-off valve V4 supplies and stops the inert gas.

The 2 inert gas nozzles 27 are horizontally disposed so as to sandwich the movement paths RT of the plurality of substrates W. Each inert gas nozzle 27 includes a tube portion 27A extending linearly in the horizontal direction (Y direction) (see fig. 4 (a)) described later. The tube portion 27A has a plurality of discharge ports 27B formed along the tube axis (Y direction).

The 4 solvent vapor nozzles 31 and 32 supply solvent vapor into the chamber 3. The tip ends of the supply pipes 39 are connected to the solvent vapor nozzles 31 and 32. The base end of the supply pipe 39 is connected to a solvent vapor supply source 41. The solvent vapor supply source 41 supplies, for example, isopropyl alcohol vapor (hereinafter referred to as "IPA vapor") as solvent vapor to the supply pipe 39. The solvent vapor is generated by evaporating the liquid of the solvent by a heater. The solvent vapor may also contain an inert gas (nitrogen) as a carrier gas. The supply pipe 39 is provided with an on-off valve V5. The on-off valve V5 supplies and stops the solvent vapor.

The 2 solvent vapor nozzles 31 are horizontally arranged so as to sandwich the movement paths RT of the plurality of substrates W. Similarly, the 2 solvent vapor nozzles 32 are horizontally arranged so as to sandwich the movement paths RT of the plurality of substrates W. Further configurations of the 4 solvent vapor nozzles 31 and 32 will be described later.

The 2 waterproofing agent vapor nozzles 33 supply waterproofing agent vapor into the chamber 3, respectively. The tip of the supply pipe 43 is connected to each water repellent vapor nozzle 33. The base end of the supply pipe 43 is connected to a water repellent vapor supply source 45. The water repellent vapor supply source 45 supplies water repellent vapor to the supply pipe 43. The water repellent vapor is generated by evaporating a liquid of a water repellent (silyl compound agent) by a heater. The waterproofing agent vapor may contain an inert gas (nitrogen) as a carrier gas. The supply pipe 43 is provided with an on-off valve V6. The on-off valve V6 supplies and stops the waterproofing agent vapor.

The 2 water repellent vapor nozzles 33 are horizontally disposed so as to sandwich the movement paths RT of the plurality of substrates W. Further configurations of the 2 water repellent vapor nozzles 33 will be described later.

An exhaust port 47 is provided in a side wall of the chamber 3. The exhaust port 47 is disposed at a position lower than the upper surface of the processing tank 2. For example, the exhaust port 47 is arranged at a height facing the outer surface 2A of the processing tank 2. The exhaust port 47 is disposed at a position lower than a shielding plate 55 described later. An exhaust pipe 49 is connected to the exhaust port 47. The exhaust pipe 49 is provided with an opening/closing valve V7 and an exhaust pump 51 in this order from the exhaust port 47 side. The exhaust pump 51 discharges the gas in the chamber 3 from the exhaust port 47. Thereby, the pressure in the chamber 3 is reduced to a pressure lower than the atmospheric pressure.

In fig. 1, for convenience of illustration, the exhaust port 47 is provided in the side wall 3C. In this regard, as shown in fig. 3 described later, the exhaust port 47 is provided in the side wall 3A.

Further, a drain 53 is connected to the bottom wall of the chamber 3. The discharge pipe 53 is provided with an on-off valve V8. When the on-off valve V8 is opened, the processing liquid in the chamber 3 can be discharged to the outside of the chamber 3. When the on-off valve V8 is closed, the processing liquid can be stored in the bottom of the chamber 3.

The chamber 3 is provided with a shield plate 55. The shield plate 55 is provided slightly downward from the upper edge (or opening) of the processing tank 2 and over the entire periphery of the outer surface 2A of the processing tank 2. In other words, the shield plate 55 is provided between the outer side wall of the processing tank 2 and the inner side wall of the chamber 3. The shielding plate 55 shields the environment between an upper portion (upper space) in the chamber 3 and a lower portion (lower space) in the chamber 3. The shield plate 55 has gaps G1 and G2 (openings) through which the processing liquid overflowed from the processing bath 2 flows in the lower portion of the chamber 3. That is, the shield plate 55 has a gap G1 with the outer side wall of the processing bath 2 and a gap G2 with the inner side wall of the chamber 3. In addition, one of the gaps G1 and G2 may not be provided as needed.

The substrate processing apparatus 1 includes a control unit 61 and a storage unit (not shown). The control section 61 controls each configuration of the substrate processing apparatus 1. The control unit 61 includes, for example, 1 or more processors such as a Central Processing Unit (CPU). The storage unit includes at least 1 of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk, for example. The storage unit stores a computer program necessary for controlling each configuration of the substrate processing apparatus 1.

< 2 shielding plate 71 >)

Next, 1 shielding plate 71, which is a characteristic part of the present embodiment, will be described. Fig. 3 is a vertical sectional view showing a schematic configuration of the left side surface of the substrate processing apparatus 1. Fig. 4 (a) is a vertical cross-sectional view showing a schematic configuration of the left side surface of the substrate processing apparatus 1 when a plurality of substrates W are not shown. Fig. 4 b is a view showing the solvent vapor nozzles 31 and 32 (the water repellent vapor nozzle 33). Fig. 5 is a vertical cross-sectional view showing a schematic configuration of the front surface of the substrate processing apparatus 1.

The substrate processing apparatus 1 includes a shielding plate 71. The shielding plate 71 prevents particles, mist, and the like from adhering to the equipment surface of the front substrate WT described later. The shielding plate 71 is attached to the processing tank 2 via an attaching member not shown. The shielding plate 71 is formed to extend in the up-down direction (Z direction). The shielding plate 71 may be attached to the chamber 3.

The shielding plate 71 is provided between the "front substrate WT" and the side wall 3A of the chamber 3 facing the front end portion 7A side of the holding member 7. The front substrate WT is the substrate W farthest from the back plate 9 among a plurality of (for example, 49) substrates W. The side walls of the chamber 3 on the base end 7B side and the back plate 9 side of the holding member 7 are denoted by reference numeral 3B.

In fig. 5, the shielding plate 71 is disposed so as to cover the entire substrate W when viewed in a direction (+y direction) from the front end portion 7A side toward the base end portion 7B side of the holding member 7. The device surface (surface) of the front substrate WT faces in a direction (-Y direction) from the base end portion 7B side toward the front end portion 7A side of the holding member 7. The slot 49 (SL 49) shown in fig. 2 (a) is the front substrate WT. As shown by arrow AR2 in fig. 2 (a), the device surface of the front substrate WT faces the shielding plate 71.

The distance K1 between the equipment surface of the front substrate WT of the slot 49 and the shielding plate 71 is, for example, 13mm (see fig. 3). In addition, the distance between the shielding plate 71 and the side wall 3A is assumed to be a distance K2. The distance K1 is smaller than the distance K2 (distance K1 < distance K2).

The device surface of the substrate W including the front substrate WT is a surface on which an electronic circuit is formed, and is referred to as a "surface". The back surface of the substrate W is a surface on which no electronic circuit is formed. The opposite side of the device face is the back face.

As shown in fig. 3 and 5, the upper end 72 of the shielding plate 71 is disposed so as to reach the top surface 3E of the chamber 3. That is, the upper end 72 of the shielding plate 71 is disposed at substantially the same height as the top surface 3E of the chamber 3 (e.g., a gap is provided between the upper end 72 of the shielding plate 71 and the top surface 3E). For example, the mist solvent discharged from the liquid discharge ports 76 of the solvent vapor nozzles 31 and 32 described later is prevented from being directed toward the plurality of substrates W beyond the shielding plate 71 reaching the top surface 3E of the chamber 3. Further, since the air flow on the lower end side of the shielding plate 71 is relatively fast, it is considered that the mist solvent does not face the plurality of substrates W. The same applies to the mist waterproofing agent discharged from the second liquid discharge port 86 of the waterproofing agent vapor nozzle 33, which will be described later.

< 3. Liquid discharge ports 76, 86 of solvent vapor nozzles 31, 32 and waterproofing agent vapor nozzle 33 >

Next, the liquid discharge ports 76, 86 of the solvent vapor nozzles 31, 32 and the water repellent vapor nozzle 33, which are other features of the present embodiment, will be described.

Referring to fig. 3, 4 (a), and 4 (b). Each of the solvent vapor nozzles 31 and 32 includes a tube portion 73 extending horizontally (Y direction) in a straight line and a plurality of (e.g., 50) ejection ports 75 provided in the tube portion 73. The 50 ejection ports 75 are arranged along the tube axis AX (see fig. 4 (b)) at predetermined intervals. For example, 50 ejection orifices 75 are arranged at 5mm intervals (pitch). The 50 ejection ports 75 eject the solvent vapor into the chamber 3.

The 50 ejection orifices 75 have circular openings of the same diameter D1 as each other. The 50 ejection ports 75 are arranged so as to correspond to, for example, 50 substrates W that can be held by the substrate holding unit 5. That is, the 50 ejection ports 75 are arranged in regions corresponding to the regions of the 50 substrates W held by the substrate holding portion 5. The ejection ports 75 are directed, for example, in a horizontal direction (X direction) or in a diagonally downward direction (XZ direction) in order to eject the solvent vapor toward the substrate W.

In addition, the conventional substrate processing apparatus has the following problems: a liquid (droplet) of the solvent adheres to the substrate W, and the liquid may become a cause of particles. That is, on the upstream side of each of the solvent vapor nozzles 31 and 32, the solvent vapor may condense due to a decrease in the piping temperature, and the condensed solvent liquid may be ejected, for example, in a mist form from 1 or more ejection ports on the upstream side of each of the solvent vapor nozzles 31 and 32. When the mist solvent adheres to the substrate W on the side of the slot 49, the adhering solvent may become a cause of particles. The same applies to the water repellent vapor nozzle 33.

Therefore, in the present embodiment, each of the solvent vapor nozzles 31 and 32 further includes the liquid discharge port 76 of the pipe portion 73 provided upstream of the plurality of discharge ports 75. The liquid discharge port 76 discharges the liquid of the solvent generated by condensation of the solvent vapor into the chamber 3. As shown in fig. 3 and 4 (a), the liquid discharge port 76 is arranged in a region 78 corresponding to between the shielding plate 71 and the side wall 3A of the chamber 3. The liquid discharge port 76 discharges, for example, the liquid of the solvent to a region between the shielding plate 71 and the side wall 3A of the chamber 3 (i.e., a space sandwiched by the shielding plate 71 and the side wall 3A of the chamber 3).

The ejection port 75 on the distal end portion 7A side of the holding member 7 out of the 50 ejection ports 75 is referred to as "ejection port 75A". In this case, the distance LN1 from the ejection port 75A to the liquid discharge port 76 is longer than the interval LN2 of 2 ejection ports 75. The liquid discharge port 76 has a circular opening of diameter D2. The diameter D2 of the liquid discharge port 76 is the same as the diameter D1 of each discharge port 75 (diameter d1=d2). In addition, for example, when the respective ejection ports 75 of the solvent vapor nozzle 32 eject the solvent vapor in the horizontal direction (X direction), the liquid discharge ports 76 also discharge the solvent condensed in the same direction as the respective ejection ports 75, that is, in the horizontal direction (X direction).

The water repellent vapor nozzles 33 are also constructed substantially the same as the solvent vapor nozzles 31. That is, each of the water repellent vapor nozzles 33 includes a second pipe portion 83 extending in a straight line in the horizontal direction (Y direction) and a plurality of (for example, 50) second discharge ports 85 provided in the second pipe portion 83. The 50 second discharge ports 85 are arranged at predetermined intervals (for example, 5 mm) along the tube axis AX (Y direction). The second discharge ports 85 discharge the water repellent vapor into the chamber 3. The second discharge ports 85 are also directed, for example, in the horizontal direction (X direction) or in the obliquely downward direction (XZ direction).

