CN117038536A - Purification treatment method - Google Patents
Purification treatment method Download PDFInfo
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- CN117038536A CN117038536A CN202311025448.4A CN202311025448A CN117038536A CN 117038536 A CN117038536 A CN 117038536A CN 202311025448 A CN202311025448 A CN 202311025448A CN 117038536 A CN117038536 A CN 117038536A
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- gas
- container
- gas supply
- flow rate
- supply port
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000000746 purification Methods 0.000 title claims description 51
- 238000010926 purge Methods 0.000 claims abstract description 157
- 238000007599 discharging Methods 0.000 claims description 10
- 239000007789 gas Substances 0.000 description 322
- 238000001514 detection method Methods 0.000 description 30
- 238000003672 processing method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to a purifying treatment method, which uses a purifying treatment device to carry out purifying treatment on a container, and comprises the following steps: (a) mounting the container on the support table; (b) Supplying the purge gas to the gas supply port at a first flow rate by the gas supply unit; and (c) supplying the purge gas to the gas supply port by the gas supply unit at a second flow rate smaller than the first flow rate when a condition for changing the flow rate of the purge gas to be supplied to the gas supply port is satisfied, the condition for changing the flow rate of the purge gas to be supplied to the gas supply port being a preset time, and (c) supplying the purge gas to the gas supply port at the second flow rate if the preset time elapses after the purge gas is supplied to the gas supply port at the first flow rate.
Description
The present application is a divisional application with the application date 2019, 07, 10, 201910622128.4 and the name of "purification device and purification method".
Technical Field
The present application relates to a purifying apparatus and a purifying method for purifying a container accommodating an object.
Background
In a process for manufacturing various electronic/electric devices such as a semiconductor device and a display device, a stocker configured to store wafers, substrates, semiconductor elements, and the like (hereinafter, referred to as "objects") in a predetermined atmosphere and to perform a predetermined process on the objects is used.
The stocker has a plurality of compartments partitioned by a plurality of partitions, and objects are stored in the compartments in a state of being stored in the container. The interior of the container forms a predetermined environment and atmosphere, and thereby the object can be treated in the predetermined environment and atmosphere.
In such a process, a process of supplying purge gas to the inside of the container and discharging the purge gas from the container to perform a purge process on the inside of the container is performed, whereby a certain cleanliness of the inside of the container can be maintained.
In such a purge treatment, it is important to smoothly circulate the purge gas in the container and smoothly discharge the purge gas from the container. Therefore, there is a need for development of a technique capable of smoothly circulating the purge gas in the container and smoothly discharging the purge gas from the container.
Prior art literature
Patent literature
Korean patent No. 0-1647923
Disclosure of Invention
The present application has been made to solve the above-described technical problems of the prior art, and an object of the present application is to provide a purification treatment apparatus capable of smoothly supplying a purification gas into a container housing an object and smoothly discharging the gas in the container to the outside.
A purification treatment method according to an embodiment of the present application for achieving the above object performs a purification treatment on a container using a purification treatment apparatus including: a support base for mounting the container in which the object is stored; a gas supply port provided in the support base, the gas supply port communicating with a gas inflow hole of the container when the container is mounted on the support base; a gas discharge port provided in the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base; and a gas supply unit connected to the gas supply port to supply a purge gas to the gas supply port, the purge processing method including the steps of: (a) mounting the container on the support table; (b) Supplying the purge gas to the gas supply port at a first flow rate by the gas supply unit; and (c) supplying the purge gas to the gas supply port by the gas supply unit at a second flow rate smaller than the first flow rate when a condition for changing the flow rate of the purge gas to be supplied to the gas supply port is satisfied, the condition for changing the flow rate of the purge gas to be supplied to the gas supply port being a preset time, and (c) supplying the purge gas to the gas supply port at the second flow rate if the preset time elapses after the purge gas is supplied to the gas supply port at the first flow rate.
