CN117133707B - Semiconductor manipulator finger leveling device and method - Google Patents
Semiconductor manipulator finger leveling device and method Download PDFInfo
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- CN117133707B CN117133707B CN202311393694.5A CN202311393694A CN117133707B CN 117133707 B CN117133707 B CN 117133707B CN 202311393694 A CN202311393694 A CN 202311393694A CN 117133707 B CN117133707 B CN 117133707B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims abstract description 10
- 230000033001 locomotion Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000306 component Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
Abstract
The invention discloses a semiconductor manipulator finger leveling device and a method, wherein the semiconductor manipulator finger leveling device comprises a manipulator arm and a finger assembly, and a rotating ball is arranged between the manipulator arm and the finger assembly; the device also comprises a leveling screw and a locking jackscrew, wherein a disc spring is arranged between the screw head of the leveling screw and the adjacent manipulator arm or finger assembly; the leveling screws comprise a first leveling screw, a second leveling screw and a third leveling screw which are connected to form a first triangle, and the rotating ball is positioned in the range of the first triangle; penetrating a locking jackscrew by one of the manipulator arm and the finger assembly, wherein the tail end of the locking jackscrew is in contact with or connected with the other one of the manipulator arm and the finger assembly; the locking jackscrew comprises a first locking jackscrew, a second locking jackscrew and a third locking jackscrew which are connected to form a second triangle, and the rotating ball is positioned in the range of the second triangle. The invention can finish quick leveling through fewer steps and ensure that the fingers do not shake during movement.
Description
Technical Field
The invention belongs to the technical field of semiconductor equipment, and particularly relates to a device and a method for leveling fingers of a semiconductor manipulator.
Background
The robot is an important core component in the semiconductor transmission equipment, and is responsible for the effect of materials such as a transfer wafer, the part of the robot, which is directly contacted with the wafer, is a blade (a sheet-shaped supporting structure for supporting the wafer, also called a finger), the levelness of the part is critical to the reliability of the transfer wafer, and the blade is usually designed as a movable part because of the levelness error of the whole platform, the installation error of the robot and the like, and the blade needs to be independently installed on a robot ARM (also called a robot ARM) and has a leveling function. During installation and leveling, the angle between the manipulator arm and the horizontal plane is fixed, and the upper surface of the finger for supporting the wafer is adjusted to be horizontal through the leveling function.
The conventional structural scheme, for example, the chinese patent application publication No. CN114657543a, can finish fine adjustment of the blade angle, but during adjustment, the relation between the screws and the wedge blocks at four positions needs to be adjusted, and mutual interference is easy to occur between the four positions, for example, after the pitch angle is adjusted, when the yaw angle is adjusted, the pitch angle is changed, so that the adjustment process is relatively complex and the adjustment time is relatively long.
Disclosure of Invention
Based on the technical problems in the prior art, the invention provides the device and the method for leveling the fingers of the semiconductor manipulator, which solve the problems of high leveling difficulty and low efficiency in the prior art, realize rapid leveling through fewer steps and ensure that the fingers do not shake in the motion process.
According to the technical scheme, the invention provides a semiconductor manipulator finger leveling device, which comprises a manipulator arm and a finger assembly, wherein the manipulator arm and the finger assembly are stacked, a gap is reserved between the manipulator arm and the finger assembly, and a rotating ball is arranged between the manipulator arm and the finger assembly; the device also comprises a leveling screw, wherein the leveling screw connects the manipulator arm and the finger assembly, and a disc spring is arranged between the screw head of the leveling screw and the adjacent manipulator arm or finger assembly; the leveling screws comprise a first leveling screw, a second leveling screw and a third leveling screw, the connecting lines among the first leveling screw, the second leveling screw and the third leveling screw form a first triangle, and the rotating ball is positioned in the range of the first triangle; the locking jackscrew penetrates into a gap between the mechanical arm and the finger assembly from one of the mechanical arm and the finger assembly, and the tail end of the locking jackscrew is in contact with or connected with the other one of the mechanical arm and the finger assembly; the locking jackscrew is including first locking jackscrew, second locking jackscrew, third locking jackscrew, and the line between first locking jackscrew, second locking jackscrew, the third locking jackscrew constitutes the second triangle-shaped, and the swivel ball is located the within range of second triangle-shaped.
