CN116964007A - Active particle supply device and water treatment system using same - Google Patents
Active particle supply device and water treatment system using same Download PDFInfo
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- CN116964007A CN116964007A CN202180094821.4A CN202180094821A CN116964007A CN 116964007 A CN116964007 A CN 116964007A CN 202180094821 A CN202180094821 A CN 202180094821A CN 116964007 A CN116964007 A CN 116964007A
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- particle supply
- supply device
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 183
- 239000002245 particle Substances 0.000 title claims abstract description 131
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000001301 oxygen Substances 0.000 claims abstract description 22
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 22
- 230000000694 effects Effects 0.000 claims abstract description 14
- 239000012530 fluid Substances 0.000 claims description 32
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 26
- 239000007789 gas Substances 0.000 claims description 24
- 239000011149 active material Substances 0.000 claims description 5
- 230000005684 electric field Effects 0.000 claims description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 12
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 9
- 229910001882 dioxygen Inorganic materials 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000011261 inert gas Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004813 Perfluoroalkoxy alkane Substances 0.000 description 1
- 208000036366 Sensation of pressure Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- TUJKJAMUKRIRHC-UHFFFAOYSA-N hydroxyl Chemical compound [OH] TUJKJAMUKRIRHC-UHFFFAOYSA-N 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005949 ozonolysis reaction Methods 0.000 description 1
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/48—Treatment of water, waste water, or sewage with magnetic or electric fields
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/50—Treatment of water, waste water, or sewage by addition or application of a germicide or by oligodynamic treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Plasma Technology (AREA)
Abstract
The present application provides an active particle supply device (4), comprising: an injector (10) for injecting water (2) to be treated from a nozzle (12), wherein a contact portion (13) is provided in a space in which the pressure around the injected water (2) to be treated is reduced by a venturi effect, a dielectric (15) is disposed on the upper surface of the contact portion (13), and a supply port (16) for supplying oxygen is provided in the contact portion (13); and a plasma generating device (11) that generates a plasma (100) for generating active particles in oxygen at the contact portion (13).
Description
Technical Field
The present application relates to an active particle supply device and a water treatment system using the same.
Background
In a water treatment system for decomposing and removing contaminants, an ozone generator is provided, and a gas containing ozone having a high oxidizing power is injected into water to be treated by using an injector to perform a purification treatment. There are two basic problems in this system. (1) If ozone is generated at a high concentration, the ozone generation efficiency is lowered and the water treatment efficiency is lowered. (2) As the ozone generator, a dielectric barrier discharge generator having a complicated structure and high price is required.
To address this problem, the following system is disclosed: the water to be treated (inner pipe) and the oxygen pipe (outer pipe) are coaxially arranged, the water to be treated is used as a ground electrode, the oxygen pipe is used as a power supply electrode, and an ac high voltage is applied between the power supply electrode and the ground electrode to generate dielectric barrier discharge, thereby generating oxygen plasma (for example, patent document 1).
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 4-222693
Disclosure of Invention
Problems to be solved by the application
In the structure of patent document 1, the water pipe to be treated is used as the ground electrode, so that the discharge space for generating oxygen atoms is limited to the outer peripheral portion of the water pipe to be treated (inner pipe). Therefore, the discharge space for generating oxygen atoms and the contact portion for supplying oxygen atoms to the water to be treated are separated. During the oxygen atom transport, the proportion of returned oxygen molecules due to the recombination reaction becomes high, so that oxygen atoms cannot be effectively supplied to the water to be treated, and the water treatment efficiency is lowered.
The present application has been made to solve the above-described problems, and an object of the present application is to provide an active particle supply device that can supply active particles to water to be treated efficiently and can purify the water to be treated efficiently, and a water treatment system using the same.
Means for solving the problems
The active particle supply device disclosed by the application comprises: an ejector having a contact portion in a space in which the first fluid is ejected from the nozzle and the pressure around the ejected first fluid is reduced by a venturi effect, the contact portion having a supply port for supplying the second fluid; and a plasma generating device that generates plasma of active particles in the second fluid at the contact portion.
The water treatment system according to the present application includes the active particle supply device for supplying the active particles to the water to be treated as the first fluid.
Effects of the application
According to the active particle supply device and the water treatment system disclosed by the application, the water to be treated can be effectively purified.
Drawings
Fig. 1 is a block diagram of a water treatment system including an active particle supply device according to embodiment 1.
Fig. 2A is a perspective view of an ejector of the active particle supply device according to embodiment 1.
Fig. 2B is a cross-sectional view of an ejector of the active particle supply device according to embodiment 1.
Fig. 3 is a structural diagram of an active particle supply device according to embodiment 2.
Fig. 4A is a perspective view of an ejector of the active particle supply device according to embodiment 2.
Fig. 4B is a cross-sectional view of an ejector of the active particle supply device according to embodiment 2.
Fig. 5 is a block diagram of a water treatment system including an active particle supply device according to embodiment 3.
Fig. 6 is a block diagram of a water treatment system including an active particle supply device according to embodiment 4.
Fig. 7A is a perspective view of an ejector of the active particle supply device according to embodiment 4.
Fig. 7B is a cross-sectional view of an ejector of the active particle supply device according to embodiment 4.
Fig. 8 is a structural diagram of an active particle supply device according to embodiment 5.
Fig. 9A is a perspective view of an ejector of the active particle supply device according to embodiment 5.