A purification treatment method according to an embodiment of the present application for achieving the above object performs a purification treatment on a container using a purification treatment apparatus including: a support base for mounting the container in which the object is stored; a gas supply port provided in the support base, the gas supply port communicating with a gas inflow hole of the container when the container is mounted on the support base; a gas discharge port provided in the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base; and a gas supply unit connected to the gas supply port to supply a purge gas to the gas supply port, the purge processing method including the steps of: (a) mounting the container on the support table; (b) Supplying the purge gas to the gas supply port at a first flow rate by the gas supply unit; and (c) when a condition for changing a flow rate of the purge gas supplied to the gas supply port is satisfied, supplying the purge gas to the gas supply port by the gas supply unit at a second flow rate smaller than the first flow rate, the condition for changing the flow rate of the purge gas supplied to the gas supply port being an internal pressure of the container, the (c) step supplying the purge gas to the gas supply port at the second flow rate if the internal pressure of the container reaches or exceeds a preset pressure after supplying the purge gas to the gas supply port at the first flow rate.
A purification treatment method according to an embodiment of the present application for achieving the above object performs a purification treatment on a container using a purification treatment apparatus including: a support base for mounting the container in which the object is stored; a gas supply port provided in the support base, the gas supply port communicating with a gas inflow hole of the container when the container is mounted on the support base; a gas discharge port provided in the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base; and a gas supply unit connected to the gas supply port to supply a purge gas to the gas supply port, the purge processing method including the steps of: (a) mounting the container on the support table; (b) Supplying the purge gas to the gas supply port at a first flow rate by the gas supply unit; and (c) supplying the purge gas to the gas supply port at a second flow rate smaller than the first flow rate by the gas supply unit when a condition for changing the flow rate of the purge gas supplied to the gas supply port is satisfied, the condition for changing the flow rate of the purge gas supplied to the gas supply port being the flow rate of the purge gas through the gas supply port, the (c) supplying the purge gas to the gas supply port at the second flow rate if the flow rate of the purge gas through the gas supply port is changed during the supply of the purge gas to the gas supply port at the first flow rate.
A purification treatment method according to an embodiment of the present application for achieving the above object performs a purification treatment on a container using a purification treatment apparatus including: a support base for mounting the container in which the object is stored; a plurality of gas supply ports provided on the support base, the plurality of gas supply ports communicating with a plurality of gas inflow holes of the container when the container is mounted on the support base; a gas discharge port provided in the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base; and a gas discharge pipe connected to the gas discharge port, the purification treatment method comprising the steps of: (a) mounting the container on the support table; (b) Determining a flow rate of purge gas to be supplied into the vessel; (c) Differently setting the flow rate of the purge gas through the plurality of gas supply ports to adjust the flow rate of the purge gas or opening all or a part of the plurality of gas supply ports to adjust the flow rate of the purge gas to supply the purge gas into the container at the flow rate determined in the step (b); and (d) measuring the pressure of the purge gas in the gas discharge pipe, and forcibly discharging the gas in the container through the gas discharge pipe when the measured pressure reaches a preset pressure.
A purification treatment apparatus according to an embodiment of the present application for achieving the above object may include: a support base for mounting a container for storing an object; a plurality of gas supply ports provided on the support base, the plurality of gas supply ports communicating with a plurality of gas inflow holes of the container when the container is mounted on the support base; a gas discharge port provided on the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base; a gas supply unit that supplies a purge gas into the container through a plurality of gas supply ports; and a gas discharge unit for discharging the purge gas in the container through the gas discharge port.
A plurality of flow switches may be connected to each of the plurality of gas supply ports, and the flow rate of the purge gas passing through the plurality of gas supply ports may be individually adjusted.
The flow rate of the purge gas may be adjusted based on at least one of time, the internal pressure of the vessel, and the current flow rate of the purge gas.
The purification treatment apparatus according to an embodiment of the present application may further include a position detection sensor for detecting a position of the container mounted on the support table.
The purification treatment apparatus according to an embodiment of the present application may further include a load detection sensor for detecting a load of the container mounted on the support table and a load of the object.
The gas supply port may include a gas supply pad having a gas supply hole communicating with the gas inflow hole of the container, the gas supply pad being in contact with the bottom surface of the container and playing a role of buffering when the container is mounted on the support table.
The gas discharge port may include a gas discharge pad having a gas discharge hole communicating with the gas discharge hole of the container, and the gas discharge pad may contact with the bottom surface of the container and perform a buffering function when the container is mounted on the support table.