Preferably, the first leveling screw and the swivel ball are disposed along a central axis of the finger assembly; the second leveling screw and the third leveling screw are respectively positioned at two sides of the central axis of the finger assembly.
Further, the first locking jackscrew is located on one side, facing the rotating ball, beside the first leveling screw, the second locking jackscrew is located on one side, close to the central axis of the finger assembly, beside the second leveling screw, and the third locking jackscrew is located on one side, close to the central axis of the finger assembly, beside the third leveling screw.
Further, the connecting lines of the second leveling screw, the second locking jackscrew, the third locking jackscrew and the third leveling screw are straight lines and perpendicular to the central axis of the finger assembly.
Further, the end of the locking jackscrew is hemispherical.
Further, a first spherical groove is formed in the manipulator arm, a second spherical groove is formed in the finger assembly, openings of the first spherical groove and the second spherical groove are opposite, and the first spherical groove and the second spherical groove are in contact with the rotating ball.
Further, the finger assembly comprises a finger, a finger fixed bottom plate and a finger fixed pressing plate, wherein the finger is positioned between the finger fixed bottom plate and the finger fixed pressing plate, and the finger, the finger fixed bottom plate and the finger fixed pressing plate are connected through a finger fixed screw; the finger fixing bottom plate is connected with the manipulator arm.
In one embodiment, the overlapped parts of the manipulator arm and the finger assembly are plate-shaped; the manipulator arm is provided with a screw unthreaded hole for penetrating the leveling screw, and the finger component is provided with a screw hole for penetrating and screwing the leveling screw; the mechanical arm is also provided with a jackscrew hole which is used for penetrating and being in threaded connection with the locking jackscrew.
Further, one side of the screw light hole facing outwards is provided with a disc spring accommodating groove, and the disc spring is positioned in the disc spring accommodating groove.
According to the technical scheme of the invention, the invention also provides a semiconductor manipulator finger leveling method, which adopts the semiconductor manipulator finger leveling device to level and comprises the following steps:
the initial state is that the tail ends of the first locking jackscrew, the second locking jackscrew and the third locking jackscrew are all in an untruncated state;
step S1, screwing and adjusting a first leveling screw, so as to adjust the pitching angle of the finger assembly to be horizontal;
s2, screwing and adjusting the first locking jackscrew, and propping up the first locking jackscrew under the condition that the pitching angle of the finger assembly is unchanged;
step S3, screwing and adjusting the second leveling screw and/or the third leveling screw, so as to adjust the deflection angle of the finger assembly to be horizontal;
and S4, screwing and adjusting the second locking jackscrew and the third locking jackscrew, and tightly propping the second locking jackscrew and the third locking jackscrew under the condition that the deflection angle of the finger assembly is unchanged.
Compared with the prior art, the invention has the following beneficial technical effects:
1. the semiconductor manipulator finger leveling device and the method adopt a mode of arranging three leveling screws, three locking screws and a rotating ball in the middle, solve the problem that the prior art adopts screw adjustment to affect each other, and realize the effect of quickly leveling the finger.
2. According to the semiconductor manipulator finger leveling device and method, the disc springs are arranged at the bottoms of the screw heads, so that the finger assembly can be enabled to be adjusted in a tiny movement mode, and the pressing force of the leveling screw is always available during adjustment.
3. According to the semiconductor manipulator finger leveling device and method, the rotating balls are arranged in the middle positions of the three leveling screws, and when any one screw is adjusted, the finger assembly always changes on the plane limited by the rotating balls, in other words rotates around the rotating balls, so that the finger assembly can be quickly leveled by matching the three leveling screws.