The waterproofing agent vapor nozzle 33 further includes a second liquid discharge port 86 provided in the second pipe portion 83 upstream of the 50 second discharge ports 85. The second liquid discharge port 86 is arranged in the region 78 corresponding to between the shielding plate 71 and the side wall 3A of the chamber 3. In fig. 4 (a), the second ejection port 85 on the distal end portion 7A side of the holding member 7 out of the 50 second ejection ports 85 is referred to as "second ejection port 85A". In this case, the distance LN1 from the second ejection port 85A to the second liquid ejection port 86 is larger than the interval LN2 (for example, 5 mm) of 2 second ejection ports 85. The second liquid discharge port 86 discharges the liquid (droplet) of the waterproofing agent generated by condensation of the waterproofing agent vapor into the chamber 3. The second liquid discharge port 86 discharges, for example, a liquid of the waterproofing agent to a region between the shielding plate 71 and the side wall 3A of the chamber 3. The second liquid discharge port 86 discharges, for example, a liquid of a waterproofing agent as a mist.

In the present embodiment, each of the solvent vapor nozzles 31 and 32 has 1 liquid discharge port 76, but may have 2 or more liquid discharge ports 76 arranged in the Y direction. Similarly, the waterproofing agent vapor nozzle 33 is provided with 1 second liquid discharge port 86, but may be provided with 2 or more second liquid discharge ports 86 aligned in the Y direction.

< 4 > operation of substrate processing apparatus 1 >

The operation of the substrate processing apparatus 1 will be described with reference to fig. 6. In fig. 6, the substrate holding portion 5 is not shown. In fig. 6, the symbol "1" indicates the exhaust operation by the exhaust pump 51 and the on-off valve V7.

In the treatment tank 2, pure water is stored as a treatment liquid through the discharge pipe 13. The substrate holding portion 5 is located at the drying position H1. A not-shown transfer robot transfers 49 substrates W to the substrate holding unit 5, for example. The substrate holding unit 5 holds, for example, 49 substrates W in a vertical posture. The lifter 4 lowers the substrate holding unit 5 from the drying position H1 to the processing position H2, thereby immersing 49 substrates W in the pure water in the processing tank 2 for a predetermined period (step S01). Thereby, the substrate W is cleaned. After the substrate holding portion 5 is lowered, the upper cover 25 is closed.

In addition, regarding 49 substrates W, the equipment of the substrates W with odd number of slots (for example, slots 1, 3, 5, & gt47, 49) faces toward the shielding plate 71 side (-Y direction), even number of slots (e.g., slots 2, 4, 6 · · · · · · ·' 46, 48) are facing the back plate 9 side. That is, 49 substrates W are arranged face to face (face to face). The substrate W of the slot 49 (SL 49) is a front substrate WT (see fig. 2 (a) and 3).

Thereafter, nitrogen gas is supplied from the inert gas nozzle 27 into the chamber 3. Further, by opening the opening/closing valve V7 while operating the exhaust pump 51, the inside of the chamber 3 is exhausted from the exhaust port 47, and the inside of the chamber 3 is depressurized to a pressure lower than the atmospheric pressure (step S02). After that, the exhaust pump 51 and the like continue the exhaust of the chamber 3. The supply of the nitrogen gas from the inert gas nozzle 27 is stopped, and the IPA vapor is supplied into the chamber 3 from the solvent vapor nozzles 31 and 32 (step S03).

After that, the exhaust pump 51 is stopped, and the opening/closing valve V7 is closed. Further, the supply of the IPA vapor is continued. The lifter 4 moves the substrate holding unit 5 from the processing position H2 to the drying position H1, thereby lifting 49 substrates W from the pure water in the processing tank 2 (step S04). Thereby, the pure water adhering to the device surface of the substrate W is replaced with IPA.

Here, the effects of the liquid discharge port 76 and the shielding plate 71 will be described. Since the liquid (liquid droplets) of the condensed solvent is discharged from the liquid discharge port 76, the mist-like solvent can be prevented from being discharged to the substrate W side of the slot 49. Accordingly, the IPA vapor can be uniformly supplied from the 50 ejection ports 75 to 49 substrates W. In addition, the shielding plate 71 prevents the liquid of the solvent discharged from the liquid discharge port 76 from adhering to the substrate W. The steps S07 and S12 described later are also similar.

After step S04, QDR valve 23 is opened to release pure water in treatment tank 2 to the bottom surface of chamber 3 (step S05). Thereafter, the exhaust pump 51 is operated to open the opening/closing valve V7, thereby exhausting the chamber 3. The supply of the IPA vapor from the solvent vapor nozzles 31 and 32 is stopped, and the water repellent vapor is supplied from the water repellent vapor nozzle 33 into the chamber 3 (step S06). Thereby, IPA attached to the substrate W is replaced with a water repellent. The equipment surface of the substrate W is modified with a water repellent agent.

Here, the water repellent vapor may be uniformly supplied from the plurality of second discharge ports 85 to 49 substrates W. In addition, the shielding plate 71 prevents the water repellent liquid discharged from the second liquid discharge port 86 from adhering to the substrate W.

After step S06, the exhaust pump 51 and the like continue to exhaust the air in the chamber 3. Further, the supply of the water repellent vapor from the water repellent vapor nozzle 33 is stopped, and the IPA vapor is supplied from the solvent vapor nozzles 31, 32 into the chamber 3 (step S07). Thus, the water repellent attached to the substrate W is replaced with IPA, and the water repellent and particles derived from the water repellent are washed, for example.

After that, the exhaust pump 51 is stopped, and the opening/closing valve V7 is closed. The supply of the IPA vapor from the solvent vapor nozzles 31 and 32 is stopped, and the nitrogen gas is supplied from the inert gas nozzle 27 into the chamber 3 (step S08). Thereby, the inside of the chamber 3 in the depressurized state is returned to the atmospheric pressure. After that, the pure water in the lower portion of the chamber 3 is discharged to the outside of the chamber 3 through the discharge pipe 53 (step S08).

Here, the effect of the shielding plate 71 will be described. Fig. 7 shows a substrate processing apparatus 201 in which the shielding plate 71 is not provided. In addition, the respective components of the substrate processing apparatus 201 are denoted by the same reference numerals as those of the substrate processing apparatus 1 shown in fig. 3. In fig. 7, the exhaust pump 51 exhausts the chamber 3 from the exhaust port 47 provided in the side wall 3A, and depressurizes the chamber 3. At this time, the region 91 on the tip end portion 7A side of the holding member 7 is a region in which the air flow is slow. Thus, the environment is liable to remain. For example, there are cases where the particles (dirt) generated in step S06 and the particles (dirt) generated in step S07 are aggregated and retained in the region 91. The particles contain, for example, mist, which causes the particles.

When the nitrogen gas is supplied to return the interior of the chamber 3 to the atmospheric pressure, the exhaust pump 51 is stopped, and the particles retained in the region 91 may be rolled up by the nitrogen gas, and the particles may adhere to the substrates W (the front end substrates WT) of the slots 49.

As shown in fig. 8 (a), when the substrate holding portion 5 holds 50 substrates W arranged in a face-to-face manner, the equipment surface of the substrate W of the slot 50 (SL 50) faces the back plate 9 side. In addition, arrow AR2 indicates the orientation of the device face. That is, the back surface of the substrate W of the slot 50 faces the front end portion 7A side (-Y direction) of the holding member 7. In this case, since the back surface of the substrate W in the slot 50 is blocked, the problem of adhesion of particles to the equipment surface due to the slowing of the airflow in the region 91 does not occur.

As shown in fig. 8 (b), in the case where the substrate holding portion 5 holds 49 substrates W arranged in a face-to-face manner, the equipment surface of the substrates W of the slot 49 (SL 49) faces the front end portion 7A side (-Y direction) of the holding member 7. Therefore, the equipment surface of the substrate W of the slot 49 faces the region 91, and particles are easily attached to the equipment surface.

In addition, as shown in fig. 8 (c), in the case where the substrate holding portion 5 holds 25 substrates W arranged in a face-to-face manner, the equipment surface of the substrates W of the slot 25 (SL 25) faces the front end portion 7A side (-Y direction) of the holding member 7. Therefore, the equipment surface of the substrate W of the slot 25 faces the region 91, and particles are easily attached. However, since the substrates W of the slot 25 are separated from the region 91, the number of particles of the substrates W attached to the slot 25 of fig. 8 (c) is smaller than the number of particles of the substrates W attached to the slot 49 of fig. 8 (b).

In fig. 8 (a) to 8 (c), the "good" indicates that the adhesion of particles to the equipment surface was not confirmed. In addition, "poor" means that adhesion of particles to the equipment surface was confirmed. In addition, since the back plate 9 is present on the substrate W of the slot 1 and the equipment surface is not oriented to the back plate 9 side, it is considered that the problem of adhesion of particles to the equipment surface does not occur.

By providing the shielding plate 71, the device surface of the front substrate WT of the slot 49 is protected from particles mixed in the environment of the region 91 where the front end 7A side of the holding member 7 stays. In addition, the flow of gas between the front substrate WT and the shielding plate 71 can be improved. This prevents the environment from remaining opposite to the front substrate WT as in the region 91. This prevents particles from adhering to the device surface of the substrate W.

After step S08, in steps S09 and S10, pure water is supplied from the discharge pipe 13 to the processing tank 2 to clean the inside of the processing tank 2, and then the pure water in the processing tank 2 is discharged outside of the processing tank 2 and the chamber 3 by the QDR valve 23 and the on-off valve V8. In steps S09 to S11, the supply of nitrogen gas is continued.

Thereafter, a predetermined amount of diluted IPA liquid is supplied from the discharge pipe 13 to the processing tank 2 as the second processing liquid. Thereafter, the lifter 4 impregnates 49 substrates W with the diluted IPA liquid in the processing tank 2 for a predetermined period of time (step S11). This allows additional cleaning of the substrate W to remove particles and the like remaining in step S07.

Thereafter, the exhaust pump 51 is operated to open the opening/closing valve V7, thereby exhausting the chamber 3. The supply of the nitrogen gas from the inert gas nozzle 27 is stopped, and the IPA vapor is supplied into the chamber 3 from the solvent vapor nozzles 31 and 32 (step S12). Thereafter, the lift 4 lifts 49 substrates W from the diluted IPA liquid in the processing tank 2 (step S12). Thereby, the diluted IPA liquid adhering to the substrate W is replaced with IPA. Thereafter, the supply of the IPA vapor from the solvent vapor nozzles 31 and 32 is stopped, and the substrate W is dried (step S12).

After that, the exhaust pump 51 is stopped, and the opening/closing valve V7 is closed. The supply of the IPA vapor from the solvent vapor nozzles 31 and 32 is stopped, and the nitrogen gas is supplied from the inert gas nozzle 27 into the chamber 3 (step S13). Thereby, the inside of the chamber 3 in the depressurized state is returned to the atmospheric pressure.

Here, the particles (dirt) generated in step S12 may accumulate and stay in the region 91 (see fig. 7). When the nitrogen gas is supplied to return the interior of the chamber 3 to the atmospheric pressure, the exhaust pump 51 may be stopped, and the particles retained in the region 91 may adhere to the substrate W (front substrate WT) of the slot 49 (SL 49) due to the nitrogen gas. However, by providing the shielding plate 71, the device surface of the front substrate WT of the slot 49 is protected from particles mixed in the environment of the region 91 where the front end 7A side of the holding member 7 stays.

After step S13, the supply of nitrogen gas from the inert gas nozzle 27 is stopped. After that, the upper cover 25 is opened, and a not-shown transfer robot transfers 49 substrates W to the next destination (step S14).