Further, a purification treatment method according to an embodiment of the present application for achieving the above object performs a purification treatment on a container using a purification treatment apparatus including: a support base for mounting a container for storing an object; a plurality of gas supply ports provided on the support base, the plurality of gas supply ports communicating with a plurality of gas inflow holes of the container when the container is mounted on the support base; and a gas discharge port provided on the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base, wherein the purification treatment method comprises the steps of: (a) the container is mounted on a support table; (b) determining a flow rate of purge gas supplied into the vessel; and (c) differently setting the flow rate of the purge gas through the plurality of gas supply ports to adjust the flow rate of the purge gas or opening all or a part of the plurality of gas supply ports to adjust the flow rate of the purge gas to supply the purge gas into the container at the flow rate determined in the step (b).
Here, the step (a) may be to detect the load of the container on the support table and determine whether or not the container is mounted.
Furthermore, the purification treatment method according to an embodiment of the present application may further include the following steps between the step of (a) and the step of (b): detecting the position of the container on the support table; and stopping the supply of the purge gas when the position of the container is not a predetermined position.
Here, the step of (b) may include the steps of: (b-1) detecting a load of the container on the support table and a load of an object stored in the container; and, (b-2) determining the flow rate of the purge gas based on the load of the object.
Further, the step (b-2) may calculate the number of objects based on the load of the objects detected in the step (b-1), and determine the flow rate of the purge gas to be supplied into the container based on the number of objects.
Further, in the step (b), the flow rate of the purge gas may be determined based on at least one of time, the internal pressure of the container, and the current flow rate of the purge gas.
According to the purge processing apparatus and the purge processing method of the embodiment of the present application, the flow rate of the purge gas through the plurality of gas supply ports can be set differently, or the flow rate of the purge gas can be adjusted by opening all or part of the plurality of gas supply ports, and the purge gas can be supplied into the container, so that the purge gas can be smoothly circulated in the container and then discharged.
Drawings
Fig. 1 is a diagram schematically showing a purification treatment apparatus according to an embodiment of the present application.
Fig. 2 is a control block diagram of a purification processing apparatus according to an embodiment of the present application.
Fig. 3 and 4 are flowcharts illustrating a purification treatment method using the purification treatment apparatus according to an embodiment of the present application.
Description of the reference numerals
10: a container; 20: a frame; 21: a support table; 30: a gas supply unit; 40: a gas discharge unit; 50: a gas supply port; 60: a gas discharge port; 71: a position detection sensor; 81: a load detection sensor.
Detailed Description
Hereinafter, a purification treatment apparatus and a purification treatment method according to an embodiment of the present application will be described with reference to the drawings.
The purge processing apparatus according to the embodiment of the present application functions to perform a purge processing on a container (for example, a FOUP (front opening unified pod, front opening unified pod)) containing an object such as a wafer, a substrate, a semiconductor element, or the like. The container can be stored in the compartment of the stocker in a state where the object is accommodated in the container, and the inside of the compartment of the stocker may be provided with the purge device. A predetermined environment and atmosphere can be formed inside the container, and thus the object can be processed in the predetermined environment and atmosphere. For example, an inert gas such as nitrogen gas may be supplied into the container, whereby an atmosphere having low reactivity is formed in the container, and oxidation of the object or the like can be prevented. Further, since the object can be stored in the internal space of the container cut off from the outside, foreign matter from the outside can be prevented from adhering to the object.
As shown in fig. 1, a purification treatment apparatus according to an embodiment of the present application may include: a frame 20 having a support base 21, the support base 21 mounting and supporting the container 10 in which the object is stored; a gas supply unit 30 for supplying a purge gas into the container 10; a gas discharge unit 40 for discharging gas from the container 10; a plurality of gas supply ports 50 provided on the support table 21 and connected to the gas supply unit 30 through the gas supply pipe 31; and a gas discharge port 60 provided in the support base 21 and connected to the gas discharge unit 40 through a gas discharge pipe 41.
As shown in fig. 2, the gas supply unit 30 may include: a gas supplier 39 for supplying a purge gas; and a plurality of gas filters 32 and a plurality of flow switches 33 connected to the plurality of gas supply ports 50, respectively. For example, the gas supplier 39 may be constituted by a compressor, a pump, a blower, or the like that supplies the purge gas under pressure. The gas filter 32 functions to filter the gas supplied to the gas supply port 50. The function of the flow switch 33 is to measure and regulate the flow of gas supplied to the gas supply port 50. The plurality of gas supply ports 50 are connected with the plurality of flow switches 33, respectively, so that the flow rate of the purge gas through the plurality of gas supply ports 50 can be adjusted individually for each of the plurality of gas supply ports 50. As a row, the plurality of flow switches 33 set the flow rate of the purge gas through the plurality of gas supply ports 50 differently from each other, whereby the flow rate of the purge gas supplied into the container 10 can be adjusted. As another example, the plurality of flow switches 33 may adjust the flow rate of the purge gas supplied into the container 10 by opening all of the plurality of gas supply ports 50 or opening a part of the plurality of gas supply ports 50.