4. In the device and the method for leveling the finger of the semiconductor manipulator, one leveling screw is preferably adopted to adjust the pitching of the finger, the other two leveling screws are used to adjust the deflection of the finger, the angles in the two directions can be separated and leveled respectively without mutual influence, and the operation is simpler and more convenient.
5. The device and the method for leveling the finger of the semiconductor manipulator adopt the locking jackscrews corresponding to the leveling screws and are used for locking the adjusting mechanism parts formed by the leveling screws, the rotating balls and the like, so that the upward and downward forces are simultaneously applied to the finger assembly in cooperation with the leveling screws, the finger assembly cannot shake in the process of being driven by the manipulator arm to move, materials such as wafers can be stably supported, and the stability and the high efficiency of the semiconductor transmission and treatment process are ensured.
Drawings
FIG. 1 is a schematic view of a manipulator arm and finger assembly according to an embodiment of the present invention.
FIG. 2 is a schematic view of the embodiment of FIG. 1 where the robot arm and finger assembly are connected.
FIG. 3 is a schematic view of a joint between a robot arm and a finger assembly according to another embodiment of the present invention.
Fig. 4 is a partial perspective cross-sectional schematic view of the structure of fig. 2 taken along a central axis of the finger assembly.
Reference numerals in the drawings illustrate:
1. a manipulator arm;
2. a finger assembly;
3. a spin ball;
4. a disc spring;
5. a first leveling screw;
6. a second leveling screw;
7. a third leveling screw;
8. a first locking jackscrew;
9. a second locking jackscrew;
10. a third locking jackscrew;
11. a first spherical groove;
12. a second spherical groove;
13. a finger;
14. a finger fixing base plate;
15. a finger-fixed pressure plate;
16. a finger fixing screw;
17. screw unthreaded holes;
18. screw holes;
19. a jackscrew screw hole;
20. disc spring holding groove.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings. Embodiments of the invention and features of the embodiments may be combined with each other without conflict.
It should be noted that the terms "first," "second," and the like herein are merely used for distinguishing between different devices, modules, or units and not for limiting the order or interdependence of the functions performed by such devices, modules, or units.
It should be noted that references to "one", "a plurality" and "a plurality" in this disclosure are intended to be illustrative rather than limiting, and those skilled in the art will appreciate that "one or more" is intended to be construed as "one or more" unless the context clearly indicates otherwise.
The invention provides a device and a method for leveling fingers of a semiconductor manipulator, which solve the problems of high installation and leveling difficulty and low efficiency in the prior art, realize the rapid leveling of the fingers of the manipulator through fewer steps, ensure that the fingers do not shake in the motion process, improve the installation and debugging efficiency and effect of semiconductor equipment, and improve the stability of the semiconductor transmission process.
Referring to fig. 1 to 4, a semiconductor manipulator finger leveling device according to an embodiment of the present invention includes a manipulator arm 1 and a finger assembly 2 located at an end of the manipulator arm 1, wherein the manipulator arm 1 and the finger assembly 2 are stacked, a gap is formed between the manipulator arm 1 and the finger assembly 2, and a rotating ball 3 is disposed between the manipulator arm 1 and the finger assembly 2, so that the finger assembly 2 (and/or the manipulator arm 1) can rotate around the rotating ball 3, and further, the levelness of an upper surface of a finger 13 for supporting a material such as a wafer in the finger assembly 2 is adjusted.
