CN117141122A - Thermal print head and thermal printer - Google Patents
Thermal print head and thermal printer Download PDFInfo
- Publication number
- CN117141122A CN117141122A CN202310622742.7A CN202310622742A CN117141122A CN 117141122 A CN117141122 A CN 117141122A CN 202310622742 A CN202310622742 A CN 202310622742A CN 117141122 A CN117141122 A CN 117141122A
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- Prior art keywords
- layer
- boron nitride
- particles
- thermal printhead
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000010410 layer Substances 0.000 claims abstract description 349
- 239000002245 particle Substances 0.000 claims abstract description 125
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229910052582 BN Inorganic materials 0.000 claims abstract description 76
- 239000011241 protective layer Substances 0.000 claims abstract description 69
- 239000011521 glass Substances 0.000 claims abstract description 49
- 239000000654 additive Substances 0.000 claims abstract description 33
- 230000000996 additive effect Effects 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 14
- 229910000464 lead oxide Inorganic materials 0.000 claims description 5
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 description 14
- 238000005299 abrasion Methods 0.000 description 11
- 238000005187 foaming Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000010931 gold Substances 0.000 description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
Landscapes
- Electronic Switches (AREA)
Abstract
The invention provides a thermal print head and a thermal printer suitable for improving wear resistance of a protective layer. The thermal print head (A1) comprises: a substrate (1) having a main surface (11) facing the z1 side in the thickness direction (z); a resistor layer (4) which is arranged on the main surface (11) and has a plurality of heat generating parts (41) arranged in the main scanning direction; a wiring layer (3) which is arranged on the main surface (11) and is electrically connected to the resistor layer (4); and a protective layer (5) that covers at least the resistor layer (4), wherein the protective layer (5) (second layer 52) is composed of glass and additive particles, and the additive particles contain boron nitride particles.
Description
Technical Field
The present invention relates to a thermal print head and a thermal printer.
Background
Patent document 1 discloses an example of a conventional thermal head. The thermal print head disclosed in this document has a substrate, a glaze layer, an electrode layer, a resistor layer, a protective layer, and a drive IC. The substrate is a plate-like member made of an insulating material, for example, alumina (Al 2 O 3 ) And the like. The glaze layer is formed on the surface of the substrate, and is made of glass, for example. The electrode layer is formed on the glaze layer and forms a current path for selectively passing current through the resistor layer. The resistor layer has a plurality of heat generating portions arranged in the main scanning direction. The drive IC controls the current flowing to each heat generating portion. The protective layer covers at least the resistor layer.
In the thermal head having such a configuration, a plurality of heat generating portions are heated, and a print medium such as thermal paper is conveyed in the sub-scanning direction while being pressed against the protective layer, and printing is performed on the print medium. In the protective layer for protecting the resistor layer (the plurality of heat generating portions), abrasion resistance is required because the protective layer repeatedly contacts the printing medium. In recent years, the printing speed has been increased. In addition, with diversification of printing media, a relatively hard printing medium may be used. In such a situation, improvement in abrasion resistance of the protective layer is demanded.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2019-147300.
Disclosure of Invention
Problems to be solved by the invention
One of the problems of the present invention is to provide a thermal print head that is improved over prior art implementations. In particular, in view of the above, it is an object of the present invention to provide a printable thermal head suitable for a printing medium in which abrasion resistance of a protective layer is improved.
A first aspect of the present invention provides a thermal printhead comprising: a substrate having a main surface facing one side in the thickness direction; a resistor layer disposed on the main surface and having a plurality of heat generating portions arranged in the main scanning direction; a wiring layer which is arranged on the main surface and is electrically connected to the resistor layer; and a protective layer covering at least the resistor layer, the protective layer including glass and additive particles, the additive particles including boron nitride particles.
A second aspect of the invention provides a thermal printer comprising the thermal printhead of the first aspect of the invention; and a platen disposed opposite to the plurality of heat generating portions.
Effects of the invention
According to the above structure, improvement in wear resistance of the protective layer can be achieved in the thermal head.
Other features and advantages of the present invention will become apparent from the following detailed description with reference to the accompanying drawings.
Drawings
Fig. 1 is a plan view showing a thermal head according to a first embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view taken along line II-II of fig. 1.
Fig. 3 is an enlarged plan view showing a main part of a thermal head according to a first embodiment of the present invention.
Fig. 4 is an enlarged cross-sectional view of a main portion of a portion of fig. 2.
Fig. 5 is an enlarged cross-sectional view of a main portion of a portion of fig. 4.
Fig. 6 is an enlarged cross-sectional view of a main part of a thermal head according to a second embodiment of the present invention.
Fig. 7 is an enlarged cross-sectional view of a main portion of fig. 6 with a portion enlarged.
Fig. 8 is an enlarged cross-sectional view of a main part of a thermal head according to a third embodiment of the present invention.
Fig. 9 is an enlarged cross-sectional view of a main portion of a portion of fig. 8.
Fig. 10 is an enlarged cross-sectional view showing a main part of a thermal head according to a fourth embodiment of the present invention.
Fig. 11 is an enlarged cross-sectional view of a main portion of fig. 10 with a portion enlarged.
Fig. 12 is an enlarged cross-sectional view of a main portion of a thermal head according to a fifth embodiment of the present invention.
Fig. 13 is an enlarged cross-sectional view of a main portion of fig. 12 with a portion enlarged.
Fig. 14 is an enlarged cross-sectional view showing a main part of a thermal head according to a sixth embodiment of the present invention.
Fig. 15 is an enlarged cross-sectional view of a main portion of fig. 14 with a portion enlarged.