Further, the gas supply unit 30 may include a main flow switch 34 and a control valve 35 connected to the plurality of flow switches 33. The gas supply unit 30 may further include a pressure sensor 36, a regulator 37, and a regulating valve 38 provided in the gas supply pipe 31 so that the flow rate of the purge gas supplied into the container 10 can be more precisely regulated.
The constituent elements of such a gas supply unit 30 may be electrically connected to the control unit 90 and controlled by the control unit 90. Under the control of the control unit 90, the gas supply unit 30 can supply purge gas into the container 10 mounted on the support table 21 through the gas supply pipe 31, the plurality of gas supply ports 50, and the plurality of gas inflow holes 15 of the container 10. The gas supply unit 30 may supply gas at a first flow rate when the mounting of the container 10 is detected, and may supply gas at a second flow rate different from the first flow rate when the condition for changing (adjusting) the flow rate is satisfied. The conditions for altering the flow rate may be determined based on at least one of time, pressure inside the vessel 10, and flow rate.
Regarding the time for changing the flow rate condition, the gas supply unit 30 may supply the purge gas to the container 10 at the second flow rate after a preset time elapses after the purge gas is initially supplied to the container 10 at the first flow rate. Here, the first flow rate may be greater than the second flow rate. For example, the gas supply unit 30 may initially supply the purge gas at a relatively large flow rate (e.g., 20LPM (liter per minute)) and then supply the purge gas at a relatively small flow rate (e.g., 5 LPM) after a predetermined time (e.g., 1800 seconds) has elapsed.
Further, regarding the pressure inside the container 10 as the condition for changing the flow rate, the gas supply unit 30 may initially supply the purge gas to the container 10 at the first flow rate, and when the pressure inside the container 10 reaches or exceeds the preset pressure, the purge gas may be supplied to the container 10 at the second flow rate. Here, the first flow rate may be greater than the second flow rate. For example, the gas supply unit 30 may supply the gas at a relatively small flow rate when the pressure inside the container 10 exceeds a preset pressure (e.g., 10 kPa) after the purge gas is initially supplied at a relatively large flow rate.
In addition, regarding the current flow rate of the purge gas as the flow rate condition for changing, the control unit 90 may determine whether to maintain the current flow rate and whether to increase or decrease the flow rate based on the current flow rate of the purge gas measured in real time by the flow rate switch 43, and control the gas supply unit 30 such that the gas supply unit 30 supplies the purge gas to the container 10 at the current flow rate or the flow rate increased from the current flow rate.
As such, the conditions for altering the purge gas flow may be determined based on at least one of time, pressure, and current flow. Therefore, the supply efficiency of the purge gas can be improved when only one gas supply port is used or when the gas is continuously supplied at the same flow rate, and thus, the running cost can be saved.
The gas discharge unit 40 may include: a gas ejector 49 for ejecting the gas in the container 10 to the outside; a pressure sensor 42 connected to the gas discharge port 60; a flow switch 43; and a body valve 44. For example, the gas ejector 49 may be constituted by a vacuum pump or the like. The function of the flow switch 43 is to measure and regulate the flow of gas discharged from the gas discharge port 60. The gas discharge unit 40 may further include a pressure sensor 46 and a regulating valve 48 provided in the gas discharge pipe 41 so that the gas in the container 10 can be smoothly discharged to the outside. By discharging the gas to the outside of the container 10 through the gas discharge unit 40, the gas can be discharged along a certain path without discharging the gas from the gap of the container 10, and the gas can be prevented from flowing into the space inside the purge chamber or other devices.
