CN117096094A - 一种适用于多规格amb基板同时烧结的夹具装置 - Google Patents
一种适用于多规格amb基板同时烧结的夹具装置 Download PDFInfo
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Abstract
本发明涉及一种适用于多规格AMB基板同时烧结的夹具装置，其包括安装底板，用于作为基板承载机构，所述安装底板内设有至少一个底板凹槽；AMB基板，用于对芯片提供支撑、散热以及保护，每个底板凹槽内均安设有一块所述AMB基板；金属罩，用于保护AMB基板边缘，所述金属罩覆盖于安装底板上层，且所述金属罩正对每个底板凹槽位置分别设有金属罩窗口；薄膜，用于封闭底板凹槽内的AMB基板及芯片，所述薄膜覆盖于金属罩上层；锁紧环，用于夹紧并固定薄膜，所述锁紧环位于薄膜上层，且所述锁紧环紧贴薄膜边缘，所述锁紧环通过紧固件将薄膜与金属罩压至安装底板；该装置实现多规格AMB基板同时烧结，提高了夹具通用性，提高烧结效率。
Description
技术领域
本发明涉及芯片封装技术领域，具体涉及一种适用于多规格AMB基板同时烧结的夹具装置。
背景技术
大功率MOSFET、IGBT器件不仅是新能源电动车的核心部件，也是制造各类高压大容量电力换流和控制装备的核心器件，已成为支撑智能电网发展的基础器件，贯穿于新能源电力汇集与并网、交直流输电与组网、电力灵活应用的全过程。而上述器件的功率密度越高，产生的热量就越多，对高效散热的需求也就越大，高效散热是电力电子器件在一定环境温度条件下能长期正常工作的保证。但现有电力电子器件失效中，约55％的失效是由热引起，由振动、潮湿、尘埃引起的失效则分别占20％、10％和6％。因此对于大功率器件封装实现高效散热非常重要。而要解决这一问题，基板的选择是关键。
目前现有IGBT封装主要采用DBC（直接覆铜）陶瓷基板，因为DBC陶瓷基板具有金属层厚度大、载流能力强、耐高温性能好、结合强度高、耐热冲击性好及可靠性高的特点。但是，DBC陶瓷基板在高温服役过程中，往往会因为铜和陶瓷之间的热膨胀系数差异大而产生较大的热应力，从而导致铜层从陶瓷表面剥离，进而导致器件失效。因此在DBC工艺技术上进一步发展出AMB（Active Metal Brazing，活性金属钎焊）工艺技术。
AMB陶瓷基板利用含少量活性元素的活性金属焊料实现铜箔与陶瓷基片间的焊接。活性焊料通过在普通金属焊料中添加Ti、Zr、Hf、V、Nb或Ta等稀土元素制备，由于稀土元素具有高活性，可提高焊料熔化后对陶瓷的润湿性，使陶瓷表面无需金属化就可与金属实现焊接。相比之下，AMB技术具有更优的热导率、铜层结合力和可靠性，可大幅提高陶瓷基板可靠性，更适合大功率大电流应用场景，在汽车、航天、轨道交通、工业电网等领域广泛应用。
但现有AMB陶瓷基板在烧结作业中，需要用对应夹具来加以固定，而现有的夹具设计往往只能针对一款产品（同一款产品数量取决于产品的尺寸）进行固定，当需要对多种AMB陶瓷基板进行烧结操作时，则需要设计多款固定夹具，并重复拆装，造成烧结步骤多次重复、烧结周期长、成本高等问题。
因此，急需设计一款适用于多规格AMB基板同时烧结的夹具装置，大幅提高夹具兼容性，进而缩短烧结周期，提高烧结效率，为实现高温、大功率、高散热、高可靠性的封装设计目标提供支撑。
发明内容
为克服上述现有技术的不足，本发明提供了一种适用于多规格AMB基板同时烧结的夹具装置，具体采用如下技术方案：
一种适用于多规格AMB基板同时烧结的夹具装置，其包括：
安装底板，用于作为基板承载机构，所述安装底板内设有至少一个底板凹槽；