The mechanical arm is characterized by further comprising a leveling screw, wherein the leveling screw connects the mechanical arm 1 with the finger assembly 2; more specifically, the manipulator arm 1 and the finger assembly 2 are in a substantially horizontal state, and the leveling screw is disposed substantially vertically, and is screwed into the manipulator arm 1 and the finger assembly 2 substantially vertically and forms a connected whole. The leveling screw comprises a screw rod body with external threads and a screw head, wherein the screw head is positioned at one end close to the outer side, the size of the screw head is larger than that of the screw rod body, and the screw head is provided with a groove with a shape like a hexagon or a straight line so as to be convenient for screwing. A disc spring 4 is arranged between the screw head of the leveling screw and the adjacent component (namely the manipulator arm 1 or the finger assembly 2), and the leveling screw is arranged on the manipulator arm 1 or the finger assembly 2 and can be designed according to specific situations. The leveling screws are used to tighten the manipulator arm 1 and the finger assembly 2 relatively. The leveling screws at least comprise a first leveling screw 5, a second leveling screw 6 and a third leveling screw 7, the connecting lines among the first leveling screw 5, the second leveling screw 6 and the third leveling screw 7 form a first triangle, and the rotating ball 3 is positioned in the range of the first triangle.
The device also comprises a locking jackscrew, wherein the locking jackscrew penetrates into a gap between the mechanical arm 1 and the finger assembly 2 from one of the mechanical arm 1 and the finger assembly 2, and the locking jackscrew is arranged on the mechanical arm 1 or the finger assembly 2 and can be designed according to specific conditions; the end of the locking jackscrew is in contact with or connected with the other of the manipulator arm 1 and the finger assembly 2, so that a jacking force along the opposite and opposite direction of the manipulator arm 1 and the finger assembly 2 is formed, and the gap distance between the manipulator arm 1 and the finger assembly 2 can be jointly limited in cooperation with the tensioning force formed by the leveling screw. The locking jackscrew at least comprises a first locking jackscrew 8, a second locking jackscrew 9 and a third locking jackscrew 10, the connecting lines among the first locking jackscrew 8, the second locking jackscrew 9 and the third locking jackscrew 10 form a second triangle, and the rotating ball 3 is positioned in the range of the second triangle.
In summary, the main principle and the inventive concept of the present solution are to establish a connection between a plurality of leveling screws by using a manner of determining a plane by three points and forming a lever by using a rotating ball 3 between the three points, which is not a relatively difficult and undesirable interaction as in the prior art solution, but a slight movement of the finger assembly 2 is enabled under the action of the disc spring 4, and a pressing force of the leveling screws is always present during leveling, and any one of the first leveling screw 5, the second leveling screw 6 and the third leveling screw 7 is independently adjusted, the finger assembly 2 is rotated around the rotating ball 3, and the rotating leveling mechanism is locked by locking a jackscrew, so that the purpose of leveling can be achieved by fewer adjustment steps and the stability of the finger assembly 2 after leveling is ensured.
In the preferred embodiment, the first leveling screw 5 and the swivel ball 3 are disposed along the central axis of the finger assembly 2, and the second leveling screw 6 and the third leveling screw 7 are respectively disposed at both sides of the central axis of the finger assembly 2. The finger assembly 2 (and the part of the manipulator arm 1 connected with the finger assembly 2) is generally in a strip shape, the middle symmetry axis of which the left side and the right side are basically symmetrical is the central axis of the invention, and the central axis is consistent with the length direction of the finger assembly 2 (and the part of the manipulator arm 1 connected with the finger assembly 2). So that the finger pitch can be adjusted based on the heights of the first leveling screw 5 and the swivel ball 3, and the finger yaw can be adjusted based on the heights of the second leveling screw 6, the third leveling screw 7, and the swivel ball 3.