Description of the reference numerals
A1, A2, A3, A4, A5, A6: thermal print head
Pr: thermal printer 1: substrate board
11: major face 2: glaze layer
21: glaze main surface 22: heater glaze
23: glass layer 3: wiring layer
31: common electrode 311: public part
312: common electrode band portion 32: independent electrode
33: individual electrode strips 34: connecting part
35: signal wiring section 36: pad part
4: resistor layer 41: heating part
5: protective layer 51: first layer
519: opening 52: second layer
53: third layer 55: first part
56: second portion 61: conducting wire
71: drive IC 72: protective resin
73: connector 81: paper pressing roller
82: printing medium.
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The terms "first", "second", and the like in the present invention denote terms used as labels, and the order of these objects is not necessarily intended to be given.
In the present invention, "something a is formed on something B" and "something a is formed on something B" include "a case where something a is directly formed on something B" and "a case where something a is formed on something B with other objects interposed therebetween" unless otherwise specified. Likewise, "something a is disposed on something B" and "something a is disposed on something B" mean, unless otherwise specified, that "a case where something a is disposed directly on something B" and "a case where other objects are interposed between something a and something B, and something a is disposed on something B" are included. Likewise, "something a is located on something B" means, unless otherwise specified, that "something a is in contact with something B," something a is located on something B, "and" a case where another object is interposed between something a and something B, and something a is located on something B. In addition, "seeing something a overlaps something B in a certain direction" means that "a case where something a overlaps something B entirely" and "a case where something a overlaps a part of something B" are included unless otherwise specified. In the present invention, "a certain surface a faces (one side or the other side) in the direction B" means that the angle of the surface a with respect to the direction B is not limited to 90 °, but includes a case where the surface a is inclined with respect to the direction B.
First embodiment:
fig. 1 to 5 show a thermal head according to a first embodiment of the present invention. The thermal head A1 of the present embodiment includes a substrate 1, a glaze layer 2, a wiring layer 3, a resistor layer 4, a protective layer 5, a plurality of wires 61, a drive IC71, a protective resin 72, and a connector 73.
Fig. 1 is a plan view showing a thermal head A1. Fig. 2 is a schematic cross-sectional view taken along line II-II of fig. 1. Fig. 3 is an enlarged plan view showing a main portion of the thermal head A1. Fig. 4 is an enlarged cross-sectional view of a main portion of fig. 2 with a portion thereof enlarged. Fig. 5 is an enlarged cross-sectional view of a main portion of fig. 4 with a portion thereof enlarged. In addition, the protective layer 5 is omitted in fig. 1 and 3 for ease of understanding. The connector 73 is omitted in fig. 4. In these figures, the thickness direction of the substrate 1 is referred to as "thickness direction z". The upper side in fig. 2 and 4 is "one side in the thickness direction z", and is referred to as "z 1 side in the thickness direction z". The lower side in fig. 2 and 4 is "the other side in the thickness direction z", and is referred to as "the z2 side in the thickness direction z". The term "planar view" means when viewed in the thickness direction z. The main scanning direction of the thermal head A1 is referred to as a "main scanning direction x", and the sub-scanning direction of the thermal head A1 is referred to as a "sub-scanning direction y". The lower side in fig. 1 and 3 (left side in fig. 2 and 4) in the sub-scanning direction y is the upstream side from which the printing medium is fed, and is referred to as "y 1 side in the sub-scanning direction y". The upper side in fig. 1 and 3 (right side in fig. 2 and 4) is the downstream side where the printing medium is discharged, and is referred to as "y 2 side in the sub-scanning direction y".
The thermal head A1 is incorporated in a thermal printer Pr (see fig. 2) that prints on a print medium 82. The thermal printer Pr has a thermal print head A1 and a platen roller 81. The platen roller 81 is opposed to the thermal head A1. The print medium 82 is sandwiched between the thermal head A1 and the platen roller 81, and is conveyed in the sub-scanning direction y by the platen roller 81. Examples of such a print medium 82 include thermal paper used for producing bar code paper and receipts. Instead of the platen roller 81, a platen made of flat rubber may be used. The platen includes a portion of cylindrical rubber having a large radius of curvature that is arcuate in shape when viewed in cross-section. In the present invention, the term "platen" includes both the platen roller 81 and a flat platen.
The substrate 1 is made of, for example, al 2 O 3 The thickness of the ceramic is, for example, about 0.5 to 1.5 mm. As shown in fig. 1, the substrate 1 is formed in a long rectangular shape extending long in the main scanning direction x. The substrate 1 has a main surface 11. The main surface 11 faces the z1 side in the thickness direction z. The glaze layer 2, the wiring layer 3, the resistor layer 4, the protective layer 5, the driver IC71, and the protective resin 72 are each disposed on the main surface 11 of the substrate 1. The connector 73 is a member for connection to an external device, and is provided at an end portion of the substrate 1 on the y1 side in the sub-scanning direction y, for example.
The glaze layer 2 is disposed on the substrate 1 and is made of, for example, a glass material such as amorphous glass. The softening point of the glass material is, for example, 800 to 850 ℃. The glaze layer 2 of the present embodiment is formed to have a constant thickness, and has a flat (or substantially flat) glaze main surface 21 facing the z1 side in the thickness direction z. The thickness of the glaze layer 2 is, for example, 10 to 300. Mu.m.
The thermal head A1 has a so-called thick film structure and is manufactured by thick film printing. The glaze layer 2 is formed by thick film printing a glass paste on the substrate 1 and firing the same. The glaze layer 2 is formed using a thick film formation technique.