According to the present embodiment, the shielding plate 71 is provided to protect the substrate W from particles mixed in the atmosphere retained on the front end portion 7A side of the holding member 7. In addition, the flow of gas can be improved between the front substrate WT and the shielding plate 71. This prevents particles from adhering to the substrate W (the front substrate WT).

In the substrate processing apparatus 1, the solvent vapor nozzles 31 and 32 include a tube portion 73 extending in a straight line in the chamber 3 along the horizontal direction (Y direction), and a plurality of ejection ports 75 provided in the tube portion 73 and arranged along the tube axis AX (Y direction). The solvent vapor nozzles 31 and 32 further include a pipe portion 73 provided upstream of the plurality of discharge ports 75, and a liquid discharge port 76 provided in a region 78 corresponding to between the shielding plate 71 and the side wall 3A of the chamber 3. The plurality of ejection ports 75 eject the solvent vapor into the chamber 3. The liquid discharge port 76 discharges the solvent generated by condensation of the solvent vapor to a region between the shielding plate 71 and the side wall 3A of the chamber 3.

The liquid of the solvent generated by condensation on the upstream side of the solvent vapor nozzles 31 and 32 is discharged from the liquid discharge port 76 of the pipe portion 73 provided upstream of the plurality of discharge ports 75. The liquid discharge port 76 is disposed in a region 78 corresponding to the space between the shielding plate 71 and the side wall 3A on the front end portion 7A side of the holding member 7 of the chamber 3. Therefore, the liquid of the solvent discharged from the liquid discharge port 76 can be prevented from adhering to the substrate W (front substrate WT). In addition, the liquid of the solvent can be prevented from being supplied from a predetermined ejection port 75 (for example, ejection port 75A) among the plurality of ejection ports 75 to the substrate W. Therefore, the solvent vapor can be supplied from all of the plurality of discharge ports.

The substrate processing apparatus 1 further includes a water repellent vapor nozzle 33 provided in the chamber 3 and disposed at a position higher than the processing bath 2, and the water repellent vapor nozzle 33 supplies water repellent vapor into the chamber 3. The waterproofing agent vapor nozzle 33 includes a second pipe portion 83 extending in a straight line in the horizontal direction (Y direction) in the chamber 3, and a plurality of second discharge ports 85 provided in the second pipe portion 83 and arranged along the pipe axis AX (Y direction). The waterproofing agent vapor nozzle 33 further includes a second pipe portion 83 provided upstream of the plurality of second discharge ports 85, and a second liquid discharge port 86 disposed in the region 78 corresponding to between the shielding plate 71 and the side wall 3A of the chamber 3. The second discharge ports 85 discharge the water repellent vapor into the chamber 3. The second liquid discharge port 86 discharges the waterproofing agent produced by condensation of the waterproofing agent vapor to the region between the shielding plate 71 and the side wall 3A of the chamber 3.

The liquid of the waterproofing agent produced by condensation on the upstream side of the waterproofing agent vapor nozzle 33 is discharged from the second liquid discharge port 86 of the second pipe portion 83 provided upstream of the plurality of second discharge ports 85. The second liquid discharge port 86 is arranged in the region 78 corresponding to the space between the shielding plate 71 and the side wall 3A on the front end portion 7A side of the holding member 7 of the chamber 3. Therefore, the water repellent liquid discharged from the second liquid discharge port 86 can be prevented from adhering to the substrate W (front substrate WT). In addition, the supply of the liquid of the waterproofing agent from the predetermined second ejection port 85 (for example, the second ejection port 85A) out of the plurality of second ejection ports 85 to the substrate W can be prevented. Therefore, the waterproofing agent vapor can be supplied from all of the plurality of second discharge ports 85.

Example 2

Next, embodiment 2 of the present invention will be described with reference to the drawings. In addition, the description repeated with example 1 is omitted.

Fig. 9 is a vertical cross-sectional view showing a schematic configuration of the left side surfaces of the cleaning process units BT2 and BT4 in example 2. Fig. 10 is a plan view showing a schematic configuration of a substrate processing apparatus 1A according to example 2. Fig. 11 is a side view of the substrate processing mechanism HTR.

The shielding plate 71 of embodiment 1 is attached to the processing tank 2 via an attaching member not shown. In this regard, as shown in fig. 9, the shielding plate of embodiment 2 may be an unpatterned dummy substrate (dummy wafer) 100 held by the holding member 7. The dummy substrate 100 is a dummy substrate for shielding particles. The dummy substrate 100 is formed of silicon. The dummy substrate 100 may be made of ceramic.

In this embodiment, the substrate processing apparatus 1 of embodiment 1 is described as each of the cleaning processing units BT2 and BT 4. Each of the cleaning units BT2 and BT4 does not include the shielding plate 71 shown in fig. 3.

< 5. Structure of substrate processing apparatus >

Referring to fig. 10. The substrate processing apparatus 1A of the present embodiment has a function of automatically setting the dummy substrate 100. The substrate processing apparatus 1A includes a storage block 103, a transfer block 105, and a processing block 107.

<5-1. Storage block >;

the storage block 103 houses at least 1 carrier C. The storage block 103 is provided with at least 1 loading port 109. The storage block 103 includes a carrier transport mechanism (robot) 111 and a plurality of holding frames 113. The plurality of holding racks 113 hold a plurality of carriers C including the dummy substrate carrier CD, respectively. The carrier transport mechanism 111 transports any carrier C stored in the holder 113 to a carrier 119 (described later). The carrier transport mechanism 111 transports carriers C among the loading port 109, the plurality of holding racks 113, and a carrier rack 119 (described later). The carrier transport mechanism 111 includes a holding portion for holding the protruding portion on the upper surface of the carrier C or a robot for supporting the carrier C while being in contact with the bottom surface of the carrier C.

The storage block 103 includes a dummy substrate carrier CD for storing 1 or more dummy substrates 100 in a horizontal posture. The dummy substrate carrier CD is stored in advance in the storage rack 113. The carrier transport mechanism 111 generally transports the dummy substrate carrier CD between the carrier 113 and a carrier 119 described later.

< 5-2. Transfer Block >)

The transfer block 105 is disposed adjacent to the storage block 103. The transfer block 105 includes an opener 115, a substrate processing mechanism (robot) HTR, and a posture changing mechanism 117. The opener 115 includes a carrier 119 on which the carrier C is placed. The carrier 119 sequentially carries a plurality of carriers C one by one. The transfer block 105 may include a plurality of openers 115. The substrate processing mechanism HTR corresponds to the horizontal substrate transfer mechanism of the present invention. The carrier 119 corresponds to the carrier of the present invention.

The carrier C accommodates a plurality of (e.g., 25) substrates W in a horizontal posture at predetermined intervals (e.g., 10mm intervals (full pitch)) in the vertical direction Z. In addition, the substrates W are aligned in the thickness direction of the substrates W. For example, the carrier C can accommodate a maximum of 25 substrates W. As the carrier C, for example, FOUP (Front Opening Unify Pod: front end OpeningUnifyPod) is used. FOUPs are closed containers. The carrier C may be an open container, regardless of the type. The dummy substrate carrier CD is configured in the same manner as the carrier C.

< 5-2-1 substrate processing mechanism >

Reference is made to fig. 10 and 11. The substrate processing mechanism HTR takes out and conveys a plurality of substrates W from the carrier C placed on the carrier 119. That is, the substrate processing mechanism HTR is capable of collectively conveying a plurality of (for example, 25) substrates W in a horizontal posture between the carrier C placed on the carrier 119 and the posture changing mechanism 117. The substrate processing mechanism HTR is capable of conveying 1 sheet of substrates W in a horizontal posture between the carrier C placed on the carrier 119 and the posture changing mechanism 117. Therefore, the substrate processing mechanism HTR can take out and convey 1 dummy substrate 100 from the dummy substrate carrier CD placed on the carrier 119.

The substrate processing mechanism HTR includes a batch robot 125 and a single Zhang Jixie hand 127.

The batch robot 125 includes a plurality (e.g., 25) of robots 125A. In fig. 11, for convenience of illustration, the batch robot 125 includes 3 robots 125A. Each robot 125A holds 1 substrate W. In addition, the single Zhang Jixie hand 127 holds 1 substrate W.

The substrate processing mechanism HTR includes a batch robot support 129, a single Zhang Jixie robot support 131, a forward/backward movement unit 133, and a lift/rotate unit 135. The batch robot support 129 supports the batch robot 125 (a plurality of robots 125A). Thereby, the plurality of manipulators 125A integrally move. The single-robot support 131 supports the single-robot 127.

The advance and retreat portion 133 can independently advance and retreat the batch robot 125 and the single Zhang Jixie hand 127. Specifically, the advance and retreat portion 133 advances and retreats the plurality of robots 125A independently of the single robot 127 via the batch robot support portion 129. The advance and retreat portion 133 can advance and retreat the single Zhang Jixie hand 127 independently of the batch robot 125. The lifting/lowering rotation unit 135 rotates the advance/retreat unit 133 about the vertical axis AX1, thereby rotating the batch robot 125 and the hand Zhang Jixie about the vertical axis AX 1. The lifting/lowering rotation unit 135 lifts the batch robot 125 and the single Zhang Jixie hand 127 by lifting/lowering the advance/retreat unit 133. The advance and retreat portion 133 and the lifting and rotating portion 135 are each provided with an electric motor.

< 5-2-2. Gesture conversion mechanism >)

Referring to fig. 10. The posture changing mechanism 117 changes the postures of the plurality of substrates W and the dummy substrate 100 between the horizontal posture and the vertical posture. For example, the posture changing mechanism 117 changes the plurality of substrates W and the dummy substrate 100 transported by the substrate processing mechanism HTR from the horizontal posture to the vertical posture. The posture changing mechanism 117 changes the plurality of substrates W and the dummy substrate 100, which are conveyed by a conveyance mechanism WTR described later, from a vertical posture to a horizontal posture.

The plurality of substrates W include a first substrate group and a second substrate group. Accordingly, the posture changing mechanism 117 combines 2 or more substrates W1 of the first substrate group and 2 or more substrates W2 of the second substrate group to form a plurality of substrates W (W1, W2).

The posture changing mechanism 117 includes a posture changing section 137 and a pushing mechanism 139. In fig. 10, the substrate processing mechanism HTR, the posture changing section 137, and the pushing mechanism 139 are arranged in this order in the width direction Y. Fig. 12 a to 12 f are diagrams for explaining the posture changing mechanism 117 (the posture changing section 137 and the pushing mechanism 139) of the transfer block 105.

Refer to fig. 12 (a). The posture changing section 137 includes a support base 137A, 1 pair of horizontal holding sections 137B, 1 pair of vertical holding sections 137C, and a rotation driving section 137D.1 pair of horizontal holding portions 137B and 1 pair of vertical holding portions 137C are provided on the support base 137A. The horizontal holding portion 137B and the vertical holding portion 137C receive the plurality of substrates W conveyed by the substrate conveying mechanism HTR. When the substrates W are in the horizontal posture, 1 pair of horizontal holding portions 137B support the substrates W from below while being in contact with the lower surfaces of the substrates W.

When the substrate W is in the vertical posture, 1 pair of vertical holding portions 137C hold the substrate W. Each vertical holding portion 137C includes a plurality of (e.g., 26) holding grooves for holding a plurality of (e.g., 26) substrates W and a plurality of (e.g., 26) passing grooves for passing a plurality of (e.g., 26) substrates. The plurality of holding grooves and the plurality of passing grooves are alternately arranged one by one.

The rotation driving unit 137D supports the support base 137A rotatably about the horizontal axis AX 2. The rotation driving unit 137D rotates the support base 137A about the horizontal axis AX2 to change the posture of the plurality of substrates W held by the holding units 137B and 137C from horizontal to vertical.