Further preferably, as shown in fig. 2 or 3, the first locking jackscrew 8 is located beside the first leveling screw 5 towards the side of the swivel ball 3, the second locking jackscrew 9 is located beside the second leveling screw 6 near the center axis of the finger assembly 2, and the third locking jackscrew 10 is located beside the third leveling screw 7 near the center axis of the finger assembly 2. As shown in fig. 4, the connecting lines of the first leveling screw 5, the first locking jackscrew 8 and the rotating ball 3 are straight lines and are located in the central axis of the finger assembly 2, so that when the first leveling screw 5 and the first locking jackscrew 8 adjust the pitching angle and are locked, the pitching angle of the connecting lines of the first leveling screw 5, the first locking jackscrew 8 and the rotating ball 3 is also determined, and when other leveling screws and locking jackscrews are adjusted, only the left-right deflection (tilting) angle of the finger assembly 2 can be guaranteed to be changed without affecting pitching. More specifically, for example, the connecting lines of the second leveling screw 6, the second locking jackscrew 9, the third locking jackscrew 10 and the third leveling screw 7 are straight lines and perpendicular to the central axis of the finger assembly 2, and the distance between each locking jackscrew and the corresponding leveling screw is relatively close, so that the influence on the pitching angle during the deflection adjustment can be further avoided.
More specifically, as shown in fig. 1, the finger assembly 2 includes a finger 13, a finger fixing base plate 14 and a finger fixing pressure plate 15, wherein the finger 13 is clamped between the finger fixing base plate 14 and the finger fixing pressure plate 15, and the finger 13, the finger fixing base plate 14 and the finger fixing pressure plate 15 are connected and locked by a finger fixing screw 16. The other end of the finger fixing base plate 14 is connected with the manipulator arm 1 through the structure having the leveling function. The manipulator arm 1 and the finger assembly 2 (more specifically, the finger fixing base plate 14) are each in a flat plate shape. Alternatively, the robot arm 1 is located above the finger-securing base plate 14, and the finger-securing base plate 14 has a step lower than the rest in this position, so that the upper surfaces of the finger-securing base plate 14 and the robot arm 1 are substantially flush after mounting.
Further, in the embodiment, the leveling screw and the locking jackscrew are installed through the manipulator arm 1 and are adjusted by screwing from the upper part and penetrate from top to bottom; it will be appreciated that other mounting arrangements and means of the leveling screw and locking jackscrew may be used, such as having an angle of inclination in the direction of penetration, one or more of which penetrate from bottom to top, etc. Referring to fig. 4, taking this position as an example, a screw light hole 17 for penetrating a leveling screw (first leveling screw 5 in the drawing) is formed in the manipulator arm 1, and a screw hole 18 for penetrating and screwing the leveling screw (first leveling screw 5 in the drawing) is formed in the finger assembly 2 (more specifically, the finger fixing base plate 14); therefore, the lower end of the leveling screw and the screw hole 18 can be adjusted and positioned through threads, and the screw head part at the upper end of the leveling screw tightens the manipulator arm 1 and the finger assembly 2 so that the gap at the position cannot be enlarged.
The outward side of the screw light hole 17 has a disc spring receiving groove 20, and the disc spring 4 (and at least a portion of the screw head of the leveling screw) is positioned within the disc spring receiving groove 20, thereby facilitating installation and positioning of the disc spring 4. The disc spring is also called a disc spring and a washer spring, is annular and is sleeved outside the screw rod body of the leveling screw; the lower part of the disc spring 4 is abutted against the manipulator arm 1, and the upper part of the disc spring 4 is abutted against the lower surface of the screw head of the leveling screw. The inside diameter of the screw unthreaded hole 17 is slightly larger than the outside diameter of the leveling screw, and the disc spring 4 can elastically deform to different degrees at different positions, so that when the leveling screw is perpendicular to the finger assembly 2, the mechanical arm 1 is not parallel to the finger assembly 2 and has a certain inclination angle, the disc spring 4 can be simultaneously attached to the mechanical arm 1 (more specifically, the bottom surface of the disc spring accommodating groove 20) and the screw head of the leveling screw, thereby realizing stable connection.