Fig. 9B is a cross-sectional view of an ejector of the active particle supply device according to embodiment 5.
Detailed Description
Embodiment 1
Embodiment 1 relates to an active particle supply device and a water treatment system for purifying water to be treated using the same, wherein the active particle supply device includes a plasma generator and an injector for injecting water to be treated from a nozzle, reducing the pressure around the injected water to be treated by a venturi effect, the injector having a contact portion in a space where the pressure of the water to be treated is reduced, a dielectric disposed on an upper surface of the contact portion, a supply port for supplying oxygen gas provided in the contact portion, and a high electric field being applied through the dielectric by the plasma generator, whereby plasma is generated in the contact portion, and active particles are generated in the oxygen gas.
The configuration and operation of the active particle supply device and the water treatment system according to embodiment 1 will be described below with reference to fig. 1, which is a block diagram of the water treatment system having the active particle supply device, fig. 2A, which is a perspective view of the ejector of the active particle supply device, and fig. 2B, which is a cross-sectional view of the ejector.
The configuration of the water treatment system 1 and the active particle supply device 4 according to embodiment 1 will be described with reference to the configuration of fig. 1.
First, the structure of the water treatment system 1 will be described.
The water treatment system 1 includes a treatment water tank 3 for storing water 2 (first fluid), an active particle supply device 4 for purifying the water 2, and a circulation pump 5. The circulation pump 5 circulates the water 2 to be treated between the treatment water tank 3 and the active particle supply device 4.
The treatment water tank 3, the active particle supply device 4, and the circulation pump 5 are connected to each other by a water pipe 6 to be treated. In fig. 1, an arrow (Y) indicates a flow direction of the water 2 to be treated.
A valve 7 and a flow regulator 8 are connected to a water pipe 6 to be treated downstream of the circulation pump 5, that is, upstream of the active particle supply device 4. A valve 9 is connected to the water pipe 6 to be treated on the downstream side of the active particle supply device 4.
Next, the structure of the active particle supply device 4 will be described.
The active particle supply device 4 is composed of an injector 10 as a mixing portion and a plasma generation device 11 as an active particle generation means, and the plasma generation device 11 generates plasma 100.
In addition, in the ejector 10 of fig. 1, a vertical cross section including a central axis in a direction in which the water 2 to be treated of the ejector 10 flows is shown, with a part removed, in order to facilitate understanding of the structure of the water treatment system 1.
First, the structure of the ejector 10 is also described with reference to fig. 2A and 2B.
Fig. 2A is a perspective view of the ejector 10, and fig. 2B is a sectional view. Fig. 2A and 2B are conceptual views for making the structure of the injector 10 easy to understand.
In fig. 2A, the direction in which the water 2 to be treated supplied to the injector 10 flows is referred to as the Y-axis direction, the horizontal right direction is referred to as the X-axis direction, and the vertical direction is referred to as the Z-axis direction. The flow axis of the treated water 2 coincides with the central axis of the injector 10 in the Y axis direction.
Fig. 2B is a cross-sectional view of arrow A-A in fig. 2A, and is a cross-sectional view taken along a vertical plane including the central axis of the injector 10. In the cross-sectional view of fig. 2B, the gas supply port 16 is not originally present, but is shown as a virtual line (broken line) for the sake of easy understanding of the positional relationship.
In fig. 2A and 2B, "MW" represents microwaves, "OG" represents oxygen O 2 。
Hereinafter, the case of fig. 2A and 2B will be collectively referred to as fig. 2. The same applies to the following description of embodiment 2.
The injector 10 is composed of a nozzle 12, a contact portion 13, a diffuser 14, and a dielectric 15. The nozzle 12 is configured to gradually reduce the pipe cross-sectional area to a reduction angle of about 45 degrees on the downstream side. The diffuser 14 is configured to gradually expand the cross-sectional area of the pipe from 5 degrees to 10 degrees toward the downstream side.
In fig. 2A, the contact portion 13 is the entire rectangular parallelepiped region of the lower portion of the dielectric 15.
In the ejector 10, the water 2 to be treated pressurized by the circulation pump 5 is supplied from upstream of the nozzle 12. The pressure recovery is performed in the diffuser 14 by the contact portion 13 with respect to the water 2 to be treated having an increased flow rate. The treated water 2 after the pressure recovery is discharged from the downstream of the diffuser 14.
The contact portion 13 is in a negative pressure (negat ive pres sure) state of several kPa to 50kPa (absolute pressure) due to the venturi effect of the water 2 to be treated which is sprayed from the nozzle 12.
The contact portion 13 includes a gas supply port 16, and the gas supply port 16 is configured to supply oxygen (second fluid) from a direction intersecting the flow axis of the water 2 to be treated. Here, the intersecting direction is preferably arranged at an angle of about 90 ° ± 30 °, preferably about 90 ° ± 5 °, with respect to the flow axis of the water 2 to be treated.
In fig. 1 and 2, the gas supply port 16 of the injector 10 is arranged at a position eccentric from the flow axis of the water 2 to be treated. However, the position of the gas supply port 16 may be arranged on the flow axis.
The contact portion 13 is negative pressure due to the venturi effect, and oxygen gas supplied from the gas supply port 16 is sucked into the water 2 to be treated, and the water 2 to be treated and the oxygen gas are mixed.
In fig. 1, a dielectric 15 is disposed on the upper surface of the contact portion 13. The dielectric 15 has a property of transmitting a part of the microwaves and reflecting the rest of the microwaves.