The constituent elements of such a gas discharge unit 40 may be electrically connected to the control unit 90, and controlled by the control unit 90. The gas discharge means 40 can discharge the gas in the container 10 to the outside through the gas outflow hole 16, the gas discharge port 60, and the gas discharge pipe 41 of the container 10 under the control of the control means 90. At this time, the gas discharge unit 40 may be configured to forcibly discharge the gas of the container 10 when the pressure measured at the pressure sensor 46 reaches a preset pressure. Accordingly, problems related to the environment and safety can be solved by forcibly discharging the harmful substances in the container 10.
The gas supply port 50 may include a gas supply pad 51 in contact with the bottom surface of the container 10. When the container 10 is mounted on the support table 21, the gas supply pad 51 may contact the bottom surface of the container 10 and support the load of the container 10. For example, the gas supply pad 51 is made of a synthetic resin material or includes a spring or the like, and functions to absorb shock that may occur when the container 10 is mounted on the support base 21. According to various embodiments of the present application, the gas supply pad 51 and the portion of the container 10 in contact with the gas supply pad 51 are each made of a pad made of a silicone rubber material, and the two pads have a certain degree of friction force to absorb the impact generated when the container 10 is mounted on the support base 21, so that the container 10 can be configured so as not to deviate from the position of the support base 21.
A gas supply hole 52 may be formed at the gas supply pad 51. The gas supply hole 52 may be connected to the gas supply unit 30 through the gas supply pipe 31. When the container 10 is mounted on the gas supply pad 51, the gas supply hole 52 may communicate with the gas inflow hole 15 of the container 10.
The gas discharge port 60 may include a gas discharge pad 61 in contact with the bottom surface of the container 10. When the container 10 is mounted on the support base 21, the gas discharge pad 61 can contact the bottom surface of the container 10 and support the load of the container 10. For example, the gas discharge pad 61 is made of a synthetic resin material or includes a spring or the like, and can absorb shock that may occur when the container 10 is mounted on the support base 21. According to various embodiments of the present application, the gas discharge pad 61 and the portion of the container 10 that is in contact with the gas discharge pad 61 are each made of a pad made of a silica gel material, and the two pads absorb an impact generated when the container 10 is mounted on the support base 21 and have a certain degree of friction, so that the container 10 can be configured so as not to deviate from the position of the support base 21.
More than one gas discharge port 60 may be provided, and in this case, the number of gas outflow holes 16 corresponding to the gas discharge ports 60 may be provided at positions corresponding to the positions of the gas discharge ports 60 in the container 10, respectively.
Gas exhaust holes 62 may be formed in the gas exhaust pad 61. The gas discharge hole 62 may be connected to the gas discharge unit 40 through the gas discharge pipe 41. When the container 10 is mounted on the gas discharge pad 61, the gas discharge hole 62 may communicate with the gas discharge hole 16 of the container 10.
Further, the purifying treatment apparatus according to the embodiment of the present application may include a position detection sensor 71 provided at the support table 21 and detecting the position of the container 10 mounted on the support table 21. The position detection sensor 71 can be used to determine whether or not the container 10 is mounted at a predetermined position on the support table 21. As a line, the position detection sensor 71 may be constituted by a contact sensor that contacts the container 10. As another example, the position detection sensor 71 may be configured as a noncontact sensor including a light emitting portion that emits light and a light receiving portion that receives light reflected by the object after being emitted from the light emitting portion, and the noncontact sensor may determine whether or not an article is present or measure a distance from the article based on whether or not there is light reflection or an imaging position of the reflected light at the light receiving portion.
The position detection sensor 71 may be electrically connected to the control unit 90. The position detection sensors 71 may be provided in plurality at predetermined intervals on the support table 21. Therefore, the position of the container 10 can be detected by the plurality of position detection sensors 71 at a plurality of positions around the container 10, so that the position of the container 10 can be detected more accurately.
The control unit 90 can determine whether or not the container 10 is mounted at a predetermined position on the support table 21 based on the position of the container 10 detected by the position detection sensor 71. For example, when the container 10 is not mounted at a predetermined position on the support base 21, the control unit 90 may perform an operation of notifying the operator that the container 10 is not mounted at a predetermined position on the support base 21 without starting an operation of supplying the purge gas into the container 10. When the container 10 is mounted at a predetermined position on the support base 21, the control unit 90 can control the gas supply unit 30 to start the supply of the purge gas into the container 10.