AMB基板，用于对芯片提供支撑、散热以及保护，每个底板凹槽内均安设有一块所述AMB基板；
金属罩，用于保护AMB基板边缘，所述金属罩覆盖于安装底板上层，且所述金属罩正对每个底板凹槽位置分别设有金属罩窗口；
薄膜，用于封闭底板凹槽内的AMB基板及芯片，所述薄膜覆盖于金属罩上层；
锁紧环，用于夹紧并固定薄膜，所述锁紧环位于薄膜上层，且所述锁紧环紧贴薄膜边缘，所述锁紧环通过紧固件将薄膜与金属罩压至安装底板。
优选为：所述安装底板内底板凹槽的四角位置设有第一气道口。
优选为：所述底板凹槽中至少一侧边设有第二气道口。
优选为：所述安装底板上设有气体管路，所述气体管路连通第一气道口和第二气道口，所述气体管路用于烧结过程中向底板凹槽以及薄膜填充或抽取保护气体。
优选为：所述金属罩的金属罩窗口的尺寸小于底板凹槽尺寸。
优选为：所述紧固件采用螺钉，所述安装底板上设有多个螺纹孔，所述锁紧环、薄膜以及金属罩中对应螺纹孔位置均设有过孔，所述螺钉穿过锁紧环、薄膜以及金属罩后连接至安装底板的螺纹孔，通过拧紧螺钉，将锁紧环、薄膜、金属罩以及安装底板夹紧固定。
优选为：所述安装底板的边缘位置均匀分布有多个端部带有凸缘的销钉，所述锁紧环上设有卡接销钉凸缘的条形孔，且所述条形孔的一端设有用于销钉凸缘穿过的销钉过孔，当锁紧环与安装底板进行锁紧时，所述安装底板的销钉通过销钉过孔穿过锁紧环，旋转锁紧环一定角度后，所述安装底板的销钉的凸缘卡接至条形孔的边缘。
优选为：所述薄膜采用聚四氟乙烯薄膜或聚全氟乙烯共聚四氟乙烯薄膜。
优选的：所述安装底板采用四边呈弧形的菱形底板，且所述螺纹孔位于菱形底板的四角位置，其中一个对角位置安设有固定耳，所述固定耳用于对安装底板定位并固定，以便于烧结作业。
优选的：所述安装底板采用圆形底板，所述螺纹孔位于圆形底板的边缘，且多个所述螺纹孔环绕圆心呈中心对称设置。
有益效果
本发明的技术方案获得了下列有益效果：
本发明的夹具装置通过在安装底板内设置匹配不同AMB基板的底板凹槽，以实现对AMB基板定位，同时利用同一安装底板可同时安装多种类型的AMB基板，实现多规格AMB基板同时烧结，提高了夹具通用性，提高烧结效率；在烧结作业中通过薄膜和锁紧环可实现对基板防护，并且拆卸十分便捷，同时在烧结过程中通过底板凹槽填充保护气体以及利用金属罩保护基板边缘，提高了夹具使用寿命。
附图说明
图1为本发明中适用于多规格AMB基板同时烧结的夹具装置的装配结构示意图。
图2为本发明中实施例1一种多规格AMB基板同时烧结的夹具装置的结构示意图。
图3为本发明中实施例1一种多规格AMB基板同时烧结的夹具装置的结构示意图。
图4为本发明中AMB基板与安装底座的装配状态示意图。
附图中附图标记的具体含义：
1-安装底板；101-底板凹槽；102-气体管路；2-AMB基板；3-芯片；4-金属罩；401-金属罩窗口；5-薄膜；6-锁紧环；7-固定耳；8-条形孔；9-销钉；10-紧固件。
具体实施方式
下面结合附图对本发明作进一步描述。以下实施例仅用于更加清楚地说明本发明的技术方案，而不能以此来限制本发明的保护范围。应该指出，以下详细说明都是示例性的，旨在对本申请提供进一步的说明。
除非另有指明，本文使用的所有技术和科学术语具有与本申请所属技术领域的普通技术人员通常理解的相同含义。需要注意的是，这里所使用的术语仅是为了描述具体实施方式，而非意图限制根据本申请的示例性实施方式。如在这里所使用的，除非上下文另外明确指出，否则单数形式也意图包括复数形式，此外，还应当理解的是，当在本说明书中使用术语“包含”和/或“包括”时，其指明存在特征、步骤、操作、器件、组件和/或它们的组合。
实施例1：
