CN117119279A - Camera sensor assembling method, mounting equipment, camera module and image acquisition equipment - Google Patents
Camera sensor assembling method, mounting equipment, camera module and image acquisition equipment Download PDFInfo
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- CN117119279A CN117119279A CN202311073908.0A CN202311073908A CN117119279A CN 117119279 A CN117119279 A CN 117119279A CN 202311073908 A CN202311073908 A CN 202311073908A CN 117119279 A CN117119279 A CN 117119279A
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000003466 welding Methods 0.000 claims abstract description 15
- 239000011521 glass Substances 0.000 claims description 19
- 238000005476 soldering Methods 0.000 claims description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 37
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 37
- 239000000919 ceramic Substances 0.000 description 17
- 238000003384 imaging method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
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- Engineering & Computer Science (AREA)
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- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention discloses a camera sensor assembly method, a camera sensor assembly device, a camera module and a picture taking device. The method is suitable for the sensor which is not packaged by COB, and comprises the following steps: welding the sensor and the PCB so that the photosensitive surface of the sensor is parallel to the PCB; the PCB board is pre-installed to the inside of the front cover of the camera, and an adjusting element is arranged between the PCB board and the inside of the front cover of the camera. Measuring a point coordinate set of the front end face of the camera by taking the position of the measuring equipment as an origin, and calculating the point coordinate set of an ideal plane; measuring a point coordinate set of a photosensitive surface of the sensor; a set of point coordinates of a fixed point location of the adjusting element is measured. Obtaining dihedral angles of an ideal plane and a sensor photosurface and the distance between a fixed point position and the intersection line of the two planes through calculation; based on the distance and dihedral angle, the adjusting element continuously outputs the corresponding adjusting quantity, so that the sensor photosurface is adjusted to the position of an ideal plane, and the parallelism and the distance of the sensor photosurface and the front end surface are accurately adjusted.
Description
Technical Field
The invention relates to the technical field of sensor cameras, in particular to a camera sensor assembly method, a camera module, a camera mounting device and a picture taking device.
Background
In the industrial camera adjustment process, the photosensitive plane of the sensor and the front end surface of the structural member are required to be ensured to be parallel as much as possible, and meanwhile, the distance between the front end surface of the structural member and the photosensitive surface of the sensor is required to be ensured to be within a tolerance range, so that the imaging blurring of the camera is avoided, and the analysis of an imaging target is influenced. The above problems can be divided into two parts: 1. the parallelism between the photosensitive plane of the sensor and the front end surface of the structural member is regulated, and when the parallelism between the photosensitive plane of the sensor and the front end surface of the structural member meets the requirement, the imaging of the camera cannot occur the local blurring condition; 2. the distance between the sensor photosurface and the front end surface is adjusted to enable the distance between the sensor photosurface and the front end surface to be as close as possible to a design value. However, since a protective glass layer is provided on the photosensitive surface, it is difficult to directly ensure the assembly index by a physical structure. In the prior art, the gasket is used for adjustment, and the actual adjustment distance cannot reach the theoretical value due to the fact that the screw has a pressing force on the gasket, so that the adjustment effect is reduced.
Disclosure of Invention
The camera sensor assembling method, the mounting equipment, the camera module and the image acquisition equipment provided by the invention can at least solve one of the technical problems.
In order to achieve the above purpose, the present invention proposes the following technical solutions:
a camera sensor assembly method, the sensor is not encapsulated by COB, the surface of the sensitive surface of the sensor is provided with a glass surface, comprising: welding the sensor and the PCB so that the photosensitive surface of the sensor is parallel to the PCB;
the PCB is pre-installed on the inner side of the front cover of the camera, and an adjusting element is arranged between the PCB and the inner side of the front cover of the camera;
measuring a point coordinate set of the front end face of the camera by taking the position of the measuring equipment as an origin, and calculating the point coordinate set of an ideal plane; measuring a point coordinate set of a photosensitive surface of the sensor; fitting a plane equation of the ideal plane and the sensor photosurface, and calculating a dihedral angle and an intersecting line equation of the ideal plane and the sensor photosurface;
measuring a point coordinate set of a fixed point position of the adjusting element, and calculating the distance between the point coordinate set of the fixed point position and the intersecting line; based on the distance and the dihedral angle, the position of the PCB is adjusted, so that the parallelism and the distance between the light sensitive surface of the sensor and the front end surface of the camera are kept.