Further, the purification treatment apparatus according to the embodiment of the present application may include a load detection sensor 81 provided on the support table 21, and detecting the load of the container 10 mounted on the support table 21 and the load of the object stored in the container 10. The load detection sensor 81 may be constituted by a contact sensor that contacts the bottom surface of the container 10. For example, the load detection sensor 81 may include a load sensor.
The load detection sensor 81 may be electrically connected to the control unit 90. The load detection sensors 81 may be provided in plurality at predetermined intervals on the support table 21. Therefore, the load of the container 10 and the object can be detected at a plurality of positions of the container 10, and the load of the container 10 and the object can be detected more accurately.
The control unit 90 can start the operation of supplying the purge gas into the container 10 based on the load of the container 10 detected by the load detection sensor 81 and the load of the object stored in the container 10. That is, when the load detection sensor 81 detects a load within a predetermined range, the control unit 90 may determine that the container 10 is mounted on the support base 21, and control the gas supply unit 30 to start the supply of the purge gas into the container 10.
The control unit 90 can control the flow rate of the purge gas supplied into the container 10 based on the load of the container 10 detected by the load detection sensor 81 and the load of the object stored in the container 10. Since the load detected by the load detection sensor 81 is the sum of the load of the container 10 and the load of the object stored in the container 10, the load detected by the load detection sensor 81 increases as the number of objects stored in the container 10 increases. Therefore, the control unit 90 can calculate the number of objects stored in the container 10 based on the load detected by the load detection sensor 81, and control the flow rate of the purge gas supplied into the container 10 based on the calculated number of objects. For example, when the number of objects is large, the control unit 90 increases the flow rate of the purge gas supplied into the container 10 so that the purge gas can smoothly circulate in the container 10 because the space occupied between the objects in the container 10, that is, the width of the flow path through which the purge gas passes, is small. In contrast, when the number of objects is small, the control unit 90 reduces the flow rate of the purge gas because the space occupied between the objects in the container 10, that is, the width of the flow path through which the purge gas passes, is large, and can prevent the purge gas from being supplied into the container 10 at an excessive flow rate.
Hereinafter, a purification treatment method of performing a purification treatment using the purification treatment apparatus according to an embodiment of the present application will be described with reference to fig. 3 and 4.
First, as shown in fig. 3, a container 10 containing an object to be purified is mounted on a support base 21 (S10). At this time, the control unit 90 determines whether or not the load detection sensor 81 detects the load of the container 10 set in advance, and based on this, it can determine whether or not the container 10 is mounted on the support table 21.
Then, the position of the container 10 on the support table 21 is detected using the position detection sensor 71 (S20).
Then, based on the position of the container 10 detected by the position detection sensor 71, the control unit 90 determines whether or not the container 10 is located at a predetermined position on the support table 21 (S30).
At this time, when the container 10 is not mounted at a predetermined position on the support base 21, the control unit 90 may stop the operation of the purge device without starting the operation of supplying the purge gas into the container 10 (S40). At this time, the control unit 90 may perform an operation of notifying the operator that the container 10 is not mounted at a predetermined position on the support table 21.
When the container 10 is mounted at a predetermined position on the support base 21, the control unit 90 can determine the flow rate of the purge gas to be supplied into the container 10 (S50).
Here, as shown in fig. 4, the step of determining the flow rate of the purge gas to be supplied into the container 10 (S50) may include: a step (S51) of detecting the load of the container 10 and the load of the object stored in the container 10 by using the load detection sensor 81; and a step (S52) of determining the flow rate of the purge gas based on the detected load of the object.
Here, the load of the object can be detected by subtracting the load of the known container 10 from the load detected by the load detection sensor 81.
Here, in the step of determining the flow rate of the purge gas based on the load of the detected object (S52), the control unit 90 may calculate the number of objects stored in the container 10 based on the load of the object detected by the load detection sensor 81, and adjust the flow rate of the purge gas to be supplied into the container 10 based on the calculated number of objects.
Here, the number of objects stored in the container 10 can be calculated by dividing the load of the objects detected by the load detection sensor 81 by the unit weight of the objects (the weight of each object).