Refer to fig. 12 (f). The pushing mechanism 139 includes a push rod 139A, a lifting/lowering rotation portion 139B, a horizontal movement portion 139C, and a rail 139D. The push rod 139A has a plurality (e.g., 52) of holding grooves. The push rod 139A supports the lower portions of the plurality of (for example, 52) substrates W in the vertical posture and the dummy substrate 100. In fig. 12 (a) to 12 (f), for convenience of illustration, the pusher 139A is configured to hold 8 substrates W including the dummy substrate 100. In fig. 18 (a) and 20 (a), the pusher 139A is configured to hold 6 substrates W for convenience of illustration.

The lifting/lowering rotation portion 139B is coupled to the lower surface of the push rod 139A. The lifting/lowering rotation portion 139B expands and contracts to lift the push rod 139A in the up-down direction. The lifting/lowering rotation portion 139B rotates the push rod 139A about the vertical axis AX 3. The horizontal movement portion 139C supports the lifting rotation portion 139B. The horizontal movement portion 139C horizontally moves the push rod 139A and the lifting and rotating portion 139B along the rail 139D. The guide rail 139D is formed to extend in the width direction Y. The rotation driving unit 137D, the lifting/lowering rotation unit 139B, and the horizontal movement unit 139C are each provided with an electric motor.

<5-3. Processing block >;

referring to fig. 10. The processing block 107 is adjacent to the transfer block 105. The processing block 107 is disposed on the opposite side of the storage block 103 from the transfer block 105. The processing block 107 includes 4 batch processing units BT1 to BT4 and a conveyance mechanism WTR.

The 4 batch processing units BT1 to BT4 are arranged in this order along the front-rear direction X. In fig. 10, the batch processing unit BT1 is disposed at a position farthest from the transfer block 105. The 4 batch processing units BT1 to BT4 process the plurality of substrates W and the dummy substrate 100 at once. For example, the 4 batch processing units BT1 to BT4 are composed of 2 chemical processing units BT1, BT3 and 2 cleaning processing units BT2, BT 4. The chemical solution processing unit BT1 and the cleaning processing unit BT2 are set to 1 group, and the chemical solution processing unit BT3 and the cleaning processing unit BT4 are set to another 1 group. The 1-group batch processing unit may include 1 or more chemical liquid processing units and 1 or more cleaning processing units.

The 2 chemical solution treatment units BT1 and BT3 each include a treatment tank 141. The 2 chemical solution processing units BT1 and BT3 respectively perform etching processing using chemical solutions. As the chemical solution, for example, phosphoric acid is used. The 2 processing tanks 141 of the chemical processing units BT1 and BT3 store chemical supplied from chemical discharge pipes, not shown. The chemical liquid discharge pipe is provided on the inner wall of each processing tank 141.

The 2 chemical processing units BT1 and BT3 include 2 lifters LF1 and LF3, respectively. The 2 lifters LF1 and LF3 hold the plurality of substrates W and the dummy substrate 100 in a vertical posture arranged at predetermined intervals (for example, 5mm (half pitch)). The lifters LF1 and LF3 lift the plurality of substrates W and the dummy substrate 100 between a processing position inside the processing bath 141 and a transfer position above the processing bath 141.

As described above, the cleaning units BT2 and BT4 have the structure of example 1 shown in fig. 1 and 3, respectively, in addition to the shielding plate 71. The cleaning units BT2 and BT4 each include a processing bath 2 for storing a processing liquid, a chamber 3 surrounding the processing bath 2, and an elevator 4. The lifter 4 includes a substrate holding portion 5 and a lifter mechanism 6 for lifting and lowering the substrate holding portion 5. The substrate holding portion 5 includes 3 holding members 7 and a back plate 9.

Refer to fig. 13 (a) and 13 (b). Each holding member 7 has a plurality of (e.g., 51) groove portions formed in an array in the Y direction at a predetermined pitch (e.g., 5mm (half pitch)). The 51 slots are referred to as slots 1-51 (SL 1-SL 51), respectively. The groove closest to the back plate 9 is slot 1 and the groove furthest from the back plate 9 is slot 51.

In other words, each holding member 7 has a plurality of (e.g., 50) slots SL1 to SL50 for holding a plurality of (e.g., 50) substrates W and a slot SL51 for holding the dummy substrate 100. The groove SL51 (dummy substrate holding groove) is disposed on the distal end portion 7A side of each holding member 7 with respect to the grooves SL1 to SL 50. That is, the slot SL51 is disposed on the opposite side of the slot SL49 with the slot SL50 interposed therebetween. The grooves SL1 to SL50 and the groove SL51 are arranged in a row at a predetermined interval (half pitch). Each of the grooves SL1 to SL50 corresponds to a holding groove of the present invention.

In the present embodiment, in order to process the plurality of substrates W in the respective cleaning processing units BT2, BT4, the dummy substrate 100 is applied to the plurality of substrates W at a time. Therefore, the substrate W other than the dummy substrate 100 for masking is not disposed in the slot SL51. As shown in fig. 9, the liquid discharge port 76 and the second liquid discharge port 86 are disposed closer to the side wall 3A of the chamber 3 than the dummy substrate 100.

The transport mechanism WTR transports the plurality of substrates W in the vertical posture and the dummy substrate 100 at once. The transport mechanism WTR transports the plurality of substrates W in the vertical posture and the dummy substrate 100 between the posture changing mechanism 117 and the 4 batch processing units BT1 to BT 4. The transport mechanism WTR includes 1 pair of chucks 143, 145, a guide 147, and a lifting unit (not shown). The chucks 143 and 145 each have 51 holding grooves for holding 50 substrates W and 1 dummy substrate 100, for example. The transfer mechanism WTR opens or closes 2 chucks 143, 145. The conveyor WTR moves the pair of chucks 143, 145 along the guide rail 147. The lifting section lifts and lowers the pair of chucks 143 and 145 1. The conveyor WTR is driven by an electric motor.

The substrate processing apparatus 1A includes a control unit 61 and a storage unit (not shown). The control section 61 controls each configuration of the substrate processing apparatus 1A. The storage unit stores a computer program necessary for controlling each configuration of the substrate processing apparatus 1A.

< 6 > operation of substrate processing apparatus

The operation of the substrate processing apparatus 1A will be described with reference to the flowchart of fig. 14. Referring to fig. 10. An external transfer robot, not shown, transfers the 2 carriers C to the load port 109 in sequence.

The substrate processing apparatus 1A combines 2 or more substrates W1 of the first substrate group of the first carrier C with 2 or more substrates W2 of the second substrate group of the second carrier C to form a processed substrate group which is substrates W arranged in a face-to-face manner and at half pitch. The substrate processing apparatus 1A sequentially conveys the processed substrate groups to, for example, the chemical solution processing unit BT1 and the cleaning processing unit BT2, and processes the processed substrate groups at once. Details thereof are described.

Step S21 is to convey the first substrate group to the posture changing mechanism

The carrier transport mechanism 111 of the magazine 103 transports the first carrier C from the load port 109 to the carrier rack 119. Here, the first carrier C houses a first substrate group composed of 25 substrates W1. Further, 2 carriers C may be transferred from the loading port 109 to the loading frame 119 via the rack 113.

Refer to fig. 12 (a). In fig. 12 (a) to 12 (f), for convenience of illustration, the first substrate group is composed of 3 substrates W1, and the second substrate group is composed of 3 substrates W2. In addition, when the substrate W1 and the substrate W2 are not particularly distinguished, the substrate W1 and the substrate W2 are described as "substrates W".

The substrate processing mechanism HTR collectively conveys 25 substrates W1 of the first substrate group from the first carrier C placed on the carrier 119 to the posture changing section 137 by using the batch robot 125. Here the number of the elements to be processed is, the substrate processing mechanism HTR has 25 grooves SL1, SL3 with odd numbers as shown in FIG. 13 (a) and FIG. 13 (b) corresponding to SL5, & ltSUP & gt, SL47 and SL49, 25 substrates W1 are transported to the posture changing section 137. The posture changing section 137 receives 25 substrates W1 from the substrate processing mechanism HTR using 2 pairs of holding sections 137B, 137C. At this time, the 25 substrates W1 were in a horizontal posture with the equipment facing upward. The 25 substrates W1 are arranged at predetermined intervals (full pitch). The full pitch is, for example, 10mm spacing. Full pitch is also known as normal pitch. In addition, the half pitch is a half pitch interval (e.g., 5 mm) of the full pitch.

Step S22 insertion of dummy substrate

The substrate processing mechanism HTR takes out 25 substrates W1 from the first carrier C, and then the carrier transport mechanism 111 transports the empty first carrier C from the carrier 119 to the storage rack 113, and then transports the dummy substrate carrier CD from the storage rack 113 to the carrier 119 (see fig. 10).

Thereafter, as shown in fig. 12 (a), the substrate processing mechanism HTR uses the single Zhang Jixie hand 127 to convey the dummy substrate 100 from the dummy substrate carrier CD to the posture changing section 137. Here, the substrate processing mechanism HTR conveys the dummy substrate 100 to the posture changing section 137 so as to correspond to the slot SL 51. As shown in fig. 12 (a), the posture changing section 137 receives the dummy substrate 100 in the horizontal posture by using the holding groove above the 25 substrates W1 in the horizontal posture. In fig. 12 a, 25 substrates W1 and dummy substrates 100 in a horizontal posture are arranged at full pitch (for example, 10 mm) in the vertical direction Z.

The substrate processing mechanism HTR extracts 1 dummy substrate 100 from the dummy substrate carriers CD, and then the carrier transport mechanism 111 transports the dummy substrate carriers CD from the loading frame 119 to the storage frame 113, and then transports the second carrier C from the loading port 109 to the loading frame 119 (see fig. 10).

Step S23, the first substrate group is changed to the vertical posture

Refer to fig. 12 (b). After the dummy substrate 100 is conveyed to the posture changing section 137, the rotation driving section 137D rotates the 2 pairs of holding sections 137B and 137C provided on the support base 137A by 90 degrees around the horizontal axis AX 2. Thereby, the posture changing section 137 changes the 25 substrates W1 and the dummy substrate 100 from the horizontal posture to the vertical posture.

Refer to fig. 12 (c). Then, the lifting/lowering rotation portion 139B of the pushing mechanism 139 lifts the push rod 139A to a position higher than the holding portions 137B, 137C of the posture changing portion 137. Thus, the pusher 139A receives 25 substrates W1 and the dummy substrate 100 from the holding portions 137B and 137C. The 25 substrates W1 held by the pusher 139A are directed to the left direction Y. In fig. 12 (a) to 12 (f), an arrow AR2 denoted by the substrate W (W1, W2) indicates the orientation of the device surface of the substrate W.

Refer to fig. 12 (d). The pushing mechanism 139 rotates the vertically oriented 25 substrates W1 and the dummy substrate 100 by 180 degrees about the vertical axis AX 3. Thereby, 25 substrates W1 are reversed to face the right direction Y. Further, the inverted 25 substrates W1 are moved from the position before rotation to the left Y by a half pitch amount (for example, 5 mm). The posture changing section 137 rotates the holding sections 137B and 137C by-90 degrees around the horizontal axis AX2, and is configured to be able to receive the next substrate W2. The posture changing section 137 and the pushing mechanism 139 are operated so as not to interfere with each other.

Step S24 is to convey the first substrate to the second substrate group of the posture changing mechanism

The second carrier C is mounted on the carrier 119. The second carrier C houses a second substrate group composed of 25 substrates W2. The substrate processing mechanism HTR collectively conveys 25 substrates W2 of the second substrate group from the second carrier C placed on the carrier 119 to the posture changing section 137 by using the batch robot 125. Here the number of the elements to be processed is, the substrate processing mechanism HTR has an even number of 25 slots SL2, SL4 as shown in FIG. 13 (a) and FIG. 13 (b) the posture changing section 137 is configured to convey 25 substrates W2 in a corresponding manner to SL6, & ltfig. SL48 & gt and SL 50. As shown in fig. 12 (d), the posture changing section 137 receives 25 substrates W2 in the horizontal posture by the 2 holding sections 137B and 137C. At this time, the equipment surface of each of the 25 substrates W2 faces upward.