Further, the point coordinate set of the ideal plane is the point coordinate set of the front end face of the camera, and the back intercept of the camera is overlapped.
Further, the welding sensor and the PCB board, make the sensor photosurface parallel with the PCB board, include: placing a glass face of a sensor on a first plane, the glass face being parallel to the first plane; the PCB is placed on the second plane, and the PCB is parallel to the second plane; the first plane is parallel to the second plane, and the PCB is parallel to the photosensitive surface of the sensor.
Further, an elastic gasket is arranged between the sensor and the PCB, and the elastic gasket is arranged on the outer side of the pin of the sensor, so that the sensor is tightly pressed on the first plane, and the parallelism between the PCB and the sensitive surface of the sensor is kept.
Further, the adjusting element continuously outputs an adjustment amount corresponding to the dihedral angle, the distance.
Further, the fixing point of the adjusting element comprises the step of selecting a plurality of measuring points as the fixing point of the adjusting element when the front cover of the camera contacts the contact end face of the adjusting element.
Further, the method further comprises the following steps: after the parallelism and the distance between the light sensitive surface of the sensor and the front end surface of the camera are determined, the PCB and the front cover of the camera are fixed, and the assembly is completed.
The present invention also proposes a mounting apparatus using the camera sensor assembly method as described above, comprising:
the base is provided with a first plane which is used for placing the glass surface of the sensor;
the support column is arranged outside the first plane and used for supporting the PCB, so that the distance between the lower surface of the PCB and the first plane is not less than 25% of the thickness of the elastic gasket; the support column is provided with a second plane which is used for placing a PCB;
wherein the first plane is parallel to the second plane.
The present invention also proposes a camera module including:
the front cover of the camera is provided with a through hole, so that light rays penetrate through the through hole and enter the image sensor; the inner side is provided with a mounting column for mounting the PCB;
and the adjusting element is arranged between the mounting column and the PCB, is fixedly connected and electrically connected with the PCB and is used for adjusting the position of the PCB, and further adjusting the parallelism and the distance between the light sensitive surface of the sensor and the front end surface of the camera.
The invention also provides a graph acquisition device, which comprises: a camera module as described above.
The camera sensor assembling method provided by the invention is suitable for the camera sensor which is not packaged by the COB. According to the assembly method provided by the invention, the sensor is welded on the PCB to ensure the parallelism between the sensor light sensing surface and the PCB, then the PCB welded with the sensor is pre-installed on the inner side of the front cover of the camera, the ideal plane for installing the PCB is calculated by measuring the point coordinate sets of the sensor light sensing surface and the front end surface of the camera, the intersection line and the dihedral angle of the ideal plane and the sensor light sensing surface are calculated, the adjustment quantity of the parallelism is calculated, the piezoelectric ceramic is arranged, the corresponding voltage is output according to the adjustment quantity, the high-precision adjustment is realized, the PCB is adjusted to the position where the ideal plane is located, the PCB is parallel to the front end surface of the camera, and the parallelism and the distance adjustment of the sensor light sensing surface and the front end surface are further completed.
Drawings
FIG. 1 is a schematic diagram of a camera sensor weld of the present invention;
FIG. 2 is a cross-sectional view of FIG. 1;
FIG. 3 is a schematic structural view of the welding tool of the present invention;
FIG. 4 is a schematic view of a sensor installation of the present invention;
FIG. 5 is a side view of FIG. 3;
FIG. 6 is a front view of FIG. 3;
fig. 7 is a computational schematic of a camera sensor of the present invention.