Thus, when the flow rate of the purge gas to be supplied into the container 10 is determined, the purge gas is supplied into the container 10 at the determined flow rate (S60). At this time, the flow rate of the purge gas supplied into the container 10 can be adjusted by differently setting the flow rates of the purge gas passing through the plurality of gas supply ports 50. As another example, the flow rate of the purge gas supplied into the container 10 may be adjusted by opening all of the plurality of gas supply ports 50 or opening a part of the plurality of gas supply ports 50. For example, the control unit 90 may supply gas at a high pressure (e.g., 20 LPM) for rapid supply of gas due to low gas pressure inside the container 10 during a certain time (e.g., 60 seconds) after the container 10 is mounted on the support table 21, and supply gas at a relatively low pressure (e.g., 5 LPM) when a certain time has elapsed or the gas inside the container 10 reaches a certain pressure.
According to the purge processing apparatus and the purge processing method according to the embodiments of the present application as described above, the flow rate of the purge gas can be adjusted by differently setting the flow rates of the purge gas through the plurality of gas supply ports 50 or the flow rate of the purge gas can be adjusted by opening all or part of the plurality of gas supply ports 50, and the purge gas can be supplied into the container 10, so that the purge gas can be smoothly circulated in the container 10 and then discharged.
Further, according to the purge processing apparatus and the purge processing method of the embodiment of the present application, the purge gas can be supplied to the inside of the container 10 through the plurality of gas supply ports 50, so that the supply efficiency of the purge gas is improved as compared with the related art, and thus, the running cost can be reduced.
While the preferred embodiment of the present application has been illustrated, the scope of the application is not limited to this particular embodiment, and suitable modifications may be made within the scope of the claims as hereinafter claimed.
Claims (5)
1. A purification treatment method of purifying a container using a purification treatment apparatus comprising: a support base for mounting the container in which the object is stored; a gas supply port provided in the support base, the gas supply port communicating with a gas inflow hole of the container when the container is mounted on the support base; a gas discharge port provided in the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base; and a gas supply unit connected to the gas supply port for supplying a purge gas to the gas supply port,
the purification treatment method comprises the following steps:
(a) Mounting the container on the support table;
(b) Supplying the purge gas to the gas supply port at a first flow rate by the gas supply unit; and
(c) When a condition for changing the flow rate of the purge gas supplied to the gas supply port is satisfied, the purge gas is supplied to the gas supply port at a second flow rate smaller than the first flow rate by the gas supply unit,
the condition for changing the flow rate of the purge gas supplied to the gas supply port is a preset time,
the step (c) is to supply the purge gas to the gas supply port at the second flow rate if a predetermined time elapses after the purge gas is supplied to the gas supply port at the first flow rate.
2. A purification treatment method of purifying a container using a purification treatment apparatus comprising: a support base for mounting the container in which the object is stored; a gas supply port provided in the support base, the gas supply port communicating with a gas inflow hole of the container when the container is mounted on the support base; a gas discharge port provided in the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base; and a gas supply unit connected to the gas supply port for supplying a purge gas to the gas supply port,
the purification treatment method comprises the following steps:
(a) Mounting the container on the support table;
(b) Supplying the purge gas to the gas supply port at a first flow rate by the gas supply unit; and
(c) When a condition for changing the flow rate of the purge gas supplied to the gas supply port is satisfied, the purge gas is supplied to the gas supply port at a second flow rate smaller than the first flow rate by the gas supply unit,
the condition for changing the flow rate of the purge gas supplied to the gas supply port is the internal pressure of the container,
the step (c) supplies the purge gas to the gas supply port at the second flow rate if the internal pressure of the container reaches or exceeds a preset pressure after the purge gas is supplied to the gas supply port at the first flow rate.
3. A purification treatment method of purifying a container using a purification treatment apparatus comprising: a support base for mounting the container in which the object is stored; a gas supply port provided in the support base, the gas supply port communicating with a gas inflow hole of the container when the container is mounted on the support base; a gas discharge port provided in the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base; and a gas supply unit connected to the gas supply port for supplying a purge gas to the gas supply port,
the purification treatment method comprises the following steps:
(a) Mounting the container on the support table;
(b) Supplying the purge gas to the gas supply port at a first flow rate by the gas supply unit; and
(c) When a condition for changing the flow rate of the purge gas supplied to the gas supply port is satisfied, the purge gas is supplied to the gas supply port at a second flow rate smaller than the first flow rate by the gas supply unit,
the condition for changing the flow rate of the purge gas supplied to the gas supply port is the flow rate of the purge gas through the gas supply port,
the step (c) is to supply the purge gas to the gas supply port at the second flow rate if the flow rate of the purge gas passing through the gas supply port is changed during the supply of the purge gas to the gas supply port at the first flow rate.