The wiring layer 3 is a structure for forming a path for supplying electricity to the resistor layer 4, and is disposed on the glaze main surface 21 of the glaze layer 2. The wiring layer 3 is formed to have a specific resistance value smaller than that of the resistor layer 4. The wiring layer 3 is made of an electric conductor containing silver (Ag) as a main component, for example. The thickness of the wiring layer 3 is, for example, about 0.5 to 30 μm, which is an example of the thickness of the wiring layer 3.
As shown in fig. 3 to 5, the wiring layer 3 has a common electrode 31, a plurality of individual electrodes 32, a plurality of signal wiring portions 35, and a plurality of pad portions 36.
The common electrode 31 has a common portion 311 and a plurality of common electrode strip portions 312. Specifically, the common portion 311 is disposed at an interval on the y2 side in the sub-scanning direction y with respect to the resistor layer 4. The common portion 311 extends along the main scanning direction x, and the width dimension in the sub scanning direction y is formed relatively large. The plurality of common electrode stripe portions 312 extend from the common portion 311 toward the y1 side in the sub-scanning direction y, and are arranged at equal intervals in the main scanning direction x.
The plurality of individual electrodes 32 are electrodes for partially energizing the resistor layer 4, and are portions of opposite polarity to the common electrode 31. The individual electrodes 32 extend from the resistor layer 4 toward the driver IC71. The plurality of individual electrodes 32 are arranged in the main scanning direction x, and each has an individual electrode stripe portion 33 and a connecting portion 34.
Each individual electrode stripe portion 33 is a stripe portion extending in the sub-scanning direction y, and is located between 2 adjacent common electrode stripe portions 312 of the common electrode 31. The connection portion 34 extends from the individual electrode stripe portion 33 to the drive IC71, and most of the connection portion has a portion along the sub-scanning direction y and a portion inclined with respect to the sub-scanning direction y. The connection portions 34 are arranged at relatively narrow intervals in the main scanning direction x on the y1 side in the sub scanning direction y. The distance between adjacent connection portions 34 on the y1 side in the sub-scanning direction y is, for example, 100 μm or less.
The plurality of signal wiring portions 35 constitute wiring patterns connected to the connector 73 and the driver IC71. In fig. 4, only 1 signal wiring portion 35 is shown, and a plurality of signal wiring portions 35 are arranged in the main scanning direction x in the vicinity of the drive IC71 and extend in the sub-scanning direction y, respectively. Further, the drive IC71 used in the thermal head A1 generally has a planar shape of a long rectangular shape (refer to fig. 1). The long edge of the driver IC71 extends along the main scanning direction x, which is the direction in which the resistor layer 4 extends.
As shown in fig. 3 and 4, the plurality of pad portions 36 are portions connected to the driver IC71 via the plurality of wires 61. The plurality of pad portions 36 are arranged in the main scanning direction x and the sub scanning direction y. The plurality of pad portions 36 are connected to an end portion on the y1 side in the sub-scanning direction y of any one of the plurality of connection portions 34 (the individual electrodes 32) or an end portion on the y2 side in the sub-scanning direction y of any one of the plurality of signal wiring portions 35. Wires 61 for connection to the driver ICs 71 are bonded to the respective pad portions 36. In the present embodiment, among the plurality of pad portions 36, pad portions connected to the connecting portions 34 adjacent to each other in the main scanning direction x are arranged alternately in the sub scanning direction y. Thus, the plurality of pad portions 36 connected to the plurality of connection portions 34 are prevented from interfering with each other, although they have a larger width than a portion of the connection portions 34.
Further, a part of the wiring layer 3 may be made of a conductor containing gold (Au) as a main component. Specifically, the portion of the wiring layer 3 containing Au as a main component includes, for example, the common portion 311 and the plurality of common electrode stripe portions 312 of the common electrode 31, and the individual electrode stripe portions 33 of the plurality of individual electrodes 32. The wiring layer 3 may be entirely made of an electric conductor containing Au as a main component.
The resistor layer 4 has a higher resistivity than the material constituting the wiring layer 3, and is formed in a stripe shape extending in the main scanning direction x, for example, by ruthenium oxide or the like. As shown in fig. 3, the resistor layer 4 intersects the plurality of common electrode strips 312 of the common electrode 31 and the individual electrode strips 33 of the plurality of individual electrodes 32. The resistor layer 4 is laminated on the opposite side of the substrate 1 with respect to the plurality of common electrode strips 312 of the common electrode 31 and the individual electrode strips 33 of the plurality of individual electrodes 32. The resistor layer 4 is locally energized through the wiring layer 3 at a portion sandwiched between the common electrode strip portions 312 and the individual electrode strip portions 33, thereby forming a heat generating portion 41 that generates heat. The 1 printing dot is formed by heat generation of 2 heat generating portions 41 adjacent to each other with 1 individual electrode strip portion 33 interposed therebetween. The thickness of the resistor layer 4 is, for example, about 1 to 10 μm.
The protective layer 5 is composed of at least the resistor layer 4, and includes glass such as amorphous glass as a main component. In the present embodiment, the protective layer 5 includes a first layer 51 and a second layer 52 stacked on each other.
The first layer 51 covers at least the resistor layer 4 (the plurality of heat generating portions 41) and contacts the resistor layer 4. In the present embodiment, the first layer 51 covers the entire resistor layer 4 and most of the wiring layer 3. Specifically, the first layer 51 is formed in a region from the front of the y1 side edge of the substrate 1 in the sub-scanning direction y to the y2 side edge of the substrate 1 in the sub-scanning direction y. However, the first layer 51 exposes the region including the plurality of pad portions 36 in the wiring layer 3. As shown in fig. 4, the first layer 51 has a plurality of openings 519. Each opening 519 penetrates the first layer 51 in the thickness direction z. Each of the plurality of openings 519 exposes the pad portion 36. In this way, the first layer 51 protects the wiring layer 3 and the resistor layer 4.