结合图1、图2及图4所示，本实施例1中具体公开有一种适用于多规格AMB基板同时烧结的夹具装置，其包括安装底板1，用于作为基板承载机构，所述安装底板1内设有一个底板凹槽101；需说明的是，本实施例1中所述安装底板1采用四边呈弧形的菱形底板，且所述菱形底板的四角位置分别设有螺纹孔，其中一个对角位置安设有固定耳7，所述固定耳7用于对安装底板1定位并固定，以便于烧结作业。
进一步的，所述安装底板1内底板凹槽101的四角位置设有第一气道口。并且在所述底板凹槽101中至少一侧边设有第二气道口。所述安装底板1上则设有气体管路102，所述气体管路102连通第一气道口和第二气道口，所述气体管路102用于烧结过程中向底板凹槽101以及薄膜5填充或抽取保护气体。由于气体管路102位于安装底板1上，因此在向底板凹槽101内通保护气体过程中，部分气体可从气体管路102渗入薄膜5与安装底板1的间隙，在烧结过程中，由于薄膜5下方填充保护气体，可避免薄膜5被损坏，同时保护气体也可保护AMB基板2损毁。
AMB基板2，用于对芯片3提供支撑、散热以及保护，所述底板凹槽101内安设有所述AMB基板2；本实施例中所述安装底板1虽仅设有一个底板凹槽101，但该底板凹槽101具有兼容性，参见下表1所示。
结合上述表1，本实施例1针对厚度0.8mm的AMB基板所设计的底板凹槽和金属罩尺寸，可兼容厚度为0.68mm-1.1mm的AMB基板；而针对厚度1.6mm的AMB基板所设计的底板凹槽和金属罩尺寸，可兼容厚度为1.3mm-1.6mm的AMB基板；针对厚度2.6mm的AMB基板所设计的底板凹槽和金属罩尺寸，可兼容厚度为2.3mm-2.6mm的AMB基板，因此本实施例1中的夹具装置可在AMB基板2高度差不大的前提下，大幅提高夹具兼容性，进而减少夹具成本，同时本实施例中安装底板1通过固定耳7可快速定位并安装至烧结设备内，提高烧结效率。
金属罩4，用于保护AMB基板2边缘，所述金属罩4覆盖于安装底板1上层，且所述金属罩4正对每个底板凹槽101位置分别设有金属罩窗口401；其中本实施例1中所述金属罩4的金属罩窗口401的尺寸小于底板凹槽101尺寸，该金属罩4可覆盖安装底板1上的气体管路102，形成气体流动通道，同时该金属罩4可覆盖AMB基板2上无需烧结的区域，经在烧结位置设置金属罩窗口401，进而对AMB基板2进行保护。
薄膜5，用于封闭底板凹槽101内的AMB基板2及芯片3，所述薄膜5覆盖于金属罩4上层，优选的所述薄膜5采用聚四氟乙烯薄膜或聚全氟乙烯共聚四氟乙烯薄膜；
锁紧环6，用于夹紧并固定薄膜5，所述锁紧环6位于薄膜5上层，且所述锁紧环6紧贴薄膜5边缘，所述锁紧环6通过紧固件10将薄膜5与金属罩4压至安装底板1。更具体的，本实施例1中所述紧固件10采用螺钉，所述安装底板1上设有多个螺纹孔，所述锁紧环6、薄膜5以及金属罩4中对应螺纹孔位置均设有过孔，所述螺钉穿过锁紧环6、薄膜5以及金属罩4后连接至安装底板1的螺纹孔，通过拧紧螺钉，将锁紧环6、薄膜5、金属罩4以及安装底板1夹紧固定。
在烧结作业过程中，首先将芯片3放置于AMB基板2上，并将AMB基板2放置在安装底板1的底板凹槽101内；随后装上金属罩4以保护产品的边缘；然后选择聚四氟乙烯或聚全氟乙烯共聚四氟乙烯（PFA）薄膜5，并将其覆盖金属罩4上层；之后用锁紧环6固定薄膜5；最后将安装底板1定位到烧结设备内。
更进一步的，本实施例1中所述安装底板1的边缘位置均匀分布有多个端部带有凸缘的销钉9，所述锁紧环6上设有卡接销钉9凸缘的条形孔8，且所述条形孔8的一端设有用于销钉9凸缘穿过的销钉过孔，当锁紧环6与安装底板1进行锁紧时，所述安装底板1的销钉9通过销钉过孔穿过锁紧环6，旋转锁紧环6一定角度后，所述安装底板1的销钉9的凸缘卡接至条形孔8的边缘。本实施例1中通过锁紧环6实现了对夹具内AMB基板2完全固定，并且在使用过程中拆装极为便捷，仅需设置少量螺钉固定，同时结合销钉9凸缘与条形孔8卡接可对夹具整体边缘进行压紧固定，拆卸时也仅需轻微转动锁紧环6，便可将夹具装置松开，实现AMB基板2快速更换。