Quartz and alumina are preferably used for the dielectric 15, but other materials may be used. A plasma generator 11 is connected to an upper portion of the dielectric 15, that is, to an upper surface side of the contact portion 13 of the injector 10.
Next, the structure of the plasma generating apparatus 11 will be described.
The plasma generating device 11 is configured by a microwave oscillator 17, a rectangular waveguide 18, a single-sided waveguide 19, a directional coupler 20, a matching unit 21, a reactor 22, a short-circuiting unit 23, and a slot antenna 24.
The plasma generating device 11 generates plasma 100 in oxygen gas supplied from the gas supply port 16 to the contact portion 13 of the injector 10.
The microwave oscillator 17, the single-sided waveguide 19, the directional coupler 20, and the matcher 21 are connected by a rectangular waveguide 18.
The configuration of the plasma generating device 11 is exemplified, and may be different from the above.
The microwave oscillator 17 is a device for generating microwaves, and it is assumed that microwaves are generated using a magnetron. However, a semiconductor method or other methods may be used.
The microwave frequency used in the microwave oscillator 17 is about 2.45GHz, but other frequencies may be used.
The single-sided waveguide 19 is connected to the rear section of the microwave oscillator 17. The single-sided waveguide 19 propagates microwaves (incident waves) generated by the microwave oscillator 17 with low loss, but sufficiently attenuates microwaves (reflected waves) reflected from the short-circuiting device 23. That is, the single-sided waveguide 19 is provided for protecting the microwave oscillator 17 from the reflected wave.
The directional coupler 20 is connected to the rear end of the single-sided waveguide 19, separates the incident wave and the reflected wave, detects the incident wave and the reflected wave, and measures the power (incident wave-reflected wave) consumed by the plasma 100. The output of the microwave oscillator 17 is adjusted using the measured value of the power consumption of the plasma 100.
The matching unit 21 is connected to the rear stage of the directional coupler 20, and matches the entire circuit impedance of the plasma generating apparatus 11.
The reactor 22 connected to the rear section of the matching unit 21 has a rectangular parallelepiped shape, and is made of aluminum, copper, steel, or other metal. Plating may be performed on the inner surface or the outer surface of the reactor 22.
A slot antenna 24 with a slot cut is disposed on the lower surface of the reactor 22. Microwaves are radiated from the slot antenna 24 to the dielectric 15 of the injector 10.
The width of the slot antenna 24 is preferably 1mm or less. The current flowing to the lower surface of the reactor 22 is blocked by the slot antenna 24, and a high electric field is generated in the slot portion, so that the plasma 100 is excited in the contact portion 13 of the injector 10.
The short-circuiting device 23 is connected to the rear end of the reactor 22, and reflects microwaves. A reflecting plate (not shown) is mounted in the short-circuiting device 23. By adjusting the distance from the reactor 22 to the reflecting plate, a standing wave is generated in the space from the reactor 22 to the short 23. By using this standing wave, plasma 100 is easily generated in contact portion 13 of injector 10.
Next, the generation of plasma 100 at contact portion 13 of injector 10, the generation of oxygen atoms, and the purification of the water to be treated will be described.
The plasma generator 11 introduces microwaves from the microwave oscillator 17, and generates a high electric field in the slot antenna 24 in the reactor 22, thereby generating plasma 100 in the contact portion 13 of the injector 10.
In the plasma 100, oxygen atoms (O) as active particles are generated from oxygen gas by electron collision 2 +e→o+o+e, where e represents an electron).
As shown in fig. 2B, in embodiment 1, plasma 100 is generated in the upper portion of contact portion 13, that is, in the region between the lower surface of dielectric 15 and the upper surface of the flow path of water 2 to be treated.
The active particle supply device 4 supplies an active gas containing oxygen atoms generated by the plasma 100 to the water 2 to be treated flowing through the contact portion 13 in the injector 10. In this way, the water treatment system 1 oxidizes and decomposes organic components and the like in the water 2 to be treated to purify the water 2 to be treated.
The plasma generating device 11 generates plasma 100 by microwaves. Therefore, compared to a conventionally used plasma (for example, inductively coupled plasma, capacitively coupled plasma, or the like) using a high frequency of several hundred kHz or more, the plasma 100 having a higher density can be generated with the same input power. As a result, when oxygen is used, oxygen atoms having a high density can be generated.
Oxygen atoms generated by plasma 100 are rapidly deactivated when they leave plasma 100 (O+O.fwdarw.O) 2 ). Therefore, it is necessary to supply the reactive gas containing oxygen atoms to the water 2 to be treated before the oxygen atoms are deactivated. Therefore, the time from the departure of oxygen atoms from plasma 100 to the arrival of water 2 to be treated needs to be 1msec or less.
In the active particle supply device 4 according to embodiment 1, since the plasma 100 is generated in the contact portion 13 of the injector 10, the deactivation of oxygen atoms is suppressed, and the active particle supply device can immediately supply the oxygen atoms to the water 2 to be treated. As a result, the water treatment performance of the active particle supply device 4 can be dramatically improved.
In embodiment 1, the water 2 to be treated is shown as the first fluid, but an oxygen-containing gas such as oxygen or air may be used as the first fluid. At this time, oxygen atoms generated in the contact portion 13 in the injector 10 are mixed with an oxygen-containing gas and converted into ozone, and the plasma generating device 11 functions as a high-efficiency ozone generator.