The first layer 51 is made of, for example, amorphous glass, and may contain an additive such as alumina particles. The softening point of the amorphous glass constituting the first layer 51 is, for example, 780 ℃. The first layer 51 is formed by thick-film printing a glass paste on the glaze layer 2 so as to cover a part of the resistor layer 4 and the wiring layer 3, and then firing the glass paste. The thickness t1 of the first layer 51 is not particularly limited, and is, for example, about 6 to 8 μm.
The second layer 52 is formed on the first layer 51. The second layer 52 is located at the end on the z1 side in the thickness direction z among the plurality of layers (the first layer 51 and the second layer 52 in the present embodiment) constituting the protective layer 5. The second layer 52 is formed so as to overlap the resistor layer 4 in a plan view (seen in the thickness direction z) and is formed in a region where the print medium 82 can be brought into contact when the print medium 82 is conveyed. The second layer 52 covers a portion of the first layer 51. Specifically, the second layer 52 covers each part of the two sides sandwiching the resistor layer 4 in the sub-scanning direction y. The second layer 52 covers at least a part of the individual electrode stripe portions 33 of the individual electrodes 32 and the common electrode 31.
The second layer 52 is made of, for example, amorphous glass, and contains 1 or 2 or more kinds of additive particles. The second layer 52 contains at least Boron Nitride (BN) particles as additive particles. In the present embodiment, the second layer 52 contains boron nitride particles and aluminum oxide particles as the additive particles. The second layer 52 may be a structure not containing the alumina particles. In the present embodiment, the softening point of the amorphous glass constituting the second layer 52 is, for example, 700 ℃. Therefore, the softening point of the amorphous glass constituting the first layer 51 is higher than the softening point of the amorphous glass constituting the second layer 52. The glass material of the second layer 52 is composed of, for example, lead-free glass containing no lead oxide. The boron nitride particles are, for example, particles composed of cubic boron nitride (cBN), and are preferably in the shape of a circular arc. Cubic boron nitride has a hardness inferior to that of diamond, with knoop hardness of the order of 4700 Hk. In addition, cubic boron nitride is excellent in heat resistance. The alumina particles are particles formed of alumina, and preferably have a shape with an arc.
The thickness t2 of the second layer 52 is smaller than the thickness t1 of the first layer 51, for example, about 2 to 6 μm. The particle diameter of the boron nitride particles contained in the second layer 52 is not more than the thickness t2 of the second layer 52, preferably about 0 to 4 μm.
In this embodiment, the mixing ratio of the additive particles (boron nitride particles and alumina particles in this embodiment) in the second layer 52 is, for example, 5 to 80% by weight. The mixing ratio of the boron nitride particles in the second layer 52 is preferably 10 to 30% by weight. The mixing ratio of the alumina particles in the second layer 52 is, for example, 0 to 70% by weight.
The second layer 52 is formed by thick film printing a material obtained by mixing boron nitride particles and aluminum oxide particles in a glass paste, and firing the same. The density of the amorphous glass constituting the second layer 52 is a relatively similar value to the density of the boron nitride particles. In the formed second layer 52, the boron nitride particles are in a substantially uniformly dispersed state. In addition, the first layer 51 does not contain boron nitride particles unlike the second layer 52.
The driver IC71 selectively energizes the plurality of individual electrodes 32, thereby functioning to partially heat the resistor layer 4. As shown in fig. 1 and 4, the driver IC71 is disposed on the y1 side in the sub-scanning direction y with respect to the resistor layer 4 (the plurality of heat generating portions 41). In the present embodiment, a plurality of driver ICs 71 are disposed on the glaze layer 2. A plurality of pads are provided on the drive IC71. As shown in fig. 4, the pad of the drive IC71 and the plurality of pad portions 36 are connected via a plurality of wires 61 bonded respectively. The wire 61 is made of Au, for example. As shown in fig. 2 and 4, the drive IC71 is covered with a protective resin 72. The protective resin 72 is made of, for example, black soft resin. The driver IC71 and the connector 73 are connected through the plurality of signal wiring portions 35. The drive IC71 receives a print signal and a control signal transmitted from the outside and a voltage supplied to the plurality of heat generating units 41 via the connector 73. The plurality of heat generating units 41 are independently energized according to the print signal and the control signal, and selectively generate heat.
Next, a simple description will be given of an example of a method of using the thermal head A1.
The thermal head A1 is used in a state of being assembled in the thermal printer Pr. As shown in fig. 2, in this printer, each heat generating portion 41 of the thermal head A1 faces the platen roller 81. In use of the printer, the platen roller 81 rotates, and a print medium 82 such as thermal paper is fed between the platen roller 81 and each heat generating portion 41 at a constant speed along the sub-scanning direction y. The print medium 82 is pressed by the platen roller 81 against the portion of the protective layer 5 covering each heat generating portion 41. On the other hand, the individual electrodes 32 shown in fig. 3 are selectively given electric potential by the drive IC71. Thereby, a voltage is applied between the common electrode 31 and each of the plurality of independent electrodes 32. Then, electric current selectively flows through the plurality of heat generating portions 41 to generate heat. The heat generated in each heat generating portion 41 is transferred to the print medium 82 via the protective layer 5. Then, a plurality of dots are printed on a line area extending linearly in the main scanning direction x on the print medium 82. The heat generated by each heat generating portion 41 is also transferred to the glaze layer 2, and accumulated in the glaze layer 2.
Next, the operation of the present embodiment will be described.