实施例2：
结合图1、图3和图4所示，本实施例2中页公开有一种适用于多规格AMB基板同时烧结的夹具装置，其包括安装底板1，用于作为基板承载机构，所述安装底板1内设有多个底板凹槽101；需说明的是，本实施例2中所述安装底板1采用圆形底板，所述螺纹孔位于圆形底板的边缘，且多个所述螺纹孔环绕圆心呈中心对称设置。进一步，本实施例2中所述安装底板1上设有四种规格的底板凹槽101，且每个规格的底板凹槽101设有多个，在烧结过程中可将多个不同规格的AMB基板2分别放入对应底板凹槽101内，即可在一次烧结作业过程中同时烧结多个AMB基板2。
进一步的，所述安装底板1内底板凹槽101的四角位置设有第一气道口。并且在所述底板凹槽101中至少一侧边设有第二气道口。所述安装底板1上则设有气体管路102，所述气体管路102连通第一气道口和第二气道口，所述气体管路102用于烧结过程中向底板凹槽101以及薄膜5填充或抽取保护气体。由于气体管路102位于安装底板1上，因此在向底板凹槽101内通保护气体过程中，部分气体可从气体管路102渗入薄膜5与安装底板1的间隙，在烧结过程中，由于薄膜5下方填充保护气体，可避免薄膜5被损坏，同时保护气体也可保护AMB基板2损毁。
AMB基板2，用于对芯片3提供支撑、散热以及保护，每个底板凹槽101内分别安设有一块所述AMB基板2；本实施例中所述安装底板1设有四种规格的底板凹槽101，参见下表2所示。
结合上述表2，本实施例2设有四种规格的底板凹槽101，其对应可烧结至少四种规格的AMB基板2，同时在不同底板凹槽101内设置气体管路102进行保护，需要说明的是，本实施例2中气体管路102布局可使保护气体均匀填充底部凹槽即可，一般底部凹槽尺寸越大，其气体管路102数量及气道口数量越多。基于上述本实施例2中的夹具装置可在同一安装底板1上同时烧结不同规格尺寸的AMB基板2，大幅提高夹具兼容性，进而减少夹具成本。
金属罩4，用于保护AMB基板2边缘，所述金属罩4覆盖于安装底板1上层，且所述金属罩4正对每个底板凹槽101位置分别设有金属罩窗口401；其中本实施例2中所述金属罩4的金属罩窗口401的尺寸小于底板凹槽101尺寸，该金属罩4可覆盖安装底板1上的气体管路102，形成气体流动通道，同时该金属罩4可覆盖AMB基板2上无需烧结的区域，经在烧结位置设置金属罩窗口401，进而对AMB基板2进行保护。
薄膜5，用于封闭底板凹槽101内的AMB基板2及芯片3，所述薄膜5覆盖于金属罩4上层，优选的所述薄膜5采用聚四氟乙烯薄膜5或聚全氟乙烯共聚四氟乙烯薄膜5；
锁紧环6，用于夹紧并固定薄膜5，所述锁紧环6位于薄膜5上层，且所述锁紧环6紧贴薄膜5边缘，所述锁紧环6通过紧固件10将薄膜5与金属罩4压至安装底板1。更具体的，本实施例2中所述紧固件10采用螺钉，所述安装底板1上设有多个螺纹孔，所述锁紧环6、薄膜5以及金属罩4中对应螺纹孔位置均设有过孔，所述螺钉穿过锁紧环6、薄膜5以及金属罩4后连接至安装底板1的螺纹孔，通过拧紧螺钉，将锁紧环6、薄膜5、金属罩4以及安装底板1夹紧固定。