Step S25, changing the posture of the second substrate group to the vertical posture

Refer to fig. 12 (e). The pushing mechanism 139 lowers the pusher 139A holding the 25 substrates W1 and the dummy substrate 100 to the retracted position. Thereafter, the posture changing section 137 changes the posture of the 25 substrates W2 from horizontal to vertical. The posture-changed 25 substrates W2 are oriented to the left direction Y. Refer to fig. 12 (f). Thereafter, the pushing mechanism 139 lifts the push rod 139A holding the 25 substrates W2 of the second substrate group. Thereby, the pushing mechanism 139 further receives 25 substrates W2 from the posture changing section 137.

Thus, the first substrate group and the second substrate group are combined with the dummy substrate 100 to form a process substrate group (50 substrates W1, W2 and the dummy substrate 100). The processing substrate groups are arranged at half pitch. Of the 50 substrates W1 and W2, the 25 substrates W1 of the first substrate group and the 25 substrates W2 of the second substrate group are alternately arranged one by one. The 25 substrates W1 face in the opposite direction to the 25 substrates W2. Accordingly, 50 substrates W1 and W2 are arranged face to face. That is, 2 device surfaces (or 2 back surfaces) of the adjacent 2 substrates W1, W2 face each other.

Then, the pushing mechanism 139 conveys the set of processing substrates along the guide rail 139D to the substrate delivery position PP defined in the transfer block 105. The substrate delivery position PP is set below 1 pair of chucks 143, 145 of the conveying mechanism WTR.

Step S26 treatment of the medicinal liquid

The transport mechanism WTR transports the vertical processing substrate group (50 substrates W1, W2 and 1 dummy substrate 100) from the pushing mechanism 139 at the substrate delivery position PP. That is, the transport mechanism WTR receives the processing substrate group in the vertical posture at the substrate transfer position PP, and transports the processing substrate group to one of the 2 lifters LF1, LF3 of the 2 chemical processing units BT1, BT 3. For example, the lifter LF1 receives the processing substrate group conveyed by the conveying mechanism WTR at a position above the processing bath 141 of the chemical processing section BT 1. The lifter LF1 immerses the processing substrate group in phosphoric acid (processing liquid) stored in the processing bath 141. Thus, 50 substrates W were subjected to etching treatment. In this process, phosphoric acid corresponding to 50 substrates W was replenished without counting the dummy substrates 100.

After the etching process, the lifter LF1 lifts the process substrate group from the phosphoric acid in the process tank 141. When the processing substrate group is transferred to the lifter LF3, the chemical solution processing unit BT3 performs the same processing as the chemical solution processing unit BT1 on the processing substrate group.

Step S27, cleaning and drying

The transport mechanism WTR receives a vertical process substrate group (50 substrates W1, W2 and 1 dummy substrate 100) from the lifter LF1, for example, and transports the process substrate group to the substrate holding unit 5 of the lifter 4 of the cleaning process unit BT2 shown in fig. 1, 9, 13 (a) and 13 (b). When receiving the processing substrate group, the lifting mechanism 6 (see fig. 1) positions the substrate holding unit 5 at the drying position H1. The substrate holding unit 5 holds 50 substrates W1 and W2 in a vertical posture, and holds the dummy substrate 100 so that the front substrate WT located farthest from the back plate 9 among the 50 substrates W1 and W2 is located between the side wall 3A of the chamber 3 facing the front end 7A side of each holding member 7. Specifically, the substrate holding portion 5 receives and holds 50 substrates W1 and W2 and the dummy substrate 100 through 50 slots SL1 to SL50 and 1 slot SL51 of each holding member 7. The substrate holding unit 5 moves between a processing position H2 in the processing bath 2 and a drying position H1 above the processing bath 2 while holding the processing substrate group.

The cleaning processing unit BT2 performs the cleaning processing and the drying processing in steps S01 to S14 shown in fig. 6 on the processing substrate group. At this time, the dummy substrate 100 for shielding is provided to shield the environment in which the tip end portion 7A of each holding member 7 is retained. Therefore, the substrate W is protected from particles mixed in this environment.

When the group of processed substrates is processed by the chemical solution processing unit BT3, the conveyance mechanism WTR conveys the group of processed substrates from the chemical solution processing unit BT3 to the cleaning processing unit BT 4. The cleaning processing unit BT4 performs the same processing as the cleaning processing unit BT2 on the processing substrate group.

Step S28 posture conversion to horizontal posture

Thereafter, the conveyor WTR conveys the vertical-posture processed substrate group processed by the processing tank 2 or the like from one of the 2 substrate holders 5 to the posture changing mechanism 117. That is, the transport mechanism WTR receives the processing substrate group from one of the 2 substrate holders 5 of the 2 cleaning units BT2 and BT4, and transports the processing substrate group to the posture changing mechanism 117. The push rod 139A is moved to the substrate delivery position PP by the horizontal movement portion 139C. The pusher 139A holds 50 substrates W (W1, W2) of the processing substrate group and the dummy substrate 100, which are conveyed by the conveying mechanism WTR, in a vertical posture.

The posture changing mechanism 117 divides the 50 substrates W1 and W2 conveyed by the conveying mechanism WTR into 25 substrates W1 of the first substrate group and 25 substrates W2 of the second substrate group. The posture conversion mechanism 117 converts the first substrate group, the second substrate group, and the dummy substrate 100 from the vertical posture to the vertical posture. Specifically, description is made.

The posture changing mechanism 117 operates in the order from fig. 12 (f) to fig. 12 (a), for example. That is, the posture changing mechanism 117 extracts 25 substrates W2 of the second substrate group from the processing substrate group and changes them from the horizontal posture to the vertical posture. Thereafter, the posture changing mechanism 117 changes the vertical posture of the 25 substrates W1 of the first substrate group and the dummy substrate 100 from the horizontal posture. In order to return the empty carrier C to the first substrate group earlier than the second substrate group, the posture changing mechanism 117 may extract 25 substrates W1 of the first substrate group and the dummy substrate 100 from the processing substrate group.

Step S29 of transporting the substrate to the carrier

The carrier transport mechanism 111 selectively transports 1 of the first carrier C, the second carrier C, and the dummy substrate carrier CD to the carrier 119. The substrate processing mechanism HTR uses the batch robot 125 to transfer 25 substrates W2 of the second substrate group from the posture changing section 137 to the second carrier C of the carrier 119. The substrate processing mechanism HTR uses the single Zhang Jixie hand 127 to convey the dummy substrate 100 from the posture changing section 137 to the dummy substrate carrier CD of the carrier 119. The substrate processing mechanism HTR further uses the batch robot 125 to transfer 25 substrates W1 of the first substrate group from the posture changing section 137 to the first carrier C of the carrier 119.

The carrier transport mechanism 111 transports the dummy substrate carrier CD storing the dummy substrate 100 from the carrier 119 to the storage rack 113. The carrier transport mechanism 111 transports the first carrier C containing the processed substrate W1 and the second carrier C containing the processed substrate W2 from the carrier 119 to the loading port 109. The external transfer robot transfers the 2 carriers C, which are transferred to the loading port 109, respectively, to the next destination in sequence.

According to the present embodiment, by providing the dummy substrate 100 as a shielding plate, the substrate W is protected from particles mixed in the environment where the front end portion 7A side of the holding member 7 is retained. In addition, the flow of gas can be improved between the front substrate WT and the dummy substrate 100. This prevents particles from adhering to the substrate W (the front substrate WT).

The substrate holding unit 5 holds a plurality of substrates W in a vertical posture, and holds the dummy substrate 100 so as to be positioned between the front substrate WT and the sidewall 3A of the chamber 3 among the plurality of substrates W. Thus, particles can be prevented from adhering to the front substrate WT. The substrate processing apparatus 1A further includes a dummy substrate carrier CD that accommodates the dummy substrate 100 for shielding. The dummy substrate 100 is applied to each of the plurality of substrates W collectively processed in the processing bath 2. After the processing in the processing bath 2, the dummy substrate 100 is returned to the dummy substrate carrier CD separately from the plurality of substrates W. Therefore, particles can be prevented from adhering to the front substrate WT without providing a shielding plate 71 in the chamber 3 surrounding the processing bath 2.

In fig. 12 (f), a substrate W2 of the second substrate group indicated by a symbol EE1 is a front substrate WT. When the push rod 139A is rotated 180 degrees around the vertical axis AX3 from this state, the substrate W1 of the first substrate group indicated by the symbol EE2 becomes the front substrate WT. Therefore, the front substrate WT is changed by the forming method of 50 substrates W. In this case, the dummy substrate 100 may be conveyed to the posture changing section 137 in fig. 12 (d) instead of being conveyed to the posture changing section 137 in fig. 12 (a). Then, the posture changing section 137 changes the second substrate group and the dummy substrate 100 from the horizontal posture to the vertical posture.

Example 3

Next, embodiment 3 of the present invention will be described with reference to the drawings. In addition, the description repeated with examples 1 and 2 is omitted. Fig. 15 is a vertical cross-sectional view showing a schematic configuration of the left side surfaces of the cleaning process units BT2 and BT4 of example 3.

In example 2, a dummy substrate 100 was added to 1 group of a plurality of substrates W (W1, W2) subjected to batch processing at a time. In this regard, in example 3, when the substrate detection sensor portion 153 detects that the substrate W corresponding to the slot SL50 (front end holding slot) is not present in the carrier C, the dummy substrate 100 is added to 1 group of the plurality of substrates W subjected to batch processing. As shown in fig. 15, the dummy substrate 100 is held by the slot SL 50.

Fig. 16 (a) is a side view showing the structure of the opener 115. Fig. 16 (b) is a plan view showing a detection state of the substrate detection sensor. The opener 115 includes a carrier 119 on which the carrier C is placed, a shutter 151 for loading and unloading the door DR of the carrier C, and a substrate detection sensor 153. The carrier 119 is configured in such a way as to protrude into the region of the storage block 103.

The substrate detection sensor 153 detects the presence or absence of the substrate W stored in the carrier C while moving in the vertical direction with respect to the carrier C mounted on the carrier 119. The substrate detection sensor portion 153 includes a sensor body 153A, an arm 153B, a sensor lifting portion 153C, and a sensor advancing/retreating portion 153D.

The sensor body 153A includes, for example, a transmission type sensor (optical sensor) having a light projector and a light receiver. The control unit 61 detects the presence of the substrate W when the light from the light projector is blocked by the substrate W and the light receiver does not detect the light. When the light receiver detects the light from the light projector, the control unit 61 detects that there is no substrate W.

The arm 153B supports the sensor body 153A. The sensor lifting/lowering portion 153C lifts/lowers the sensor body 153A and the arm 153B. That is, the sensor lifting/lowering portion 153C moves the sensor body 153A and the like in the up-down direction Z. The sensor advancing and retreating portion 153D advances and retreats the sensor body 153A and the arm 153B in the front-rear direction X. The sensor lifting portion 153C and the sensor advancing/retreating portion 153D are each provided with an electric motor. The sensor lifting/lowering portion 153C includes a height sensor (for example, a linear encoder or a rotary encoder) for detecting the height position of the sensor main body 153A (the detected substrate W).

As shown in fig. 2 (a) and 2 (b), each holding member 7 of the substrate holding portion 5 of the present embodiment includes, for example, 50 grooves SL1 to SL50. The 2 chucks 143, 145 of the conveying mechanism WTR of the present embodiment each include, for example, 50 holding grooves. Each vertical holding portion 137C includes, for example, 25 holding grooves and 25 passing grooves. The push rod 139A has 50 holding grooves.