In the thermal head A1, the protective layer 5 (second layer 52) that can be in contact with the print medium 82 contains boron nitride particles as additive particles. With such a structure, the hardness of boron nitride is high, and the abrasion resistance of the protective layer 5 (second layer 52) can be improved.
In this embodiment, the protective layer 5 is composed of a plurality of layers including the first layer 51 and the second layer 52. The first layer 51 is in contact with the resistor layer 4, and the second layer 52 is located at the uppermost layer (the end on the z1 side in the thickness direction z) and overlaps the resistor layer 4 in a plan view. The second layer 52 contains boron nitride particles. On the other hand, the first layer 51 formed in a relatively wide range does not contain boron nitride particles. According to such a structure, the amount of the boron nitride particles used can be suppressed, and the abrasion resistance of the second layer 52 that can be contacted by the printing medium 82 can be effectively improved. Further, according to the findings of the inventors, it was confirmed that when the glass layer containing boron nitride particles is directly formed on the wiring layer 3 in the case where the wiring layer 3 contains Ag, a foaming phenomenon occurs in the vicinity of Ag of the wiring layer 3. In the present embodiment, the first layer 51 directly formed on the wiring layer 3 does not contain boron nitride particles. Therefore, when the wiring layer 3 contains Ag, the foaming phenomenon caused by Ag can be prevented.
The mixing ratio of the additive particles in the second layer 52 is 5 to 80 wt%. The mixing ratio of the boron nitride particles in the second layer 52 is 10 to 30 wt%. According to such a structure, in the second layer 52, boron nitride particles can be uniformly dispersed, and abrasion resistance can be improved. Based on the findings of the present inventors, when the printing process is performed under the same conditions, although the printing density is somewhat uneven, the mixing ratio of the boron nitride particles in the second layer 52 is in the range of 10 to 30 wt%, the polishing amount of the second layer 52 is small, and improvement of the abrasion resistance can be confirmed.
The thickness t1 of the first layer 51 is greater than the thickness t2 of the second layer 52. The thickness t2 of the second layer 52 is 2 to 6 μm. According to such a structure, the thickness t2 of the second layer 52 is suppressed to be relatively small, and the amount of the boron nitride particles used can be effectively suppressed. The particle diameter of the boron nitride particles contained in the second layer 52 is 0 to 4 μm, which is equal to or smaller than the thickness t2 of the second layer 52. According to such a structure, the boron nitride particles are uniformly dispersed in the second layer 52, and the appearance of the boron nitride particles can be effectively suppressed from appearing on the surface of the second layer 52. Therefore, the abrasion resistance of the protective layer 5 (the second layer 52) can be improved, and the surface of the protective layer 5 (the second layer 52) can be appropriately formed in a smooth state.
According to the findings of the present inventors, it was confirmed that when lead oxide is contained in the glass paste to which the boron nitride particles are added, a large amount of bubbles are generated on the surface of the fired glass layer. In the present embodiment, the second layer 52 is composed of lead-free glass containing no lead oxide. This effectively suppresses the generation of bubbles on the surface of the second layer 52, and can maintain the smoothness of the surface of the protective layer 5 (second layer 52).
The softening point of the glass material constituting the first layer 51 is higher than the softening point of the glass material constituting the second layer 52. According to such a configuration, even if the second layer 52 is softened when the temperature of the protective layer 5 increases during use of the thermal head A1 or the like, the first layer 51 can be maintained in a relatively strong state. This can suppress the boron nitride particles contained in the second layer 52 from settling from the second layer 52 to the first layer 51. Therefore, the foaming phenomenon in the case where the wiring layer 3 contains Ag can be appropriately prevented.
Second embodiment:
fig. 6 and 7 show a thermal head according to a second embodiment of the present invention. Fig. 6 is an enlarged cross-sectional view of a main part of the thermal head A2 according to the present embodiment, and is a cross-sectional view similar to fig. 4. Fig. 7 is an enlarged cross-sectional view of a main portion of fig. 6 with a portion enlarged. In the drawings of fig. 6 and the following, the same or similar elements as those of the thermal head A1 of the above embodiment are denoted by the same reference numerals as those of the above embodiment, and the appropriate description thereof is omitted. The structures of the respective portions in the respective embodiments shown in fig. 6 and the following can be appropriately combined with each other within a range where technical contradiction does not occur.
The thermal head A2 of the present embodiment is different from the thermal head A1 of the above embodiment in the configuration of the glaze layer 2. In the thermal head A2 shown in fig. 6 and 7, the glaze layer 2 has a heater glaze 22 and a glass layer 23. The heater glaze 22 has a cross-sectional shape perpendicular to the main scanning direction x, and is a planar strip shape extending long in the main scanning direction x, and is bulged toward the z1 side in the thickness direction z. The glass layer 23 is formed adjacent to the heater glaze 22, and the glaze main surface 21 facing the z1 side in the thickness direction z has a flat shape. The glass layer 23 overlaps a portion of the heater glaze 22. The resistor layer 4 (a plurality of heat generating portions 41) is disposed on the heater glaze 22 so as to overlap the heater glaze 22 in a plan view (as viewed in the thickness direction z). In forming such a glaze layer 2 having the heater glaze 22 and the glass layer 23, the glass paste is thick film printed on the substrate 1, and then fired and repeated a plurality of times.
In the thermal head A2 of the present embodiment, the protective layer 5 (second layer 52) that can be brought into contact with a printing medium (not shown) contains boron nitride particles as additive particles. With such a structure, boron nitride has high hardness, and the abrasion resistance of the protective layer 5 (second layer 52) can be improved.