In addition, in embodiment 1, it is assumed that oxygen is used as the second fluid. However, an inert gas (for example, helium, argon, or the like) may be used, and an inert gas may be added to the oxygen.
In this case, helium and argon can generate plasma relatively easily as compared with oxygen gas, which is electron-attached.
In addition, when plasma 100 is generated using an inert gas, hydroxyl radicals are generated in contact portion 13.
In embodiment 1, by controlling the flow rate of the inert gas, the plasma 100 is easily generated. That is, after the inert gas flows through the gas supply port 16 to generate the plasma 100, the flow rate of the inert gas is gradually decreased, and the flow rate of the oxygen gas is increased. By controlling so that the plasma 100 is finally maintained with only oxygen, the generation of the plasma 100 becomes easy.
The plasma 100 can be easily generated by controlling the flow rate of oxygen before and after the plasma generation without using an inert gas.
The flow rate of the oxygen gas supplied from the gas supply port 16 to the contact portion 13 is reduced, and in this state, the introduction of microwaves from the microwave oscillator 17 is started. As a result, the gas pressure in the contact portion 13 is low, and thus the plasma 100 is easily generated. After plasma 100 is generated, the flow rate of oxygen is gradually increased, and the pressure of contact portion 13 is increased, so that plasma 100 can be stably maintained.
Injector 10 is exposed to oxygen atoms (O)Ozone (O) 3 ) Hydrogen peroxide (H) 2 O 2 ) And an active gas such as hydroxyl radical (OH). Therefore, the material of the injector 10 is preferably a material having high corrosion resistance.
As a material of the injector 10, for example, a metal material such as stainless steel (SUS (stainless steel), 316, SUS304, etc.), a fluororesin such as PTFE (polytetrafluoroethylene) (polytetrafluoroethylene), PFA (p-fluoroflange) (perfluoroalkoxyalkane), a material having a surface covered with a fluororesin, or the like can be used.
In the water treatment system 1 according to embodiment 1, ozone generated by oxygen atoms may be contained in the water 2 to be treated returned to the treatment water tank 3 by the active particle supply device 4. Therefore, as shown in fig. 1, the treatment tank 3 is preferably provided with an exhaust port 25 and an ozonolysis treatment apparatus 26 using activated carbon or the like.
The water treatment system 1 of fig. 1 includes a treatment water tank 3 for storing water 2 to be treated, an active particle supply device 4 for purifying the water 2 to be treated, and a circulation pump 5, and purifies the water 2 to be treated by a so-called closed loop.
The active particle supply device 4 may be applied to a so-called open loop system in which water to be treated to be purified is supplied to the active particle supply device 4, and the water to be treated is discharged after being purified.
As described above, the active particle supply device according to embodiment 1 includes the injector that injects the first fluid from the nozzle, reduces the pressure around the injected first fluid by the venturi effect, and includes the contact portion in the space where the pressure of the first fluid is reduced, the contact portion includes the supply port that supplies the second fluid, and plasma that generates active particles in the second fluid is generated in the contact portion. In addition, in the water treatment system, the active particle supply device is used to purify the water to be treated.
Therefore, the water treatment system and the active particle supply device according to embodiment 1 can effectively purify the water to be treated.
Embodiment 2
In the active particle supply device according to embodiment 2, in addition to the dielectric substance disposed on the upper surface of the contact portion, the dielectric substance is disposed on the lower surface and both side surfaces.
The structure and operation of the active particle supply device according to embodiment 2 will be described mainly with respect to differences from embodiment 1 based on fig. 3, which is a structural view of the active particle supply device, fig. 4A, which is a perspective view of an ejector of the active particle supply device, and fig. 4B, which is a cross-sectional view of the ejector.
In fig. 3 and 4 of embodiment 2, the same or corresponding parts as those of embodiment 1 are given the same reference numerals.
In order to distinguish from embodiment 1, the active particle supply device 204, the injector 210, and the contact portion 213 are provided.
In embodiment 2, the difference from embodiment 1 is the structure of the contact portion 213 of the injector 210, and therefore, the treatment water tank 3, the circulation pump 5, and the like for storing the water 2 (first fluid) to be treated in the water treatment system are omitted in fig. 3.
First, the structure of the active material supply device 204 will be described.
The active particle supply device 204 is constituted by an injector 210 as a mixing section and a plasma generating device 11 as an active particle generating means for generating plasma 100.
The injector 210 of fig. 3 is partially removed to show a vertical cross section including the central axis of the injector 210 in the direction of the water flow to be treated.
Next, the structure of the injector 210 will be described with reference to fig. 4A and 4B as well.
Fig. 4A is a perspective view of the injector 210, and fig. 4B is a sectional view.
In fig. 4A, the direction in which the water 2 to be treated supplied to the injector 210 flows is referred to as the Y-axis direction, the horizontal right direction is referred to as the X-axis direction, and the vertical direction is referred to as the Z-axis direction. The flow axis of the treated water 2 coincides with the central axis of the injector 210 in the Y axis direction.
Fig. 4B is a cross-sectional view of arrows A-A of fig. 4A, which is a cross-sectional view at a vertical plane containing the central axis of the injector 210. In the cross-sectional view of fig. 4B, the gas supply port 16 is not originally present, but is described as a virtual line (broken line) for the sake of easy understanding of the positional relationship.