The mechanical arm 1 is further provided with a jackscrew hole 19 for penetrating and screwing a locking jackscrew (a first locking jackscrew 8 in the drawing), and after the locking jackscrew is adjusted to a jacking state, the tail end of the locking jackscrew is abutted against the finger assembly 2, so that a gap at the position cannot be reduced. The upper end of the locking jackscrew is provided with a groove in a shape like a straight line so as to be convenient to screw, and the tail end of the locking jackscrew is hemispherical, so that stable jacking effect can be ensured within a certain inclination angle range.
A first spherical groove 11 is formed in the mechanical arm 1, a second spherical groove 12 is formed in the finger assembly 2, the openings of the first spherical groove 11 and the second spherical groove 12 are opposite, and the first spherical groove 11 and the second spherical groove 12 are in contact with the rotating ball 3 in a fitting manner. The surfaces of the first spherical surface groove 11, the second spherical surface groove 12, and the rotating ball 3 are smooth, so that the rotating ball can rotate with almost no frictional resistance. Or alternatively, the first spherical groove 11 and the second spherical groove 12 are formed by a groove body and a sliding washer or a bearing type component in the groove body. In other possible embodiments, a ball hinge structure is adopted at the rotating ball 3, and the rotating ball 3 is connected with the manipulator arm 1 and/or the finger assembly 2 while the manipulator arm 1 and the finger assembly 2 can rotate around the rotating ball 3.
Based on the preferred semiconductor manipulator finger leveling device (such as the embodiment shown in fig. 1, 2 and 4), the invention provides a semiconductor manipulator finger leveling method, which comprises the following steps:
the initial state is: the tail ends of the first locking jackscrew 8, the second locking jackscrew 9 and the third locking jackscrew 10 are all in an untruncated state; an untastened condition, such as no locking jackscrew installed or no contact between the end of the locking jackscrew and the finger assembly 2, with a spacing sufficient to meet the adjustment requirements; the first leveling screw 5, the second leveling screw 6 and the third leveling screw 7 are used for connecting the manipulator arm 1 and the finger assembly 2 and pressing the disc spring 4, and the disc spring 4 has a certain basically circumferential uniform deformation (for example, after the screw head screwed to the leveling screw contacts with the disc spring 4, the three leveling screws are screwed in for a plurality of circles, and all the three leveling screws are treated similarly).
Step S1, screwing and adjusting a first leveling screw 5, so as to adjust the pitching angle of the finger assembly 2 to be horizontal; the leveling may be performed, for example, by placing a level on the finger assembly 2.
Step S2, screwing and adjusting the first locking jackscrew 8, and tightly propping the first locking jackscrew 8 under the condition that the pitching angle of the finger assembly 2 is unchanged; at this time, the pitch angle of the finger assembly 2 is locked under the restriction of the first leveling screw 5 and the first locking jack 8 (and the swivel ball 3), and the finger assembly 2 can adjust only the yaw (right and left inclination angle).
Step S3, screwing and adjusting the second leveling screw 6 and/or the third leveling screw 7, thereby adjusting the deflection angle of the finger assembly 2 to be horizontal; more specifically, for example, according to the case indicated by the level, it is possible to complete the leveling by adjusting the leveling screw on one side, and if the leveling is difficult, for example, due to the elastic limit of the disc spring 4 or the like, it is necessary to adjust both the second leveling screw 6 and the third leveling screw 7.
In step S4, the second locking jack 9 and the third locking jack 10 are screwed and adjusted, and the second locking jack 9 and the third locking jack 10 are tightly pressed under the condition that the deflection angle (and the pitching angle) of the finger assembly 2 is unchanged. And (5) finishing leveling.