In this embodiment, the protective layer 5 is composed of a plurality of layers including the first layer 51 and the second layer 52. The first layer 51 is in contact with the resistor layer 4, and the second layer 52 is located at the uppermost layer (the end on the z1 side in the thickness direction z) and overlaps the resistor layer 4 in a plan view. The second layer 52 contains boron nitride particles. On the other hand, the first layer 51 formed in a relatively wide range does not contain boron nitride particles. According to such a configuration, the wear resistance of the second layer 52 that can be brought into contact with a printing medium (not shown) can be effectively improved while suppressing the amount of boron nitride particles used. Further, according to the findings of the present inventors, it was confirmed that when a glass layer containing boron nitride particles is directly formed on the wiring layer 3 in the case where the wiring layer 3 contains Ag, a foaming phenomenon occurs in the vicinity of Ag of the wiring layer 3. In the present embodiment, the first layer 51 directly formed on the wiring layer 3 does not contain boron nitride particles. Therefore, when the wiring layer 3 contains Ag, the foaming phenomenon caused by Ag can be prevented. In addition, the same operational effects as those of the thermal head A1 of the above embodiment can be achieved.
Third embodiment:
fig. 8 and 9 show a thermal head according to a third embodiment of the present invention. Fig. 8 is an enlarged cross-sectional view of a main part of the thermal head A3 according to the present embodiment, and is a cross-sectional view similar to fig. 4. Fig. 9 is an enlarged cross-sectional view of a main portion of a portion of fig. 8. The thermal head A3 of the present embodiment differs from the thermal head A1 of the above embodiment in the structure of the protective layer 5.
In the thermal head A3 shown in fig. 8 and 9, the protective layer 5 is constituted by a single layer. The protective layer 5 of the present embodiment corresponds to the first layer 51 of the thermal head A1, and has a thickness to the same extent as the first layer 51 of the thermal head A1. On the other hand, in the present embodiment, the protective layer 5 contains at least Boron Nitride (BN) particles as additive particles. In the present embodiment, the protective layer 5 contains boron nitride particles and aluminum oxide particles as the additive particles. The protective layer 5 may be a structure not containing the alumina particles.
In the thermal head A3 of the present embodiment, the protective layer 5, which can be brought into contact with a printing medium (not shown), contains boron nitride particles as additive particles. According to such a structure, boron nitride has high hardness, and the wear resistance of the protective layer 5 can be improved. In addition, the same operational effects as those of the above embodiment can be achieved within the same configuration as the thermal head A1 of the above embodiment.
Fourth embodiment:
fig. 10 and 11 show a thermal head according to a fourth embodiment of the present invention. Fig. 10 is an enlarged cross-sectional view of a main part of the thermal head A4 according to the present embodiment, and is a cross-sectional view similar to fig. 4. Fig. 11 is an enlarged cross-sectional view of a main portion of fig. 10 with a portion enlarged. The thermal head A4 of the present embodiment differs from the thermal head A1 of the above embodiment in the structure of the protective layer 5.
In the thermal head A4 shown in fig. 10 and 11, the protective layer 5 includes a first layer 51, a second layer 52, and a third layer 53. The protective layer 5 of the present embodiment further includes a third layer 53 as compared with the thermal head A1 of the above embodiment. The third layer 53 is interposed between the first layer 51 and the second layer 52 in the thickness direction z, and contacts both the first layer 51 and the second layer 52. The specific structure of each of the first layer 51 and the second layer 52 is the same as that of the thermal head A1 of the above embodiment. The third layer 53 is made of amorphous glass, for example, similarly to the first layer 51 and the second layer 52. The third layer 53 may also contain additive particles. When the third layer 53 contains additive particles, the additive particles are either or both of boron nitride particles and aluminum oxide particles. The softening point of the glass material constituting the third layer 53 is preferably higher than the softening point of the glass material constituting the second layer 52 and lower than the softening point of the glass material constituting the first layer 51.
In the thermal head A4 of the present embodiment, the protective layer 5 (second layer 52) that can be brought into contact with a printing medium (not shown) contains boron nitride particles as additive particles. According to this structure, boron nitride has high hardness, and the abrasion resistance of the protective layer 5 (second layer 52) can be improved.
In this embodiment, the protective layer 5 is composed of a plurality of layers including the first layer 51 and the second layer 52. The first layer 51 is in contact with the resistor layer 4, and the second layer 52 is located at the uppermost layer (the end on the z1 side in the thickness direction z) and overlaps the resistor layer 4 in a plan view. The second layer 52 contains boron nitride particles. On the other hand, the first layer 51 formed in a relatively wide range does not contain boron nitride particles. According to such a configuration, the wear resistance of the second layer 52 that can be brought into contact with a printing medium (not shown) can be effectively improved while suppressing the amount of boron nitride particles used. Further, according to the findings of the present inventors, it was confirmed that when a glass layer containing boron nitride particles is directly formed on the wiring layer 3 in the case where the wiring layer 3 contains Ag, a foaming phenomenon occurs in the vicinity of Ag of the wiring layer 3. In the present embodiment, the first layer 51 directly formed on the wiring layer 3 does not contain boron nitride particles. Therefore, when the wiring layer 3 contains Ag, the foaming phenomenon caused by Ag can be prevented. The same operational effects as those of the thermal head A1 of the above embodiment can be achieved.
Fifth embodiment:
fig. 12 and 13 show a thermal head according to a fifth embodiment of the present invention. Fig. 12 is an enlarged cross-sectional view of a main part of the thermal head A5 according to the present embodiment, and is a cross-sectional view similar to fig. 4. Fig. 13 is an enlarged cross-sectional view of a main portion of fig. 12 with a portion enlarged. The thermal head A5 of the present embodiment differs from the thermal head A1 of the above embodiment in the structure of the protective layer 5.