In the figure: 1-a PCB board; 2-a sensor; 201-a photosurface; 202-glass surface; 3-an elastic washer; 4-welding a tool; 401-a base; 40101-coarse positioning surface; 402-supporting columns; 40201—a support surface; 403-a tooling fixture; 5-a camera front cover; 501-front end face; 502-a through hole; 503-mounting posts; 504-camera mount; 6-piezoelectric ceramics.
Description of the embodiments
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention.
The invention provides a camera sensor assembly method, which is suitable for a sensor without COB (chip on Board) package, and comprises the following steps:
welding the sensor 2 and the PCB 1 so that the sensor photosurface 201 is parallel to the PCB 1;
the method specifically comprises the following steps: placing a glass face 202 of the sensor on a first plane, the glass face 202 being parallel to the first plane; the PCB 1 is placed on the second plane, and the PCB 1 is parallel to the second plane; the first plane is parallel to the second plane, and the PCB board 1 is parallel to the sensor photosurface 201.
Meanwhile, an elastic gasket 3 is arranged between the sensor 2 and the PCB 1, and the elastic gasket 3 is arranged on the outer side of the sensor pin, so that the sensor 2 is tightly pressed on the first plane, and the parallelism between the PCB 1 and the sensor photosurface 201 is maintained.
The invention also provides a mounting device, which uses the camera sensor assembly method to realize the welding of the sensor 2 and the PCB 1, so that the photosensitive surface 201 of the sensor is parallel to the PCB 1.
The mounting apparatus includes:
a base provided with a first plane for placing the sensor glass face 202;
the support column is arranged outside the first plane and is used for supporting the PCB 1, so that the distance between the lower surface of the PCB and the first plane is kept to be not less than 25% of the thickness of the elastic gasket 3; the support column is provided with a second plane, and the second plane is used for placing the PCB 1;
wherein the first plane is parallel to the second plane.
The mounting device in this embodiment is a welding fixture 4.
In this embodiment, a schematic diagram of soldering between the PCB board 1 and the sensor 2 is shown in fig. 1 and 2.
A glass layer is arranged on a photosensitive surface 201 of the sensor 2 and is a glass surface 202; a plurality of pins are arranged on the other surface of the sensor 2, a plurality of hole sites opposite to the pins are arranged on the PCB 1, an elastic gasket 3 is arranged between the PCB 1 and the sensor 2, and the gasket is positioned on the outer side of the sensor pins. The gasket is annular in this embodiment.
In order to keep parallelism between the sensor light sensing surface 201 and the PCB board 1, the sensor 2 and the PCB board 1 are welded and fixed, and the embodiment further includes a welding tool 4, see fig. 3.
The welding fixture 4 comprises a base 401 and a support column 402, wherein the base 401 is used for placing the sensor 2, the end surface of the base 401, which is in contact with the sensor glass surface 202, is a rough adjustment positioning surface 40101, the rough adjustment positioning surface 40101 is a machining surface, and the parallelism of the rough adjustment positioning surface 40101 meets the requirement of the sensor 2, and is used as the rough adjustment positioning surface 40101 for welding the sensor 2 and the PCB 1. In this embodiment, the first plane is a coarse positioning surface 40101, and the second plane is a supporting surface 40201.
The support column 402 is arranged at the outer side of the coarse adjustment positioning surface 40101 and is used for placing and supporting the PCB 1, and the lower surface of the PCB 1 corresponds to the supporting surface 40201 of the support column 402 and keeps a certain distance; meanwhile, the support surface 40201 is also parallel to the coarse positioning surface 40101; the upper surface of the PCB 1 is provided with a fixture fixing piece 403 for fixing the PCB 1 and the support column 402.
The support column 402 is also used for controlling the height between the PCB 1 and the sensor 2, so that the distance between the lower surface of the PCB 1 and the coarse positioning surface 40101 is not less than 25% of the thickness of the elastic washer 3, and when the PCB 1 is fixed on the support surface 40201, enough downward pressure is applied to the sensor 2, so that the sensor 2 cannot be pulled up from the coarse positioning surface 40101 due to solder cooling in the welding process.