< 7. Operation of substrate processing apparatus >

The operation of the substrate processing apparatus 1A will be described with reference to the flowchart of fig. 17. Fig. 18 (a) to 18 (f) are side views for explaining the posture changing mechanism of example 3.

The substrate processing apparatus 1A combines the substrates W1 of the first substrate group of the first carrier C and the substrates W2 of the second substrate group of the second carrier C to form a processed substrate group which is substrates W arranged in a face-to-face manner and at half pitch. Details thereof are described.

Step S41 detection of the presence or absence of the substrate in the first Carrier

The carrier transport mechanism 111 of the magazine 103 transports the first carrier C from the load port 109 to the carrier rack 119. Here, the first carrier C accommodates 25 substrates W1.

The shutter 151 of the opener 115 removes the door DR of the first carrier C. Thereafter, as shown in fig. 16 b, the substrate detection sensor portion 153 (the sensor lifting portion 153C and the sensor advancing/retreating portion 153D) brings the sensor main body 153A into the carrier C. Thereafter, the sensor lifting/lowering portion 153C lifts or lowers the sensor body 153A to detect the presence or absence of the substrate W1 in the first carrier C.

The substrate detection sensor 153 can detect that the substrate W1 (corresponding substrate) corresponding to the slot SL50 is not in the first carrier C (the first substrate is in a non-state). In the storage unit of the substrate processing apparatus 1A, a correspondence relationship between substrates W (processing substrate group), substrates W1 of the first carrier C (first substrate group), and substrates W2 of the first carrier C (second substrate group) arranged in a grounded manner and at half pitch is stored based on a forming method of the processing substrate group. Therefore, the substrate processing apparatus 1A can determine which position of the substrate group the substrate W1 is not processed when the predetermined substrate W1 is not present in the first carrier C.

In the method for forming the processing substrate group shown in fig. 18 (a) to 18 (f), the substrate W1 of the first substrate group is composed of odd-numbered grooves SL1 of each holding member 7 SL3, SL5, & gtSL 47, SL49 remain. The substrates W2 of the second substrate group are held by even-numbered slots SL2, SL4, SL6, & gtsl 48, SL50 of the holding members 7.

Step S42 is to convey the first substrate group to the posture changing mechanism

As shown in fig. 18 (a), the substrate processing mechanism HTR uses the batch robot 125 to collectively transfer 25 substrates W1 from the first carrier C placed on the carrier 119 to the posture changing section 137 of the posture changing mechanism 117. Here, the substrate detection sensor 153 does not detect that the substrate W1 (corresponding substrate W1) corresponding to the slot SL50 is not on the first carrier C. Therefore, the dummy substrate 100 is not inserted.

Step S43, the first substrate group is changed to the vertical posture

Thereafter, the posture changing section 137 changes the posture of the 25 substrates W1 from the horizontal posture to the vertical posture. Refer to fig. 18 (b). Then, the lifting/lowering rotation portion 139B of the pushing mechanism 139 lifts the push rod 139A to receive the 25 substrates W1 in the vertical posture from the posture changing portion 137. Refer to fig. 18 (c). Thereafter, the lifting/lowering rotating unit 139B rotates 25 substrates W1 180 degrees around the vertical axis AX 3.

Step S44 detection of the presence or absence of the substrate in the second Carrier

After 25 substrates W1 are conveyed from the first carrier C, the shutter 151 of the opener 115 mounts the door DR with respect to the first carrier C. Thereafter, the carrier transporting mechanism 111 transports the empty first carriers C to the storage shelves 113. Thereafter, the carrier transport mechanism 111 transports the second carrier C from the loading port 109 to the loading frame 119. Here, the second carrier C can accommodate a maximum of 25 substrates W2. However, 24 substrates W2 of the second substrate group are accommodated in the second carrier C.

After that, the shutter 151 of the opener 115 removes the door DR of the second carrier C. Then, the substrate detection sensor 153 detects the presence or absence of the substrate W2 in the second carrier C. Then, the substrate detection sensor 153 detects that the substrate W2 (corresponding substrate W2) corresponding to the slot SL50 is not in the second carrier C (first substrate is in a non-state).

Step S45, conveying the second substrate group to the posture changing mechanism

As shown in fig. 18 (C), the substrate processing mechanism HTR uses the batch robot 125 to collectively transfer 24 substrates W2 from the second carrier C placed on the carrier 119 to the posture changing section 137 of the posture changing mechanism 117 instead of the first carrier C.

Step S46 insertion of dummy substrate

When the substrate detection sensor 153 detects that the corresponding substrate W2 corresponding to the slot SL50 is not on the second carrier C, the substrate processing apparatus 1A operates as follows. That is, after 24 substrates W2 are conveyed from the second carrier C, the shutter 151 of the opener 115 mounts the door DR with respect to the second carrier C. Thereafter, the carrier transporting mechanism 111 transports the empty second carriers C to the storage shelves 113. Thereafter, the carrier transport mechanism 111 transports the dummy substrate carriers CD storing 1 or more dummy substrates 100 from the holding rack 113 to the carrier 119.

Thereafter, the shutter 151 of the opener 115 removes the gate DR of the dummy substrate carrier CD. Then, the substrate processing mechanism HTR uses the single Zhang Jixie hand 127 to convey the dummy substrate 100 at a portion of the row of 24 substrates W2 conveyed to the posture changing section 137, where the substrates W2 are not aligned. Specifically, description is made. The substrate processing mechanism HTR takes out the dummy substrate 100 from the dummy substrate carrier CD placed on the carrier 119 using the single Zhang Jixie hand 127 instead of the second carrier C. Thereafter, as shown in fig. 18 (d), the substrate processing mechanism HTR conveys the dummy substrate 100 to a holding groove (portion) of the plurality of pairs of holding grooves of the vertical holding portion 137C of the posture changing portion 137, in which the corresponding substrate W2 (the substrate W2 corresponding to the groove SL50 of each holding member 7) is not held.

Step S47, posture conversion of the second substrate group into the vertical posture

Refer to fig. 18 (e). The push rod 139A holding 25 substrates W1 (first substrate group) in a vertical posture is lowered below the holding portions 137B, 137C of the posture changing portion 137 by the lifting and rotating portion 139B of the pushing mechanism 139. After 24 substrates W2 and the dummy substrate 100 are conveyed to the posture changing section 137, the posture changing section 137 changes the 24 substrates W2 and the dummy substrate 100 from the horizontal posture to the vertical posture.

Refer to fig. 18 (f). Thereafter, the lifting/lowering rotation unit 139B further receives the 24 substrates W2 (second substrate group) in the vertical posture and the dummy substrate 100 from the posture conversion unit 137 by lifting the push rod 139A. Thus, the first substrate group and the second substrate group were combined with the dummy substrate 100 to form a half-pitch processing substrate group (49 substrates W1, W2, and 1 dummy substrate 100) arranged in a face-to-face manner. The horizontal moving unit 139C of the pushing mechanism 139 conveys the processed substrate group to the substrate delivery position PP defined in the transfer block 105.

Steps S48 and S49 perform the same processing as steps S26 and S27 of embodiment 2. In the etching process of step S48, the dummy substrate 100 supplements phosphoric acid corresponding to 49 substrates W without counting. In the cleaning process and the drying process in step S49, each holding member 7 of the substrate holding unit 5 holds 49 substrates W and the dummy substrate 100 by using 50 slots SL1 to SL 50. At this time, as shown in fig. 15, the front substrate WT is held by a groove (slot) SL 49. The dummy substrate 100 is held by the slot SL 50. By simulating the substrate 100, particles can be prevented from adhering to the substrate W (front substrate WT).

[ step S50] posture conversion to horizontal posture

Then, the transport mechanism WTR receives the processed substrate group from one of the 2 substrate holders 5 of the 2 cleaning units BT2 and BT4, and transports the processed substrate group to the posture changing mechanism 117. The push rod 139A is moved to the substrate delivery position PP by the horizontal movement portion 139C. The pusher 139A holds 49 substrates W (W1, W2) of the processing substrate group and the dummy substrate 100, which are conveyed by the conveying mechanism WTR, in a vertical posture.

The posture changing mechanism 117 operates in the order from fig. 18 (f) to fig. 18 (a), for example. That is, the posture changing mechanism 117 extracts 24 substrates W2 and 1 dummy substrate 100 of the second substrate group from the processing substrate group and changes them from the horizontal posture to the vertical posture. Thereafter, the posture changing mechanism 117 changes the posture of the 25 substrates W1 of the first substrate group from the vertical posture to the horizontal posture. In order to return the empty carrier C to the first substrate group earlier than the second substrate group, the posture changing mechanism 117 may extract 25 substrates W1 of the first substrate group from the processing substrate group.

Step S51 of transporting the substrate to the carrier

The carrier transport mechanism 111 selectively transports 1 of the first carrier C, the second carrier C, and the dummy substrate carrier CD to the carrier 119. The substrate processing mechanism HTR uses the single Zhang Jixie hand 127 to transfer the dummy substrate 100 from the posture changing section 137 to the dummy substrate carrier CD of the carrier 119. The substrate processing mechanism HTR uses the batch robot 125 to transfer 24 substrates W2 of the second substrate group from the posture changing section 137 to the second carrier C of the carrier 119. The substrate processing mechanism HTR further uses the batch robot 125 to transfer 25 substrates W1 of the first substrate group from the posture changing section 137 to the first carrier C of the carrier 119.

The carrier transport mechanism 111 transports the dummy substrate carrier CD storing the dummy substrate 100 to the storage rack 113. The carrier transport mechanism 111 transports the first carrier C containing the processed substrate W1 and the second carrier C containing the processed substrate W2 to the loading port 109, respectively. The external conveying mechanism sequentially conveys the 2 carriers C respectively conveyed to the loading port 109 to the next destination.

According to the present embodiment, the 50 grooves SL1 to SL50 of each holding member 7 of the substrate holding portion 5 have the groove SL50 (tip holding groove) located at the extreme end portion on the tip end portion 7A side of each holding member 7. When the substrate detection sensor 153 detects that the corresponding substrate W2 corresponding to the slot SL50 is not on the second carrier C, the substrate processing mechanism HTR conveys the dummy substrate 100 to the portion of the row of the second substrate group conveyed to the posture changing mechanism 117 where the corresponding substrate W is not present. Thus, the dummy substrate 100 can be automatically disposed between the front substrate WT and the side wall 3A of the chamber 3 facing the front end 7A of each holding member 7. The substrate processing apparatus 1A further includes a dummy substrate carrier CD that accommodates the dummy substrate 100 for shielding. The dummy substrate 100 is selectively applied to a plurality of substrates W collectively processed in the processing bath 2. After the processing in the processing bath 2, the dummy substrate 100 is returned to the dummy substrate carrier CD separately from the 49 substrates W. Therefore, particles can be prevented from adhering to the front substrate WT without providing a shielding plate 71 in the chamber 3 surrounding the processing bath 2.

In the present embodiment, when the substrate detection sensor 153 does not detect that the substrate W2 corresponding to the slot SL50 is not on the second carrier C, for example, the dummy substrate 100 is not inserted into the 50 substrates W1 and W2 of the 1 group. This is because, as shown in fig. 2 (a), the equipment surface of the groove SL49, for example, facing the front end portion 7A side of the holding member 7 is protected by the substrate W1 held by the groove SL 50. In addition, since the device surface of the substrate W1 held by the groove SL50 faces the substrate W2 held by the groove SL49, particles can be prevented from adhering to the device surface of the substrate W1 held by the groove SL 50. In this case, the particles adhere to the back surface of the substrate W1 held by the groove SL50, but in the present embodiment, the adhesion of the particles is allowed.