In fig. 4A and 4B, "MW" represents microwaves, "OG" represents oxygen O 2 。
In embodiment 2, the method of generating plasma 100 in contact portion 213 between plasma generating apparatus 11 and injector 210 is the same as in embodiment 1.
A description will be given of a difference from embodiment 1, that is, a difference in the structure of the contact portion 213 and a difference in the generation region of the plasma 100.
As shown in fig. 4A, the dielectric 15 is disposed on all four surfaces of the lower surface, the right side surface, and the left side surface, in addition to the upper surface, in the contact portion 213 of the injector 210.
As a result, as shown in fig. 4B, plasma 100 is generated in a region between the lower surface of dielectric 15 at the upper part of contact 213 and the upper surface of the flow path of the water to be treated, and also in a region between the upper surface of dielectric 15 at the lower part of contact 213 and the lower surface of the flow path of the water to be treated.
In the active particle supply device 204 according to embodiment 2, by disposing the dielectric 15 on the upper surface, the lower surface, and both side surfaces of the contact portion 213, the plasma 100 can be generated in the entire outer peripheral region of the water 2 to be treated flowing through the contact portion 213, and oxygen atoms with high density can be supplied to the water 2 to be treated.
As described above, the active particle supply device according to embodiment 2 has dielectrics disposed on the lower surface and both side surfaces of the contact portion, in addition to the dielectrics disposed on the upper surface.
Therefore, the active particle supply device according to embodiment 2 can effectively purify the water to be treated. Further, the water to be treated can be purified by oxygen atoms having a high density.
Embodiment 3
The active particle supply device and the water treatment system according to embodiment 3 are provided with a swirling flow generating device in a front stage of an ejector of the active particle supply device.
The configuration and operation of the water treatment system and the active particle supply device according to embodiment 3 will be described mainly with respect to differences from embodiment 1 based on fig. 5, which is a block diagram of the water treatment system including the active particle supply device.
In fig. 5 of embodiment 3, the same or corresponding parts as those of embodiment 1 are given the same reference numerals.
In addition, in order to distinguish from embodiment 1, a water treatment system 301 and an active particle supply device 304 are provided.
First, the structure of the water treatment system 301 will be described.
The water treatment system 301 includes a treatment water tank 3 for storing the water 2 (first fluid), an active particle supply device 304 for purifying the water 2, a circulation pump 5, and a swirling flow generating device 27. The swirling flow generating device 27 is connected to the front stage of the active particle supply device 304 at the rear stage of the circulation pump 5. The circulation pump 5 circulates the water 2 to be treated among the treatment water tank 3, the swirling flow generating device 27, and the active particle supply device 304.
The treatment water tank 3, the active particle supply device 304, the circulation pump 5, and the swirling flow generating device 27 are connected to each other by a water pipe 6 to be treated. In fig. 5, an arrow (Y) indicates a flow direction of the water 2 to be treated.
A valve 7 and a flow regulator 8 are connected to the water pipe 6 to be treated on the downstream side of the circulation pump 5, that is, on the upstream side of the active particle supply device 304. A valve 9 is connected to the water pipe 6 to be treated on the downstream side of the active particle supply device 304.
The water treatment system 301 further includes an exhaust port 25 and an ozone decomposition treatment device 26.
Next, the structure of the active material supply device 304 will be described.
The active particle supply device 304 is constituted by the injector 10 as a mixing section and the plasma generating device 11 generating the plasma 100 as an active particle generating means.
In the ejector 10 of fig. 5, a vertical cross section including a central axis in a flow direction of the water 2 to be treated of the ejector 10 is shown with a part removed for easy understanding of the structure of the water treatment system 301.
Since the structure of the injector 10 is the same as that of embodiment 1, a perspective view and a cross-sectional view of the injector 10 are omitted.
Next, the function and effect of the swirling flow generating device 27 will be described.
The swirling flow generating device 27 includes a mechanism for swirling the water 2 to be treated. By providing the swirling flow generating device 27 in the front stage of the nozzle 12 of the injector 10 of the active particle supplying device 304, the water 2 to be treated is supplied to the nozzle 12 of the injector 10 in a state of being spirally rotated. As a result, the flow rate of the water 2 to be treated increases, and the inside of the contact portion 13 can be brought into a negative pressure state more strongly by the venturi effect. Therefore, the plasma 100 is easily generated, and the oxygen atoms generated in the contact portion 13 can be efficiently supplied to the water 2 to be treated.
In embodiment 3, the swirling flow generating device 27 is described as a device in the active particle supply device 304, but may be a device other than the active particle supply device 304.
In embodiment 3, the case where the swirling flow generating device 27 is provided in the active particle supply device 4 of embodiment 1 has been described, but the same effect can be achieved even if the swirling flow generating device is provided in the active particle supply device 204 of embodiment 2.
As described above, the active particle supply device and the water treatment system according to embodiment 3 are provided with the swirling flow generating device in the front stage of the ejector of the active particle supply device.
Therefore, the water treatment system and the active particle supply device according to embodiment 3 can effectively purify the water to be treated. Further, the plasma generation becomes easy, and oxygen atoms can be efficiently supplied to the water to be treated.
Embodiment 4
In the active particle supply device and the water treatment system according to embodiment 4, a contractor コ for preventing water droplets from adhering is added directly below the dielectric of the ejector.