In summary, the scheme adopts the mode of three leveling screws, three locking screws and a rotating ball arranged in the middle, wherein one leveling screw is arranged on the central axis of the manipulator, one leveling screw is arranged on each of two sides of the central axis, the three leveling screws form a triangle, and locking jackscrews are correspondingly arranged beside the leveling screws, so that the problem that the adjustment of the screws is influenced in the prior art is solved, and the effect of quickly leveling fingers is realized; the bottom of the head part of the screw is provided with the disc spring, so that the finger assembly can be enabled to be subjected to tiny movement adjustment, the pressing force of the leveling screw is always present during adjustment, and the finger assembly cannot shake in the process of being driven to move by the mechanical arm after leveling; when any one screw is adjusted, the finger assembly always changes on the plane limited by the rotary ball, so that the finger assembly can be quickly adjusted by matching with three leveling screws; preferably, one leveling screw is used for adjusting the pitching of the finger, the other two leveling screws are used for adjusting the deflection of the finger, and the angles in the two directions can be separated and leveled respectively without mutual influence, so that the operation is simpler and more convenient. The scheme is not only suitable for vacuum manipulators, but also suitable for atmospheric manipulators and the like.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. The semiconductor manipulator finger leveling device is characterized by comprising a manipulator arm (1) and a finger assembly (2), wherein the manipulator arm (1) and the finger assembly (2) are stacked, a gap is reserved between the manipulator arm (1) and the finger assembly (2), and a rotating ball (3) is arranged between the manipulator arm (1) and the finger assembly (2);
the device also comprises a leveling screw, wherein the leveling screw connects the manipulator arm (1) with the finger assembly (2), and a disc spring (4) is arranged between the screw head of the leveling screw and the adjacent manipulator arm (1) or the finger assembly (2); the leveling screws comprise a first leveling screw (5), a second leveling screw (6) and a third leveling screw (7), a first triangle is formed by connecting wires among the first leveling screw (5), the second leveling screw (6) and the third leveling screw (7), and the rotating ball (3) is positioned in the range of the first triangle;
the device also comprises a locking jackscrew, wherein the locking jackscrew penetrates into a gap between the mechanical arm (1) and the finger assembly (2) from one of the mechanical arm (1) and the finger assembly (2), and the tail end of the locking jackscrew is in conflict or connection with the other one of the mechanical arm (1) and the finger assembly (2); the locking jackscrew comprises a first locking jackscrew (8), a second locking jackscrew (9) and a third locking jackscrew (10), a second triangle is formed by connecting lines among the first locking jackscrew (8), the second locking jackscrew (9) and the third locking jackscrew (10), and the rotating ball (3) is positioned in the range of the second triangle;
the first leveling screw (5) and the rotary ball (3) are arranged along the central axis of the finger assembly (2); the second leveling screw (6) and the third leveling screw (7) are respectively positioned at two sides of the central axis of the finger assembly (2).
2. The semiconductor manipulator finger leveling device according to claim 1, characterized in that the first locking jackscrew (8) is located beside the first leveling screw (5) towards the side of the swivel ball (3), the second locking jackscrew (9) is located beside the second leveling screw (6) near the centre axis of the finger assembly (2), and the third locking jackscrew (10) is located beside the third leveling screw (7) near the centre axis of the finger assembly (2).
3. The semiconductor manipulator finger leveling device according to claim 2, wherein the lines of the second leveling screw (6), the second locking jackscrew (9), the third locking jackscrew (10) and the third leveling screw (7) are straight lines and perpendicular to the central axis of the finger assembly (2).
4. A semiconductor robot finger leveling device in accordance with any one of claims 1-3 wherein the locking jack is hemispherical at its distal end.
5. A semiconductor manipulator finger levelling device according to any of claims 1-3, characterized in that a first spherical groove (11) is provided in the manipulator arm (1) and a second spherical groove (12) is provided in the finger assembly (2), the first spherical groove (11) and the second spherical groove (12) being open opposite, the first spherical groove (11) and the second spherical groove (12) both being in contact with the swivel ball (3).
6. A semiconductor manipulator finger levelling device according to any of claims 1-3, characterized in that the finger assembly (2) comprises a finger (13), a finger fixation base (14) and a finger fixation pressure plate (15), the finger (13) being located between the finger fixation base (14) and the finger fixation pressure plate (15), the finger (13), the finger fixation base (14) and the finger fixation pressure plate (15) being connected by a finger fixation screw (16); the finger fixing bottom plate (14) is connected with the manipulator arm (1).