In the thermal head A5 shown in fig. 12 and 13, the formation area of the second layer 52 of the protective layer 5 is different from the thermal head A1 of the above embodiment. In the present embodiment, the second layer 52 overlaps the resistor layer 4 in a plan view (see the thickness direction z), but does not overlap the common portion 311 in a plan view. In the present embodiment, the softening point of the amorphous glass constituting the first layer 51 is equal to or lower than the softening point of the amorphous glass constituting the second layer 52.
In the thermal head A5 of the present embodiment, the protective layer 5 (second layer 52) that can be in contact with a printing medium (not shown) contains boron nitride particles as additive particles. According to this structure, boron nitride has high hardness, and the abrasion resistance of the protective layer 5 (second layer 52) can be improved.
The softening point of the glass material constituting the first layer 51 is equal to or lower than the softening point of the glass material constituting the second layer 52. The common portion 311 is formed in a considerably wider range than other elements of the wiring layer 3. The second layer 52 does not overlap the common portion 311 in a plan view (seen in the thickness direction z). According to such a configuration, when the temperature of the protective layer 5 increases during use of the thermal head A1 or the like, even if the first layer 51 softens and the boron nitride particles contained in the second layer 52 are deposited from the second layer 52 to the first layer 51, the foaming phenomenon in the common portion 311 does not occur when the wiring layer 3 contains Ag. Therefore, the foaming phenomenon caused by Ag in the case where Ag is contained in the wiring layer 3 can be suppressed. In addition, the same operational effects as those of the above embodiment can be achieved within the same configuration as the thermal head A1 of the above embodiment.
Sixth embodiment:
fig. 14 and 15 show a thermal head according to a sixth embodiment of the present invention. Fig. 14 is an enlarged cross-sectional view of a main part of the thermal head A6 according to the present embodiment, and is a cross-sectional view similar to fig. 4. Fig. 15 is an enlarged cross-sectional view of a main portion of fig. 14 with a portion enlarged. The thermal head A6 of the present embodiment differs from the thermal head A1 of the above embodiment in the structure of the protective layer 5.
In the thermal head A6 shown in fig. 14 and 15, the protective layer 5 includes a first portion 55 and a second portion 56. The first portion 55 is in contact with the resistor layer 4, and is formed around the resistor layer 4 to cover the resistor layer 4 (the plurality of heat generating portions 41). The first portion 55 overlaps the resistor layer 4 in plan view (as viewed in the thickness direction z) and extends along the main scanning direction x. The first portion 55 is composed of the same material as the second layer 52 in the thermal head A1 of the first embodiment described above. The first portion 55 is made of, for example, amorphous glass, and contains 1 or 2 or more kinds of additive particles. The first portion 55 contains at least boron nitride particles as additive particles. In the present embodiment, the first portion 55 contains boron nitride particles and aluminum oxide particles as the additive particles. Further, the first portion 55 may be a structure not including the alumina particles.
The second portion 56 is formed in a region that does not overlap with the first portion 55 in a plan view (seen in the thickness direction z), and is formed in a wider range than the first portion 55. The second portion 56 is made of the same material as the first layer 51 in the thermal head A1 of the first embodiment described above. The second portion 56 is made of, for example, amorphous glass, and may contain, for example, an additive such as alumina particles. The second portion 56 is different from the first portion 55 in that it is free of boron nitride particles.
In the thermal head A6 of the present embodiment, the protective layer 5 (first portion 55) that can be brought into contact with a printing medium (not shown) contains boron nitride particles as additive particles. According to such a structure, boron nitride has high hardness, and the wear resistance of the protective layer 5 (the first portion 55) can be improved.
The first portion 55 overlaps the resistor layer 4 in a plan view, and the first portion 55 contains boron nitride particles. On the other hand, the boron nitride particles are not contained in the second portion 56 formed to be relatively wide-range. According to this structure, the wear resistance of the first portion 55 that can be contacted by the printing medium (not shown) can be effectively improved while suppressing the amount of boron nitride particles used. In addition, in the same range of the configuration as the thermal head A1 of the above embodiment, the same operational effects as the above embodiment can be achieved.
The thermal print head of the present invention is not limited to the above-described embodiments. The specific structure of each part of the thermal head of the present invention can be changed in various designs.
In the above embodiment, when the protective layer 5 is configured to include a plurality of layers stacked on the resistor layer 4, boron nitride particles are not included only in the layer (the second layer 52 in the above embodiment) located at the z1 side end of the thickness direction z as the uppermost layer, but the present invention is not limited thereto. When the protective layer 5 includes a plurality of layers stacked on the resistor layer 4, boron nitride particles may be contained in any one of the plurality of layers, for example, only an intermediate layer located between the lowermost layer (layer in contact with the resistor layer 4) and the uppermost layer in the thickness direction z may contain boron nitride particles.
The present invention includes embodiments described in the following supplementary notes.
And supplementary note 1.
A thermal printhead, comprising:
a substrate having a main surface facing one side in the thickness direction;
a resistor layer disposed on the main surface and having a plurality of heat generating portions arranged in the main scanning direction;
a wiring layer which is arranged on the main surface and is electrically connected to the resistor layer; and
a protective layer covering at least the resistor layer,
the protective layer comprises glass and additive particles,
the additive particles comprise boron nitride particles.
And is additionally noted as 2.
The thermal head described in the supplementary note 1,
the protective layer comprises a plurality of layers laminated over the resistor layer,
at least any one of the plurality of layers comprises the boron nitride particles.
And 3.