更进一步的，本实施例2中所述安装底板1的边缘位置均匀分布有多个端部带有凸缘的销钉9，所述锁紧环6上设有卡接销钉9凸缘的条形孔8，且所述条形孔8的一端设有用于销钉9凸缘穿过的销钉过孔，当锁紧环6与安装底板1进行锁紧时，所述安装底板1的销钉9通过销钉过孔穿过锁紧环6，旋转锁紧环6一定角度后，所述安装底板1的销钉9的凸缘卡接至条形孔8的边缘。本实施例2中通过锁紧环6实现了对夹具内AMB基板2完全固定，并且在使用过程中拆装极为便捷，仅需设置少量螺钉固定，同时结合销钉9凸缘与条形孔8卡接可对夹具整体边缘进行压紧固定，拆卸时也仅需轻微转动锁紧环6，便可将夹具装置松开，实现AMB基板2快速更换。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和变形，这些改进和变形也应视为本发明的保护范围。
Claims (10)
1.一种适用于多规格AMB基板同时烧结的夹具装置，其特征在于，包括：
安装底板，用于作为基板承载机构，所述安装底板内设有至少一个底板凹槽；
AMB基板，用于对芯片提供支撑、散热以及保护，每个底板凹槽内均安设有一块所述AMB基板；
金属罩，用于保护AMB基板边缘，所述金属罩覆盖于安装底板上层，且所述金属罩正对每个底板凹槽位置分别设有金属罩窗口；
薄膜，用于封闭底板凹槽内的AMB基板及芯片，所述薄膜覆盖于金属罩上层；
锁紧环，用于夹紧并固定薄膜，所述锁紧环位于薄膜上层，且所述锁紧环紧贴薄膜边缘，所述锁紧环通过紧固件将薄膜与金属罩压至安装底板。
2.根据权利要求1所述的夹具装置，其特征为：所述安装底板内底板凹槽的四角位置设有第一气道口。
3.根据权利要求2所述的夹具装置，其特征为：所述底板凹槽中至少一侧边设有第二气道口。
4.根据权利要求3所述的夹具装置，其特征为：所述安装底板上设有气体管路，所述气体管路连通第一气道口和第二气道口，所述气体管路用于烧结过程中向底板凹槽以及薄膜填充或抽取保护气体。
5.根据权利要求1所述的夹具装置，其特征为：所述金属罩的金属罩窗口的尺寸小于底板凹槽尺寸。
6.根据权利要求1所述的夹具装置，其特征为：所述紧固件采用螺钉，所述安装底板上设有多个螺纹孔，所述锁紧环、薄膜以及金属罩中对应螺纹孔位置均设有过孔，所述螺钉穿过锁紧环、薄膜以及金属罩后连接至安装底板的螺纹孔，通过拧紧螺钉，将锁紧环、薄膜、金属罩以及安装底板夹紧固定。
7.根据权利要求6所述的夹具装置，其特征为：所述安装底板的边缘位置均匀分布有多个端部带有凸缘的销钉，所述锁紧环上设有卡接销钉凸缘的条形孔，且所述条形孔的一端设有用于销钉凸缘穿过的销钉过孔，当锁紧环与安装底板进行锁紧时，所述安装底板的销钉通过销钉过孔穿过锁紧环，旋转锁紧环一定角度后，所述安装底板的销钉的凸缘卡接至条形孔的边缘。
8.根据权利要求1所述的夹具装置，其特征为：所述薄膜采用聚四氟乙烯薄膜或聚全氟乙烯共聚四氟乙烯薄膜。
9.根据权利要求7所述的夹具装置，其特征为：所述安装底板采用四边呈弧形的菱形底板，且所述螺纹孔位于菱形底板的四角位置，其中一个对角位置安设有固定耳，所述固定耳用于对安装底板定位并固定，以便于烧结作业。
10.根据权利要求7所述的夹具装置，其特征为：所述安装底板采用圆形底板，所述螺纹孔位于圆形底板的边缘，且多个所述螺纹孔环绕圆心呈中心对称设置。
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| CN109671663A (zh) * | 2018-11-29 | 2019-04-23 | 贵州振华风光半导体有限公司 | 一种大功率混合集成电路器件的烧结方法 |
| JP7199768B1 (ja) * | 2022-07-29 | 2023-01-06 | アサヒ・エンジニアリング株式会社 | シンタリング治具、シンタリング金型、ピックアップユニット、フィルム処理装置、シンタリング装置およびシンタリング方法 |
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