In the method of manufacturing the processing substrate group shown in fig. 18 (a) to 18 (f), 1 substrate W2 of the second substrate group stored in the second carrier C corresponds to the corresponding substrate W2 corresponding to the slot SL 50. In this regard, for example, in the state of fig. 18 (f), when the substrates W (W1, W2) in the vertical posture are rotated 180 degrees around the vertical axis AX3, the substrate W1 of the first substrate group corresponds to the corresponding substrate W1 corresponding to the slot SL 50.

Example 4

Next, embodiment 4 of the present invention will be described with reference to the drawings. In addition, the description of the embodiments 1 to 3 will be omitted.

Fig. 19 is a left side view showing the substrate holding portion 5 of the lifter 4. Fig. 20 (a) to 20 (f) are side views for explaining the operation of the posture changing mechanism 117 of embodiment 4 including the insertion of the dummy substrate 100.

In example 3, when the substrate detection sensor 153 detects that the corresponding substrate W (W2) corresponding to the slot SL50 is not present on the second carrier C, the substrate processing mechanism HTR conveys 1 dummy substrate 100 to the portion of the column of the second substrate group conveyed to the posture changing section 137, where the corresponding substrate W2 (corresponding to the slot SL 50) is not present. The same applies to the case where there is no substrate W corresponding to the grooves SL48, SL 49. In this regard, in example 3, as shown in fig. 19, when detecting that not only the slot SL50 but also, for example, the substrate W (corresponding substrate W) corresponding to 2 slots SL48 to SL49 is not present in the substrate detection sensor portion 153, the substrate processing mechanism HTR conveys 1 dummy substrate 100.

Refer to fig. 19. For example, the substrate holding unit 5 of the lifter 4 holds 47 substrates W with 47 slots SL1 to SL 47. That is, the 3 grooves SL48 to SL50 of the substrate holding portion 5 do not hold the substrate W. In this case, the substrate processing apparatus 1A operates to dispose the dummy substrate 100 in any one of the 2 slots SL48 and SL 50.

The substrate detection sensor 153 shown in fig. 16 (a) can detect that the corresponding substrate corresponding to the slot SL50 is not in the carrier C (first substrate-free state). Further, the substrate detection sensor 153 can detect that the second counter substrate W corresponding to 1 or more slots between the slot (front end holding slot) holding the front end substrate WT among the 50 slots SL1 to SL50 is not located on at least one of the first carrier C and the second carrier (second non-substrate state). For example, in fig. 19, the substrate detection sensor 153 detects that there is no corresponding substrate W corresponding to the slot SL50 and that there is no second corresponding substrate W corresponding to 2 slots SL48, SL49 between the slot SL47 and the slot SL50 holding the front substrate WT. The substrate processing mechanism HTR uses the single Zhang Jixie hand 127 to convey 1 dummy substrate 100 at a portion corresponding to any one of the grooves SL48, SL50 of the columns of the plurality of substrates W2 of the second substrate group.

Next, the operation of the substrate processing apparatus 1A of the present embodiment will be described with reference to the flowchart of fig. 17.

The carrier conveying mechanism 111 conveys the first carrier C to the carrier rack 119. The substrate detection sensor 153 detects the presence or absence of the substrate W1 stored in the first carrier C while moving in the vertical direction with respect to the first carrier C mounted on the carrier 119. Thus, the substrate detection sensor 153 detects that the corresponding substrate W1 corresponding to the slot SL49 of each holding member 7 is not present (step S41).

Thereafter, as shown in fig. 20 a, the substrate processing mechanism HTR uses the batch robot 125 to transfer 24 substrates W1 of the first substrate group from the first carrier C placed on the carrier 119 to the posture changing section 137 (step S42). Thereafter, the posture changing section 137 changes the conveyed 24 substrates W1 from the horizontal posture to the vertical posture. As shown in fig. 20 (b), the pushing mechanism 139 receives 24 substrates W1 converted into the vertical posture by the push rod 139A. As shown in fig. 20 c, the pushing mechanism 139 rotates 24 substrates W1 held by the pusher 139A in the vertical posture about the vertical axis AX3 (step S43).

Thereafter, the carrier conveying mechanism 111 conveys the second carrier C to the carrier rack 119 instead of the first carrier C. The substrate detection sensor 153 detects the presence or absence of the substrate W2 stored in the second carrier C while moving in the vertical direction with respect to the second carrier C mounted on the carrier 119. Thus, the substrate detection sensor 153 detects that the corresponding substrate W corresponding to the grooves SL48 and SL50 of each holding member 7 is not present (step S44).

Thereafter, as shown in fig. 20C, the substrate processing mechanism HTR uses the batch robot 125 to transfer 23 substrates W2 of the first substrate group from the first carrier C placed on the carrier 119 to the posture changing section 137 (step S45). Here, in step S44, the substrate detection sensor unit 153 detects that there are no corresponding substrates W corresponding to the slot SL50 (no first substrate state) and no second corresponding substrates corresponding to the 2 slots SL48 and SL49 between the slot SL47 and the slot SL50 holding the front substrate WT (no second substrate state).

In this case, as shown in fig. 20 d, the substrate processing mechanism HTR uses the single Zhang Jixie hand 127 to convey the dummy substrate 100 in a portion of the 3 slots SL48 to SL50 where there is no corresponding substrate W, for example, where there is no corresponding substrate W2 corresponding to the even-numbered slot SL48 closest to the front substrate WT (step S46). The dummy substrate 100 may be transported in a portion where the substrate W corresponding to the slot SL50 does not exist. For example, when there is no corresponding substrate W corresponding to the continuous 5 slots SL46 to SL50, the dummy substrate 100 may be transported to any one of the portions where there is no corresponding substrate W2 corresponding to the slots SL46, LS48, LS 50.

Thereafter, as shown in fig. 20 (e), the posture changing section 137 changes the conveyed 23 substrates W2 and 1 dummy substrate 100 from the horizontal posture to the vertical posture. As shown in fig. 20 f, the pushing mechanism 139 receives 23 substrates W2 and 1 dummy substrate 100 converted into the vertical posture by the pusher 139A (step S47).

Thus, the first substrate group and the second substrate group were combined with the dummy substrate 100 to form a processing substrate group (47 substrates W1, W2 and 1 dummy substrate 100) arranged in a half-pitch and face-to-face manner. The following explanation is the same as in example 3, and therefore omitted.

According to the present embodiment, the substrate detection sensor portion 153 can detect that the corresponding substrate corresponding to the slot SL50 (front end holding slot) is not on the second carrier C (first substrate is in a non-state). The substrate detection sensor 153 can detect that 2 second counter substrates (1 or more second counter substrates) corresponding to, for example, 2 slots SL48 and SL49 (1 or more slots) between, for example, the slot SL47 and the slot SL50 holding the front substrate WT among the 50 slots SL1 to SL50 are not present in the first carrier C and the second carrier C (second non-substrate state). When the substrate detection sensor portion 153 detects the first substrate-free state and the second substrate-free state, the substrate processing mechanism HTR conveys the dummy substrate to a portion of the column of the second substrate group conveyed to the posture changing mechanism 117 where either one of the first corresponding substrate and the second corresponding substrate is absent.

The dummy substrate 100 can be inserted into any one of the grooves SL48 and SL50, for example. When the dummy substrate 100 is held in the slot SL50, the dummy substrate 100 can shield the environment in the vicinity of the environment where the tip end portion 7A side of the holding member 7 stays. In addition, the adhesion of particles can be prevented at the same position regardless of the number of substrates W1, W2. In addition, if the dummy substrate 100 is disposed near the front substrate WT, particles can be prevented near the front substrate WT.

The present invention is not limited to the above embodiment, and can be modified as follows.

(1) In the above-described embodiment, the holding member 7 of the substrate holding portion 5 is configured to be capable of holding, for example, 50 substrates W as a plurality of substrates W. In this regard, for example, 25 substrates W may be held. In this case, 25 grooves may be provided in the holding member 7 at 10mm intervals.

(2) In the above-described embodiment and modification (1), the holding member 7 holds 49 (odd number of) substrates W. Thereby, particles are prevented from adhering to the device surface of the front substrate WT. In this connection, the holding member 7 may hold 50 (even number of) substrates W. This prevents particles from adhering to the "back surface" of the front substrate WT.

(3) In the above-described embodiment and each modification, the holding member 7 holds 49 substrates W. The equipment surface of the substrate W with the odd number of slots is directed in a direction (-Y direction) from the base end portion 7B toward the tip end portion 7A of the holding member 7. The device surface of the even-numbered substrates W is directed in the direction (+y direction) of the base end portion 7B. That is, 2 device surfaces or 2 back surfaces of 2 adjacent substrates W are opposed to each other. In this connection, all 49 substrates W may be set in a direction toward the front end 7A (-Y direction). In addition, all 49 substrates W may be oriented in the direction toward the base end 7B (+y direction). That is, the device surfaces of 2 adjacent substrates W face the back surface.

(4) The shielding plate 71 of the above-described embodiment and modifications may be configured as follows. That is, as shown in fig. 21 (a), the shielding plate 95 may include a main body 95A and a cylindrical portion 95B. The cylindrical portion 95B is disposed on the substrate holding portion 5 side and faces the front substrate WT. The diameter of the cylindrical portion 95B is substantially the same as the diameter of each substrate W. As a result, as shown in fig. 21 (b), when the transfer robot transfers the plurality of substrates W positioned at the drying position H1, it is possible to further realize that the 2 arms 96 of the transfer robot do not interfere with the shielding plate 95. Fig. 21 (b) is a view seen in the direction of arrow AR1 in fig. 21 (a).

(5) In the above-described embodiment and each modification, the liquid discharge ports 76 are oriented in the same direction as the plurality of discharge ports 75. In this regard, as shown in fig. 22, the liquid discharge port 76 may be oriented in a direction different from the plurality of discharge ports 75 (for example, downward). This makes it possible to orient the liquid of the solvent for condensation in a direction of the substrate W that does not affect the adhesion of particles. The second liquid discharge port 86 of the waterproofing agent vapor nozzle 33 may be oriented in a direction different from the plurality of second discharge ports 85.

(6) In the above-described embodiments and modifications, the exhaust port 47 is provided in the side wall 3A of the chamber 3 as shown in fig. 3. In this regard, in the region 91 shown in fig. 7, the flow rate is reduced, and thus if the environment is likely to stay, the exhaust port 47 may not be provided in the side wall 3A facing the front end portion 7A side of the holding member 7.

(7) In the above embodiments and modifications, as shown by arrow AR1 in fig. 2 (a), the back plate 9 is formed so as to cover a part of each substrate W when a plurality of substrates W are viewed from the back plate 9 side. In this regard, the back plate 9 may be formed so as to cover the entire substrate W.

(8) In the above-described embodiments and modifications, the upper end 72 of the shielding plate 71 is disposed so as to reach the top surface 3E of the chamber. In this regard, the upper end of the shielding plate 71 may be disposed at a position higher than the upper end of the front substrate WT. The mist solvent discharged from the liquid discharge ports 76, 86 of the nozzles 31, 32, 33 can be prevented from passing over the shielding plate 71 higher than the upper end of the front substrate WT and toward the plurality of substrates W.

(9) In the above-described embodiments and modifications, the upper end 72 of the shielding plate 71 is disposed so as to reach the top surface 3E of the chamber. In this regard, the upper end 72 of the shielding plate 71 may be disposed at a position higher than the upper end of the inert gas nozzle 27. The mist solvent ejected from the liquid discharge ports 76, 86 of the nozzles 31, 32, 33 can be prevented from passing over the shielding plate 71 higher than the upper end of the inert gas nozzle 27 and toward the plurality of substrates W.