The configuration and operation of the water treatment system and the active particle supply device according to embodiment 4 will be described mainly with respect to differences from embodiment 1 based on fig. 6, which is a configuration diagram of the water treatment system including the active particle supply device, fig. 7A, which is a perspective view of an ejector of the active particle supply device, and fig. 7B, which is a cross-sectional view of the ejector.
In fig. 6 and 7 of embodiment 4, the same or corresponding parts as those of embodiment 1 are given the same reference numerals.
In order to distinguish from embodiment 1, the water treatment system 401, the active particle supply device 404, the ejector 410, and the contact portion 413 are provided.
First, the structure of the water treatment system 401 will be described.
The water treatment system 401 includes a treatment water tank 3 for storing the water 2 (first fluid), an active particle supply device 404 for purifying the water 2, and a circulation pump 5. The circulation pump 5 circulates the water 2 to be treated between the treatment water tank 3 and the active particle supply device 404.
The treatment water tank 3, the active particle supply device 404, and the circulation pump 5 are connected by a water pipe 6 to be treated. In fig. 6, an arrow (Y) indicates a flow direction of the water 2 to be treated.
A valve 7 and a flow regulator 8 are connected to the water pipe 6 to be treated on the downstream side of the circulation pump 5, that is, on the upstream side of the active particle supply device 404. A valve 9 is connected to the water pipe 6 to be treated on the downstream side of the active particle supply device 404.
The water treatment system 401 further includes an exhaust port 25 and an ozone decomposition treatment device 26.
Next, the structure of the active material supply device 404 will be described.
The active particle supply device 404 is constituted by an injector 410 as a mixing section and a plasma generating device 11 as an active particle generating means for generating plasma 100.
In the eductor 410 of fig. 6, a vertical cross section of a central axis of the eductor 410 in the direction in which the water 2 to be treated flows is shown, except for a part, in order to facilitate understanding of the structure of the water treatment system 401.
Next, the structure of the ejector 410 will be described with reference to fig. 7A and 7B.
Fig. 7A is a perspective view of the ejector 410, and fig. 7B is a sectional view.
In fig. 7A, the direction in which the water 2 to be treated supplied to the injector 410 flows is referred to as the Y-axis direction, the horizontal right direction is referred to as the X-axis direction, and the vertical direction is referred to as the Z-axis direction. The flow axis of the treated water 2 coincides with the central axis of the injector 410 in the Y axis direction.
Fig. 7B is a cross-sectional view of arrow A-A of fig. 7A, which is a cross-sectional view taken along a vertical plane including the central axis of the injector 410. In the cross-sectional view of fig. 7B, the gas supply port 16 is not originally present, but is described as a virtual line (broken line) for the sake of easy understanding of the positional relationship.
In fig. 7A and 7B, "MW" represents microwaves, "OG" represents oxygen O 2 。
In embodiment 4, the method of generating plasma 100 in contact portion 413 between plasma generating apparatus 11 and injector 410 is the same as in embodiment 1.
In embodiment 4, the difference from embodiment 1 is the structure of the contact portion 413 of the ejector 410.
The difference from embodiment 1, that is, the contractor 28 for preventing water droplets from adhering to the contact portion 413 and the effect thereof will be described.
As is clear from fig. 6 and 7, the contact portion 413 is provided with a retractor 28 for preventing water droplets from adhering directly under the dielectric 15.
In the case where the plasma 100 is generated by microwaves through the dielectric 15, if moisture adheres to the dielectric 15, it becomes difficult to stably maintain the plasma 100.
In the water treatment system 401 according to embodiment 4, the constriction device 28 is disposed immediately below the dielectric 15 in the contact portion 413 of the ejector 410 of the active particle supply device 404. By adding the constriction 28 to the contact portion 413, it is possible to suppress adhesion of water scattered from the water 2 to be treated flowing through the contact portion 413 of the ejector 410 to the dielectric 15.
As is clear from fig. 7B, plasma 100 is generated in a region between the lower surface of dielectric 15 at the upper portion of contact portion 413 and the upper surface of constrictor 28 provided on the upper surface of the flow path of the water to be treated.
As a result of adding the constrictor 28 for preventing water droplets from adhering to the contact portion 413 of the injector 410, the active particle supply device 404 according to embodiment 4 can stably maintain the plasma 100 without being affected by the moisture of the water 2 to be treated. As a result, oxygen atoms generated in the contact portion 413 can be efficiently supplied to the water 2 to be treated.
The retractor 28 is formed by forming a plurality of through holes having a diameter of about 0.1 to 1mm in a plate having a thickness of about 1 mm. As the material of the retractor 28, a material having high corrosion resistance is preferably used. For example, a metal material such as stainless steel (SUS 316, SUS304, etc.), a fluororesin such as PTFE, PFA, or a material having a surface covered with a fluororesin may be used.
In embodiment 4, the addition of the contractor 28 for preventing water droplets from adhering to the active particle supply device 4 of embodiment 1 is described, but the same effect is obtained by providing the active particle supply device 204 of embodiment 2 and the active particle supply device 304 of embodiment 3.
As described above, in the water treatment system and the active particle supply device according to embodiment 4, a constriction device for preventing water droplets from adhering is added directly below the dielectric of the injector.
Therefore, the water treatment system and the active particle supply device according to embodiment 4 can effectively purify the water to be treated. Further, the oxygen atoms can be efficiently supplied to the water to be treated while maintaining the plasma stably without being affected by the water content of the water to be treated.