4. A purification treatment method of purifying a container using a purification treatment apparatus comprising: a support base for mounting the container in which the object is stored; a plurality of gas supply ports provided on the support base, the plurality of gas supply ports communicating with a plurality of gas inflow holes of the container when the container is mounted on the support base; a gas discharge port provided in the support base, the gas discharge port communicating with a gas outflow hole of the container when the container is mounted on the support base; and a gas discharge pipe connected to the gas discharge port, characterized in that,
the purification treatment method comprises the following steps:
(a) Mounting the container on the support table;
(b) Determining a flow rate of purge gas to be supplied into the vessel;
(c) Differently setting the flow rate of the purge gas through the plurality of gas supply ports to adjust the flow rate of the purge gas or opening all or a part of the plurality of gas supply ports to adjust the flow rate of the purge gas to supply the purge gas into the container at the flow rate determined in the step (b); and
(d) And measuring the pressure of the purified gas in the gas discharge pipe, and forcibly discharging the gas in the container through the gas discharge pipe when the measured pressure reaches a preset pressure.
5. The purification treatment method according to claim 4, wherein,
in the step (b), a flow rate of the purge gas to be supplied into the container is determined based on at least one of time, an internal pressure of the container, and a current flow rate of the purge gas.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0095317 | 2018-08-16 | ||
| KR20180095317 | 2018-08-16 | ||
| KR1020190005042A KR102190920B1 (en) | 2018-08-16 | 2019-01-15 | Purge apparatus and purge method |
| KR10-2019-0005042 | 2019-01-15 | ||
| CN201910622128.4A CN110838461B (en) | 2018-08-16 | 2019-07-10 | Purifying device and purifying method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910622128.4A Division CN110838461B (en) | 2018-08-16 | 2019-07-10 | Purifying device and purifying method |
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| CN117038536A true CN117038536A (en) | 2023-11-10 |
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| CN201910622128.4A Active CN110838461B (en) | 2018-08-16 | 2019-07-10 | Purifying device and purifying method |
| CN202311025448.4A Pending CN117038536A (en) | 2018-08-16 | 2019-07-10 | Purification treatment method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100541814B1 (en) * | 2003-09-15 | 2006-01-11 | 삼성전자주식회사 | Chemical vapor deposition equipment |
| JP5448000B2 (en) * | 2009-05-27 | 2014-03-19 | ローツェ株式会社 | Atmosphere replacement device |
| US9212786B2 (en) * | 2009-06-30 | 2015-12-15 | Roylan Developments Limited | Apparatus for purging containers for storing sensitive materials |
| JP5537528B2 (en) * | 2011-09-28 | 2014-07-02 | 株式会社日立製作所 | Fresh water purification equipment |
| US9441792B2 (en) * | 2013-09-30 | 2016-09-13 | Applied Materials, Inc. | Transfer chamber gas purge apparatus, electronic device processing systems, and purge methods |
| KR102162366B1 (en) * | 2014-01-21 | 2020-10-06 | 우범제 | Apparatus for removing fume |
| US10438829B2 (en) * | 2014-02-07 | 2019-10-08 | Murata Machinery, Ltd. | Purge device and purge method |
| US10410894B2 (en) * | 2014-06-16 | 2019-09-10 | Murata Machinery, Ltd. | Purge stocker and purging method |
| JP6450156B2 (en) * | 2014-11-12 | 2019-01-09 | ミライアル株式会社 | Gas purge filter |
| KR101691607B1 (en) * | 2015-08-26 | 2016-12-30 | (주)젠스엠 | Wafer container transferring apparatus with purging function |
| WO2017038269A1 (en) * | 2015-08-31 | 2017-03-09 | 村田機械株式会社 | Purging device, purging stocker, and purging method |
| JP6671911B2 (en) * | 2015-10-02 | 2020-03-25 | 株式会社ニューフレアテクノロジー | Position shift detecting apparatus, vapor phase growth apparatus and position shift detecting method |
| KR20180000094A (en) * | 2016-06-22 | 2018-01-02 | 세메스 주식회사 | Flow meter |
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| CN110838461A (en) | 2020-02-25 |
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