(10) In the above-described embodiments and modifications, the substrate processing apparatus 1 includes 4 solvent vapor nozzles 31 and 32. In this regard, the substrate processing apparatus 1 may be provided with 1 or more solvent vapor nozzles 31. The same applies to the discharge pipe 13, the inert gas nozzle 27, and the waterproofing agent vapor nozzle 33.

(11) In the above-described embodiments and modifications, the dummy substrate 100 is stored in the dummy substrate carrier CD, and the dummy substrate carrier CD is stored in the storage rack 113 of the storage block 103. In this regard, as shown by the two-dot chain line in fig. 10, the substrate processing apparatus 1A may include a substrate buffer portion (including a carrier) 160 at a position accessible by the substrate processing mechanism HTR. In this case, the substrate buffer 160 includes a plurality of substrate holders arranged in the vertical direction Z. Each of the plurality of substrate holders is configured to be capable of holding 1 dummy substrate 100. Thus, when the dummy substrate 100 is required, the substrate processing mechanism HTR can immediately convey the dummy substrate 100.

(12) In each of the above embodiments and modifications, 1 dummy substrate 100 is inserted. In this connection, 2 or more dummy substrates 100 may be inserted. As shown in fig. 23, for example, the holding member 7 of the substrate holding unit 5 may hold 47 substrates W and 3 dummy substrates 100 with 50 slots SL1 to SL 50. When the holding member 7 of the substrate holding portion 5 does not hold 2 or more substrates W, the holding member 7 holds not 1 dummy substrate 100 but a plurality of dummy substrates 100, and therefore the rectifying function can be improved as compared with 1 dummy substrate 100.

(13) In the above-described embodiments and modifications, the cleaning processing units BT2 and BT4 collectively process the plurality of substrates W and 1 dummy substrate 100 arranged at half-pitch and facing each other. In this regard, the cleaning processing units BT2 and BT4 may process a plurality of substrates W and 1 dummy substrate 100 arranged at half-pitch and facing each other at the same time. The face-to-face method is a method in which all the substrates W are arranged in the same direction.

The cleaning units BT2 and BT4 may process 25 substrates W of 1 carrier quantity arranged at full pitch and facing each other at the same time. In the face-to-face method, the substrate W may be oriented toward the front end portion 7A or toward the base end portion 7B.

(14) In the above-described embodiments and modifications, a plurality of (for example, 50 or 49) substrates W other than the dummy substrate 100 for masking may include a dummy substrate for inspection for inspecting the state of substrate processing. The dummy substrate for inspection is accommodated in the first carrier C or the second carrier C. In addition, the dummy substrate for inspection does not return to the carrier CD for the dummy substrate.

Claims

1. A substrate processing apparatus, characterized in that,

The device is provided with:

a treatment tank for storing a treatment liquid;

a chamber surrounding the processing tank;

a solvent vapor nozzle provided in the chamber and disposed at a position higher than the processing tank, the solvent vapor nozzle supplying solvent vapor into the chamber;

an exhaust pump that exhausts the chamber through an exhaust port arranged at a position lower than an upper surface of the processing bath;

a substrate holding unit that includes a holding member that holds a plurality of substrates arranged in a row in a manner opposed to each other in a vertical posture at a predetermined interval, and a back plate that supports a base end portion of the holding member, the substrate holding unit being movable within the chamber over a position within the processing bath and a position above the processing bath; and

and a shielding plate provided between a front end substrate, which is farthest from the back plate, of the plurality of substrates and a side wall of the chamber facing the front end side of the holding member, in a state where the substrate holding portion is located above the processing bath.

2. The substrate processing apparatus according to claim 1, wherein,

the solvent vapor nozzle includes a tube portion extending horizontally and linearly in the chamber, and a plurality of discharge ports provided in the tube portion and arranged along a tube axis,

The solvent vapor nozzle further includes a liquid discharge port provided in the pipe portion upstream of the plurality of discharge ports and disposed in a region corresponding to a space between the shielding plate and the side wall of the chamber,

the plurality of ejection ports eject the solvent vapor into the chamber,

the liquid discharge port discharges a solvent generated by condensation of the solvent vapor to a region between the shielding plate and the side wall of the chamber.

3. The substrate processing apparatus according to claim 2, wherein,

the liquid discharge ports are oriented in different directions from the plurality of discharge ports.

4. The substrate processing apparatus according to any one of claim 1 to 3, wherein,

the upper end of the shielding plate is arranged at a position higher than the upper end of the front substrate.

5. The substrate processing apparatus according to any one of claim 1 to 3, wherein,

the upper end of the shielding plate is configured in a manner of reaching the top surface of the chamber.

6. The substrate processing apparatus according to any one of claim 1 to 3, wherein,

further provided with a water repellent vapor nozzle which is provided in the chamber and is disposed at a position higher than the treatment tank, and which supplies water repellent vapor into the chamber,

The water repellent vapor nozzle includes a second pipe portion extending horizontally and linearly in the chamber, and a plurality of second ejection ports provided in the second pipe portion and arranged along a pipe axis,

the waterproofing agent vapor nozzle further includes a second liquid discharge port provided in the second pipe portion upstream of the plurality of second discharge ports and in a region corresponding to a space between the shielding plate and the side wall of the chamber,

the second plurality of ejection openings respectively eject the water repellent vapor into the chamber,

the second liquid discharge port discharges the waterproofing agent produced by condensation of the waterproofing agent vapor to a region between the shielding plate and the side wall of the chamber.

7. The substrate processing apparatus according to any one of claim 1 to 3, wherein,

the shielding plate is installed in the processing tank.

8. The substrate processing apparatus according to claim 1, wherein,

the shielding plate is a dummy substrate held by the holding member.

9. The substrate processing apparatus according to claim 8, wherein,

the device further comprises:

a carrier rack for placing carriers for storing the plurality of substrates in a horizontal posture;

A dummy substrate carrier that accommodates the dummy substrate;

a horizontal substrate conveying mechanism that conveys the plurality of substrates and conveys the dummy substrate;

a posture changing mechanism that changes the postures of the plurality of substrates and the dummy substrate between a horizontal posture and a vertical posture; and

a batch substrate conveying mechanism for conveying the plurality of substrates and the dummy substrate in a vertical posture,

the horizontal substrate transfer mechanism transfers the plurality of substrates from the carrier placed on the carrier stage to the posture changing mechanism, and transfers the dummy substrate from the dummy substrate carrier to the posture changing mechanism,

the posture changing mechanism changes the plurality of substrates conveyed by the horizontal substrate conveying mechanism from a horizontal posture to a vertical posture,

the batch substrate conveying mechanism conveys the plurality of substrates in a vertical posture and the dummy substrate from the posture changing mechanism,

the substrate holding unit holds the plurality of substrates in a vertical posture, and holds the dummy substrate so as to be positioned between a front end substrate located farthest from the back plate among the plurality of substrates and a side wall of the chamber opposed to a front end side of the holding member,

The substrate holding portion moves over a position in the processing bath and a position above the processing bath in a state where the plurality of substrates and the dummy substrate are held,

the batch substrate conveying mechanism conveys the plurality of substrates in the vertical posture after being processed in the processing tank and the dummy substrate from the substrate holding part to the posture changing mechanism,

the posture changing mechanism changes the plurality of substrates conveyed by the batch substrate conveying mechanism from a vertical posture to a horizontal posture,

the horizontal substrate transport mechanism returns the plurality of substrates in a horizontal posture from the posture changing mechanism to the carrier mounted on the carrier mounting frame, and returns the dummy substrate in a horizontal posture from the posture changing mechanism to the carrier for the dummy substrate.

10. The substrate processing apparatus according to claim 9, wherein,

the device further comprises:

a holding rack for holding a plurality of carriers; and

a carrier transporting mechanism for transporting any carrier stored in the holder to the carrier rack,

the dummy substrate carrier is stored in the holder in advance.

11. The substrate processing apparatus according to claim 8, wherein,

the device further comprises:

a dummy substrate carrier that accommodates the dummy substrate;

a posture changing mechanism that changes the postures of the plurality of substrates and the dummy substrate between a horizontal posture and a vertical posture;

a batch substrate conveying mechanism that conveys the plurality of substrates and the dummy substrate in a vertical posture; and

a substrate detection sensor unit for detecting the presence or absence of a substrate accommodated in the carrier,

the holding member includes a plurality of holding grooves arranged in a row for holding the plurality of substrates,

the plurality of holding grooves have a front-end holding groove at the extreme end portion on the front-end portion side of the holding member,

the substrate detection sensor portion detects the presence or absence of a substrate accommodated in the carrier while moving in the up-down direction with respect to the carrier placed on the carrier placement frame,

the horizontal substrate transfer mechanism transfers the plurality of substrates from the carrier placed on the carrier stage to the posture changing mechanism,

When the substrate detection sensor unit detects that there is no corresponding substrate corresponding to the front end holding groove on the carrier, the horizontal substrate conveying mechanism conveys the dummy substrate from the dummy substrate carrier to a portion of the array of the plurality of substrates conveyed to the posture changing mechanism where there is no corresponding substrate,

the substrate holding unit receives the plurality of substrates in a vertical posture from the batch substrate conveying mechanism by using the plurality of holding grooves of the holding member,

12. The substrate processing apparatus according to claim 8, wherein,

the device further comprises:

a carrier rack for placing a first carrier for storing a first substrate group composed of more than 2 substrates in a horizontal posture;

a dummy substrate carrier that accommodates the dummy substrate;

a horizontal substrate conveying mechanism that conveys the first substrate group, conveys a second substrate group composed of 2 or more substrates, and conveys the dummy substrate;

a posture changing mechanism for changing the postures of the first substrate group, the second substrate group and the dummy substrate between a horizontal posture and a vertical posture, wherein the plurality of substrates in the vertical posture are formed by combining the first substrate group and the second substrate group,

A substrate detection sensor unit for detecting the presence or absence of a substrate accommodated in the first carrier,

the substrate detection sensor portion detects the presence or absence of a substrate accommodated in the first carrier while moving in the vertical direction with respect to the first carrier mounted on the carrier mounting frame,

the substrate detection sensor unit detects the presence or absence of a substrate stored in a second carrier mounted on the carrier mounting frame while moving in the vertical direction with respect to the second carrier stored in a horizontal posture in the second substrate group,

the horizontal substrate transfer mechanism transfers the first substrate group from the first carrier placed on the carrier to the posture changing mechanism,

the horizontal substrate transfer mechanism transfers the second substrate group from the second carrier placed on the carrier to the posture changing mechanism,

when the substrate detection sensor unit detects that there is no corresponding substrate corresponding to the front end holding groove on the first carrier or the second carrier, the horizontal substrate transfer mechanism transfers the dummy substrate from the dummy substrate carrier to a portion of the row of the first substrate group or the second substrate group that is transferred to the posture changing mechanism, where there is no corresponding substrate,

The posture changing mechanism changes the first substrate group, the second substrate group and the dummy substrate from a horizontal posture to a vertical posture, and combines the first substrate group and the second substrate group to form the plurality of substrates in the vertical posture,

the posture changing mechanism divides the plurality of substrates conveyed by the batch substrate conveying mechanism into the first substrate group and the second substrate group, and changes the first substrate group, the second substrate group and the dummy substrate from a vertical posture to a vertical posture,

the horizontal substrate transfer mechanism returns the first substrate group in a horizontal posture from the posture changing mechanism to the first carrier mounted on the carrier, returns the second substrate group in a horizontal posture from the posture changing mechanism to the second carrier mounted on the carrier, and returns the dummy substrate in a horizontal posture from the posture changing mechanism to the dummy substrate carrier.

13. The substrate processing apparatus according to claim 12, wherein,

the substrates of the first substrate group and the substrates of the second substrate group are alternately arranged one by one among the plurality of substrates.

14. The substrate processing apparatus according to any one of claims 11 to 13, wherein,

the front substrate faces the sidewall of the chamber.