The using method of the tool comprises the following steps: the sensor glass surface 202 is placed on the rough positioning surface 40101, an elastic gasket 3 is placed around the sensor pin area, the PCB board 1 is placed on the elastic gasket 3, and the sensor pin is inserted into a corresponding hole on the PCB board 1. Subsequently, the fixture fixing member 403 is mounted on the upper surface of the PCB board 1, so that the fixture fixing member 403 passes through the corresponding mounting hole of the PCB board 1 and is mounted on the support column 402. In this embodiment, the elastic washer 3 is in a compressed state, so that the sensor 2 is tightly pressed on the rough adjusting positioning surface 40101, and the parallelism imbalance between the glass surface 202 and the PCB board 1 caused by the cooling of the flux in the welding process is avoided.
Through the auxiliary effect of the welding tool, the sensor 2 can be welded on the PCB 1, and the parallelism of the photosensitive surface 201 of the sensor and the PCB 1 is ensured.
The PCB 1 is pre-installed on the inner side of the front cover of the camera, and an adjusting element is arranged between the PCB 1 and the inner side of the front cover of the camera. The adjusting element in this embodiment is a piezoelectric ceramic 6.
As shown in fig. 4 to 6, the soldered PCB board 1 and the sensor 2 are mounted on the camera front cover 5, and the position of the PCB board 1 is adjusted so that the camera front end surface 501 and the sensor light-sensitive surface 201 are kept parallel and at a certain distance. The camera front face 501 is a plane on which the outer side of the camera front cover 5 is located.
In this embodiment, the front cover 5 of the camera is provided with a through hole 502, and the through hole 502 is opposite to the photosensitive surface 201 of the sensor, so that external light can enter the sensor 2 through the through hole 502; the inner side of the camera front cover 5 is also provided with a plurality of mounting posts 503, and the mounting posts 503 are provided with mounting holes corresponding to the mounting holes of the PCB 1, so that the fixture fixing piece 403 passes through the mounting holes of the PCB and the mounting posts to fixedly connect the PCB 1 with the camera front cover 5.
The contact part of the PCB 1 and the mounting post 503 is provided with piezoelectric ceramics 6, the piezoelectric ceramics 6 is fixedly connected with the PCB 1, and the piezoelectric ceramics 6 are electrically connected with the PCB 1. Preferably, the piezoelectric ceramic 6 is annular in this embodiment.
Taking the position of the measuring equipment as an origin, measuring a point coordinate set of the front end face 501 of the camera, and calculating the point coordinate set of an ideal plane;
measuring a point coordinate set of the photosensitive surface 201 of the sensor; fitting a plane equation of the ideal plane and the sensor photosurface 201, and calculating a dihedral angle and an intersecting line equation of the ideal plane and the sensor photosurface 201;
measuring a point coordinate set of a fixed point position of the adjusting element, and calculating the distance between the point coordinate set of the fixed point position and the intersecting line; wherein, a plurality of measuring points are selected as fixed point positions of the adjusting element on the contact end surface of the camera front cover 5, which contacts the adjusting element; based on the distance and dihedral angle, the parallelism and distance between the sensor photosurface 201 and the camera front surface 501 are adjusted.
Wherein the adjusting element continuously outputs an adjustment amount corresponding to the dihedral angle and the distance.
Specifically, in the present embodiment, the parallelism between the sensor light sensing surface 201 and the camera front end surface 501, and the coordinates of the piezoelectric ceramic 6 are measured by the spectral confocal apparatus; the height difference to be adjusted is calculated, the piezoelectric ceramic 6 is fed back, and the voltage is applied through the piezoelectric ceramic 6, so that the parallelism between the sensor light sensing surface 201 and the front end surface 501 of the camera and the distance between the sensor light sensing surface and the front end surface 501 of the camera are adjusted.