The thermal head described in the supplementary note 2,
the protective layer is made up of the plurality of layers including a first layer and a second layer,
the first layer is in contact with the resistor layer,
the second layer is located at one end of the plurality of layers in the thickness direction and overlaps the resistor layer when viewed in the thickness direction,
the second layer comprises the boron nitride particles.
And 4.
The thermal head described in the supplementary note 3,
the boron nitride particles are absent from the first layer.
And 5.
The thermal head described in the supplementary note 4,
the mixing ratio of the additive particles in the second layer is 5 to 80 wt%.
And 6.
The thermal head described in the supplementary note 5,
the mixing ratio of the boron nitride particles in the second layer is 10 to 30 wt%.
And 7.
The thermal head described in supplementary notes 5 or 6,
the protective layer comprises as the additive particles alumina particles,
the mixing ratio of the alumina particles in the second layer is 0 to 70% by weight.
And 8.
The thermal head according to any one of supplementary notes 4 to 7,
the thickness of the second layer is 2-6 mu m.
And 9.
The thermal head described in the attached reference 8,
the particle diameter of the boron nitride particles is equal to or less than the thickness of the second layer.
And is noted 10.
The thermal head described in the attached reference 9,
the particle size of the boron nitride particles is 0-4 mu m.
And is additionally noted 11.
The thermal head described in the attached reference 8,
the protective layer is formed by the first layer and the second layer,
the thickness of the first layer is greater than the thickness of the second layer.
And is additionally noted as 12.
The thermal head according to any one of supplementary notes 4 to 11,
the second layer is composed of lead-free glass free of lead oxide.
And (3) is additionally noted.
The thermal head according to any one of supplementary notes 4 to 12,
the softening point of the first layer is higher than the softening point of the second layer.
And is additionally denoted by 14.
The thermal head according to any one of supplementary notes 4 to 12,
the softening point of the first layer is less than the softening point of the second layer,
the wiring layer is disposed at intervals in the sub-scanning direction with respect to the resistor layer and has a common portion extending in the main scanning direction,
the second layer does not overlap the common portion as seen in the thickness direction.
And (5) is additionally noted.
The thermal head according to any one of supplementary notes 1 to 13,
further comprising a glaze layer disposed over the major face,
the resistor layer is disposed over the glaze layer.
And is additionally denoted by 16.
A thermal printer, comprising:
the thermal print head of any one of supplementary notes 1 to 14; and
a platen disposed opposite to the plurality of heat generating portions.
Claims (16)
1. A thermal printhead, comprising:
a substrate having a main surface facing one side in the thickness direction;
a resistor layer disposed on the main surface and having a plurality of heat generating portions arranged in the main scanning direction;
a wiring layer which is arranged on the main surface and is electrically connected to the resistor layer; and
a protective layer covering at least the resistor layer,
the protective layer comprises glass and additive particles,
the additive particles comprise boron nitride particles.
2. The thermal printhead of claim 1, wherein:
the protective layer comprises a plurality of layers laminated over the resistor layer,
at least any one of the plurality of layers comprises the boron nitride particles.
3. The thermal printhead of claim 2, wherein:
the protective layer is made up of the plurality of layers including a first layer and a second layer,
the first layer is in contact with the resistor layer,
the second layer is located at one end of the plurality of layers in the thickness direction and overlaps the resistor layer when viewed in the thickness direction,
the second layer comprises the boron nitride particles.
4. A thermal printhead as claimed in claim 3, wherein:
the boron nitride particles are absent from the first layer.
5. The thermal printhead of claim 4, wherein:
the mixing ratio of the additive particles in the second layer is 5 to 80 wt%.
6. The thermal printhead of claim 5, wherein:
the mixing ratio of the boron nitride particles in the second layer is 10 to 30 wt%.
7. The thermal printhead of claim 5, wherein:
the protective layer comprises as the additive particles alumina particles,
the mixing ratio of the alumina particles in the second layer is 0 to 70% by weight.
8. The thermal printhead of claim 4, wherein:
the thickness of the second layer is 2-6 mu m.
9. The thermal printhead of claim 8, wherein:
the particle diameter of the boron nitride particles is equal to or less than the thickness of the second layer.
10. The thermal printhead of claim 9, wherein:
the particle size of the boron nitride particles is 0-4 mu m.
11. The thermal printhead of claim 8, wherein:
the protective layer is formed by the first layer and the second layer,
the thickness of the first layer is greater than the thickness of the second layer.
12. The thermal printhead of claim 4, wherein:
the second layer is composed of lead-free glass free of lead oxide.
13. The thermal printhead of claim 4, wherein:
the softening point of the first layer is higher than the softening point of the second layer.
14. The thermal printhead of claim 4, wherein:
the softening point of the first layer is less than the softening point of the second layer,
the wiring layer is disposed at intervals in the sub-scanning direction with respect to the resistor layer and has a common portion extending in the main scanning direction,
the second layer does not overlap the common portion as seen in the thickness direction.
15. The thermal printhead of claim 1, wherein:
further comprising a glaze layer disposed over the major face,
the resistor layer is disposed over the glaze layer.
16. A thermal printer, comprising:
the thermal print head of any one of claims 1 to 15; and
a platen disposed opposite to the plurality of heat generating portions.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-088822 | 2022-05-31 | ||
| JP2022088822A JP2023176504A (en) | 2022-05-31 | 2022-05-31 | Thermal print head and thermal printer |
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| Publication Number | Publication Date |
|---|---|
| CN117141122A true CN117141122A (en) | 2023-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310622742.7A Pending CN117141122A (en) | 2022-05-31 | 2023-05-30 | Thermal print head and thermal printer |
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|---|---|
| JP (1) | JP2023176504A (en) |
| CN (1) | CN117141122A (en) |
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