7. A semiconductor manipulator finger leveling device according to any one of claims 1-3, wherein the portions of the manipulator arm (1) and the finger assembly (2) that are disposed one above the other are plate-shaped; a screw light hole (17) for penetrating the leveling screw is formed in the mechanical arm (1), and a screw hole (18) for penetrating and connecting the leveling screw in a threaded manner is formed in the finger assembly (2); the mechanical arm (1) is also provided with a jackscrew screw hole (19) which is used for penetrating and being in threaded connection with the locking jackscrew.
8. The semiconductor manipulator finger leveling device according to claim 7, wherein the outward side of the screw light hole (17) is provided with a disc spring accommodating groove (20), and the disc spring (4) is positioned in the disc spring accommodating groove (20).
9. A method for leveling a finger of a semiconductor manipulator, characterized in that the leveling is performed by using the device for leveling a finger of a semiconductor manipulator according to claim 2 or 3, comprising the steps of:
the initial state is that the tail ends of the first locking jackscrew (8), the second locking jackscrew (9) and the third locking jackscrew (10) are in an untruncated state;
step S1, screwing and adjusting a first leveling screw (5), so as to adjust the pitching angle of the finger assembly (2) to be horizontal;
s2, screwing and adjusting the first locking jackscrew (8), and tightly propping the first locking jackscrew (8) under the condition that the pitching angle of the finger assembly (2) is unchanged;
step S3, screwing and adjusting the second leveling screw (6) and/or the third leveling screw (7), so as to adjust the deflection angle of the finger assembly (2) to be horizontal;
and S4, screwing and adjusting the second locking jackscrew (9) and the third locking jackscrew (10), and tightly pushing the second locking jackscrew (9) and the third locking jackscrew (10) under the condition that the deflection angle of the finger assembly (2) is unchanged.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311393694.5A CN117133707B (en) | 2023-10-26 | 2023-10-26 | Semiconductor manipulator finger leveling device and method |
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| CN202311393694.5A CN117133707B (en) | 2023-10-26 | 2023-10-26 | Semiconductor manipulator finger leveling device and method |
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| CN117133707B true CN117133707B (en) | 2023-12-26 |
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| JP2000120679A (en) * | 1998-10-21 | 2000-04-25 | Enomoto Co Ltd | Mechanism for finely adjusting clearance between mechanical members |
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| CN107611069A (en) * | 2016-07-12 | 2018-01-19 | 北京北方华创微电子装备有限公司 | Manipulator and semiconductor processing equipment |
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| CN218631990U (en) * | 2022-10-18 | 2023-03-14 | 江苏京创先进电子科技有限公司 | Leveling structure, mechanical arm and wafer processing equipment |
| CN116872185A (en) * | 2023-08-18 | 2023-10-13 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Leveling mechanism and wafer transmission manipulator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022043558A (en) * | 2020-09-04 | 2022-03-16 | 川崎重工業株式会社 | Robot and hand posture adjustment method |
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| JP2000120679A (en) * | 1998-10-21 | 2000-04-25 | Enomoto Co Ltd | Mechanism for finely adjusting clearance between mechanical members |
| JP2004311821A (en) * | 2003-04-09 | 2004-11-04 | Tokyo Electron Ltd | Substrate processing equipment |
| KR20090000925A (en) * | 2007-06-29 | 2009-01-08 | 세메스 주식회사 | Leveling apparatus |
| CN107611069A (en) * | 2016-07-12 | 2018-01-19 | 北京北方华创微电子装备有限公司 | Manipulator and semiconductor processing equipment |
| CN114657543A (en) * | 2022-03-21 | 2022-06-24 | 盛吉盛半导体科技(无锡)有限公司 | Blade assembly structure convenient to adjust |
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| CN117133707A (en) | 2023-11-28 |
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