As shown in fig. 7, the parallelism of the sensor light sensing surface 201 and the camera front end surface 501, and the calculation process of the distance therebetween are specifically as follows:
taking the position of the spectrum confocal equipment as an origin, taking a point on the edges of four sides of the photosensitive surface 201 below the sensor glass surface 202, and recording the coordinates as follows:in the same manner, four points are also taken on the camera front face 501, and the coordinate set thereof is noted as:
and if the rear intercept of the camera is D, the point set on the plane where the ideal position of the photosensitive plane is located is as follows:
plane S where fitting point set P is located 1 The method comprises the following steps: s is S 1 ：a 1 x+b 1 y+c 1 z+d 1 ＝0；
Plane S in which fitting point set Q' is located 2 The method comprises the following steps: s is S 2 ：a 2 x+b 2 y+c 2 z+d 2 ＝0；
Parallel plane S 1 And plane S 2 Plane equation of (2) calculating plane S 1 And S is 2 Is denoted as θ; calculation plane S 1 And S is 2 Is defined by intersection line L:
the mounting post contacts one end of the piezoelectric ceramic 6 and is used as the contact end surface of the mounting post; selecting a plurality of measuring points on the contact end face of the mounting column as fixed points of the piezoelectric ceramic 6, and measuring two-dimensional coordinates of the fixed points as a set
The distance of the coordinate set M from the straight line L is calculated and expressed as set = { (d) i ) I=1, 2,3,4}; the distance represented by the set d is positive and negative, and the judgment method (positive and negative judgment) of the element symbol in the set d is as follows: substituting coordinate points in the coordinate set M into the plane S 1 And S is 2 The Z value on the corresponding plane is calculated and the difference is recorded as a setThe element symbol corresponding to the subscript in set d is consistent with the corresponding element symbol in set Z.
The height difference to be adjusted by the piezoelectric ceramic 6 is set d' = { (d) at each fixed point position i *tanθ)|i＝1，2，3，4}；
Given that the ratio of the displacement to the voltage of the piezoelectric ceramic 6 is K, the voltage at each fixed point can be obtainedThe magnitude of the voltage u= { (d) required for the electroceramic 6 i *tanθ/K)|i＝1，2，3，4}；
The piezoelectric ceramic 6 applies corresponding voltage to the PCB 1, and the parallelism and distance adjustment can be permanently completed. After the voltage output by the piezoelectric ceramic 6 is adjusted, the position of the PCB board 1 is changed, so that the position of the sensor photosurface 201 is the position of the ideal plane, that is, the distance between the sensor photosurface 201 and the front end surface 501 of the camera is the rear intercept D of the camera.
After the parallelism and the distance between the sensor light sensing surface 201 and the camera front cover 5 are determined, the camera fixing piece 504 on the mounting post 503 is screwed, and the PCB 1 and the camera front cover 5 are fixed, so that the assembly is completed.
The present invention also proposes a camera module including:
a camera front cover 5 provided with a through hole so that light passes through the through hole and enters the sensor 2; the inner side is provided with a mounting post 503 for mounting the PCB 1;
the adjusting element is arranged between the mounting column 503 and the PCB 1, is fixedly connected and electrically connected with the PCB 1 and is used for adjusting the position of the PCB 1 so as to keep parallelism and distance between the sensor light sensing surface 201 and the front end surface 501 of the camera; the adjusting element continuously outputs corresponding adjusting quantity which meets the adjusting requirement. In this embodiment, the adjustment element is a piezoelectric ceramic 6.
A PCB board 1 mounted on the mounting posts 503 of the camera front cover 5; the sensor 2 is welded on the PCB 1, parallelism is kept between the PCB 1 and the sensor photosurface 201, and parallelism and distance are kept between the sensor photosurface 201 and the front end surface 501 of the camera.