Embodiment 5
The active particle supply device according to embodiment 5 uses a plasma generator having the following structure: the plasma generator includes a power feeding electrode on an upper surface of the injector, a ground electrode on a lower surface of the injector, and an ac voltage is applied between the power feeding electrode and the ground electrode.
The structure and operation of the active particle supply device according to embodiment 5 will be described mainly with respect to differences from embodiment 1 based on fig. 8, which is a structural view of the active particle supply device, fig. 9A, which is a perspective view of an ejector of the active particle supply device, and fig. 9B, which is a cross-sectional view of the ejector.
In fig. 8 and 9 of embodiment 5, the same or corresponding parts as those of embodiment 1 are given the same reference numerals.
In order to distinguish from embodiment 1, the active particle supply device 504, the plasma generator 511, and the injector 510 are provided.
In embodiment 5, since the difference from embodiment 1 is the plasma generating device 511, the treatment water tank 3, the circulation pump 5, and the like for storing the water 2 (first fluid) to be treated in the water treatment system are omitted in fig. 8.
First, the structure of the active material supply device 504 will be described.
The active particle supply device 504 is constituted by an injector 510 as a mixing section and a plasma generating device 511 as an active particle generating means for generating plasma 100.
The injector 510 of fig. 8 is partially removed to show a vertical cross section of the central axis of the injector 510 in the flow direction of the water to be treated.
Next, the structure of the injector 510 will be described with reference to fig. 9A and 9B.
Fig. 9A is a perspective view of the injector 510, and fig. 9B is a sectional view.
In fig. 9A, the direction in which the water 2 to be treated supplied to the injector 510 flows is referred to as the Y-axis direction, the horizontal right direction is referred to as the X-axis direction, and the vertical direction is referred to as the Z-axis direction. The flow axis of the treated water 2 coincides with the central axis of the injector 510 in the Y-axis direction.
Fig. 9B is a cross-sectional view of arrows A-A in fig. 9A, and is a cross-sectional view taken along a vertical plane including the central axis of the injector 510. In the cross-sectional view of fig. 9B, the gas supply port 16 is not originally present, but is described as a virtual line (broken line) for the sake of easy understanding of the positional relationship.
In FIG. 9A, "OG" represents oxygen O 2 。
In fig. 9A, the plasma generator 511 is not a constituent element of the injector 510, but is described for easy understanding of the overall structure.
In embodiment 5, a method of generating plasma 100 in contact portion 13 of injector 510 is different from embodiment 1.
The structure and function of the plasma generator 511, which are differences from embodiment 1, will be described.
The plasma generating apparatus 511 includes: a power supply electrode 29 provided on the upper surface of the injector 510, a ground electrode 30 provided on the lower surface, and an ac power supply 31 for applying an ac voltage to the power supply electrode 29.
By applying an ac voltage (frequency: several kHz, voltage: about 10 kV) output from an ac power supply 31 to the power supply electrode 29, plasma 100 is generated in the contact portion 13.
As is clear from fig. 9B, plasma 100 is generated in a region between the lower surface of dielectric 15 at the upper portion of contact portion 13 and the upper surface of the flow path of the water to be treated, and also in a region below the flow path of the water to be treated. That is, plasma 100 is generated in the whole contact portion 13 except for the flow path of the water to be treated.
The configuration and operation of the plasma 100 are the same as those of embodiment 1 except for the method of generating plasma.
The active particle supply device 504 according to embodiment 5 has a simpler structure than the case where plasma is generated by using the microwaves described in embodiment 1. In addition, in the active particle supply device 504 according to embodiment 5, the stable plasma 100 can be generated regardless of the kind of gas supplied from the gas supply port.
When the plasma generator 511 according to embodiment 5 is used, the water treatment efficiency is reduced because the plasma density is lower than that of the plasma generator 11 according to embodiment 1 using a microwave generator, but the structure is simple and the operation is easy.
In embodiment 5, the plasma generator 511 having the structure in which the power feeding electrode and the ground electrode are provided on the upper and lower surfaces of the injector and the ac voltage is applied between the electrodes is applied to the active particle supply device 4 of embodiment 1, but the same effects can be obtained even when applied to the active particle supply devices 204, 304, 404 of embodiments 2 to 4.
As described above, the active particle supply device according to embodiment 5 includes the power feeding electrode on the upper surface of the injector, the ground electrode on the lower surface, and the ac power supply for applying the ac voltage between the power feeding electrode and the ground electrode as the plasma generating device.
Therefore, the active particle supply device according to embodiment 5 can effectively purify the water to be treated. In addition, the structure of the device is simplified, and the operation is easy.
While the present application has been described with reference to various exemplary embodiments and examples, the various features, forms, and functions described in one or more embodiments are not limited to use with the particular embodiments, but may be applied to the embodiments alone or in various combinations.
Accordingly, numerous modifications not illustrated can be assumed within the scope of the disclosed technology. For example, the case of deforming, adding or omitting at least one component, and the case of taking out at least one component and combining it with the components of the other embodiments are also included.