The invention also provides a graph acquisition device, which comprises: a camera module as described above.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The camera sensor assembling method is characterized in that the sensor is not packaged by COB, and the photosensitive surface of the sensor is provided with a glass surface, and the camera sensor assembling method comprises the following steps:
welding the sensor and the PCB so that the photosensitive surface of the sensor is parallel to the PCB;
the PCB is pre-installed on the inner side of the front cover of the camera, and an adjusting element is arranged between the PCB and the inner side of the front cover of the camera;
measuring a point coordinate set of the front end face of the camera by taking the position of the measuring equipment as an origin, and calculating the point coordinate set of an ideal plane; measuring a point coordinate set of a photosensitive surface of the sensor; fitting a plane equation of the ideal plane and the sensor photosurface, and calculating a dihedral angle and an intersecting line equation of the ideal plane and the sensor photosurface;
measuring a point coordinate set of a fixed point position of the adjusting element, and calculating the distance between the point coordinate set of the fixed point position and the intersecting line; based on the distance and the dihedral angle, the position of the PCB is adjusted, so that the parallelism and the distance between the light sensitive surface of the sensor and the front end surface of the camera are kept.
2. The method of assembling a camera sensor according to claim 1, wherein the set of point coordinates of the ideal plane is a set of point coordinates of a front face of the camera superimposed with a camera back intercept.
3. The camera sensor assembly method of claim 1, wherein the soldering the sensor and the PCB such that the sensor photosurface is parallel to the PCB comprises: placing a glass face of a sensor on a first plane, the glass face being parallel to the first plane; the PCB is placed on the second plane, and the PCB is parallel to the second plane; the first plane is parallel to the second plane, and the PCB is parallel to the photosensitive surface of the sensor.
4. A camera sensor assembly method according to claim 3, wherein an elastic washer is disposed between the sensor and the PCB, and the elastic washer is disposed outside the sensor pin, so that the sensor is pressed against the first plane, and parallelism between the PCB and the light sensing surface of the sensor is maintained.
5. The camera sensor assembling method according to claim 1, wherein the adjusting member continuously outputs the adjustment amount corresponding to the dihedral angle, the distance.
6. The method for assembling a camera sensor according to claim 1, wherein the fixing points of the adjusting element include selecting a plurality of measuring points as the fixing points of the adjusting element at the contact end surface of the camera front cover contacting the adjusting element.
7. The camera sensor assembly method of claim 1, further comprising: after the parallelism and the distance between the light sensitive surface of the sensor and the front end surface of the camera are determined, the PCB and the front cover of the camera are fixed, and the assembly is completed.
8. A mounting apparatus using the camera sensor mounting method according to claim 4, comprising:
the base is provided with a first plane which is used for placing the glass surface of the sensor;
the support column is arranged outside the first plane and used for supporting the PCB, so that the distance between the lower surface of the PCB and the first plane is not less than 25% of the thickness of the elastic gasket; the support column is provided with a second plane which is used for placing a PCB;
wherein the first plane is parallel to the second plane.
9. A camera module, comprising:
the front cover of the camera is provided with a through hole, so that light rays penetrate through the through hole and enter the image sensor; the inner side is provided with a mounting column for mounting the PCB;
and the adjusting element is arranged between the mounting column and the PCB, is fixedly connected and electrically connected with the PCB and is used for adjusting the position of the PCB, and further adjusting the parallelism and the distance between the light sensitive surface of the sensor and the front end surface of the camera.
10. A picture taking apparatus, comprising: the camera module of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311073908.0A CN117119279A (en) | 2023-08-24 | 2023-08-24 | Camera sensor assembling method, mounting equipment, camera module and image acquisition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311073908.0A CN117119279A (en) | 2023-08-24 | 2023-08-24 | Camera sensor assembling method, mounting equipment, camera module and image acquisition equipment |
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| Publication Number | Publication Date |
|---|---|
| CN117119279A true CN117119279A (en) | 2023-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311073908.0A Pending CN117119279A (en) | 2023-08-24 | 2023-08-24 | Camera sensor assembling method, mounting equipment, camera module and image acquisition equipment |
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| Country | Link |
|---|---|
| CN (1) | CN117119279A (en) |
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- 2023-08-24 CN CN202311073908.0A patent/CN117119279A/en active Pending
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