Description of the reference numerals
1. 301, 401 water treatment system, 2 treated water, 3 treatment water tank, 4, 204, 304, 404, 504 active particle supply device, 5 circulation pump, 6 treated water piping, 7, 9 valve, 8 flow regulator, 10, 210, 410, 510 injector, 11, 511 plasma generation device, 12 nozzle, 13, 213, 413 contact portion, 14 diffuser, 15 dielectric, 16 gas supply port, 17 microwave oscillator, 18 rectangular waveguide, 19 single-sided waveguide, 20 directional coupler, 21 matcher, 22 reactor, 23 short-circuiting device, 24 slot antenna, 25 exhaust port, 26 ozone decomposition treatment device, 27 swirling flow generation device, 28 constrictor, 29 power supply electrode, 30 ground electrode, 31 ac power supply, 100 plasma.
Claims (12)
1. An active particle supply device is provided with:
an ejector that ejects a first fluid from a nozzle, the ejector including a contact portion in a space in which a pressure around the ejected first fluid is reduced by a venturi effect, the contact portion including a supply port for supplying a second fluid; and
and a plasma generating device that generates plasma in the contact portion, the plasma generating active particles in the second fluid.
2. The active particle supply apparatus according to claim 1, wherein a dielectric is disposed on an upper surface of the contact portion, and the plasma is generated in the second fluid by applying a high electric field from outside of the dielectric through the dielectric.
3. The active particle supply apparatus according to claim 2, wherein a dielectric is further disposed on a lower surface and both side surfaces of the contact portion.
4. The active particle supply apparatus according to claim 2 or 3, wherein the plasma generation apparatus generates the plasma by introducing a microwave through the dielectric.
5. The active particle supply device according to claim 2 or 3, wherein the plasma generator includes a power supply electrode and a ground electrode so as to sandwich the contact portion, and the plasma is generated by applying an ac voltage to the power supply electrode.
6. The active particle supply apparatus according to claim 1, wherein the second fluid is an oxygen-containing gas, and the plasma generates oxygen atoms in the second fluid.
7. The active particle supply apparatus according to any one of claims 2 to 5, wherein the second fluid is an oxygen-containing gas, and the plasma generates oxygen atoms in the second fluid.
8. The active material supply device according to any one of claims 2 to 5 and 7, wherein a retractor for preventing water droplets from adhering is provided below the dielectric at the contact portion.
9. The active particle supply apparatus according to any one of claims 1 to 8, wherein the second fluid is supplied from a direction intersecting a flow axis of the first fluid at the contact portion.
10. The active particle supply apparatus according to any one of claims 1 to 9, wherein a swirling flow generating device that forms the first fluid into a swirling flow is provided in a front stage of the nozzle.
11. A water treatment system comprising the active particle supply device according to any one of claims 1 to 10,
the active particles are supplied to the water to be treated as the first fluid.
12. The water treatment system of claim 11, further comprising: a circulation pump for supplying the water to be treated to the active particle supply device; and a treatment water tank for storing the treatment water discharged from the active particle supply device.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/008070 WO2022185429A1 (en) | 2021-03-03 | 2021-03-03 | Active particle supply device, and water treatment system using same |
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| Publication Number | Publication Date |
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| CN116964007A true CN116964007A (en) | 2023-10-27 |
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| CN202180094821.4A Pending CN116964007A (en) | 2021-03-03 | 2021-03-03 | Active particle supply device and water treatment system using same |
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| JP (1) | JP7034388B1 (en) |
| CN (1) | CN116964007A (en) |
| WO (1) | WO2022185429A1 (en) |
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| JP2023156780A (en) * | 2022-04-13 | 2023-10-25 | 日本未来科学研究所合同会社 | Liquid treatment device and liquid treatment method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1160016A (en) * | 1995-09-28 | 1997-09-24 | 三菱电机株式会社 | Method and device for production of ozone |
| JP2009072716A (en) * | 2007-09-21 | 2009-04-09 | Honda Electronic Co Ltd | Apparatus and method for treatment with plasma in liquid |
| WO2015064382A1 (en) * | 2013-11-01 | 2015-05-07 | 国立大学法人東京工業大学 | Liquid treatment apparatus and produced water treatment method |
| US20170128604A1 (en) * | 2014-07-28 | 2017-05-11 | Ngk Insulators, Ltd. | Treatment device, sterilization device, sterilization water, and sterilization method |
| JP6818952B1 (en) * | 2020-04-09 | 2021-01-27 | 三菱電機株式会社 | Oxygen radical supply device and oxygen radical supply method |
-
2021
- 2021-03-03 WO PCT/JP2021/008070 patent/WO2022185429A1/en active Application Filing
- 2021-03-03 JP JP2021537962A patent/JP7034388B1/en active Active
- 2021-03-03 CN CN202180094821.4A patent/CN116964007A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1160016A (en) * | 1995-09-28 | 1997-09-24 | 三菱电机株式会社 | Method and device for production of ozone |
| JP2009072716A (en) * | 2007-09-21 | 2009-04-09 | Honda Electronic Co Ltd | Apparatus and method for treatment with plasma in liquid |
| WO2015064382A1 (en) * | 2013-11-01 | 2015-05-07 | 国立大学法人東京工業大学 | Liquid treatment apparatus and produced water treatment method |
| US20170128604A1 (en) * | 2014-07-28 | 2017-05-11 | Ngk Insulators, Ltd. | Treatment device, sterilization device, sterilization water, and sterilization method |
| JP6818952B1 (en) * | 2020-04-09 | 2021-01-27 | 三菱電機株式会社 | Oxygen radical supply device and oxygen radical supply method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7034388B1 (en) | 2022-03-11 |
| JPWO2022185429A1 (en) | 2022-09-09 |
| WO2022185429A1 (en) | 2022-09-09 |
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